JP4177874B2 - Light emitting device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To improve a heat dissipation characteristic and to improve emission luminance. <P>SOLUTION: A light emitting device includes: a light emitting device 5; a substrate 2 made of a metal, mounting the light emitting device 5 thereon; a first frame 3 made of an insulator surrounding the substrate 2, on which a wiring conductor 3a is formed; and a package composed of a second frame 4 made of a metal surrounding the light emitting device 5. The second frame 4 has an inner circumferential surface 4a spreading upward and reflecting light generated by the light emitting element 5. <P>COPYRIGHT: (C)2007,JPO&amp;INPIT

Description

  The present invention relates to a light emitting device using a light emitting element.

  Conventionally, light-emitting devices using light-emitting elements such as light-emitting diodes (LEDs) and semiconductor lasers (LDs) have been attracting attention because they are expected to further reduce power consumption and extend their lifetime in the future. It has begun to be used in various fields such as various indicators, optical sensors, displays, photocouplers, backlights, and optical printer heads. A cross-sectional view of a light emitting element storage package (hereinafter also referred to as a package) for mounting a conventional light emitting element is shown in FIG.

  As shown in FIG. 2, the conventional package 11 has a base 12 generally made of a material such as various resins or ceramics. On the substrate 12, a metallized layer is formed by firing a conductive paste containing tungsten, molybdenum-manganese, or the like, and a wiring conductor 13 is formed on which a Ni plating layer or an Au plating layer is applied by plating. . Power is supplied from the outside to the light emitting element 15 in the package 11 via the wiring conductor 13.

  The base body 12 is provided with a substantially square frame body 14 made of various resins and ceramics having a through hole in the central portion on one main surface on the inner side of the package 11, and the frame body 14 is a base body. 12 is fixed by a brazing material such as silver (Ag) -copper (Cu) having a melting point of 700 to 900 ° C., a resin adhesive, or a low melting point glass melted at 500 ° C. or less.

  The light emitting element 15 is die-bonded to the base 12 with an Ag paste 16. The electrodes of the light emitting element 15 are wire bonded by a wiring conductor 13 formed on the base 12 and a bonding wire 17 made of Au.

  Further, in order to protect the light emitting element 15, a transparent resin 18 is provided inside the frame 14 so as to cover the light emitting element 15. The transparent resin 18 is formed by heat-curing a thermosetting epoxy resin or the like. The transparent resin 18 also has a function of firmly attaching the light emitting element 15 to the package 11. As a result, a light-emitting device that houses the light-emitting element 15 is obtained.

  This light-emitting device emits visible light by causing the light-emitting element 15 to emit light by a drive current supplied from an external electric circuit. Applications include various indicators, optical sensors, displays, photocouplers, backlights, and optical printer heads.

  In recent years, this light-emitting device has been used for illumination, and a device having higher characteristics in terms of high luminance and heat dissipation is required. In addition, when used for illumination, the lifetime is an important issue, and thus a long-life light emitting device is required.

Therefore, recently, in order to improve the light emission luminance of the light emitting device, the frame body 14 and the base body 12 are often made of a material having a higher reflectance. For example, by using a highly reflective metal such as Ag or Al as the material of the frame body 14 that reflects the light of the light emitting element 15, or by depositing these metals on the inner peripheral surface of the frame body 14, It has been proposed to provide a light emitting device with brightness.
JP 2002-344029 A

  However, the conventional package 11 has a problem in that the heat generated from the light emitting element 15 causes distortion in the package 11, and as a result, the emission angle of light emitted from the light emitting element 15 is not stabilized. This occurs due to the difference in thermal expansion coefficient between the base 12 and the frame 14 because the base 12 is made of resin or ceramics while the frame 14 is made of metal.

