JP3491192B2 - Method for manufacturing laminated sheet integrated antenna coil, method for manufacturing non-contact IC card, and non-contact IC card - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a laminated sheet-integrated antenna coil, a method for manufacturing a non-contact type IC card, and a non-contact type IC card. More specifically, the present invention relates to a laminated sheet having good mass productivity and a small thickness. The present invention relates to an integrated antenna coil manufacturing method, a non-contact type IC card manufacturing method, and a non-contact type IC card. In particular,
Phone cards, prepaid cards (equivalent to the current size), identification cards such as identification labels and tag sheets that use paper for laminate sheets, ID cards, applications such as book labels and labels for rental CDs, etc. It is useful for applications such as compounding into magnetic cards.

[0002]

29 is a plan view showing an example of a conventional non-contact type IC card. This non-contact type IC card 50
0 is a configuration in which the IC module 3 and the antenna coil 51 whose terminal is connected to the pad portion (terminal area) of the IC module 3 are sealed with the laminate sheets 2a and 2b. The antenna coil 51 has an insulating coating wire 4
It is formed by looping for ~ 6 turns. 1
The circumference per turn is, for example, 100 mm.

[0003]

The above-mentioned conventional non-contact type I
The C card 500 has the following problems. (1) The IC is integrated with the laminate sheet from the beginning
Mass productivity is poor because it is not a card module alone. (2) Since the antenna coil formed by bending the insulating coating conductor is bonded to the laminate sheet by using an adhesive or the like, it is necessary to increase the shape retention force of the antenna coil alone to some extent, and the wire diameter is too small. I can't make it small. Therefore, the thickness of the card cannot be reduced so much. Therefore, an object of the present invention is to provide a laminated sheet integrated antenna coil manufacturing method, a non-contact type IC card manufacturing method, and a non-contact type IC card, which have good mass productivity and can be reduced in thickness.

[0004]

According to a first aspect of the present invention, an antenna coil is formed by laying a heat-sealing-layer-insulated coated wire having a heat-sealing layer formed on the outer periphery thereof to form an antenna coil. An antenna coil integrated with a laminate sheet, characterized in that the coil is hot-pressed onto a laminate sheet to reduce the thickness of the antenna coil, and the wires are fusion-bonded to each other and the antenna coil is fusion-bonded to the laminate sheet. A manufacturing method is provided. In the method for manufacturing a laminated sheet-integrated antenna coil according to the first aspect described above, even if the shape-holding force of the heat-sealing layer-attached insulating coating conductor itself is not so high, the heat-sealing of the wire-bonded heat-sealing layer-insulating coating conductor. It is possible to prevent the adhesion layers from fusing and collapsing the shape. Therefore, a wire having a small wire diameter can be used, and the overall thickness can be reduced. Also,
The wire from the antenna coil moves laterally due to the pressure from the topless.
It can spread and compress its thickness. In addition, since the shape of the antenna coil is stable, it is easy to handle such as positioning on the laminate sheet, and mass productivity can be improved.

According to a second aspect of the present invention, according to the present invention, an insulating coated conductive wire with a heat-sealing layer having a heat-sealing layer formed on the outer periphery is locked to a locking pin protruding from a winding jig and wired. An antenna coil is formed, the antenna coil is hot-pressed on a laminate sheet, and the pressing pin accommodates the locking pin inside a jig, and the wire rods of the antenna coil are fusion-bonded to each other and the antenna coil is laminated sheet. Provided is a method of manufacturing a laminated sheet-integrated antenna coil, which is characterized by fusion-bonding the upper part. In the laminated sheet integrated antenna coil manufacturing method according to the second aspect, since the insulating coating wire with the heat-sealing layer can be locked to the locking pin protruding from the winding jig, the shape of the antenna coil can be laid. The antenna coil can be accurately formed in a short time. Further, since the locking pin can be housed inside the jig and the antenna coil and the antenna sheet can be completely adhered to each other at the time of hot pressing, fusion bonding of the wire rods of the antenna coil or the antenna coil and the laminate sheet can be prevented. It is possible to reliably perform fusion bonding. further,
Wiring of insulation coated conductors with a heat-sealing layer and fusion bonding of antenna coils onto a laminate sheet can be performed using only one type of jig, that is, winding jig. Therefore, mass productivity can be improved.

According to a third aspect of the present invention, according to the present invention, an IC module is connected to an IC coil terminal to which an end of an antenna coil having a heat-sealing layer-formed insulating coating wire having a heat-sealing layer formed is laid.
A card module is manufactured, and the IC card module is hot-pressed onto a first laminate sheet to compress the thickness of the antenna coil and melt-bond wires to each other and attach the antenna coil to the first laminate. A method for manufacturing a non-contact type IC card, which comprises fusion-bonding to a sheet, and hot-pressing a second laminate sheet to the first laminate sheet to fuse the laminates together. Non-contact type IC according to the third aspect
In the card manufacturing method, since the IC card module in which the terminal of the antenna coil is connected to the IC module is manufactured, it becomes possible to handle the IC card module alone, and it can be used for any laminated sheet IC card. Mass productivity is improved. Further, even if the shape retention of the heat-sealable layer-attached insulating coating conductor itself is not so high, it is possible to prevent the collapse of the shape due to the wire-bonded heat-sealable layer-attached insulating coating conductors being fused together. Since a small wire can be used, the thickness of the IC card can be reduced. Also, the pressure of the hot press causes the antenna coil to
The wire rod can be expanded laterally and the thickness can be compressed.
It

[0007]

According to a fourth aspect of the present invention, the present invention provides an insulating coated conductive wire with a heat-sealing layer having an IC module mounted on the winding jig and having a heat-sealing layer formed on the outer periphery thereof. An antenna coil is formed by engaging with a locking pin protruding from the wire and forming an antenna coil, and a terminal for the antenna coil is connected to the IC module to produce an IC card module. The antenna coil is provided with a hot melt layer. Hot-pressing on the first laminate sheet of No. 1 and the pressing pressure is used to accommodate the locking pin inside the jig, the wire rods of the antenna coil are melt-bonded to each other, and the antenna coil is fused to the hot-melt layer. Bonding and hot pressing a second laminate sheet having a hot melt layer on the hot melt layer of the first laminate sheet to fuse the hot melt layers to each other. Providing a non-contact type IC card manufacturing method of. In the method for manufacturing a non-contact type IC card according to the fourth aspect , since the insulating coating wire with the heat-sealing layer can be locked to the locking pin protruding from the winding jig, the antenna coil can be wired. The coil can be accurately formed in a short time. Further, since the locking pin can be housed inside the jig and the antenna coil and the antenna sheet can be completely adhered to each other at the time of hot pressing, fusion bonding of the wire rods of the antenna coil or the antenna coil and the laminate sheet can be prevented. It is possible to reliably perform fusion bonding. In addition, the wiring of the insulating coated conductor with the heat-sealing layer and the fusion bonding of the antenna coil onto the laminate sheet can be performed using only one type of jig, that is, a winding jig, so that it can be manufactured with a consistent line. And mass productivity can be improved. Furthermore, since the IC card module is embedded in the fusion layer formed by fusing the hot melt layers of the first laminate sheet and the second laminate sheet together, it is difficult to remove the IC card module from the card. , It is possible to improve the bending resistance by increasing the mechanical strength of the card.

[0009]

[0010]

BEST MODE FOR CARRYING OUT THE INVENTION The present invention will now be described in more detail with reference to the embodiments shown in the drawings. The present invention is not limited to this.

First Embodiment FIG. 1 is an explanatory view showing a laminated sheet integrated antenna coil 100 according to a first embodiment of the present invention.
(A) is a top view. (B) is a XX 'sectional view. (C) is an enlarged cross-sectional view of the main part of (b). As shown in FIGS. 1A and 1B, the laminated sheet-integrated antenna coil 100 has a structure in which the antenna coil 1 is hot pressed onto the laminated sheet 2 and fusion-bonded. As shown in (c) of FIG. 1, the antenna coil 1 includes an insulating coated conductor wire 1 a with a heat-sealing layer (a center conductor 1).
0 has an insulating layer 11 formed on the outer periphery thereof, and a heat-sealing layer 1 formed on the outer periphery thereof.
2 is formed) and the wires are melt-bonded to each other by the hot pressing. The hot pressing process will be described in detail later.

FIG. 2 is a flow chart showing a process for manufacturing the laminated sheet-integrated antenna coil 100 of FIG. Step S1 is a wiring process for forming the antenna coil 1 by laying the insulating coated conductor 1a with the heat-sealing layer on the winding jig 20. FIG. 3 is a perspective view of the winding jig 20. On the upper surface of the winding jig 20, upper and lower pins 21 for bending the insulating coating conductor 1a with the heat-sealing layer are projected by the elastic force of the spring. Therefore, when the upper surface of the pin is pressed, it is housed inside the jig as shown in FIG. FIG. 5 shows a flow chart of the wiring process.

At step SS1, as shown in FIG.
The winding jig 20 is put into the multi-head wiring robot 30. The multi-headed wiring robot 30 controls the positions of a plurality (five in the illustrated example) of the wiring heads 32 in the horizontal plane by the movable arm 31 to simultaneously perform wiring on the plurality of winding jigs 20. This is a configuration that can be performed.

At step SS2, as shown in FIG.
The multi-head wiring robot 30 moves the winding jig 20 to the wiring start position.

At step SS3, as shown in FIG.
The multi-head wire laying robot 30 moves the wire laying head 32 from the standby position and entangles the insulating coating wire 1a with the heat-sealing layer with the start pin of the upper and lower pins 21. As shown in FIG.
The insulation-coated conductor 1a with a heat-sealing layer has a structure in which an insulating layer 11 is formed on the outer circumference of the central conductor 10 and a heat-sealing layer 12 is formed on the outer circumference thereof. The material of the insulating layer 11 is polyurethane, for example. The main component of the material of the heat fusion layer 12 is, for example, polyester (fusion temperature 130 ° C.).
The diameter φ of the central conductor 10 is, for example, 40 μm.
The layer thickness τ1 of the insulating layer 11 is, for example, 2 μm. The layer thickness τ2 of the heat fusion layer 12 is, for example, 1 to 2 μm.
At this time, the end of the insulating coated conductor 1a with the heat-sealing layer is clamped.

In step SS4, as shown in FIG. 10, the wiring head 32 is moved between the reference pins of the upper and lower pins 21, and the insulating coated conductive wire 1a with a heat-sealing layer is wired.

In step SS5, it is judged whether or not the number of windings of the insulating coated conductor 1a with a heat-sealing layer has reached the prescribed number of windings. When the prescribed number of windings has been reached, step SS6 follows and the prescribed number of windings is reached. If not, the process returns to step SS4 to continue the wiring. The specified number of windings is usually 10 turns or less, for example, about 4 to 6 turns.

In step SS6, as shown in FIG. 11, after the insulation coating conductive wire 1a with a heat fusion layer is entangled with the end pins of the upper and lower pins 21, the insulation coating conductive wire 1a with a heat fusion layer is carried to the standby position and clamped. Do it again. In step SS7, as shown in FIG. 12, the end of the insulating coated conductor 1a with the heat-sealing layer is cut.

At step SS8, the multi-head wiring robot 3
0 advances the winding jig 20 to the discharge part (see FIG. 6).
In step SS9, the winding jig 20 is removed from the multi-head wiring robot 30. FIG. 13 shows a cross-sectional state of the insulating coated conductor 1a with a heat-sealing layer that is entwined with the upper and lower pins 21.

Returning to FIG. 2, step S2 is a laminating process. FIG. 14 shows a flow chart of the laminating process. In step T1, the conveyor 41 of the laminator 40
The winding jig 20 is placed on top. As shown in FIG.
The laminator 40 includes a conveyor 41 that conveys the winding jig 20, and an unwinding roll 4 that unwinds the laminate sheet 2.
2, a heat insulating plate 43 and a press plate 44 that are fixedly installed on the traveling path of the laminate sheet 2, a press 46 that can vertically drive the vertical cylinder 45 in the direction of the press plate 44, and a winding roll 47. It is equipped and configured. In the figure, the winding jig (antenna coil) with the latest mounting time is represented by 20-1 (1-1), and the winding jig (antenna coil) with one loading time before is 20-.
2, 20-3, ... (1-2, 1-3, ...).

At step T2, the conveyor 41 moves the winding jig 20 directly below the press plate 44. The surface temperature of the press plate 44 is maintained at a high temperature of about 150 ° C., for example.

In step T3, the upper and lower cylinders 45 are raised and the winding jig 20 is pressed against the laminate sheet 2. The pressing force of the upper and lower cylinders 45 is, for example, 2 kg.
/ It is about a square centimeter. As shown in FIG. 16, since the upper and lower pins 21 of the winding jig 20 are gradually accommodated in the jig to limit the vertical spreading of the insulating coating conductor 1a with a heat-sealing layer, each insulating coating conductor 1a Spread laterally in close contact.

At step T4, the process waits until the prescribed press time elapses, and then proceeds to step T5. The pressing time is about 5 seconds to 1 minute, for example, 15 seconds. As shown in FIG. 17, after the pressing is completed, the insulating coated conductive wires 1 a with a heat-sealing layer are aligned in a horizontal row, and adjacent wires (the heat-sealing layers 12 thereof) are melt-bonded to each other. Further, since the heat-sealing layer 12 of the insulating coated conductor 1a with the heat-sealing layer is melted, the antenna coil 1 is fusion-bonded onto the laminate sheet 2. It should be noted that the surface temperature of the winding jig 20 is the same as that of the thermal fusion layer 1 from the viewpoint of preventing adhesion of the thermal fusion layer 12.
It is adjusted to a temperature lower than the fusing temperature of 2 (for example, 110 ° C. or lower).

In step T5, the press 46 lowers the upper and lower cylinders 45 and finishes the hot pressing.

At step T6, the laminate sheet 2 integrated with the antenna coil 1 is wound around the winding roll 47. After that, the laminate sheet 2 is cut into a prescribed length, whereby the laminate sheet-integrated antenna coil 100 shown in FIG. 1 is manufactured.

According to the above-described laminated sheet-integrated antenna coil manufacturing process, the insulating coil conductor 1a with the heat-sealing layer is locked to the upper and lower pins 21 protruding from the winding jig 20 to form the antenna coil 1. Since it is fusion bonded to the laminate sheet 2 by hot pressing, the heat fusion layers 12 of the insulation coated conductor 1a with each fusion layer are fused even if the shape retaining force of the insulation coated conductor 1a with the fusion layer is not so high. It is possible to prevent the shape from collapsing. Therefore, a wire rod having a small wire diameter can be used, and the overall thickness can be reduced.

-Second Embodiment- FIG. 18 shows a non-contact type I according to a second embodiment of the present invention.
It is explanatory drawing which shows the C card 200. (A) is a top view. (B) is a XX 'sectional view. (C) is (b)
It is sectional drawing which expanded the principal part of this. 18 (a) (b)
As shown in FIG.
The IC card module 201 in which the terminal of the antenna coil 1 is connected to the pad portion (terminal area) of the module 3 is hot-pressed onto the laminate sheet 2a by fusion bonding, and then the laminate sheet 2a is laminated on the laminate sheet 2b.
It is a structure in which fusion bonding is performed. As shown in FIG. 18 (c), the antenna coil 1 includes an insulating coated conductor 1a with a heat-sealing layer (an insulating layer 11 is formed on the outer periphery of the central conductor 10 and a heat-sealing layer 12 is formed on the outer periphery thereof). The above structure) is wired, and the wires are melt-bonded to each other by the hot pressing. The hot pressing process will be described in detail later with reference to FIG. 19 which shows the non-contact type IC card 200 of FIG.
FIG. 6 is a flow chart of a process for manufacturing a. Step S21 is
On the winding jig 20 ', the insulating coated conductor 1 with the heat-sealing layer
It is a wiring process of wiring a to form the antenna coil 1. FIG. 20 is a perspective view of the winding jig 20 '. An IC module mounting portion 22 for mounting an IC module (3 in FIG. 21) and adsorbing and fixing the IC module is provided on the upper surface of the winding jig 20 '. In addition, the point that the upper and lower pins 21 can be housed inside the jig is the same as the winding jig 20 of FIGS. 3 and 4. In the wiring process, first, as shown in FIG.
The IC module 3 is mounted on the IC module mounting portion 22 and fixed by suction. After that, the insulating coated conductor 1a with a heat-sealing layer is laid by the same process as the laying process described with reference to FIG. FIG. 22 shows a state after completion of wiring.

In step S22, the antenna coil 1 is
This is a bonding step for connecting the terminal of 1 to the IC module 3. That is, as shown in FIG. 23, the insulation coating conductive wire 1a with a heat-sealing layer is connected to the pad portion of the IC module 3 by wedge bonding or the like,
The insulating coated conductor 1a with a heat-sealing layer is cut in the vicinity of the bonding portion 4. Thereby, the winding jig 20 '
As shown in FIG. 24, an IC card module 201 in which the terminal of the antenna coil 1 is connected to the IC module 3 is manufactured on the top.

Step S23 is a laminating process. FIG. 25 shows a flow chart of the laminating step. In step T1, the winding jig 20 'is placed on the conveyor 41 of the laminator 40'. As shown in FIG. 26, the laminator 40 is a conveyor 4 that conveys the winding jig 20 ′.
1 and the unwinding roll 4 that unwinds the laminate sheet 2a
2a, a heat insulating plate 43 and a press plate 44 that are fixedly installed on the traveling path of the laminate sheet 2a, a press 46 that can vertically drive the upper and lower cylinders 45 in the direction of the press plate 44, and the laminate sheet 2b is unwound. 42b, a winding roll 47, and a heat roller 48 for fusing the laminate sheet 2b to the laminate sheet 2a. In the figure, the winding jig (IC card module) with the latest mounting time is 2
Represented by 0'-1 (201-1), the winding jig (IC card module) before loading one by one is 20'-
2, 20'-3, ... (201-2, 201-3, ...).

At step T2, the conveyor 41 moves the winding jig 20 'to just below the press plate 44.
The surface temperature of the press plate 44 is, for example, 150 ° C.
It is maintained at a high temperature.

In step T3, the upper and lower cylinders 45 are raised and the winding jig 20 'is pressed against the laminate sheet 2a. As described above with reference to FIG. 16, the upper and lower pins 21 of the winding jig 20 'are gradually accommodated in the jig to limit the vertical spreading of the insulating coated conductor 1a with the heat-sealing layer. Therefore, the insulating coating conductors 1a spread laterally in a state of being in close contact with each other.

At step T4, the process waits until the prescribed press time elapses, and then proceeds to step T5. As described above with reference to FIG. 17, after the pressing time has elapsed, the insulating coating conductive wires 1a with a heat-sealing layer are arranged in a horizontal row, and adjacent wire rods (of the heat-sealing layer 12) are melted. To join. In addition, the heat-sealing layer 1 of the insulating coated conductor 1a with the heat-sealing layer
Since 2 melts, the antenna coil 1 is fusion-bonded onto the laminate sheet 2a. The surface temperature of the winding jig 20 ′ is adjusted to a temperature lower than the fusion temperature of the heat fusion layer 12 (for example, 110 ° C. or lower) from the viewpoint of preventing the heat fusion layer 12 from adhering. There is.

In step T5, the press 46 lowers the upper and lower cylinders 45 and finishes the hot pressing.

In step TT6, the laminated sheet 2b is heated by the heat roller 48 and fused to the laminated sheet 2a. The temperature of the heat roller 48 is
For example, it is 180 ° C. At this time, since the heat-sealing layer 12 of the insulating coated conductor 1a with the heat-sealing layer is melted, the antenna coil 1 is fusion-bonded onto the laminate sheet 2b. As a result, the IC card module 201 is sealed in the laminate sheets 2a and 2b.

At step TT7, the laminate sheets 2a and 2b integrated with the antenna coil 1 are wound on the winding roll 47. Then, the laminated sheet 2a,
The non-contact type IC card 200 shown in FIG. 18 is manufactured by cutting 2b into a prescribed card length.

According to the above non-contact type IC card manufacturing process, the insulating coating wire 1a with the heat-sealing layer is locked to the upper and lower pins 21 protruding from the winding jig 20 ', and the antenna coil 1 is formed.
Is formed and fusion-bonded to the laminate sheet 2a by hot pressing, so that the heat-sealing layer of the heat-sealing-layer-insulating-film conductor 1a is not required even if the shape-holding force of the heat-sealing-layer-insulating film conductor 1a itself is not so high. It is possible to fuse 12 together to prevent the shape from collapsing. Therefore, a wire having a small wire diameter can be used, and the thickness of the non-contact type IC card 200 can be reduced (for example, the thickness can be about 0.25 mm).

-Third Embodiment- FIG. 27 shows a non-contact type I according to a third embodiment of the present invention.
It is explanatory drawing which shows the C card 300. (A) is a top view. (B) is a XX 'sectional view. (C) is (b)
It is sectional drawing which expanded the principal part of this. 27 (a) (b)
As shown in FIG.
The IC card module 201 in which the terminal of the antenna coil 1 is connected to the pad portion (terminal area) of the module 3 is hot-pressed onto the laminate sheet 32a with a hot melt layer by fusion bonding, and then the laminate sheet with a hot melt layer is formed. The laminated sheet 32b with the hot melt layer is fusion-bonded to the 32a, and both laminated sheets 33a,
The IC card module 201 is sealed in the hot melt layer 33 sandwiched between 33b. As shown in (c) of FIG. 27, the antenna coil 1 has an insulating coated conductive wire 1 a with a heat-sealing layer (an insulating layer 11 is formed on the outer circumference of the central conductor 10 and a heat-sealing layer 12 is formed on the outer circumference thereof). The above structure) is wired, and the wires are melt-bonded to each other by the hot pressing.

Next, the non-contact type IC card 300 shown in FIG.
A process for manufacturing the will be described. The processing contents of the wiring process, the bonding process, and the laminating process are described in FIGS.
As described with reference to. However, in the laminating process, hot pressing (steps T3 and T in FIG.
28), the antenna coil 1 is fusion-bonded onto the hot melt layer 33a of the laminated sheet 32a with a hot melt layer, as shown in FIG. Therefore,
The heat roller 48 heats the laminated sheet 32b with the hot melt layer (corresponding to step TT6 in FIG. 25).
And laminated sheets 32a, 32 with hot melt layer
Since the hot melt layers 33a and 32b of b melt, the hot melt layers 3a and 32b are melted as shown in (b) and (c) of FIG.
The IC card module 201 is sealed in the module 3.

According to the above non-contact type IC card manufacturing process, the laminated sheets 32a, 32 with the hot melt layer are provided.
Since the IC card module 201 is embedded in the hot melt layer 33 formed by melting the hot melt layers 33a and 33b of FIG.
It is possible to improve the bending resistance by increasing the mechanical strength of the card while making it difficult to remove 01.

[0040]

EFFECTS OF THE INVENTION According to the method for manufacturing an antenna coil with a laminated sheet of the present invention, since the heat-sealing layers of the respective conductors are fused to each other, the shape-retaining force can be substantially enhanced, so that a wire having a small wire diameter can be manufactured. It can be used and the overall thickness can be reduced. Further, according to the method for manufacturing a laminated sheet-integrated antenna coil of the present invention, the insulating coating wire with the heat-sealing layer can be locked to the locking pin protruding from the winding jig so that the shape of the antenna coil can be laid. The antenna coil can be accurately formed in a short time. Further, since the locking pin is housed inside the jig during hot pressing, it is possible to perform fusion bonding in a state in which the insulating coated conductors with the heat-sealing layer are aligned flat on the surface of the jig. Can be made smaller.

According to the non-contact type IC card manufacturing method of the present invention, it is possible to handle the IC card module alone in which the terminal of the antenna coil is connected to the IC module, and to use it for any laminated sheet IC card. Therefore, mass productivity is improved. Further, even if the shape-holding force of the insulating coating conductor with the heat-sealing layer is not so high, it is possible to fuse the heat-sealing layers of the respective conductors to each other to prevent the collapse of the shape, so that a wire having a small wire diameter can be used. Ready to use,
The thickness as an IC card can be reduced.

According to the non-contact type IC card of the present invention, since a laminated sheet in which an antenna coil formed by laying an insulating coated conductive wire with a heat fusion layer is fusion-bonded by hot pressing is used, Laminated sheet I
It can also be used for C cards, improving mass productivity. Further, even if the shape-holding force of the insulating coating conductor with the heat-sealing layer is not so high, the heat-sealing layers of the respective conductors are fused to each other during the hot pressing to substantially enhance the shape-holding force. A small wire can be used, and the thickness of the IC card can be reduced.

[Brief description of drawings]

FIG. 1 is an explanatory diagram showing a laminated sheet-integrated antenna coil according to a first embodiment of the present invention.

FIG. 2 is a flowchart showing a process of manufacturing the laminated sheet-integrated antenna coil of FIG.

FIG. 3 is a perspective view showing a winding jig.

FIG. 4 is a perspective view showing a state in which the upper and lower pins of the winding jig are housed inside the jig.

FIG. 5 is a flowchart showing a wiring process.

FIG. 6 is an explanatory view showing a state in which a winding jig is put into the multi-head wiring robot.

FIG. 7 is an explanatory diagram showing a state in which the winding jig has been moved to a wiring start position.

FIG. 8 is an explanatory diagram showing a state in which upper and lower pins (start pins) are entangled with an insulating coating conductive wire with a heat-sealing layer.

FIG. 9 is a cross-sectional view showing the structure of an insulating coated conductive wire with a heat fusion layer.

FIG. 10 is an explanatory diagram showing a state in which an insulating coated conductive wire with a heat fusion layer is laid between upper and lower pins (reference pins).

FIG. 11 is an explanatory diagram showing a state after the upper and lower pins (end pins) are entangled with the insulating coating conductive wire with the heat-sealing layer.

FIG. 12 is an explanatory view showing a state in which an end of an insulating coated conductive wire with a heat fusion layer is cut.

FIG. 13 is a cross-sectional view showing a state of an insulating coated conductive wire with a heat-sealing layer entwined with upper and lower pins.

FIG. 14 is a flowchart showing a laminating step.

FIG. 15 is a configuration diagram showing a laminator.

FIG. 16 is a cross-sectional view showing a state of the insulating coated conductor with a heat-sealing layer while the winding jig is being pressed.

FIG. 17 is a cross-sectional view showing a state of an insulating coated conductive wire with a heat fusion layer after completion of pressing.

FIG. 18 is an explanatory diagram showing an IC card according to a second embodiment of the present invention.

FIG. 19 is a flowchart showing a process for manufacturing the IC card of FIG.

FIG. 20 is another perspective view showing the winding jig.

21 is an explanatory diagram showing a state in which an IC module is mounted on the IC module mounting portion of the winding jig shown in FIG. 20.

FIG. 22 is a flow chart showing a state in which the wiring of the insulating coated conductor with the heat-sealing layer is completed.

FIG. 23 is another explanatory view showing a state in which the end of the insulating coated conductive wire with the heat fusion layer is cut.

FIG. 24 is a configuration diagram showing an IC card module.

FIG. 25 is another flowchart showing the laminating step.

FIG. 26 is another configuration diagram showing a laminator.

FIG. 27 is an explanatory diagram showing an IC card according to a third embodiment of the present invention.

FIG. 28 is an explanatory view showing a state of an insulating coated conductor with a heat-sealing layer after completion of pressing.

FIG. 29 is a plan view showing an example of a conventional non-contact type IC card.

[Explanation of symbols]

100 Laminate Sheet Integrated Antenna Coil 200, 300 Non-contact IC Card 1 Antenna Coil 1a Insulating Film Conductor Wire with Thermal Adhesion Layer 2, 2a, 2b Laminate Sheet 3 IC Module 10 Center Conductor 11 Insulating Layer 12 Thermal Adhesion Layer 20, 20 'winding jig 21 upper and lower pins 22 IC module mounting portions 32a, 32b laminating sheets with hot melt layer 33, 33a, 33b hot melt layer 40, 40' laminator 41 conveyors 42, 42a, 42b unwinding roll 43 heat insulating plate 44 Press Plate 45 Upper and Lower Cylinders 46 Press 47 Winding Roll 48 Heat Roller 201 IC Card Module

─────────────────────────────────────────────────── ─── Continuation of the front page (56) Reference JP-A-9-265517 (JP, A) JP-A-9-234983 (JP, A) JP-A-8-63565 (JP, A) JP-A-62- 122798 (JP, A) International publication 95/33246 (WO, A1) (58) Fields investigated (Int.Cl. ⁷ , DB name) G06K 19/07 B42D 15/10 521 G06K 19/077

Claims (4)

(57) [Claims] 1. An antenna coil is formed by laying a heat-sealing-layer-insulated coated wire having a heat-sealing layer formed on the outer periphery thereof to form an antenna coil, and the antenna coil is hot-pressed onto a laminate sheet to form the antenna coil. A method for manufacturing a laminated sheet-integrated antenna coil, which comprises compressing the thickness , fusion-bonding wires to each other, and fusion-bonding the antenna coil to a laminate sheet. 2. An antenna coil is formed by locking an insulating coated conductive wire with a heat-sealing layer formed on an outer periphery thereof to a locking pin protruding from a winding jig to form an antenna coil. Hot pressing the coil on the laminate sheet, accommodating the locking pin inside the jig by the pressing pressure, fusion bonding the wire rods of the antenna coil, and fusion bonding the antenna coil on the laminate sheet. A method for manufacturing a laminated sheet-integrated antenna coil, which is characterized. 3. An IC card module is produced by connecting an end of an antenna coil having an insulating coating wire with a heat-sealing layer and a heat-sealing layer formed on the outer periphery thereof to the IC module, to manufacture an IC card module. The thickness of the antenna coil by hot-pressing the antenna module onto the first laminate sheet.
Compressing and fusion bonding the wires together, and fusion bonding the antenna coil to the first laminate sheet, and hot pressing the second laminate sheet onto the first laminate sheet to fuse the laminates together. And a method for manufacturing a non-contact type IC card. 4. An IC module is placed on a winding jig.
And an insulating coating with a heat-sealing layer having a heat-sealing layer formed on the outer periphery
Lock the conducting wire to the locking pin protruding from the winding jig.
Wiring to form an antenna coil, the IC module
Connect the terminal of the antenna coil to the
Make a module and hot melt the antenna coil.
Hot press on the first laminated sheet with layers
The press pin accommodates the locking pin inside the jig.
Together with the wires of the antenna coil are fused and joined together, and
The antenna coil is fusion bonded to the hot melt layer
The hot melt layer of the first laminated sheet.
Hot-press the second laminated sheet with the hot melt layer
Characterized in that the hot melt layers are fused together
Non-contact type IC card manufacturing method .