JP2003249523A - Method and device for mounting components - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for mounting components, which can eliminate defective products due to broken components and substrate, when the component sucked by a tool is pressed against the substrate and then ultrasonic vibration is applied to welding by metal diffusion. <P>SOLUTION: A shift length obtained by recognizing the component sucked by the tool with a recognition means is decided in a step S6. When the shift length is smaller than the set reference value, subsequent mounting is executed in a step S7; and when it is not smaller than the set reference value, the subsequent mounting is stopped in a step S8. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component mounting method that can be suitably applied to flip chip mounting or the like in which electronic components are directly mounted on a circuit board.

[0002]

2. Description of the Related Art A conventional component mounting method will be described below with reference to examples. 2. Description of the Related Art In recent years, as electronic devices have become smaller and lighter and electronic components used in the devices have become higher in frequency, flip-chip mounting has been used in which electronic components are directly mounted and bonded on a substrate.

Above all, when a micro device such as a SAW filter or a crystal oscillator used for oscillation of a frequency of a fixed cycle is mounted on a package substrate, it is formed on the device or the package substrate by applying ultrasonic vibration to the device. The ultrasonic bonding flip-chip mounting method is often used in which bonding is performed on the package substrate via bumps.

A conventional example of a method of mounting a SAW filter by ultrasonic bonding will be described with reference to FIGS. 9, 10, 11 and 12. FIG. 9 shows a component device, the main parts of which are a supply unit A for supplying the components, a conveyance unit B of a box substrate for mounting the components, and the components taken out from the supply unit A for mounting on the box substrate. And a mounting section C that operates. Here, the box substrate refers to a substrate whose periphery is higher than the mounting surface with respect to the mounting surface. FIG. 11 schematically shows the box substrate 9.

FIG. 10 is an enlarged schematic view of the mounting portion C of FIG. The mounting portion C has a tool 4 provided with suction holes for sucking and holding the component 1, a horn 3 for transmitting ultrasonic waves generated by an ultrasonic oscillator 17 to the tool 4, and a predetermined position for holding the tool 4. Mounting head 2 for positioning the head 2, a head driving unit 18 for horizontally moving the mounting head 2 left and right, a rotating means 5 for horizontally moving the horn 3 and the tool 4, and a tool 4.
A recognition means 6 for recognizing the posture when the component 1 picks up the component 1,
A display unit 7 for displaying an image input to the image recognition unit 13 by the recognition unit 6, a stage 8 for holding a box substrate 9 on which the component 1 is mounted, a stage drive unit 19 for moving the stage 8 back and forth in a horizontal direction, and the like. It consists of

The display means 7 is arranged at a position where an operator can visually confirm while mounting the tool 4. The mounting head 2 is attached to the left and right, and the stage 8 is attached to the front and back so as to be orthogonal to each other in the horizontal direction.

Reference numeral 15 is a motor control unit for driving the head drive unit 18 and the stage drive unit 19. A main processing unit 14 controls the motor control unit 15. A storage device 16 stores data necessary for controlling the main processing unit 14.

FIG. 12 is a flowchart showing a conventional semiconductor element component mounting method. In FIG. 12, in step S1, the mounting head 2 moves to the component suction position.

In step S2, the component 1 is sucked by the tool 4. In step S3, the recognition unit 6 recognizes the component 1 sucked by the tool 4.

In step S4, the suction position and the suction angle of the component 1 are detected. In step S5, step S
The mounting head 2 and the rotating means 5 are moved to the corrected mounting position based on the result of 4.

In step S6, the box substrate 9 is mounted at the mounting position. In step S7, ultrasonic vibration is applied from the horn 3 with the component 1 mounted on the box substrate 9. Here, as shown in the perspective view and bottom view of FIG. 13, the component 1 has bumps 11 formed on the bottom, and when ultrasonic vibration is applied from the horn 3 in step S7,
The applied ultrasonic vibration is transmitted to the component 1 via the tool 4 and further to the bumps 11 of the component 1 via the component,
The bumps 11 and the lands of the box substrate 9 are joined by metal diffusion. FIG. 14 is an enlarged view when an ultrasonic wave is applied to the component 1 by the tool 4, and FIG. 15 is a sectional view when the component is mounted.

The tip of the tool 4 is often the same as the outer size of the component 1. This is because when the tip portion is smaller than the outer size of the component 1, it is difficult for ultrasonic waves to propagate to the entire component 1 and the bonding strength is reduced.

This is because when the tip of the tool 4 is larger than the outer size of the component 1, the component 1 is damaged due to a local load applied to the component 1 due to the displacement of the component suction position.
Specifically, as shown in the side view and the bottom view of FIG. 16, the outer size of the component 1 is smaller than the outer size of the tip of the tool 4, and the tip of the tool 4 protrudes beyond the component 1, When sound waves are applied, the tool 4 is vibrated.
This is because the suction surface of the component 1 is worn to form a recess having substantially the same shape as the component 1, and the component 1 is damaged due to a local load applied to the component 1 due to the displacement of the component suction position.

Therefore, when the component 1 is picked up, as shown in the side view and bottom view of FIG. It becomes necessary to adsorb.

[0015]

However, the center position of the tool 4 varies because the tool 4 is regularly replaced due to wear or product type switching. Therefore, even if the parts are moved according to the data and the parts are picked up, the center of the part 1 and the center of the tool 4 and the pick-up angle of the part 1 and the mounting angle of the tool 4 do not easily match. It will stick out.

For example, the component mounting space is 1.7 mm
Since the external shape of the component 1 is 1.3 mm × 0.8 mm and there is almost no dimensional tolerance with respect to the box substrate 9 having a size of × 1.2 mm, as shown in FIGS. When the suction state in which a part of the component 1 protrudes from the outer shape of the tool 4 because the suction angle of the component 1 and the attachment angle of the tool 4 do not coincide with each other, as shown in FIGS. When mounting the components on the board 9, there is a problem that the tip of the tool 4 collides with the edge of the box board 9 to damage the tool 4 or the box board 9, resulting in product destruction.

The present invention solves the above-mentioned conventional problems, and an object of the present invention is to provide a component mounting method capable of eliminating product defects due to destruction of components and substrates.

[0018]

In order to solve the above problems, in the component mounting method of the present invention, after the component is sucked and held, the recognizing means recognizes the sucked component, and the suction position and the suction angle of the component are determined. To detect. At this time, when the positional deviation and the rotational deviation between the tool and the component are equal to or more than a certain amount, the component is once placed on the temporary placement stage and then re-sucked after recognition by the recognition means. Then, the mounting head, the rotating means, and the stage are corrected and moved based on the recognition result of the component by the recognition means, and the component is mounted on the box substrate. It also has a function of reflecting the correction amount at this time on the next component suction position.

It also has a function of detecting the mounting position and angle of the tool surface before picking up the component and reflecting the detected tool mounting position and angle in the picking position of the component.

With such a structure, when the parts are picked up, the parts can be picked up with the center of the parts and the center of the tool and the mounting angle of the tool and the picking angle of the parts matched. It is possible to eliminate tool and board breakage due to collision between the tip portion and the edge of the box board. And by matching the center and angle of the parts and the tool, ultrasonic energy can be transmitted to the parts without loss when mounting the parts, so that the joint strength between the parts and the box board is guaranteed and it is possible to prevent the occurrence of product defects. Become.

The component mounting method according to claim 1 of the present invention is
A component of the mounting head is picked up, the picked-up component is recognized by the recognition means to detect the suction position and the suction angle, and the mounting head and the substrate to be mounted are mounted according to the detected suction position and suction angle. When the components are moved relative to each other and pressed against the mounting position on the substrate, ultrasonic vibration is applied from the horn of the mounting head to bond by metal diffusion, and the component adsorbed by the tool is recognized and obtained by the recognition means. If the deviation amount is less than the set reference value, the subsequent mounting operation is executed, and if it is more than the set reference value, the subsequent mounting operation is stopped. And

The component mounting method according to claim 2 of the present invention is
A component of the mounting head is picked up, the picked-up component is recognized by the recognition means to detect the suction position and the suction angle, and the mounting head and the substrate to be mounted are mounted according to the detected suction position and suction angle. When the components are moved relative to each other and pressed against the mounting position on the substrate, ultrasonic vibration is applied from the horn of the mounting head to bond by metal diffusion, and the component adsorbed by the tool is recognized and obtained by the recognition means. If the deviation amount is less than the set reference value, the subsequent mounting operation is executed, and if the deviation amount is more than the set reference value, the component sucked by the tool is discarded. It is characterized by

The component mounting method according to claim 3 of the present invention is
A component of the mounting head is picked up, the picked-up component is recognized by the recognition means to detect the suction position and the suction angle, and the mounting head and the substrate to be mounted are mounted according to the detected suction position and suction angle. When the components are moved relative to each other and pressed against the mounting position on the substrate, ultrasonic vibration is applied from the horn of the mounting head to bond by metal diffusion, and the component adsorbed by the tool is recognized and obtained by the recognition means. If the deviation amount is less than the set reference value, the subsequent mounting operation is performed.If the deviation amount is more than the set reference value, the component is temporarily placed on the temporary placement stage, It is characterized in that the recognition unit recognizes a component, and the component on the temporary placement stage is re-sucked by the tool to execute a mounting operation.

The component mounting method according to claim 4 of the present invention comprises:
In any one of Claims 1 to 3, the tool sucks the component after mounting the component being sucked by the tool based on the content of the suction position and the suction angle detected by recognizing the sucked component by the recognition unit. It is characterized in that the suction position and the angle of the component when it is held are corrected.

The component mounting method according to claim 5 of the present invention comprises:
According to a fourth aspect of the present invention, the correction amount of the suction position and the angle of the next component is calculated from the average value of the displacement amount and the angle of the component in a plurality of suction operations.

The component mounting method according to claim 6 of the present invention is
A component of the mounting head is picked up, the picked-up component is recognized by the recognition means to detect the suction position and the suction angle, and the mounting head and the substrate to be mounted are mounted according to the detected suction position and suction angle. When the parts are moved relative to each other and pressed against the mounting position of the board, ultrasonic vibration is applied from the horn of the mounting head to bond by metal diffusion, before the parts are picked up and before and after the tools are replaced It is characterized in that the difference between the surface position and the angle is measured and used as a correction amount for the next component suction position.

The component mounting apparatus according to claim 7 of the present invention is
A component of the mounting head is picked up, the picked-up component is recognized by the recognition means to detect the suction position and the suction angle, and the mounting head and the substrate to be mounted are mounted according to the detected suction position and suction angle. A component mounting apparatus that relatively moves and presses the component at a mounting position on the substrate, applies ultrasonic vibration from a horn of the mounting head to bond the components by metal diffusion, and a head driving device that moves the mounting head, and It is characterized in that the main processing unit for driving the stage drive device for moving the substrate is configured to execute the component mounting method according to any one of claims 1 to 6.

[0028]

BEST MODE FOR CARRYING OUT THE INVENTION The component mounting method of the present invention will be described below based on each specific embodiment. Since the mechanical structure of the transporting means and various actuators of the component mounting apparatus is the same as that of the conventional example shown in FIGS. 9 and 10, the same reference numerals are used for the description. The present invention is different from the conventional one in the configuration of the operation program in the mounting process.

(Embodiment 1) FIG. 22 is a block diagram showing the configuration of the component mounting apparatus shown in FIGS. 9 and 10. Reference numeral 20 is an operation means for inputting various settings and operation modes to the main processing section 14. Whereas the part related to the implementation program of the conventional main processing unit 14 is configured as shown in FIG. 12,
In the first embodiment, a part of this mounting program is configured as shown in FIG.

The main processing unit 14 of this (Embodiment 1)
In step S1, the mounting head 2 picks up the component 1. In step S2, the mounting head 2 is moved to the recognition position of the recognition means 6.

In step S3, the recognition means 6 inputs the image of the component 1 into the image recognition section 13. In step S4,
The image recognition unit 13 detects the center position and the suction angle of the component 1 based on the image of the recognition unit 6.

In step S5, the "deviation amount" between the rotation center of the tool 4 and the center of the component 1 is calculated. Step S6
Then, the "deviation amount" calculated in step S5 is compared with the "setting reference value" to determine the magnitude of the "deviation amount".

If the "deviation amount" is less than the "setting reference value" in step S6, the next step in step S7, specifically, the routine of step S4 and subsequent steps in FIG. 12 is executed.

If the "deviation amount" is equal to or greater than the "setting reference value" in step S6, the subsequent mounting operation is stopped in step S8. Specifically, the routine of step S4 and subsequent steps in FIG. 12 is executed. Do not execute.

As described above, when the "deviation amount" between the center of the tool 4 and the center of the component 1 is large, the equipment is automatically stopped in step S8, so that the tip of the tool 4 and the edge of the box substrate 9 are separated. The destruction of the tool 4 and the box substrate 9 due to the collision can be eliminated.

(Embodiment 2) In (Embodiment 1), when the "deviation amount" is equal to or larger than the "setting reference value", the subsequent mounting operation is stopped in step S8. In 2), as shown in FIG. 2, in step S6, if the “deviation amount” is equal to or larger than the “setting reference value”, step S9 is executed to execute the parts disposal box 12 shown in FIG.
The mounting head 2 is moved upward. Here, the component disposal box 12 is fixed at an arbitrary position on the left and right horizontal straight lines on which the mounting head 2 is movable.

The component disposal box 12 may be fixed to the stage drive unit 19. After the movement of the mounting head 2 is completed, the component 1 is discarded in the component discard box 12 in step S10.

After the disposal is completed, in step S11, the mounting head 2 moves to the suction position of the next component and suctions the next component. With this configuration, it is possible to prevent the occurrence of mounting deviation and prevent the productivity from decreasing by not stopping the operation of the equipment.

Further, if the discarding operation is not performed more than the preset number of times, it is possible to prevent the wasteful discarding operation due to the abnormality of the equipment. In addition, when the parts are discarded, if they are disposed in the aligned position, they can be reused as the supply parts, so that the economic effect is great.

Incidentally, steps S1 to S7 in FIG.
Is the same as in FIG. (Embodiment 3) FIG. 4 shows a flowchart of (Embodiment 3) of the present invention. Steps S1 to S7 are the same as Steps S1 to S7 of (Embodiment 1).

When it is determined that the "deviation amount" is equal to or larger than the "setting reference value" in step S6 of this (Embodiment 3), steps S12 to S18 are executed and the process returns to step S2. The difference is that it is configured in.

In step S12, the mounting head 2 is moved onto the temporary placement stage 10 shown in FIG. Step S
At 13, the component 1 is temporarily placed on the temporary placement stage 10 fixed at an arbitrary position on the left and right horizontal straight lines on which the recognition means 6 can move.

In step S14, the temporary placement stage 10
The recognition means 6 is moved upward. In addition, temporary placement stage 1
0 may be fixed to the stage drive unit 19.
Alternatively, the recognition means 6 may be configured to be horizontally movable in a plane.

In step S15, the image of the component 1 placed on the temporary placement stage is input to the image recognition section 13. In step S16, the current position and angle of the component 1 are detected.

In step S17, the main processing unit 14 calculates a correction amount for matching the center and angle of the tool 4 of the mounting head 2 and the component 1, and the motor control unit 15 determines the correction amount of the mounting head 2 based on the correction amount. Correct the position.

In step S18, when the position correction in step S17 is completed, the component 1 is picked up, and the processes of step S2 and thereafter are repeated. In this embodiment, a component that could not be properly picked up is once placed on the temporary placement stage 10 and then re-chucked to bring it into a correct picking state, thus reducing the loss due to the discarding of parts up to now. be able to.

(Embodiment 4) FIG. 6 shows (Embodiment 4) of the present invention. In this (Embodiment 4), between Step S5 and Step S6 in (Embodiment 1) to (Embodiment 3), steps S5-a and S5-b
Is added.

More specifically, the image recognition unit 1 recognizes the image of the component 1 attracted by the mounting head 2 in step S3 by the recognition unit 6.
3, and the image recognition unit 13 detects the current position and angle of the component 1 in step S4.

Then, in step S5, the main processing section 14 calculates the horizontal displacement amount A of the tool 4 and the component 1 in the horizontal direction, the horizontal displacement amount B of the front and rear in the horizontal direction, and the angular displacement amount R, and the step S5-a. To be stored in the storage device 16.

In step S5-b, the main processing unit 14 calculates a correction amount based on the positional deviation amount A, the positional deviation amount B, and the angular deviation amount R, and the suction of the next component is performed based on the calculated correction amount. Feedback on position and angle.

According to this configuration, since the component can be sucked in the correct posture by always correcting the suction position of the component, the loss due to the disposal of the component can be reduced, and unnecessary operation for correcting the suction position is not necessary.

(Embodiment 5) FIG. 7 shows (Embodiment 5) of the present invention, and step S5-b of (Embodiment 4).
A concrete example of step S5-b1 and step S5-b2 is shown.

More specifically, the image recognizing unit 1 recognizes the image of the component 1 attracted by the mounting head 2 in step S3 by the recognizing means 6.
3, and the image recognition unit 13 detects the current position and angle of the component 1 in step S4. Then, in step S5, the main processing unit 14 calculates the lateral displacement amount A between the tool 4 and the component 1 in the horizontal direction, the positional displacement amount B in the horizontal direction and the angular displacement amount R, and the storage device in step S5-a. Store in 16. Then, in step S5-b1, the deviation amounts A, B between the tool 4 and the component 1 stored in the storage device 16 in the plurality of mounting steps up to that time including this time,
The average R is calculated by the main processing unit 14. Then, based on the value, the main processing unit 1 in step S5-b2.
The correction amount is calculated in step 4 and is fed back to the suction position and angle of the next component.

According to this structure, the feedback amount of the position and the angle when the next component is sucked is calculated based on the shift amount when the component is picked up a plurality of times, so that the validity of the feedback value can be improved.

(Embodiment 6) FIG. 8 shows (Embodiment 6) of the present invention. This (Embodiment 6) is a component mounting apparatus configured to implement any of (Embodiment 1) to (Embodiment 5), Step S1-a executed before Step S1, Step S1-a S1-b, step S1-c, step S1-d, step S1-e,
The routine of step S1-f is executed to measure the difference between the position and the angle of the tool surface before and after tool exchange before and after the component is picked up, and set as the correction amount to the next component picked-up position.

More specifically, in step S1-a, the component 1
The mounting head 2 in the state of not adsorbing is moved to the recognition position. In step S1-b, the recognition means 6 causes the tool 4
Image is input to the image recognition unit 13.

In step S1-c, the image recognition unit 13 detects the center position and attachment angle of the tool 4. In step S1-d, the main processing unit 14 calculates the amount of deviation between the center and the angle of the tool 4 before and after the replacement, and stores this in the storage device 16 in step S1-e.

In step S1-f, step S1-e
Then, the component suction position is corrected based on the value stored in the storage device 16. According to this configuration, since the parts can be sucked in a state where the tools and the parts match with each other even after the tool is replaced, it is possible to reduce the loss of the parts without lowering the production of the equipment.

In each of the above embodiments, the stage 1 may be moved in the direction perpendicular to the mounting head 2 so that the component 1 can be mounted at an arbitrary position on the box substrate 9. Further, the recognizing means 6 may move forward and backward or left and right in a form orthogonal to the mounting head 2 in the horizontal direction, or the mounting head 2 may move above the recognizing means 6 to recognize the component 1. Good. The tip of the tool 4 may be the same as or smaller than the outer size of the component 1.

Although (Embodiment 4) is a part of (Embodiment 1) to (Embodiment 3), any one of (Embodiment 1) to (Embodiment 3) It is also effective to carry out the conventional mounting process without performing it in a part of FIG.

In each of the above embodiments, the mounting head 2 has moved to the mounting position of the box substrate 9 to be mounted. However, not only one moves closer to and away from the other, but the box substrate 9 also moves. Alternatively, the same can be applied to the case where the mounting head 2 and the box substrate 9 are both moved relative to each other.

Although the substrate in each of the above embodiments is a box substrate, the same effect can be obtained even with a normal substrate having no edge.

[0063]

As described above, according to the present invention, it is possible to eliminate the damage to the board or the tool caused by the collision between the edge of the tool and the board by always aligning the positions of the tool and the parts and again when mounting the parts. It is possible to reduce the occurrence of product defects. Since the components mounted by ultrasonic bonding are difficult to repair and are expensive, the loss of the components is eliminated, and the economic effect is great.

Further, it is possible to prevent the transmission variation of the ultrasonic energy to the parts caused by the positional deviation or the angular deviation between the tool and the parts, and it is possible to prevent the occurrence of product defects.

[Brief description of drawings]

FIG. 1 is a flowchart of (Embodiment 1) of the present invention.

FIG. 2 is a flowchart of (Embodiment 2) of the present invention.

FIG. 3 is a perspective view showing an entire component mounting apparatus according to (Embodiment 2) of the present invention.

FIG. 4 is a flowchart of (Embodiment 3) of the present invention.

FIG. 5 is a perspective view showing an entire component mounting apparatus according to (Embodiment 3) of the present invention.

FIG. 6 is a flowchart of (Embodiment 4) of the present invention.

FIG. 7 is a flowchart of (Embodiment 5) of the present invention.

FIG. 8 is a flow chart of (Embodiment 6) of the present invention.

FIG. 9 is a perspective view showing the entire component mounting apparatus.

FIG. 10 is a schematic diagram of the mounting portion C of FIG.

FIG. 11 is a perspective view of a box substrate.

FIG. 12 is a flowchart of a conventional component mounting method.

FIG. 13 is an enlarged perspective view and bottom view of mounted components.

FIG. 14 is an enlarged view when ultrasonic waves are applied to a component by a tool.

FIG. 15 is a cross-sectional view when components are mounted

FIG. 16 is a side view and a bottom view when the outer size of the component is smaller than the outer size of the tool tip.

FIG. 17 is a side view and a bottom view in which the external size of the component is the same as the size of the tip of the tool and the center and the angle match.

FIG. 18 is a perspective view showing a part of suction points in a conventional component mounting method.

FIG. 19 is an explanatory diagram of a screen in which a state in which the tool picks up a component is input to the image recognition unit by the recognition unit and displayed by the display unit.

FIG. 20 is a perspective view showing a part of a mounting portion of a conventional component mounting method.

FIG. 21 is an enlarged perspective view and a sectional view of a mounting location of a conventional component mounting method.

FIG. 22 is a control block diagram of the component mounting apparatus.

[Explanation of symbols]

1 part 2 mounting head 3 horns 4 tools 5 rotation means 6 recognition means 7 Display means 8 stages 9 box board 10 Temporary stage 11 bumps 12 waste box 13 Image recognition unit 14 Main processing unit 15 Motor control unit 16 storage 17 Ultrasonic oscillator 18 head drive 19 Stage drive

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Shuichi Hirata             1006 Kadoma, Kadoma-shi, Osaka Matsushita Electric             Sangyo Co., Ltd. F-term (reference) 5F044 PP17

Claims (7)

[Claims] 1. A tool of a mounting head sucks a component, a picked-up component is recognized by a recognition means, a suction position and a suction angle are detected, and the mounting head and the mounting head are detected according to the detected suction position and suction angle. When the board to be mounted is relatively moved to press the part against the mounting position of the board, ultrasonic vibration is applied from the horn of the mounting head to join the parts by metal diffusion, and the parts adsorbed by the tool are recognized by the recognition means. If the amount of deviation obtained by recognizing is less than the set reference value, the subsequent mounting operation is executed, and if it is more than the set reference value, the subsequent mounting operation is performed. Component mounting method to stop. 2. A component of a mounting head is picked up by a tool, a picked-up component is recognized by a recognition means, a suction position and a suction angle are detected, and the mounting head and the mounting head are detected according to the detected suction position and suction angle. When the board to be mounted is relatively moved to press the part against the mounting position of the board, ultrasonic vibration is applied from the horn of the mounting head to join the parts by metal diffusion, and the parts adsorbed by the tool are recognized by the recognition means. If the amount of deviation obtained by recognizing in step 3 is less than the set reference value, the subsequent mounting operation is executed, and if it is more than the set reference value, the tool has attracted A component mounting method for discarding the component. 3. A component of a mounting head is picked up by a tool, a picked-up component is recognized by a recognition means, a suction position and a suction angle are detected, and the mounting head and the mounting head are detected according to the detected suction position and suction angle. When the board to be mounted is relatively moved to press the part against the mounting position of the board, ultrasonic vibration is applied from the horn of the mounting head to join the parts by metal diffusion, and the parts adsorbed by the tool are recognized by the recognition means. If the deviation amount obtained by recognizing in step 1 is less than the set reference value, the subsequent mounting operation is executed, and if it is more than the set reference value, the parts are temporarily placed. A component mounting method in which the component is once placed on a stage, the component is recognized by the recognition unit, and the component on the temporary placement stage is re-sucked by the tool to execute a mounting operation. 4. Based on the content of the picked-up position and picked-up angle detected by recognizing the picked-up parts by the recognition means,
The component mounting method according to any one of claims 1 to 3, wherein the component suction position and the angle when the tool suction-holds the component after mounting the component being sucked by the tool are corrected. 5. The component mounting method according to claim 4, wherein the amount for correcting the suction position and the angle of the next component is calculated from the average value of the displacement amount and the angle of the component in a plurality of suction operations. 6. A component of a mounting head is picked up by a tool, a picked-up component is recognized by a recognition means, a suction position and a suction angle are detected, and the mounting head and the mounting head are detected according to the detected suction position and suction angle. When relatively moving the board to be mounted and pressing the part to the mounting position of the board, applying ultrasonic vibration from the horn of the mounting head to join by metal diffusion, before picking up the part and before exchanging the tool And the component mounting method in which the difference between the position and angle of the tool surface after replacement is measured and used as the correction amount for the next component suction position. 7. A component of a mounting head is picked up by a tool, a picked-up component is recognized by a recognition means, a suction position and a suction angle are detected, and the mounting head is detected in accordance with the detected suction position and suction angle. A component mounting apparatus that relatively moves a substrate to be mounted, presses the component at a mounting position of the substrate, applies ultrasonic vibration from a horn of the mounting head to bond by metal diffusion, and moves the mounting head. A component mounting apparatus configured to execute a component mounting method according to any one of claims 1 to 6, wherein a main processing unit that drives a head driving device that drives the substrate and a stage driving device that moves the substrate.