JP3818930B2 - Component mounting method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a component mounting method that can be suitably applied to flip chip mounting in which electronic components are directly mounted on a circuit board.
[0002]
[Prior art]
Hereinafter, a conventional component mounting method will be described with an example.
In recent years, with the reduction in size and weight of electronic devices and the increase in the frequency of electronic components used in devices, flip chip mounting has been used in which electronic components are directly mounted on a substrate and bonded.
[0003]
In particular, when a micro device such as a SAW filter or a crystal oscillator used for oscillation at a constant frequency is mounted on a package substrate, a bump formed on the device or the package substrate by applying ultrasonic vibration to the device is applied. An ultrasonic bonding flip chip mounting method is often used in which bonding is performed on a package substrate.
[0004]
A conventional example of a method for mounting a SAW filter by ultrasonic bonding will be described with reference to FIGS. 9, 10, 11, and 12.
FIG. 9 shows a component device. The main parts are a supply unit A to which components are supplied, a box substrate transport unit B that receives the mounting of the components, and the components taken out from the supply unit A are mounted on the box substrate. And mounting portion C. Here, the box substrate refers to a substrate whose shape is higher than the mounting surface with respect to the mounting surface. FIG. 11 schematically shows the box substrate 9.
[0005]
FIG. 10 is an enlarged schematic view of the mounting portion C of FIG.
The mounting part C includes a tool 4 provided with a suction hole for sucking and holding the component 1, a horn 3 for transmitting the ultrasonic wave generated by the ultrasonic oscillator 17 to the tool 4, and a tool 4 holding the tool 4 at a predetermined position. The mounting head 2 for positioning the head, the head driving unit 18 for moving the mounting head 2 to the left and right in the horizontal direction, the rotating means 5 for rotating the horn 3 and the tool 4 in the horizontal direction, and the tool 4 A recognition unit 6 for recognizing the posture when sucked, a display unit 7 for displaying an image input to the image recognition unit 13 by the recognition unit 6, a stage 8 for holding a box substrate 9 on which the component 1 is mounted, and a stage The stage drive unit 19 is configured to move 8 forward and backward in the horizontal direction.
[0006]
The display means 7 is arranged at a position where the operator can visually check the tool 4 while attaching it. The mounting head 2 is attached to the left and right, and the stage 8 is attached so as to be orthogonal to each other in the horizontal direction.
[0007]
A motor control unit 15 operates the head drive unit 18 and the stage drive unit 19. A main processing unit 14 controls the motor control unit 15. Reference numeral 16 denotes a storage device that stores data necessary for control of the main processing unit 14.
[0008]
FIG. 12 is a flowchart showing a conventional semiconductor element component mounting method.
In FIG. 12, in step S1, the mounting head 2 moves to the component suction position.
[0009]
In step S <b> 2, the component 1 is sucked by the tool 4.
In step S <b> 3, the component 1 sucked by the tool 4 is recognized by the recognition unit 6.
[0010]
In step S4, the suction position and suction angle of the component 1 are detected.
In step S5, the mounting head 2 and the rotation means 5 are moved to the corrected mounting position based on the result in step S4.
[0011]
In step S6, mounting is performed on the mounting position on the box substrate 9.
In step S 7, ultrasonic vibration is applied from the horn 3 with the component 1 mounted on the box substrate 9. Here, as shown in the perspective view and the bottom view of FIG. 13, the component 1 has a bump 11 formed on the bottom. When ultrasonic vibration is applied from the horn 3 in step S <b> 7, the applied ultrasonic vibration is applied to the tool 4. Is transmitted to the component 1 through the connector, further transmitted to the bump 11 of the component 1 through the component, and bonded by metal diffusion between the bump 11 and the land of the box substrate 9. 14 is an enlarged view when an ultrasonic wave is applied to the component 1 by the tool 4, and FIG. 15 is a cross-sectional view when the component is mounted.
[0012]
The tip of the tool 4 is often the same as the external size of the part 1. This is because when the tip portion is smaller than the external size of the component 1, ultrasonic waves are not easily transmitted to the entire component 1, and the bonding strength is reduced.
[0013]
This is because when the tip of the tool 4 is larger than the external size of the component 1, the component 1 is damaged due to a local load applied to the component 1 due to the displacement of the component suction position.
Specifically, as shown in the side view and the bottom view shown in FIG. 16, the external size of the part 1 is smaller than the external size of the tip part of the tool 4, and the tool 4 is super-extended with the tip part protruding from the part 1. When a sound wave is applied, the suction surface of the tool 4 and the part 1 is worn by vibration to form a recess having almost the same shape as the part 1, and a local load is applied to the part 1 due to the deviation of the part suction position. This is because 1 is damaged.
[0014]
Therefore, when picking up the component 1, as shown in the side view and the bottom view shown in FIG. 17, the tip 1 uses the tool 4 having the same size as the component 1 to pick up the component 1 without misalignment or rotation. It will be necessary.
[0015]
[Problems to be solved by the invention]
However, the center position of the tool 4 varies because the tool 4 is periodically replaced due to wear, product type switching, or the like. Therefore, even if it moves according to the data and picks up the part, the center of the part 1 and the center of the tool 4 and the picking angle of the part 1 and the mounting angle of the tool 4 are difficult to coincide with each other. It will stick out.
[0016]
For example, in contrast to the box substrate 9 having a component mounting space of 1.7 mm × 1.2 mm, the outer shape of the component 1 is 1.3 mm × 0.8 mm and there is almost no dimensional tolerance. The part 1 and the center of the tool 4 or the suction angle of the part 1 and the attachment angle of the tool 4 do not coincide with each other. 20, when mounting a component on the box substrate 9, the tip of the tool 4 collides with the edge of the box substrate 9, damaging the tool 4 or the box substrate 9 and causing product destruction. Had problems.
[0017]
The present invention solves the above-mentioned conventional problems, and an object of the present invention is to provide a component mounting method that can eliminate product defects due to destruction of components and boards.
[0018]
[Means for Solving the Problems]
In order to solve the above-described problem, the component mounting method of the present invention recognizes a component sucked by a recognition unit after sucking and holding the component, and detects a suction position and a suction angle of the component. At this time, if the positional deviation and rotational deviation between the tool and the part are equal to or larger than a certain amount, the part is temporarily placed on the temporary placement stage and then re-sucked by the recognition means. Then, the mounting head, the rotating means and the stage are corrected and moved based on the recognition result of the parts by the recognition means, and the parts are mounted on the box substrate. Further, it has a function of reflecting the next component suction position based on the correction amount at this time.
[0019]
In addition, it has a function of detecting the attachment position and angle of the tool surface before picking up the component and reflecting the detected tool attachment position and angle in the component pickup position.
[0020]
With this configuration, when the part is picked up, the center of the part and the center of the tool, and the attachment angle of the tool and the suction angle of the part can be picked up so that the tool tip does not protrude from the part. Tool and substrate destruction due to collision of the edge of the box substrate can be eliminated. Since the center and angle of the component and the tool match, the ultrasonic energy can be transmitted to the component without loss when mounting the component, so that the bonding strength between the component and the box substrate can be guaranteed and product defects can be prevented. Become.
[0021]
In the component mounting method according to the first aspect of the present invention, the component is sucked by the tool of the mounting head, the sucked component is recognized by the recognition unit, the sucking position and the sucking angle are detected, and the detected sucking position and the sucking position are detected. When mounting the mounting head and the board to be mounted according to the angle, pressing the component against the mounting position of the board, applying ultrasonic vibration from the horn of the mounting head and joining by metal diffusion, a tool If the amount of deviation obtained by recognizing the picked-up part by the recognition means is less than the set reference value, the picked- up part is recognized by the recognition means, and the pick-up position and pick-up angle are determined. based on the detected contents, the part of the suction position and angle correction to subsequent mounting operation when the tool after mounting components in the adsorption by the tool to suction holding the component Line, and the amount of deviation the tool is determined by recognition by the recognition unit components adsorbed, characterized in that on stopping the subsequent mounting operation when there was a shift amount equal to or greater than the predetermined reference value.
[0022]
In the component mounting method according to the second aspect of the present invention, the component is picked up by the tool of the mounting head, the picked-up component is recognized by the recognition means, the pick-up position and pick-up angle are detected, and the picked-up position and pick-up detected. When mounting the mounting head and the board to be mounted according to the angle, pressing the component against the mounting position of the board, applying ultrasonic vibration from the horn of the mounting head and joining by metal diffusion, a tool If the amount of deviation obtained by recognizing the picked-up part by the recognition means is less than the set reference value, the picked- up part is recognized by the recognition means, and the pick-up position and pick-up angle are determined. based on the detected contents, the part of the suction position and angle correction to subsequent mounting operation when the tool after mounting components in the adsorption by the tool to suction holding the component And line shift amount of the tool is determined by recognition by the recognition unit components adsorbed is, when was a shift amount greater than the set reference value and discards the part which the tool is adsorbed .
[0023]
In the component mounting method according to claim 3 of the present invention, the component is sucked by the tool of the mounting head, the sucked component is recognized by the recognition means, the suction position and the suction angle are detected, and the detected suction position and suction are detected. When mounting the mounting head and the board to be mounted according to the angle, pressing the component against the mounting position of the board, applying ultrasonic vibration from the horn of the mounting head and joining by metal diffusion, a tool If the amount of deviation obtained by recognizing the picked-up part by the recognition means is less than the set reference value, the picked- up part is recognized by the recognition means, and the pick-up position and pick-up angle are determined. based on the detected contents, the part of the suction position and angle correction to subsequent mounting operation when the tool after mounting components in the adsorption by the tool to suction holding the component Line, and the tool shift amount found by recognized by the recognition unit components adsorbed there is placed temporarily in the temporary placement stage the parts when was shift amount larger than a predetermined reference value, the component by the recognition means Recognizing and re-sucking the part on the temporary placement stage with the tool, the part being picked up by the tool is detected based on the content of the suction part and the suction angle detected by the recognition means. The mounting operation is executed by correcting the suction position and angle of the component when the tool holds the component by suction after mounting .
[0025]
The component mounting method according to a fourth aspect of the present invention is the component mounting method according to the first to third aspects, wherein the amount for correcting the suction position and angle of the next component is determined from the average value of the component displacement amount and angle in a plurality of suction operations. It is characterized by calculating.
[0026]
In the component mounting method according to the fifth aspect of the present invention, the component is picked up by the tool of the mounting head, the picked-up component is recognized by the recognition means, the pick-up position and pick-up angle are detected, and the picked-up position and pick-up detected. Relatively moving the mounting head and the substrate to be mounted according to the angle, pressing the component against the mounting position of the substrate, applying ultrasonic vibration from the horn of the mounting head, and joining by metal diffusion, The difference between the position and angle of the tool surface before and after the replacement of the tool is measured before the suction of the tool, and the correction amount to the next component suction position is obtained.
[0028]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, a component mounting method according to the present invention will be described based on specific embodiments.
The mechanical configuration of the conveying means and various actuators of the component mounting apparatus is the same as that in FIGS. 9 and 10 showing the conventional example, and will be described with the same reference numerals. In the present invention, the configuration of the operation program for the mounting process is different from the conventional one.
[0029]
(Embodiment 1)
When the configuration of the component mounting apparatus shown in FIGS. 9 and 10 is described in a block diagram, it is as shown in FIG. Reference numeral 20 denotes an operation means for inputting various settings and operation modes to the main processing unit 14. Whereas the portion related to the mounting program in the configuration of the conventional main processing unit 14 is configured as shown in FIG. 12, in (Embodiment 1), a part of this mounting program is configured as shown in FIG. ing.
[0030]
The main processing unit 14 of this (Embodiment 1) sucks the component 1 with the mounting head 2 in step S1.
In step S2, the mounting head 2 is moved to the recognition position of the recognition means 6.
[0031]
In step S <b> 3, the image of the component 1 is input to the image recognition unit 13 by the recognition unit 6. In step S4, the image recognition unit 13 detects the center position and the suction angle of the component 1 based on the image of the recognition means 6.
[0032]
In step S5, the “deviation amount” between the rotation center of the tool 4 and the center of the component 1 is calculated.
In step S6, the “deviation amount” calculated in step S5 is compared with the “set reference value” to determine the magnitude of the “deviation amount”.
[0033]
If the “deviation amount” is less than the “set reference value” in step S6, the next step in step S7, specifically, the routine after step S4 in FIG. 12 is executed.
[0034]
If the “deviation amount” is equal to or greater than the “set reference value” in step S6, the subsequent mounting operation is stopped in step S8, and specifically, the routine after step S4 in FIG. 12 is not executed.
[0035]
As described above, when the “deviation amount” between the center of the tool 4 and the center of the component 1 is large, the equipment is automatically stopped in step S8, so that the tool is caused by the collision between the tip of the tool 4 and the edge of the box substrate 9. 4 and the box substrate 9 can be destroyed.
[0036]
(Embodiment 2)
In (Embodiment 1), when the “deviation amount” is greater than or equal to the “set reference value”, the subsequent mounting operation is stopped in step S8. In this (Embodiment 2), as shown in FIG. In step S6, if the “deviation amount” is equal to or greater than the “set reference value”, step S9 is executed to move the mounting head 2 onto the component disposal box 12 shown in FIG. Here, the component disposal box 12 is fixed at an arbitrary position on a horizontal straight line on which the mounting head 2 is movable.
[0037]
The component disposal box 12 may be configured to be fixed to the stage drive unit 19.
After the movement of the mounting head 2 is completed, the component 1 is discarded to the component disposal box 12 in step S10.
[0038]
After the completion of disposal, in step S11, the mounting head 2 moves to the next component suction position and sucks the next component.
Since it comprised in this way, the fall of productivity can be prevented by preventing generation | occurrence | production of mounting misalignment and not stopping operation | movement of an installation.
[0039]
Furthermore, if the discarding operation is not performed more than a preset number of times, it is possible to prevent a wasteful discarding operation due to equipment abnormality or the like.
In addition, when the parts are discarded, if they are disposed in the aligned position, they can be reused as supply parts, so the economic effect is great.
[0040]
Note that steps S1 to S7 in FIG. 2 are the same as those in FIG.
(Embodiment 3)
FIG. 4 shows a flowchart of (Embodiment 3) of the present invention, and Steps S1 to S7 are the same as Steps S1 to S7 of (Embodiment 1).
[0041]
If it is determined in step S6 of this (Embodiment 3) that the “deviation amount” is greater than or equal to the “set reference value”, steps S12 to S18 are executed, and the process returns to step S2. Is different.
[0042]
In step S12, the mounting head 2 is moved onto the temporary placement stage 10 shown in FIG.
In step S13, the component 1 is temporarily placed on the temporary placement stage 10 fixed at an arbitrary position on a horizontal straight line on which the recognition means 6 can move.
[0043]
In step S <b> 14, the recognition unit 6 is moved onto the temporary placement stage 10.
The temporary placement stage 10 may be configured to be fixed to the stage drive unit 19. Alternatively, the recognition unit 6 may be configured to move in a horizontal plane.
[0044]
In step S <b> 15, the image of the part 1 placed on the temporary placement stage is input to the image recognition unit 13.
In step S16, the current position and angle of the component 1 are detected.
[0045]
In step S17, the main processing unit 14 calculates a correction amount for matching the center and angle of the tool 4 of the mounting head 2 with the part 1, and the motor control unit 15 corrects the position of the mounting head 2 based on the correction amount. Do.
[0046]
In step S18, when the position correction in step S17 is completed, the component 1 is picked up and the processes in and after step S2 are repeated again.
In this embodiment, the parts that could not be properly picked up are temporarily placed on the temporary placement stage 10 and then picked up again, so that the correct picked up state can be obtained. be able to.
[0047]
(Embodiment 4)
FIG. 6 shows (Embodiment 4) of the present invention.
This (Embodiment 4) is obtained by adding Step S5-a and Step S5-b between Step S5 and Step S6 in (Embodiment 1) to (Embodiment 3).
[0048]
Specifically, the image of the component 1 attracted by the mounting head 2 in step S3 is input to the image recognition unit 13 by the recognition unit 6, and the current position and angle of the component 1 are detected by the image recognition unit 13 in step S4.
[0049]
In step S5, the main processing unit 14 calculates the horizontal and horizontal positional deviation amounts A, B, and the angular deviation amount R of the tool 4 and the part 1 in the horizontal direction, and the storage device in step S5-a. 16 is stored.
[0050]
In step S5-b, the main processing unit 14 calculates a correction amount based on the positional deviation amount A, the positional deviation amount B, and the angular deviation amount R, and the next component suction position and angle based on the calculated correction amount. To give feedback.
[0051]
According to this configuration, by always correcting the suction position of the component, the component can be sucked in a correct posture, so that loss due to component disposal can be reduced and no wasteful operation for correcting the suction position is required.
[0052]
(Embodiment 5)
FIG. 7 shows (Embodiment 5) of the present invention, and shows a specific example of Step S5-b of (Embodiment 4), Step S5-b1 and Step S5-b2.
[0053]
Specifically, the image of the component 1 attracted by the mounting head 2 in step S3 is input to the image recognition unit 13 by the recognition unit 6, and the current position and angle of the component 1 are detected by the image recognition unit 13 in step S4. In step S5, the main processing unit 14 calculates the horizontal and horizontal positional deviation amounts A, B, and the angular deviation amount R of the tool 4 and the part 1 in the horizontal direction, and the storage device in step S5-a. 16 is stored. In step S5-b1, the main processing unit 14 calculates the average of the deviation amounts A, B, and R between the tool 4 and the component 1 stored in the storage device 16 in a plurality of mounting processes including the current time. . Based on the value, the correction amount is calculated by the main processing unit 14 in step S5-b2, and fed back to the suction position and angle of the next part.
[0054]
According to this configuration, since the feedback amount of the position and angle at the time of sucking the next part is calculated based on the deviation amount at the time of picking up a plurality of parts, the validity of the feedback value can be improved.
[0055]
(Embodiment 6)
FIG. 8 shows (Embodiment 6) of the present invention.
This (Embodiment 6) is a step S1-a, which is executed prior to Step S1, in the component mounting apparatus configured to implement any of (Embodiment 1) to (Embodiment 5). Steps S1-b, Step S1-c, Step S1-d, Step S1-e, and Step S1-f are executed to measure the difference between the position and angle of the tool surface before and after tool replacement before picking up parts. A correction amount to the next component suction position is set.
[0056]
Specifically, in step S1-a, the mounting head 2 in a state where the component 1 is not sucked is moved to the recognition position.
In step S <b> 1-b, the image of the tool 4 is input to the image recognition unit 13 by the recognition unit 6.
[0057]
In step S1-c, the image recognition unit 13 detects the center position and attachment angle of the tool 4.
In step S1-d, the main processing unit 14 calculates the amount of deviation between the center and angle of the tool 4 before and after replacement, and stores this in the storage device 16 in step S1-e.
[0058]
In step S1-f, the component suction position is corrected based on the value stored in the storage device 16 in step S1-e.
According to this configuration, since the component can be picked up in the state where the tool and the component match from the first time after the tool is replaced, the loss of the component can be reduced without reducing the production of the equipment.
[0059]
In each of the above-described embodiments, the component 1 may be mounted at an arbitrary position on the box substrate 9 by moving the stage 8 in a direction perpendicular to the mounting head 2. Further, the recognition means 6 may move back and forth or left and right in the horizontal direction so as to be orthogonal to the mounting head 2, or the mounting head 2 may move to above the recognition means 6 to recognize the component 1. Good. The tip of the tool 4 may be the same as or smaller than the external size of the component 1.
[0060]
Note that (Embodiment 4) is a part of (Embodiment 1) to (Embodiment 3), but does not implement any of (Embodiment 1) to (Embodiment 3). It is also effective to carry out part of FIG. 12 showing the conventional mounting process.
[0061]
In each of the above embodiments, the mounting head 2 has moved to the mounting position of the box substrate 9 that receives the mounting. However, not only one of the mounting heads moves closer to and away from the other but also the box substrate 9 moves or the mounting head In the case of relative movement of the two and the box substrate 9 moving, the same can be implemented.
[0062]
In addition, although the board | substrate in each said embodiment was a box board | substrate, there exists the same effect also in the normal board | substrate which does not have an edge.
[0063]
【The invention's effect】
As described above, according to the present invention, it is possible to eliminate the damage to the substrate or the tool caused by the collision of the edge of the tool and the board by always matching the position of the tool and the part at the time of component mounting, and again. Generation can be reduced. Parts mounted by ultrasonic bonding are difficult to repair and are expensive, so there is a great economic effect due to the loss of parts.
[0064]
In addition, it is possible to prevent variation in transmission of ultrasonic energy to the component caused by the position or angle shift between the tool and the component, and also has an effect of preventing the occurrence of product defects.
[Brief description of the drawings]
FIG. 1 is a flowchart of (Embodiment 1) of the present invention. FIG. 2 is a flowchart of (Embodiment 2) of the present invention. FIG. 3 is a diagram of a component mounting apparatus according to (Embodiment 2) of the present invention. FIG. 4 is a flowchart of (Embodiment 3) of the present invention. FIG. 5 is a perspective view of the entire component mounting apparatus according to (Embodiment 3) of the present invention. FIG. 7 is a flowchart of (Embodiment 5) of the present invention. FIG. 8 is a flowchart of (Embodiment 6) of the present invention. FIG. 10 is a schematic view of the mounting portion C in FIG. 9. FIG. 11 is a perspective view of a box substrate. FIG. 12 is a flowchart of a conventional component mounting method. Figure and bottom view [Figure 14] Ultrasound on the part by tool Fig. 15 is a cross-sectional view when mounting the component. Fig. 16 is a side view and bottom view when the external size of the component is smaller than the external size of the tool tip. Fig. 17 is the external size of the component and the tool. FIG. 18 is a perspective view showing a part of a suction portion of a conventional component mounting method. FIG. 19 is a state in which a tool sucks a component. FIG. 20 is a perspective view showing a part of a mounting part of a conventional component mounting method. FIG. 21 is a mounting of a conventional component mounting method. Enlarged perspective view and cross-sectional view of the part [FIG. 22] Control block diagram of the component mounting apparatus [Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Component 2 Mounting head 3 Horn 4 Tool 5 Rotating means 6 Recognizing means 7 Display means 8 Stage 9 Box substrate 10 Temporary placement stage 11 Bump 12 Waste box 13 Image recognition part 14 Main processing part 15 Motor control part 16 Storage device 17 Ultrasound Oscillator 18 Head drive 19 Stage drive

Claims (5)

A component is picked up by a tool of the mounting head, the picked-up component is recognized by a recognition means to detect a pick-up position and pick-up angle, and a board that receives the mounting head and mounting according to the picked-up pick-up position and pick-up angle is detected. Relatively moving and pressing the component against the mounting position of the board, applying ultrasonic vibration from the horn of the mounting head and joining by metal diffusion,
When the amount of deviation obtained by recognizing the component picked up by the tool is less than the set reference value, the picked- up component is recognized by the recognizing unit, and the picking position and the picking angle are detected. Based on the detected content, correct the suction position and angle of the component when the tool holds and holds the component after mounting the component being sucked by the tool, and execute the subsequent mounting operation.
A component mounting method in which a subsequent mounting operation is stopped when a shift amount obtained by recognizing a component picked up by a tool by the recognition means is a shift amount equal to or larger than a set reference value. A component is picked up by a tool of the mounting head, the picked-up component is recognized by a recognition means to detect a pick-up position and pick-up angle, and a board that receives the mounting head and mounting according to the picked-up pick-up position and pick-up angle is detected. Relatively moving and pressing the component against the mounting position of the board, applying ultrasonic vibration from the horn of the mounting head and joining by metal diffusion,
When the amount of deviation obtained by recognizing the component picked up by the tool is less than the set reference value, the picked- up component is recognized by the recognizing unit, and the picking position and the picking angle are detected. Based on the detected content, correct the suction position and angle of the component when the tool holds and holds the component after mounting the component being sucked by the tool, and execute the subsequent mounting operation.
A component mounting method for discarding the component adsorbed by the tool when a deviation amount obtained by recognizing the component adsorbed by the tool by the recognition means is a deviation amount equal to or larger than a set reference value. A component is picked up by a tool of the mounting head, the picked-up component is recognized by a recognition means to detect a pick-up position and pick-up angle, and a board that receives the mounting head and mounting according to the picked-up pick-up position and pick-up angle is detected. Relatively moving and pressing the component against the mounting position of the board, applying ultrasonic vibration from the horn of the mounting head and joining by metal diffusion,
When the amount of deviation obtained by recognizing the component picked up by the tool is less than the set reference value, the picked- up component is recognized by the recognizing unit, and the picking position and the picking angle are detected. Based on the detected content, correct the suction position and angle of the component when the tool holds and holds the component after mounting the component being sucked by the tool, and execute the subsequent mounting operation.
If the amount of deviation obtained by recognizing the component picked up by the tool is greater than the set reference value, the component is temporarily placed on the temporary placement stage and recognized by the recognition unit. Then, the component on the temporary placement stage is re-sucked by the tool, and the tool is mounted after the component being suctioned is mounted by the tool based on the content of the suction part and the suction position and the suction angle detected by the recognition means. A component mounting method for performing mounting operation by correcting the suction position and angle of a component when the component holds the component by suction . The amount for correcting the suction position and angle of the next part is calculated from the average value of the part shift amount and angle in multiple picking operations.
The component mounting method according to claim 1 . The component is picked up by the tool of the mounting head, and the picked up component is recognized by the recognition means. The suction position and the suction angle are detected, the mounting head and the substrate to be mounted are moved relative to each other according to the detected suction position and the suction angle, and the component is pressed against the mounting position of the board. When joining by metal diffusion by applying ultrasonic vibration from the horn,
Measure the difference between the position and angle of the tool surface before and after tool replacement before picking up the part, and use it as the correction amount to the next part pick-up position.
Component mounting method.

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