JP4281516B2 - RFID tag circuit element and RFID tag cartridge - Google Patents

Description

  The present invention relates to a wireless tag circuit element that can wirelessly write and read information and a wireless tag cartridge that houses the wireless tag circuit element, and in particular, a base material includes a connection part between an IC circuit part and an antenna part. The present invention relates to a wireless tag circuit element and a wireless tag cartridge that accommodates the wireless tag circuit element in a roll shape.

  An RFID (Radio Frequency Identification) system is known in which information is read out in a non-contact manner by a predetermined reader (interrogator) from a small RFID circuit element (responder) in which predetermined information is stored. This RFID system can read information stored in the RFID circuit element by wireless communication with a reader even when the RFID circuit element is dirty or disposed at an invisible position. For this reason, they are used in many fields as ID cards for personal identification, tag labels for identifying articles, and the like.

  The RFID circuit element normally includes an antenna unit for wirelessly communicating information and an IC circuit unit for storing predetermined information, and the IC circuit unit and the antenna unit are connected at a predetermined connection unit. ing.

When the above-mentioned RFID circuit element is used as an ID card for personal identification or a tag label for identifying an article, if the user uses the ID card or RFID tag by being bent by mistake, the IC circuit unit and the antenna unit are used. There was a risk of breaking the connection with. As a technique for preventing the breakage of the connecting portion, Patent Document 1 discloses that an IC chip (IC circuit portion) used for a non-contact IC card or tag is provided on the IC chip to prevent disconnection. A technique is disclosed in which a pair of electrodes is arranged substantially perpendicularly to the longitudinal direction of a substrate. In the above-mentioned prior art, the wire breakage can be prevented to some extent with respect to a certain bending stress on the base material, but when a stress exceeding a certain bending stress is applied, the wire breaks and the IC card is The problem was that it could not be used.
Japanese Patent Laid-Open No. 2000-230368

  The present invention has been made to solve the above-described problems. When a bending stress is applied to the RFID tag circuit element, the IC circuit portion is not easily destroyed, and the IC circuit portion and the antenna portion An object of the present invention is to provide a wireless tag circuit element and a wireless tag cartridge which can prevent the function as a wireless tag circuit element from being lost even if a part of the connection part is disconnected and disconnected.

  In order to achieve such an object, a wireless tag circuit element according to claim 1 is provided with a base material, an IC circuit portion provided on the base material for storing predetermined information, and connected to the IC circuit portion. An antenna unit that performs transmission / reception, a first connection unit that is provided along a longitudinal direction of the substrate and connects the antenna unit and the IC circuit unit, and the substrate so as to face the first connection unit A wireless tag circuit element comprising a second connection portion provided along a longitudinal direction of the antenna portion and connecting the antenna portion and the IC circuit portion at a position different from the first connection portion, wherein the first connection The bonding strength at the portion and the bonding strength at the second connection portion differ depending on the position along the longitudinal direction of the base material.

  The RFID tag circuit element according to claim 2 is the RFID tag circuit element according to claim 1, wherein the antenna portion is a dipole antenna including two linear elements, and the first connection portion is a portion of the antenna portion. One of the linear elements is connected to the IC circuit unit, and the second connecting unit connects the other linear element of the antenna unit different from the first connecting unit to the IC circuit unit. .

  The RFID tag circuit element according to claim 3 is the RFID tag circuit element according to claim 1 or 2, wherein the first connection portion and the second connection portion are provided side by side along a longitudinal direction of the base material. A plurality of IC circuit side electrodes.

  The RFID tag circuit element according to claim 4 is the RFID tag circuit element according to claim 3, wherein the first connection portion and the second connection portion are provided side by side along a longitudinal direction of the base material. At least one of the plurality of IC circuit unit side electrodes has a smaller area than other IC circuit unit side electrodes provided in the same row.

  The RFID tag circuit element according to claim 5 is the RFID tag circuit element according to claim 3 or 4, wherein the IC circuit part side electrode is connected to the antenna part via a conductive bonding member. The area of the conductive bonding member in at least one of the plurality of IC circuit side electrodes provided side by side along the longitudinal direction of the material is the same as that in the other IC circuit side electrodes provided in the same row. The area is smaller than the area of the bonding region formed by the conductive bonding member.

  The RFID tag circuit element according to claim 6 is the RFID tag circuit element according to claim 5, wherein the conductive bonding member is a conductive paste.

  The RFID tag circuit element according to claim 7 is the RFID tag circuit element according to any one of claims 3 to 6, wherein the RFID tag circuit element is present per predetermined area of the substrate in the first connection portion and the second connection portion. The area of the IC circuit portion side electrode to be changed differs depending on the position along the longitudinal direction of the base material.

  The RFID tag circuit element according to claim 8 is the RFID tag circuit element according to claim 1 or 2, wherein the first connection portion and the second connection portion are provided along a longitudinal direction of the base material. It has an IC circuit part side electrode, and the length of the IC circuit part side electrode in the width direction of the base material varies depending on the position along the longitudinal direction of the base material.

  The RFID circuit element according to claim 9 is the RFID circuit element according to claim 8, wherein the length of the IC circuit side electrode in the width direction of the base material gradually decreases along the longitudinal direction of the base material. Or gradually increase.

  The RFID tag circuit element according to claim 10 is the RFID tag circuit element according to claim 9, wherein the IC circuit portion side electrode has a tapered shape.

  The wireless tag circuit element according to claim 11 is the wireless tag circuit element according to any one of claims 1 to 10, wherein the first connection portion and the second connection portion are along a longitudinal direction of the base material. It has an antenna electrode provided in the antenna portion, and the length of the antenna electrode in the width direction of the base material is different depending on the position along the longitudinal direction of the base material.

  The RFID circuit element according to a twelfth aspect is the RFID circuit element according to the eleventh aspect, wherein the antenna electrode has a tapered shape.

  The RFID tag circuit element according to claim 13 is the RFID tag circuit element according to any one of claims 1 to 12, wherein a bonding strength at the first connection portion and a bonding strength at the second connection portion are the bases. The portions located substantially perpendicular to the longitudinal direction of the material are substantially equal to each other.

  According to a fourteenth aspect of the present invention, there is provided a wireless tag cartridge in which the RFID tag circuit element according to any one of the first to thirteenth aspects is accommodated in a state where the substrate is rolled.

  According to the RFID tag circuit element according to claim 1, the first connection portion that connects the antenna portion and the IC circuit portion, and provided along the longitudinal direction of the substrate so as to face the first connection portion, In the RFID circuit element including the second connection portion that connects the antenna portion and the IC circuit portion at a position different from the first connection portion, the bonding strength at the first connection portion and the bonding strength at the second connection portion are based on Since it differs depending on the position along the longitudinal direction of the material, when the base material is bent with a small radius of curvature in the longitudinal direction, the connection of the weak joint strength portions is preferentially interrupted in the first connection portion and the second connection portion, respectively. Therefore, it is possible to prevent the IC circuit portion from being damaged. Further, in the first connection portion and the second connection portion, the connection of the portion having a strong bonding strength is maintained, so that the connection between the IC circuit portion and the antenna portion is not interrupted, and the function as the RFID circuit element is impaired. There is no effect.

  According to the RFID circuit element according to claim 2, in addition to the effect produced by the RFID circuit element according to claim 1, the antenna part is a dipole antenna composed of two linear elements, and the first connection part is One linear element of the antenna unit is connected to the IC circuit unit, and the second connection unit is connected to another linear element different from the first connection unit of the antenna unit and the IC circuit unit. Therefore, among the two linear elements of the antenna section, the connection of the parts with weak joint strength is interrupted preferentially, and the connection of the parts with strong joint strength is maintained, so the two linear elements There is an effect that the connection between each and the IC circuit portion is not interrupted and the function as the RFID circuit element is not impaired.

