JP3368461B2 - shell - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a shell , and more particularly to a chuck body for holding a semiconductor wafer.
And an electrode for establishing continuity with the electrode pad of the semiconductor wafer
And a contactor having a pad .

[0002]

2. Description of the Related Art In a semiconductor manufacturing process, a plurality of semiconductor wafers (hereinafter referred to as "wafers") may be collectively transported between the processes in carrier units or may be transported one by one. Wafers have a larger diameter and are processed one by one.
As the number of so-called single wafer processing steps increases, the number of scenes in which wafers are transferred one by one increases. In addition, there are various inspection processes in the semiconductor manufacturing process. For example, a semiconductor inspection process in which an inspection is performed at the wafer stage and a wafer are separated as semiconductor elements (hereinafter referred to as “chips”) and the chips are inspected as a package product. There is a reliability test process. In the probe inspection, a large number of IC chips formed on the surface of the wafer are inspected for electrical characteristics of individual IC chips in a wafer state, and chips having no defects in electrical characteristics are screened. By applying thermal and electrical stress to the product, latent defects of the chip are revealed and good products are screened.

On the other hand, with the miniaturization and high functionality of electric products, chips are becoming smaller and highly integrated. Moreover, recently, various mounting techniques for further miniaturization of semiconductor products have been developed, and in particular, a technique of mounting a chip as a bare chip without packaging the chip has been developed. In order to put bare chips on the market, quality-guaranteed bare chips are required. In order to put a quality-guaranteed bare chip on the market, a reliability test must be performed. A probe device can also be used for the reliability test. However, in the case of the probe device, only one wafer can be inspected at a time, and a lot of time is required for the reliability test of one wafer. Therefore, there is a cost problem in using the probe device for the reliability test. is there. Further, in order to inspect a bare chip using a conventional reliability tester, various difficult points such as electrical connection between the bare chip and a socket must be solved, and since a small bare chip is handled, handling is extremely difficult. There is a risk that the inspection will be complicated and the inspection cost will increase.

Therefore, there is a demand for a reliability tester capable of inspecting the wafer as it is. In the case of the reliability test apparatus, the reliability test can be performed on a plurality of wafers at the same time, so that the inspection cost can be significantly reduced. In order to perform the reliability test in the wafer state, it is necessary to transfer the wafers integrated with the contactors one by one to the reliability test device. For example, various reliability test techniques have been proposed in JP-A-7-231019, JP-A-8-5666, and JP-A-8-340030. In particular, the former two publications propose a technique for reliably contacting a wafer and a contactor such as a probe sheet collectively during a reliability test without being thermally affected. When a reliability test is carried out in a wafer state, it is fundamentally and extremely important to bring the contactor of the wafer into contact with the contactor accurately at a high temperature in order to ensure the reliability of the inspection.

[0005]

However, it is important to smoothly transfer the wafer to and from the transfer mechanism on the wafer holder before the collective contact between the wafer and the contactor. In the case of a holder, it is hard to say that sufficient measures have been taken for the transfer of wafers. In addition, the wafer holder for the reliability test is devised only for the reliability test, and it is difficult to share it with others, resulting in poor versatility.

The present invention has been made to solve the above-mentioned problems, and it is possible to smoothly transfer a wafer and contact the wafer.
And the transfer mechanism makes it easy
It is intended to provide a shell that can be transported to .

[0007]

According to a first aspect of the present invention, a shell is provided for electrically connecting a chuck body for holding a semiconductor wafer and an electrode pad of the semiconductor wafer.
And a contactor having an electrode pad of
I, the chuck body, said plurality of openings which open in the chuck body surface, and communicates with and the chuck body formed inside the gas passages in these openings, the gas
And entrance into instrumentation deposited by a valve mechanism of the flow path, and a seal member mounted over the entire circumference the outer peripheral edge portion of the chuck body surface, the and the semiconductor wafer through the chuck body
Double the pin moves up and down when you exchanged the chuck body surface
Includes a number of pin holes, and a sealing membrane which expands and contracts with the vertical movement of each of these pin holes provided in the upper <br/> Symbol pins, the
Evacuate between the chuck body and the contactor.
And the chuck body and contactor under reduced pressure.
Also, the semiconductor wafer is integrated so that it can be transported .

A second aspect of the present invention is described.shell
In the invention according to claim 1, the sealing film is
It has a cylindrical shape with a sealed tip and an open bottom.
It is characterized by that.

A third aspect of the present invention is described.shell
Is the above in the invention of claim 1 or claim 2.
RecordThere is a recess on the bottom surface of the chuck body to fit the temperature sensor.
DigitIt is characterized by that.

[0010]

BEST MODE FOR CARRYING OUT THE INVENTION A case in which an embodiment of the shell of the present invention is used for a reliability test will be described below with reference to FIGS. FIG. 1 is a diagram showing a wafer storage chamber that constitutes a main part of the reliability test apparatus. As shown in FIG. 1, the wafer storage chamber 1 is formed in a flat rectangular shape as a whole, and is placed in a rack for reliability testing (not shown), for example, in a row for many columns and many rows in a horizontal state. Used by mounting. When performing the reliability test, the wafer W is integrated with the contactor 3 via the wafer chuck 2 which is the wafer holder of the present invention.
It is designed to be installed inside. Wafer W and contactor 3
The state of being integrated with each other means that the inspection electrodes (hereinafter, referred to as “electrode pads”) of each of a large number of chips formed on the entire surface of the wafer and the contactor 3 corresponding to these electrode pads.
The state in which the projection-shaped inspection terminals (hereinafter, referred to as “electrode pads”) provided on the respective terminals collectively come into contact with each other so that conduction is possible. Therefore , the integrated structure of the wafer, the wafer chuck 2, and the contactor 3 will be referred to as a shell 4 for convenience in the following description.

