JP4125997B2

JP4125997B2 - Composite wiring board

Info

Publication number: JP4125997B2
Application number: JP2003171572A
Authority: JP
Inventors: 賢一郎花村; 智充堀; 尚安藤
Original assignee: Sony Chemical and Information Device Corp
Current assignee: Dexerials Corp
Priority date: 2003-06-17
Filing date: 2003-06-17
Publication date: 2008-07-30
Anticipated expiration: 2023-06-17
Also published as: JP2005011859A

Description

【０００１】
【発明の属する技術分野】
本発明は、配線基板の技術分野にかかり、特に、基板素片と、フレキシブル配線基板である接続用配線基板とが積層された複合配線素片に関する。
【０００２】
【従来の技術】
図１３の符号１０１は従来技術の複合配線基板であり、第一、第二の積層部１３０ａ、１３０ｂが、橋梁部１２０ｃで接続されて構成されている。第一、第二の接続部１３０ａ、１３０ｂには、複数の電気部品１３５が搭載されており、これらの電気部品１３５は橋梁部１２０ｃによって互いに電気的に接続されている。
【０００３】
第一、第二の積層部１３０ａ、１３０ｂは、図１４(ｂ)で示したような、長尺のフレキシブル配線基板１２０の両端の表面及び裏面に、図１４(ａ)で示したような短尺のリジッド配線基板で構成された基板素片１１０が１又は２枚以上積層されて構成されており、橋梁部１２０ｃは、フレキシブル配線基板１２０の中央部分であって、第一、第二の積層部１３０ａ、１３０ｂの間に位置する部分で構成されている。
【０００４】
上記複合配線基板１０１の基板素片１１０とフレキシブル配線基板１２０の構成を説明すると、図１４(ａ)を参照し、基板素片１１０は、カラス・エポキシ等で構成された硬質のベース基板１１１と、該ベース基板１１１の片面に配置された層間配線膜１１２と、ベース基板１１１を貫通し、底面が配線膜１１２に接続され、先端がベース基板１１１の層間配線膜１１２とは反対の面に突出された接続突起１１４とを有している。
【０００５】
ベース基板１１１の接続突起１１４の先端が突出する側の面には、接続突起１１４の先端が露出された状態で接着剤１１３が配置されている。
【０００６】
次に、図１４(ｂ)を参照し、フレキシブル配線基板１２０は、可撓性フィルム１２３と、可撓性フィルム１２３の表面と裏面にそれぞれ配置された主配線膜１２１、１２２と、主配線膜１２１、１２２上に配置されたカバーフィルム１２５、１２６とを有している。
【０００７】
可撓性フィルム１２３と、主配線膜１２１、１２２と、カバーフィルム１２５、１２６は可撓性を有しており、フレキシブル配線基板１２０は自由に折り曲げられるようになっている。
【０００８】
図１５は、第一又は第二の積層部１３０ａ、１３０ｂの分解図である。フレキシブル配線基板１２０の片面に複数枚の基板素片１１０₁〜１１０₃が配置され、反対側の面にも複数枚の基板素片１１０₄〜１１０₆が配置されており、各基板素片１１０₁〜１１０₆の接続突起１１４は、フレキシブル配線基板１１０側に向けられ、基板素片１１０₁〜１１０₆の接続突起は、隣接する基板素片１１０₁〜１１０₆の層間配線膜１２１又はフレキシブル配線基板１２０の主配線膜１２１、１２２に当接され、全体が押圧され、互いに密着した状態で接着剤１１３によって貼付される。
【０００９】
このとき、フレキシブル配線基板１２０は、フレキシブル配線基板１２０に密着される基板素片１１０₁、１１０₄の接続突起１１４によって押圧される。
【００１０】
符号１１４ｐは、フレキシブル配線基板１２０の両面側に配置され、フレキシブル配線基板１２０を両側から押圧する接続突起であり、符号１１４ｑは、フレキシブル配線基板１２０の片面側だけに配置され、フレキシブル配線基板１２０を表面側、又は裏面側からのみ押圧する接続突起を示している。
【００１１】
基板素片１１０₁〜１１０₆とフレキシブル配線基板１２０を積層する際、一組の接続突起１１４ｐによって押圧される部分は変形しないが、片面にのみ配置された接続突起１１４ｑは、反対側の面に接続突起１１４が存在しないため、図１６に示すように、フレキシブル配線基板１２０を変形させ、曲がりや波状の歪みを発生させる。
【００１２】
この歪みは、接続突起１１４(１１４ｐ、１１４ｑ)と主配線膜１２１、１２との間の位置ズレを発生させ、接続不良が生じる原因となる。
【特許文献１】
特開平０５−２４３７３８号公報
【特許文献２】
特開平０５−０７５２７０号公報
【００１３】
【発明が解決しようとする課題】
本発明は上記従来技術の不都合を解決するために創作されたものであり、その目的は歪みが生じない複合配線基板を提供することにある。
【００１４】
【課題を解決するための手段】
請求項１記載の発明は、可撓性フィルムと、前記可撓性フィルムの片面と反対側の面にそれぞれ配置された第一、第二の主配線膜とを有し、可撓性を有する接続用配線基板と、第一のベース基板と、前記第一のベース基板の片面に配置された第一の層間配線膜と、前記第一のベース基板を貫通し、底面が前記第一の層間配線膜に接続され、先端が前記第一のベース基板の反対側の面に突き出された第一の接続突起を有し、前記接続用配線基板の前記第一の主配線膜が位置する面側に配置された第一の基板素片と、第二のベース基板と、前記第二のベース基板の片面に配置された第二の層間配線膜と、前記第二のベース基板を貫通し、底面が前記第二の層間配線膜に接続され、先端が前記第二のベース基板の反対側の面に突き出された第二の接続突起を有し、前記接続用配線基板の前記第二の主配線膜が位置する面側に配置された第二の基板素片とを有し、前記第一、第二の接続突起は、前記第一、第二の主配線膜にそれぞれ当接され、前記第一、第二の基板素片と前記接続用配線基板とが積層された複合配線基板であって、前記第一の接続突起が当接された前記接続用配線基板の部分は、真裏位置に前記第二の接続突起が当接され、第三のベース基板と、前記第三のベース基板の片面に配置された第三の層間配線膜と、前記第三のベース基板を貫通し、底面が前記第三の層間配線膜に接続され、先端が前記第三のベース基板の反対側の面に突き出された第三の接続突起を有する第三の基板素片と、第四のベース基板と、前記第四のベース基板の片面に配置された第四の層間配線膜と、前記第四のベース基板を貫通し、底面が前記第四の層間配線膜に接続され、先端が前記第四のベース基板の反対側の面に突き出された第四の接続突起を有する第四の基板素片とを有し、前記第三の基板素片は一枚以上が前記第一の基板素片に積層され、前記第四の基板素片は一枚以上が前記第二の基板素片に積層され、前記第一〜第四のベース基板は軟質の樹脂フィルムによって構成され、前記第一〜第四の基板素片は可撓性を有するフレキシブル配線基板である複合配線基板である。
請求項２記載の発明は、可撓性フィルムのうち、前記第一の接続突起が当接された第一の主配線膜と、該第一の主配線膜の真裏に位置し、前記第二の接続突起が当接された前記第二の主配線膜との間に位置する部分には貫通孔が形成され、該貫通孔内に配置された接続材料によって導電性プラグが形成され、前記第一、第二の接続突起は、前記導電性プラグを両側から押圧する位置に配置された請求項１記載の複合配線基板である。
請求項３記載の発明は、前記第三、第四の基板素片のうち、最外層に位置する前記第三、第四の基板素片の少なくとも一方には、電気部品が搭載された請求項１又は請求項２のいずれか１項記載の複合配線基板である。
請求項４記載の発明は、前記接続用配線基板は、前記第一、第二の基板素片よりも長尺に形成され、前記第一、第二の基板素片で挟まれた積層部と、前記第一、第二の基板素片からはみ出した橋梁部とを有する請求項１乃至請求項３のいずれか１項記載の複合配線基板である。
請求項５記載の発明は、可撓性フィルムと、前記可撓性フィルムの片面と反対側の面にそれぞれ配置された第一、第二の主配線膜とを有し、可撓性を有する接続用配線基板と、第一のベース基板と、前記第一のベース基板の片面に配置された第一の層間配線膜と、前記第一のベース基板を貫通し、底面が前記第一の層間配線膜に接続され、先端が前記第一のベース基板の反対側の面に突き出された第一の接続突起を有し、前記接続用配線基板の前記第一の主配線膜が位置する面側に配置された第一の基板素片と、第二のベース基板と、前記第二のベース基板の片面に配置された第二の層間配線膜と、前記第二のベース基板を貫通し、底面が前記第二の層間配線膜に接続され、先端が前記第二のベース基板の反対側の面に突き出された第二の接続突起を有し、前記接続用配線基板の前記第二の主配線膜が位置する面側に配置された第二の基板素片とを有し、前記第一、第二の接続突起は、前記第一、第二の主配線膜にそれぞれ当接され、前記第一、第二の基板素片と前記接続用配線基板とが積層された複合配線基板であって、前記第一の接続突起が当接された前記接続用配線基板の部分は、真裏位置に前記第二の接続突起が当接され、前記接続用配線基板は、前記第一、第二の基板素片よりも長尺に形成され、前記第一、第二の基板素片で挟まれた積層部と、前記第一、第二の基板素片からはみ出した橋梁部とを有し、互いに対向する前記第一、第二の接続突起にそれぞれ当接された前記第一、第二の主配線膜のうち、一方は、前記橋梁部に延設され、他方は前記積層部内で終端された複合配線基板である。
請求項６記載の発明は、可撓性フィルムのうち、前記第一の接続突起が当接された前記第一の主配線膜と、該第一の主配線膜の真裏に位置し、前記第二の接続突起が当接された前記第二の主配線膜との間に位置する部分には貫通孔が形成され、該貫通孔内に配置された接続材料によって導電性プラグが形成され、前記第一、第二の接続突起は、前記導電性プラグを両側から押圧する位置に配置された請求項５記載の複合配線基板である。
請求項７記載の発明は、第三のベース基板と、前記第三のベース基板の片面に配置された第三の層間配線膜と、前記第三のベース基板を貫通し、底面が前記第三の層間配線膜に接続され、先端が前記第三のベース基板の反対側の面に突き出された第三の接続突起を有する第三の基板素片と、第四のベース基板と、前記第四のベース基板の片面に配置された第四の層間配線膜と、前記第四のベース基板を貫通し、底面が前記第四の層間配線膜に接続され、先端が前記第四のベース基板の反対側の面に突き出された第四の接続突起を有する第四の基板素片とを有し、前記第三の基板素片は一枚以上が前記第一の基板素片に積層され、前記第四の基板素片は一枚以上が前記第二の基板素片に積層された請求項５又は請求項６のいずれか１項記載の複合配線基板である。
請求項８記載の発明は、前記第三、第四の基板素片のうち、最外層に位置する前記第三、第四の基板素片の少なくとも一方には、電気部品が搭載された請求項７記載の複合配線基板である。
請求項９記載の発明は、前記第一、第二のベース基板は硬質の板であり、前記第一、第二の基板素片は硬質のリジッド配線板である請求項５乃至請求項８のいずれか１項記載の複合配線基板である。
請求項１０記載の発明は、前記第一〜第四のベース基板は軟質の樹脂フィルムによって構成され、前記第一〜第四の基板素片は可撓性を有するフレキシブル配線基板である請求項７又は請求項８のいずれか１項記載の複合配線基板である。
請求項１１記載の発明は、前記第一、第二の基板素片は、前記接続用配線基板の一端と他端にそれぞれ配置され、前記積層部は、前記接続用配線基板の両端にそれぞれ形成され、前記各積層部内に位置する前記第一又は第二の主配線膜は、前記橋梁部に延設された前記第一又は第二の主配線膜によって接続された請求項１０記載の複合配線基板である。
【００１５】
本発明は上記のように構成されており、第一の接続突起が当接される部分の第一の主配線膜の反対側には、第二の主配線膜が配置されている。そして、第一の接続突起が当接される第一の主配線膜と、第二の接続突起が当接される第二の主配線膜とは、可撓性フィルム又は導電性プラグを挟んで互いに対向しており、第一の接続突起と第二の接続突起とは、フレキシブル配線基板の同じ垂線上に位置している。
【００１６】
従って、第一、第二の接続突起を押圧すると、可撓性フィルム又は導電性プラグが両側から押圧されるようになっており、片側から押されて曲がることはない。
【００１７】
互いに対向する第一、第二の主配線膜のうちの少なくとも一方は、外部回路や電気部品に電気的に接続された接続パッドであり、他方は、他の回路や他の電気部品に電気的に接続された接続パッドであってもよく、他の回路や電気部品から電気的に孤立したダミーパッドであってもよい。
【００１８】
【発明の実施の形態】
本発明の実施例を説明する。
図１の符号１は本発明の第一例の複合配線基板を示している。
【００１９】
この複合配線基板１は、第一、第二の積層部３０ａ、３０ｂが、可撓性あるいは屈曲性を有する橋梁部２０ｃで接続されて構成されている。
【００２０】
図２は、複合配線基板１の第一、第二の積層部３０ａの部分の分解図であり、該複合配線基板１は、１乃至複数枚の接続用配線基板２０と、接続用配線基板２０の片面に配置される第一の基板素片４１と、反対側の面に配置される第二の基板素片４２と、第一、第二の基板素片４１、４２に積層される第三、第四の基板素片４３、４４とを有している。
【００２１】
第一〜第四の基板素片４１〜４４は、第一〜第四のベース基板６１、６２、６３、６４と、第一〜第四の各ベース基板６１〜６４の片面にそれぞれ配置された第一〜第四の層間配線膜５１、５２、５３、５４と、第一〜第四のベース基板６１〜６４を貫通し、底面が第一〜第四の層間配線膜５１〜５４に接続され、先端が第一〜第四の層間配線膜５１〜５４とは反対側の各ベース基板６１〜６４の面に突出された第一〜第四の接続突起８１、８２、８３、８４をそれぞれ有している。
【００２２】
第一〜第四の基板素片４１〜４４は、硬質のリジッド配線基板である場合と、軟質で可撓性を有するフレキシブル配線基板である場合の両方が含まれる。
【００２３】
リジッド配線基板である場合は、第一〜第四のベース基板６１〜６４は、カラス・エポキシ等で構成されており、フレキシブル配線基板である場合は、第一〜第四のベース基板６１〜６４は、ポリイミドフィルム等の可撓性を有する樹脂フィルムによって構成されている。
【００２４】
いずれの場合も、各接続突起８１〜８４は、金属や導電性樹脂等の導電性材料によって構成されている。また、第一〜第四の層間配線膜５１〜５４は、膜厚十μｍ〜数十μｍの銅の膜によって構成されている。
【００２５】
第一〜第四のベース基板６１〜６４の表面のうち、第一〜第四の接続突起８１〜８４の先端が突出する側の面には、各接続突起８１〜８４の先端が露出された状態で接着剤７１、７２、７３、７４がそれぞれ配置されている。接着剤７１〜７４はフィルム状であり、それにより、第一〜第四の各ベース基板６１〜６４の表面は覆われている。
【００２６】
次に、接続用配線基板２０は、図３に示すように、可撓性フィルム２３と、可撓性フィルム２３の表面と裏面にそれぞれ配置された第一、第二の主配線膜２１、２２と、と、第一、第二の主配線膜２１、２２上に配置されたカバーフィルム２５、２６とを有している。
【００２７】
可撓性フィルム２３は、その表面から裏側まで貫通し、第一、第二の主配線膜２１、２２間を接続する導電性プラグ２４を有している。
【００２８】
可撓性フィルム２３とカバーフィルム２５、２６は、ポリイミド膜等の樹脂によって構成され、第一、第二の主配線膜２１、２２は、膜厚十μｍ〜数十μｍの銅の膜によって構成されており、接続用配線基板２０全体が可撓性・屈曲性を有し、自由に曲げられるように構成されている。
【００２９】
ベース基板６１〜６４は、ガラス・エポキシ等で構成された硬質基板である場合と、可撓性フィルム２３とと同じポリイミド樹脂等で構成された軟質の樹脂フィルムである場合がある。
【００３０】
ベース基板６１〜６４が可撓性フィルムであった場合は、第一〜第四の基板素片６１〜６４は、接続用配線基板２０と同じように可撓性や屈曲性と呼ばれる性質を有しているが、硬質基板である場合は、接続用配線基板２０のように自由に曲げることはできない。
【００３１】
また、ベース基板６１〜６４が可撓性フィルムであっても、後述するように第一〜第四の基板素片６１〜６４が複数枚積層されたて多層積層体が形成された場合は、その多層積層体は可撓性を失い、自由に曲げることは硬質基板の場合と同様にできなくなる。
【００３２】
図３の符号２０ａ、２０ｂは、それぞれ第一〜第四の基板素片が積層され、第一、第二の積層部３０ａ、３０ｂが形成される部分である。
【００３３】
接続用配線基板２０の長さは、第一の積層部３０ａと第二の積層部３０ｂの合計長さを超える長さであり、接続用配線基板２０のうち、第一、第二の積層部３０ａ、３０ｂの一部となる部分２０ａ、２０ｂの中間は、第一、第二の積層部３０ａ、３０ｂを接続する橋梁部２０ｃである。
【００３４】
接続用配線基板２０の端部２０ａ、２０ｂと橋梁部２０ｃの境界付近の部分的な平面図を図５に示す。
【００３５】
第一、第二の主配線膜２１、２２はパターニングされており、幅広の部分と細長の部分が形成されている。
【００３６】
幅広の部分のうち、後述するように、外部回路や電気部品に接続される方をパッド部として符号３１を付し、他の回路等に電気的に接続されず、電気的に孤立する方をダミー部として符号３２を付す。
【００３７】
細長に形成された部分は、配線部３３であり、第一、第二の積層部３０ａ、３０ｂと、橋梁部２０ｃに配置されている。それに対し、パッド部３１とダミー部３２は、橋梁部２０ｃには配置されておらず、第一、第二の積層部３０ａ、３０ｂの内部に配置されており、第一の積層部３０ａに位置するパッド部３１と、第二の積層部３０ｂに位置するパッド部３１とは、所定のもの同士が配線部３３によって接続されている。ダミー部３２は、橋梁部２０ｃまで伸びる接続部３３には接続されていない。