  According to the wireless tag circuit element according to claim 3, in addition to the effect produced by the wireless tag circuit element according to claim 1 or 2, the first connection portion and the second connection portion are arranged along the longitudinal direction of the base material. Since it has a plurality of IC circuit part side electrodes provided side by side, the substrate is bent in the longitudinal direction, and each of the first connection part and the second connection part has a weak bonding strength, respectively. Even if the connection is interrupted, the connection between the antenna part and the IC circuit part is maintained via the other IC circuit part side electrode having a strong bonding strength, so that the function as the RFID circuit element is not impaired. There is.

  According to the wireless tag circuit element according to claim 4, in addition to the effect produced by the wireless tag circuit element according to claim 3, the first connection portion and the second connection portion are provided side by side along the longitudinal direction of the base material. Since at least one of the plurality of IC circuit unit side electrodes is smaller in area than the other IC circuit unit side electrodes provided in the same row, when the substrate is bent with a small radius of curvature in the longitudinal direction In the first connection part and the second connection part, the connection is interrupted preferentially in the part connected via the IC circuit part side electrode having a small area, and the IC circuit part is prevented from being bent. There is an effect that it can be prevented from being damaged. Further, in the first connection portion and the second connection portion, the connection between the IC circuit portion and the antenna portion is maintained in the portion connected via the other IC circuit portion side electrode having a large area, and the RFID circuit element There is an effect that the function is not impaired.

  According to the RFID tag circuit element of claim 5, in addition to the effect produced by the RFID tag circuit element of claim 3 or 4, the IC circuit part side electrode is connected to the antenna part via the conductive bonding member. The area of the conductive bonding member in at least one of the plurality of IC circuit unit side electrodes provided side by side along the longitudinal direction of the substrate is the same as that of the other IC circuit unit side electrodes provided in the same row. Since the area is smaller than the area of the bonding region formed by the conductive bonding member, when the base material is bent with a small radius of curvature in the longitudinal direction, each of the first connection portion and the second connection portion has a small area of the conductive bonding member. Since the connection is preferentially interrupted and the deflection of the IC circuit portion is suppressed, the IC circuit portion can be prevented from being damaged. Further, in the first connection portion and the second connection portion, the connection between the IC circuit portion and the antenna portion is maintained in the portion where the area of the conductive bonding member is large, and the function as the RFID circuit element is not impaired. effective.

  According to the wireless tag circuit element of claim 6, in addition to the effect of the wireless tag circuit element of claim 5, the conductive bonding member is a conductive paste, so that the area can be easily adjusted when applied. Therefore, desired bonding strength can be easily obtained at the first connection portion and the second connection portion.

  The RFID circuit element according to claim 7 is the RFID circuit element according to any one of claims 3 to 6, wherein the IC circuit is present per predetermined area of the base material in the first connection portion and the second connection portion. Since the area of the part-side electrode varies depending on the position along the longitudinal direction of the base material, when the base material is bent with a small radius of curvature in the longitudinal direction, the predetermined connection of the base material in the first connection portion and the second connection portion is performed. Since the connection is preferentially interrupted at a portion where the area of the IC circuit portion side electrode existing per area is small and the deflection of the IC circuit portion is suppressed, it is possible to prevent the IC circuit portion from being damaged. Further, in the first connection portion and the second connection portion, the connection between the IC circuit portion and the antenna portion is maintained in the portion where the area of the IC circuit portion side electrode existing per predetermined area of the substrate is large, and the RFID circuit There is an effect that the function as an element is not impaired.

  According to the wireless tag circuit element according to claim 8, in addition to the effect produced by the wireless tag circuit element according to claim 1 or 2, the first connection portion and the second connection portion are arranged in the longitudinal direction of the base material. IC circuit unit side electrodes provided along the length of the IC circuit unit side electrodes in the width direction of the base material (direction substantially perpendicular to the longitudinal direction of the base material) When the substrate is bent with a small radius of curvature in the longitudinal direction, the length in the width direction of the substrate of the IC circuit unit side electrode is different in the first connection portion and the second connection portion. Since the connection is preferentially interrupted at the portion where the joint strength is shorter than the portion and the deflection of the IC circuit portion is suppressed, it is possible to prevent the IC circuit portion from being damaged. Further, in the first connection part and the second connection part, the connection between the IC circuit part and the antenna part is maintained in the part where the length in the width direction of the base material of the IC circuit part side electrode is long and the bonding strength is strong, There is an effect that the function as the wireless tag circuit element is not impaired.

  According to the wireless tag circuit element according to claim 9, in addition to the effect achieved by the wireless tag circuit element according to claim 8, the length in the width direction of the IC circuit side electrode gradually decreases along the longitudinal direction of the base material. Or, since the first connecting portion and the second connecting portion are gradually increased, the bonding strength is large at one end in the longitudinal direction of the substrate and the bonding strength is small at the other end, so that the substrate has a small radius of curvature in the longitudinal direction. When bent, the connection is preferentially interrupted at one end of the first connection portion and the second connection portion where the bonding strength is weak, and the deflection of the IC circuit portion is suppressed, so that the IC circuit portion can be prevented from being damaged. There is. In addition, the connection between the IC circuit portion and the antenna portion is maintained at one end of the first connection portion and the second connection portion where the bonding strength is strong, and the function as the RFID circuit element is not impaired.

  According to the RFID circuit element of the tenth aspect, in addition to the effect produced by the RFID tag circuit element according to the ninth aspect, since the IC circuit part side electrode has a tapered shape, the first connection part and the second connection part Since the bonding strength is large at one end in the longitudinal direction of the substrate and the bonding strength at the other end is small, when the substrate is bent in the longitudinal direction with a small radius of curvature, the first connection portion and the second connection portion Among them, the connection is preferentially interrupted at one end where the bonding strength is weak, and the deflection of the IC circuit portion is suppressed, so that the IC circuit portion can be prevented from being damaged. In addition, the connection between the IC circuit portion and the antenna portion is maintained at one end of the first connection portion and the second connection portion where the bonding strength is high, and the function as the wireless tag circuit element is not impaired.

  According to the wireless tag circuit element according to claim 11, in addition to the effect produced by the wireless tag circuit element according to any one of claims 1 to 10, the first connection portion and the second connection portion are arranged in the longitudinal direction of the base material. Since the length of the antenna electrode in the width direction of the base material varies depending on the position along the longitudinal direction of the base material, the base material is small in the longitudinal direction. When bent at a radius of curvature, the connection is preferentially interrupted at the first connection portion and the second connection portion where the length of the antenna electrode in the width direction of the substrate is shorter than the other portions and the bonding strength is weak. Since the deflection of the circuit part is suppressed, the IC circuit part can be prevented from being damaged. Further, in the first connection portion and the second connection portion, the connection between the IC circuit portion and the antenna portion is maintained in the portion where the length of the antenna electrode in the width direction of the base material is long and the bonding strength is high, and the RFID circuit There is an effect that the function as an element is not impaired.

  According to the wireless tag circuit element of the twelfth aspect, in addition to the effect exhibited by the wireless tag circuit element of the eleventh aspect, the antenna electrode has a tapered shape. Since the joint strength is large at one end in the longitudinal direction of the material and the joint strength is small at the other end, when the base material is bent with a small radius of curvature in the longitudinal direction, the joint strength is weak at the first connection portion and the second connection portion. Since the connection is preferentially interrupted at one end and the deflection of the IC circuit unit is suppressed, the IC circuit unit can be prevented from being damaged. In addition, in the first connection portion and the second connection portion, the connection between the IC circuit portion and the antenna portion is maintained at one end where the bonding strength is high, and the function as the RFID circuit element is not impaired.