The wafer storage chamber 1 will be described.
As shown in FIG. 1, the wafer storage chamber 1 is composed of a temperature control chamber 1A and a connector chamber 1B adjacent to the temperature control chamber 1A, and both 1A and 1B are blocked by a heat insulating wall (not shown). The heat insulating wall prevents the temperature of the connector chamber 1B from rising as much as possible. In the temperature control chamber 1A, the temperature of the wafer W is controlled to the inspection temperature as described later, and the temperature around the wafer W is prevented from rising as much as possible.

Cylinder mechanisms 6 are arranged at the four corners of the base 5 in the temperature control chamber 1A, and the upper ends of the cylinder rods of the cylinder mechanisms 6 are pressed plates arranged above the base 5, respectively. It is connected to the four corners of 7. A clamp mechanism (not shown) is arranged on the back surface of the pressing plate 7, and the shell 4 is received through the clamp mechanism.
A connector and a wiring board for connecting to a tester (not shown) are arranged in the connector chamber 1B.

Further, as shown in FIG. 2, the base 5 and the pressing plate 7
A base plate 8 is arranged in parallel with the base 5, and a circular hole 8A is formed substantially in the center of the base plate 8.
Are formed. Inside the hole 8A, a temperature control body having a diameter slightly smaller than that of the hole 8A is provided as a bottom jacket 9 on the base 5, and its upper surface is substantially level with the upper surface of the base plate 8. In addition, FIG.
As shown in, the base plate 8 has a bottom jacket 9
A large number (for example, 2000 to 3000) of relay terminals surrounding the pogo pins 10 are arranged in a ring shape in a plurality of rows. These pogo pins 10 are provided corresponding to a large number of external terminals (hereinafter referred to as “connection pads”) 3B arranged in a ring shape around the electrode pads 3A of the contactor 3 and are electrically connected to the connection pads 3B at the time of contact. Can be electrically conducted. Therefore, when the shell 4 transferred through the transfer mechanism (not shown) is received via the clamp mechanism in the temperature control chamber 1A, the cylinder mechanism 6 is driven and the shell 4 descends via the pressing plate 7 to move to the bottom. When the jacket 9 is reached, the wafer chuck 2 is moved to the bottom jacket 9
Contact pad 3B of the contactor 3
Makes electrical contact with the pogo pin 10. In this state, the temperature of the wafer chuck 2 is controlled by the bottom jacket 9, and the temperature of the wafer W is controlled to a predetermined inspection temperature (for example, 110 ° C.).

Now, the wafer chuck 2 of this embodiment is
As shown in FIGS. 3A and 3B, a chuck body 21 formed in a disk shape is mainly used, and the chuck body 21 is configured to be integrated with the contactor 3 while holding the wafer W. . The inside of the chuck body 21 is shown in FIG.
As shown in, the gas flow path 21A is formed. Then, the inlet of the gas passage 21A (opened on the peripheral surface of the main body)
Is connected to a gas supply pipe 22, and its outlet (opened adjacent to the inlet on the peripheral surface of the main body) is connected to a gas discharge pipe 23. (Chemically inert gas such as nitrogen gas) is supplied and discharged.

Further, as shown in FIGS. 3A and 3B, a plurality of ring-shaped grooves 21 are formed on the upper surface of the chuck body 21.
B and 21C are formed concentrically (only two ring-shaped grooves are shown in the figure).
B and 21C have openings 21E communicating with the gas flow passage 21A.
Are formed at a plurality of locations. Also, the chuck body 21
A seal ring 24 made of an elastic member having high flexibility such as silicon rubber is attached near the outer periphery of the upper surface, and the seal ring 24 keeps the internal airtightness when the wafer chuck 2 and the contactor 3 are integrated. There is. Therefore, when the contactor 3 and the wafer chuck 2 are overlapped with each other and the pressure between the two and 3 is reduced by the inert gas through the gas supply pipe 22 and the gas discharge pipe 23, the two and 3 are integrated and cannot be separated. Further, both pipes 22 and 23 have valve mechanisms 22A and 23A shown in (c) in the figure, which are supplied with nitrogen gas and evacuated to reduce the pressure between the wafer chuck 2 and the contactor 3. , Each gas supply and discharge pipe 22,
23 to gas pipe or vacuum exhaust pipe (both not shown)
When the valve is removed, the springs of the valve mechanisms 22A and 23A are actuated, and the valve moves to the right from the position shown in the figure to block the entrance and exit to prevent the inflow of air and maintain the internal depressurized state. Has become

When the wafer chuck 2 and the contactor 3 are integrated as described above, all the electrode pads P of the wafer W held by the wafer chuck 2 and the electrode pads 3A of the contactor 3 are held as shown in FIG. Are in contact with each other at a time and are in a state capable of conduction. When the wafer W and the contactor 3 are brought into contact with each other at a time, for example, the wafer-contact aligning device (alignment device) proposed by the applicant in Japanese Patent Application No. 8-297463 can be used. Using this alignment apparatus, the electrode pad P of the wafer W and the electrode pad 3A of the contactor 3 are
Theft both in alignment in a state of being collectively contact a, c
A stack 4 for the stack chuck 2, the wafer W and the contactor 3.
As one. Before being integrated as the shell 4, FIG.
As shown in (b) of FIG. 3, the wafer W is transferred on the wafer chuck 2 by using the three pins 11A of the main chuck 11 in the alignment apparatus main body.

