JP3421358B2 - Transport method - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a transfer method for transferring a substrate from a cassette to a substrate holder.

In recent years, many process apparatuses have been used in the semiconductor manufacturing process. Especially in the LSI process equipment, automation is being promoted to improve yield and quality, and processing is performed by a cassette-to-cassette.

Currently, the automated devices are silicon-based LSI process devices, such as process devices not used in silicon, such as vapor deposition devices and molecular beam crystal growth (MB).
E) The automation of equipment etc. has been delayed, and there is no equipment that can process cassette-to-cassette. In addition, HEMT (High Ele
Development of LSIs using compound semiconductors such as ctron Mobililty Transistor) elements and GaAs (gallium arsenide) FETs (Field Effect Transistors) is also in progress.
Full automation is desired in manufacturing processes such as molecular beam crystal growth and vacuum deposition.

[0004]

2. Description of the Related Art Conventionally, in a semiconductor manufacturing process, a plurality of processes are performed in a multi-chamber apparatus. The multi-chamber device includes a transfer device that automatically transfers a substrate. In this case, the substrate surface is conveyed upward.

In general, a method of transferring a substrate includes a belt transfer using a transfer belt from a substrate cassette,
There is robot transfer that uses a robot to transfer. In the belt transportation, the substrate cannot be taken out from an arbitrary position in the substrate cassette, and the belt causes dust to adhere to the substrate. Therefore, the method of the robot transportation device is currently considered advantageous.

FIG. 6 shows a block diagram of a conventional multi-chamber apparatus. The multi-chamber apparatus 11 of FIG. 6 includes a pentagonal transfer chamber 12, four process chambers 13a to 13d, and one load lock chamber 14 each having gate valves 15a to 15d.
15e is provided. That is, the transfer chamber 12, the process chambers 13a to 13d, and the load lock chamber 14 are evacuated, and the vacuum state of each space is controlled by the gate valve 15a.
Separated by ~ 15e.

The transfer chamber 12 is provided with a substrate holder 16 capable of mounting five substrates, and a robot 17 having a linear support arm for transferring the substrates in vacuum.

On the other hand, the load lock chamber 14 is partitioned from the outside by a gate valve 15f.
In the vicinity of 5f, a robot 18 of a supporting arm (transport device)
Are placed. In addition, a substrate 19 is provided around the robot 18.
Substrate cassettes 20a and 20b in which a predetermined number of substrates are mounted are positioned, and an alignment device 21 that positions the substrate during transportation is positioned.

In such a multi-chamber apparatus 11, the substrate is transferred from the substrate cassette 20a, 20b to the transfer robot 18
After being carried to the alignment device 21 by using, the substrate is aligned, it is carried to the load lock chamber 14. After the load lock chamber 14 is evacuated, the transfer robot 17 transfers the substrate to the substrate holder 16 and then to the process chambers 13a to 13d. After the process is completed, the substrate passes through the load lock chamber 14 and the substrate cassettes 20a, 20a
Then, the process processing ends.

In this case, the robot 18 which takes out the substrate 19 from the substrate cassettes 20a and 20b and conveys it to the load lock chamber 14 generally uses a support arm for vacuum-adsorbing the substrate.

FIG. 7 shows a diagram for explaining the conventional substrate transfer. In FIG. 7, the substrate cassette 20
The a and 20b are placed on a cassette elevator 22 and can move up and down, and an elevator 23 for receiving the substrate 19 is provided in the load lock chamber 14. In the transfer method, first, the support arm 18a of the robot 18 is extended into the substrate cassette 20a, and the cassette elevator 22 is lowered to adsorb the substrate.

The support arm 18a is extended with the robot 18 directed toward the load lock chamber 14,
The elevator 23 in 4 is moved up and the substrate is picked up.
After that, the support arm 18a of the robot 18 is contracted, the gate valve 15f is closed, and the substrate 19 is sent to the transfer chamber 12 by vacuuming.