  According to the wireless tag circuit element according to claim 13, in addition to the effect produced by the wireless tag circuit element according to any one of claims 1 to 12, the bonding strength at the first connection portion and the bonding strength at the second connection portion Are substantially equal to each other in a portion positioned substantially perpendicular to the longitudinal direction of the base material, and therefore when the base material is bent with a small radius of curvature in the longitudinal direction, the first connection portion and the second connection portion, Since the connection is interrupted at a portion located substantially perpendicular to the longitudinal direction of the base material, the stress applied to the IC circuit portion as the base material is bent can be made as small as possible. That is, in the first connection portion and the second connection portion, when the connection is maintained at a portion located on the diagonal line of the IC circuit portion, the IC circuit portion becomes longer in the longitudinal direction of the base material along with the bending in the longitudinal direction of the base material. Since it is deformed in the direction, it is inevitable that bending stress is applied to the IC circuit portion. However, according to the RFID tag circuit element of claim 13, the IC circuit portion and the antenna portion are arranged in the longitudinal direction of the base material. On the other hand, since the connection is interrupted at a portion positioned substantially perpendicular to the substrate, it is possible to suppress the deformation of the IC circuit portion due to the bending of the base material in the longitudinal direction.

  The wireless tag cartridge according to claim 14 is the wireless tag circuit element according to any one of claims 1 to 13, which is stored in a state where the base material is rolled, and is stored in the wireless tag cartridge. In addition, even when the base material is bent in the longitudinal direction with a small radius of curvature, the connection of the weak joint strength is interrupted preferentially in the first connection part and the second connection part, and the IC circuit part is damaged. There is an effect that can be prevented. Further, in the first connection portion and the second connection portion, the connection of the portion having a strong bonding strength is maintained, so that the connection between the IC circuit portion and the antenna portion is not interrupted, and the function as the RFID circuit element is impaired. There is no effect. Further, if the radius of curvature is a predetermined radius, there is an effect that the connection is maintained at each connection portion and the end of the IC circuit portion does not damage the tape base material.

  Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings.

  FIG. 1 is a diagram illustrating a wireless tag generation system 10 to which the present invention is preferably applied. In this wireless tag generation system 10, the wireless tag generation device 12 according to an embodiment of the present invention includes a route server 16, a terminal 18, a general-purpose computer 20, and a plurality of information servers 22 via a wired or wireless communication line 14. It is connected to the.

  FIG. 2 is a diagram illustrating the configuration of the wireless tag generation device 12. This RFID tag generating apparatus 12 is for producing the RFID tag label 24 shown in FIG. 4, and prints a predetermined print character or the like as will be described later. The RFID label 24 according to the user's request can be immediately created by writing to the cover film 86, a cover film 86, which will be described later, and ink for generating the tag tape 26 used as the material of the RFID label 24 A base tape 92 or the like in which a RFID tag circuit element 24a including a ribbon 98 and two antenna elements 64a and 64b made of two linear elements 64a and 64b and an IC circuit unit 80 are arranged in a band at a predetermined interval is used. The removable cartridge 28 to be stored and the cartridge motor 30 are driven to control the feeding of the tag tape 26 from the cartridge 28. A cartridge motor drive circuit 32, a print drive circuit 36 for controlling the drive of the thermal head 34 for printing on the tag tape 26, and a feed roller 38 for feeding the tag tape 26 in the direction indicated by the arrow. A feed roller drive circuit 42 for controlling the drive of the feed roller 38 via the feed roller motor 40, a transport guide 46 for guiding the tag tape 26 from the cartridge 28 to the carry-out port 44, and a solenoid 48. A cutter 50 that cuts the tag tape 26 by a predetermined length according to driving and divides the tag tape 26 into individual RFID labels 24, a sensor 52 that detects the presence / absence of the tag tape 26 at the carry-out port 44, and the RFID tag An antenna 54 for communicating with the circuit element 24a by electromagnetic coupling or radio waves, and via the antenna 54 A wireless communication circuit 56 for reading or writing information with the RFID circuit element 24a, and a signal processing circuit 58 for processing a signal read from the RFID circuit element 24a and reading information. And controlling the driving of the wireless tag generation device 12 via the cartridge motor drive circuit 32, the print drive circuit 36, the delivery roller drive circuit 42, the solenoid 48, the wireless communication circuit 56, the signal processing circuit 58, and the like. The control circuit 60 is provided. The control circuit 60 is connected to the communication line 14 by an input / output interface 62.

  FIG. 3 is a diagram for explaining the configuration of the RFID circuit element 24a. As shown in FIG. 3, the RFID circuit element 24a communicates with the antenna 54 of the RFID tag generating device 12 by electromagnetic coupling or radio waves, and in RFID communication using a high frequency such as UHF, Between the antenna unit 64 and the IC circuit unit 80 connected to the antenna unit 64. The IC circuit unit 80 includes a rectifying unit 66 that rectifies the carrier wave received by the antenna unit 64, a power source unit 68 for storing energy of the carrier wave rectified by the rectifying unit 66, and the antenna unit 64. A clock extraction unit 70 that extracts a clock signal from the generated carrier wave and supplies the clock signal to the control unit 76; a memory unit 72 that functions as an information storage unit that can store a predetermined information signal; and a modulation / demodulation unit connected to the antenna unit 64 And a control unit 76 for controlling the operation of the RFID label 24 through the rectifying unit 66, the clock extracting unit 70, the modem unit 74, and the like. The control unit 76 performs control for storing the predetermined information in the memory unit 72 by communicating with the wireless tag generation device 12, and the modulation / demodulation unit 74 receives the carrier wave received by the antenna unit 64. After performing modulation based on the information signal stored in 72, basic control such as control of reflecting back from the antenna unit 64 as a reflected wave is executed.

  4A and 4B are diagrams illustrating the RFID label 24, wherein FIG. 4A is a plan view, FIG. 4B is a bottom view, and FIG. 4C is an enlarged sectional view of the RFID label 24, and is a sectional view taken along line VV. It is. FIG. 4A is a view seen from the cover film 86 side, and the antenna part 64 and the IC circuit part 80 composed of the two linear elements 64a and 64b provided in the lower layer of the cover film 86 are indicated by broken lines. FIG. 5 is a cross-sectional view taken along the line V′-V ′ of FIG. 4A, where FIG. 5A is a diagram illustrating a state before the cover film 86 is bonded, and FIG. It is a figure which shows a state. As shown in FIG. 4A, on one surface (front surface) of the RFID label 24, for example, a print 78 such as “RF-ID” indicating the type of the RFID label 24 is printed. As shown in FIG. 4C and FIG. 5A, a release paper 90 is adhered to the back side of the IC circuit portion 80 via an adhesive layer 88, and the RFID label 24 is attached to a predetermined product or the like. When pasting, the release paper 90 is peeled off and adhered by the adhesive layer 88. A colored base film 82 made of PET (polyethylene terephthalate) or the like is provided on the front side of the IC circuit unit 80. The antenna section 64 is a dipole antenna composed of two linear elements 64a and 64b, and is formed on the back surface of the base film 82 by printing or the like.

  Further, as will be described in detail later, a portion of the two linear elements 64a and 64b that overlaps with the IC circuit portion 80 is referred to as antenna electrodes 65a and 65b, and is indicated by hatching in FIG. 4C and FIG. . The antenna electrodes 65 a and 65 b are joined to the IC circuit portion side electrode 146 of the IC circuit portion 80 via the conductive joining member 148. A connection portion including the IC circuit portion side electrode 146, the antenna electrode 65a, and the conductive bonding member 148 that bonds the IC circuit portion side electrode 146 and the antenna electrode 65a is referred to as a first connection portion 150a. The connection part constituted by the IC circuit part side electrode 146, the antenna electrode 65b, and the conductive bonding member 148 connecting the IC circuit part side electrode 146 and the antenna electrode 65b is referred to as a second connection part 150b.