Therefore, as shown in FIGS. 3A and 3B, the through hole 21 for three pins is formed in the wafer chuck 2.
D is provided at three places between the ring-shaped grooves 21B and 21C. The through hole 21D is formed to have a diameter larger than the outer diameter of the three pin 4, and the through hole 21D is formed in the through hole 21D as shown in FIG.
As shown in (d), a cylindrical silicon rubber film 25 having a closed end is arranged, and the base end portion of the silicon rubber film 25 is formed on the back surface side of the chuck body 21 via a packing 26 made of aluminum, for example. It is screwed on. An O-ring 27 is attached to the outer periphery of the packing 26, and the silicon rubber film 25 and the O-ring 27 maintain the airtightness between the wafer chuck 2 and the contactor 3 and maintain the reduced pressure state between the two and 3. Is done. Further, the tip of the three pin 11A is formed to be slightly thick and round so as not to damage the silicon rubber film 25. Therefore, when transferring the wafer W on the wafer chuck 2 mounted on the main chuck 11, the three pins 11A of the main chuck 11 are raised and fitted into the through holes 21D of the wafer chuck 2, and then the three pins 11A are attached to the silicon rubber film. While extending 25, from the upper surface of the chuck body 21 of FIG.
Of that out collision as indicated by a chain line.

The contactor 3 has an anisotropic conductive sheet 31 in which conductors 31B are arranged in a matrix on a silicon rubber sheet 31A, as shown in FIGS. 2 and 4A and 4B, for example. An electrode pad 3A that surely contacts each conductor 31B of the anisotropic conductive sheet 31, a connection pad 3B formed corresponding to the electrode pad 3A, and a wiring 32 having a multi-layered structure connecting these both electrode pads.
And a wiring board 32 having B.
32 is formed as an integral body. Then, in a state where the contactor 3 and the wafer W are integrated, each electrode pad P of the chip T and the electrode pad 3A of the wiring board 32 are electrically connected to each other via the conductor 31B of the anisotropic conductive sheet 31. There is. The wiring board 32 is made of a material having a coefficient of thermal expansion substantially equal to that of the wafer W (eg, ceramic such as quartz glass).
The wiring 32B therein is made of a material having excellent conductivity such as aluminum. Further, the conductor 31B is a fine metal particle, and the contactor 3
When the wafer W is pressed against the wafer W, the silicon rubber sheet 31A is compressed so that the metal particles come into contact with each other and become conductive. In order for the electrode pad P of the chip T and the electrode pad 3A of the wiring board 32 to surely contact the respective conductors 31B of the anisotropic conductive sheet 31, the conductors 31B are arranged so as to satisfy the conditions of and Even if the anisotropic conductive sheet 31 comes into contact with the wafer W and the wiring substrate 32 at random, the conductor 31B surely contacts the electrode pad P of the chip T and the electrode pad 3A of the contactor 3 as shown in FIG. 4B. Need to contact. Adjacent conductor 31
The interval A of B should be smaller than the diameter D of the electrode pads P and 3A as shown in FIG. The distance B between the adjacent electrode pads P and 3A must be larger than the diameter d of the conductor 31B as shown in FIG.

As shown in FIG. 5, the bottom jacket 9 for controlling the temperature of the shell 4 has a plurality of ring-shaped grooves 9A which are concentrically formed on the surface thereof like the wafer chuck 2.
A state in which the shell 4 is placed on the bottom jacket 9 having an exhaust passage (not shown) formed therein, and a plurality of holes connecting the exhaust passage and the ring-shaped groove 9A. When vacuum exhaust is performed by a vacuum exhaust device (not shown) through the exhaust passage, the shell 4 is vacuum-sucked by the ring-shaped groove 9A. Also, bottom jacket 9
For example, as shown in FIG. 6, the surface heater 91 and the first cooling jacket 92 are built in, and the shell 4 placed on the bottom jacket 9 is controlled to a predetermined inspection temperature. The surface heater 91 is arranged on the front surface side of the bottom jacket 9, and the first cooling jacket 92 is arranged below the surface heater 91. Further, a heat resistance sheet 93 such as tetrafluoroethylene resin having excellent heat insulation and heat resistance is interposed between the surface heater 91 and the first cooling jacket 92. The thermal resistance sheet 93 is formed by thermally insulating the first cooling jacket 92 from the surface heater 91.
The cooling jacket 92 is prevented from being overheated, the surface heater 91 is prevented from being excessively raised in temperature, and the shell 4 is kept at the optimum inspection temperature. That is, the first
Inside the cooling jacket 92, as shown in FIG. 6, a refrigerant passage 92A is formed which extends over the entire surface.
Refrigerant (cooling water in this embodiment) is flowing through A, and this cooling water is heated by the surface heater 91 to cool the cooling jacket 9.
There is a risk that it will boil within 2 and will no longer function as a refrigerant. Therefore, the heat resistance sheet 93 prevents the surface heater 91 from
Block the heat flow from the
The temperature is kept at -80 ° C so that the optimum cooling capacity can always be exerted. In this way, by controlling the surface heater 91 and the first cooling jacket 92 to the optimum temperature, the shell 4
Can be maintained at 110 ° C. at all times.

Further, the first cooling jacket 92 not only simply improves the temperature control of the bottom jacket 9, but also
It also has a function of suppressing a temperature increase around the first cooling jacket 92. As shown in FIGS. 2 and 7, a second cooling jacket (hereinafter, referred to as “top jacket”) 12 is provided on the back surface of the pressing plate 7, and the top jacket 12 has an internal refrigerant flow path. The contactor 3 held by the pressing plate 7 is cooled by the cooling water flowing in 12A, and the contactor 3 has a function of suppressing an increase in the temperature around them. Therefore, in the temperature control room 1A, the bottom jacket 9
The temperature of the wafer chuck 2 is controlled by the first cooling jacket 92 and the top jacket 12, and the temperature rise around the wafer chuck 2 is suppressed by the first cooling jacket 92 and the top jacket 12 to suppress the heat radiation from the temperature control chamber 1A as much as possible.

