JP3753629B2 - Light emitting device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a light emitting device.
[0002]
[Prior art]
As a conventional light emitting device, for example, there has been a light emitting device as disclosed in JP-A-1-283883. 6A, 6B, and 6C, reference numeral 1 denotes a reflective case (package) made of a thermoplastic resin having plating properties, and a recess 2 is formed on the surface thereof.
[0003]
Further, the portions indicated by 3, 4 and 5 are subjected to Cu / Ni / Ag plating, and the platings 3, 4 and 5 are connected to 6 and 7 electrode terminal terminals through through holes.
[0004]
In the plating land 3, a light emitting diode chip 8 as a light emitting element is fixed by an Ag paste 9 and connected to the plating land 4 by an Au wire 11.
[0005]
The underlying thermoplastic resin is exposed between the plating lands 3 and 4 with a width of about 0.3 mm. This portion is a three-dimensional insulation pattern.
[0006]
The recess 2 of the reflective case 1 is sealed with a transparent epoxy resin 12 for protecting the light emitting diode and improving the light extraction efficiency.
[0007]
In use, the LED chip 8 emits light by flowing a current of several tens of mA from the electrode plating terminals 6 to 7, and operates as a visible light emitting lamp.
[0008]
[Problems to be solved by the invention]
In the conventional light emitting device, the electrical connection between the light emitting diode chip 8 and the back electrode plating terminals 6, 7 is performed through the three-dimensional wiring plated layers 3, 4, 5 formed on the surface of the reflection case 1. Is called. In order to form three-dimensional wiring by plating, the plating layers 3, 4 and 5 are plated on the entire surface, then masked with a resist on a necessary pattern forming portion, and a pattern is left by sequentially performing a photolithography process and an etching process. In general, any one of methods such as removing plating of unnecessary portions, that is, portions serving as insulating lines, and making only a pattern forming portion ready for plating by applying a catalyst or the like is employed. However, in any method, in order to form a pattern three-dimensionally, masking must be performed three-dimensionally, and advanced techniques are required.
[0009]
In view of the above problems, an object of the present invention is to provide a light emitting device capable of simplifying a manufacturing process.
[0010]
[Means for Solving the Problems]
A light-emitting device according to the present invention includes a light-emitting element, a package, a land portion that is located on an upper surface of the package and is connected to an electrode of the light-emitting element, and a back terminal that is located on the back surface of the package and is used for external connection. A light-emitting device comprising: a light-transmitting resin that seals the light-emitting element;
The above-described object is achieved by providing electrical continuity between the land portion and the back terminal in a package.
[0011]
A light-emitting device according to the present invention includes a light-emitting element, a package, a land portion that is located on an upper surface of the package and is connected to an electrode of the light-emitting element, and a back terminal that is located on the back surface of the package and is used for external connection. A light-emitting device comprising: a light-transmitting resin that seals the light-emitting element;
The package includes an insulating resin body, and a metal member whose upper surface forms the land portion and whose rear surface forms the back terminal,
The object is achieved by the metal member being exposed and embedded in the insulating resin body.
[0012]
The light emitting device according to the present invention comprises:
A light emitting element; a package; a land portion located on an upper surface of the package and connected to an electrode of the light emitting element; a back surface terminal located on the back surface of the package for external connection; and the light emitting element sealed. A light-emitting device comprising:
The package includes an insulating resin body, and a metal member whose upper surface forms the land portion and whose rear surface forms the back terminal,
The said object is achieved by the said metal member and the said light emitting element and the said back surface terminal having comprised electrical continuity.
[0013]
The light emitting device according to the present invention is any one of the above light emitting devices.
The package includes a plurality of metal members including a land portion and a back terminal,
At least one of the plurality of land portions is connected to the light emitting element through a bonding wire to achieve the above object.
[0014]
The light emitting device according to the present invention achieves the above object by at least a metal member including a land portion connected to the light emitting element by a bonding wire being exposed and embedded in the package.
[0015]
The light emitting device according to the present invention is any one of the above light emitting devices.