  As shown in FIG. 5 (b), a transparent cover film 86 is bonded to the front side of the base film 82 via an adhesive layer 84. The print 78 is printed on the back surface of the cover film 86, that is, the surface on the adhesive layer 84 side.

  FIG. 5 shows the ratio of dimensions of each member in order to make it easy to understand the connection relationship between the members. Each member is shown in a dimension different from the actual dimension.

  FIG. 6 is a diagram for explaining the configuration of the cartridge 28 in detail. The cartridge 28 includes a first roll 94 around which a band-shaped base tape 92 in which the RFID tag circuit elements 24a including the antenna portion 64 and the IC circuit portion 80 are continuously arranged is wound, and the base tape 92. A second roll 96 around which the cover film 86 having the same width is wound, an ink ribbon roll 100 around which the ink ribbon 98 is wound, a winding roller 102 for winding the ink ribbon 98, A pressure roller 104 that feeds the tape in the direction indicated by the arrow while pressing and bonding the base tape 92 and the cover film 86 is provided around each axis so as to be capable of rotating. Although the first roll 94 and the second roll 96 are drawn concentrically in the drawing, they are actually spirally wound around a core. The ink ribbon roll 100 and the take-up roller 102 are disposed on the back side of the cover film 86, that is, the side to be bonded to the base tape 92, and the ink ribbon 98 is the main body of the RFID tag generating apparatus 12. By being pressed by the thermal head 34 provided on the cover film 86, it is brought into contact with the back surface of the cover film 86.

  In forming the tag tape 26, the winding roller 102 and the pressure roller 104 are rotated in synchronization with each other in the directions indicated by the arrows by driving the cartridge motor 30. At this time, when a plurality of heating elements provided in the thermal head 34 are energized by the print drive circuit 36, a predetermined amount is applied to the back surface of the cover film 86, that is, the surface to be bonded to the base tape 92. Characters, symbols, bar codes, or the like are printed, and after the printing, the tag tape 26 is bonded to the base tape 92 by the pressure roller 104. When the RFID label 24 is produced, the RFID circuit provided in the tag tape 26 by the RFID circuit 56 or the like is applied to the RFID circuit element 24a of the tag tape 26 moved along the conveyance guide 46. After predetermined information is written in each IC circuit unit 80 of the element 24a, the cutter 50 is cut into a predetermined length and divided into individual RFID labels 24.

  FIG. 7 is a diagram for explaining the configuration of the control circuit 60. As shown in FIG. 7, the control circuit 60 comprises a central processing unit CPU 140, a ROM (Read Only Memory) 142, a RAM (Random Access Memory) 144, etc., and uses the temporary storage function of the RAM 144. On the other hand, it is a so-called microcomputer that performs signal processing in accordance with a program stored in the ROM 142 in advance. The control circuit 60 is connected to the communication line 14 via the input / output interface 62, and exchanges information with the route server 16, the terminal 18, the general-purpose computer 20, the information server 22, and the like. Is possible.

FIG. 8 is a diagram illustrating an antenna pattern of the antenna unit 64 formed on the base film 82. Two IC circuit units 80 provided on the back surface of the antenna unit 64 via the IC circuit unit side electrode 146 are illustrated. Shown with a chain line. The antenna unit 64 provided in the RFID tag circuit element 24a of the present embodiment is a dipole antenna having a resonance frequency of 300 MHz or more, and two linear elements 64a and 64b having one end connected to the IC circuit unit 80. It is composed of The lengths of the linear elements 64a and 64b are preferably in the range of 1 × 10 ⁻³ m to 250 × 10 ⁻³ m, respectively.

  FIG. 9 is a diagram illustrating the pattern of the IC circuit unit side electrode 146 provided on the surface of the IC circuit unit 80 on the antenna unit 64 side. In FIG. 9, the two linear elements 64a and 64b constituting the antenna unit 64 are indicated by two-dot chain lines. In addition, portions of the two linear elements 64a and 64b that overlap with the IC circuit unit 80 are referred to as antenna electrodes 65a and 65b, respectively, and are indicated by broken lines. Further, in order to facilitate understanding, in the drawing shown in FIG. 9, the conductive bonding member 148 for bonding the IC circuit portion side electrode 146 and the antenna electrodes 65a and 65b is not shown, but the IC circuit portion It is provided on the entire surface of the side electrode 146.

  The first connecting portion 150a is a conductive member for bonding the IC circuit portion side electrode 146, the antenna electrode 65a, and the IC circuit portion side electrode 146 and the antenna electrode 65a arranged in a line along the longitudinal direction of the base tape 92. It is a connection part which consists of a property joining member 148. The second connection portion 150b connects the IC circuit portion side electrode 146, the antenna electrode 65b, the IC circuit portion side electrode 146, and the antenna electrode 65b arranged in a line along the longitudinal direction of the base tape 92. It is a connection part which consists of the electroconductive joining member 148 to do.

  The first connection portion 150a and the second connection portion 150b are provided with a plurality of, for example, two IC circuit portion side electrodes 146 arranged in one row along the longitudinal direction of the base tape 92, and the one row. At least one of the plurality of IC circuit unit side electrodes 146 arranged in a row is configured to have a smaller area than the other IC circuit unit side electrodes 146 provided in the same row. The IC circuit portion side electrode 146 is made of, for example, gold and can be formed in a desired size at a desired position by plating or the like. The plurality of IC circuit unit side electrodes 146 provided in the first connection unit 150a are connected to each other in the IC circuit unit 80, and the plurality of IC circuit unit side electrodes provided in the second connection unit 150b. 146 are also connected to each other in the IC circuit unit 80.

Further, of the IC circuit part side electrode 146 provided in the first connection part 150a and the IC circuit part side electrode 146 provided in the second connection part 150b, the electrode part is located substantially perpendicular to the longitudinal direction of the base tape 92. The IC circuit portion side electrodes 146 provided in the portion are configured to have substantially the same area. Since the IC circuit unit 80 and the antenna unit 64 are bonded by the conductive bonding member 148 provided on the entire surface of the IC circuit unit side electrode 146, the bonding strength increases as the area of the IC circuit unit side electrode 146 increases. . Therefore, the bonding strength at the first connection portion 150 a and the bonding strength at the second connection portion 150 b are substantially equal to each other at a portion positioned substantially perpendicular to the longitudinal direction of the base tape 92. Further, the IC circuit unit side electrode is set so that the bonding strength of the IC circuit unit side electrode 146 provided in an area smaller than that of the other IC circuit unit side electrode 146 is lower than the mechanical breakdown strength of the IC circuit unit 80. An area of 146 is determined. For example, when the area of the IC circuit unit 80 is 1 × 1 mm ² , the IC circuit unit side electrode 146 has a size of, for example, 0.3 × 0.3 mm ² and 0.2 × 0.2 mm ^2. Are arranged along the longitudinal direction of the base tape 92. In this case, the IC circuit portion side electrode 146 having a small area has an area of ½ or less compared to the IC circuit portion side electrode 146 having a large area, and the bonding strength of the IC circuit portion side electrode 146 having a large area is also large. It becomes 1/2 or less compared with.

  FIG. 10 is a diagram showing the relationship between the curvature of the base tape 92 and the degree of deflection of the IC circuit unit 80 when the base tape 92 is bent in the longitudinal direction. In a state where the base tape 92 is not bent at all as shown in FIG. 10A, an excessive stress is not applied to the IC circuit unit 80, and there is no possibility that the IC circuit unit 80 is damaged.

  The conductive bonding member 148, the adhesive layer 88, and the release paper 90 are not shown in FIG.