  In addition, the conventional package 11 can sufficiently cope with high brightness, but if the input power of the light emitting element 15 is increased to increase the luminance, the light intensity stabilized by the heat emitted from the light emitting element 15 and the light radiation angle are increased. A new problem has arisen that the light intensity distribution cannot be obtained. When heat dissipation deteriorates, the temperature of the light-emitting element 15 rises, and the strength of the light-emitting element 15 itself decreases due to repeated thermal history of temperature rise and temperature drop. Further, the light emitting element 15 and the package 11 are distorted, and the light emission angle and the light intensity distribution measured at a certain distance from the package 11 deviate from desired values and patterns. The light intensity distribution is represented by a single light beam (light beam) or an aggregate thereof, and the pattern of the light beam becomes unstable due to distortion of the package 11 and becomes unstable. As described above, when the light-emitting device is used for local illumination or the like, the light emission angle and the light intensity distribution are important problems.

  Therefore, the present invention has been completed in view of such conventional problems, and the object thereof is to satisfactorily reflect the light emitted from the light emitting element on the inner peripheral surface of the frame body and to radiate it uniformly and efficiently to the outside. A further object is to provide a light-emitting element storage package and a light-emitting device capable of producing a light-emitting device capable of obtaining stable optical characteristics in which light intensity, light emission angle, and light intensity distribution do not change due to temperature change.

  The light emitting device of the present invention includes a light emitting element and a package. The package has a base part, a first frame part, and a second frame part. The base is mounted with a light emitting element and is made of metal. The base portion has an upper surface wider than the lower surface of the light emitting element and a lower surface wider than the upper surface. The first frame body portion is formed with a wiring conductor and surrounds the base body portion. The first frame body portion is made of an insulator. The first frame body portion has a larger outer dimension than the lower surface of the base body portion. The second frame body portion surrounds the light emitting element and is made of metal. The second frame body portion extends upward, and has an inner peripheral surface that reflects light generated by the light emitting element. The wiring conductor is formed inside the first frame body portion.

  The present invention includes a light emitting element, a base portion made of a metal on which the light emitting element is mounted, a first frame portion made of an insulator on which a wiring conductor is formed and surrounding the base portion, and a metal surrounding the light emitting element. And a package including a second frame body portion. The second frame body portion has an inner peripheral surface that spreads upward and reflects the light generated by the light emitting element. With such a configuration, the present invention can improve heat dissipation and improve light emission luminance.

  The light emitting element storage package of the present invention will be described in detail below. FIG. 1 is a cross-sectional view showing an example of an embodiment of the package of the present invention. In FIG. 1, 2 is a base, 3 is a first frame, and 4 is a second frame. A package 1 for housing is mainly configured.

  The package of the present invention has a base 2 made of metal having a mounting portion 2a on which the light emitting element 5 is mounted at the center of the upper main surface, and an outer peripheral portion of the upper main surface of the base 2 so as to surround the mounting portion 2a. A first frame body 3 formed of a frame-like insulator having a larger outer dimension than the base body 2 and having a wiring conductor 3a led out from the vicinity of the mounting portion 2a to the outside; And a second frame body 4 made of a metal attached to the upper surface so as to surround the mounting portion 2a and having an inner circumferential surface that is inclined upward.

  The substrate 2 of the present invention functions as a support member for supporting and mounting the light emitting element 5 and a heat dissipation member for dissipating the heat of the light emitting element 5. A mounting portion 2 a for mounting the light emitting element 5 is provided at the center of the upper surface of the base 2. The light emitting element 5 is attached to the mounting portion 2a via a low melting point brazing material such as a resin adhesive or tin (Sn) -lead (Pb) solder. And the heat | fever of the light emitting element 5 maintains favorable the operativity of the light emitting element 5 by being transmitted to the base | substrate 2 via a resin adhesive and a low melting-point brazing material, and being efficiently dissipated outside. Further, the light emitted from the light emitting element 5 is reflected on the inner peripheral surface of the second frame body 4, a lens installed on the optical axis of the light emitting element 5 inside or above the second frame body 4, and the like. And is converted into diffused light, parallel light, or the like and emitted to the outside.

