JP3833912B2 - Bonding method for electronic components - Google Patents

Description

【００４６】
（表１）のデータは位置ずれ検査部ＦのＲＡＭ９３に格納される。図１７を参照しながら説明したように、位置ずれ量Ｔｘ，Ｔｙには一定の傾向があり、この平均値ＴＸ，ＴＹは位置ずれ補正のためのオフセットデータとなる。位置ずれの平均値ＴＸ，ＴＹはラインコントローラ１へ送られた後、ラインコントローラ１からオフセットデータとしてアウターリードボンディング部ＣのＲＡＭ４３へ送られる。（表２）にこのオフセットデータを示す。
【００４７】
【表２】

【００４８】
アウターリードボンディング部Ｃは、次のＬＣＤ１へ電子部品を仮圧着する時は、ＸＹθテーブルコントローラ４５にこのオフセットデータをフィードバックし、これ以後は、オフセットデータＴＸ，ＴＹを補正値として補正しながら、アウターリード２８の電極９に対する位置合わせを行ったうえで、仮圧着ツール３１による仮付けを行う。この補正は、（表２）に示すオフセットデータＴＸ，ＴＹにしたがって、ボンディング位置＃１〜＃８毎にそれぞれ行っていくことが望ましい。
【００４９】
次に図１４および図１５を参照しながら、オフセットデータフィードバックモードを説明する。図１４（ａ）（ｂ）（ｃ）は本発明の一実施の形態のＬＣＤとアウターリードのマークの画像図、図１５は本発明の一実施の形態の電子部品のボンディング装置の位置ずれ補正方法の説明図である。図１４（ａ）は、図１１（ａ）と同様の画像であって、図３に示すアウターリード２８の仮付けを行う前の第１のカメラ３３と第２のカメラ３４の画像を示している。まず、上記した式（１）〜（６）からＸ方向の位置ずれＳｘとＹ方向の位置ずれＳｙを求める。次にＲＡＭ４３に格納されたオフセットデータＴＸ，ＴＹを補正値としてこのＳｘ，Ｓｙに加え、最終補正値Ｕｘ，Ｕｙを求める（以上、図１５も参照）。
【００５０】
次にＸＹθテーブル１１を駆動してＬＣＤ１をＸ方向に−Ｕｘ、Ｙ方向に−Ｕｙ移動させることにより位置補正を行う。すなわち、オフセットデータフィードバックモードでは、仮付け及び本圧着時に生じる位置ずれの平均値ＴＸ，ＴＹを予め見込んでＬＣＤ１と各電子部品６ａ，６ｂとをずらして位置合わせを行う。図１４（ｂ）はこの位置補正されたＬＣＤ１と電子部品６ａ（６ｂ）のマーク３４，３５，３６，３７の画像である。このようにして位置補正をしたならば、上述したように仮圧着ツール３１によりアウターリード２８をＡＣＦ２７に仮付けする。続いてＬＣＤ１を搬送部２で第１本圧着部Ｄ、第２本圧着部Ｅへ搬送し、第１本圧着ツール６３と第２本圧着ツール７３により本圧着する。図１４（ｃ）は本圧着後の画像である。この本圧着後の位置ずれ量Ｔｘ，Ｔｙは式（１１）（１２）のとおりであり、仮付けや本圧着を行う過程でＬＣＤ１と電子部品６ａ，６ｂとの相対的な位置がずれることにより位置ずれ量Ｔｘ，Ｔｙは小さくなる。その後、搬送部２によってこのＬＣＤ１を位置ずれ検査部Ｆへ搬送してＬＣＤ１と電子部品６ａ（６ｂ）の位置ずれを検査する。位置ずれＴｘ，Ｔｙが許容値±Ｄ以下の場合、そのＬＣＤ１は良品として図１に示す良品回収部Ｈに回収され、許容値±Ｄ以上の場合、不良品として選別されて不良品回収部Ｇに回収される。
【００５１】
図１６は上述した本発明の一実施の形態の電子部品のボンディング装置のアウターリードボンディング部Ｃのオフセットデータフィードバックモードのフローチャートである。
【００５２】
本発明は上記実施の形態に限らず、様々な設計変更や運転方法が考えられるものであり、例えば（表１）ではオフセットデータＴＸ，ＴＹを入手するためのＬＣＤ１の枚数は５０枚であるが、この枚数は何枚でもよい。さらに本実施の形態では、ボンディング装置に位置ずれ検査部Ｆを備えたが、位置ずれ検査部Ｆを別にして単体で設けて使用してもよい。又、アウターリードボンディング部Ｃと位置ずれ検査部Ｆとを通信ケーブルＪで接続し、各種データを通信により転送しているが、磁気ディスク等の記憶媒体を用いて、データのやりとりを行ってもよい。また位置ずれを検出するマークとしては、要は観察のターゲットになり得るものであればよく、上記マーク３４，３５，３６，３７に限定されない。このように本発明は様々な設計変更が可能である。
【００５３】
【発明の効果】
以上説明したように本発明によれば、アウターリードの電極に対する位置ずれを許容範囲内に抑えることができ、ＬＣＤへの電子部品のボンディングを歩留りよく行うことができる。
【図面の簡単な説明】
【図１】本発明の一実施の形態の電子部品のボンディング装置の全体構成を示す平面図
【図２】本発明の一実施の形態の電子部品のボンディング装置のアウターリードボンディング部の平面図
【図３】本発明の一実施の形態の電子部品のボンディング装置のアウターリードボンディング部の部分斜視図
【図４】本発明の一実施の形態のＬＣＤの下板の底面図
【図５】本発明の一実施の形態の電子部品のボンディング装置のアウターリードボンディング部の制御系のブロック図
【図６】本発明の一実施の形態の電子部品のボンディング装置の第１本圧着部と第２本圧着部の平面図
【図７】本発明の一実施の形態の電子部品のボンディング装置の第１本圧着部に備えられた本圧着ツール付近の斜視図
【図８】本発明の一実施の形態の電子部品のボンディング装置の位置ずれ検査部の平面図
【図９】本発明の一実施の形態の電子部品のボンディング装置の位置ずれ検査部の要部斜視図
【図１０】本発明の一実施の形態の電子部品のボンディング装置の位置ずれ検査部の制御系のブロック図
【図１１】（ａ）本発明の一実施の形態のＬＣＤとアウターリードのマークの画像図
（ｂ）本発明の一実施の形態のＬＣＤとアウターリードのマークの画像図
（ｃ）本発明の一実施の形態のＬＣＤとアウターリードのマークの画像図
【図１２】
本発明の一実施の形態の第１の電子部品と第２の電子部品が本圧着されたＬＣＤの平面図
【図１３】本発明の一実施の形態の電子部品のボンディング装置のアウターリードボンディング部のオフセットデータ入手モード時の仮付け工程を示すフローチャート
【図１４】（ａ）本発明の一実施の形態のＬＣＤとアウターリードのマークの画像図（ｂ）本発明の一実施の形態のＬＣＤとアウターリードのマークの画像図
（ｃ）本発明の一実施の形態のＬＣＤとアウターリードのマークの画像図
【図１５】本発明の一実施の形態の電子部品のボンディング装置の位置ずれ補正方法の説明図
【図１６】本発明の一実施の形態の電子部品のボンディング装置のアウターリードボンディング部のオフセットデータフィードバックモードのフローチャート
【図１７】従来の電子部品のボンディング方法におけるアウターリードと電極の相対的な位置ずれの分布図
【符号の説明】
Ｃ アウターリードボンディング部
Ｄ 第１本圧着部
Ｅ 第２本圧着部
Ｆ 位置ずれ検査部
１ 表示パネル（ＬＣＤ）
６ａ 第１の電子部品
６ｂ 第２の電子部品
７ａ 第１のフィルムキャリヤ
７ｂ 第２のフィルムキャリヤ
９ 電極
１１，５１Ａ，５１Ｂ，８１ ＸＹθテーブル
２２ 吸着ヘッド
２７ 異方性導電シート（ＡＣＦ）
２８ アウターリード
３０ 仮圧着ヘッド
３１ 仮圧着ツール
３２ 第１のカメラ
３３ 第２のカメラ
３４，３５，３６，３７ マーク
４１，９１ ＣＰＵ
４３，９３ ＲＡＭ
４４，９４ 認識部
４５ ＸＹθテーブルコントローラ
６３ 第１本圧着ツール
７３ 第２本圧着ツール
８７ 第３のカメラ
８８ 第４のカメラ[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic component bonding method for bonding an outer lead of an electronic component made of a film carrier to an electrode of a display panel.
[0002]
[Prior art]
A display panel of an electronic device such as a liquid crystal panel is assembled by bonding an outer lead of an electronic component as a driver to an electrode formed along an end of the display panel. As an electronic component for the driver, an electronic component made by mounting a chip on a film carrier by a TAB (Tape Automated Bonding) method is often used. In addition, since the outer leads of the electronic parts and the electrodes of the display panel have a narrow pitch and high alignment accuracy is required, an anisotropic conductive sheet (hereinafter referred to as “ACF”) is interposed between the outer leads and the electrodes. The bonding method is often used.