  FIG. 10B shows a state in which the curvature of the base tape 92 is larger than that in FIG. In this state, the IC circuit unit 80 is bent with the same curvature as that of the base tape 92, and a relatively large stress is applied to the IC circuit unit 80. For example, in the state wound around the first roll 94, the IC circuit unit 80 is deformed as shown in FIG.

  FIG. 10C shows a state where the base tape 92 is bent with a larger curvature (smaller radius of curvature) than that of FIG. 10B. For example, when the release paper 90 is peeled off, the base tape 92 is bent with a large curvature as shown in FIG.

  According to the embodiment shown in FIG. 9, two IC circuit part side electrodes 146 are provided side by side in each of the first connection part 150a and the second connection part 150b, and of the two IC circuit part side electrodes 146, One is configured to have a smaller area than the other IC circuit unit side electrode 146 provided in the same row, and is positioned substantially vertically in the first connection unit 150a and the second connection unit 150b. When the base tape 92 is bent with a large curvature as shown in FIG. 10C, the two IC circuit side electrodes 146 provided in such a relationship are configured to have substantially the same area. Before the IC circuit unit 80 is damaged, the connection portion of the first connection unit 150a and the second connection unit 150b connected by the IC circuit unit side electrode 146 having a small area is disconnected. Since one end of the part 80 is disengaged from the antenna 64, further deflection of the IC circuit part 80 is suppressed, it is possible to prevent damage to the IC circuit part 80. In addition, since each of the two linear elements 64a and 64b is connected to the IC circuit unit 80 via the plurality of IC circuit unit side electrodes 146, the IC circuit unit in the IC circuit unit side electrode 146 having a small area. Since the connection between the IC circuit unit 80 and the antenna unit 64 is secured via the other IC circuit unit side electrode 146 even if the connection between the 80 and the antenna unit 64 is disconnected and disconnected, the RFID circuit element 24a The function as can be secured.

  Furthermore, the IC circuit portion side electrodes 146 having small areas provided in the first connection portion 150a and the second connection portion 150b are provided so as to be positioned substantially perpendicular to the longitudinal direction of the base tape 92. Therefore, when the base tape 92 is bent with a large curvature, one side of the IC circuit portion 80 where the IC circuit portion side electrode 146 having a small area is removed from the base tape 92, and the IC circuit portion Since the deformation of 80 is suppressed, the IC circuit unit 80 is not subjected to excessive stress.

  Instead of the IC circuit portion side electrode 146 shown in FIG. 9, any one of the embodiments shown in FIGS. 11A to 11E can be adopted.

  FIGS. 11A to 11E are diagrams for explaining another embodiment of the IC circuit unit side electrode 146 or the conductive bonding member 148 provided on the surface of the IC circuit unit 80 on the side in contact with the antenna unit 64. is there. 11A to 11E, the two linear elements 64a and 64b constituting the antenna unit 64 are indicated by two-dot chain lines. In addition, portions of the two linear elements 64a and 64b that overlap with the IC circuit unit 80 are referred to as antenna electrodes 65a and 65b, respectively, and are indicated by broken lines. Furthermore, in order to facilitate understanding, the conductive bonding member 148 for bonding the IC circuit portion side electrode 146 and the antenna electrodes 65a and 65b is omitted in the drawings shown in FIGS. However, a conductive bonding member 148 is provided on the entire surface of the IC circuit portion side electrode 146.

  In FIG. 11 (a), each of the first connection portion 150a and the second connection portion 150b includes a plurality of, for example, two IC circuit portion side electrodes 146 along the longitudinal direction of the base tape 92. Provided in a row, at least one of the plurality of IC circuit portion side electrodes 146 arranged in one row is provided with a conductive bonding member 148 than the other IC circuit portion side electrodes 146 provided in the same row. A configuration in which the area 148a to be formed is small is shown.

  As the conductive bonding member 148, for example, silver paste, carbon paste, polymer paste, solder, anisotropic conductive film (ACF), or the like is preferably used.

  Further, of the IC circuit part side electrode 146 provided in the first connection part 150a and the IC circuit part side electrode 146 provided in the second connection part 150b, the electrode part is located substantially perpendicular to the longitudinal direction of the base tape 92. In the IC circuit portion side electrode 146 provided in the portion, the areas 148a where the conductive bonding member 148 is provided are configured to be approximately equal to each other. Since the IC circuit unit 80 and the antenna unit 64 are connected via the conductive bonding member 148, the bonding strength increases as the region 148a in which the conductive bonding member 148 is provided is larger. Therefore, the bonding strength at the first connection portion 150 a and the bonding strength at the second connection portion 150 b are substantially equal to each other at a portion positioned substantially perpendicular to the longitudinal direction of the base tape 92. Furthermore, the bonding strength of the IC circuit unit side electrode 146 where the region 148 a where the conductive bonding member 148 is provided is smaller than the other IC circuit unit side electrode 146 is lower than the mechanical breakdown strength of the IC circuit unit 80. As described above, the area of the region 148a where the conductive bonding member 148 is provided is determined.

  According to the embodiment shown in FIG. 11A, the same effects as those of the embodiment shown in FIG. 9 can be obtained. That is, when the base tape 92 is bent with a large curvature as shown in FIG. 10C, the region 148a where the conductive bonding member 148 is provided becomes smaller before the IC circuit portion 80 is damaged. Since the connection at the configured IC circuit part side electrode 146 is interrupted and one end of the IC circuit part 80 is detached from the antenna part 64, further bending of the IC circuit part 80 is prevented and damage to the IC circuit part 80 is prevented. be able to. Further, since each of the two linear elements 64a and 64b is connected to the IC circuit unit 80 via a plurality of IC circuit unit side electrodes 146, it is more conductive than the other IC circuit unit side electrodes 146. Even if the connection is disconnected at the IC circuit portion side electrode 146 where the region 148a where the conductive bonding member 148 is provided is small and disconnected, the connection between the IC circuit portion 80 and the antenna portion 64 via the other IC circuit portion side electrode 146 is not Thus, the function as the RFID circuit element 24a can be secured.

  Further, in the first connection portion 150a and the second connection portion 150b, the IC circuit portion side electrodes 146 having a small region 148a where the conductive bonding member 148 is provided are positioned substantially perpendicular to the longitudinal direction of the base tape 92. Therefore, when the base tape 92 is bent with a large curvature, one side of the IC circuit unit 80 is detached from the base tape 92 and the deformation of the IC circuit unit 80 is suppressed. No excessive stress is applied to 80.

In FIG. 11B, the IC circuit portion side electrodes 146 provided in two rows along the longitudinal direction of the base tape 92 have a length in the width direction of the base tape 92. The configuration is different depending on the position along the direction, specifically, the length in the width direction of the base tape 92 of the IC circuit side electrode 146 is gradually reduced or gradually increased along the longitudinal direction of the base tape 92. A tapered trapezoidal IC circuit side electrode 146 is shown. Further, the IC circuit portion side electrode 146 in the first connection portion 150a and the IC circuit portion side electrode 146 in the second connection portion 150b have a length in the width direction of the base tape 92 in the longitudinal direction of the base tape 92. On the other hand, they are configured so as to be substantially equal to each other in the portion of the relationship that is positioned substantially vertically. Assuming that the area of the IC circuit unit 80 is 1 × 1 mm ² , the longer side of the two sides facing the parallel of the IC circuit side electrode 146 is 0.3 mm in length, for example, and the length of the shorter side is, for example, 0.15 mm.