【００３８】
一つのパッド部３１の真裏位置には、反対側の面に位置するパッド部３１か、又はダミー部３２のいずれか一方が配置されている。
そして、導電性プラグ２４は、そのパッド部３１の間、又はパッド部３１とダミー部３２の間に配置されている。
【００３９】
他方、カバーフィルム２５、２６の第一、第二の積層部３０ａ、３０ｂの一部を構成する部分には、開口２７、２８がそれぞれ設けられており、各開口２７、２８底面には、第一、第二の主配線膜２１、２２のパッド部３１とダミー部３２を構成する部分が露出されている。
【００４０】
接続用配線基板２０の片面に密着される第一の基板素片４１の第一の接続突起８１と、反対側の面に密着される第二の基板素片４２の第二の接続突起８２とは、バッド部３１又はダミー部３２のいずれか一方に当接される位置に形成されている。
【００４１】
第一、第二の基板素片４１、４２上に、第三、第四の基板素片４３、４４を１乃至複数枚ずつ配置する。第三、第四の接続突起８３、８５は、第一、第二の基板素片４１、４２側にそれぞれ向ける。
【００４２】
そして、各基板素片４１〜４４と接続用配線基板２０とを加熱しながら積層される方向に加圧すると、第一、第二の接続突起８１、８２は、パッド部３１を構成する第一、第二の主配線膜２１、２２又はダミー部３２を構成する第一、第二の主配線膜２１、２２に押圧され、第三、第四の接続突起８３、８４は、第一、第二の層間配線膜５１、５２にそれぞれ押圧される。
【００４３】
第一、第二の接続突起８１、８２を通る直線は、導電性プラグ２４を通り、且つ、可撓性フィルム２３の表面に対して垂直になっている。従って、第一、第二の基板素片４１、４２が、接続用配線基板２０に対して押圧されると、第一、第二の接続突起８１、８２は、可撓性フィルム２３の同じ部分(ここでは導電性プラグ２４)を押圧するようになっている。
【００４４】
即ち、可撓性フィルム２３のうち、第一の接続突起８１によって押圧される部分(可撓性フィルム２３を構成するポリイミド又は導電性プラグ２４)の反対側は、第二の接続突起８２によって押圧されるようになっており、逆に、第二の接続突起８２によって押圧される部分(可撓性フィルム２３を構成するポリイミド又は導電性プラグ２４)は第一の接続突起８１によって押圧されるようになっている。
【００４５】
従って、この実施例では、可撓性フィルム２３には、第一又は第二の接続突起８１、８２のいずれか一方からのみ押圧される部分は存在せず、接続用配線基板２０の第二、第二の積層部３０ａ、３０ｂに歪みが生じないようになっている。
【００４６】
この状態で加熱されると、接着剤７１〜７３が軟化し、冷却されて硬化すると第一〜第四の基板素片４１〜４４と、接続用配線基板２０とは、接着剤７１〜７３によって互いに接着され、複合配線基板１が形成される。
【００４７】
この状態では、第一、第二の主配線膜２１、２２と第一〜第四の層間配線膜５１〜５４の間は、導電性プラグ２４や第一〜第四の接続突起８１〜８４によって互いに電気的に接続されている。
【００４８】
但し、第一、第二の接続突起８１、８２の一方がパッド部３１に当接され、他方がダミー部３２に当接される場合、ダミー部３２を構成する第一又は第二の層間配線膜５１、５２には、第三、第四の基板素片４３、４４の接続突起８３、８４は当接されない。
【００４９】
最後に、最外層に位置する第三、第四の基板素片４３、４の第三、第四の層間配線膜５３、５４に電気部品３５を電気的に接続し、第一、第二の積層部３０ａ、３０ｂに電気部品３５を搭載する。電気部品３５は、集積回路などの半導体素子の他、コンデンサ、抵抗素子、インダクタンス素子等の電気部品が含まれる。
【００５０】
この状態では、電気部品３５は、第一又は第二の主配線膜２１、２２の少なくとも一方に電気的に接続されている。
【００５１】
その電気的接続の経路を説明すると、例えば、図４に示す導電性プラグ２４は、片面側がパッド部３１に接触し、反対側の面がダミー部３２に接触しており、パッド部３１には、第一の接続突起８１や第二の接続突起８２が当接され、パッド部３１に接続された第一、第二の接続突起８１、８２が接続された第一、第二の層間配線膜５１、５２には、隣接する第三、第四の基板素片４３、４４の接続突起８３、８４がそれぞれ当接されている。
【００５２】
複数の第三の基板素片４３同士が積層された状態では、それらの第三の層間配線膜５３は、第三の接続突起８３によって互いに相互に電気的に接続されている。
【００５３】
同様に、複数の第四の基板素片４４同士が積層された状態では、それらの第四の層間配線膜５４は、第四の接続突起８４によって互いに相互に電気的に接続されている。
【００５４】
これにより、一個のパッド部３１は、第一の基板素片４１と第一の基板素片４１に積層された第三の基板素片４３の第一、第三の層間配線膜５１、５３に電気的に接続されるか、又は、第二の基板素片４２と第二の基板素片４２に積層された第四の基板素片４４の第四の層間配線膜５４に電気的に接続される。
【００５５】
従って、一個のパッド部３１は、最外層に位置する第三又は第四の基板素片４３、４４の第三又は第四の層間配線膜５３、５４のいずれか一方又は両方の層間配線膜５３、５４に接続される。
【００５６】
パッド部３１は、図５のような接続部３３に接続され、接続用配線基板２０の橋梁部２０ｃを通る接続部３３により、第一の積層部３０ａに位置するパッド部３１と第二の積層部３０ｂに位置するパッド部３１とが相互に接続される。
【００５７】
第一、第二の積層部３０ａ、３０ｂにそれぞれ位置し、最外層の第三又は第四の基板素片４３、４４に搭載された電気部品３５は、パッド部３１と接続部３３とを介して相互に電気的に接続される。
【００５８】
また、最外層の第三又は第四の基板素片４３、４４が有する第三、第四の層間配線膜５３、５４に他の外部回路が電気的に接続されれば、複合配線基板１に搭載された電気部品３５は外部回路に電気的に接続される。外部回路は、最外層の第三又は第四の基板素片４３、４４が有する第三、第四の層間配線膜５３、５４以外の配線膜に接続されていても同じである。
【００５９】
第一又は第二の接続突起８１、８２が当接されるパッド部３１の真裏位置にはパッド部３１又はダミー部３２が配置され、その間には、電極プラグ２４が配置されている。
【００６０】
真裏位置のパッド部３１には、上述したように、第一、又は第二の接続突起８１、８２が当接されており、他方、ダミー部３２にも、第一の接続突起８１又は第二の接続突起８２のいずれかが当接されている。
【００６１】
従って、接続用配線基板２０は、同じ部分一方の面が第一の接続突起８１に当接され、反対側の面が第二の接続突起８２に当接されている。
【００６２】
そして、第一、第二の接続突起８１、８２に接続用配線基板２０を押圧する力が加わると、第一、第二の接続突起８１、８２は電極プラグ４２を両側から押圧するので、接続用配線基板２０は、可撓性を有していても歪みや曲がりが生じないようになっている。
【００６３】
電極プラグ２４が配置されていない場合は、第一、第二の接続突起８１、８２が、第一、第二の主配線膜２１、２２を介して、可撓性フィルム２３を両側から押圧する。このように、電極プラグ２４が配置されていない場合は、可撓性フィルム２３が凹んでも接続用配線基板２０は曲がらないため、本発明に含まれる。
【００６４】
図１、及び後述する図６の符号Ｓ₁は、第一、第二の接続突起８１、８２が当接されるダミー部３２と接続部３３の間に電極プラグ２４は配置されておらず、可撓性フィルム２３が存する部分を示している。
【００６５】
なお、ダミー部３２に当接された第一又は第二の接続突起８１、８２は、第一又は第二の層間配線膜５１、５２に接続されているが、その層間配線膜５１、５２は、第三の基板素片４３の第三の接続突起８３や第四の基板素片４４の第四の接続突起８４に接続させず、孤立させることができる。このようにすれば、複合配線基板１内部の配線パターンが簡略される。
【００６６】
そして、以上のように複合配線基板１を作成する際に接続用配線基板２０に歪みが生じず、位置ずれが生じていないので、第一、第二の接続突起８１、８２がパッド部３１に確実に当接され、接続不良が生じない。
【００６７】
次に、図６(ａ)の符号２は、本発明の第二例の複合配線基板を示しており、同じ部材には、上記第一例の複合配線基板１と同じ符号を付して説明を省略する。
【００６８】
この複合配線基板２は、図６(ｂ)に示した長尺で可撓性を有する接続用配線基板５０と、上記構成の第一〜第四の基板素片４１〜４４とを有しており、図７に示すように、接続用配線基板５０の片側の端部の片面に第一の基板素片４１が配置され、その真裏位置に、第二の基板素片４２が配置されており、更に、第一、第二の基板素片４１、４２に対し、第三の基板素片４３と第四の基板素片４４がそれぞれ積層され、積層部３０ｄが構成されている。
【００６９】
図６(ｂ)及び図７の符号５０ｄは、接続用配線基板５０のうち積層部３０ｄの一部となる端部を示している。また、符号５０ｃは、積層部３０ｄからはみ出た橋梁部であり、この橋梁部３０ｄの端部(積層部３０ｄとは逆側)では、カバーフィルム２５が部分的に除去され、コンタクト部１３が形成されている。
【００７０】
図８に示すように、第一の主配線膜２１によって複数の接続部３３が構成されており、コンタクト部１３には、各節族部３３の表面と、接続部３３間に位置する可撓性フィルム２３の表面と露出されている。
【００７１】
この第二例の複合配線基板２でも、上記第一例の複合配線基板１と同様に、接続用配線基板５０のうち、第一の接続突起８１が当接される部分の真裏位置には、第二の接続突起８２が当接されるようになっており、逆に、第二の接続突起８２が当接される真裏位置には、第一の接続突起８１が当接されるようになっている。
【００７２】
第一、第二の接続突起８１が当接される位置には、第一又は第二の主配線膜２１、２２によって構成されたパッド部３１又はダミー部３２のいずれか一方が配置されており、第一、第二の接続突起８１は、パッド部３１又はダミー部３２のいずれか一方に当接されるようになっている。
【００７３】
なお、第一、第二の接続突起８１、８２が当接されるパッド部３１とダミー部３２の間、又はパッド部３１とパッド部３１の間には導電性プラグ２４が配置されており、第一、第二の接続突起８１、８２は導電性付ラブ２４を両側から押圧するようになっている。
【００７４】
従って、この実施例でも、接続用配線基板５０には、第一又は第二の接続突起８１、８２のいずれか一方からのみ押圧される部分は存在せず、接続用配線基板５０の積層部３０ｄに歪みが生じないようになっている。
【００７５】
次に、図８の符号２Ａ、２Ｂは、上述した第二例の複合配線板をそれぞれ示しており、各複合配線基板２Ａ、２Ｂのコンタクト部１３同士を向け、コンタクト部１３に位置する接続部３３同士を電気的に接続し、図９に示した本発明の第三例の複合配線基板３を構成する。
【００７６】
この第三例の複合配線基板３では、二枚の複合配線基板２Ａ、２Ｂの少なくとも一方のコンタクト部１３上に異方導電性フィルム１７が配置され、コンタクト部１３同士が接着されると共に、コンタクト部１３に露出する接続部３３同士が電気的に接続されており、２枚の複合配線基板２Ａ、２Ｂの橋梁部５０ｃによって、２枚の複合配線基板２Ａ、２Ｂの積層部３０ｄ同士が接続されている。従って、一方の複合配線基板２Ａの積層部３０ｄに搭載された電気部品３５と、他方の複合配線基板２Ａの積層部３０ｄに搭載された電気部品３５とは、２枚の橋梁部５０ｃによって互いに接続されている。
【００７７】
なお、本発明の複合配線基板１、２、２Ａ、２Ｂは、接続用配線基板２０、５０の両端又は片側端部の表面と裏面に第一、第二の基板素片４１、４２をそれぞれ貼付し、三層積層基板を作成した後、第一、第二の基板素片４１、４２に、一枚の第三又は第四の基板素片４３、４４を積層させたり、予めそれぞれ積層させて置いた複数の第三、第四の基板素片４３、４４を三層積層基板に貼り付けることができる。
【００７８】
図１０は、接続用配線基板２０の両側に、第一、第二の基板素片４１、４２をそれぞれ対向させた状態であり、図１１は、押圧装置４８、４９を第一、第二の基板素片４１、４２の表面に均一に当接させ、加熱しながら押圧することにより、第一、第二の基板素片４１、４２を接続用配線基板２０に貼り合わせ、三層積層基板４５を形成した状態を示している。
【００７９】
押圧装置４８、４９の第一、第二の基板素片４１、４２に当接される部分は固く、また平坦にされており、第一、第二の基板素片４１、４２が接続用配線基板２０に押圧されても、本発明の三層積層基板４５は歪みや曲がりを生じない。
【００８０】
そして、その三層積層基板４５に、第三、第四の積層基板４３、４４を１枚又は複数枚積層させて複合配線基板１、２、２Ａ、２Ｂを形成しても歪みや曲がりは生じない。
【００８１】
従来技術では、第一、第二の基板素片４１、４２が硬質のリジッド配線基板であっても、軟質のフレキシブル配線基板であっても、上記のように押圧されると、三層積層基板が形成された時点で歪みや曲がりが生じる。
【００８２】
従来技術では、特に、第一、第二の基板素片４１、４２が硬質のリジッド配線基板である場合に、三層積層基板に歪みや曲がりが生じやすい。
【００８３】
図１２の符号４６は、１枚の第一の基板素片４１に１枚以上の第三の基板素片４３を積層させた状態の第一の多層積層基板であり、符号４７は、１枚の第二の基板素片４２に１枚以上の第四の基板素片４４を積層させた状態の第二の多層積層基板を示している。
【００８４】
第一、第二の多層積層基板４６、４７を、接続用配線基板２０に貼付すると、歪みや曲がりを有さない本発明の複合配線基板１が得られる。
【００８５】
第一〜第四の基板素片４１〜４４がフレキシブル配線基板であっても、それらを複数枚積層させた第一、第二の多層積層板４６、４７は可撓性を失っているので、従来技術では、接続用配線基板２０に貼付する際に、接続用配線基板２０に歪みや曲がりが生じやすい。
【００８６】
【発明の効果】
本発明の複合配線基板には歪みが生じない。
【図面の簡単な説明】
【図１】本発明の第一例の複合配線基板
【図２】その組み立て方を説明するための図
【図３】第一例の複合配線基板に用いられるフレキシブル配線基板
【図４】電気部品との接続を説明するための図
【図５】パッド部とダミー部の相違を説明するための図
【図６】(ａ)：本発明の第二例の複合配線基板 (ｂ)：それに用いられるフレキシブル配線基板
【図７】第二例の複合配線基板の組み立て方を説明するための図
【図８】コンタクト部を説明するための図
【図９】(ａ)：第二例の複合配線基板同士の接続を説明するための図 (ｂ)：本発明の第三例の複合配線基板
【図１０】三層積層基板を形成する工程を説明するための図(１)
【図１１】三層積層基板を形成する工程を説明するための図(２)
【図１２】第一、第二の多層積層基板を説明するための図
【図１３】従来技術の複合配線基板
【図１４】その複合配線基板に用いられる(ａ)：基板素片、(ｂ)：フレキシブル配線基板
【図１５】その複合配線基板をの組み立て方を説明するための図
【図１６】従来技術の複合配線基板の歪みを説明するための図
【符号の説明】
１〜３……複合配線基板
２１……第一の主配線膜
２２……第二の主配線膜
２３……可撓性フィルム
２４……導電性プラグ
３５……電気部品
４１〜４４……第一〜第四の基板素片
５１〜５４……第一〜第四の層間配線膜
６１〜６４……第一〜第四のベース基板
８１〜８４……第一〜第四の接続突起
３０ａ、３０ｂ、３０ｄ……積層部
２０ｃ、５０ｃ……橋梁部[0001]
BACKGROUND OF THE INVENTION
The present invention relates to the technical field of wiring boards, and particularly relates to a composite wiring piece in which a board piece and a connection wiring board which is a flexible wiring board are laminated.
[0002]
[Prior art]
Reference numeral 101 in FIG. 13 denotes a composite wiring board according to the prior art, in which first and second laminated portions 130a and 130b are connected by a bridge portion 120c. A plurality of electrical components 135 are mounted on the first and second connection portions 130a and 130b, and these electrical components 135 are electrically connected to each other by a bridge portion 120c.
[0003]
The first and second laminated portions 130a and 130b are formed on the front and back surfaces of both ends of the long flexible wiring board 120 as shown in FIG. One or two or more substrate pieces 110 made of the rigid wiring board are laminated, and the bridge part 120c is a central part of the flexible wiring board 120, and is a first and second laminated part. It is comprised by the part located between 130a and 130b.