[0003]
The ACF is made of an adhesive synthetic resin sheet. The ACF is attached to the upper surface of the electrode or the lower surface of the outer lead in advance, and the outer lead is bonded to the electrode with a crimping tool before the camera. For example, the outer lead and the electrode are observed in advance by a measuring device such as a relative position detector to detect a relative displacement between the outer lead and the electrode. For example, the display panel is moved in the X direction by an alignment means such as an XYθ table on which the display panel is placed. After correcting the positional deviation by moving in the Y direction and θ direction (horizontal rotation direction), the outer lead is crimped to the electrode by a crimping tool and bonded.
[0004]
FIG. 17 is a distribution diagram of relative positional deviation between the outer lead and the electrode in the conventional electronic component bonding method. The horizontal axis is the amount of positional deviation in the X direction, and the vertical axis is the frequency. In the figure, a indicates the distribution of the positional deviation between the outer lead and the electrode after correcting the positional deviation in the X direction by the alignment means described above, and this distribution a is centered on 0 as shown in the figure. It is a normal distribution. Further, b is a distribution of the positional deviation between the outer lead and the electrode after the above-described crimping, and this distribution b is also a normal distribution, and the distribution b is deviated by TX from the distribution a. That is, when the outer lead is pressure-bonded to the electrode via the ACF, a positional deviation TX occurs. As a cause of the occurrence of the positional deviation TX, various factors such as a mismatch in parallelism between the lower surface of the crimping tool and the electrode surface of the display panel, a crimping load, a temperature, and physical characteristics of the ACF can be considered. If the positional deviation amount TX after crimping is within the allowable value ± DX, it is OK, but if the positional deviation amount TX is within the allowable value ± DX, it is NG. In the figure, the hatched portion is NG because the positional deviation amount TX in the X direction is not less than the allowable value ± DX. In FIG. 17, the positional deviation in the X direction has been described as an example, but the positional deviation in the Y direction is the same.
[0005]
[Problems to be solved by the invention]
As described above, in the conventional electronic component bonding method, when the outer lead is pressure-bonded to the electrode, a relative positional deviation TX is likely to occur between the outer lead and the electrode, and this positional deviation TX is an allowable value ± DX. The adjustment of the machine and the like were repeated every time the electronic component was bonded to the display panel. For this reason, there is a problem that much time and labor are required, productivity is not improved, and the cost of the display panel is increased.
[0006]
In FIG. 17, the distribution a before crimping and the distribution b after crimping are both normal distributions, and there is a certain correlation between them. Therefore, the present invention has been made with this point in mind, and an electron that can be bonded by aligning the outer lead and the electrode while automatically correcting the positional deviation between the outer lead and the electrode using this correlation. An object is to provide a bonding method for components.