An electrode is formed only on one surface of the light emitting element, and the electrode and the land portion are connected via a conductive bump, thereby achieving the above object.
[0016]
The light emitting device according to the present invention comprises:
A light emitting element; a package; a plurality of land portions located on an upper surface of the package and connected to electrodes of the light emitting element; a plurality of back surface terminals located on the back surface of the package and used for external connection; and the light emitting element In a light emitting device comprising a translucent resin that seals
The light emitting element includes a surface on which a plurality of electrodes are arranged in parallel and a surface on which light is emitted facing the surface, and the plurality of electrodes are fixed across the plurality of land portions. The plurality of land portions and the plurality of back terminals are electrically connected to achieve the above object.
[0017]
The light emitting device according to the present invention is any one of the above light emitting devices.
The object is achieved by the light emitting element mounting surface of the package being rectangular.
[0018]
In the present invention, as shown in FIG. 1, a first land portion 27 on which a light emitting element 22 is mounted and a second land portion 31 connected to the light emitting element 22 via a bonding wire 29 are formed on the upper surface of the package 21. The back surface terminals 28 and 32 for external connection are formed on the back surface of the package 21, the light emitting element 22 is mounted on the first land portion 27, and the light emitting element 22 and the second land portion 31 are connected by a bonding wire 29. In the light emitting device in which the light emitting element 22 and the bonding wire 29 are sealed with a translucent resin 23, the package 21 has an upper surface as the first land portion 27 and a back surface as the first back surface terminal 28. A first conductive resin body 24 having a high conductivity, a second conductive resin body 25 having a second land portion 31 on the upper surface and a second rear surface terminal 32 on the back surface, and the two conductive trees. The insulating resin body 26 is interposed between the bodies 24 and 25, and both the conductive resin bodies 24 and 25 and the insulating resin body 26 are integrally formed (two-color molding) at the time of mold molding. Good.
[0019]
2A to 2C, in the present invention, in the light emitting device described above, a recess 41 is formed on the upper surface of the package 21, and the first land portion 27 and the second land portion 31 are formed in the recess 41. The recess 41 may be sealed with a translucent resin 23 after the light emitting element 22 is mounted and connected.
[0020]
In the present invention, a metal film 33 for connection may be formed on the first land portion 27, the second land portion 31, and the back terminals 28 and 32.
[0021]
In the present invention, as shown in FIG. 3, a first land portion 27 for mounting the light emitting element 22 and a second land portion 31 connected to the light emitting element 22 via a bonding wire 29 are formed on the upper surface of the package 21. The back surface terminals 28 and 32 for external connection are formed on the back surface of the package 21, the light emitting element 22 is mounted on the first land portion 27, and the light emitting element 22 and the second land portion 31 are connected by a bonding wire 29. In the light emitting device in which the light emitting element 22 and the bonding wire 29 are sealed with a translucent resin 23, the package 21 has an upper surface as the first land portion 27 and a back surface as the first back surface terminal 28. Between the two resin bodies 24, 25, and the second resin body 25 having the second land portion 31 on the top surface and the second back terminal 32 formed on the back surface. The resin body 24, 25, 26 is integrally formed at the time of mold molding, and the metal member 45 for connecting to the bonding wire 29 is exposed to the second resin body 25. It may be embedded.
[0022]
In the present invention, as shown in FIGS. 4 and 5, the first land portion 27 connected to the first electrode 46 of the light emitting element 22 and the second electrode 47 connected to the second electrode 47 of the light emitting element 22 are formed on the upper surface of the package 21. The land portion 31 is formed, the back terminals 28 and 32 for external connection are formed on the back surface of the package 21, the light emitting element 22 is mounted on the first land portion 27, and the light emitting element 22 and the second land portion 31 are formed. In the light emitting device in which the light emitting element 22 and the bonding wire 29 are sealed with a translucent resin 23, the package 21 has a first land portion 27 on the top surface and a back surface. Is a highly conductive first conductive resin body 24 having a first back terminal 28, and a high conductive second conductive resin body having a top surface as a second land portion 31 and a back surface as a second back terminal 32. 25 and both An insulating resin body 26 interposed between the resin bodies 24 and 25. The conductive resin bodies 24 and 25 and the insulating resin body 26 are integrally formed at the time of molding, and the first electrode 46 and the second electrode 47 are arranged in parallel on the back surface of the light emitting element 22, and the electrodes 46, 47 and the land portions 27, 31 are electrically conductively formed in advance on one of the electrodes 46, 47 and the land portions 27, 31. It may be connected via bumps 57.