  In the first connection part 150a and the second connection part 150b, since the conductive bonding member 148 is provided on the entire surface of the IC circuit part side electrode 146, the larger the area of the IC circuit part side electrode 146 per unit area, the larger the area. Bonding strength is increased. Therefore, the bonding strength at the first connection portion 150 a and the bonding strength at the second connection portion 150 b are substantially equal to each other at a portion positioned substantially perpendicular to the longitudinal direction of the base tape 92.

  According to the embodiment shown in FIG. 11B, the same operational effects as those of the embodiment shown in FIG. 9 can be obtained. That is, in the first connection part 150a and the second connection part 150b, the tapered IC circuit part side electrode 146 is provided, and the IC circuit part side electrode 146 provided in the first connection part 150a and the second connection are provided. The IC circuit portion side electrode 146 provided in the portion 150b is configured so that the length in the width direction of the base tape 92 is substantially equal at a portion positioned substantially perpendicular to the longitudinal direction of the base tape 92. Therefore, when the base tape 92 is bent with a large curvature as shown in FIG. 10C, the first connection portion 150a and the second connection portion 150b are before the IC circuit portion 80 is damaged. In the IC circuit portion side electrode 146, the connection is disconnected at one end of the base tape 92 with the shorter length in the width direction, and the one end of the IC circuit portion 80 is disconnected from the antenna portion 64. To prevent further deflection of the circuit portion 80, it is possible to prevent damage to the IC circuit part 80. In addition, since each of the two linear elements 64a and 64b is connected to the IC circuit unit 80 via the IC circuit unit side electrode 146, the antenna unit 64 and the IC circuit unit 80 are connected to one end of the IC circuit unit 80. Even if the connection is disconnected and disconnected, the connection between the IC circuit unit 80 and the antenna unit 64 is ensured at the other end, so that the function as the RFID circuit element 24a can be secured.

  Further, the bonding strength at the first connection portion 150 a and the bonding strength at the second connection portion 150 b are provided so as to be substantially equal at a portion that is positioned substantially perpendicular to the longitudinal direction of the base tape 92. Therefore, when the base tape 92 is bent with a large curvature, one side of the IC circuit portion 80 where the connection strength is weak in the first connection portion 150a and the second connection portion 150b is detached from the base tape 92, and the IC tape Since the deformation of the circuit unit 80 is suppressed, no excessive stress is applied to the IC circuit unit 80.

  In FIG. 11C, in the first connection portion 150a and the second connection portion 150b, a plurality of IC circuit portion side electrodes 146 are provided in a line along the longitudinal direction of the base tape 92, respectively. A configuration is shown in which the area (electrode density) of the IC circuit portion side electrodes 146 existing per predetermined area of the base tape 92 gradually decreases or increases along the longitudinal direction of the base tape 92. Specifically, the number of IC circuit side electrodes 146 present per unit length is configured to gradually decrease or gradually increase along the longitudinal direction of the base tape 92.

  In addition, the first connection portion 150a and the second connection portion 150b are configured such that the electrode densities at portions located substantially perpendicular to the longitudinal direction of the base tape 92 are substantially equal to each other. In the first connection part 150a and the second connection part 150b, the IC circuit part 80 and the antenna part 64 are connected via the conductive bonding member 148 provided on the entire surface of the IC circuit part side electrode 146. As the electrode density of the IC circuit part side electrode 146 increases, the bonding strength increases.

  According to the embodiment shown in FIG. 11C, the same operational effects as those of the embodiment shown in FIG. 9 can be obtained. That is, in the first connection portion 150 a and the second connection portion 150 b, the area (electrode density) of the IC circuit portion side electrode 146 existing per predetermined area of the base tape 92 is along the longitudinal direction of the base tape 92. The first connection part 150a and the second connection part 150b are configured to gradually decrease or gradually increase, and the first connection part 150a and the second connection part 150b are arranged in a portion that is substantially perpendicular to the IC circuit part side electrode 146 with respect to the longitudinal direction of the base tape 92 Since the electrode density is configured to be substantially equal, when the base tape 92 is bent with a large curvature as shown in FIG. 10C, before the IC circuit portion 80 is damaged. The antenna unit 64 and the IC circuit unit 80 are disconnected at one end of the IC circuit unit 80 having a small electrode density among the first connection unit 150a and the second connection unit 150b, and the IC circuit unit 8 Since one end of deviates from the antenna unit 64, and prevent further deflection of the IC circuit part 80, it is possible to prevent damage to the IC circuit part 80. Since each of the two linear elements 64a and 64b is connected to the IC circuit unit 80 via the IC circuit unit side electrode 146 provided along the longitudinal direction of the base tape 92, the IC circuit Even if the connection with the antenna unit 64 is disconnected and disconnected at one end of the unit 80, the connection between the other end of the IC circuit unit 80 and the antenna unit 64 is ensured, so that the function as the RFID circuit element 24a is secured. it can.

  Furthermore, when the base tape 92 is bent with a large curvature, a portion of the IC circuit portion 80 where the electrode density of the IC circuit portion side electrodes 146 in the first connection portion 150a and the second connection portion 150b is small is the base tape 92. And the deformation of the IC circuit unit 80 is suppressed, so that excessive stress is not applied to the IC circuit unit 80.

  In FIG. 11D, in the first connection portion 150a and the second connection portion 150b, a plurality of, for example, two IC circuit portion side electrodes 146 are arranged in a line along the longitudinal direction of the base tape 92, respectively. A configuration is shown in which at least one of the plurality of IC circuit side electrodes 146 arranged in one row has a smaller area than the other IC circuit side electrodes 146 provided in the same row. Furthermore, the IC circuit unit side electrodes 146 provided in the first connection unit 150a and the second connection unit 150b are arranged side by side so that the order of the areas becomes equal to each other.

  The pattern of the IC circuit unit side electrode 146 shown in FIG. 11D is such that the IC circuit unit side electrode 146 of the first connection unit 150a and the IC circuit unit side electrode 146 of the second connection unit 150b are formed on the base tape 92. The IC circuit portion side electrode 146 is different from the pattern shown in FIG. 9 in that the first connection portion 150a and the second connection portion 150b have different sizes in that they are not arranged so as to be positioned substantially perpendicular to the longitudinal direction. However, since they are arranged in the same order in the longitudinal direction of the base tape 92, the same effect as that obtained when the pattern shown in FIG. That is, in the case where the base tape 92 is bent with a large curvature as shown in FIG. 10C, before the IC circuit portion 80 is damaged, the first connection portion 150a and the second connection portion 150b The portion connected by the IC circuit portion side electrode 146 having a small area is disconnected, and one end of the IC circuit portion 80 is disconnected from the antenna portion 64. Therefore, the IC circuit portion 80 is prevented from being further bent, and the IC circuit Damage to the portion 80 can be prevented. In addition, each of the two linear elements 64 a and 64 b is connected to the IC circuit unit 80 via a plurality of IC circuit unit side electrodes 146, so that the area is larger than that of the other IC circuit unit side electrodes 146. Since the connection between the IC circuit unit 80 and the antenna unit 64 is ensured through the other IC circuit unit side electrode 146 even if the connection is interrupted at the portion of the IC circuit unit side electrode 146 having a small size, the RFID circuit element The function as 24a can be secured.

  Furthermore, when the base tape 92 is bent with a large curvature, one side of the IC circuit portion 80 on the side where the IC circuit portion side electrode 146 having a small area is detached from the base tape 92, Since the deformation is suppressed, an excessive stress is not applied to the IC circuit unit 80.

  In FIG. 11E, in the first connection portion 150a and the second connection portion 150b, three IC circuit portion side electrodes 146 are provided in a line along the longitudinal direction of the base tape 92, respectively. Of the three IC circuit unit side electrodes 146 arranged in one row, the area of the two IC circuit unit side electrodes 146 at both ends in the longitudinal direction of the base tape 92 is one IC circuit unit side electrode located in the center. A configuration smaller than the area of 146 is shown.