[0004]
The structure of the substrate piece 110 and the flexible wiring board 120 of the composite wiring substrate 101 will be described. Referring to FIG. 14A, the substrate piece 110 is composed of a hard base substrate 111 made of crow, epoxy or the like. The interlayer wiring film 112 disposed on one surface of the base substrate 111, the base substrate 111 penetrates, the bottom surface is connected to the wiring film 112, and the tip projects to the surface opposite to the interlayer wiring film 112 of the base substrate 111. Connecting projection 114.
[0005]
An adhesive 113 is disposed on the surface of the base substrate 111 on the side where the tip of the connection protrusion 114 protrudes, with the tip of the connection protrusion 114 exposed.
[0006]
Next, referring to FIG. 14B, the flexible wiring board 120 includes a flexible film 123, main wiring films 121 and 122 disposed on the front and back surfaces of the flexible film 123, and a main wiring film, respectively. And cover films 125 and 126 arranged on 121 and 122, respectively.
[0007]
The flexible film 123, the main wiring films 121 and 122, and the cover films 125 and 126 have flexibility, and the flexible wiring board 120 can be bent freely.
[0008]
FIG. 15 is an exploded view of the first or second stacked portion 130a, 130b. A plurality of substrate pieces 110 on one side of the flexible wiring board 120.₁~ 110_ThreeAre disposed, and a plurality of substrate pieces 110 are also disposed on the opposite surface._Four~ 110₆Are arranged on each substrate piece 110.₁~ 110₆The connection protrusion 114 is directed to the flexible wiring board 110 side, and the board piece 110 is₁~ 110₆The connecting projection of the adjacent substrate piece 110₁~ 110₆The interlayer wiring film 121 or the main wiring films 121 and 122 of the flexible wiring board 120 are pressed against each other, and the whole is pressed and adhered by the adhesive 113 while being in close contact with each other.
[0009]
At this time, the flexible wiring board 120 is attached to the flexible wiring board 120.₁110_FourThe connection projection 114 is pressed.
[0010]
Reference numeral 114p is a connection protrusion that is arranged on both sides of the flexible wiring board 120 and presses the flexible wiring board 120 from both sides. Reference numeral 114q is arranged only on one side of the flexible wiring board 120, and the flexible wiring board 120 is attached to the flexible wiring board 120. The connection protrusion which presses only from the surface side or the back surface side is shown.
[0011]
Substrate piece 110₁~ 110₆When the flexible wiring board 120 is laminated, the portion pressed by the pair of connection protrusions 114p is not deformed, but the connection protrusion 114q arranged only on one side does not have the connection protrusion 114 on the opposite surface. As shown in FIG. 16, the flexible wiring board 120 is deformed to generate bending or wave-like distortion.
[0012]
This distortion causes misalignment between the connection protrusions 114 (114p, 114q) and the main wiring films 121, 12 and causes connection failure.
[Patent Document 1]
Japanese Patent Laid-Open No. 05-243738
[Patent Document 2]
JP 05-075270 A
[0013]
[Problems to be solved by the invention]
The present invention was created in order to solve the above-mentioned disadvantages of the prior art, and an object thereof is to provide a composite wiring board in which distortion does not occur.
[0014]
[Means for Solving the Problems]
  The invention according to claim 1 includes a flexible film and first and second main wiring films respectively disposed on a surface opposite to one surface of the flexible film, and has flexibility. A wiring board for connection, a first base board, a first interlayer wiring film disposed on one side of the first base board, and a bottom surface penetrating the first base board, the bottom surface being the first interlayer board A surface side that is connected to the wiring film and has a first connection protrusion whose tip is protruded from the surface on the opposite side of the first base substrate, on which the first main wiring film of the connection wiring substrate is located A first substrate piece disposed on the second base substrate, a second interlayer wiring film disposed on one surface of the second base substrate, and a bottom surface penetrating the second base substrate. Is connected to the second interlayer wiring film, and a second contact whose tip protrudes from the opposite surface of the second base substrate. And a second substrate piece disposed on a surface side where the second main wiring film of the connection wiring board is located, and the first and second connection protrusions are A composite wiring board in contact with each of the first and second main wiring films, wherein the first and second board pieces and the connection wiring board are laminated, wherein the first connection protrusion is The portion of the connection wiring board that is in contact with the second connection protrusion is in contact with the back side position.The third base substrate, the third interlayer wiring film disposed on one side of the third base substrate, the third base substrate penetrating, and the bottom surface being connected to the third interlayer wiring film. , A third substrate piece having a third connection protrusion whose tip is protruded from the opposite surface of the third base substrate, a fourth base substrate, and a single base surface of the fourth base substrate The fourth interlayer wiring film formed and the fourth base substrate are penetrated, the bottom surface is connected to the fourth interlayer wiring film, and the tip protrudes to the surface opposite to the fourth base substrate. A fourth substrate piece having a fourth connection protrusion, and at least one third substrate piece is laminated on the first substrate piece, and the fourth substrate piece is one piece. At least one sheet is laminated on the second substrate piece, and the first to fourth base substrates are made of a soft resin film. Said first to fourth wiring board piece is a flexible wiring board having flexibilityIt is a composite wiring board.
  According to a second aspect of the present invention, the first main wiring film with which the first connection protrusion is in contact with the first main wiring film is located in the flexible film, and the second main wiring film is located on the back side of the first main wiring film. A through hole is formed in a portion located between the second main wiring film with which the connection protrusion is abutted, and a conductive plug is formed by a connection material disposed in the through hole. The composite wiring board according to claim 1, wherein the first and second connection protrusions are disposed at positions where the conductive plug is pressed from both sides.
  Claim 3In the described invention, an electrical component is mounted on at least one of the third and fourth substrate pieces located in the outermost layer among the third and fourth substrate pieces.Either of Claim 1 or Claim 2It is a composite wiring board of description.
  The invention according to claim 4The connection wiring board is formed to be longer than the first and second substrate pieces, and is sandwiched between the first and second substrate pieces, and the first and second substrate pieces. And a bridge portion protruding from the substrate piece.Claim 3The composite wiring board according to any one of the above.