The surface heater 91, the first cooling jacket 92 and the top jacket 12 play their respective roles under the control of the wafer temperature controller 13. Therefore, next, the wafer temperature control device 13 will be described with reference to FIG.
Will be described with reference to. This wafer temperature control device 13
Is a heater temperature control device 14 that controls the temperature of the surface heater 91 and a refrigerant temperature control device 15 that controls the temperatures of the cooling water supplied to the first cooling jacket 92 and the top jacket 12. Has become.

As shown in FIG. 7, the heater temperature control device 14 includes a temperature measuring device 141 for measuring the temperature of the wafer chuck 2, a detection signal from the temperature measuring device 141, and a preset target value (for example, 110). First PID controller 1 that transmits a PID control signal based on the deviation from
42, a relay 143 that operates based on the PID control signal of the first PID controller 142, a heater power supply 144 that controls the temperature of the surface heater 92 based on the operation of the relay 143, and a detection signal of the temperature sensor 141. The temperature of the wafer chuck 2 is quickly heated to the target value according to the deviation from the target value to maintain a stable inspection temperature. When there is a deviation between the measured temperature of the wafer chuck 2 and the target value (110 ° C.), the first PID controller 142 sends the PID control signal to the relay 1 according to the deviation amount.
43 to the heater power supply 144 via the relay 143.
Is controlled by PID to quickly and stably match the surface heater 92 with the target value.

Further, the refrigerant temperature control device 15 is shown in FIG.
As shown in FIG. 2, a water tank 151 for storing the cooling water for the first cooling jacket 92 and the top jacket 12, a cooler 152 having a refrigerant pipe 152A inserted into the cooling water in the water tank 151, and a water tank 151 The temperature sensor 153 is provided with a temperature sensor 153 for measuring the water temperature of the water, and a second PID controller 154 for PID-controlling the cooler 152 in accordance with a deviation between a detection signal from the temperature sensor 153 and a preset target value. The water temperature is quickly cooled to the target value in accordance with the deviation between the detection signal and the target value to maintain a stable water temperature. Further, the water tank 151, the first cooling jacket 92, and the refrigerant passage 92 of the top jacket 12
The entrances and exits of A and 12A are forward piping 155A (Fig. 5).
Then, it is indicated by a solid line. ) And the return pipe 155B (Fig. 5)
Is indicated by a broken line. ), And cooling water is supplied to the water tank 151 via these two pipes 155A and 155B.
And the first cooling jacket 92 and the top jacket 12 are circulated. The outward pipe 155A is branched into two directions on the way, one of which is connected to the inlet of the refrigerant passage 92A of the first cooling jacket 92 and the other of which is connected to the inlet of the refrigerant passage 12A of the top jacket 12. A pump 156 is arranged near the water tank 151 at the branch point of the outward path 155A, the cooling water is circulated by the pump 156, and the flow rate of the cooling water in the outward path and the return path is measured by the flow meter 157. . Then, if there is a deviation between the measured temperature of the cooling water in the water tank 151 and the target value (for example, 40 ° C.), the second PID controller 154 outputs the PID control signal to the cooler 1 according to the deviation amount.
52, and the PID control of the cooler 152 is performed to adjust the flow rate of the refrigerant in the refrigerant pipe 152A so that the water temperature of the water tank 151 matches the target value quickly and stably. By optimally controlling the temperature of the cooling water by the refrigerant temperature control device 15 as described above, the first cooling jacket 9
In 2, the bottom jacket 9 is cooled and its surroundings are cooled, and in the top jacket 12, the contactor 3 is cooled and its surroundings are cooled to suppress the temperature rise in the temperature control chamber 1A. Further, as the refrigerant of the cooler 152, for example, ethylene glycol, water or the like is used. In FIG. 7, 155C is a return pipe and 15
Reference numerals 8A, 158B and 158C are valves, and when the cooling water is not supplied to the first cooling jacket 92 and the top jacket 12, the valves 158A and 158B are closed and the valve 158C is opened to return the cooling water to the water tank 151. .

By the way, by specially devising the temperature measuring device 141 of the wafer chuck 2 and measuring the temperature of the wafer W with high accuracy through the wafer chuck 2, the control accuracy of the wafer temperature control device 13 is increased, The reliability of the W reliability test is improved. Therefore, the temperature measuring device for the wafer chuck will be described with reference to FIGS. This temperature measuring device 141, as shown in FIG.
A rod-shaped temperature sensor 1 for detecting the temperature of the wafer chuck 2.
41A, a cylinder 141C accommodating a flange-shaped piston portion 141B formed at the base end portion of the temperature sensor 141A, and a spring 141D that is elastically mounted in the cylinder 141C and always urges the temperature sensor 141A upward. And is installed upright at three locations on the base 5. And 3
The temperature sensor 141A of the book is shown in FIG. 5 and FIG.
As shown in (b), 3 are provided at equal intervals in the radial direction from the center of the bottom jacket 9 to the vicinity of the outer circumference.
It is fitted in the through hole 9B at the location. This temperature sensor 14
1A is configured, for example, by inserting a thermocouple into a stainless steel pipe with a closed tip. In addition, (a) of FIG.
In (b), only the temperature measuring device 141 arranged at the center of the wafer chuck 2 is shown in its entirety, and the others are the temperature sensors 141.
Only the tip of A is shown.

Further, on the back surface of the wafer chuck 2, three recesses 2A corresponding to the through holes 9B are formed in the radial direction. The recess 2A is formed to a depth reaching from the back surface of the wafer chuck 2 to the vicinity of the front surface, and the temperature sensor 1
41A makes elastic contact with the innermost portion of the recess 2A, the temperature of the wafer chuck 2 is measured at a position as close as possible to the wafer W, and the temperature extremely close to the actual temperature of the wafer W can be grasped. The thickness t from the innermost portion of the recess 2A to the surface of the wafer chuck is set to 1 mm, for example. Further, the wafer chuck 2 is made of a material having a high thermal conductivity, such as a metal such as aluminum, so that the temperature gradient from the wafer surface to the inner portion 2A is minimized. Therefore, when the shell 4 is pressed onto the bottom jacket 9 via the pressing plate 7, the shell 4 comes into close contact with the bottom jacket 9 as described later, and when the bottom jacket 9 descends in this state, the three temperature sensors The tips of the 141A project from the surface of the bottom jacket 9 and the wafer chuck 2
When the bottom jacket 9 is subsequently lowered, the tip of the temperature sensor 141A is inserted into the recess 2A of the recess 2A.
Elastically contact the innermost part of the wafer chuck 2 via a spring 141D, measure the temperature of the wafer chuck 2 at a position closest to the wafer W of the wafer chuck 2, and then grasp the temperature substantially equal to the actual temperature of the wafer W. You can The temperature sensor 141A moves up and down within a range of, for example, 15 mm via a spring 141D.

Further, as shown in an enlarged view in FIG. 8C, a position detecting sensor 141E having a U-shaped plane structure is disposed on the inner peripheral surface of the cylinder 141C, and the temperature sensor 141 is provided.
When A falls in the direction of the arrow against the spring 141C, the shutter 141F attached to the temperature sensor 141A blocks the light beam of the position detection sensor 141E to detect the height of the temperature sensor 141A. That is, the temperature sensor 1
By detecting the height of 41A, whether or not the shell 4 is placed on the bottom jacket 9 is detected.

Further, as shown in FIGS. 8A and 8B, a jacket joining device 16 is provided on the bottom jacket 9, and the shell joining device 16 surely joins the shell 4 and the bottom jacket 9 together. Is done.
This jacket joining device 16 has a plurality of long bolts 161 for connecting and supporting the base 5 and the bottom jacket 9 as shown in FIG. Spring 1 to support
And 62. More specifically, a plurality of through holes 5A corresponding to the plurality of long bolts 161 are formed in the base 5 as guide holes at equal intervals in the circumferential direction, and the long bolts 161 pass through these through holes 5A. Each long bolt 1
The head 161B of 61 is locked on the back side of the base 5. In addition, recesses into which a plurality of long bolts 161 are fitted are formed at the outer peripheral edge of the back surface of the bottom jacket 9 at equal intervals in the circumferential direction, and further, through holes are formed in the center of each recess. Further, a female screw portion 161A is formed at the tip of the long bolt 161, and this tip portion is fitted into the recessed portion of the bottom jacket 9, and the screw 163 inserted into the through hole from the surface of the bottom jacket 9 becomes the female screw portion 161A. It is screwed. Therefore, the long bolt 161 is attached to the bottom jacket 9
And the head is locked on the back surface of the base 5.

Therefore, when the shell 4 descends via the pressing plate 7 and reaches the bottom jacket 9 as described above, even if the shell 4 is slightly inclined with respect to the surface of the bottom jacket 9, As the shell 4 descends, the springs 162 are gradually compressed and the bottom jacket 9 is corrected by the shell 4, and the bottom jacket 9 is elastically joined to the shell 4 in a state of being in close contact with the shell 4, 4 is horizontal so that all the connection pads 3B of the contactor 3 and the pogo pins 10 collectively and evenly contact each other. The expansion and contraction range of the spring 162 is set so that the bottom jacket 9 can be raised and lowered within a range of, for example, 10 mm during joining. Further, at the time of joining, the above-mentioned temperature measuring device 1
Since the spring 141D of No. 4 expands and contracts within a range of 15 mm, the expansion and contraction range of the spring 141D has a margin of 5 mm with respect to the spring 162. Therefore, even if the bottom jacket 9 is lowered by 10 mm during joining, the temperature sensor 141A Can always elastically contact the concave portion 2A of the wafer chuck 2.

As shown in FIG. 9A, a pogo pin block 17 is provided on the base plate 8 surrounding the bottom jacket 9, and the pogo pin 10 is planted in the pogo pin block 17. Therefore, the pogo pin block 17 will be described in detail. As shown in FIG. 9A, for example, the pogo pin block 17 has a structure in which it is radially divided into four parts from the center of the hole 17A facing the bottom jacket 9, and each part is a block element 171.
Is formed as. A gap δ of, for example, 1 mm is formed between adjacent block elements 171, and the thermal expansion of each block element 171 is absorbed by each gap δ. By thus dividing the pogo pin block 17 into four, the dimensional change due to thermal expansion of each block element 171 is reduced, and even if the block element 171 thermally expands during the reliability test as shown in FIG. 9B. The pogo pin 10 only moves from the solid line position to the alternate long and short dash line position, for example, and surely comes into contact with the contact pad 3B of the contactor 3 without coming off. If the pogo pin block 17 'is formed of an integral block as shown in FIG. 10 (a), the pogo pin block 17' will be the block element 17 '.
Since it is four times the size of 1, the pogo pin block 17 '
The dimensional change due to thermal expansion is large, and as shown in (b) of the figure, the pogo pin 10 moves from the solid line position to the alternate long and short dash line position and comes off the connection pad 3B of the contactor 3, which may reduce the reliability of the inspection. . For example, the pogo pin block 17 shown in FIG. 9A has a length of 310 mm and a width of 310 m.
When the thickness is 30 mm and the thickness is 30 mm, the deviation amount in the outside pogo pin 10 in FIG. 9B is 300 μm, but in the case of the integrated pogo pin block 17 ′ shown in FIG. Even if it is the same size as the pogo pin block 17 shown in FIG. 9A, the shift amount in FIG. 10B is 6
It was 00 μm. Therefore, the pogo pin block 17
By dividing, the amount of displacement of the pogo pin 10 can be halved, and the pogo pin 10 can surely come into contact with the connection pad 3B of the contactor 3 so that the contact is stable and the reliability of the inspection can be improved. The pogo pin block 17 is preferably made of synthetic resin such as glass fiber-containing polyimide resin or polyamide-imide resin in a rectangular shape, and has a coefficient of thermal expansion as close as possible to that of the contactor 3.