[0007]
[Means for Solving the Problems]
To this end, the electronic component bonding method of the present invention uses a crimping tool for temporary attachment with an anisotropic conductive sheet interposed between an outer lead of an electronic component made of a film carrier and an electrode of a glass substrate. Temporarily attaching the electronic component to the anisotropic conductive sheet, attaching the electronic component temporarily attached using a main pressure bonding tool to the glass substrate, and the electronic after the main pressure bonding Measuring relative displacement between a component and the glass substrate. (1) In the offset data acquisition mode, the tacking step is (a) when the electronic component is positioned on the glass substrate. The relative displacement between the electronic component and the glass substrate Observe the two first marks formed on the electronic component and the two second marks formed on the glass substrate. Detecting, (b) correcting the displacement and aligning the electronic component and the glass substrate, and (c) temporarily attaching the electronic component to the anisotropic conductive sheet with a crimping tool for temporary attachment, Relative positional deviation between the electronic component and the glass substrate after the main press bonding Observe the two first marks and the two second marks Offset data is obtained based on the detected misalignment, and (2) in the offset data feedback mode, the tacking step is (a) the electronic component and the glass substrate when the electronic component is positioned on the glass substrate. Relative displacement of Observe the two first marks formed on the electronic component and the two second marks formed on the glass substrate. (B) the electronic component and the glass substrate are shifted and aligned based on the positional deviation and the offset data, and (c) the anisotropic conductive sheet is attached to the electronic component with a crimping tool for temporary attachment. Including the step of temporarily attaching to.
[0008]
According to the above configuration, the positional deviation that occurs when the outer lead is crimped to the electrode is observed by the observation means, and the electronic component and the display panel are aligned based on this positional deviation. Can be suppressed within an allowable range.
[0009]
DETAILED DESCRIPTION OF THE INVENTION
Next, an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a plan view showing the overall configuration of an electronic component bonding apparatus according to an embodiment of the present invention. This electronic component bonding apparatus includes a supply unit A, an anisotropic conductive sheet adhering unit B, an outer lead bonding unit C, a first crimping unit D, a first liquid crystal panel (hereinafter referred to as “LCD”) as a display panel. Two crimping section E, misalignment inspecting section F, defective product collecting section G for collecting LCD determined to be NG in the inspection in misalignment inspecting section F, non-defective product collecting section H for collecting LCD determined to be OK, and apparatus The system includes a line controller I that manages the overall operation status, communication of various data, and the like, a communication cable J that connects the line controller I and each unit, and the like.
[0010]
In the figure, reference numeral 1 denotes an LCD, and 2 denotes a transport unit provided along each part. A number of arms 3 are provided in the transport unit 2 at a constant pitch, and a pad 4 for vacuum-absorbing the LCD 1 on the mounting tables W1, W2, W3. Each pad 4 absorbs the LCD 1 on the mounting tables W1, W2, W3,... In a vacuum and reciprocates in the X direction to transfer the LCD 1 to an XYθ table provided in each part or on the XYθ table. The LCD 1 is carried out to the next mounting tables W1, W2, W3. Next, each part will be described.
[0011]
First, the outer lead bonding portion C will be described. 2 is a plan view of the outer lead bonding portion C of the electronic component bonding apparatus according to the embodiment of the present invention, and FIG. 3 is a portion of the outer lead bonding portion C of the electronic component bonding apparatus according to the embodiment of the present invention. It is a perspective view. In FIG. 2, reference numeral 11 denotes an XYθ table. The X table 13 is placed on the Y table 12, and the θ table 14 is placed on the X table 13. The LCD 1 is placed on the θ table 14. Place. The θ table 14 sucks and fixes the LCD 1 by suction means (not shown). When the motor 15 of the Y table 12 is driven, the LCD 1 moves in the Y direction. When the motor 16 of the X table 13 is driven, the LCD 1 moves in the X direction. When an actuator (not shown) of the θ table 14 is driven, the LCD 1 is moved to θ. Rotate (horizontal rotation). In this way, the LCD 1 is positioned by moving it in the XYθ direction. The transport direction of the LCD 1 by the transport unit 2 is assumed to be the X direction.
[0012]
An index head 20 is provided on the side of the XYθ table 11. The index head 20 includes four arms 21 extending radially outward, and a suction head 22 that vacuum-sucks electronic components is provided at the tip of the arm 21. The arm 21 is attached to the index head 20 at intervals of 90 °, and the index head 20 rotates the index every 90 °. A first film carrier supply unit 23 and a second film carrier supply unit 24 are installed on both sides of the index head 20. A first mold 25 is provided between the index head 20 and the first film carrier supply unit 23, and a second mold 26 is provided between the index head 20 and the second film carrier supply unit 24. Is provided.
[0013]
The first film carrier supply unit 23 is provided with a first film carrier 7a which is a material of a first electronic component 6a (hereinafter also simply referred to as electronic component 6a) bonded to the long side of the LCD 1. The first film carrier 7 a led out from the first film carrier supply unit 23 is punched into the first mold 25. The first electronic component 6a obtained by punching is vacuum-sucked by the suction head 22, and the index head 20 is driven to rotate horizontally in the direction of the solid arrow by 90 °, so that the first electronic component 6a is conveyed above the end of the long side of the LCD 1. Then, it is bonded to the end of the LCD 1 by means described later.
[0014]
Further, the second film carrier 7 b led out from the second film carrier supply unit 24 is punched into the second mold 26. The second electronic component 6b obtained by punching (hereinafter also simply referred to as an electronic component 6b) is vacuum-sucked by the suction head 22, and the index head 20 is driven in the direction of the broken-line arrow, whereby the end of the short side of the LCD 1 is obtained. It is conveyed upward and bonded to this end. When the second electronic component 6a is bonded to the end portion of the short side of the LCD 1, the LCD table 1 is horizontally rotated by 90 ° in advance by driving the θ table 14, and the short side is positioned at a position facing the index head 20. Move.