[0023]
In the present invention, the highly conductive first conductive resin body 24 whose upper surface is the first land portion 27 and whose rear surface is the first back surface terminal 28, the upper surface is the second land portion 31, and the rear surface is the second The highly conductive second conductive resin body 25 that is the back terminal 32 and the insulating resin body 26 interposed therebetween are integrally molded to form the package 21, and the upper surface of the package 21 The light emitting element 22 is mounted so that the first electrode 46 is connected to the first land portion 27 and the second electrode 47 is connected to the second land portion 31, and the periphery of the light emitting element 22 is attached to the translucent resin 23. And may be resin-sealed.
[0024]
The operation of the present invention will be described below.
[0025]
As described above, the highly conductive first conductive resin body 24 whose upper surface is the first land portion 27 and whose back surface is the first back surface terminal 28, and whose upper surface is the second land portion 31 and whose back surface is the second land surface. The highly conductive second conductive resin body 25 which is the back terminal 32 and the insulating resin body 26 interposed therebetween are, for example, integrally molded (two-color molding) to form the package 21. The light emitting element 22 is mounted on the upper surface of the package 21 so that the first electrode 46 is connected to the first land portion 27 and the second electrode 47 is connected to the second land portion 31. Is sealed with a translucent resin 23.
[0026]
Then, in order to secure the electrical connection between the light emitting element 22 on the upper surface and the rear surface terminals 28 and 32 on the rear surface as in the prior art, it is not necessary to provide a three-dimensional wiring on the surface of the package through hole or the like, thereby simplifying the process. Simplified.
[0027]
As described above, the metal member 45 can be electrically connected to the light emitting element 22 on the top surface and the back terminals 28 and 32 on the back surface only by inserting and molding the metal member 45 when the package 21 is molded. As a result, the bonding wire can be easily attached (bonding property) without performing metal plating or the like on the bonding land 31.
[0028]
As described above, since the light emitting element 22 and the land portions 27 and 31 are connected using the conductive bumps 57, connection using a bonding wire or the like is not necessary, and there is no occurrence of defects such as wire disconnection, and product reliability. Improves.
[0029]
DETAILED DESCRIPTION OF THE INVENTION
(First Example)
FIG. 1 is a sectional view showing a light emitting device according to a first embodiment of the present invention. In the light emitting device of this embodiment, a light emitting element 22 is mounted and connected on an upper surface of a resin substrate 21 as a package, and the periphery of the light emitting element 22 is transparent for the purpose of protecting the light emitting element 22 and improving external quantum efficiency. The resin 23 is sealed with resin.
[0030]
The resin substrate 21 includes a first conductive resin body 24 made of a highly conductive resin, a second conductive resin body 25, and an insulating resin body 26 interposed between the two conductive resin bodies 24, 25. It is integrally formed (two-color molding) during mold molding.
[0031]
The first conductive resin body 24 and the second conductive resin body 25 are made of a conductive material such as metal powder or carbon mixed with a resin, or a resin material such as polypyrrole resin or polyaniline. What has electroconductivity itself is used. The resistivity of the conductive resin bodies 24 and 25 is preferably 1 Ω · cm or less in consideration of the drive current of the light emitting element 22 and the like.
[0032]
An upper surface of the first conductive resin body 24 is a first land portion (mounting land portion) 27 on which the light emitting element 22 is mounted. The back surface of the first conductive resin body 24 is a first back terminal 28 for external connection.