A guide hole 171A is formed at the corner of the block element 171.
71A and the guide hole (not shown) of the base 5 formed corresponding to the guide hole 171A are used as a reference to position the block element 171 at a predetermined mounting position. Further, the block element 171 is formed with fastening holes 171B for fastening members such as a plurality of screws, and the fastening screw holes of the base 5 formed corresponding to these fastening holes 171B are used as a reference. Block element 171
Is fastened and fixed to a predetermined mounting position. Therefore, after passing the guide pins (not shown) through the guide holes 171A of the block element 171 and the base 5, respectively,
By fastening the block element 171 and the base 5 with a fastening member, the block element 171 can be accurately fixed to a predetermined mounting position. The fastening hole of the block element 171 has a margin for absorbing a dimensional change due to thermal expansion of the block element 171.

Next, the operation will be described. Before mounting the shell 4 in the wafer storage chamber 1 as shown in FIG.
First, the wafer chuck 2, the wafer W and the contactor 3 are integrated as a shell 4 by using an alignment device. To that end, as shown in FIG. 3B, the wafer chuck 2 is placed on the main chuck 11 of the alignment apparatus. After placing the wafer chuck 2 on the main chuck 11,
When the wafer W is transferred onto the wafer chuck 2, the three pins 11A of the main chuck 11 rise at this point,
The wafer W is fitted into the through hole 21D of the wafer chuck 2 and protrudes from the surface of the wafer chuck 2 while extending the silicon rubber film 25 as shown by the dashed line in FIG.
Waiting for After that, when the wafer W is received by the wafer chuck 2, the three-pin 11A retracts into the main chuck 11 and returns to the original position, and the wafer W is placed on the wafer chuck 2. In parallel with this operation, the contactor 3 is arranged at a predetermined position above the main chuck 11.
Next, the electrode pad P of the wafer W and the electrode pad 3A of the contactor 3 are read by an image pickup device such as a CCD camera (not shown), and the position coordinates of a typical electrode pad P among the electrode pads P of the wafer W are obtained. , The electrode pads 3 of the contactor 3 corresponding to these electrode pads P
After obtaining the position coordinates of A, the main chuck 11 moves in the X, Y and θ directions based on these coordinate values to perform the alignment operation of both P and 3A, and after alignment,
The main chuck 2 is raised to bring all the electrode pads P into contact with the electrode pads 3A corresponding to them.

At this point, for example, the wafer chuck 2 has already been
Is in a state in which nitrogen gas replacement and vacuum evacuation are possible via the gas supply / discharge pipes 22 and 23. Therefore, the gas supply pipe 2
Nitrogen gas is supplied from 2 to replace the air between the wafer chuck 2 and the contactor 3 with nitrogen. Next, when the nitrogen gas supply source is removed from the gas supply pipe 22, the valve mechanism 2 of the gas supply pipe 22 is removed.
2A and 23A operate to close the gas passage 21A. On the other hand, when the gas exhaust pipe 23 is evacuated, the gas flow passage 21
A, ring-shaped grooves 21B, 21 on the surface of the wafer chuck 2
The nitrogen gas between the wafer chuck 2 and the contactor 3 is evacuated via C, and the electrode pad P of the wafer W and the electrode pad 3A of the contactor 3 are brought into contact with each other as shown in FIG. As a result, the shell 4 becomes a state in which all the chips can be collectively inspected in a wafer state. Even if the heights of the electrode pads P vary, the anisotropic conductive sheet 3
Variation can be absorbed by 1. Even when the pressure between the wafer chuck 2 and the contactor 3 is reduced as described above, the reduced pressure space is shielded from the outside by the seal ring 24 around the wafer chuck 2, and the three-pin through hole 21D is changed by the silicon rubber film 25 to the outside. Since it is blocked from the above, the depressurized state can be reliably maintained.

After that, the shell 4 is unloaded from the alignment apparatus via a transfer mechanism (not shown), transferred to the wafer storage chamber 1 as shown in FIG. 1, and the shell 4 is loaded into the wafer storage chamber 1. In the wafer storage chamber 1, after the shell 4 is clamped by the clamp mechanism, the cylinder mechanism 6 at four locations is clamped.
Is driven to push down the shell 4 to the bottom jacket 9 via the pressing plate 7. When the pressing plate 7 descends and reaches the bottom jacket 9, it is impossible to horizontally descend the pressing plate 7 by each cylinder mechanism 6, and there is some inclination between the shell 4 and the bottom jacket 9. When the shell 4 is joined to the bottom jacket 9, the plurality of springs 162 of the jacket joining device 16 absorb the inclination of the shell 4 and the shell 4 and the bottom jacket 9 come into close contact with each other and elastically join. Then, when the pressing plate 7 reaches the lower end, the wafer chuck 2 of the shell 4 and the bottom jacket 9 are evenly adhered to each other, and all the connection pads 3B of the contactor 3 of the shell 4 are electrically integrated with the corresponding pogo pins 10. And all of the chips on the wafer W are brought into contact with each other uniformly to be able to conduct a reliability test collectively in a wafer-like state.

On the other hand, in the process in which the bottom jacket 9 is joined to the wafer chuck 2 via the jacket joining device 16, the bottom chuck 9 is joined to the wafer chuck 2, and the elasticity of the spring 162 of the jacket joining device 16 is maintained in this state. When the bottom jacket 9 is further lowered against the above, the temperature sensor 141A of the temperature measuring device 141 gradually protrudes from the surface of the bottom jacket 9 and fits into the recess 2A on the back surface of the wafer chuck 2. Then, before the bottom jacket 9 reaches the descending end, the temperature sensor 141A moves to the concave portion 2
The tip of the temperature sensor 141D elastically contacts the innermost portion of the recess 2A by contacting the innermost portion of A with the spring 141D compressing the temperature of the wafer chuck 2 at a position 1 mm away from the wafer W. Is ready to measure. Moreover, by detecting the position of the temperature sensor 141A by the position detection sensor 141E, it is possible to reliably detect whether or not the shell 4 is present on the bottom jacket 9.

Next, when the reliability test is started, the wafer temperature control device 13 is activated to set the wafer W at the inspection temperature (11
(0 ° C) and control the temperature to the inspection temperature. At this time, in the heater temperature control device 14, the heater power supply 144 is turned on to heat the wafer chuck 2 from the back surface via the surface heater 91. Then, the temperature sensor 141A of the temperature measuring device 141 measures the temperature of the wafer chuck 2 and transmits the detection signal to the PID controller 142. When the PID controller 142 transmits a control signal to the relay 143 according to the deviation from the target value (inspection temperature), the heater power supply 144 is PID-controlled via the relay 143, and the heater power supply 144 changes from the heater power supply 144 to the surface heater 91 according to the deviation. Is applied to increase the temperature of the wafer chuck 2 to the inspection temperature in a short time through the surface heater 91. On the other hand, in the refrigerant temperature control device 15, the valves 158A and 158B are opened and the pump 156 is driven to supply the cooling water in the water tank 151 to the first cooling jacket 92 and the top jacket 12 of the bottom jacket 9 through the outward pipe 155A. . The cooling water returns to the water tank 151 through the respective return channels 92A and 12A and the return pipe 155B, starts circulating the cooling water, and cools the bottom jacket 9 and the top jacket 12, respectively.

When the wafer chuck 2 reaches the inspection temperature,
The PID controller 142 operates based on the detection signal of the temperature sensor 141A to perform PID control of the heater power supply 144, and the supplied power is kept substantially constant to hold the wafer chuck 2 at the inspection temperature. During this time, the bottom jacket 9 and the top jacket 12 are cooled by the cooling water, and the temperature of the cooling water rises by absorbing the heat of the surface heater 91. However, since the thermal resistance sheet 93 is interposed between the surface heater 91 and the first cooling jacket 92, most of the heat flow from the surface heater 91 to the first cooling jacket 92 is the thermal resistance sheet 9.
3, the cooling water is prevented from rising excessively, the cooling water is prevented from boiling in the refrigerant passage 92A, and the bottom jacket 9 is efficiently cooled. However, when the wafer chuck 2 reaches the inspection temperature, the temperature of the cooling water returning from the bottom jacket 9 and the top jacket 12 to the water tank 151 reaches around 70 to 80 ° C. Therefore, aquarium 1
The cooling water in 51 is always cooled by the cooler 152 to a temperature (for example, 40 ° C.) with good cooling efficiency. The temperature of the cooling water is always detected by the temperature sensor 153, and a detection signal is transmitted to the PID controller 154, whereby the cooler 1
52 is PID controlled to constantly regulate the flow rate of the refrigerant, and the water tank 1
The cooling water in 51 is always kept at a constant temperature. As a result, the temperature increase around the bottom jacket 9 is suppressed by the first cooling jacket 92, the temperature increase of the contactor 3 and the temperature increase around the contactor 3 are suppressed by the top jacket 12, and the temperature inside the temperature control chamber 1A is increased. Is suppressed, and by extension, heat dissipation to the periphery of the wafer storage chamber 1 is suppressed.

Further, the pogo pin block 17 thermally expands due to the temperature rise in the temperature control chamber 1A. However, since the pogo pin block 17 is divided into four block elements 171, the dimensional change due to thermal expansion of each block element 171 is significantly smaller than that in the case where the pogo pin block 17 is not divided. Therefore, the pogo pins 10 implanted in the pogo pin block 17 are in stable and reliable contact with the connection pads 3B of the contactor 3. Moreover, since there is a space of 1 mm between each block element 171, the thermal expansion of each block element 171 can be absorbed by these gaps δ.

When the wafer W reaches the inspection temperature under the control of the wafer temperature control device 13, the test signal S1 is transmitted from the driver to the wafer W through the connector, the pogo pin 10 and the contactor 3 as shown in FIG. The inspection result signal S2 is transmitted from W to the tester by following the reverse path, and the reliability test can be performed on all the chips in the wafer state.

As described above, according to this embodiment,
The shell 4 is a chuck body 2 for holding the wafer W.
1 and an electrode pad for establishing continuity with the electrode pad of the wafer W.
Chuck body 2 including a contactor 3 having a lid
1 denotes a plurality of openings on the surface of the chuck body 21.
And the inside of the chuck body 21 communicating with these openings.
Of the gas flow passage 21A formed in the
Valve mechanism 22A, 23A attached to the entrance and exit, and chuck
A seal attached over the entire outer peripheral edge of the surface of the main body 21.
Provided through the ring 24 and the chuck body 21.
And when the wafer W is transferred on the surface of the chuck body,
A plurality of through holes 21D through which the pins 11A move up and down, and
Three pin 11A provided in each through hole 21D of
And a silicon rubber film 25 that expands and contracts as it goes up and down,
Evacuate between the chuck body 21 and the contactor 3.
As a result, the chuck body 21, the contactor 3, and the wafer
Conveyor with W integrated and depressurized state maintained
Since the wafer W is transferred by the structure, when the wafer W is transferred on the wafer chuck 2, the three pins 11A of the main chuck 11 move in and out through the through hole 21D.
Can be smoothly transferred, and even if the main body 21 of the main chuck 2 and the contactor 3 are evacuated through the gas supply / discharge pipes 22 and 23 in order to make contact with the contactor 3 all at once, the seal ring 24 and the silicon A decompression space can be created by the rubber film 25, and after decompression, the valve mechanism 22A,
The reduced pressure state can be maintained by 23A.
Furthermore, after the wafer chuck 2, the wafer W, and the contactor 3 are integrated as the shell 4, it can be easily transferred to the wafer storage chamber 1 by using the transfer mechanism.

As shown in FIG. 3D, the silicone rubber film 25 is formed into a cylindrical shape having a sealed end and an opened lower end in conformity with the shape of the three pin 11A. 21D, the three-pin 11A can be smoothly expanded and contracted as the three-pin 11A moves up and down. Also, the lower surface of the chuck body 21
The concave portion 2A into which the temperature sensor 141A is fitted is provided
Therefore, insert the temperature sensor 141A in the recess 2A during the reliability test.
Temperature that is approximately equal to the actual temperature of the wafer W
Can be grasped.

In the above embodiment, the wafer chuck 2 for the reliability test has been described, but the wafer holder of the present invention can be widely used as a carrier for carrying wafers one by one. Further, the wafer holder of the present invention is not limited to the above embodiment, and each constituent member can be appropriately changed as necessary.

[0042]

According to the invention described in claim 1 of the present invention, the wafer and the contactor can be securely transferred by transferring the wafer smoothly.
It makes contact with all at once and is easily transported by the transport mechanism.
Can provide a shell that can

According to a second aspect of the present invention, in the first aspect of the invention, when the wafer is transferred, the seal film expands and contracts as the pins move up and down, and the pins smoothly move in and out. Can provide a shell that can. According to the invention of claim 3 of the present invention,
In the invention described in claim 1 or 2, the reliability
Understand the temperature that is approximately equal to the actual temperature of the wafer during the test.
You can provide a shell that can

[Brief description of drawings]

FIG. 1 is a perspective view showing a state where a shell is stored in a wafer storage chamber.

FIG. 2 is an exploded perspective view for explaining exchange of signals when a reliability test is performed using the wafer storage chamber shown in FIG.

FIG. 3 is a diagram showing the wafer chuck shown in FIG.
Is a perspective view thereof, (b) is a cross-sectional view of a main part thereof, (c) is a cross-sectional view showing a valve mechanism of a gas supply / discharge pipe, and (d) is a perspective view showing a seal member used in the main part shown in (b). It is a figure.

4A and 4B are diagrams showing a state in which the wafer and the contactor shown in FIG. 1 are collectively in contact with each other, FIG. 4A is a plan view showing a relationship between an anisotropic conductive sheet of a chip and a contactor, and FIG. Sectional views, (c) and (d) are plan views showing the relationship between the electrode pads and the conductors of the anisotropic conductive sheet, respectively.

FIG. 5 is a perspective view showing the bottom jacket shown in FIG. 2 taken out.

6 is a cross-sectional view of the bottom jacket shown in FIG.

FIG. 7 is a block diagram showing a wafer temperature control device according to one embodiment of the present invention shown in FIG.

FIG. 8 is a cross-sectional view schematically showing the jacket joining apparatus for the bottom jacket and the wafer temperature measuring apparatus shown in FIG.
(A) is a figure which shows the state before attaching a shell, (b) is a figure which shows the state after attaching a shell, (c) is an enlarged view which shows the relationship between a temperature sensor and a position detection sensor.

9 is a diagram showing the pogo pin block shown in FIG.
(A) is a perspective view showing a pogo pin block in which pogo pins are erected, and (b) is a schematic view showing a thermal influence when the contact of the pogo pin of (a) is made.

10 is a view showing another pogo pin block for comparison with the pogo pin block shown in FIG. 9, (a) is a perspective view showing the pogo pin block in which the pogo pins are erected, and (b) is the pogo pin of (a). It is a schematic diagram which shows the thermal influence when a contactor contacts.

[Explanation of symbols]

2 Wafer chuck (wafer holder) 11 Main chuck 11A three-pin 21 body 21A gas flow path (exhaust passage) 21D Through hole (pin hole) 22 Gas supply pipe 22A valve mechanism 23 Gas exhaust pipe 23A valve mechanism 24 Seal ring (seal member) 25 Silicone rubber film

─────────────────────────────────────────────────── --- Continued from the front page (56) References JP-A-6-333799 (JP, A) JP-A-5-280647 (JP, A) JP-A-7-263523 (JP, A) JP-A-6- 349750 (JP, A) JP-A 1-283845 (JP, A) JP-A 8-148533 (JP, A) JP-A 9-274055 (JP, A) (58) Fields investigated (Int.Cl. ⁷ , DB name) H01L 21/68 H01L 21/66

Claims (3)

(57) [Claims] A chuck body for holding a semiconductor wafer and an electrode pad of the semiconductor wafer are electrically connected to each other.
With a contactor with an electrode pad for
There are, the chuck body has a plurality of openings which open in the chuck body surface, and the gas flow path and communicating with these openings being and formed within the chuck body, the moth
Scan channel and instrumentation deposited by a valve mechanism to entrance of a seal member mounted over the entire circumference the outer peripheral edge portion of the chuck present <br/> surface, and the semiconductor wafer through the chuck body
The pin moves up and down when transferring on the chuck body surface
A plurality of pin holes and a seal film which is provided in each of the pin holes and expands and contracts as the pins move up and down are provided.
Evacuate between the chuck body and the contactor.
This reduces the pressure on the chuck body and contact.
Integrated with the semiconductor wafer and the semiconductor wafer
Shell, characterized in that it is. 2. The shell according to claim 1, wherein the sealing film is formed in a cylindrical shape having a sealed front end and an open lower end. 3. A temperature sensor is provided on the lower surface of the chuck body.
The shell according to claim 1 or 2 , further comprising a recess for fitting .