  According to the embodiment shown in FIG. 11 (e), three IC circuit side electrodes 146 are provided side by side in each of the first connection portion 150 a and the second connection portion 150 b, and both ends in the longitudinal direction of the base tape 92. Since the area of the two IC circuit side electrodes 146 is smaller than the area of the one IC circuit side electrode 146 located at the center, it is large as shown in FIG. When the base tape 92 is bent with a curvature, the first connecting portion 150a and the second connecting portion 150b are provided at both ends in the longitudinal direction of the base tape 92 before the IC circuit portion 80 is damaged. The IC circuit unit side electrode 146 having a small area is disconnected, and both ends of the IC circuit unit 80 are disconnected from the antenna unit 64, so that further bending of the IC circuit unit 80 is prevented, It is possible to prevent damage of the road section 80. In addition, since each of the two linear elements 64a and 64b is connected to the IC circuit unit 80 via the plurality of IC circuit unit side electrodes 146, it is provided at the center in the longitudinal direction of the base tape 92. The IC circuit part side provided in the center of the longitudinal direction of the base tape 92 even if the connection is disconnected at the parts of the IC circuit part side electrode 146 at both ends having a smaller area compared to the IC circuit part side electrode 146 Since the connection between the IC circuit unit 80 and the antenna unit 64 is ensured through the electrode 146, the function as the RFID circuit element 24a can be secured.

  Furthermore, when the base tape 92 is bent with a large curvature, two sides of the IC circuit portion 80 at both ends perpendicular to the longitudinal direction of the base tape 92 are detached from the base tape 92, and the IC circuit portion 80 is deformed. Therefore, the IC circuit unit 80 is not subjected to excessive stress.

  As described above, by varying the bonding strength along the longitudinal direction of the base tape 92, the first connecting portion 150a and the second connecting portion 150b each have a strong bonding strength at one location. It is possible to prevent excessive stress from being applied to the IC circuit unit 80.

  FIGS. 12A to 12D are diagrams showing patterns of two linear elements 64 a and 64 b of the antenna unit 64 provided on the base tape 92. The two linear elements 64a and 64b have antenna electrodes 65a and 65b, respectively. The antenna electrodes 65a and 65b are portions of the two linear elements 64a and 64b that overlap the IC circuit unit 80. The antenna electrode 65a constitutes the first connection unit 150a, and the antenna electrode 65b is the second connection unit. 150b is configured. In FIG. 12, the antenna electrodes 65a and 65b are indicated by oblique lines. The antenna unit 64 is integrally formed with the antenna electrodes 65a and 65b on the surface of the base film 82 on the IC circuit unit 80 side by a photolithography technique or a screen printing technique using a metal such as Al or Cu or Ag paste. The

  The antenna electrodes 65a and 65b shown in FIGS. 12A and 12B are tapered so that the length in the width direction of the base tape 92 gradually decreases or increases along the longitudinal direction of the base tape 92. It is configured.

  The antenna electrodes 65a and 65b are bonded to the IC circuit unit 80 via the conductive bonding member 146. As shown in FIG. 13, in the IC circuit unit 80, the IC circuit unit side electrode 146 is provided with a constant width along the longitudinal direction of the base tape 92, and a silver paste, for example, is formed on the entire surface of the IC circuit unit side electrode 146. Even if a conductive bonding member such as the above is applied, the portions where the antenna electrodes 65a and 65b are not provided are not bonded. Therefore, the bonding strength at the first connection portion 150a and the second connection portion 150b is determined based on the base tape 92. It can be configured to gradually decrease or gradually increase along the longitudinal direction. Therefore, when the base tape 92 is bent with a large curvature as shown in FIG. 10C, the antenna electrodes 65a and 65b in the IC circuit unit 80 are damaged before the IC circuit unit 80 is damaged. Since the connection between the antenna portion 64 and the IC circuit portion 80 is disconnected at one end where the length in the width direction of the base tape 92 is shorter than the other portions, further bending of the IC circuit portion 80 is prevented. Further, the IC circuit unit 80 can be prevented from being damaged.

  The pattern of the antenna electrodes 65a and 65b is a triangular pattern shown in FIG. 12 (c) instead of the tapered pattern shown in FIGS. 12 (a) and 12 (b). A pattern with a tapered portion may be adopted.

  According to the antenna electrodes 65a and 65b shown in FIGS. 12C and 12D, as shown in FIG. 13, in the IC circuit portion 80, the IC circuit portion side electrode 146 is arranged in the longitudinal direction of the base tape 92. Even if it is provided with a certain width along the portion, the portions where the antenna electrodes 65a and 65b are not provided are not joined. Therefore, the joining strength at the first connecting portion 150a and the second connecting portion 150b is determined by the base tape 92. It can be made different depending on the position in the longitudinal direction. Therefore, when the base tape 92 is bent with a large curvature as shown in FIG. 10C, the antenna electrodes 65a and 65b in the IC circuit unit 80 are damaged before the IC circuit unit 80 is damaged. Since the connection between the antenna electrodes 65a and 65b and the IC circuit unit 80 is interrupted in the portion where the length in the width direction of the base tape 92 is short compared to the other portions and the bonding strength is weak, that of the IC circuit unit 80 The above-described deflection can be prevented, and the IC circuit unit 80 can be prevented from being damaged. When the antenna electrodes 65a and 65b having the pattern shown in FIG. 12C are employed, the IC circuit unit 80 and the antenna are arranged at both ends of the base tape 92 in the longitudinal direction of the first connection unit 150a and the second connection unit 150b. The connection with the unit 64 is disconnected. When the antenna electrodes 65a and 65b having the pattern shown in FIG. 12D are employed, the antenna electrodes 65a and 65b out of the first connection portion 150a and the second connection portion 150b are tapered. The connection between the IC circuit portion 80 and the antenna portion 64 is disconnected at one end where the width of the base tape 92 is shorter than the other portions.

  12A to 12D, each of the two linear elements 64a and 64b is connected to the IC circuit unit 80 along the longitudinal direction of the base tape 92. Therefore, in the IC circuit portion 80, the connection between the IC circuit portion 80 and the antenna portion 64 is ensured in a portion where the length in the width direction of the base tape 92 of the antenna electrodes 65a and 65b is longer than the other portions. Therefore, the function as the RFID circuit element 24a can be secured.

  FIG. 14 is a diagram showing a positional relationship between the IC circuit unit 80, the IC circuit unit side electrode 146, and the two linear elements 64a and 64b in the base tape 92, and the IC circuit unit provided on the back surface of the antenna unit 64. 80 is indicated by a two-dot chain line. As shown in FIG. 14, the IC circuit portion side electrode 146 provided in the IC circuit portion 80 is provided in the region of the length Lc, and the two linear elements 64 a and 64 b are in the longitudinal direction of the base tape 92. Are parallel to each other and opposed to each other in a region with a length La that is longer than Lc. Therefore, when the IC circuit unit 80 is attached to the antenna unit 64, the IC is within the region with the length La. The circuit portion 80 may be attached so as to be accommodated, and the allowable range of misalignment is widened and the yield is improved.

  The preferred embodiments of the present invention have been described in detail with reference to the drawings. However, the present invention is not limited to these embodiments, and may be implemented in other modes.

  For example, by adopting any one of the embodiments shown in FIGS. 9, 11 (a) to 11 (e) and FIGS. Although the joining strength in the portion 150b can be configured to differ depending on the position along the longitudinal direction of the base tape 92, FIG. 9, FIG. 11 (a) to (e), and FIG. 12 (a) to (d). A plurality of embodiments may be used in combination among the embodiments shown in FIG. For example, as shown in FIG. 9, two large and small IC circuit side electrodes 146 are arranged in two rows along the longitudinal direction of the base tape 92, and the conductive bonding member 148 in the smaller IC circuit side electrode 146 is arranged. It is also possible to reduce the amount of.

