JP3451004B2 - Manufacturing method of electronic component storage package - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component housing package for housing electronic components such as semiconductor devices, piezoelectric devices and solid-state image pickup devices. More specifically, the present invention relates to a so-called chocolate break after firing a multi-piece substrate. The present invention relates to a package for storing electronic components obtained by dividing the substrate.

[0002]

2. Description of the Related Art Conventionally, an electronic component housing package for housing a semiconductor element such as a semiconductor integrated circuit element and an electronic component such as a piezoelectric element and a solid-state image sensor (so-called CCD) has, for example, an outer dimension of about 1 cm square. When manufacturing a package having a relatively small size, for example, in the case of a ceramic package, a plurality of regions for the package are arranged integrally on a ceramic green sheet laminated body having a large area which becomes a substrate of the package after firing. A dividing groove is formed on the upper surface or the upper and lower surfaces of the laminated body for partitioning into the respective package regions, and an assembly of a plurality of packages obtained by firing this is divided along the dividing groove (so-called By making a chocolate break), it is possible to collectively produce a large number of pieces (so-called a large number of pieces). It has been.

Further, even when other glass ceramics or an insulating material obtained by binding an inorganic insulating powder with an organic insulating resin is used as the base material, a plurality of sheet-like substrates are similarly cut into a plurality of pieces by chocolate breaking. The package of is produced intensively.

On the other hand, in such a comparatively small-sized package for housing electronic components, particularly when mounting an electronic component such as a solid-state image sensor whose mounting position must be precisely controlled, the upper surface of the base of the package is mounted. When mounting an electronic component on the electronic component mounting part using an automatic machine using an image recognition device, etc., there is no space on the upper surface of the base body, so there is a recognition mark that serves as a reference for aligning the electronic component. Since it is difficult to provide the package, it is general that the outer periphery of the package is image-recognized and used as a reference for alignment, and the electronic component is positioned based on it.

[0005]

However, in the package obtained by chocolate-breaking the substrate on which a large number of packages are integrally formed as described above along the dividing groove, the outer periphery of the upper surface of the base is the dividing groove. However, many burrs with a width of about 50 μm are likely to be generated on the side surface of the base of each package along the dividing groove, so that when the image recognition device tries to recognize the outer periphery of the package, burrs are included. However, as a result, the outer circumference of the package, which is the reference for alignment, cannot be accurately recognized, and the electronic components must be accurately mounted on the mounting part. There was a problem that it could not be done.

In such a case, it is difficult for the accuracy of the image recognition device to recognize the outer circumference by focusing the image recognition device only on the accurately formed outer circumference of the package upper surface. Also, it is not realistic to grind the side surface of each package to remove burrs after dividing, which takes a lot of time and labor and increases the number of manufacturing steps.
In the case where the substrate is a material having extremely high hardness such as ceramics, it was difficult in terms of processing technology.

The present invention has been devised in order to solve the above problems, and its object is to divide a method for manufacturing a package for storing electronic parts, which is manufactured by chocolate breaking from a multi-piece board. Even if the package has burrs on the side surface of the base body, the correct outer periphery of the package can be easily and accurately recognized by the image recognition device, and thus electronic components can be accurately aligned and mounted. An object of the present invention is to provide a method for manufacturing an electronic component storage package that can obtain a component storage package.

[0008]

A first method of manufacturing a package for storing electronic parts according to the present invention comprises a step of preparing a ceramic green sheet for an insulating frame by subjecting a ceramic green sheet to a predetermined punching process. A step of preparing a ceramic green sheet for an insulating substrate by printing a metallized paste made of metal in a predetermined pattern on the ceramic green sheet for an insulating frame and a ceramic green sheet having a different color tone after firing, and the ceramic green sheet for an insulating frame And a ceramic green sheet for the insulating substrate are laminated vertically to obtain a laminated body, and a division groove deeper than the thickness of the ceramic green sheet for the insulating frame is formed on the upper surface of the laminated body, and the laminated body is formed. A dividing groove shallower than the dividing groove is formed at a position facing the dividing groove on the lower surface of A process for partitioning into a plurality of electronic component storage package areas, and an electronic component storage package in which a wiring conductor made of metal is formed on an insulating base body in which an insulating frame body having a different color tone is laminated by firing the laminated body. And a step of dividing the assembly along the dividing groove so that a burr exists in the central portion of the side surface of the insulating substrate to obtain a plurality of electronic component storing packages. It is characterized by including.