  The substrate 2 is made of a metal such as an iron (Fe) -nickel (Ni) -cobalt (Co) alloy or a copper (Cu) -tungsten (W) alloy, and the ingot is conventionally known such as rolling or punching. It is formed and formed into a predetermined shape by performing metal processing. In particular, in order to enhance the heat dissipation effect, the substrate 2 is preferably made of a Cu—W alloy having excellent thermal conductivity. Further, a metal having excellent corrosion resistance and wettability with the brazing material, specifically, a Ni layer having a thickness of 0.5 to 9 μm and a gold (Au) layer having a thickness of 0.5 to 9 μm are sequentially coated on the surface by a plating method. The base 2 is effectively prevented from being oxidized and corroded, and the light emitting element 5 can be firmly bonded to the mounting portion 2a on the upper surface of the base 2.

  The base body 2 has a first frame 3 made of an insulator joined to an outer peripheral portion of an upper surface thereof so as to surround the mounting portion 2 a, and is for accommodating the light emitting element 5 inside the first frame 3. A void is formed. The first frame 3 has an outer dimension larger than that of the base 2 and a wiring conductor 3a that is led out from the vicinity of the mounting portion 2a to the outside. The first frame 3 is made of an insulator such as an aluminum oxide sintered body (alumina ceramic), an aluminum nitride sintered body, a glass ceramic, or a resin.

  Further, the wiring conductor 3a formed on the first frame 3 is formed of a metallized layer such as tungsten (W), molybdenum (Mo), manganese (Mn), copper (Cu), etc. A metal paste obtained by adding and mixing an organic solvent and a solvent is printed and applied in a predetermined pattern and baked to form the first frame 3. On the surface of the wiring conductor 3a, a metal such as a Ni layer having a thickness of 0.5 to 9 μm or a Au layer having a thickness of 0.5 to 5 μm is used to prevent the oxidation and to firmly connect the bonding wire 7 and the external lead terminal 8. The layer is preferably deposited by plating.

  In the present invention, as shown in FIG. 1, the external lead terminal 8 is inserted into the space formed in the outer peripheral portion of the lower surface of the first frame 3 and is electrically connected to the wiring conductor 3 a of the first frame 3. Therefore, the external lead terminal 8 is not bulky and has a low profile.

  The second frame 4 of the present invention is made of Al (aluminum), Ag, Fe—Ni—Co alloy, Fe—Ni alloy, or the like, and particularly made of Al having a high reflectance in order to enhance the light reflection effect. Is preferred. The second frame 4 has a shape in which the inner peripheral surface is an inclined surface that expands upward. The ingot made of the material is subjected to conventionally known metal processing such as cutting, rolling, and punching. As a result, the predetermined shape is formed.

  Further, the inner peripheral surface of the through hole 4 a of the second frame 4 is formed so as to expand upward at an angle of 35 to 60 degrees with respect to the upper surface of the base 2. In this way, the light of the light emitting element 5 accommodated in the through hole 4a is favorably reflected by the inner peripheral surface of the inclined through hole 4a, and the light is radiated to the outside within a range of an emission angle of 20 degrees or less. The light emission efficiency of the light emitting device using the package 1 of the present invention can be made extremely high.

  The light emission angle is as seen in a longitudinal section as shown in FIG. 1, and if the cross-sectional shape in a cross section perpendicular to the optical axis of the light beam is circular, the radiation angle is constant, and the light beam If the cross section of the cross section perpendicular to the optical axis has a deviation such as an elliptical shape, the radiation angle is the maximum value.

  When the angle formed by the inner peripheral surface of the through hole 4a of the second frame 4 with the upper surface of the base body 2 is less than 35 degrees, the radiation angle spreads to 20 degrees or more, the amount of dispersed light increases, and the luminance of light increases. descend. On the other hand, when the angle exceeds 60 degrees, light that is diffusely reflected in the package 1 without being well emitted to the outside of the package 1 increases. Therefore, the angle formed by the inner peripheral surface of the through hole 4a of the second frame 4 and the upper surface of the base 2 is preferably 35 to 60 degrees.

If the arithmetic average roughness Ra of the inner peripheral surface of the through hole 4a of the frame 4 exceeds 4 μm, it becomes difficult to uniformly reflect the light emitted from the light emitting element 5 accommodated in the through hole 4a. The intensity of the reflected light is likely to be biased. On the other hand, if it is less than 0.004 μm, it tends to be difficult to form such a surface stably and efficiently. Therefore, the arithmetic average roughness Ra of the inner peripheral surface of the through hole 4a is preferably 0.004 to 4 μm.

  In addition, in order to make Ra of the internal peripheral surface of the through-hole 4a into said range, it can process by a conventionally well-known chemical etching method or a cutting method. Alternatively, a transfer processing method using the surface accuracy of the mold may be used.

  In the present invention, the base body 2, the first frame body 3 and the second frame body 4 are joined with a resin adhesive such as silicone or epoxy, or a metal brazing material such as Ag-Cu brazing or Pb- This is performed by solder such as Sn, Au-Sn, Au-Si. The bonding material for bonding the base body 2, the first frame body 3 and the second frame body 4 may be appropriately selected in consideration of the material, thermal expansion coefficient, etc. of the base body 2, the first frame body 3 and the second frame body 4. Although not particularly limited, a metal brazing material or solder is preferable when high reliability of bonding is required.

  In the light emitting element storage package of the present invention, the base 2, the first frame 3, and the second frame 4 have similar or the same thermal expansion coefficients of the base 2 and the first frame 3. It is preferable that the thermal expansion coefficients of the base body 2, the first frame body 3, and the second frame body 4 are similar or the same. Thereby, the distortion of the package 1 due to the temperature change can be eliminated or suppressed.

  For example, the heat of the base 2 made of Fe—Ni—Co alloy (thermal expansion coefficient 6 × 10 −6 / ° C.) or the like and the second frame 4 made of Al (thermal expansion coefficient 23 × 10 −6 / ° C.) or the like. Even if the expansion coefficients are different, the distortion caused thereby can be reduced. That is, even if distortion occurs due to the influence of the second frame 4, the distortion can be absorbed by the first frame 3 and the base body 2 made of alumina ceramic (thermal expansion coefficient 5.7 × 10−6 / ° C.) or the like. The distortion of the entire package 1 can be reduced.

  And, in order to stabilize the light emitted from the light emitting element 5 so as not to change by suppressing the spread of light, it is preferable to suppress the change of the light emission angle due to the temperature change or the like to 10 degrees or less. If the difference in thermal expansion coefficient between the substrate 2 and the first frame 3 is 5 × 10 −6 / ° C. or less, the change in the light emission angle can be suppressed to 10 degrees or less. Therefore, the difference in thermal expansion coefficient between the base 2 and the first frame 3 is preferably 5 × 10 −6 / ° C. or less.

  Moreover, it is preferable that the outer peripheral end of the base body 2 overlaps with the inner peripheral end of the lower surface of the second frame body 4 in the vertical direction. Thereby, in the 1st frame 3, the site | part with a small intensity | strength which does not overlap between the outer peripheral end of the base | substrate 2 and the inner peripheral end of the lower surface of the 2nd frame 4 does not generate | occur | produce, It is possible to suppress cracking or breakage due to a difference in thermal expansion coefficient between the base 2 and the second frame 4.

  In the present invention, a step 4b is formed between the upper surface and the inner peripheral surface of the second frame body 4, and an end of a translucent member such as a lens is locked and attached to the step 4b. In this case, the optically coupled state between the light emitting element 5 and the translucent member can be stably maintained, and a light emitting device with stabilized optical characteristics can be obtained.

The thermal conductivity of the substrate 2 is preferably 100 W / m · K or more. Thereby, the heat dissipation of the light emitting element 5 can be improved and the drive current value which can be input into the light emitting element 5 can be increased. If it is less than 100 W / m · K, for example, if the drive current value is 20 mA, the chip junction temperature, which is the heat of the light-emitting element 5, will be 65 ° C. or more, the thermal load applied to the light-emitting element 5 will increase, and 10,000 hours will be spent. It becomes difficult to ensure a longer life. At 100 W / m · K or higher, the junction temperature of the light-emitting element 5 is 50 ° C. or lower even when the drive current value is 20 mA, and a lifetime exceeding 10,000 hours can be secured, and a larger drive current must be input. The light output of the light emitting element 5 can be improved.