  In the above-described embodiment, the antenna unit 64 is a dipole antenna composed of two linear elements 64a and 64b. However, both ends of one antenna are respectively connected to the IC circuit unit 80, such as a loop antenna. In the case of an antenna to be connected, one end of the antenna is connected to one side of the IC circuit portion 80 along the longitudinal direction of the base tape 92 so that the first connection portion 150a is formed, and the other end is the first. The present invention can be applied by connecting to the other side of the IC circuit portion 80 along the longitudinal direction of the base tape 92 so as to constitute the second connection portion 150b facing the connection portion 150a.

  In the above-described embodiment, the RFID label 24 has the base film 82 having a substantially constant thickness over the entire surface as shown in FIG. 5, but the base film 82 has the IC circuit portion 80 as shown in FIG. You may have the recessed part 152 which can enter. According to such a configuration, since the IC circuit unit 80 is accommodated in the recess 152, the portion of the IC circuit unit 80 does not protrude from the release paper 90 side.

  In the above-described embodiment, the RFID circuit element 24a includes the release paper 90, the adhesive layer 88, the IC circuit unit 80, the IC circuit unit side electrode 146, the antenna unit 64, the base film 82, and the adhesive layer as shown in FIG. 84 and the cover film 86 are stacked in this order, but the stacking order of the RFID circuit elements 24a is not limited to this. FIG. 16 is a diagram corresponding to FIG. 5B, and is a diagram illustrating another example in which the stacking order is different from the base tape 92 illustrated in FIG. 5B. As shown in FIG. 16, release paper 90, adhesive layer 88a, base film 82, antenna part 64, IC circuit part side electrode 146, IC circuit part 80, adhesive layer 88b, tag cover film 154, adhesive layer 84, cover film The RFID label 24 may be stacked in the order of 86.

  In addition, although not illustrated one by one, the present invention is implemented with various modifications within a range not departing from the gist thereof.

It is a figure explaining the radio | wireless tag production | generation system to which this invention is applied suitably. It is a figure explaining the structure of the radio | wireless tag production | generation apparatus which is one Example of this invention. It is a figure explaining the structure of the wireless tag which is one Example of this invention. 4A and 4B are diagrams illustrating the wireless tag of FIG. 3, in which FIG. 3A is a plan view, FIG. 3B is a bottom view, and FIG. FIG. 5 is a cross-sectional view taken along line VV in FIG. 4, (a) is a view before bonding a cover film, and (b) is a view after bonding a cover film. FIG. 3 is a diagram for explaining in detail the configuration of the cartridge of FIG. 2. It is a figure explaining the structure of the control circuit of FIG. It is a figure which illustrates the antenna pattern of the antenna part in a wireless tag. FIG. 4 is a diagram illustrating a pattern of an IC circuit unit side electrode provided on a surface of the IC circuit unit on the antenna unit side in the wireless tag of FIG. 3. FIG. 4 is a diagram showing a relationship between the curvature of the base tape and the degree of deflection of the IC circuit unit in the wireless tag of FIG. 3. FIG. 4 is a diagram illustrating a pattern of an IC circuit unit side electrode provided on a surface of the IC circuit unit on the antenna unit side in the wireless tag of FIG. 3. FIG. 4 is a diagram illustrating a pattern of antenna electrodes of an antenna unit provided on a base tape in the wireless tag of FIG. 3. FIG. 4 is a diagram illustrating a pattern of an IC circuit unit side electrode provided on a surface of the IC circuit unit on the antenna unit side in the wireless tag of FIG. 3. FIG. 4 is a diagram showing a positional relationship among an IC circuit part, an IC circuit part side electrode, and two linear elements in the base tape in the wireless tag of FIG. 3. It is a figure equivalent to Drawing 5 (b), and is a figure explaining other examples which provided a crevice in a base film. It is a figure equivalent to Drawing 5 (b), and is a figure explaining other examples from which a lamination order differs.

Explanation of symbols

24: wireless tag 24a: wireless tag circuit element 28: cartridge (wireless tag cartridge)
64: Antenna portions 64a, 64b: Linear elements 65a, 65b: Antenna electrode 80: IC circuit portion 92: Base material tape (base material)
146: IC circuit portion side electrode 148: conductive bonding member 150a: first connection portion 150b: second connection portion

Claims (14)

A substrate;
An IC circuit unit that is provided on the substrate and stores predetermined information;
An antenna unit connected to the IC circuit unit for transmitting and receiving information; and
A first connecting portion that is provided along a longitudinal direction of the base material and connects the antenna portion and the IC circuit portion;
A second connection portion provided along the longitudinal direction of the base material so as to face the first connection portion, and connecting the antenna portion and the IC circuit portion at a position different from the first connection portion. A wireless tag circuit element comprising:
The wireless tag circuit element according to claim 1, wherein the bonding strength at the first connection portion and the bonding strength at the second connection portion are different depending on a position along a longitudinal direction of the base material. The antenna unit is a dipole antenna composed of two linear elements,
The first connection portion connects one linear element of the antenna portion and the IC circuit portion, and the second connection portion is another linear shape different from the first connection portion of the antenna portion. 2. The RFID tag circuit element according to claim 1, wherein an element and the IC circuit unit are connected.   The said 1st connection part and the said 2nd connection part have a some IC circuit part side electrode provided along with the longitudinal direction of the said base material, The Claim 1 or 2 characterized by the above-mentioned. RFID circuit element.   In the first connection part and the second connection part, at least one of the plurality of IC circuit part side electrodes provided side by side along the longitudinal direction of the base material is another line provided in the same row. 4. The RFID circuit element according to claim 3, wherein the area is smaller than that of the IC circuit portion side electrode. The IC circuit part side electrode is connected to the antenna part via a conductive bonding member,
The area of the conductive joint member in at least one of the plurality of IC circuit unit side electrodes provided side by side along the longitudinal direction of the base material is another IC circuit unit side electrode provided in the same row. 5. The RFID tag circuit element according to claim 3, wherein the RFID tag circuit element is smaller than an area of a bonding region formed by the conductive bonding member.   6. The RFID tag circuit element according to claim 5, wherein the conductive bonding member is a conductive paste.   In the first connection portion and the second connection portion, an area of the IC circuit portion side electrode existing per predetermined area of the base material is different depending on a position along a longitudinal direction of the base material. The RFID tag circuit element according to claim 3. The first connection part and the second connection part have an IC circuit part side electrode provided along the longitudinal direction of the base material,
The RFID circuit element according to claim 1 or 2, wherein a length of the IC circuit portion side electrode in the width direction of the base material varies depending on a position along a longitudinal direction of the base material.   9. The RFID tag circuit element according to claim 8, wherein the length of the IC circuit portion side electrode in the width direction of the base material gradually decreases or gradually increases along the longitudinal direction of the base material.   The RFID circuit element according to claim 9, wherein the IC circuit portion side electrode has a tapered shape. The first connection part and the second connection part have antenna electrodes provided on the antenna part along the longitudinal direction of the base material,
11. The RFID tag circuit element according to claim 1, wherein a length of the antenna electrode in a width direction of the base material varies depending on a position along a longitudinal direction of the base material.   12. The RFID circuit element according to claim 11, wherein the antenna electrode has a tapered shape.   The bonding strength at the first connection portion and the bonding strength at the second connection portion are substantially equal to each other in a portion positioned substantially perpendicular to the longitudinal direction of the base material. The RFID tag circuit element according to claim 1.   14. A RFID tag cartridge, wherein the RFID circuit element according to claim 1 is housed in a state in which the substrate is rolled.

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