JP7380254B2 - Contact and non-contact common IC card and contact and non-contact common IC card manufacturing method - Google Patents

Description

The present invention relates to a contact and non-contact common IC card equipped with an external contact terminal and an antenna for contactless communication.

Conventionally, IC cards include contact IC cards that input and output electrical signals through external contact terminals on the surface of the card, non-contact IC cards that input and output electrical signals by electromagnetic induction through an antenna, and IC cards that input and output electrical signals through external contact terminals on the card surface. Contact and non-contact common IC cards are used that can achieve both the functions of a contact IC card and a contactless IC card using a single IC chip. Among them, contact and non-contact shared IC cards can be used as contact IC cards that can prevent external leakage of input/output data during financial payments by using one card properly, and can be used when entering and leaving a room, at ticket gates at stations, etc. It is highly convenient and is becoming increasingly popular, as it can be used as a contactless IC card that allows data to be exchanged in close proximity.

By the way, in the production of contact and non-contact common IC cards, generally, as described in Patent Document 1, first, an IC card base is manufactured by laminating a core sheet and the like on both sides of an antenna sheet on which an antenna coil is formed. On the other hand, by cutting with an end mill, a recessed portion for mounting an IC module including external contact terminals and an IC chip is formed, and both ends of the antenna coil of the antenna sheet are exposed and used as connection terminals.

Next, a conductive adhesive is applied to cover the upper part of the connection terminal, and then the IC module is attached via the adhesive, and the antenna connection terminal of the IC module and the connection terminal of both ends of the antenna coil are The IC module is adhesively fixed to the IC card base so as to be electrically connected by the conductive adhesive. As a result, the IC chip built into the IC module is electrically connected to the external contact terminal, and is also electrically connected to the antenna via the antenna connection terminal, conductive adhesive, and connection terminal, and the contact IC It can be used as a contact and non-contact shared IC card that has both the functions of a card and a non-contact IC card.

Further, Patent Document 2 discloses that a connecting pad having a first portion and a second portion that are electrically connected to each other is attached to each of two ends of an antenna disposed between two layers of plastic. The first part of the connection unit formed on the film is connected, and a solder material is deposited on the second part, forming a cavity in the plastic and introducing the chip card module into the cavity. states that a chip card can be manufactured by contacting the conductive track of the chip card module with the second part of the connection pad and melting the internal solder by heating and soldering the conductive track to the connection pad. has been done.

Japanese Patent Application Publication No. 2009-157666 Special table 2019-511782 publication

Generally, if the antenna formed on the antenna sheet is etched copper foil, the thickness of the antenna is, for example, about 15 μm or more and 75 μm or less, and if it is a wire-wound antenna, the antenna diameter is For example, it is about 50 μm or more and 150 μm or less, so depending on the processing precision of the end mill cutting, there is a risk that the antenna may be penetrated or cut, and because the area at both ends of the antenna coil is small, the connection terminal may not be exposed due to misalignment. Ta. In addition, because the distance between the antenna connection terminal of the IC module and the antenna connection terminal is large in the thickness direction of the card, if the card is bent, etc., the conductive adhesive will break after being applied and cured, causing electrical Connection could be lost.

In addition, as in Patent Document 2, when the internal solder is melted by heating, the shape of the liquefied solder becomes uncertain, so the solder comes off from the conductive track of the chip card module and the electrical connection is damaged. In addition, since the cross-sectional area of the solder in the thickness direction fluctuates, when the card is cut, the bonding area between the solder portion exposed on the surface and the conductive track also fluctuates, which may reduce bonding reliability. In addition, since the distance between the conductive track of the chip card module and the second part of the connection pad in the thickness direction of the chip card is large, and the solder is deposited to connect the two, the conductive adhesive described above cannot be used. Similarly, when the card is bent, etc., the solder, which has an indeterminate shape after hardening, may break and electrical connection may be lost.

The present disclosure has been made in view of this situation, and provides a contact and non-contact common IC card and a method for manufacturing the contact and non-contact common IC card, which improves the reliability of electrical connection between an antenna and an IC module. The challenge is to provide the following.

The contact and non-contact common IC card according to the present embodiment includes a substrate equipped with an external contact terminal on one surface and a plurality of antenna connection terminals on the other surface, and a substrate mounted on the other surface of the substrate. , an IC module having an IC chip that is electrically connected to the external contact terminal and the antenna connection terminal, and an antenna that has conductive blocks electrically connected to both ends thereof. a base, the conductive block is configured with a first portion having a first thickness and a second portion having a second thickness thicker than the first thickness adjacent to each other; The first portion and the end portion of the antenna are electrically connected, and the second portion and the antenna connection terminal are electrically connected via a conductive adhesive layer.

In the contact and non-contact common IC card according to another embodiment of the present invention, the melting point of a portion of the second portion that comes into contact with the conductive adhesive layer may cause the IC module to pass through the conductive adhesive layer to the second portion. The temperature may be higher than the temperature required to adhere to the site.

Furthermore, in the contact and non-contact common IC card according to another embodiment of the present invention, the conductive adhesive layer may include an anisotropic conductive film.

Further, in the contact and non-contact common IC card according to another embodiment of the present invention, the second portion of the conductive block is formed by partially bending a member having the same thickness as the first portion; The second portion may have a void inside.

In the contact and non-contact common IC card according to another embodiment of the present invention, when the contact and non-contact common IC card is viewed from the normal direction of the surface of the contact and non-contact common IC card on which the external contact terminal is arranged, The first portion may have a shape that tapers away from the second portion.

Further, in the contact and non-contact common IC card according to another embodiment of the present invention, a recess or a through hole may be formed in the second portion along the thickness direction.

The method for manufacturing a contact and non-contact common IC card according to the present embodiment includes a substrate provided with an external contact terminal on one surface and a plurality of antenna connection terminals on the other surface, and the other surface of the substrate. a step of preparing an IC module having an IC chip mounted on the external contact terminal and the antenna connection terminal and electrically connected to each other; a first portion having a first thickness; A card incorporating an antenna in which a conductive block is configured adjacent to a second portion having a second thickness that is thicker than the second thickness, and is electrically connected to each of both ends of the conductive block by the first portion. The method includes a step of manufacturing a base body, and a step of electrically connecting the second portion and the antenna connection terminal via a conductive adhesive layer.

According to the present embodiment, it is possible to provide a contact and non-contact common IC card and a method of manufacturing the contact and non-contact common IC card, which improves the reliability of the electrical connection between the antenna and the IC module.

FIG. 2 is a plan view and a cross-sectional view illustrating the structure of a card according to an embodiment of the present disclosure. It is a sectional view showing a card base. FIG. 2 is a plan view illustrating the vicinity of the IC module in FIG. 1(a). FIG. 2 is a cross-sectional view illustrating the vicinity of the IC module in FIG. 1(b). It is a top view explaining the modification regarding a conductive block. It is a top view explaining the modification regarding a conductive block.

Hereinafter, an example of the contact and non-contact common IC card of the present disclosure will be described with reference to the drawings and the like. However, the contact and non-contact common IC cards of the present disclosure are not limited to the embodiments and examples described below.

Note that each figure shown below is shown schematically. Therefore, the size and shape of each part are appropriately exaggerated to facilitate understanding. Further, in each figure, hatching indicating a cross section of a member is omitted as appropriate. Numerical values such as dimensions and material names of each member described in this specification are examples of embodiments, and are not limited to these, and can be appropriately selected and used. In this specification, terms specifying shapes and geometrical conditions, such as terms such as parallel, perpendicular, and perpendicular, are not only meant strictly, but also include substantially the same state.

1. Embodiment of the Present Disclosure An example of an embodiment of the contact and non-contact common IC card of the present disclosure will be described. Here, for convenience of explanation, an XYZ coordinate system will be set for the contact and non-contact common IC card 1. First, as shown in FIGS. 1(a) and 1(b), the external contact terminals 14 of the IC module 7 are arranged with the Z-axis in the normal direction of the main surface of the contact and non-contact common IC card 1. The direction from the main surface on the side where the external contact terminal 14 is not placed to the main surface on the side where the external contact terminal 14 is arranged is defined as the Z2 direction or the upper side in the thickness direction, and the opposite direction is defined as the Z1 direction or the lower side in the thickness direction. do.

Also, when the contact and non-contact common IC card 1 is viewed from the Z2 direction, the X axis is a straight line perpendicular to both short sides of the contactless common IC card 1 and the Z axis, and one of the contact and non-contact common IC cards 1 on the side closer to the external contact terminal 14 is The direction from one short side to another short side is defined as the X2 direction or right side, and the opposite direction is defined as the X1 direction or left side. Furthermore, the straight line perpendicular to the X-axis and the Z-axis is defined as the Y-axis, the direction from one long side on the far side from the external contact terminal 14 to the other long side is defined as the Y2 direction or the upper side, and the opposite direction is defined as the Y1 direction or the upper side. Lower side.

Here, FIG. 1(a) is a plan view of the contact and non-contact common IC card 1 seen from the Z2 direction, and FIG. 1(b) is a plan view of the contact and non-contact common IC card 1 of FIG. 1(a). is a cross-sectional view taken along line AA, which is a straight line parallel to the X-axis passing through approximately the center of the external contact terminal 14 in the vertical direction, and viewed from the Y1 direction. Further, FIG. 2 is a cross-sectional view similar to FIG. 1(b) of the card base 2 before the recess 9 for embedding the IC module 7 is formed by cutting.

An external contact terminal 14 for contact communication with an IC chip 15 built in the IC module 7 is arranged on the surface of the contact/non-contact common IC card 1 on the Z2 direction side. Although details will be described later, the card base 2 shown in FIG. 2 is cut into a cut card base 2a in which a recess 9 is formed. The IC module 7 is embedded and fixed in the recess 9 of the cut card base 2a via the conductive adhesive layer 10 to form the contact and non-contact common IC card 1 shown in FIG. 1(b). Further, inside the card base 2 or the cut card base 2a, an antenna 8 made of a coated conducting wire or the like and wound into a loop shape is disposed approximately near the center in the thickness direction thereof. A pair of conductive blocks 11 composed of a first conductive block 11a and a second conductive block 11b, which are conductive members, are located near the ends 8a and 8b of the antenna 8 from which the coating has been removed, respectively, on the Z2 direction side. electrically connected. The first conductive block 11a and the second conductive block 11b have a substantially L-shaped cross-sectional shape or a symmetrical shape thereof when viewed from the Y1 direction.

Further, on the Z2 direction side of each of the first conductive block 11a and the second conductive block 11b, a pair of conductive adhesive layers 10 each including a first conductive adhesive layer 10a and a second conductive adhesive layer 10b are electrically connected. The pair of conductive adhesive layers 10 are also electrically and mechanically connected to the main surface of the substrate 71 of the IC module 7 on the opposite side to the external contact terminals 14 on the Z2 direction side. ing. Note that the conductive adhesive layer 10 may be arranged separately as the first conductive adhesive layer 10a and the second conductive adhesive layer 10b, or they may be connected together, and the external contact terminals 14 of the substrate 71 of the IC module 7 It may be an embodiment in which a part or all of the main surface on the opposite side is covered.

As a result, the IC module 7 is mechanically connected and integrated with the card base 2 via the conductive adhesive layer 10, and the IC chip 15 built in the IC module 7 and the external contact terminal 14 are electrically connected. Connected. Furthermore, the IC chip 15 and both ends 8a and 8b of the antenna 8 are also electrically connected. Therefore, the contact and non-contact common IC card 1 is compliant with ISO/IEC7816 in addition to ISO/IEC14443 and NFC communication standards, and is capable of contact and non-contact communication based on the same built-in IC chip 15. (wireless communication). Next, each of the main components of the contact and non-contact common IC card 1 will be explained.

(a) Card base The card base 2 refers to a member in a card state before the IC module 7 is embedded. Typically, as shown in FIG. 2, from the bottom in the thickness direction, an oversheet layer 6, a core layer 5 , a core layer 4 and an oversheet layer 3 are laminated in this order. Further, between the core layer 5 and the core layer 4, an antenna 8 wound in a loop shape and made of a coated conducting wire or the like is arranged. In addition, a pair of conductive blocks 11 constituted by a first conductive block 11a and a second conductive block 11b, which are conductive members, are electrically connected near 8a and 8b, which are both ends of the antenna 8. has been done. However, the layer structure of the card base 2 is not limited to this, and may include a three-layer structure of an oversheet layer, a core layer, and an oversheet layer, a two-layer structure of a core layer, and an antenna layer. A five-layer structure including a core layer, a core layer, and an oversheet layer may be used. Further, the surface of the oversheet layer 3 or 6 of the card base 2 opposite to the core layer 4 or 5 may be printed or embedded with a magnetic stripe, and the surface of the oversheet layer 3 or 6 of the core layer 4 or 5 may be printed or embedded. The adjacent surface may be printed.

(i) Core layer As the core layers 4 and 5, a wide variety of white or colored plastic sheets can be used, and the following individual films or composite films thereof can be used. For example, polyethylene terephthalate (PET), PET-G (terephthalic acid-cyclohexanedimethanol-ethylene glycol copolymer), polyvinyl chloride, vinyl chloride-vinyl acetate copolymer, polycarbonate, polyamide, polyimide, cellulose diacetate, cellulose These include triacetate, polystyrene, ABS, polyacrylic acid ester, polypropylene, polyethylene, polyurethane, and the like. The thickness of the core sheet can be appropriately selected in consideration of the overall thickness of the card, and can be, for example, about 0.25 mm or more and 0.38 mm or less. Note that, as will be described later, it is necessary to arrange the antenna 8 on the surface of either the core layer 4 or 5 so that it is sandwiched between the two core layers.

(ii) Oversheet layer For the oversheet layers 3 and 6, the same material as the core layer is usually used, but a transparent material with a thickness of about 0.05 mm or more and 0.10 mm or less may be used. many. From the viewpoint of preventing the occurrence of curling when the laminate of the core layer and the oversheet layer is integrated by heat pressing or the like, it is preferable that the thicknesses of the oversheet layers 3 and 6 are the same, but they are not necessarily the same. You don't have to. The material for the oversheet layer may be any material as long as it has heat-adhesive properties, but even if the oversheet layer itself does not have heat-adhesive properties, a layer of a known adhesive that generates adhesive force by heat etc. may be used. By additionally forming the layer between the core layer and the oversheet layer, the two can be integrated. In addition, when the contact and non-contact common IC card 1 is used as a magnetic card, a magnetic tape is thermally transferred to the main surface side opposite to the core layers 4 and 5 for either or both of the oversheet layers 3 and 6. It may also be embedded in advance by, for example,

(iii) Antenna The antenna 8 built into the cut card base 2a of FIGS. 1(a) and 1(b) and the card base 2 of FIG. 2 uses, for example, the 13.56 MHz HF frequency band. The IC chip 15 may be a device that performs close-range communication, or may be a device that performs communication using a UHF frequency band of 920 MHz, for example, but when performing contactless communication, the IC chip 15 is connected to an external reader/writer (information reading/writing device). It is placed to communicate with. When the contact/non-contact shared IC card 1 is held over the reader/writer, the antenna 8 generates a current due to a magnetic field generated by the reader/writer, and supplies power to the IC chip 15 . This enables the IC chip 15 to be driven, and when performing contactless communication, transmits and receives information to and from the reader/writer, rewrites information, and the like.

The antenna 8 is typically formed of a covered conductor wire, which is a copper wire whose periphery is coated with an insulating material. In addition, copper alloy wires such as Cu-Ni, Cu-Cr, Cu-Zn, Cu-Sn, and Cu-Be, or various metal wires and metal alloy wires such as iron, stainless steel, and aluminum can be selected. You can also. By using a coated conducting wire, the contact and non-contact common IC card 1 can be formed at a lower cost than, for example, a copper foil etching method. However, the antenna 8 may be formed by etching copper foil, aluminum foil, or the like. Next, FIG. 3(a) is an enlarged view of the vicinity of the IC module 7 in FIG. 1(a). Further, FIG. 3(b) is a diagram showing a state in which the IC module 7 is removed in FIG. 3(a), and FIG. 3(c) is a diagram showing a state in which the oversheet layer 3 and core layer 4 are further removed. FIG. 3 is a diagram showing a state in which a pair of conductive blocks 11 are exposed. 4(a) is an enlarged view of the vicinity of the IC module 7 in FIG. 1(b), and FIG. 4(b) is an enlarged view of the card base 2 before forming the recess 9 for embedding the IC module 7. A diagram showing the state, FIG. 4(c), is an enlarged view of the vicinity of the first conductive block 11a.

As shown in FIG. 3(a), both ends 8a and 8b of the antenna 8 are arranged on the left and right outer sides of the external contact terminals 14 of the IC module 7 so that the conductive wires are approximately parallel to the Y axis. For convenience, the end portion on the X1 direction side is designated as 8a, and the end portion on the X2 direction side is designated as 8b. In addition, the portions near both ends 8a and 8b of the antenna 8 that contact the first conductive block 11a and the second conductive block 11b are exposed with the coating peeled off in advance for electrical connection thereto. It is made of copper wire.

(iv) Conductive block As shown in FIGS. 2 and 4(b), a first conductive block having a conductive member is provided on the Z2 direction side near the ends 8a and 8b of the antenna 8 from which the coating is removed. A pair of conductive blocks 11 including a block 11a and a second conductive block 11b are electrically connected. Further, as shown in FIG. 3A, when the vicinity of the IC module 7 of the contact and non-contact common IC card 1 is seen through from the Z2 direction, the first conductive block 11a is located at the left end of the external contact terminal 14 of the IC module 7. and the vicinity of the end 8a of the antenna 8.

Further, the second conductive block 11b is similarly arranged so as to overlap both the right end region of the external contact terminal 14 of the IC module 7 and the vicinity of the end portion 8b of the antenna 8. Note that the back side of the substrate 71 (opposite to the external contact terminals 14 of the substrate 71) corresponds to the left end and right side areas of the external contact terminals 14 of the IC module 7 where the first conductive block 11a and the second conductive block 11b overlap. As shown in FIG. 4A, a first antenna connection terminal 71a and a second antenna connection terminal 71b, which are electrically connected to the IC chip 15, are arranged on the main surface side).

As shown in FIG. 4(a), the pair of conductive blocks 11, the first conductive block 11a and the second conductive block 11b, have a substantially L-shaped cross section or a symmetrical shape thereof when viewed from the Y1 direction. There is. As illustrated in FIG. 4(c), the first conductive block 11a has a thin thickness h11 along the Z axis, and a first portion 12a of a plate-shaped portion that extends in the X1 direction by a length d11. , the second portion 13a of the plate-like portion has a thickness h1 thicker than h11 by h12 along the Z axis, and a length d12 along the X axis. Note that both the first conductive block 11a and the second conductive block 11b are arranged above the antenna 8, that is, on the Z2 direction side. Although it is possible to join both conductive blocks so that they come into contact with the lower end of the antenna 8, the former allows the thickness h1 of the second portion 13a along the Z axis to be thinner, and the conductive block 11 can be made smaller. This is advantageous from the viewpoint of reducing heat capacity.

Here, the thickness h1 of the second portion 13a of the first conductive block 11a is the distance from the upper end of the antenna end 8a to the lower end of the conductive adhesive layer 10 along the Z axis, as shown in FIG. 4(c). The antenna 8 is preferably arranged near the center in the thickness direction of the card base 2, which has a thickness of about 0.8 mm, from the viewpoint of preventing warping of the card base 2, etc. In consideration of this, it is preferable that the thickness be 0.1 mm or more and 0.3 mm or less. Further, the length of the second portion 13a along the Y axis may be approximately 2.0 mm or more and 10.0 mm or less, although it depends on the cross-sectional shape of the first conductive block 11a along the XZ plane. preferable.

On the other hand, in the dimensions of the first conductive block 11a, it is preferable that the ratio of the thickness h1 of the second portion 13a to the thickness h11 of the first portion 12a be 1.3 or more and 20.0 or less. This is preferable from the viewpoint of reducing the heat capacity of the block 11a and ensuring the physical strength of the first portion 12a in particular. Furthermore, in order to stably ensure these characteristics during mass production, it is more preferable that the ratio be 2.0 or more and 10.0 or less.

Further, for the same reason as above, it is preferable that the ratio of the length d1 along the X axis to the thickness h1 of the second portion 13a of the first conductive block 11a is 20.0 or more and 60.0 or less. , more preferably 30.0 or more and 50.0 or less. On the other hand, it is preferable that the ratio of the overall length d1 to the length d12 along the X-axis of the second portion 13a of the first conductive block 11a is 1.5 or more and 7.0 or less.

On the other hand, the Z1 side surface of the first portion 12a of the first conductive block 11a and the Z2 side surface of the second portion 13a are preferably substantially parallel to the XY plane and flat. In particular, regarding the second portion 13a that is difficult to weld, the maximum angle formed by the Z2 side surface of the second portion 13a with respect to the surface of the first recess 9a of the cut card base 2a may be 5° or less. preferable. Thereby, when the Z2 side surface of the second portion 13a is cut when forming the first recess 9a and the conductive adhesive layer 10 is pasted, an appropriate contact area is secured and bonding with the conductive adhesive layer 10 is ensured. This is to perform well. However, from the viewpoint of adhesion with the conductive adhesive layer 10, minute irregularities with an arithmetic surface roughness Ra of approximately 0.5 μm or more and 50.0 μm or less are formed on the Z2 side surface of the second portion 13a. It's okay. In addition, from the viewpoint of securing the above-mentioned appropriate contact area, the cross-sectional area of the second portion 13a on the surface of the first recess 9a of the cut card base 2a is 0.00 mm from the surface of the first recess 9a in the Z1 direction. It is preferable that the ratio of the cross-sectional area of the second portion 13a cut along the XY plane at an arbitrary depth of up to 1 mm is 0.8 or more and 1.2 or less.

The first portion 12a and the second portion 13a are adjacent to each other, and may be integrally formed of the same member, or may be made of different members joined to each other. Further, the second conductive block 11b is also bilaterally symmetrical with the first conductive block 11a, and similarly, the first part 12b of the plate-shaped part is thin and extends in the X2 direction, and the first part 12b has a thin thickness along the Z axis. The second portion 13b of the plate-like portion is thicker than the second portion 13b.

As described above, the reason why the first conductive block 11a has the first portion 12a and the second portion 13a having different thicknesses is because the antenna end portion 8a and the contact/non-contact common IC card 1 are arranged at different positions in the thickness direction. The first conductive block 11a is electrically connected to the first antenna connection terminal 71a of the IC module 7, and the cross-sectional area and volume when cut along a plane parallel to the XZ plane are minimized. This is to minimize the heat capacity of the Furthermore, the surface of the first portion 12a of the first conductive block 11a on the side to be bonded to the antenna terminal 8a and the surface of the second portion 13a on the side to be bonded to the conductive adhesive layer 10 are both formed as flat surfaces. By doing so, a sufficient contact area with the antenna 8 and the conductive adhesive layer 10 can be secured, and a highly reliable electrical connection can be achieved. It should be noted that all of the above explanations regarding the first conductive block 11a also apply to the second conductive block 11b.

The material used for the conductive block 11 is one that has conductivity to contribute to the electrical connection between the IC chip 15 and the antenna 8, and as described later, the recess 9 for embedding the IC module 7 is cut. There is no particular limitation as long as it has machinability when cutting and hardness and strength that will not break due to external forces such as bending the card. However, when the connection to the antenna 8 is performed by welding, it is preferable to have weldability with antenna members such as copper wires and adhesiveness with the conductive adhesive layer 10 described later.

Furthermore, the melting point of at least the portions of the conductive block 11 that contact the conductive adhesive layer 10 of the second portions 13a and 13b is such that the IC module 7 is bonded to the second portions 13a and 13b via the conductive adhesive layer 10. The temperature is preferably higher than that required for Note that the temperature required to bond the IC module 7 to the second portions 13a and 13b via the conductive adhesive layer 10 means, for example, if the conductive adhesive layer 10 is made of thermoplastic resin, the temperature is the temperature required to soften it. , or a heating temperature for melting, and if the conductive adhesive layer 10 is a thermosetting resin or the like, a heating temperature for softening, causing a crosslinking reaction, etc., or activating the adhesive force. There may be.

In addition, when the conductive adhesive layer 10 contains solder, if the solder is Sn-Pb type (including Sn-Pb-Bi type and Sn-Pb-Ag type), the melting point is about 180°C or more and 300°C or less, A lead-free solder has a melting point of about 120° C. or more and 250° C. or less, but the conductive block 11 should be made of a material that has a melting point higher than that of the solder actually used.

In addition, when the conductive adhesive layer 10 is made of a hot melt adhesive, for example, according to the softening point test method of the ring and ball method defined in JIS K6863-1994 (softening point test method for hot melt adhesives). The conductive block 11 can be made of a material having a higher softening point. On the other hand, when the conductive adhesive layer 10 is composed of an epoxy resin adhesive, for example, the softening point test method defined by JIS K7234-1986 (softening point test method for epoxy resin) or the mercury substitution method is used. The conductive block 11 can be made of a material having a softening point higher than the above softening point. For conductive adhesive layers 10 other than those mentioned above, the temperature that is substantially recognized as the melting point, softening point, etc. can be measured in accordance with the above method, or if it is difficult to implement the above method, without being limited to this method. Just convert it.

The material of the conductive block 11 that meets the above requirements may vary depending on the temperature required to bond the conductive adhesive layer 10 with the second portions 13a and 13b, but may be, for example, copper, aluminum, iron, Metals such as stainless steel, brass, brass, bronze, gold, silver, titanium, lead, etc., with an overall volume resistivity of 80 x 10 ^-8 Ωm or less at 0°C and a melting point of 300°C or higher. Things can be mentioned. In particular, it is necessary to melt the conductive adhesive layer 10 at a high temperature, and from the viewpoint of achieving good non-contact communication, the volume resistivity is 20 × 10 ^-8 Ωm or less and the melting point is 500 ° C. or higher. Aluminum, gold, silver, copper, brass, brass, and bronze are more preferred.

Further, the conductive block 11 may be made of the same metal, or, for example, the first portions 12a and 12b and the second portions 13a and 13b may be made of different metals. For example, for the first parts 12a and 12b of the conductive block 11, which are arranged relatively apart from the conductive adhesive layer 10, a member having a melting point lower than the softening point of the conductive adhesive layer 10 is used, and the conductive adhesive For the second portions 13a and 13b that come into contact with the layer 10, a member having a melting point higher than the softening point temperature of the conductive adhesive layer 10 may be used. By doing so, it is possible to expand the selection range of members for the conductive block 11 as a whole while suppressing a decrease in connection reliability with the conductive adhesive layer 10 due to thermal deformation of the conductive block 11.

Furthermore, the members used for the second parts 13a and 13b that come into contact with the conductive adhesive layer 10 conduct the heat applied for adhesion with the conductive adhesive layer 10 to the first parts 12a and 12b, and the surrounding cutting In order to suppress thermal deformation of the finished card base 2a, it is preferable to use a material that conducts heat as little as possible. For example, bronze, platinum iridium, platinum rhodium, lead, titanium, iron, stainless steel, tin, etc., which have a thermal conductivity of 70 W/m·K or less, are preferable on the premise that they have a melting point higher than the softening point of the conductive adhesive layer 10. can be selected. Among them, platinum-iridium, platinum-rhodium, lead, titanium, iron, stainless steel, and the like having a thermal conductivity of 40 W/m·K or less are effective in further suppressing thermal deformation of the cut card base 2a.

Alternatively, the main body of the conductive block 11 can be made of the same metal, and the outer surface can be plated with a different metal. As an example, it is conceivable to form the inside of the conductive block 11 with copper, brass, or bronze, and to apply silver plating or gold plating to the entire outer surface or only the contact area with the antenna 8 and the conductive adhesive layer 10. . Thereby, the antenna 8 can be well welded to the conductive block 11, or the IC module 7 and the conductive block 11 can be well electrically and mechanically connected via the conductive adhesive layer 10. Can be done.

In the pair of conductive blocks 11 as described above, in particular, the thickness of the second portions 13a and 13b may be formed to be slightly thicker than h1 in FIG. 4(c). In this case, as shown in FIG. 4(b), the upper ends of the second parts 13a and 13b are configured to protrude slightly into the planned area of the first recess 9a, which is the wide part of the recess 9 for embedding the IC module 7. Become. In other words, as shown in FIG. 4B, the first conductive block 11a and the second conductive block extend in the thickness direction from the main surface of the card base 2 on the side where the first recess 9a of the recess 9 is formed. The shortest distance e2 from the end mill to the second portions 13a and 13b is the shortest distance e2 along the thickness direction from the main surface of the non-cutting region of the card base 2a cut by the end mill on the side where the first recess 9a of the recess 9 is formed. The distance e1 can be made shorter than the shortest distance e1 to the lower end of the first recess 9a.

Here, when cutting the recess 9 with an end mill, the upper ends of the first portions 12a and 12b that protrude slightly are cut together, and the lower surface portion of the first recess 9a of the card base 2 and the surface portion of the conductive block 11 are cut together. form the same plane. Therefore, good electrical and mechanical connection can be made between the IC module 7 and the antenna 8 via the conductive adhesive layer 10.

Furthermore, even if the arrangement of the conductive block 11 in the thickness direction with respect to the card base 2 is slightly shifted downward from its original position, the amount of shift does not exceed the difference between e1 and e2 described above. As far as possible, e2 is always shorter than e1, so when cutting the recess 9 with an end mill, the upper ends of the first portions 12a and 12b are not exposed to the lower surface of the first recess 9a of the cut card base 2a. Can be suppressed. Furthermore, since a flat surface is formed on the surface of the second portion 13a that is bonded to the conductive adhesive layer 10, even if the cutting depth by the end mill changes, the conductive bonding of the cut surface of the second portion 13a The area of the surface facing the layer 10 is always constant, so that a stable contact area with the conductive adhesive layer 10 can be ensured, and a highly reliable electrical connection can be achieved.

(b) IC module Next, after forming a recess 9 in the card base 2 by cutting to obtain a cut card base 2a, the IC module is embedded in the cut card base 2a via the conductive adhesive layer 10. The IC module 7 will be explained. As shown in FIGS. 3(a) and 4(a), the IC module 7 has an approximately rectangular flat substrate 71 with rounded corners, and has external contact terminals 14 on one side and external contact terminals 14 on the other side. It is provided with a first antenna connection terminal 71a and a second antenna connection terminal 71b which are antenna connection terminals, and a molded part 72 which is a protruding part in which the IC chip 15 is built. Each of the main components of the IC module 7 will be explained below.

(i) Substrate The substrate 71 is a flexible resin film made of glass epoxy resin, polyimide resin, etc., with copper foil pasted on the front and back sides of the resin film via an adhesive, and the copper foil pasted on the front and back sides of the resin film. are left to form a predetermined pattern. Specifically, the photosensitive material is applied so as to form the external contact terminal 14 on one copper foil surface of the resin film, and the first antenna connection terminal 71a and the second antenna connection terminal 71b on the other copper foil surface. By sequentially performing the steps of attaching, placing a film plate with a predetermined pattern formed thereon, exposing it to light, and etching away the non-exposed areas, a substrate 71 with a predetermined pattern of copper foil partially remaining on the front and back surfaces of the resin film is formed. It is formed. Further, the substrate 71 is provided with a plurality of through holes (not shown) in advance for wire bonding to the external contact terminals 14.

(ii) IC Chip The IC chip 15 is bonded and fixed to the surface of the substrate 71 opposite to the surface on which the external contact terminals 14 are formed via an adhesive. The IC chip 15 includes a CPU for controlling operations of both contact and non-contact communications, a storage device such as RAM, EEPROM, and flash memory, and decoding of input signals and generation of output signals for contact and non-contact communications. It is equipped with various circuits such as interface circuits and power generation circuits. Note that the various circuits may be provided as separate elements from the IC chip. The IC chip 15 is adhesively fixed to the center of the surface of the substrate 71 on which the first antenna connection terminal 71a and the second antenna connection terminal 71b are formed, and is bonded to the pad on the circuit surface of the IC chip 15 using an adhesive. Each terminal section of the external contact terminal 14 is connected with a wire 16, such as a gold wire, passing through a through hole in the substrate 71. Further, the pads of the IC chip 15 and the first antenna connection terminal 71a and the second antenna connection terminal 71b of the substrate 71 are similarly connected with the wire 16.

(iii) Mold part On the mounting surface of the IC chip 15 of the substrate 71 on which the above-mentioned IC chip 15 is mounted and the wires 16 are connected, in order to protect the IC chip 15 and the wires 16 from external force loads and environmental loads, A mold portion 72 which is a protruding portion covering these is formed. As the mold part 72, an ultraviolet curable resin, a thermosetting resin, or the like is used.

(c) Conductive adhesive layer After forming a recess 9 for embedding the IC module 7 in the card base 2 by cutting with an end mill, the above-mentioned IC module 7 is embedded and fixed in the cut card base 2a. Now, the conductive adhesive layer 10 that connects electrically and mechanically will be explained. The conductive adhesive layer 10 is a liquid or tape-like member that is applied or pasted on the upper side of the second portion 13a of the first conductive block 11a in the thickness direction, as shown in FIG. 4(c). The same applies to the second conductive block 11b. However, the conductive adhesive layer 10 does not necessarily need to be applied or pasted on the first conductive block 11a or the second conductive block 11b first, and the first antenna connection terminal 71a and the second antenna connection terminal 71b may be painted or pasted.

Further, the conductive adhesive layer 10 may be applied or attached to the entire back surface of the substrate 71 in order to serve as a mechanical connection between the IC module 7 and the cut card base 2a. However, the conductive adhesive layer 10 is applied and pasted on the back surface of the substrate 71 so as to cover only the areas of the first antenna connection terminal 71a and the second antenna connection terminal 71b, and on the other back surface of the substrate 71, Another non-conductive adhesive may be applied or pasted. This is because, by not considering conductivity, it is easier to select another adhesive that is more advantageous for mechanical connection.

Such a conductive adhesive layer 10 may be an ACF (Anisotropic Conductive Film), that is, an anisotropic conductive film, an ACP (Anisotropic Conductive Paste), or other materials in which silver particles are dispersed as a filler in an epoxy resin. A conductive paste or the like can be used. Among these, if ACF is used, ACF is thermally laminated on the entire back surface of the substrate 71 of the IC module 7, and after the IC module 7 is buried in the recess 9 of the cut card base 2a, it is heated at a predetermined temperature and under a load. By heat pressing, the IC chip 15 and the antenna 8 can be electrically connected. Furthermore, since the IC module 7 can be mechanically connected to the cut card base 2a at the same time, the process of mounting the IC module 7 onto the cut card base 2a can be simplified.

(d) Method for manufacturing a contact and non-contact common IC card Next, an example of a method for manufacturing a contact and non-contact common IC card 1 using the above-described card base 2, IC module 7, and conductive adhesive layer 10 will be explained. .

(i) Forming an antenna on the core layer First, a coated conductive wire coated with an insulating material is attached to the antenna end on the surface of either the core layer 5 or 4 on the side that is not adjacent to the oversheet layer 6 or 3. Starting from either part 8a or 8b, it is embedded using a winding machine. Specifically, for example, while applying a predetermined heat pressure to the core layer 5, an antenna supply head is drawn in a loop shape as shown in FIG. 1(a), and the antenna 8 supplied from the antenna supply head is drawn. are sequentially embedded in the core layer 5. Here, the antenna 8 is arranged on the left and right sides of the intended mounting position of the IC module 7 so that the vicinity of the antenna ends 8a and 8b are vertically aligned, and the antenna 8 is cut at the end point. Furthermore, it is preferable that the coating be removed in advance around the antenna ends 8a and 8b for electrical connection to the conductive block 11 in a later process. Although FIG. 1A shows a card-shaped cut card base 2a, the actual antenna formation is often performed in units of large-sized sheets in which cards are arranged vertically and horizontally on multiple sides.

(ii) Connection of the conductive block to the end of the antenna Next, as shown in FIG. A first conductive block 11a and a second conductive block 11b, which are a pair of conductive blocks 11, are electrically and mechanically joined at a position overlapping with the IC module 7 to be mounted later. For example, the first conductive block 11a is made of phosphor bronze, which has excellent corrosion resistance, fatigue resistance, abrasion resistance, etc., and has its outer circumference plated with silver to improve weldability.

As shown in FIGS. 2 and 3(c), the first conductive block 11a has a substantially inverted L-shaped cross-sectional shape when viewed from the Y1 direction, which is the side surface of the card, and a planar shape when viewed from the Z2 direction. is a rectangular shape. Further, the second conductive block 11b is also symmetrical with respect to the first conductive block 11a. Here, the thinner first portions 12a and 12b of the first conductive block 11a and the second conductive block 11b are joined to the vicinity of the ends 8a and 8b of the antenna 8 by welding, respectively.

(iii) Manufacture of card base Using the core layer 5 on which the antenna 8 and the pair of conductive blocks 11 are formed, as shown in FIG. 4 and oversheet layer 3 are stacked in this order. Thereafter, a unit of a stack of large sheets in which cards are arranged horizontally and vertically is sandwiched between stainless steel plates from above and below in the thickness direction, and heat pressure is applied to the stack through the stainless plates. By going through such a hot press step, it is possible to obtain a card base in the form of a large sheet in which each layer of the laminate is integrated. In addition, if either the oversheet layer or the core layer has heat resistance that does not allow heat-sealing at a predetermined temperature, an adhesive sheet that heat-seals at a predetermined temperature may be sandwiched between each layer, or an adhesive may be applied. Then, by subjecting them to a hot pressing process, an integrated large-sized sheet unit card base is obtained.

Note that depending on the size of the first conductive block 11a in FIG. 4(c), that is, the length d11 and thickness h11 of the first portion 12a, and the length d12 and thickness h1 of the second portion 13a, the core layer 5 Corresponding through-holes or recesses are formed in advance in the contact area of the core layer 4 with the first conductive block 11a, particularly in the contact area with the thick second portion 13a. It is preferable. The same applies to the second conductive block 11b. By doing this, when heat pressure is applied from above and below in the thickness direction, the risk of appearance defects due to thermal deformation on the front and back surfaces of the card base due to the influence of the locally thick conductive block 11 is reduced. can be done.

(iv) Punching the card base into a card size and forming a concave portion The card base obtained in the above manner in large-sized sheets in which cards are arranged on multiple sides vertically and horizontally is cut into an ISO/IEC7816 card by a punching machine. A card base 2 of the same size is punched out. Furthermore, a cut card base 2a is obtained by forming a recess 9 for embedding the IC module 7 in the card base 2 by cutting with an end mill. The recess 9 is composed of two stages: a first recess 9a for accommodating the flat substrate 71, and a second recess 9b for accommodating the mold portion 72, which is a convex portion.

At this time, as shown in FIG. 4(b), the first conductive block 11a and the second conductive block 11b are arranged such that their upper ends slightly protrude into the region where the recess 9 is to be formed. Therefore, when cutting the first recess 9a of the recess 9 in the card base 2, the upper ends of the first conductive block 11a and the second conductive block 11b are cut together. Therefore, as described above, the subsequent electrical and mechanical connection between the IC module 7 and the antenna 8 via the conductive adhesive layer 10 is made well, and the arrangement of the conductive block 11 in the thickness direction with respect to the cut card base 2a is ensured. It becomes possible to widen the permissible range of

(v) Attaching the conductive adhesive layer to the IC module On the other hand, apart from manufacturing the card base 2 and processing the cut card base 2a, the conductive adhesive layer 10 is attached to the IC module 7. As the IC module 7, a module tape is usually used in which the IC module 7 is continuously formed on a long tape in one or two rows. A tape-shaped ACF is pasted onto the surface of this module tape opposite to the surface on which the external contact terminals 14 are formed while applying a constant heat pressure. Thereafter, the module tape with the ACF pasted thereon is punched out using a punching machine to form a substantially rectangular IC module 7 with rounded corners, thereby obtaining the IC module 7 with the conductive adhesive layer 10 pasted thereon.

(vi) Embedding the IC module in the card base and electrical connection Thereafter, as shown in FIG. 3(a), the conductive adhesive layer 10 was attached to the cut card base 2a in which the recess 9 was formed. The IC module 7 is buried, a heat block (not shown) is pressed against the external contact terminal 14, and a predetermined heat pressure is applied for a predetermined time. As a result, the conductive adhesive layer 10 made of ACF is melted and a thermosetting reaction is caused, thereby forming the upper end portions of the first conductive block 11a and the second conductive block 11b, as shown in FIG. 4(a). , and the conductive adhesive layer 10 disposed above can be electrically and mechanically bonded to each other at their interfaces 91a and 91b. Further, the first recess 9a of the cut card base 2a where the conductive block 11 is not present and the conductive adhesive layer 10 disposed above the first recess 9a are bonded only mechanically. ACF has different application times and heat and pressure conditions depending on its type and composition, but as an example, the time is 0.5 seconds or more and 10.0 seconds or less, the temperature is 150°C or more and 250°C or less, and the pressure is can be set to 20 MPa or more and 100 MPa or less.

On the other hand, in the case of the conductive block 11 made of phosphor bronze, its solid phase melting point is thought to be between 880°C and 975°C, so the heating temperature for promoting the softening and thermosetting reaction of ACF is, for example, 250°C. Even if there is, the conductive block 11 will not be softened by the heating. Therefore, the electrical connection with the IC module 7 may be impaired because the shape of the conductive block 11 becomes uncertain, and the amount of heat transferred to the core layer and oversheet layer increases due to the conductive block 11 being deformed in the left-right direction. However, it is possible to suppress appearance defects on the card base 2. Furthermore, it is possible to prevent the conductive block 11 from becoming weakened due to thermal deformation and breaking when the card is bent or the like, resulting in loss of electrical connection.

Here, electrical connection is made between the vicinity of the antenna end 8a and the first portion 12a of the first conductive block 11a, and between the second portion 13a of the first conductive block 11a and the first antenna connection terminal 71a of the IC module 7. Explain the difference between electrical connection and The former, as described above, involves bringing the first portion 12a of the first conductive block 11a made of metal close to the end portion 8a of the antenna 8, which is embedded and formed on the core layer 5 using a winding machine or the like. , electrical connection can be easily made by welding using electric discharge. Sufficient work space for welding can be secured around the antenna end 8a and the first conductive block 11a, and even if the core layer 5 is thermally deformed due to high-temperature welding, final contact and non-contact can be quickly established. This is because there is less possibility that the common IC card 1 will have a defective appearance.

On the other hand, in the latter case, after covering the recess 9 of the cut card base 2a with the IC module 7, the second portion 13a of the first conductive block 11a inside and the first antenna connection terminal 71a of the IC module 7 are connected. It is necessary to make electrical connections. In this case, either the second portion 13a of the first conductive block 11a itself is provided with thermal adhesive properties, or the second portion 13a of the first conductive block 11a and the first antenna connection terminal 71a of the IC module 7 are connected. , it is necessary to separately sandwich the conductive adhesive layer 10 and bond it by thermally melting it or the like. However, as long as the connection part is hidden, welding or other means cannot be used.

Further, as described above, when the second portion 13a itself is given adhesive properties by heating, such as by configuring the second portion 13a of the first conductive block 11a with solder, the shape of the first conductive block 11a changes due to melting. There is a possibility that the connection reliability between the first conductive block 11a and the first antenna connection terminal 71a is reduced, and the external appearance of the cut card base 2a itself is deteriorated due to changes in heat conduction. Therefore, only the conductive adhesive layer 10 sandwiched between them is thermally melted under temperature conditions that do not melt the second portion 13a of the first conductive block 11a, thereby electrically connecting the first conductive block 11a and the first antenna connection terminal 71a. Connection reliability must be ensured. That is, it is essential that the melting point of the portion of the second portion 13a that comes into contact with the conductive adhesive layer 10 is higher than the temperature required to bond the IC module 7 to the second portion 13a via the conductive adhesive layer 10. becomes. Naturally, these also have the same relationship with the second conductive block 11b.

In this way, at least the melting point of the thicker second portions 13a and 13b of the conductive block 11 at the portions that contact the conductive adhesive layer 10 is necessary for bonding the conductive adhesive layer 10 to the second portions 13a and 13b. The conductive adhesive layer 10 is firmly electrically and mechanically connected to the conductive block 11 by heating the conductive adhesive layer 10 at a temperature higher than the heating temperature for promoting the softening and thermosetting reactions of the ACF constituting the conductive adhesive layer 10. It will be connected.

Taking the first conductive block 11a as an example, the pair of conductive blocks 11 includes an antenna end 8a on the cut card base 2a side, and a first antenna connection terminal 71a arranged on the back surface of the substrate 71 of the IC module 7. A thin first portion 12a that functions as a connection bridge in the left-right direction, and a thick portion 12a that functions as a connection bridge in the thickness direction of the antenna end portion 8a and the first antenna connection terminal 71a. The second portion 13a is a conductive member having a substantially L-shaped or substantially inverted L-shaped cross section.

By forming the pair of conductive blocks 11 in such a shape, the heat capacity of the conductive blocks 11 can be reduced compared to a case where the entire conductive block 11 is a flat member having the thickness of the second portion 13a. . Therefore, when the external contact terminals 14 of the IC module 7 are heated by the heat block, the heat accumulated in the conductive block 11 is radiated to the surroundings, and the core layers 4 and 5 of the card base 2 and the oversheet layers 3 and 6 of the card base 2 are heated. This can prevent thermal deformation and poor appearance. In addition, by reducing the volume of foreign substances other than the core layer and oversheet layer sandwiched inside the card base 2 as much as possible, thermal deformation of the card base 2 during the heat pressing process that applies heat pressure from above and below in the thickness direction It is possible to suppress appearance defects due to

2. Modifications Modifications of the contact and non-contact common IC card of the present disclosure, particularly regarding the conductive block, will be described.

(a) Modification 1
FIG. 5(a) shows a plan view of the conductive block 21 according to Modification Example 1, which is similar to FIG. 3(c) in the contact and non-contact common IC card of the present disclosure. The first conductive block 21a and the second conductive block 21b constituting the conductive block 21 are bilaterally symmetrical like the conductive block 11 of the embodiment, and although not shown, correspond to FIG. 4(b). The cross section viewed from the Y1 direction is approximately L-shaped or approximately inverted L-shaped. However, as shown in FIG. 5(a), the first portions 22a and 22b, which are thinner than the second portions 23a and 23b, which are thicker, extend along the X-axis from the second portions 23a and 23b. The conductive block 11 of the embodiment differs from the conductive block 11 in that the width of the first portion along the Y-axis becomes smaller as the distance moves away, and the first portion has a tapered shape.

In this way, the width of the thin first portions 22a and 22b along the Y axis gradually tapers away from the second portions 23a and 23b along the X axis. The volume and heat capacity of the conductive block 21a and the second conductive block 21b can be further reduced. Therefore, without reducing the contact area between the conductive adhesive layer 10 and the conductive block 21, thermal deformation of the surrounding card base 2 due to heat accumulation and heat radiation in the conductive block 21 when the conductive adhesive layer 10 is heated can be prevented. This can be further suppressed.

(b) Modification 2
Next, FIG. 5(b) shows a plan view of a conductive block 31 according to a second modification, which is similar to the first modification described above. In the first conductive block 31a and the second conductive block 31b constituting the conductive block 31, a recess or a through hole 34 along the thickness direction is formed in the thick second portion 33a or 33b. Except for this, the conductive block 31 according to the second modification has the same shape as the conductive block 21 according to the first modification. By forming recesses or through holes 34 in the thicker second portions 33a and 33b of the conductive block 31, the upper surfaces of the second portions 33a and 33b and the conductive adhesive layer 10 disposed above the second portions 33a and 33b are formed. The mechanical adhesion can be strengthened due to the wedge effect between the two. In addition, the surface area of the conductive block 31 increases by the amount of the recess or through hole, increasing the heat dissipation effect. The thermal deformation of can be further suppressed.

(c) Modification example 3
Next, FIG. 5(c) shows a plan view of a conductive block 41 according to modification 3. In this modification, unlike the above-described embodiments and modifications, the conductive block 41 is divided into two parts, a first conductive block 41a and a third conductive block 41c, which are arranged as a portion connecting to the vicinity of the antenna end 8a, A second conductive block 41b and a fourth conductive block 41d, which are divided into two parts, are arranged as parts connected to the vicinity of the antenna end 8b. That is, the conductive block 41 is divided into four parts. Further, although not shown, the cross section of each of the four conductive blocks when viewed from the Y1 direction corresponding to FIG. 4(b) is approximately L-shaped or approximately inverted L-shaped, as in the embodiment.

As described above, since the conductive block 41 is divided into four parts, the surface area of the conductive block 41 as a whole increases, thereby increasing the heat dissipation effect. Thermal deformation of the surrounding card base 2 due to accumulation and heat radiation can be effectively suppressed. Furthermore, since the conductive block connected to the vicinity of the antenna end 8a and the conductive block connected to the vicinity of the antenna end 8b are each divided into two parts, for example, the conductive blocks connected to the vicinity of the antenna end 8a are divided into two parts. Even if an electrical connection failure occurs in either one of the blocks, since the other conductive block is electrically connected, good electrical connection can be ensured as a whole. Thereby, the reliability of the electrical connection between the conductive block and the antenna 8 can be improved. Further, even when the card is bent, etc., the internal stress applied to the conductive block 41 is dispersed to each of the four divided conductive blocks, so that breakage of the conductive block 41 is suppressed.

(d) Modification example 4
Subsequently, FIG. 5(d) shows a plan view of a conductive block 51 according to modification example 4. In this modification, the conductive block 51 includes a first conductive block 51a and a second conductive block 51b, with the first conductive block 51a near the antenna end 8a and the second conductive block 51b near the antenna end 8b. It is connected. Here, in the first conductive block 51a, the thin first portion 52a has a single plate-like structure, but the thicker portion is parallel to the second portion 53a along the Y axis. This differs from the above-described embodiment and modified example in that it is divided into a third portion 53c.

Further, the second conductive block 51b is also formed symmetrically with the first conductive block 51a, and the thin first portion 52b has a single plate-like structure, whereas the thick portion has a plate-like structure. , a second portion 53b, and a third portion 53d parallel to the second portion 53b along the Y axis.

In this way, the conductive block 51 has a single-layer structure in the thin first parts 52a and 52b, whereas the part formed above has a second part in addition to the second parts 53a and 53b. It has three parts 53c and 53d. Therefore, the heat dissipation effect is enhanced by increasing the surface area of the conductive block 51 as a whole, especially in the second and third portions that can reach the highest temperature, and when heating the conductive adhesive layer 10, the conductive block 51 is heated. Thermal deformation of the surrounding card base 2 due to heat accumulation and heat radiation can be effectively suppressed. Further, even when the card is bent, etc., the internal stress applied to the conductive block 51 is dispersed to each of the second portion and the third portion, thereby suppressing breakage of the entire conductive block 51.

(e) Modification 5
Next, FIG. 6(a) shows a cross-sectional view of the conductive block 61 according to modification 5 near the first conductive block 61a, which corresponds to FIG. 4(c). In this modification, the first conductive block 61a forms a thin first portion 62a and a thick second portion 63a by bending a plate-like member having the same thickness. . Therefore, a void 64 is formed inside the second portion 63a.

Specifically, first, a plate member having the same thickness h21 is bent at a substantially right angle toward the Z2 direction at a point having a length d2 from the X1 direction to the X2 direction. Then, at a point having a total length of h2 including the height h22, it is further bent at a substantially right angle in the X1 direction. Thereafter, at a point of length d22, the first conductive block 61a is obtained by further bending it at a substantially right angle in the Z1 direction. In addition, in the final bending process, it is preferable that the end of the plate-shaped member is not brought into contact with the plate-shaped member, but that a gap is provided at least in part to enhance the heat dissipation effect. Further, although not shown, the second conductive block is similar to the above-described embodiments in that it has a bilaterally symmetrical shape with respect to the first conductive block 61a.

In this way, the conductive block 61 has a structure in which a plate-like member having the same thickness is bent to form a thin first portion and a thick second portion, thereby making it possible to form the conductive block 61 according to the embodiment. Compared to the conductive block 11 according to the present invention, the surface area of the conductive block 61 can be increased, and the heat dissipation effect can be further improved. Furthermore, since plate-like members of the same thickness can be used, material acquisition and processing become easier. Furthermore, by imparting spring properties through bending of the plate-like member, even when the card is bent, etc., it can be deformed appropriately against the internal stress applied to the conductive block 61, so the breakage of the entire conductive block 61 is suppressed. Ru.

(f) Modification 6
Further, FIG. 6(b) shows a cross-sectional view of the vicinity of the first conductive block 81a, corresponding to FIG. 6(a), for a conductive block 81 according to a sixth modification similar to the fifth modification. In this modification, the first conductive block 81a is formed by bending a plate-like member of the same thickness, as in modification 5, to form a first part 82a with a thinner thickness and a second part with a thicker thickness. 83a. A gap 84 is formed inside the second portion 83a, with a portion being largely open. Specifically, first, a plate member having the same thickness h31 is bent at a substantially right angle toward the Z2 direction at a point having a length d31 from the X1 direction to the X2 direction. Then, at a point having a total length of h3 including the height h32, it is bent at a substantially right angle toward the X2 direction. Thereafter, at a point of length d32, the first conductive block 81a is obtained by further bending it at a substantially right angle in the Z1 direction. Note that the length of the section after the final bending process is set to be h3.

In this way, by bending the conductive block 81 from a plate-like member of the same thickness, it is possible to improve the heat dissipation effect and suppress breakage due to spring suitability, similar to Modified Example 5. In this modification, by changing the bending direction of the plate-like member from Modification 5, the amount of plate-like member used can be further reduced, and costs can also be reduced, making it easier to obtain materials and process.

1 Contact and non-contact common IC card 2 Card base 2a Cut card base 3, 6 Oversheet layer 4, 5 Core layer 7 IC module 8 Antenna 8a, 8b Antenna end 9 Recess 9a First recess 9b Second recess 10 Conductive Adhesive layer 10a First conductive adhesive layer 10b Second conductive adhesive layer 11, 21, 31, 41, 51, 61, 81 Conductive blocks 11a, 21a, 31a, 41a, 51a, 61a, 81a First conductive blocks 11b, 21b, 31b, 41b, 51b Second conductive block 12a, 12b, 22a, 22b, 32a, 32b, 42a, 42b, 42c, 42d, 52a, 52b, 62a, 82a First portion 13a, 13b, 23a, 23b, 33a, 33b , 43a, 43b, 43c, 43d, 53a, 53b, 63a, 83a Second part 53c, 53d Third part 14 External contact terminal 15 IC chip 16 Wire 34 Recess or through hole 64, 84 Gap 71 Substrate 72 Mold part 71a 1 antenna connection terminal 71b 2nd antenna connection terminal 91a, 91b Interface 92a 1st antenna contact 92b 2nd antenna contact

Claims (7)

A substrate having an external contact terminal on one side and a plurality of antenna connection terminals on the other side, and
an IC module mounted on the other surface of the substrate and having an IC chip electrically connected to the external contact terminal and the antenna connection terminal, respectively;
a card base incorporating an antenna, each of which has a conductive block electrically connected to each of its ends;
The conductive block is configured such that a first portion having a first thickness and a second portion having a second thickness that is thicker than the first thickness are adjacent to each other,
the first portion and the end portion of the antenna are electrically connected;
A contact and non-contact common IC card, wherein the second portion and the antenna connection terminal are electrically connected via a conductive adhesive layer. 2. A melting point of a portion of the second portion that comes into contact with the conductive adhesive layer is higher than a temperature required to bond the IC module to the second portion via the conductive adhesive layer. Contact and non-contact IC card. 3. The contact and non-contact IC card according to claim 1, wherein the conductive adhesive layer includes an anisotropic conductive film. The second portion of the conductive block is formed by partially bending a member having the same thickness as the first portion, and has a void inside the second portion. The contact and non-contact common IC card according to any one of the items. When the IC card is viewed through the contact and non-contact common IC card from the normal direction of the side on which the external contact terminal is arranged, the first portion has a shape that tapers away from the second portion. The contact and non-contact common IC card according to any one of claims 1 to 4, comprising: 5. The contact and non-contact common IC card according to claim 1, wherein a recess or a through hole along the thickness direction is formed in the second portion. A substrate having an external contact terminal on one side and a plurality of antenna connection terminals on the other side, and
preparing an IC module having an IC chip mounted on the other surface of the substrate and electrically connected to the external contact terminal and the antenna connection terminal;
A conductive block is configured such that a first portion having a first thickness and a second portion having a second thickness thicker than the first thickness are adjacent to each other. a step of manufacturing a card base having a built-in antenna electrically connected to each of the antennas;
A method for manufacturing a contact and non-contact common IC card, comprising the step of electrically connecting the second portion and the antenna connection terminal via a conductive adhesive layer.