  Note that the chip junction temperature is the temperature of the chip (light-emitting element 5) when a predetermined drive current (20 mA or the like) is input, and is preferably as low as possible. That is, if the heat dissipation property is not increased, heat is accumulated in the light emitting element 5 and the chip junction temperature does not decrease. Therefore, if the heat dissipation property is increased and the chip junction temperature is decreased, a current can flow. In general, it is said that when the temperature is 65 ° C. or higher, the limit of the light-emitting element 5 is exceeded, and no further drive current can be input.

  Thus, according to the package of the present invention, the light emitting element 5 is mounted on the mounting portion 2a of the base 2 and the electrode of the light emitting element 5 and the wiring conductor 3a are electrically connected via the bonding wire 7, and then The light emitting element 5 is covered with a transparent resin, or the transparent resin is filled in the through hole 4a in which the light emitting element 5 is accommodated to seal the light emitting element 5, and the step 4b on the upper surface of the second frame 4 is transparent. A light-emitting device is obtained by installing a sex member.

  It should be noted that the present invention is not limited to the above-described embodiment, and various modifications are possible without departing from the scope of the present invention.

  The light emitting element storage package of the present invention is composed of a frame-like insulator whose outer dimension is larger than that of the base and is attached to the outer peripheral portion of the upper main surface of the base so as to surround the base. Since it has the 1st frame in which the wiring conductor derived | led-out over the outer side was formed, an external lead terminal etc. is inserted in the space formed in the outer peripheral part of the lower surface of the 1st frame, and 1st frame Since it can be electrically connected to the wiring conductor, the height is reduced.

  In addition, since the first frame has a second frame made of metal attached to surround the mounting portion so as to surround the mounting portion, the inner peripheral surface is an inclined surface spreading upward. The light emitted from the light emitting element can be reflected to the outside by 80% or more on the inner peripheral surface of the two-frame body, and a light emitting device with high light emission efficiency can be manufactured.

  Further, since the substrate on which the light emitting element is mounted is made of metal, heat dissipation is improved, the driving current input to the light emitting element can be increased, and the light output of the light emitting element can be increased.

  In addition, since the base body made of metal, the first frame body made of an insulator, and the second frame body made of a metal are provided, it is easy to adjust the thermal expansion coefficient, and the difference between these thermal expansion coefficients. Distortion of the entire light emitting element storage package can be reduced.

As a result, it is possible to manufacture a light-emitting device capable of obtaining stable optical characteristics in which the light intensity, the light emission angle, and the light intensity distribution are not changed by a temperature change.

  The light emitting device of the present invention includes a light emitting element storage package of the present invention, a light emitting element mounted on the mounting portion and electrically connected to the wiring conductor, and a light emitting element inside or above the second frame. By providing the translucent member installed on the optical axis, it is excellent in luminous efficiency and heat dissipation, and stable optical characteristics can be obtained.

It is sectional drawing which shows an example of embodiment about the light emitting element accommodation package of this invention. It is sectional drawing of the conventional package for light emitting element accommodation.

Explanation of symbols

1: Light-emitting element storage package 2: Base 2a: Mounting portion 3: First frame 3a: Wiring conductor 4: Second frame 5: Light-emitting element

Claims (2)

A light emitting element;
A base portion made of a metal on which the light emitting element is mounted, a first frame portion made of an insulator on which a wiring conductor is formed and surrounding the base portion, and a second frame made of metal surrounding the light emitting element. A package consisting of a body part,
The second frame body portion has an inner peripheral surface that spreads upward and reflects light generated by the light emitting element,
The base portion has an upper surface wider than the lower surface of the light emitting element and a lower surface wider than the upper surface ,
The first frame body portion has a larger outer dimension than the lower surface of the base portion,
The light emitting device , wherein the wiring conductor is formed inside the first frame body . 2. The light emitting device according to claim 1, wherein the light emitting element is electrically connected to the wiring conductor partially exposed on an upper surface of the first frame body part through a bonding wire. .

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