In such a carrier, the support arm 18a generally has a thin linear shape as shown in FIG. This is because the straight line is the easiest to make and is advantageous in strength, and the substrate pitch of the substrate cassette 20a which is generally used is as narrow as about 5 mm for a substrate of 2 inches to 6 inches.

As described above, in the automated semiconductor process, since the surface of the substrate 19 is always conveyed upward,
The substrate 19 is transported with the configuration shown in FIGS.

[0015]

However, in a vapor deposition apparatus, a molecular beam crystal growth apparatus (MBE apparatus), etc., the substrate surface must be faced down.

Here, a block diagram of a substrate holder used in a vapor deposition apparatus or the like is shown. 8A is an overall plan view, and FIG. 8B is a sectional view. In the substrate holder 24 shown in FIGS. 8A and 8B, four holes 24a are formed larger than the diameter of the substrate 19, and a protrusion 24b for mounting the substrate 19 is formed on the edge of the hole 24a. is there.

In this way, the substrate 19 is set from above the hole 24a of the substrate holder 24 with the substrate surface facing downward, and the transfer device as shown in FIGS. 6 and 7 cannot be used. There is a case where the substrate is mounted on the substrate cassette with the surface of the substrate facing downward, but the support arm has to be brought into contact with the surface of the substrate, which is not preferable because of problems such as dust.

Therefore, there is a problem in that the cassette-to-cassette substrate cannot be automatically conveyed, and the operator must set the substrate to improve the efficiency.

Therefore, the present invention has been made in view of the above problems, and an object thereof is to provide a transfer method for automating complicated transfer of substrates.

[0020]

SUMMARY OF THE INVENTION The above problem is to carry a substrate between a substrate cassette that holds a plurality of substrates in parallel and a substrate holder that has a fitting portion that holds the substrates face down. In the transportation method, the support includes a suction portion that sucks the substrate and a support portion that supports the suction portion, and the suction surface of the suction portion and the support portion are formed in a step shape, and a support that sucks the back surface of the substrate. The problem is solved by using a transfer device configured by an arm and a drive mechanism that horizontally moves the support arm and rotates the support arm around the direction of the suction surface. .

[0021]

As described above, the support arm is composed of the support portion and the suction portion, and the suction portion has the suction surface formed at the tip of the support portion with a predetermined distance from the support portion.

Therefore, by supporting the back surface of the substrate by the supporting arm and rotating the driving mechanism about the direction of the attracting surface as an axis, the supporting portion can mount and remove the substrate downward from the fitting portion of the substrate holder. This can be performed without contacting the substrate holder. That is, it becomes possible to fully automate the substrate transfer of the cassette-to-cassette, and it is possible to reduce particles and improve work efficiency.

[0023]

DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 shows a block diagram of an embodiment of the present invention.
FIG. 1 shows a case where molecular beam crystal growth (MBE) is performed on a substrate, and shows a transfer device 31 and an MBE device 32.

First, the MBE device 32 is used in the MBE growth chamber 4
1, a load lock chamber 43 is attached via a gate valve 42, and a substrate holder 46 on a holder cassette 45 that moves up and down by a magnetically coupled transfer rod 44.
It is a system for carrying (similar to FIG. 8). Also, a gate valve 47 is attached to the take-out port of the substrate holder 46, and the substrate holder 46 is taken out by opening and closing the gate valve 47. Further, the holder cassette 45 is interlocked with the magnetic coupling type transfer rod 44, and the substrate holder 46 can be taken in and out by a lifter (not shown in the figure) which moves up and down.

On the other hand, the carrying device 31 is
A first robot 52 having three axes and three arms is arranged near the gate valve 47 of the BE device 32, and carries the substrate holder 46 between the holder cassette 45 and the holder base 53.

The holder base 53 is provided with an optical sensor 54 for detecting the origin of the substrate holder 46 and performing alignment. The holder base 53 is also equipped with a lifter (not shown) that moves up and down to receive the substrate holder 46 from the first robot 52, and a rotation mechanism for setting the substrate 46a.