[0033]
The upper surface of the second conductive resin body 25 is a second land portion (connection land portion) 31 connected to the light emitting element 22 via a bonding wire 29 such as Au. The back surface of the second conductive resin body 25 serves as a second back surface terminal 32 for external connection.
[0034]
The land portions 27 and 31 and the back terminals 28 and 32 are subjected to Ni / Au plating 33 as a metal film. The Ni / Au plating 33 is used as a soldering pad when mounted on another mounting board.
[0035]
The insulating resin body 26 is made of a functional polymer material (engineering plastic) having good processability and solder heat resistance, such as a liquid crystal polymer and polyether sulfone.
[0036]
The resin substrate 21 is collectively formed on a multi-piece substrate, and after mounting and sealing the light emitting element 22 as described later, the resin substrate 21 is divided into individual units using a scribe method or a dicing method.
[0037]
The light emitting element 22 is fixed to the first land portion 27 with Ag paste and connected to the second land portion 31 via a bonding wire 29.
[0038]
As the translucent resin 23, for example, a transparent epoxy resin is used.
[0039]
The light emitting device having the above configuration is manufactured as follows.
[0040]
First, the resin substrates 21 are collectively formed on a multi-piece substrate.
[0041]
At this time, first, the first conductive resin body 24 and the second conductive resin body 25, that is, a portion to be an electric circuit is molded using a highly conductive resin (primary molding).
[0042]
Next, the insulating resin body 26 is molded using this portion as the insert side (secondary molding), and the resin substrate 21 is integrally formed. At this time, the land portions 27 and 31 on the top surface and the back terminals 28 and 32 on the back surface of the conductive resin bodies 24 and 25 are exposed on the respective surfaces.
[0043]
Thereafter, Ni / Au plating 33 is applied to the land portions 27 and 31 and the back terminals 28 and 32.
[0044]
Then, the light emitting element 22 is fixed to the first land portion 27 with Ag paste, and is connected to the second land portion 31 via the bonding wire 29.
[0045]
Thereafter, the periphery of the light emitting element 22 and the bonding wire 29 is resin-sealed with a translucent resin 23.
[0046]
Thereafter, the resin substrate 21 is divided into individual units using a scribing method or a dicing method, whereby the light emitting device is completed.
[0047]
The light emitting device created through the above steps can make electrical connection between the light emitting element 22 and the back terminals 28 and 32 via the conductive resin bodies 24. Then, in order to ensure the electrical connection between each land portion (plating land) for connecting the light emitting element 22 and the back surface terminal (plating terminal for electrode) as in the prior art, a through of the resin substrate (reflection case) is provided. There is no need to perform three-dimensional wiring through holes or the like. Therefore, the manufacturing process is simplified and simplified.
[0048]
Further, since no through hole is required, molding is easy and the mold shape can be simplified. Therefore, the mold cost is reduced.
[0049]
Further, since the circuit wiring is not required, the overall size is reduced.
[0050]
(Second embodiment)
2A and 2B are views showing a light emitting device according to a second embodiment of the present invention. FIG. 2A is a top view, FIG. 2B is a cross-sectional view, and FIG. In FIG. 2, 21 is a resin substrate as a package, and a recess 41 is formed on the upper surface thereof.
[0051]
The resin substrate 21 includes a bottom surface portion 42 that forms the bottom wall of the concave portion 41 and a peripheral portion 43 that forms the side wall of the concave portion 41.
[0052]
As in the first embodiment, the bottom surface portion 42 includes a first conductive resin body 24, a second conductive resin body 25, and an insulating resin body 26 interposed between the conductive resin bodies 24 and 25. These are integrally formed (two-color molding) during mold molding.
[0053]
The peripheral portion 43 is made of an insulating resin. The peripheral portion 43 is integrally formed on the bottom surface portion 42 by a two-color molding method at the time of mold molding.