  Claim 5The described invention includes a flexible film, and first and second main wiring films disposed on a surface opposite to one surface of the flexible film, and has flexible connection wiring. A substrate, a first base substrate, a first interlayer wiring film disposed on one side of the first base substrate, the first base substrate penetrating, and a bottom surface serving as the first interlayer wiring film It has a first connection projection that is connected and has a tip protruding to the opposite surface of the first base substrate, and is disposed on the surface side where the first main wiring film of the connection wiring substrate is located. A first substrate piece, a second base substrate, a second interlayer wiring film disposed on one side of the second base substrate, the second base substrate penetrating, and a bottom surface of the first base substrate piece A second connection protrusion connected to the second interlayer wiring film and having a tip protruding on the opposite surface of the second base substrate; And the second substrate piece disposed on the surface side where the second main wiring film of the connection wiring substrate is located, and the first and second connection protrusions are the first, A composite wiring board in contact with each of the second main wiring films, in which the first and second board pieces and the connection wiring board are laminated, wherein the first connection protrusions are in contact with each other. Further, the connection wiring board portion has the second connection projection in contact with the back side position.The wiring board for connection is The first and second substrate pieces are formed to be longer than the first and second substrate pieces and protrude from the first and second substrate pieces. One of the first and second main wiring films that has a bridge portion and is in contact with the first and second connection protrusions facing each other, and one of the first and second main wiring films extends to the bridge portion, and the other Is a composite wiring board terminated in the laminated portion.
  Claim 6The invention described is the first main wiring film in contact with the first connection protrusion of the flexible film, and the second connection is located directly behind the first main wiring film. A through hole is formed in a portion located between the second main wiring film with which the protrusion is abutted, and a conductive plug is formed by a connecting material disposed in the through hole. The second connection protrusion is disposed at a position for pressing the conductive plug from both sides.Claim 5It is a composite wiring board of description.
  Claim 7The invention described is a third base substrate, a third interlayer wiring film disposed on one side of the third base substrate, and the third base substrate penetrating through the third base substrate. A third substrate piece having a third connection protrusion connected to the film and having a tip protruding from the opposite surface of the third base substrate; a fourth base substrate; and the fourth base substrate A fourth interlayer wiring film disposed on one side of the substrate and the fourth base substrate, the bottom surface is connected to the fourth interlayer wiring film, and the tip is the surface opposite to the fourth base substrate A fourth substrate piece having a fourth connection protrusion protruding from the first substrate piece, and one or more of the third substrate pieces are laminated on the first substrate piece, and the fourth substrate One or more pieces were laminated on the second substrate piece.Claim 5Or it is a composite wiring board of any one of Claim 6.
  Claim 8In the described invention, an electrical component is mounted on at least one of the third and fourth substrate pieces located in the outermost layer among the third and fourth substrate pieces.Claim 7It is a composite wiring board of description.
  Claim 9In the described invention, the first and second base substrates are hard plates, and the first and second substrate pieces are hard rigid wiring boards.Claims 5 to 8The composite wiring board according to any one of the above.
  Claim 10In the described invention, the first to fourth base substrates are made of a soft resin film, and the first to fourth substrate pieces are flexible wiring boards having flexibility.Claim 7OrClaim 8The composite wiring board according to any one of the above.
  Claim 11In the described invention, the first and second substrate pieces are respectively disposed at one end and the other end of the connection wiring substrate, and the stacked portions are respectively formed at both ends of the connection wiring substrate. Said 1st or 2nd main wiring film located in each lamination | stacking part was connected by said 1st or 2nd main wiring film extended in the said bridge partClaim 10It is a composite wiring board of description.
[0015]
The present invention is configured as described above, and the second main wiring film is disposed on the opposite side of the first main wiring film to the portion where the first connection protrusion is in contact. The first main wiring film with which the first connection protrusion is in contact and the second main wiring film with which the second connection protrusion is in contact sandwich the flexible film or the conductive plug. The first connection protrusion and the second connection protrusion are located on the same vertical line of the flexible wiring board.
[0016]
Therefore, when the first and second connection protrusions are pressed, the flexible film or the conductive plug is pressed from both sides and is not bent by being pressed from one side.
[0017]
At least one of the first and second main wiring films facing each other is a connection pad electrically connected to an external circuit or an electrical component, and the other is electrically connected to another circuit or another electrical component. It may be a connection pad connected to, or a dummy pad electrically isolated from other circuits and electrical components.
[0018]
DETAILED DESCRIPTION OF THE INVENTION
Examples of the present invention will be described.
Reference numeral 1 in FIG. 1 indicates a composite wiring board of a first example of the present invention.
[0019]
The composite wiring board 1 is configured by connecting first and second laminated portions 30a and 30b with a bridge portion 20c having flexibility or flexibility.
[0020]
FIG. 2 is an exploded view of the first and second laminated portions 30a of the composite wiring board 1. The composite wiring board 1 includes one or a plurality of connection wiring boards 20 and a connection wiring board 20. A first substrate piece 41 arranged on one side of the substrate, a second substrate piece 42 arranged on the opposite surface, and a third layer laminated on the first and second substrate pieces 41, 42. And fourth substrate pieces 43 and 44.
[0021]
The first to fourth substrate pieces 41 to 44 are arranged on one side of the first to fourth base substrates 61, 62, 63, 64 and the first to fourth base substrates 61 to 64, respectively. The first to fourth interlayer wiring films 51, 52, 53 and 54 and the first to fourth base substrates 61 to 64 are penetrated, and the bottom surface is connected to the first to fourth interlayer wiring films 51 to 54. The first to fourth connection protrusions 81, 82, 83, and 84 protrude from the surfaces of the base substrates 61 to 64 opposite to the first to fourth interlayer wiring films 51 to 54, respectively. is doing.
[0022]
The first to fourth substrate pieces 41 to 44 include both a case where it is a rigid rigid wiring substrate and a case where it is a soft and flexible flexible wiring substrate.
[0023]
In the case of a rigid wiring board, the first to fourth base boards 61 to 64 are made of crow, epoxy or the like, and in the case of a flexible wiring board, the first to fourth base boards 61 to 64 are used. Is made of a flexible resin film such as a polyimide film.
[0024]
In any case, each connection protrusion 81-84 is comprised with electroconductive materials, such as a metal and conductive resin. The first to fourth interlayer wiring films 51 to 54 are made of a copper film having a thickness of 10 μm to several tens of μm.
[0025]
Out of the surfaces of the first to fourth base substrates 61 to 64, the tips of the connection projections 81 to 84 are exposed on the surface on which the tips of the first to fourth connection projections 81 to 84 project. In the state, adhesives 71, 72, 73, and 74 are respectively disposed. The adhesives 71 to 74 are film-like, and the surfaces of the first to fourth base substrates 61 to 64 are covered thereby.
[0026]
Next, as shown in FIG. 3, the connection wiring substrate 20 includes a flexible film 23, and first and second main wiring films 21 and 22 disposed on the front and back surfaces of the flexible film 23, respectively. And cover films 25 and 26 disposed on the first and second main wiring films 21 and 22.
[0027]
The flexible film 23 has a conductive plug 24 that penetrates from the surface to the back side and connects the first and second main wiring films 21 and 22.
[0028]
The flexible film 23 and the cover films 25 and 26 are made of a resin such as a polyimide film, and the first and second main wiring films 21 and 22 are made of a copper film having a thickness of 10 μm to several tens of μm. Thus, the entire connection wiring board 20 is flexible and flexible, and is configured to be freely bent.
[0029]
The base substrates 61 to 64 may be a hard substrate made of glass, epoxy, or the like, or may be a soft resin film made of the same polyimide resin as the flexible film 23 or the like.
[0030]
When the base substrates 61 to 64 are flexible films, the first to fourth substrate pieces 61 to 64 have a property called flexibility or bendability like the connection wiring substrate 20. However, when it is a hard board, it cannot be bent freely like the wiring board 20 for connection.
[0031]
In addition, even when the base substrates 61 to 64 are flexible films, when a multilayer laminate is formed by laminating a plurality of first to fourth substrate pieces 61 to 64 as described later, The multilayer laminate loses flexibility and cannot be bent freely as it is with a hard substrate.
[0032]
Reference numerals 20a and 20b in FIG. 3 are portions where the first to fourth substrate pieces are stacked, and the first and second stacked portions 30a and 30b are formed.
[0033]
The length of the connection wiring board 20 is a length that exceeds the total length of the first stacked part 30a and the second stacked part 30b. An intermediate portion between the portions 20a and 20b that are a part of the portions 30a and 30b is a bridge portion 20c that connects the first and second stacked portions 30a and 30b.
[0034]
FIG. 5 shows a partial plan view near the boundary between the end portions 20a, 20b of the connection wiring board 20 and the bridge portion 20c.
[0035]
The first and second main wiring films 21 and 22 are patterned to form a wide portion and an elongated portion.
[0036]
Of the wide portion, as will be described later, the one connected to an external circuit or an electrical component is given a reference numeral 31 as a pad portion, and the one that is not electrically connected to other circuits or the like but is electrically isolated. Reference numeral 32 is assigned as a dummy part.
[0037]
The elongated portion is a wiring portion 33, which is disposed on the first and second stacked portions 30a and 30b and the bridge portion 20c. On the other hand, the pad portion 31 and the dummy portion 32 are not arranged in the bridge portion 20c, but are arranged inside the first and second laminated portions 30a and 30b, and are positioned in the first laminated portion 30a. The predetermined pad portion 31 and the pad portion 31 located in the second stacked portion 30 b are connected to each other by the wiring portion 33. The dummy part 32 is not connected to the connection part 33 extending to the bridge part 20c.
[0038]
At the position directly behind one pad portion 31, either the pad portion 31 located on the opposite surface or the dummy portion 32 is disposed.
The conductive plug 24 is disposed between the pad portions 31 or between the pad portion 31 and the dummy portion 32.
[0039]
On the other hand, openings 27 and 28 are provided in portions constituting the first and second laminated portions 30a and 30b of the cover films 25 and 26, respectively. The portions constituting the pad portion 31 and the dummy portion 32 of the first and second main wiring films 21 and 22 are exposed.
[0040]
A first connection protrusion 81 of the first substrate piece 41 that is in close contact with one surface of the connection wiring board 20, and a second connection protrusion 82 of the second substrate element piece 42 that is in close contact with the opposite surface. Is formed at a position in contact with either the pad portion 31 or the dummy portion 32.
[0041]
One or a plurality of third and fourth substrate pieces 43 and 44 are arranged on the first and second substrate pieces 41 and 42, respectively. The third and fourth connection protrusions 83 and 85 are directed toward the first and second substrate pieces 41 and 42, respectively.
[0042]
When the substrate pieces 41 to 44 and the connection wiring substrate 20 are heated and pressed in the stacking direction, the first and second connection projections 81 and 82 constitute the pad portion 31. The first and second main wiring films 21 and 22 constituting the second main wiring films 21 and 22 or the dummy portion 32 are pressed, and the third and fourth connection projections 83 and 84 are the first and second The second interlayer wiring films 51 and 52 are pressed respectively.
[0043]
A straight line passing through the first and second connection protrusions 81 and 82 passes through the conductive plug 24 and is perpendicular to the surface of the flexible film 23. Therefore, when the first and second board pieces 41 and 42 are pressed against the connection wiring board 20, the first and second connection protrusions 81 and 82 are the same part of the flexible film 23. (Here, the conductive plug 24) is pressed.
[0044]
That is, the portion of the flexible film 23 that is pressed by the first connection protrusion 81 (the polyimide or the conductive plug 24 constituting the flexible film 23) is pressed by the second connection protrusion 82. Conversely, the portion pressed by the second connection projection 82 (polyimide or conductive plug 24 constituting the flexible film 23) is pressed by the first connection projection 81. It has become.
[0045]
Therefore, in this embodiment, the flexible film 23 does not have a portion that is pressed only from one of the first or second connection projections 81 and 82, and the second and The second stacked portions 30a and 30b are not distorted.
[0046]
When heated in this state, the adhesives 71 to 73 are softened, and when cooled and cured, the first to fourth board pieces 41 to 44 and the connection wiring board 20 are bonded by the adhesives 71 to 73. The composite wiring board 1 is formed by being bonded to each other.
[0047]
In this state, between the first and second main wiring films 21 and 22 and the first to fourth interlayer wiring films 51 to 54, the conductive plug 24 and the first to fourth connection protrusions 81 to 84 are used. They are electrically connected to each other.
[0048]
However, when one of the first and second connection projections 81 and 82 is in contact with the pad portion 31 and the other is in contact with the dummy portion 32, the first or second interlayer wiring constituting the dummy portion 32 is used. The connection protrusions 83 and 84 of the third and fourth substrate pieces 43 and 44 are not in contact with the films 51 and 52.
[0049]
Finally, the electrical component 35 is electrically connected to the third and fourth interlayer wiring films 53 and 54 of the third and fourth substrate pieces 43 and 4 located in the outermost layer, and the first and second The electrical component 35 is mounted on the stacked portions 30a and 30b. The electrical component 35 includes electrical components such as a capacitor, a resistance element, and an inductance element in addition to a semiconductor element such as an integrated circuit.
[0050]
In this state, the electrical component 35 is electrically connected to at least one of the first or second main wiring films 21 and 22.
[0051]
The electrical connection path will be described below. For example, the conductive plug 24 shown in FIG. 4 has one surface in contact with the pad portion 31 and the opposite surface in contact with the dummy portion 32. The first and second connection protrusions 81 and the second connection protrusion 82 are in contact with each other, and the first and second connection protrusions 81 and 82 connected to the pad portion 31 are connected to each other. 51 and 52 are in contact with connection projections 83 and 84 of adjacent third and fourth substrate pieces 43 and 44, respectively.
[0052]
In a state where the plurality of third substrate pieces 43 are stacked, the third interlayer wiring films 53 are electrically connected to each other by the third connection protrusion 83.
[0053]
Similarly, in a state where the plurality of fourth substrate pieces 44 are laminated, the fourth interlayer wiring films 54 are electrically connected to each other by the fourth connection protrusions 84.
[0054]
Thus, one pad portion 31 is formed on the first and third interlayer wiring films 51 and 53 of the first substrate piece 41 and the third substrate piece 43 laminated on the first substrate piece 41. It is electrically connected, or is electrically connected to the fourth interlayer wiring film 54 of the fourth substrate piece 44 laminated on the second substrate piece 42 and the second substrate piece 42. The
[0055]
Accordingly, one pad portion 31 is provided with one or both of the third or fourth interlayer wiring films 53, 54 of the third or fourth substrate piece 43, 44 located in the outermost layer. , 54.
[0056]
The pad portion 31 is connected to the connection portion 33 as shown in FIG. 5 and the connection portion 33 passing through the bridge portion 20c of the connection wiring board 20 is connected to the pad portion 31 located in the first stacked portion 30a and the second stacked portion. The pad part 31 located in the part 30b is connected to each other.
[0057]
The electrical components 35 located on the first and second laminated portions 30 a and 30 b and mounted on the third or fourth substrate piece 43 or 44 of the outermost layer are connected via the pad portion 31 and the connecting portion 33. Are electrically connected to each other.
[0058]
Further, if other external circuits are electrically connected to the third and fourth interlayer wiring films 53 and 54 of the third or fourth substrate piece 43 or 44 of the outermost layer, the composite wiring board 1 is connected. The mounted electrical component 35 is electrically connected to an external circuit. The external circuit is the same even if it is connected to a wiring film other than the third and fourth interlayer wiring films 53 and 54 of the third or fourth substrate piece 43 or 44 of the outermost layer.
[0059]
A pad portion 31 or a dummy portion 32 is disposed at a position directly behind the pad portion 31 with which the first or second connection protrusions 81 and 82 are in contact, and an electrode plug 24 is disposed therebetween.
[0060]
As described above, the first or second connection projections 81 and 82 are in contact with the pad portion 31 at the true back position. On the other hand, the first connection projection 81 or the second connection projection 81 is also applied to the dummy portion 32. Any one of the connection protrusions 82 is in contact.
[0061]
Accordingly, the connection wiring board 20 has one surface of the same portion in contact with the first connection protrusion 81 and the opposite surface in contact with the second connection protrusion 82.
[0062]
When a force that presses the connection wiring board 20 is applied to the first and second connection protrusions 81 and 82, the first and second connection protrusions 81 and 82 press the electrode plug 42 from both sides. Even if the wiring board 20 for use has flexibility, it does not cause distortion or bending.
[0063]
When the electrode plug 24 is not disposed, the first and second connection protrusions 81 and 82 press the flexible film 23 from both sides via the first and second main wiring films 21 and 22. . Thus, when the electrode plug 24 is not disposed, the connection wiring substrate 20 does not bend even if the flexible film 23 is recessed, and thus is included in the present invention.
[0064]
Reference sign S in FIG. 1 and FIG.₁Shows a portion where the flexible film 23 exists without the electrode plug 24 being disposed between the dummy portion 32 and the connection portion 33 with which the first and second connection protrusions 81 and 82 abut. .
[0065]
The first or second connection protrusions 81 and 82 that are in contact with the dummy portion 32 are connected to the first or second interlayer wiring films 51 and 52. The interlayer wiring films 51 and 52 are The third connection piece 83 of the third substrate piece 43 and the fourth connection protrusion 84 of the fourth substrate piece 44 can be isolated without being connected. In this way, the wiring pattern inside the composite wiring board 1 is simplified.
[0066]
Since the connection wiring board 20 is not distorted and is not displaced when the composite wiring board 1 is formed as described above, the first and second connection protrusions 81 and 82 are formed on the pad portion 31. It contacts securely and does not cause poor connection.
[0067]
Next, reference numeral 2 in FIG. 6A shows a composite wiring board of a second example of the present invention, and the same members as those of the composite wiring board 1 of the first example are given the same description. Is omitted.
[0068]
This composite wiring board 2 includes the long and flexible connection wiring board 50 shown in FIG. 6B and the first to fourth board pieces 41 to 44 having the above-described configuration. As shown in FIG. 7, the first board piece 41 is arranged on one side of one end of the connection wiring board 50, and the second board piece 42 is arranged at the back side. Furthermore, a third substrate piece 43 and a fourth substrate piece 44 are laminated on the first and second substrate pieces 41 and 42, respectively, thereby forming a laminated portion 30d.
[0069]
Reference numeral 50d in FIG. 6B and FIG. 7 indicates an end portion of the connection wiring substrate 50 that is a part of the laminated portion 30d. Reference numeral 50c denotes a bridge portion that protrudes from the laminated portion 30d. At the end portion of the bridge portion 30d (on the opposite side to the laminated portion 30d), the cover film 25 is partially removed, and the contact portion 13 is formed. Has been.
[0070]
As shown in FIG. 8, a plurality of connection portions 33 are configured by the first main wiring film 21, and the contact portion 13 has a flexible surface located between the surface of each nodal group portion 33 and the connection portion 33. The surface of the conductive film 23 is exposed.
[0071]
Also in the composite wiring board 2 of the second example, as in the composite wiring board 1 of the first example, the position directly behind the portion of the connection wiring board 50 with which the first connection protrusion 81 abuts is The second connection protrusion 82 is brought into contact, and conversely, the first connection protrusion 81 is brought into contact with the position directly behind the second connection protrusion 82. ing.
[0072]
At the position where the first and second connection protrusions 81 abut, either the pad portion 31 or the dummy portion 32 constituted by the first or second main wiring films 21 and 22 is arranged. The first and second connection protrusions 81 are in contact with either the pad portion 31 or the dummy portion 32.
[0073]
The conductive plug 24 is disposed between the pad portion 31 and the dummy portion 32 with which the first and second connection protrusions 81 and 82 are in contact, or between the pad portion 31 and the pad portion 31. The first and second connection protrusions 81 and 82 press the conductive lab 24 from both sides.
[0074]
Therefore, also in this embodiment, the connection wiring board 50 does not have a portion that is pressed only from one of the first or second connection protrusions 81, 82, and the laminated portion 30 d of the connection wiring board 50. No distortion occurs.
[0075]
Next, reference numerals 2A and 2B in FIG. 8 respectively indicate the composite wiring boards of the second example described above, with the contact portions 13 of the respective composite wiring boards 2A and 2B facing each other, and the connection portions positioned on the contact portions 13 33 are electrically connected to each other to constitute the composite wiring board 3 of the third example of the present invention shown in FIG.
[0076]
In the composite wiring board 3 of this third example, an anisotropic conductive film 17 is disposed on at least one contact part 13 of the two composite wiring boards 2A and 2B, and the contact parts 13 are bonded to each other. The connecting portions 33 exposed to the portion 13 are electrically connected to each other, and the laminated portions 30d of the two composite wiring boards 2A and 2B are connected to each other by the bridge portion 50c of the two composite wiring boards 2A and 2B. ing. Therefore, the electrical component 35 mounted on the laminated portion 30d of one composite wiring board 2A and the electrical component 35 mounted on the laminated portion 30d of the other composite wiring substrate 2A are connected to each other by the two bridge portions 50c. Has been.
[0077]
In the composite wiring boards 1, 2, 2A, 2B of the present invention, the first and second board pieces 41, 42 are attached to the front and back surfaces of both ends or one end of the connecting wiring boards 20, 50, respectively. Then, after creating the three-layer laminated substrate, the first and second substrate pieces 41, 42 are laminated with one third or fourth substrate piece 43, 44, or previously laminated respectively. A plurality of placed third and fourth substrate pieces 43 and 44 can be attached to the three-layer laminated substrate.
[0078]
FIG. 10 shows a state in which the first and second substrate pieces 41 and 42 are opposed to both sides of the connection wiring board 20, respectively. FIG. 11 shows the pressing devices 48 and 49 in the first and second states. The first and second substrate pieces 41, 42 are bonded to the connection wiring substrate 20 by being brought into contact with the surface of the substrate pieces 41, 42 uniformly and pressing while heating, and the three-layer laminated substrate 45. The state in which is formed is shown.
[0079]
The portions of the pressing devices 48 and 49 that are in contact with the first and second substrate pieces 41 and 42 are hard and flat, and the first and second substrate pieces 41 and 42 are connected to the connection wiring. Even when pressed against the substrate 20, the three-layer laminated substrate 45 of the present invention is not distorted or bent.
[0080]
Further, even if the composite wiring boards 1, 2, 2A, 2B are formed by laminating one or a plurality of third and fourth laminated boards 43, 44 on the three-layer laminated board 45, distortion and bending are generated. Absent.
[0081]
In the prior art, even if the first and second substrate pieces 41 and 42 are hard rigid wiring boards or soft flexible wiring boards, if pressed as described above, the three-layer laminated board When the is formed, distortion and bending occur.
[0082]
In the prior art, in particular, when the first and second substrate pieces 41 and 42 are hard rigid wiring substrates, the three-layer laminated substrate is likely to be distorted or bent.
[0083]
Reference numeral 46 in FIG. 12 denotes a first multilayer laminated substrate in a state where one or more third substrate pieces 43 are laminated on one first substrate piece 41, and reference numeral 47 denotes one piece. The second multilayer laminated substrate in a state where one or more fourth substrate pieces 44 are laminated on the second substrate piece 42 is shown.
[0084]
When the first and second multilayer laminated substrates 46 and 47 are attached to the connection wiring substrate 20, the composite wiring substrate 1 of the present invention having no distortion or bending is obtained.
[0085]
Even if the first to fourth substrate pieces 41 to 44 are flexible wiring boards, the first and second multilayer laminates 46 and 47 obtained by laminating a plurality of them lose flexibility. In the prior art, when the connection wiring board 20 is pasted, the connection wiring board 20 is likely to be distorted or bent.
[0086]
【The invention's effect】
No distortion occurs in the composite wiring board of the present invention.
[Brief description of the drawings]
FIG. 1 is a composite wiring board according to a first example of the present invention.
FIG. 2 is a diagram for explaining how to assemble
FIG. 3 shows a flexible wiring board used for the composite wiring board of the first example.
FIG. 4 is a diagram for explaining connection with an electrical component.
FIG. 5 is a diagram for explaining a difference between a pad portion and a dummy portion;
6A is a composite wiring board of a second example of the present invention. FIG. 6B is a flexible wiring board used for the composite wiring board.
FIG. 7 is a view for explaining how to assemble the composite wiring board of the second example.
FIG. 8 is a diagram for explaining a contact portion;
9A is a diagram for explaining the connection between the composite wiring boards of the second example. FIG. 9B is a diagram for explaining the connection between the composite wiring boards of the second example.
FIG. 10 is a diagram for explaining a process of forming a three-layer laminated substrate (1).
FIG. 11 is a diagram (2) for explaining a step of forming a three-layer laminated substrate.
FIG. 12 is a diagram for explaining the first and second multilayer laminated substrates;
FIG. 13 shows a conventional composite wiring board.
14A and 14B are used for the composite wiring board; FIG. 14B is a flexible wiring board;
FIG. 15 is a view for explaining how to assemble the composite wiring board;
FIG. 16 is a diagram for explaining the distortion of the conventional composite wiring board;
[Explanation of symbols]
1-3 …… Composite wiring board
21 …… First main wiring film
22 …… Second main wiring film
23 …… Flexible film
24 …… Conductive plug
35 …… Electric parts
41 to 44... First to fourth substrate pieces
51-54 ...... First to fourth interlayer wiring films
61 to 64... First to fourth base substrates
81-84 …… First to fourth connection protrusions
30a, 30b, 30d ... Laminated part
20c, 50c …… Bridge

Claims

A flexible wiring board, and first and second main wiring films disposed on the opposite side of the flexible film, respectively, and a flexible connection wiring board;
A first base substrate, a first interlayer wiring film disposed on one side of the first base substrate, and the first base substrate, the bottom surface being connected to the first interlayer wiring film, A first connection protrusion having a first connection protrusion protruding from a surface opposite to the first base substrate, the first connection wiring substrate being disposed on a surface side where the first main wiring film is located; A substrate piece of
A second base substrate, a second interlayer wiring film disposed on one side of the second base substrate, and the second base substrate, the bottom surface being connected to the second interlayer wiring film, A second connecting protrusion having a tip projecting from a surface opposite to the second base substrate and disposed on a surface of the connecting wiring substrate on which the second main wiring film is located; And a substrate piece of
The first and second connection protrusions are in contact with the first and second main wiring films, respectively, and the first and second substrate pieces and the connection wiring substrate are laminated. A substrate,
The portion of the wiring board for connection with which the first connection protrusion is in contact is in contact with the second connection protrusion at the true back position .
A third base substrate, a third interlayer wiring film disposed on one side of the third base substrate, and the third base substrate, the bottom surface being connected to the third interlayer wiring film, A third substrate piece having a third connection protrusion, the tip of which protrudes from the opposite surface of the third base substrate;
A fourth base substrate, a fourth interlayer wiring film disposed on one side of the fourth base substrate, and the fourth base substrate, the bottom surface being connected to the fourth interlayer wiring film, And a fourth substrate piece having a fourth connection protrusion protruding from the opposite surface of the fourth base substrate.
One or more of the third substrate pieces are laminated on the first substrate piece,
One or more of the fourth substrate pieces are laminated on the second substrate piece,
The first to fourth base substrates are composed of a soft resin film, and the first to fourth substrate pieces are flexible wiring substrates having flexibility .

Of the flexible film, the first main wiring film with which the first connection protrusion is brought into contact and the back side of the first main wiring film with which the second connection protrusion is brought into contact A through hole is formed in a portion located between the second main wiring film, and a conductive plug is formed by a connection material disposed in the through hole,
The composite wiring board according to claim 1, wherein the first and second connection protrusions are disposed at positions where the conductive plug is pressed from both sides.

3. The electrical component is mounted on at least one of the third and fourth substrate pieces located in the outermost layer among the third and fourth substrate pieces. A composite wiring board according to item 1 .

The connection wiring board is formed to be longer than the first and second substrate pieces, and is sandwiched between the first and second substrate pieces, and the first and second substrate pieces. The composite wiring board according to any one of claims 1 to 3 , further comprising a bridge portion protruding from the board piece.

A flexible wiring board, and first and second main wiring films disposed on the opposite side of the flexible film, respectively, and a flexible connection wiring board;
A first base substrate, a first interlayer wiring film disposed on one side of the first base substrate, and the first base substrate, the bottom surface being connected to the first interlayer wiring film, A first connection protrusion having a first connection protrusion protruding from a surface opposite to the first base substrate, the first connection wiring substrate being disposed on a surface side where the first main wiring film is located; A substrate piece of
A second base substrate, a second interlayer wiring film disposed on one side of the second base substrate, and the second base substrate, the bottom surface being connected to the second interlayer wiring film, A second connecting protrusion having a tip projecting from a surface opposite to the second base substrate and disposed on a surface of the connecting wiring substrate on which the second main wiring film is located; And a substrate piece of
The first and second connection protrusions are in contact with the first and second main wiring films, respectively, and the first and second substrate pieces and the connection wiring substrate are laminated. A substrate,
The portion of the wiring board for connection with which the first connection protrusion is in contact is in contact with the second connection protrusion at the true back position .
The connection wiring board is formed to be longer than the first and second substrate pieces, and is sandwiched between the first and second substrate pieces, and the first and second substrate pieces. A bridge portion protruding from the substrate piece,
Of the first and second main wiring films that are in contact with the first and second connection protrusions facing each other, one is extended to the bridge portion, and the other is terminated in the stacked portion. Composite wiring board.

Of the flexible film, the first main wiring film that is in contact with the first connection protrusion and the back of the first main wiring film are positioned in contact with the second connection protrusion. In addition, a through hole is formed in a portion located between the second main wiring film, and a conductive plug is formed by a connection material disposed in the through hole,
The composite wiring board according to claim 5 , wherein the first and second connection protrusions are disposed at positions where the conductive plug is pressed from both sides.

A third base substrate, a third interlayer wiring film disposed on one side of the third base substrate, and the third base substrate, the bottom surface being connected to the third interlayer wiring film, A third substrate piece having a third connection protrusion, the tip of which protrudes from the opposite surface of the third base substrate;
A fourth base substrate, a fourth interlayer wiring film disposed on one side of the fourth base substrate, and the fourth base substrate, the bottom surface being connected to the fourth interlayer wiring film, And a fourth substrate piece having a fourth connection protrusion protruding from the opposite surface of the fourth base substrate.
One or more of the third substrate pieces are laminated on the first substrate piece,
The composite wiring board according to claim 5, wherein at least one fourth board piece is laminated on the second board piece.

The composite wiring board according to claim 7 , wherein an electrical component is mounted on at least one of the third and fourth board pieces located in the outermost layer among the third and fourth board pieces.

9. The composite wiring according to claim 5 , wherein the first and second base substrates are hard plates, and the first and second substrate pieces are hard rigid wiring boards. substrate.

The first to fourth base substrate is constituted by a resin film soft, claim 7 or claim 8 which is a flexible wiring board wherein the first to fourth wiring board piece is flexible 1 The composite wiring board as described in the item.

The first and second substrate pieces are respectively disposed at one end and the other end of the connection wiring substrate, and the stacked portions are formed at both ends of the connection wiring substrate,
The composite wiring board according to claim 10, wherein the first or second main wiring film located in each of the stacked portions is connected by the first or second main wiring film extending to the bridge portion.