The board 46a is mounted on the board holder 46 by
From the substrate cassettes 55a and 55b having the up-and-down mechanism to the substrate 46 by the second robot 56 (described in FIG. 2).
After receiving a and performing substrate alignment by the alignment device 57, it is set in the substrate holder 46. The alignment device 57 is equipped with a vertical mechanism (not shown) for receiving the substrate, an optical sensor for detecting the center of the substrate 46a, and a turntable.

The MBE device 32 in FIG. 1 can be replaced with, for example, a vacuum vapor deposition device.

FIG. 2 is a block diagram of the second robot shown in FIG. FIG. 2A is a plan view and FIG.
Is the side. In FIGS. 2A and 2B, the second robot 56 is a three-axis, three-arm robot and has a base 6
1 includes a drive mechanism including rotatable first to third arms 62a to 62c, and a rotation shaft of a rotation mechanism 63 (included in the drive mechanism) such as a motor and an actuator provided in the third arm 62c. It is constituted by a support arm 64 attached to the. The motor 63 rotates the support arm 64 about the longitudinal axis.

The support arm 64 has a Z-shaped support portion 65a and a suction portion 65b formed at the tip thereof for performing vacuum suction of the substrate. That is, the Z-shape means that the suction surface of the suction portion 65b and the support portion 65a are at a predetermined distance d due to the bent portion 65c (the substrate holder 2 shown in FIG. 8).
4 (46) and is formed with a fitting portion hole 24a (46a) of the depth by <br/> Redirecting a) of.

Here, FIG. 3 shows a process diagram of the carrying operation according to FIG. In FIG. 3, first, the support arm 64 is inserted into the substrate cassettes 55a and 55b with the substrate suction surface of the suction portion 65b of the support arm 64 of the robot 56 facing upward (FIG. 3A). At this time, the support arm 64 is inserted until it does not come into contact with another substrate.

Then, the substrate 46a is adsorbed, pulled out by a predetermined amount a little forward (FIG. 3B), placed on the substrate cassette 55a, and then inserted so that the bent portion 65c of the support arm 64 is located inside the outer periphery of the substrate. (FIG. 3 (C)). After that, the substrate 46a is adsorbed, taken out from the substrate cassette 55a,
The support arm 64 is rotated by the rotation mechanism 63 to move the substrate 4
The surface of 6a faces downward (FIG. 3 (D)).

Then, the arm is extended toward the substrate holder 46, the substrate holder 46 is moved upward by the lifter of the holder base 53, and the substrate 46a is received by the fitting portion 46b (FIG. 3).
(E)).

In this way, the substrate cassette 55a can be automated.
The substrate 46a can be set on the substrate holder 46 from the above.

In this example, the fitting portion 46b for setting the substrate 46a of the substrate holder 46 is designed with a sufficient margin with respect to the size of the substrate 46a, that is, the case where the precision of the substrate position is not required. Therefore, the simplest method without using the alignment device 57 is shown.

Therefore, in practical cases, the alignment apparatus 57 is often used for transportation in a practical case where the margin of the substrate holder is not designed to be large. In this case, after the substrate 46a is sucked in the state of FIG. 3B, alignment is performed by the alignment device 57, and then the substrate 46a is received as shown in FIG.

When the alignment device 57 is used, since the substrate 46a is changed over in the alignment device 57 portion, efficient substrate transfer can be performed without wasteful operation.

Next, FIG. 4 shows a block diagram of another embodiment of FIG. 4A is a plan view and FIG. 4B is a side view. In the second robot 56 in FIG. 4, the first support arm 71 is attached to one end of the third arm 62c shown in FIG. 2 via the rotation mechanism 63, and the second support arm 7 is attached to the other end.
2 is attached via the rotating mechanism 63.