[0054]
Ni / Au plating 33 is applied to the land portions 27 and 31 on the upper surface of the conductive resin bodies 24 and 25 and the back terminals 28 and 32 on the back surface.
[0055]
The light emitting element 22 is fixed to the first land portion 27 with an Ag paste 44, and the upper electrode of the light emitting element 22 and the second land portion 31 are connected by a bonding wire 29 such as Au.
[0056]
The entire inside of the recess 41 is sealed with a light-transmitting resin 23 such as a transparent epoxy resin for the purpose of protecting the light emitting element 22 and improving the external quantum efficiency.
[0057]
According to this embodiment, the same effect as that of the first embodiment can be obtained.
[0058]
(Third embodiment)
In FIG. 3, reference numeral 21 denotes a resin substrate as a package, and a recess 41 is formed on the upper surface thereof.
[0059]
The resin substrate 21 includes a bottom surface portion 42 that forms the bottom wall of the concave portion 41 and a peripheral portion 43 that forms the side wall of the concave portion 41.
[0060]
As in the first embodiment, the bottom surface portion 42 includes a first conductive resin body 24, a second conductive resin body 25, and an insulating resin body 26 interposed between the conductive resin bodies 24 and 25. These are integrally formed (two-color molding) during mold molding.
[0061]
The peripheral portion 43 is made of an insulating resin. The peripheral portion 43 is integrally formed on the bottom surface portion 42 by a two-color molding method at the time of mold molding.
[0062]
In the second conductive resin body 25, metal lead pins 45 (metal members) are embedded at the time of mold molding, and serve as bonding pads at the time of wire bonding.
[0063]
Further, Ni / Au plating 33 for external connection is applied to the back terminals 28 and 32 on the back surface of the resin substrate 21.
[0064]
The light emitting element 22 is fixed on the first land portion 27 with Ag paste, and the upper electrode of the light emitting element 22 and the metal lead pin 45 are connected by a bonding wire 29 such as Au.
[0065]
The entire inside of the recess 41 is sealed with a light-transmitting resin 23 such as a transparent epoxy resin for the purpose of protecting the light emitting element 22 and improving the external quantum efficiency.
[0066]
When the light emitting device is formed in this way, electrical conduction is achieved by the metal lead pin 45. Therefore, in this embodiment, the Ni / Au plating 33 for external connection is applied to the back terminals 28 and 32 on the back surface of the resin substrate 21, but the Au wire is formed without forming any metal film in the recess 41. It is also possible to connect directly to the case.
(Fourth embodiment)
FIG. 4 is a cross-sectional view of the light emitting device of the fourth embodiment, and FIG. 5 is a structural diagram of the light emitting element of the fourth embodiment. In FIG. 4, reference numeral 21 denotes a resin substrate as a package, and a light emitting element 22 is mounted in the resin substrate 21.
[0067]
The resin substrate 21 includes a bottom surface portion 42 constituting the bottom wall of the recess 41 and an insulating peripheral portion 43 constituting the side wall of the recess 41.
[0068]
The bottom portion 42 has a highly conductive first conductive resin body 24 whose top surface is the first land portion 27 and whose back surface is the first back surface terminal 28, and whose top surface is the second land portion 31 and whose back surface is the back surface. It consists of a highly conductive second conductive resin body 25 serving as a second back terminal 32 and an insulating resin body 26 interposed between the two conductive resin bodies 24, 25. These are integrally formed at the time of mold forming, as in the first to third embodiments.
[0069]
The light-emitting element 22 of this embodiment is a face-down type as shown in FIG. That is, in the light emitting element 22, both the P electrode 46 as the first electrode and the N electrode 47 as the second electrode are arranged in parallel on the back surface of the light emitting element 22, and the light emission is the light emitting element. 22 is configured from the upper surface.
[0070]
In FIG. 5, 48 is a gap for enhancing the dielectric strength between the PN electrodes 46, 47, 49 is a SiO2 film, 51 is a p + -GaAs layer, 52 is an n-GaAs layer, and 53 is n. -GaAlAs layer, 54 is a p-GaAlAs active layer, 55 is a p-GaAlAs layer, and 56 is a p-GaAlAs layer.
[0071]
The PN electrodes 46 and 47 of the light emitting element 22 are fixed so as to straddle both the land portions 27 and 31 of the resin substrate 21. As the fixing method, for example, conductive bumps 57 are formed in advance on the electrodes 46 and 47 of the light emitting element 22 with Au or solder, and connected to the land portions 27 and 31 by heat or ultrasonic pressure bonding. Installed.
[0072]
In this embodiment, as in the other embodiments, the entire inside of the recess 41 is sealed with a transparent epoxy resin 23 for the purpose of protecting the light emitting element 22 and improving the external quantum efficiency.
[0073]
As described above, when the face-down type top emission type light emitting element 22 is used, there is no electrode on the upper surface which is the light output surface, so that the light utilization efficiency is improved as compared with the conventional upper surface electrode method. .
[0074]
In addition, this invention is not limited to the said Example, Of course, many corrections and changes can be added to the said Example within the scope of the present invention.
[0075]
For example, in the third embodiment, the metal lead pin 45 is embedded in the second resin body 25 made of a highly conductive resin. However, the material of the second resin body 25 is not necessarily required to have high conductivity. Therefore, instead of this, an insulating resin similar to the insulating resin body 26 may be used. In this case, since the insulating resin body 26 and the second resin body 25 do not need to be two-color molded, they may be simply molded simultaneously at the manufacturing stage.
[0076]
In the above embodiments, Ni / Au is used as the material of the metal film 33 applied to the land portions 27, 31 and the back terminals 28, 32. However, for example, Al, Cu, Ag, or the like may be used. Good.
[0077]
Further, for example, in the first embodiment, after the first conductive resin body 24 and the second conductive resin body 25 are formed, the insulating resin body 26 is integrally formed by the two-color molding method. Thereafter, the first conductive resin body 24 and the second conductive resin body 25 may be integrally formed by a two-color molding method.
[0078]
【The invention's effect】
As is apparent from the above description, according to the present invention, the conductive resin body and the insulating resin body are, for example, mounted on a two-color molded package, and a light emitting element on the upper surface and a back terminal on the back surface. Since electrical conduction is performed by a conductive resin body, there is no need to provide a three-dimensional wiring such as a through hole as in the conventional example. Therefore, work processes such as a masking process can be omitted, and the manufacturing work can be simplified.
[0079]
Further, since no through hole is required, molding is easy and the mold shape can be simplified. Therefore, the mold cost is reduced.
[0080]
Further, since the circuit wiring is not required, the overall size is reduced.
[0081]
According to the present invention, since the electrical connection between the light emitting element on the top surface and the back terminal on the back surface is performed by the conductive resin body with the metal member, the electrode inside the recess is not necessary, and the process can be further simplified. .
[0082]
According to the present invention, a face-down top-emitting type light-emitting element is used, so that the top electrode, which is the light output surface, can be omitted, and light utilization efficiency is improved compared to the conventional top-surface electrode method. There is an excellent effect such as.
[0083]
According to the present invention, light is emitted through the land portion by the metal member that is provided inside the package or the insulating resin body that constitutes the package and the upper surface thereof forms the land portion and the back surface forms the back terminal. Since the element and the back terminal are in electrical continuity, it is no longer necessary to route the wiring in the through hole on the side of the package to connect the light emitting element, which has been required in the past, to the back terminal for external connection. The overall size of the light emitting device becomes compact.
[0084]
In addition, since the formation of through holes is not necessary, peeling of the plating layer at the through hole portions generated in processes such as dicing and scribing when dividing a multi-unit substrate-like light emitting device into individual light emitting devices, In addition, there is no conduction failure between the land portion and the back surface terminal portion due to the formation failure of the through hole, and the manufacturing yield and reliability are improved.
[0085]
Furthermore, since the conduction between the light emitting element and the back terminal is performed by the package itself, the influence of the reaction of the back terminal and the solder and the corrosion of the back terminal when mounting the light emitting device on a printed circuit board or the like affects the light emitting element itself. Thus, a light-emitting device having high reliability can be realized.
[0086]
According to the present invention, since a face-down type top emission type light emitting element is used, it is possible to form a land portion with an area substantially the same size as the area of the back surface portion of the light emitting element. Since conduction to the back surface terminal can be performed at the shortest distance, the size of the light emitting device can be made very compact to a size substantially equal to the size of the light emitting element.
[0087]
In addition, since the process of connecting the bonding wire to the package becomes unnecessary, peeling of the back surface terminal, cracking of the package, and peeling of the land due to mechanical distortion introduced into the package in the process of connecting the bonding wire. Thus, electrical conduction between the light emitting element and the back terminal can be ensured, and the yield and the reliability can be improved.
[0088]
According to the present invention, the package is easily formed into a rectangular shape using a simple method such as dicing or scribing after the light emitting devices are collectively formed into a substrate shape, thereby easily obtaining a large number of light emitting devices. It becomes possible.
[0089]
In addition, surface mounting to other components can be easily performed, and the back terminal for mounting is formed in a very compact size close to the light emitting element size, so that the degree of freedom in design is improved.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view showing a light emitting device according to a first embodiment of the present invention.
2A and 2B are diagrams showing a light emitting device according to a second embodiment of the present invention, in which FIG. 2A is a plan view, FIG. 2B is a cross-sectional view, and FIG.
FIG. 3 is a cross-sectional view showing a light emitting device according to a third embodiment of the present invention.
FIG. 4 is a sectional view showing a light emitting device according to a fourth embodiment of the present invention.
FIG. 5 is a structural diagram of a light emitting element used in a light emitting device according to a fourth embodiment of the present invention.
6A and 6B are diagrams showing a conventional light emitting device, in which FIG. 6A is a plan view, FIG. 6B is a side view, and FIG. 6C is a cross-sectional view.
[Explanation of symbols]
21 packages
22 Light emitting element
23 Translucent resin
24 First conductive resin body
25 Second conductive resin body
26 Insulating resin body
27 First Land
28 First back terminal
29 Bonding wire
31 Second Land
32 Second back terminal
33 Metal film
41 recess
45 Metal parts
46 First electrode
47 Second electrode
57 Conductive bump

Claims (6)

A light emitting element, a conductive package for mounting the light emitting element, a land portion located on the upper surface of the package and electrically connected to the light emitting element, and an external connection located on the back surface of the package a surface-mounted light-emitting device having a rear surface terminal, and a translucent resin for sealing the light emitting elements used in,
A light emitting device, wherein the land and the back terminal are electrically connected to each other by the package itself.  2. The light emitting device according to claim 1, wherein an electrode is formed only on one surface of the light emitting element, and the electrode and the land portion are connected via a conductive bump. A light-emitting element, a conductive package on which the light-emitting element is mounted, a plurality of land portions located on the top surface of the light-emitting element and connected to the electrodes of the light-emitting element, and located on the back surface of the package for external connection a plurality of rear surface terminals used, the light emitting element be a surface mount type light emitting device and a translucent resin for sealing,
The light emitting element includes a surface on which a plurality of electrodes are arranged side by side and a surface on which light is emitted facing the surface, and the plurality of electrodes are fixed across the plurality of land portions. The light emitting device is characterized in that the plurality of land portions and the plurality of back surface terminals are electrically connected by the package itself.  4. The light emitting device according to claim 3, wherein a gap for enhancing withstand voltage is formed between the electrodes of the light emitting element.  The light emitting device according to claim 1, wherein the package has a rectangular light emitting element mounting surface.   A concave portion is formed on the top surface of the package, and the package includes a bottom surface portion that constitutes a bottom wall of the concave portion and a peripheral portion that constitutes a side wall of the concave portion. The light-emitting device according to claim 1, wherein the light-emitting device is integrally formed on the bottom surface portion with an insulating resin.

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