In the second method for manufacturing a package for storing electronic parts of the present invention, an insulating frame is formed by subjecting a precursor sheet made by mixing an inorganic insulating powder and a thermosetting resin precursor to a predetermined punching process. A step of preparing a precursor sheet for a body, and a metal paste formed by mixing a metal powder and a thermosetting resin precursor to the precursor sheet for the insulating frame body and the precursor sheet having a different color tone after thermosetting A step of printing a pattern to prepare a precursor sheet for an insulating substrate; a step of vertically stacking the precursor sheet for an insulating frame and the precursor sheet for an insulating substrate to obtain a laminate; A plurality of dividing grooves that are deeper than the thickness of the insulating frame precursor sheet are formed on the upper surface of, and a plurality of dividing grooves that are shallower than the dividing grooves are formed on the lower surface of the laminated body at positions facing the dividing grooves. Package for storing electronic components A process for partitioning into regions and a package for storing an electronic component in which a wiring conductor formed by bonding the metal powder with a thermosetting resin is formed on an insulating substrate on which an insulating frame body having a different color tone is laminated by heating the laminated body. And a step of dividing the assembly along the dividing groove so that a burr exists in the central portion of the side surface of the insulating substrate to obtain a plurality of electronic component storing packages. It is characterized by including.

Further, in the method for manufacturing a package for storing electronic components of the present invention, in the first or second manufacturing method, the color difference between the insulating frame and the insulating substrate is determined by JIS-Z.
5 in color difference according to L ^* a ^* b ^* color system specified in -8730
The above is characterized.

According to the method for manufacturing a package for storing electronic parts of the present invention, the ceramic green sheet for an insulating frame is laminated on the ceramic green sheet for an insulating substrate having a different color tone after firing, or for the insulating frame. A dividing groove that is deeper than the thickness of the ceramic green sheet for insulating frame or the precursor sheet for insulating frame is formed in the laminated body in which the precursor sheet is laminated on the precursor sheet for insulating substrate whose color tone after thermosetting is different from that In addition, a dividing groove that is shallower than the dividing groove is formed at a position facing the dividing groove on the lower surface of the laminated body, and the dividing groove is divided into a plurality of electronic component storing package areas, and the electronic component storing portion is obtained by baking or heating. Since the package assembly is divided along the division groove so that a burr is present in the central portion of the side surface of the insulating substrate, a plurality of electronic component storage packages are obtained. It is possible to obtain a package for storing electronic components, in which an insulating frame whose outer periphery is accurately formed by the split groove and whose color tone is different from that of the insulating substrate is stacked on the upper surface of the insulating substrate. According to the package, even if there are many burrs generated by division on the side surface of the insulating substrate that constitutes the insulating base, the outer periphery of the insulating frame whose color tone is different from that of the insulating substrate can be accurately detected by the image recognition device. In addition, it is possible to easily recognize, and as a result, it is possible to obtain an electronic component storing package in which electronic components can be accurately aligned and mounted.

According to the method of manufacturing the electronic component storing package of the present invention, the color difference between the insulating frame and the insulating substrate is J
When the color difference by the L ^* a ^* b ^* color system specified in IS-Z-8730 is set to 5 or more, the difference in color tone between the insulating frame and the insulating substrate can be easily recognized and recognized by the image recognition device. This makes it possible to recognize the outer periphery of the insulating frame more easily and reliably.

[0013]

DETAILED DESCRIPTION OF THE INVENTION The present invention will now be described in detail with reference to the accompanying drawings. 1A to 1C are cross-sectional views of respective manufacturing steps showing an example of an embodiment of a method for manufacturing an electronic component storing package of the present invention.

First, according to the method for manufacturing a package for storing electronic parts of the present invention, an insulating frame made of ceramic having a color tone different from that of the ceramic of the insulating substrate is laminated on the upper surface of the insulating substrate made of ceramic, and the insulating substrate is made of metal. A case of obtaining an electronic component storing package in which the wiring conductor is formed will be described.

In this case, first, as shown in FIG. 1 (a), a predetermined punching process is performed on a ceramic green sheet which becomes an insulating frame after firing, and an opening 2 for accommodating an electronic component is formed inside the electronic green sheet. A plurality of ceramic green sheets 1 for an insulating frame are prepared in accordance with a package area for storing components. In addition, a plurality of metallized pastes 4 made of a metal to be wiring conductors after firing are formed on a ceramic green sheet having a different color tone after firing from the ceramic green sheet for insulating frame 1 in a predetermined pattern corresponding to the package area for storing electronic parts. A printed ceramic green sheet 3 for an insulating substrate that becomes an insulating substrate after firing is prepared.

In this example, the ceramic green sheet 3 for insulating substrate is a ceramic green sheet 3a obtained by punching out an opening 5 serving as a cavity for forming an electronic component mounting portion and a through hole 6 for forming a via conductor as a wiring conductor. Similarly, two ceramic green sheets, that is, a ceramic green sheet 3b in which a through hole 6 that forms a via conductor as a wiring conductor is punched, are laminated,
The through holes 6 are filled with the metallizing paste 4, and the metallizing paste 4 is printed on the upper surface of the ceramic green sheet 3a and the lower surface of the ceramic green sheet 3b so as to form a wiring conductor pattern.

Next, as shown in FIG. 1B, the insulating frame ceramic green sheet 1 and the insulating substrate ceramic green sheet 3 are vertically laminated with the insulating frame ceramic green sheet 1 facing upward. To obtain a laminated body 7. After that, a division groove 8 deeper than the thickness of the ceramic green sheet for insulating frame 1 is formed on the upper surface of the laminated body 7, and after firing, each of the plurality of electronic component storing package regions 10 becomes an electronic component storing package. Partition into

At this time, a shallow opposing dividing groove 9 is formed on the lower surface of the laminated body 7 on the insulating substrate ceramic green sheet 3 at a position opposed to the dividing groove 8, and the shallow dividing groove 9 is formed along the dividing groove 8 later. It can be favorably divided when divided into individual electronic component storing packages.

By forming the dividing grooves 8 deeper than the thickness of the ceramic green sheet 1 for insulating frame in this way, the outer periphery of the insulating frame after firing is precisely and accurately formed by the dividing grooves 8. By recognizing this outer periphery by the image recognition device, it can be used as a reference for the alignment of the electronic components to be mounted.

Next, as shown in FIG. 1 (c), the laminated body 7 is fired to form an insulating frame body on the upper surface of the insulating substrate 14 made of ceramic, which is made of ceramic having a color tone different from that of the ceramic of the insulating substrate 14. After obtaining an assembly of electronic component storing packages 11 in which wiring conductors 15 made of metal are formed on an insulating substrate 12 formed by stacking 13 on each other, the assembly is divided along division grooves 8 to obtain a plurality of pieces. The electronic component storing package 11 is obtained.

In the package 11 for storing electronic parts thus obtained, a large number of burrs 16 generated by chocolate break are present on the side surface of the insulating substrate 14 among the side surfaces of the insulating substrate 12, Since the insulating frame 13 laminated on 14 has an outer periphery accurately formed by the dividing groove 8, and the color tone of the insulating substrate 13 is different from that of the insulating substrate 14, it is affected by the presence of the burr 16. Without insulation frame
The outer periphery of 13 can be easily and accurately recognized by the image recognition device, and electronic components can be accurately positioned and mounted using the outer periphery as a reference for alignment.

According to the electronic component storing package 11 thus obtained by the manufacturing method of the present invention,
An electronic component mounting portion 17 is formed in a concave portion formed by the opening 5 and the opening 2 substantially at the center of the upper surface of the insulating base 12, and an electronic component such as a solid-state image sensor (not shown) is formed in the mounting portion 17. Mounted and fixed via an adhesive such as glass, resin or brazing material, and a lid (not shown) is attached to the upper surface of the insulating frame 13 with glass.
An electronic component device as a product is obtained by joining the components through a sealing material such as a resin or a brazing material to hermetically seal the electronic component inside.

Further, another structural example of the electronic component storing package manufactured by the method for manufacturing an electronic component storing package of the present invention is shown in cross-sectional views of FIGS. 2 (a) to 2 (c). In these figures, the same parts as those in FIG. 1C are designated by the same reference numerals.

In the example of FIG. 2A, an insulating frame 13 having a color tone different from that of the insulating substrate 14 is laminated on the insulating substrate 14 as the insulating base 12, and a so-called castellation 18 is formed on the side surface of the insulating substrate 14. In this example, the wiring conductor 15 formed on the insulating substrate 14 is wired via the side surface conductor using the castellation 18. Then, the electronic component 19 such as a solid-state image sensor is mounted on the electronic component mounting portion 17 formed as a concave portion on the upper surface of the insulating substrate 14, and the electrode on the upper surface and the wiring conductor 15 arranged around the mounting portion 17 are provided. It is electrically connected using a bonding wire (not shown) or the like.

In the example of FIG. 2B, the insulating substrate 14 is laminated on the insulating substrate 14 as the insulating substrate 12, and the insulating frame 13 having a color tone different from that of the insulating substrate 14 is laminated on both sides of the insulating frame 13 and the insulating substrate 14. Castellation 20 is formed and is an insulating substrate
The wiring conductor 15 formed on the 14 is the castellation 20.
It is an example in which wiring is performed via a side conductor using.

Then, as in FIG. 2A, the insulating substrate 14
An electronic component 19 such as a solid-state image sensor is mounted on an electronic component mounting portion 17 formed as a recess on the upper surface of the device, and an electrode on the upper surface of the electronic component 19 and a wiring conductor 15 disposed around the mounting portion 17 are bonded by a bonding wire (not shown). No.) etc. are used for electrical connection.

In the example of FIG. 2C, an insulating frame 13 having a color tone different from that of the insulating substrate 14 is laminated on the insulating substrate 14 as the insulating base 12, and the insulating substrate 14 is provided on the upper surface thereof without forming a recess. In this example, a wiring conductor 15 formed on the insulating substrate 14 is wired via a via conductor as in the case of FIG. Then, an electronic component 19 such as a solid-state image sensor is mounted on the electronic component mounting portion 21 formed on the upper surface of the insulating substrate 14, and the electrode on the upper surface and the wiring conductor 15 arranged near the mounting portion 21 are bonded. It is electrically connected using a wire (not shown) or the like. Further, in this example, the wiring conductor 15 around the mounting portion 21 is extended to a region directly below the electronic component 19 in the mounting portion 21, and with respect to the extended tip or the electrode pad connected to the tip, The electronic component 19 may be mounted by a so-called flip-chip mounting method, in which electrodes formed on the lower surface of the electronic component 19 are electrically connected via bump conductors (not shown).

Insulating frame 13 and insulating substrate constituting insulating base 12 in the electronic component storing package according to the present invention
14 is a ceramics such as aluminum oxide sintered body, aluminum nitride sintered body, mullite sintered body, silicon nitride sintered body, silicon carbide sintered body, etc. In order to make the color tones of the insulating frame 13 and the insulating substrate 14 different from each other, various pigments may be added to the ceramic raw material so as to obtain a desired color tone difference.

When the insulating frame 13 and the insulating substrate 14 are manufactured, for example, when the ceramic is made of an aluminum oxide sintered body, it is suitable as a raw material powder of aluminum oxide, silicon oxide, magnesium oxide, calcium oxide or the like. A method for producing a package for storing electronic parts of the present invention is obtained by obtaining a ceramic green sheet by adding and mixing an organic binder and a solvent to form a slurry and forming the sheet by a conventionally known doctor blade method. Can be used for.

When a pigment is added to make the color tone of the ceramic different, for example, titanium oxide (after firing,
Blue black), molybdenum oxide (gray to black), chromium oxide (pink to magenta), cobalt oxide (gray), nickel oxide (gray)
-Erbia (pink), neodia (blue), etc. may be added according to the required color difference, and by adding these pigments, black, brown, brown or other ceramics can be obtained.

The wiring conductor 15 is an insulating frame formed by printing or filling a metallizing paste made of metal powder such as tungsten, molybdenum, manganese, silver, copper in a predetermined pattern.
It is formed by firing together with 13 and the insulating substrate 14, and has the function of electrically connecting the electrodes of the mounted electronic components to an external electric circuit.

When the wiring conductor 15 is made of tungsten, molybdenum, an alloy of these and manganese, or a metallized conductor of copper, the exposed surface thereof has excellent corrosion resistance against nickel, gold, etc. and wettability with solder. When an excellent metal is applied by plating to a thickness of about 1 to 20 μm, the wiring conductor 15 can be effectively prevented from being oxidized and corroded, and the wiring conductor 15 and a bonding wire connected to the wiring conductor 15 can be effectively prevented. The connection with the bump conductor can be made strong. Therefore, when the wiring conductor 15 is made of the metallized conductor, it is preferable to deposit a metal such as nickel or gold on the exposed surface by a plating method to a thickness of 1 to 20 μm.

Next, according to the method for manufacturing a package for housing electronic parts of the present invention, the inorganic insulating powder having a color tone different from that of the insulating substrate is heat-treated on the upper surface of the insulating substrate bonded with the thermosetting resin. Similar to the manufacturing method described above, the case of obtaining an electronic component storage package in which insulating frames bonded by a curable resin are stacked and a wiring conductor in which an insulating substrate is bonded with a metal powder by a thermosetting resin is formed is illustrated. It will be described based on 1.

In this case, as shown in FIG. 1 (a), a precursor sheet is prepared by mixing an inorganic insulating material powder, which becomes an insulating frame body after being heated and cured, and a thermosetting resin precursor. Then, a predetermined punching process is performed to prepare a precursor sheet 1 for an insulating frame in which a plurality of openings 2 for accommodating electronic components are formed inside in accordance with a package area for accommodating electronic components. In addition, a metal paste 4 formed by mixing the precursor sheet 1 for the insulating frame and the precursor sheet having a different color tone after heating with a metal powder that becomes a wiring conductor after heating and a thermosetting resin precursor is used as an electronic component. A precursor sheet 3 for an insulating substrate, which is an insulating substrate after being heated, is prepared by printing a plurality of patterns in a predetermined pattern corresponding to the storage package area.

In this example, as the insulating substrate precursor sheet 3, an opening 5 serving as a cavity for forming an electronic component mounting portion and a through hole 6 for forming a via conductor as a wiring conductor are formed.
The precursor sheet 3a obtained by punching and the precursor sheet 3b obtained by punching the through hole 6 which similarly forms the via conductor as the wiring conductor are stacked, and the metal paste is formed in the through hole 6. 4 and the metal paste 4 is printed on the upper surface of the precursor sheet 3a and the lower surface of the precursor sheet 3b so as to form a wiring conductor pattern.

Next, as shown in FIG. 1B, the insulating frame precursor sheet 1 and the insulating substrate precursor sheet 3 are stacked one above the other with the insulating frame precursor sheet 1 facing upward. To obtain a laminated body 7. After that, a dividing groove 8 deeper than the thickness of the insulating frame precursor sheet 1 is formed on the upper surface of the laminated body 7, and a plurality of electronic component storing package areas 10 each of which becomes an electronic component storing package after heating. Partition into

At this time, when the shallow opposing dividing groove 9 is formed in the precursor sheet 3 for insulating substrate, which is the lower surface of the laminated body 7, at a position opposed to the dividing groove 8, the dividing groove 8 will be formed later. It can be favorably divided when divided into individual electronic component storing packages.

By forming the dividing groove 8 deeper than the thickness of the insulating frame precursor sheet 1 in this way, the outer periphery of the insulating frame body after heating is accurately and accurately formed by the dividing groove 8. By recognizing this outer periphery by the image recognition device, it can be used as a reference for the alignment of the electronic components to be mounted.

Next, as shown in FIG. 1 (c), the laminated body 7 is heated to have a different color tone from the insulating substrate 14 on the upper surface of the insulating substrate 14 in which the inorganic insulating powder is bonded with a thermosetting resin. ,
An assembly of electronic component storage packages 11 in which a wiring conductor 15 formed by bonding metal powder with a thermosetting resin is formed on an insulating substrate 12 formed by laminating an insulating frame body 13 in which inorganic insulating powders are bonded with a thermosetting resin. After the body is obtained, this assembly is divided along the dividing groove 8 to obtain a plurality of electronic component storing packages 11.

In the electronic component storing package 11 thus obtained, a large number of burrs 16 caused by chocolate breaks are present on the side surface of the insulating substrate 14 among the side surfaces of the insulating substrate 12, Since the insulating frame 13 laminated on 14 has an outer periphery accurately formed by the dividing groove 8, and the color tone of the insulating substrate 13 is different from that of the insulating substrate 14, it is affected by the presence of the burr 16. Without insulation frame
The outer periphery of 13 can be easily and accurately recognized by the image recognition device, and electronic components can be accurately positioned and mounted using the outer periphery as a reference for alignment.

Insulating frame 13 and insulating substrate forming insulating base 12 in the electronic component storing package according to the present invention
14 is an inorganic insulating powder such as silicon oxide / aluminum oxide / aluminum nitride / silicon carbide / barium titanate / strontium titanate / calcium titanate / titanium oxide / zeolite for epoxy resin / polyimide resin / phenol resin / thermosetting It is formed by bonding with a thermosetting resin such as a conductive polyphenylene ether resin, a polyimide amide resin, a bismaleimide triazine resin, and the like. To make the color tone of the insulating frame 13 and the insulating substrate 14 different, A desired color tone difference may be obtained by adding various pigments.

If the content of the inorganic insulating powder contained in the insulating frame 13 and the insulating substrate 14 is less than 60% by weight, the thermal expansion coefficient of the insulating frame 13 and the insulating substrate 14 with respect to the thermal expansion coefficient of the mounted electronic component is When the electronic parts generate heat during operation and this heat is applied to both the electronic parts and especially the insulating substrate 14, a large thermal stress is generated between them due to the difference in thermal expansion coefficient between them. However, due to this large thermal stress, the electronic component tends to be separated from the insulating substrate 14, or the electronic component may be cracked or chipped. If the content of the inorganic insulating powder exceeds 95% by weight, it tends to be difficult to firmly bond the inorganic insulating powder with the thermosetting resin. Therefore, the insulating frame body 13 and the insulating substrate 14 that form the insulating base 12
Is the amount of the inorganic insulating powder contained in each of them.
The preferred range is 60 to 95% by weight.

When the insulating frame 13 and the insulating substrate 14 are manufactured, for example, bisphenol A type epoxy resin, bisphenol F type epoxy resin, novolac type epoxy resin, and silicon oxide powder having a particle size of about 0.1 to 100 μm are used. A thermosetting resin precursor such as a glycidyl ester type epoxy resin, and an insulating paste obtained by adding and mixing a curing agent such as an amine curing agent, an imidazole curing agent, an acid anhydride curing agent, etc. The sheet may be used in the method for producing the electronic component storing package of the present invention by adopting a sheet forming method to obtain a precursor sheet by forming it into a semi-cured sheet.

Further, the above-mentioned precursor sheet has a thickness of about 100-30.
By heating at a temperature of 0 ° C. and thermosetting, an insulating frame body 13 and an insulating substrate 14 are formed by binding the inorganic insulating powder with a thermosetting resin.

Further, the insulating frame 13 and the insulating substrate
In addition to the above materials, short fibers such as glass fibers, carbon fibers, aramid fibers, alumina fibers, potassium titanate whiskers, aluminum borate whiskers, and the like may be added to the above-mentioned materials for the material 14.

When a pigment is added to make these colors different, for example, phthalocyanine green (green after curing), quinacridone magenta (red), thioindigo (red), phthalocyanine blue (blue), induslen ( Blue), flavantron (yellow), anthraviridine (yellow), antoanthrone (orange), pyrantrone (orange)
-Isoviolanthrone (purple) or the like may be added depending on the required color difference, and the addition of these pigments makes it possible to obtain the insulating frame 13 or insulating substrate 14 of black, brown, brown or the like. For example, black insulating frame 13 or insulating substrate
To obtain 14, red + blue + yellow (= green + red) should be obtained, and to make it brown, the ratio of red and yellow should be increased.

The wiring conductor 15 is formed, for example, by binding a metal powder made of a metal such as copper, silver, copper whose surface is coated with silver, silver, a copper alloy, gold, or the like with a thermosetting resin such as an epoxy resin.
Bisphenol A on metal powder with a particle size of 0.1 to 20 μm
Type epoxy resin, bisphenol F type epoxy resin, novolac type epoxy resin, glycidyl ester type epoxy resin and other thermosetting resin precursors and amine type curing agents, imidazole type curing agents, acid anhydride type curing agents, etc. Is formed by printing or filling a predetermined pattern with a metal paste mixed with a hardener such as the hardener and heating it together with the insulating frame 13 and the insulating substrate 14, and the electrode of the electronic component to be mounted on the external electric circuit. It acts to connect electrically.

The metal powder contained in the wiring conductor 15 is
Although it acts to impart conductivity to the wiring conductor 15, if the content in the wiring conductor 15 is less than 70% by weight, the electric resistance of the wiring conductor 15 tends to be high, and 95
If it exceeds 5% by weight, it tends to be difficult to firmly bond the metal powder with the thermosetting resin to form the predetermined wiring conductor 15. Therefore, it is preferable that the amount of the metal powder contained in the wiring conductor 15 is in the range of 70 to 95% by weight.

The wiring conductor 15 can be formed by depositing a metal having excellent corrosion resistance such as nickel and gold on the exposed surface by plating to a thickness of 1 to 20 μm. Oxidation and corrosion can be effectively prevented, and the wiring conductor 15 and the bonding wire or bump conductor can be firmly and electrically connected. Therefore, it is preferable that the exposed surface of the wiring conductor 15 be made of a metal having excellent corrosion resistance such as nickel or gold and having a good conductivity, which is layered to a thickness of 1 to 20 μm by a plating method.

An electronic device according to the manufacturing method of the present invention, which comprises an insulating frame and an insulating substrate in which the inorganic insulating powder is bonded with a thermosetting resin, and a wiring conductor in which a metal powder is bonded with the thermosetting resin. As for the component storage package, the above description of the electronic component storage package including the insulating frame and the insulating substrate made of ceramic and the wiring conductor made of metal is applied.

In the example of the above embodiment, the insulating frame body
When the color tones of 13 and the insulating substrate 14 are made different, the color difference between the two is set to 5 or more by the L ^* a ^* b ^* color specification system defined in JIS-Z-8730, so that the insulation by the image recognition device can be obtained. It is possible to obtain a package for storing electronic components in which the outer periphery of the frame body 13 can be recognized more easily and accurately. Therefore, it is preferable that the insulating frame 13 and the insulating substrate 14 have different color tones so as to have such a color difference.

The present invention is not limited to the above-described embodiments, and various modifications may be made without departing from the scope of the present invention. For example, the insulating frame body 13 and the insulating substrate 14 may be made of different materials so as to have different color tones.

[0053]

According to the method of manufacturing a package for storing electronic parts of the present invention, the ceramic green sheet for an insulating frame is laminated on the ceramic green sheet for an insulating substrate having a different color tone after firing, or the insulating frame is laminated. A precursor sheet for a body is laminated on a precursor sheet for an insulating substrate having a different color tone after heat curing, and a divided groove deeper than the thickness of the ceramic green sheet for an insulating frame or the precursor sheet for an insulating frame is formed. And a divided groove shallower than the divided groove is formed at a position facing the divided groove on the lower surface of the laminated body to divide into a plurality of electronic component storing package regions, and the electronic component obtained by firing or heating. Since the assembly of the storage packages is divided along the dividing groove so that a burr exists in the central portion of the side surface of the insulating substrate, a plurality of storage packages for electronic components are obtained. It is possible to obtain a package for storing electronic components, in which an insulating frame body whose color tone is different from that of the insulating substrate is laminated on the upper surface of the insulating substrate, the outer periphery of which is accurately molded by the dividing groove, and which is thus obtained. According to the package, even if there are many burrs generated by division on the side surface of the insulating substrate that constitutes the insulating base, the outer periphery of the insulating frame whose color tone is different from that of the insulating substrate can be accurately detected by the image recognition device. In addition, it is possible to easily recognize, and as a result, it is possible to obtain an electronic component storing package in which electronic components can be accurately aligned and mounted.

Further, according to the method of manufacturing a package for storing electronic parts of the present invention, the color difference between the insulating frame and the insulating substrate is J
When the color difference by the L ^* a ^* b ^* color system specified in IS-Z-8730 is set to 5 or more, the difference in color tone between the insulating frame and the insulating substrate can be easily recognized and recognized by the image recognition device. This makes it possible to recognize the outer periphery of the insulating frame more easily and reliably.

As described above, according to the present invention, in the method of manufacturing a package for storing electronic parts, which is manufactured by chocolate breaking from a multi-piece substrate, the divided packages have burrs on the side surfaces of the base body. Can easily and accurately recognize the correct outer periphery of the package by the image recognition device, and thereby obtain a package for storing electronic components in which electronic components can be accurately aligned and mounted. It was possible to provide a method for manufacturing a package.

[Brief description of drawings]

1A to 1C are cross-sectional views of respective manufacturing steps showing an example of an embodiment of a method for manufacturing an electronic component storing package according to the present invention.

FIGS. 2A to 2C are cross-sectional views showing an example of an electronic component storing package according to a method for manufacturing an electronic component storing package of the present invention.

[Explanation of symbols]

1 ... Ceramic green sheet for insulating frame (precursor sheet for insulating frame) 3 ... Ceramic green sheet for insulating substrate (precursor sheet for insulating substrate) 4 ... Metallizing paste (metal paste) 7. ..Layered body 8 ... Dividing groove 10 ... Electronic component storing package area 11 ... Electronic component storing package 13 ... Insulating frame 14 ... Insulating substrate 15 ... Wiring conductor 19 ... ..Electronic parts

Claims (3)

(57) [Claims] 1. A step of preparing a ceramic green sheet for an insulating frame by performing a predetermined punching process on the ceramic green sheet, and a ceramic green sheet having a different color tone after firing from the ceramic green sheet for an insulating frame is made of metal. A step of printing the formed metallizing paste in a predetermined pattern to prepare a ceramic green sheet for an insulating substrate, and a step of vertically stacking the ceramic green sheet for an insulating frame and the ceramic green sheet for an insulating substrate to obtain a laminate. And a division groove deeper than the thickness of the insulating frame ceramic green sheet is formed on the upper surface of the laminated body, and the division groove is formed on the lower surface of the laminated body in a pair.
A step of forming a dividing groove shallower than the dividing groove in a facing position to divide into a plurality of electronic component storing package regions,
A step of firing the laminated body to obtain an assembly of electronic component storage packages in which wiring conductors made of metal are formed on an insulating base body in which insulating frame bodies having different color tones are laminated; Split along the middle of the side of the insulating substrate
And a step of obtaining a plurality of the electronic component storing packages such that burrs are present in a portion thereof. 2. A step of preparing a precursor sheet for an insulating frame by subjecting a precursor sheet formed by mixing an inorganic insulating powder and a thermosetting resin precursor to a predetermined punching process, and the insulating frame. Of preparing a precursor sheet for an insulating substrate by printing a metal paste formed by mixing a metal powder and a thermosetting resin precursor on a precursor sheet having a different color tone after thermosetting from a precursor sheet for insulating substrate in a predetermined pattern And a step of vertically stacking the insulating frame precursor sheet and the insulating substrate precursor sheet to obtain a laminated body, and deeper than the thickness of the insulating frame precursor sheet on the upper surface of the laminated body. While forming the dividing groove ,
The divided portion is provided at a position facing the dividing groove on the lower surface of the laminated body.
A step of forming a dividing groove shallower than the dividing groove to divide into a plurality of electronic component storing package regions, and heating the laminated body to apply the metal powder to an insulating substrate in which insulating frames having different color tones are laminated. A step of obtaining an assembly of electronic component storing packages in which wiring conductors joined by a thermosetting resin are formed, and the assembly is divided along the dividing groove to form the insulating substrate.
And a step of obtaining a plurality of the electronic component storing packages such that a burr exists on a central portion of a side surface of the plate, the manufacturing method of the electronic component storing package. 3. The color difference between the insulating frame and the insulating substrate is 5 or more in terms of the color difference according to the L * a * b * color system specified in JIS-Z-8730. The method for manufacturing the electronic component storage package according to claim 2.