The first support arm 71 includes a support portion 71a.
Then, a suction portion 71b for vacuum suctioning the substrate formed at the tip thereof is formed such that the suction surface and the support portion 71a have a predetermined distance d as described above. The second support arm 72 is formed in a linear shape and performs vacuum suction at the suction portion 72a at the tip.

Further, by the rotating mechanism 63, the first and second
Both support arms 71 and 72 rotate about the longitudinal direction.

When the second robot 56 shown in FIG. 4 is used, a substrate holding stand 73 as shown in FIG. 5 is used.

Here, FIG. 5 shows a process diagram of the carrying operation according to FIG. In FIG. 5, first, the second robot 56
The second support arm 7 is attached to the substrate cassette 55a (55b) with the substrate suction surface of the second support arm 72 facing upward.
Insert 2 (Fig. 5 (A)). Then, the substrate 46a is sucked by the suction portion 72a, taken out from the substrate cassette 55a, and placed on the substrate holding stand 73 (FIG. 5 (B)).

Next, the suction portion 71 of the first support arm 71
In step b, the board 46a is received from the board berth 73 (see FIG.
(C)) After that, the substrate 46a is sucked, and the first support arm 71 is rotated by the rotating mechanism 63, so that the substrate 46a
Down (FIG. 5 (D)). And the substrate holder 4
The first support arm 71 is extended in six directions, and the holder base 53
The substrate holder 46 is moved upward by the lifter and the substrate 46a is received by the fitting portion 46b (FIG. 5 (E)).

In this way, the substrate cassette 55a,
The substrate 46a can be set on the substrate holder 46 from 55b.

In this example, the alignment device 57 is not used, but the substrate retention block 73 is used. However, by causing the alignment device 57 to perform the role of the substrate retention block 73, an unnecessary operation is performed. It is possible to carry out the substrate transfer efficiently.

Also, the first and second support arms 71, 7
Although the two robots are driven by the same robot, they may be driven by different robots.

Further, in the above-mentioned embodiment, the MBE apparatus or the vapor deposition apparatus is taken as an example, and the cassette-to-cassette conveying apparatus 31 is used.
Although the case in which the holder is mounted is shown, the above object can be achieved and the first robot 52 can be omitted even if the holder base is installed in the load lock chamber, for example. Also,
The present invention can be applied not only to the MBE device and the vapor deposition device, but also to other devices for setting a substrate on a substrate holder having a fitting portion with a recess.

In this way, the cassette-to-cassette transfer device that can take out a substrate from an arbitrary substrate cassette position can be automated, and the vapor deposition device and MBE used as the process device for the compound semiconductor LSI can be automated.
The device can be used as a fully automatic device. Moreover, the number of workers can be reduced by the fully automation, and the particles in the LSI can be reduced by reducing the number of workers.

[0049]

As described above, according to the present invention, the supporting arm for sucking the substrate is rotatably composed of the supporting portion and the sucking portion, and the sucking surface of the sucking portion has a predetermined distance from the supporting portion. By forming it at the tip of the supporting portion, complicated substrate transfer can be automated, and the efficiency of the substrate processing step can be improved.

[Brief description of drawings]

FIG. 1 is a configuration diagram of an embodiment of the present invention.

2 is a configuration diagram of the second robot of FIG. 1. FIG.

FIG. 3 is a process diagram of the carrying operation according to FIG.

FIG. 4 is a configuration diagram of another embodiment of FIG.

FIG. 5 is a process diagram of the carrying operation according to FIG.

FIG. 6 is a configuration diagram of a conventional multi-chamber device.

FIG. 7 is a diagram for explaining conventional substrate transfer.

FIG. 8 is a configuration diagram of a substrate holder used in a conventional vapor deposition device or the like.