[0015]
FIG. 3 shows a state in which the first electronic component 6 a is mounted on the LCD 1. The LCD 1 is formed by laminating a lower plate 1a made of a glass plate and an upper plate 1b, and electrodes 9 are formed at a narrow pitch at the end of the lower plate 1a. On the electrode 9, an ACF 27 is attached in advance in an attachment portion B (see FIG. 1) of an anisotropic conductive sheet (hereinafter also referred to as ACF) 27. The first electronic component 6a is made by mounting the first chip 8a on the upper surface of the first film carrier 7a, and the outer leads 28 are formed at a narrow pitch at the end of the first film carrier 7a. ing. The suction head 22 vacuum-sucks the first film carrier 7a on its lower surface. Reference numeral 29 denotes a nozzle shaft coupled to the suction head 22, and the first film carrier 7 a is vacuum-sucked through the nozzle shaft 29.
[0016]
In FIG. 2, a provisional pressure bonding head 30 is provided above the LCD 1. In FIG. 3, reference numeral 31 denotes a temporary pressure bonding tool provided in the temporary pressure bonding head 30, and the outer lead 28 is pressed against the ACF 27 by the temporary pressure bonding tool 31 to be temporarily pressure bonded. This temporary crimping is performed prior to the final crimping of the first electronic component 6a by the first regular crimping portion D and the final crimping of the second electronic component 6b by the second regular crimping portion E, which will be described later. That is, the workability of bonding is improved by performing the temporary pressure bonding and the main pressure bonding of the electronic components 6a and 6b at different locations. The temporary crimping tool 31 is heated by a heater (not shown) so that the outer lead 28 can be lightly temporarily crimped to the ACF 27. In addition, ACF27 is previously stuck on the electrode 9 in the anisotropic conductive sheet sticking part B (refer FIG. 1).
[0017]
In FIG. 3, a first camera 32 and a second camera 33 are installed below the temporary crimping tool 31. In addition, circle-shaped marks 34 and 35 are formed in the vicinity of the electrode 9 on the lower plate 1a. FIG. 4 is a bottom view of the lower plate of the LCD according to the embodiment of the present invention, and shows an observation state by the first camera 32 and the second camera 33. In the figure, 36 and 37 are spot marks formed on both sides of the film carrier 7a. The first camera 32 observes the marks 34 and 36 on the left side in the figure, and the second camera 33 observes the marks 35 and 37 on the right side. The marks 34 and 35 on the lower plate 1a side have a circle shape.
[0018]
FIG. 5 is a block diagram of a control system of the outer lead bonding portion C of the electronic component bonding apparatus according to the embodiment of the present invention. Reference numeral 41 denotes a CPU which controls the entire outer lead bonding portion C and calculates the positional deviation Sx in the X direction and the positional deviation Sy in the Y direction of the outer lead 28 and the electrode 9. A ROM 42 stores a program for operating the apparatus. A RAM 43 stores offset data TX and TY calculated by the CPU 41. Sx, Sy, TX, and TY will be described later. A recognizing unit 44 is connected to the first camera 32 and the second camera 33 described above. Based on the obtained image data, the center coordinates Ga, Gb, Fa and Fb (described later) are obtained. An XYθ table controller 45 controls the XYθ table 11. A suction head controller 46 controls the suction head 22. Reference numeral 47 denotes a temporary pressure bonding head controller that controls the temporary pressure bonding head 30. Each means described above is connected to the bus 48, and is further connected to the communication cable J via a communication unit 49 that controls communication with the outside.
[0019]
Next, the first and second crimping portions D and E will be described. FIG. 6 is a plan view of the first crimping portion D and the second crimping portion E of the electronic component bonding apparatus according to the embodiment of the present invention. FIG. 7 is an electronic component bonding device according to the embodiment of the present invention. FIG. 6 is a perspective view of the vicinity of a main crimping tool provided in the first main crimping portion D of FIG. In FIG. 6, the first main crimping portion D performs the main crimping of the first electronic component 6 a to the end portion of the long side of the LCD 1. The second main crimping section E horizontally rotates the LCD 1 by 90 °, and finally crimps the second electronic component 6b to the end of the short side.
[0020]
First, the structure of the first crimping part D will be described. In FIG. 6, reference numeral 51A denotes an XYθ table, which includes a Y table 52A, an X table 53A, and a θ table 54A. When the motor 55A of the Y table 52A is driven, the LCD 1 moves in the Y direction, when the motor 56A of the X table 53A is driven, the LCD 1 moves in the X direction, and when the actuator (not shown) of the θ table 54A is driven, the LCD 1 moves to θ Rotate. The second crimping section E is also provided with a Y table 52B, an X table 53B, a θ table 54B, and respective motors 55B and 56B that constitute the XYθ table 51B having the same structure.
[0021]
A first crimping head portion 61 is provided in the first crimping portion D. The first main crimping head 61 includes a first main body 62 in which a drive system is built, and a first main crimping tool 63 held by the first main body 62. A plurality of (three in this embodiment) first crimping tools 63 are provided according to the number of first electronic components 6a to be crimped to the long side of the LCD 1. In FIG. 7, an arm 64 extends from the first main body 62, and the first permanent crimping tool 63 is held at the tip of the arm 64. A heater 65 is built in the first crimping tool 63 and heats the first crimping tool 63. 66 is a receiving member provided below the first crimping tool 63, and is moved up and down by being driven by lifting means (not shown). The lower receiving member 66 supports the end portion of the lower plate 1a of the LCD 1 from below by performing an ascending operation. In this state, the first main crimping tool 63 is lowered, and the outer lead 28 of the first film carrier 7a is pressed against the electrode 9 of the lower plate 1a to perform final crimping.
[0022]
In FIG. 6, the second crimping section E is provided with a second crimping head 71. The second crimping head 71 includes a second main body 72 having a second crimping tool 73. Two second crimping tools 73 are provided. The structure and operation of the second main crimping portion E are the same as those of the first main crimping portion D, and the first main crimping portion D performs the main crimping of the first electronic component 6a on the long side of the LCD 1. The second main crimping part E is different in that the second electronic component 6 b is finally crimped to the short side of the LCD 1.
[0023]
Next, the misregistration inspection unit F will be described. FIG. 8 is a plan view of a misalignment inspection unit of an electronic component bonding apparatus according to an embodiment of the present invention. FIG. 9 is a perspective view of a main part of the misalignment inspection unit of the electronic component bonding apparatus according to an embodiment of the present invention. FIG. Reference numeral 81 denotes an XYθ table, which includes a Y table 82, an X table 83, and a θ table 84. By driving the motor 85a of the Y table 82, the motor 85b of the X table 83, and the actuator of the θ table 84, the LCD 1 Is moved in the XYθ direction to adjust its position.
[0024]
Reference numeral 86 denotes an observation unit. In FIG. 9, this observation unit 86 includes a third camera 87 and a fourth camera 88. Reference numeral 89 denotes a storage box for the third camera 87 and the fourth camera 88. In the third camera 87 and the fourth camera 88, the outer lead 28 is bonded to the electrode 9 and then the marks 34, 35, 36, and 37 are observed. Detects misalignment. In FIG. 8, 2a is an NG board | substrate conveyance part, provided orthogonally to the said conveyance part 2, and LCD1 which became NG by the test result of the position shift inspection part F is conveyed to the inferior goods collection part G. And collect.
[0025]
FIG. 10 is a block diagram of a control system of the misalignment inspection unit F according to the embodiment of the present invention. Reference numeral 91 denotes a CPU which controls the entire misalignment inspection unit F and the like. A ROM 92 stores a program for operating the apparatus. The RAM 93 stores misalignment inspection results and the like. The recognition unit 94 obtains center coordinates Ga, Gb, Fa, and Fb (described later) of the marks 34, 35, 36, and 37 based on the image data of the third camera 87 and the fourth camera 88. Reference numeral 95 denotes an XYθ table controller that controls the XYθ table 81. Reference numeral 96 denotes an NG substrate transfer unit controller that controls the NG substrate transfer unit 2a.
[0026]
This electronic component bonding apparatus is configured as described above. Next, the overall operation will be described. First, the offset data acquisition mode for acquiring the offset data TX and TY will be described. In FIG. 1, the LCD 1 provided in the supply unit A is sent to the anisotropic conductive sheet bonding unit B, and the ACF 27 is bonded onto the electrode 9 of the LCD 1. Next, the LCD 1 is sent to the outer lead bonding portion C. In FIG. 2, the LCD 1 on the mounting table W <b> 1 is vacuum-sucked by the pad 4 and transferred onto the XYθ table 11. In this embodiment, first, the outer lead 28 of the first electronic component 6a is temporarily attached to the long-side electrode 9 of the LCD 1, and this temporary attaching process will be described below.
[0027]
The first film carrier 7a led out from the first film carrier supply unit 23 is punched by the first mold 25, and the first electronic component 6a is obtained. The first electronic component 6a is vacuum-sucked by the suction head 22 and picked up, and the index head 20 is horizontally moved in the direction of the solid arrow in FIG. And the LCD1 Two second Marks 34 and 35 and electronic component 6a Two first The electronic component 6a is positioned on the LCD 1 so that the marks 36 and 37 overlap (see FIG. 3).
[0028]
FIG. 3 shows the state at this time. In this state, the marks 34, 35, 36, and 37 are observed by the first camera 32 and the second camera 33, and the relative displacement between the outer lead 28 and the electrode 9 in the XY direction is detected. After correcting this positional deviation, the outer lead 28 is temporarily press-bonded to the electrode 9. FIG. 4 is a bottom view of the lower plate 1a and the outer lead 9 being observed by the first camera 33 and the second camera 34. Hereinafter, referring to FIGS. 11 (a), 11 (b), and 11 (c), A method for detecting a positional deviation between the first electronic component 6a held by the suction head 22 and the LCD 1 on the XYθ table 11 before temporary pressing will be described.
[0029]
FIGS. 11A, 11B, and 11C are image diagrams of LCD and outer lead marks according to an embodiment of the present invention. In FIG. 11A, the marks 34 and 36 are observed by the first camera 32, and the marks 35 and 37 are observed by the second camera 33. The center coordinates Ga (XGa.YGa), Gb (XGb. YGb), Fa (XFa.YFa), and Fb (XFb.YFb) are obtained by the recognition unit 44 (FIG. 5). Such detection of the center coordinates of the image can be easily performed by a well-known image processing technique, and therefore the description thereof is omitted.
[0030]
Next, based on the obtained center coordinates Ga, Gb, Fa, Fb, the positional deviations dx1, dy1, dx2, dy2 of the marks 34, 35 and the marks 36, 37 in the X direction and the Y direction are obtained from the following equations.
[0031]
dx1 = XFa-XGa (1)
dy1 = YFa-YGa (2)
dx2 = XFb−XGb (3)
dy2 = YFb−YGb (4)
Next, based on the above result, the positional deviation Sx in the X direction between the LCD 1 and the first electronic component 6a and the relative positional deviation Sy in the Y direction are obtained from the following equations.
[0032]
Sx = (dx1 + dx2) / 2 (5)
Sy = (dy1 + dy2) ÷ 2 (6)
Expression (5) is obtained by calculating the average value of the positional deviation dx1 detected by the first camera 32 and the positional deviation dx2 detected by the second camera 33 as the positional deviation in the X direction of the LCD 1 and the first electronic component 6a. Similarly, the equation (6) is used to calculate the average value of the positional deviation dy1 and the positional deviation dy2 as the positional deviation in the Y direction between the LCD 1 and the first electronic component 6a. When the positional deviations Sx and Sy are obtained in this way, the positional deviations Sx and Sy are corrected by driving the X table 13 and the Y table 12 in FIG. 2 to move the LCD 1 by −Sx and −Sy. .
[0033]
FIG. 11B shows the positional relationship between the corrected marks 34, 35, 36 and 37. In the figure, mxa and mya are distances in the X and Y directions of the center coordinates Ga and Fa of the marks 34 and 36, and mxb and myb are distances in the X and Y directions of the center coordinates Gb and Fb of the marks 35 and 37. Thus, mxa = mxb, mya = myb. The distance L1 between the center coordinates of the marks 34 and 35 is larger than the distance L2 between the center coordinates of the marks 36 and 37. The reason is that when the outer leads 28 are thermocompression-bonded to the electrodes 9 in a later step, the film carriers 7a and 7b are extended and the distance L2 is increased. Incidentally, if it is not necessary to anticipate this elongation, L1 = L2 in FIG.
[0034]
When the positional deviations Sx and Sy between the LCD 1 and the first electronic component 6a are corrected as described above, the suction head 22 is lowered in FIG. 3 to land the outer lead 28 on the ACF 27, and then the temporary crimping tool. 31 is lowered and the outer lead 28 is pressed against the ACF 27 and temporarily bonded. As described above, the temporary crimping is performed in advance so that the outer leads 28 are not unnecessarily displaced when the first crimping tool 63 and the second regular crimping tool 73 are finally crimped in a process described later. This is performed for provisional attachment on the electrode 9.
[0035]
If the first electronic component 6 a is temporarily attached onto the long-side electrode 9 of the LCD 1 as described above, then the second electronic component 6 b is temporarily attached onto the short-side electrode 9. The method for temporarily attaching the second electronic component 6b is the same as the method for temporarily attaching the first electronic component 6a described above, and will be briefly described below. In FIG. 2, if all the first electronic components 6a (three in the present embodiment) are temporarily attached on one long side electrode 9 of the LCD 1, the θ table 14 is driven and the LCD 1 is horizontally rotated by 90 °. Rotate to make the short side face the index head 20 side. Further, the second film carrier 7b is led out from the second film carrier supply section 24 to the second mold 26, and the second film carrier 7b is punched out to obtain the second electronic component 6b. Therefore, the suction head 22 picks up the second electronic component 6b, and the index head 20 is driven to rotate in the direction of the broken arrow, thereby transferring the second electronic component 6b onto the short-side electrode 9 of the LCD 1. Then, as in the case of the first electronic component 6a described with reference to FIG. 11, the positional deviations Sx and Sy between the LCD 1 and the second electronic component 6a are obtained. Next, after correcting the positional deviations Sx and Sy, the outer lead 28 is temporarily attached to the ACF 27 by the temporary crimping tool 31. That is, in the offset data acquisition mode, provisional attachment is performed after aligning the LCD 1 and the electronic components 6a and 6b so that the positional deviation between them becomes zero. As a result, the new misregistration amount caused by the tacking and the main press bonding can be known as misregistration amounts Tx and Ty measured by the misregistration inspection unit F.
[0036]
FIG. 13 is a flowchart of the outer lead bonding portion C showing a temporary attachment process in the offset data acquisition mode of the outer lead bonding portion of the electronic component bonding apparatus according to the embodiment of the present invention described above. If the first electronic component 6a and the second electronic component 6b are all temporarily attached to the LCD 1 as described above, the XYθ table 11 is driven in FIG. 2 and the LCD 1 is moved below the center pad 4 in FIG. Transport. Therefore, the pad 4 picks up the LCD 1 on the XYθ table 11 by vacuum suction and transfers it to the next mounting table W2 as indicated by an arrow N1. Then, the next pad 4 picks up the LCD 1 by vacuum suction.
[0037]
In FIG. 6, the XYθ table 51A provided in the first main crimping section D is driven to move below the LCD 1 that is vacuum-sucked by the pad 4, and the pad 4 cancels the vacuum-sucking state. Is transferred onto the XYθ table 51. Next, the XYθ table 51 </ b> A moves the first electronic component 6 a temporarily attached to the long side of the LCD 1 to the lower side of the first main crimping tool 63 to perform the main crimping. FIG. 7 shows a state where the main crimping is performed by the first regular crimping tool 63. In the drawing, the first main crimping tool 63 is preheated by a heater 65, and the lower plate 1a is supported from below by the lower receiving member 66, and is finally crimped onto the electrode 9 by pressing strongly against the outer lead 28.
[0038]
The LCD 1 on which the first electronic component 6a is finally crimped in the first regular crimping section D as described above is once transferred onto the mounting table W3, and then the second regular crimping section is continued by the transport unit 2. E is sent onto the XYθ table 51B provided for E. In the LCD 1 transferred onto the XYθ table 51B, the second electronic component 6b on the short side is positioned below the second main crimping tool 73 by rotating the θ table 54 by 90 °. Therefore, the outer lead 28 is finally crimped to the electrode 9 by the second regular crimping tool 73 as in the case of the regular crimping by the first regular crimping tool 63 described with reference to FIG.
[0039]
The LCD 1 in which the first electronic component 6a and the second electronic component 6b are all bonded as described above is sent to the XYθ table 81 of the misalignment inspection unit F shown in FIG. Inspection is performed. FIG. 9 shows the state of this misalignment inspection. The left and right marks 34, 35, 36, and 37 are observed by the third camera 87 and the fourth camera 88.
[0040]
In FIG. 11C, the left side shows the image of the third camera 87, and the right side shows the image of the fourth camera 88. When the outer lead 28 is finally crimped by the first regular crimping tool 63 or the second regular crimping tool 73, the marks 36 and 37 on the outer lead 28 side are moved from the positions shown in FIG. It is displaced to the position shown in c). The reason for this is that, as explained in the section of (Prior Art), the parallelism between the first and second crimping tools 63 and 73 and the electrode 9 surface of the LCD 1 does not match, the crimping load, the temperature, and the physicality of the ACF 27. This is because of characteristics.
[0041]
In FIG. 11C, the positional deviation between the marks 34 and 35 and the marks 36 and 37 is obtained from the following equation.
[0042]
dx3 = XFa-XGa (7)
dy3 = YFa-YGa (8)
dx4 = XFb−XGb (9)
dy4 = YFb−YGb (10)
Here, dx3, dy3, dx4, and dy4 are displacements in the X and Y directions of the center coordinates Fa and Fb of the marks 36 and 37 and the center coordinates Ga and Gb of the marks 34 and 35, respectively.
[0043]
Therefore, the positional deviation amount Tx in the X direction and the positional deviation amount Ty in the Y direction of the electronic component 6a (6b) and the LCD 1 after the main press-bonding are expressed by the following equations.
[0044]
Tx = (dx3 + dx4) / 2 (11)
Ty = (dy3 + dy4) ÷ 2 (12)
Tx is the average value of dx3 and dx4, Ty is the average value of dy3 and dy4, and the average value of the positional deviations of the left marks 34 and 36 and the right marks 35 and 37 is obtained. The relative displacement of the first electronic component 6a is used. As described above, the displacement amounts Tx and Ty can be regarded as displacement amounts generated at the time of temporary attachment and main pressure bonding. FIG. 12 is a plan view of an LCD in which the first electronic component and the second electronic component according to an embodiment of the present invention are permanently bonded. In FIG. 12, as shown in the bonding positions # 1 to # 8, six first electronic components 6a and two second electronic components 6b are bonded to the LCD 11. Therefore, the positional deviation amounts Tx and Ty are measured for each of # 1 to # 8 for a large number (50 in this embodiment) of LCDs 1. Then, TX and TY are calculated as average values of the positional deviation amounts Tx and Ty for each of the bonding positions # 1 to # 8. (Table 1) shows the data.
[0045]
[Table 1]

[0046]
The data of (Table 1) is stored in the RAM 93 of the misalignment inspection unit F. As described with reference to FIG. 17, the positional deviation amounts Tx and Ty tend to be constant, and the average values TX and TY become offset data for positional deviation correction. The average values TX and TY of the positional deviation are sent to the line controller 1 and then sent from the line controller 1 to the RAM 43 of the outer lead bonding unit C as offset data. Table 2 shows the offset data.
[0047]
[Table 2]

[0048]
The outer lead bonding portion C feeds back the offset data to the XYθ table controller 45 when the electronic component is temporarily pressure-bonded to the next LCD 1, and thereafter, while correcting the offset data TX and TY as correction values, After the positioning of the lead 28 with respect to the electrode 9, temporary attachment with the temporary crimping tool 31 is performed. This correction is preferably performed for each of the bonding positions # 1 to # 8 according to the offset data TX and TY shown in (Table 2).
[0049]
Next, the offset data feedback mode will be described with reference to FIGS. FIGS. 14A, 14B, and 14C are images of LCD and outer lead marks according to an embodiment of the present invention, and FIG. 15 is a positional deviation correction of a bonding apparatus for electronic components according to an embodiment of the present invention. It is explanatory drawing of a method. FIG. 14A is an image similar to FIG. 11A and shows images of the first camera 33 and the second camera 34 before the outer lead 28 shown in FIG. 3 is temporarily attached. Yes. First, the positional deviation Sx in the X direction and the positional deviation Sy in the Y direction are obtained from the above equations (1) to (6). Next, the offset data TX and TY stored in the RAM 43 are added as correction values to the Sx and Sy to obtain final correction values Ux and Uy (see also FIG. 15).
[0050]
Next, position correction is performed by driving the XYθ table 11 to move the LCD 1 in the X direction by −Ux and in the Y direction by −Uy. In other words, in the offset data feedback mode, the LCD 1 and the electronic components 6a and 6b are shifted in alignment with the expectation of the average values TX and TY of the positional deviations that occur at the time of tacking and main pressing. FIG. 14B shows images of the marks 34, 35, 36, and 37 of the LCD 1 and the electronic component 6a (6b) whose position has been corrected. When the position is corrected in this way, the outer lead 28 is temporarily attached to the ACF 27 by the temporary crimping tool 31 as described above. Subsequently, the LCD 1 is transported by the transport unit 2 to the first crimping unit D and the second crimping unit E, and finally crimped by the first crimping tool 63 and the second crimping tool 73. FIG. 14C shows an image after the main press bonding. The positional deviation amounts Tx and Ty after the final press-bonding are as shown in the equations (11) and (12), and the relative positions of the LCD 1 and the electronic components 6a and 6b are shifted in the process of temporary attachment and final press-bonding. The positional deviation amounts Tx and Ty are reduced. Thereafter, the LCD 1 is transported to the misalignment inspection unit F by the transport unit 2, and the misalignment between the LCD 1 and the electronic component 6a (6b) is inspected. When the positional deviations Tx and Ty are less than the allowable value ± D, the LCD 1 is collected as a non-defective product in the non-defective product collecting unit H shown in FIG. To be recovered.
[0051]
FIG. 16 is a flowchart of the offset data feedback mode of the outer lead bonding portion C of the electronic component bonding apparatus according to the embodiment of the present invention described above.
[0052]
The present invention is not limited to the above embodiment, and various design changes and operation methods can be considered. For example, in (Table 1), the number of LCDs 1 for obtaining offset data TX and TY is 50 sheets. This number can be any number. Further, in the present embodiment, the bonding apparatus includes the misalignment inspection unit F. However, the misalignment inspection unit F may be provided separately and used. In addition, the outer lead bonding part C and the misalignment inspection part F are connected by a communication cable J and various data are transferred by communication. However, even if data is exchanged using a storage medium such as a magnetic disk. Good. In addition, the mark for detecting the displacement is not limited to the marks 34, 35, 36, and 37 as long as it can be a target for observation. Thus, various design changes are possible for the present invention.
[0053]
【The invention's effect】
As described above, according to the present invention, the positional deviation of the outer lead with respect to the electrode can be suppressed within an allowable range, and the bonding of electronic components to the LCD can be performed with a high yield.
[Brief description of the drawings]
FIG. 1 is a plan view showing the overall configuration of an electronic component bonding apparatus according to an embodiment of the present invention;
FIG. 2 is a plan view of an outer lead bonding portion of the electronic component bonding apparatus according to the embodiment of the present invention.
FIG. 3 is a partial perspective view of an outer lead bonding portion of an electronic component bonding apparatus according to an embodiment of the present invention.
FIG. 4 is a bottom view of a lower plate of an LCD according to an embodiment of the present invention.
FIG. 5 is a block diagram of a control system of an outer lead bonding portion of the electronic component bonding apparatus according to the embodiment of the present invention.
FIG. 6 is a plan view of a first crimping portion and a second crimping portion of an electronic component bonding apparatus according to an embodiment of the present invention.
FIG. 7 is a perspective view of the vicinity of the main crimping tool provided in the first crimp unit of the electronic device bonding apparatus according to the embodiment of the present invention.
FIG. 8 is a plan view of a misalignment inspection unit of the electronic component bonding apparatus according to the embodiment of the present invention.
FIG. 9 is a perspective view of a main part of a misalignment inspection unit of the electronic component bonding apparatus according to the embodiment of the present invention.
FIG. 10 is a block diagram of a control system of a misalignment inspection unit of the electronic device bonding apparatus according to the embodiment of the present invention.
FIG. 11A is an image view of an LCD and outer lead mark according to an embodiment of the present invention.
(B) Image diagram of LCD and outer lead mark of one embodiment of the present invention
(C) Image diagram of LCD and outer lead mark of one embodiment of the present invention
FIG.
The top view of LCD with which the 1st electronic component and 2nd electronic component of one embodiment of this invention were finally pressure-bonded
FIG. 13 is a flowchart showing a temporary attachment process in the offset data acquisition mode of the outer lead bonding portion of the electronic component bonding apparatus according to the embodiment of the present invention;
14A is an image diagram of an LCD and outer lead mark according to an embodiment of the present invention. FIG. 14B is an image diagram of an LCD and outer lead mark according to an embodiment of the present invention.
(C) Image diagram of LCD and outer lead mark of one embodiment of the present invention
FIG. 15 is an explanatory diagram of a positional deviation correction method for an electronic component bonding apparatus according to an embodiment of the present invention;
FIG. 16 is a flowchart of an offset data feedback mode of the outer lead bonding portion of the electronic component bonding apparatus according to the embodiment of the present invention.
FIG. 17 is a distribution diagram of relative displacement between outer leads and electrodes in a conventional electronic component bonding method;
[Explanation of symbols]
C Outer lead bonding part
D 1st crimping part
E 2nd crimping part
F Misalignment inspection section
1 Display panel (LCD)
6a First electronic component
6b Second electronic component
7a First film carrier
7b Second film carrier
9 electrodes
11, 51A, 51B, 81 XYθ table
22 Suction head
27 Anisotropic conductive sheet (ACF)
28 Outer lead
30 Temporary crimping head
31 Temporary crimping tool
32 First camera
33 Second camera
34, 35, 36, 37 mark
41,91 CPU
43,93 RAM
44, 94 recognition unit
45 XYθ table controller
63 1st crimping tool
73 2nd crimping tool
87 Third camera
88 4th camera

Claims (4)

Temporarily attach the electronic component to the anisotropic conductive sheet with a temporary crimping tool with an anisotropic conductive sheet interposed between the outer lead of the electronic component made of a film carrier and the electrode of the glass substrate. A temporary attaching step, a step of subjecting the electronic component temporarily attached using a main crimping tool to the glass substrate, and a relative displacement between the electronic component after the main crimping and the glass substrate. Including a process of measuring,
(1) In the offset data acquisition mode,
The temporary attachment step includes: (a) two first marks formed on the electronic component and a relative displacement between the electronic component and the glass substrate when the electronic component is positioned on the glass substrate ; Observe and detect the two second marks formed on the glass substrate , (b) correct this misalignment and align the electronic component with the glass substrate, and (c) use the electronic tool with a temporary crimping tool. Including temporarily attaching the component to the anisotropic conductive sheet,
Obtain offset data based on the positional deviation detected by observing the two first marks and the two second marks to detect the relative positional deviation between the electronic component and the glass substrate after the main press bonding. And
(2) In the offset data feedback mode,
The temporary attachment step includes: (a) two first marks formed on the electronic component and a relative displacement between the electronic component and the glass substrate when the electronic component is positioned on the glass substrate ; Two second marks formed on the glass substrate are observed and detected, (b) the electronic component and the glass substrate are shifted and aligned based on the positional deviation and the offset data, and (c) A bonding method for electronic parts, comprising a step of temporarily attaching the electronic part to the anisotropic conductive sheet with a crimping tool for temporary attachment. 2. The electronic component bonding method according to claim 1, wherein the offset data is calculated from an average value of positional deviations detected from a plurality of glass substrates. The offset data is calculated for each bonding position for attaching an electronic component on the glass substrate, and in the temporary attachment process in the offset data feedback mode, the electronic component and the glass substrate are shifted based on each offset data for each bonding position. The method of bonding an electronic component according to claim 1, further comprising a step of aligning. When the positional deviation detected in the step of measuring the relative positional deviation between the electronic component after the main press-bonding and the glass substrate exceeds an allowable value, the glass substrate is selected as a bonding defect. The method for bonding electronic components according to claim 1.

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