[Explanation of symbols]

31 Conveyor 32 MBE equipment 41 MBE growth room 42,47 Gate valve 43 Road lock room 44 Transfer rod 45 holder cassette 46 substrate holder 46a substrate 52 First Robot 53 Holder stand 54 Optical sensor 55a, 55b Substrate cassette 56 Second Robot 57 Alignment device 62c Third arm 63 rotation mechanism 64 support arm 65a, 71a Supporting part 65b, 71b, 72a Adsorption part 71 First Support Arm 72 Second support arm 73 Board stop

Continuation of the front page (56) Reference JP-A-2-91959 (JP, A) JP-A-1-135015 (JP, A) JP-A-2-312259 (JP, A) JP-A-63-65639 (JP , A) JP 56-130935 (JP, A) JP 64-24440 (JP, A) (58) Fields investigated (Int.Cl. ⁷ , DB name) H01L 21/68 B65G 49/06- 49/07 H01L 21/203 H01L 21/363 B65G 1/00-1/20 B25J 15/00-15/12 H05K 13/00-13/04

Claims (2)

(57) [Claims] 1.Hold multiple substrates (46a) in parallel
Substrate cassette (55a, 55b) and hole shaped
And the fitting portion (4) for holding the substrate (46a) downward on the surface.
Between the substrate holder (46) having 6b)
In the carrying method of carrying (46a), An adsorption portion (65b) for adsorbing the substrate (46a) and the adsorption
A support portion (65a) for supporting the portion (65b),
The suction surface of the suction portion (65b) and the support portion (65a) are
It is formed in a stepped shape and adsorbs the back surface of the substrate (46a).
Move the support arm (64) to a position where it does not contact another substrate.
Insert the board into the board cassette (55a, 55b)
The back surface of (46a) is adsorbed and a predetermined amount of the substrate (46a) is attached.
After pulling out from the substrate cassette (55a, 55b),
Release the adsorption and attach the substrate cassette (55a, 55b)
A step of placing the substrate (46a), The entire suction surface of the suction portion (65b) is the substrate (46a)
Until the support arm (64) is located inside the outer circumference of
Reinserted in the substrate cassette (55a, 55b)
After that, a step of adsorbing the back surface of the substrate (46a) again, The substrate (46a) sucked by the support arm (64)
From the substrate cassette (55a, 55b),
Move the support arm (64) horizontally.
And move the support arm (64) toward the suction surface.
Rotate by the drive mechanism (63) that rotates the direction about the axis
Facing down the surface of the substrate (46a), The board (46a) is attached to the fitting portion of the board holder (46).
(46b) a step of fitting and holding the surface downward, A transportation method comprising: 2.Hold multiple substrates (46a) in parallel
Substrate cassette (55a, 55b) and hole shaped
And the fitting portion (4) for holding the substrate (46a) downward on the surface.
Between the substrate holder (46) having 6b)
In the carrying method of carrying (46a), The linear support with a suction part (72a) at the tip
The arm (64) is moved horizontally and the support arm is moved.
Drive (64) by rotating the suction surface around the axis. Dynamic mechanism
Second support arm horizontally moved by (61 to 63)
By (72), the substrate cassette (55a, 55b)
The back surface of the substrate (46a) being held is turned upward
And then adsorbing, The substrate adsorbed by the second support arm (72)
The substrate (46a) is conveyed upward, and is placed on the substrate stand.
Placing on (73), An adsorption portion (65b) for adsorbing the substrate (46a) and the adsorption
A support portion (65a) for supporting the portion (65b),
The suction surface of the suction portion (65b) and the support portion (65a) are
It is formed in a stepped shape and adsorbs the back surface of the substrate (46a).
The first support arm (71) allows the substrate berth (7
3) Adsorb and take out the back surface of the substrate (46a) above
Process, The substrate (4) attracted by the first support arm (71)
6a) and the first support arm (71) to the drive mechanism.
(63) rotate to lower the surface of the substrate (46a).
The process of facing The board (46a) is attached to the fitting portion of the board holder (46).
(46b) a step of fitting and holding the surface downward, A transportation method comprising: