CN1920585B - Substrate detector - Google Patents
Substrate detector Download PDFInfo
- Publication number
- CN1920585B CN1920585B CN2006100802489A CN200610080248A CN1920585B CN 1920585 B CN1920585 B CN 1920585B CN 2006100802489 A CN2006100802489 A CN 2006100802489A CN 200610080248 A CN200610080248 A CN 200610080248A CN 1920585 B CN1920585 B CN 1920585B
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- Prior art keywords
- inspection
- substrate
- temperature
- inspection substrate
- mounting
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- 239000000758 substrate Substances 0.000 title claims abstract description 446
- 238000007689 inspection Methods 0.000 claims abstract description 413
- 238000012423 maintenance Methods 0.000 claims description 9
- 238000009826 distribution Methods 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 abstract description 115
- 238000001816 cooling Methods 0.000 abstract description 106
- 239000000523 sample Substances 0.000 abstract description 15
- 238000000034 method Methods 0.000 abstract description 9
- 238000004904 shortening Methods 0.000 abstract 1
- 230000008646 thermal stress Effects 0.000 abstract 1
- 238000012856 packing Methods 0.000 description 30
- 238000012545 processing Methods 0.000 description 29
- 230000032258 transport Effects 0.000 description 28
- 238000013461 design Methods 0.000 description 21
- 238000010586 diagram Methods 0.000 description 14
- 230000002950 deficient Effects 0.000 description 12
- 238000010521 absorption reaction Methods 0.000 description 11
- 230000014509 gene expression Effects 0.000 description 11
- 125000006850 spacer group Chemical group 0.000 description 9
- 230000003028 elevating effect Effects 0.000 description 8
- 238000005259 measurement Methods 0.000 description 8
- 238000002474 experimental method Methods 0.000 description 7
- 238000012360 testing method Methods 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000010304 firing Methods 0.000 description 5
- 238000009434 installation Methods 0.000 description 5
- 238000002788 crimping Methods 0.000 description 4
- 238000009413 insulation Methods 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 239000004411 aluminium Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 239000000741 silica gel Substances 0.000 description 3
- 229910002027 silica gel Inorganic materials 0.000 description 3
- 238000009997 thermal pre-treatment Methods 0.000 description 3
- 235000008331 Pinus X rigitaeda Nutrition 0.000 description 2
- 235000011613 Pinus brutia Nutrition 0.000 description 2
- 241000018646 Pinus brutia Species 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000004364 calculation method Methods 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000000265 homogenisation Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 229920002379 silicone rubber Polymers 0.000 description 2
- 230000000007 visual effect Effects 0.000 description 2
- 230000004308 accommodation Effects 0.000 description 1
- 210000000988 bone and bone Anatomy 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000012790 confirmation Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/281—Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing
- G01R31/2817—Environmental-, stress-, or burn-in tests
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0441—Details
- G01R1/0458—Details related to environmental aspects, e.g. temperature
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Tests Of Electronic Circuits (AREA)
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
- Investigating Or Analyzing Materials Using Thermal Means (AREA)
Abstract
The present invention provided a substrate inspection device and a substrate inspection method which are capable of shortening the time required for inspecting a substrate, while imposing thermal stress on an inspected substrate. The substrate inspection device is equipped with a cooling holding unit 22 provided with a cooling plate 221 that cools a substrate 8 to be inspected, a heating holding unit 24 provided with a heating plate 241 that heats the inspected substrate 8, a transfer unit 32 which transfers the inspected substrates 8 in a predetermined order to the placement area of the cooling plate 221 and the heating plate 241, and movable probes 37 and 38, which inspect the inspected substrate 8 that is cooled by the cooling holding unit 22 and the inspected substrate 8 heated by the heating holding unit 24, respectively.
Description
Technical field
The present invention relates to becoming that the substrate of checking object applies temperature stress and the base board checking device checked.In addition, the invention is not restricted to printed wiring board, for example, can be applied to battery lead plate and the base plate for packaging of semiconductor-sealing-purpose or the inspection of the electric wiring in the film carrier tape manufactured using various substrates such as (film carrier) that flexible base, board, multi-layered wiring board, LCD or plasma display are used, in this manual, these various wiring substrates are referred to as " substrate ".
Background technology
In the past, known have a following base board checking device: in order to check at the conducting of the wiring graph that forms on the substrates such as printed wiring board or the inspecting substrate that has or not or check the resistance value between wiring graph or wiring graph of the circuit defect between each wiring graph, portable inspection is contacted with a plurality of inspections of contact or the maintenance of spininess shape ground a plurality of checkpoints with weld pad that forms on contact etc. and the wiring graph or pad etc., by measuring the resistance between the checkpoint on the corresponding inspection object wiring graph, carry out inspecting substrate.
In such substrate, for example, the connection between wiring graph and the through hole sometimes is insufficient, thus though the instability of conducting connection status.Because such defective, following situation appearring sometimes: is judged as conducting between the checkpoint when checking, is considered as non-defective unit and after being assembled in the product, because of the temperature stress in the environment for use shows defective.Particularly, can not from the outside visual examination of substrate in the inside of substrate, connect the inadequate connection defective the embedding through hole between wiring graph, therefore be difficult to by detecting.
Therefore, following testing fixture has been proposed: when inspecting substrate, by between the hot environment of heating and the low temperature environment of cooling to mounting check that the space of object substrate switches, under the state that has applied temperature stress, check, thereby detect so inadequate connection defective (for example, with reference to patent documentation 1).
[patent documentation 1] TOHKEMY 2001-215257 communique
In addition, as mentioned above, applying in the testing fixture that temperature stress checks by the mounting space of checking object substrate is switched between high temperature, low temperature environment, having the defective that the heating of substrate and cooling spended time, supervision time increase owing to the handoff procedure of environmental baseline.
Summary of the invention
The present invention is exactly the invention of finishing in view of such problem, and its purpose is to provide and can applies temperature stress, shorten the base board checking device of supervision time simultaneously inspection substrate.
Base board checking device of the present invention carries out the inspection of the distribution that forms on substrate, it is characterized in that having: keep body, its arranged in one direction a plurality of substrates of mounting respectively a plurality of mounting portion, around described a plurality of mounting portion, have a side wall portion; The temperature applying unit, it applies the position in predetermined temperature, makes the temperature of described maintenance body become predetermined temperature; Inspection portion, its substrate after predetermined inspection position inspection becomes predetermined temperature by described temperature applying unit; Moving part, it applies between position and the described inspection position in described temperature and moves; And cover, it applies the position in described temperature, described inspection position and apply the position to the mobile route of described inspection position from described temperature, cover described a plurality of mountings position, described cover has the inspection peristome of the size at a described mounting position in described inspection position, described moving part makes described maintenance body relatively move with respect to described cover, so that described a plurality of mountings position is relative with peristome with described inspection successively, described inspection portion carries out the inspection of the described substrate of mounting on described a plurality of mountings position successively with peristome via described inspection.
In addition, it is characterized in that in the aforesaid substrate testing fixture, described cover has: first lid, it applies the position in described temperature and covers described a plurality of mountings position; And second lid, its on described mobile route and described inspection position cover described a plurality of mountings position, described first lid constitutes and can open and close.
In addition, it is characterized in that in the aforesaid substrate testing fixture, described cover is laminated by a plurality of sheet components.
In addition, it is characterized in that, in the aforesaid substrate testing fixture, also with described first and second lids in any one relatively have the video camera of the image of the substrate of mounting on the mounting position of taking described maintenance body, described inspection portion is based on the image that is photographed by described video camera, carry out the position adjustments in the inspection of this substrate, in described first and second lids any one with the relative position of described video camera on have than a position adjustments peristome that described mounting position is little, described video camera is obtained the image of described substrate with peristome via described position adjustments.
In addition, it is characterized in that, in the aforesaid substrate testing fixture, also with described first and second lids in any one relatively have the thermometer that the temperature of the substrate of mounting on the mounting position of described maintenance body is measured, under the situation of described inspection portion in the temperature that is gone out by described thermometer measure is in predefined temperature range, carry out the inspection of this substrate, in described first and second lids any one has at the relative position place with described thermometer than a temperature survey peristome that described mounting position is little, and described thermometer is measured the temperature of described substrate with peristome via described temperature survey.
The base board checking device of this spline structure is by mounting substrate on cooled cooler pan, substrate is cooled by heat conduction, by mounting substrate on the heating plate after the heating, substrate is heated by heat conduction, so can under situation about switching between high temperature, the low temperature environment, substrate not applied temperature stress and check for the mounting space of the substrate of checking object, so can apply temperature stress to substrate, shorten the supervision time simultaneously.
Description of drawings
Fig. 1 is the stereoscopic figure of an example of structure that the base board checking device of the substrate inspecting method that has used one embodiment of the present invention is shown.
Fig. 2 is the summary construction diagram of an example that the inner structure of the housing in the base board checking device shown in Figure 1 is shown.
Fig. 3 is the planimetric map that the schematic configuration that the enclosure interior of base board checking device shown in Figure 2 is overlooked is shown.
Fig. 4 is the stereographic map of an example that the details of the work support of packing into shown in Figure 2 is shown.
Fig. 5 is the figure that the example in the table of inspection substrate is shown.
Fig. 6 is the stereoscopic figure of an example that the structure of cooling end shown in Figure 2 is shown.
Fig. 7 illustrates the mounting portion of cooling end shown in Figure 6 and surrounds the side wall portion of mounting portion and the partial enlarged drawing of dividing plate.
Fig. 8 is the stereoscopic figure of an example that the structure of preheating part shown in Figure 2 and heating part is shown.
Fig. 9 illustrates preheating part shown in Figure 8 and the mounting portion in the heating part and surrounds the side wall portion of mounting portion and the partial enlarged drawing of dividing plate.
Figure 10 is the key diagram of an example that the structure of lid shown in Figure 2 is shown.
Figure 11 is the key diagram of an example that the structure of lid shown in Figure 2 is shown.
Figure 12 is the key diagram of an example that the structure of fixedly lid shown in Figure 2 is shown.
Figure 13 is the outside drawing that the details of movin gdetector shown in Figure 2 is shown.
Figure 14 is the block scheme of an example that the electrical structure of base board checking device shown in Figure 2 is shown.
Figure 15 is the key diagram that is used to illustrate the action of base board checking device shown in Figure 14.
Figure 16 is the key diagram that is used to illustrate the action of base board checking device shown in Figure 14.
Figure 17 illustrates to measure by experiment near four jiaos on the inspection substrate of opening under the situation about by cooling end inspection substrate being cooled off under the state of lid and near result's the curve map of the temperature variation the central authorities.
Figure 18 illustrates to measure by experiment near four jiaos on the inspection substrate of closing under the situation about by cooling end inspection substrate being cooled off under the state of lid and near result's the curve map of the temperature variation the central authorities.
Figure 19 is the key diagram that is used to illustrate Figure 15, position adjustments, temperature survey and inspecting substrate action shown in Figure 16.
Figure 20 is the key diagram that is used to illustrate Figure 15, position adjustments, temperature survey and inspecting substrate action shown in Figure 16.
Figure 21 is the key diagram that is used to illustrate Figure 15, position adjustments, temperature survey and inspecting substrate action shown in Figure 16.
Figure 22 illustrates to measure by experiment near four jiaos on the inspection substrate of opening under the situation about by the heating part inspection substrate being heated under the state of lid and near result's the curve map of the temperature variation the central authorities.
Figure 23 illustrates to measure by experiment near four jiaos on the inspection substrate of closing under the situation about by the heating part inspection substrate being heated under the state of lid and near result's the curve map of the temperature variation the central authorities.
Figure 24 is near four jiaos that illustrate on the inspection substrate of measuring under the situation about inspection substrate being heated by preheating part and heating part and near the curve map of the experimental result of the temperature variation the central authorities.
Embodiment
Below, based on the description of drawings embodiments of the present invention.In addition, in each figure, the structure that is marked with same numeral illustrates same structure, omits its explanation.
Fig. 1 is the stereoscopic figure of an example of structure that the base board checking device of the substrate inspecting method that has used one embodiment of the present invention is shown.Base board checking device 1 shown in Figure 1 is contained in the housing 2 of case shape roughly.And, in the outside of base board checking device 1, for example use silica gel to come air is carried out drying and comes silica gel is carried out dry blast dryer 3, the air cooling machine 4 that cools off by blast dryer 3 air dry and that rise because of the silica gel temperature after the heating is connected with base board checking device 1 by conduit by heating.In addition, blast dryer 6 is connected with base board checking device 1 by conduit.
Blast dryer 3 and air cooling machine 4 make the air circulation of housing 2 inside, and it is carried out drying, so that for example become the dew point (though limiting 0 ℃～-10 ℃ of dewpoint temperatures especially) smaller or equal to zero degree.In addition, blast dryer 6 is by making air see through polymeric membrane for example air to be carried out dry blast dryer, the dried air of the dewpoint temperature (though limiting dewpoint temperature-10 ℃～-70 ℃ especially) of the chilling temperature that for example is lower than inspection substrate is provided to base board checking device 1.
In housing 2, be provided with: the escape hole 14 of the receiving port 13 of operation display part 11,12, the object substrate of being checked, the substrate after discharge to check finishing, the monitor 15 that constitutes by for example CRT (Cathode Ray Tube, cathode-ray tube (CRT)), the window 16,17 that can carry out Visual Confirmation housing 2 inside.Operation display part 11,12 for example is made of touch-screen type LCD etc., accepts from the operation indication of the execution indication of user's inspection etc. or shows the check result of inspection substrate.
Fig. 2 is the summary construction diagram of an example that the inner structure of the housing 2 in the base board checking device 1 is shown.Fig. 3 is the planimetric map that the schematic configuration that housing 2 inside of base board checking device 1 are overlooked is shown.In Fig. 2, Fig. 3, the direction relations between clear and definite and each figure shows the XYZ orthogonal axis.Here, Y-axis is the depth direction of device, and X-axis is the direction of transporting inspection substrate on each inspecting stand, and the Z axle is perpendicular to the direction of the face of inspection substrate.
Base board checking device 1 shown in Figure 2 has: the work support 21 (receiving portion) of packing into, cooling maintaining part 22 (cooling end), preheating maintaining part 23 (preheating part), heating maintaining part 24 (heating part), hold work support 25 (accommodation section), lid 26,27,30, fixedly lid 28,29, a plurality of nozzles 31 (air blows portion), transport portion 32, video camera 33,34, non-contact thermometer 35,36, movin gdetector 37,38, suction pump 39 (attraction portion), dry air blow-off outlet 51 (the second dry air supply unit), and dry air escape hole 52.
Dry air blow-off outlet 51 is connected with air cooling machine 4 via conduit, and the dry air of the dew point (though not limiting 0 ℃～-10 ℃ of dewpoint temperatures especially) that for example has smaller or equal to zero degree is provided in housing 2 by blast dryer 3 and air cooling machine 4.Dry air escape hole 52 is connected with blast dryer 3 via conduit, the air in the housing 2 are discharged in the blast dryer 3 and make the air circulation of housing 2 inside.
In addition, base board checking device 1 has: guide rail 41 that extends on Y direction and guide rail 42; The guide rail 43 that on X-direction, extends; Two guide rails 44,44 that on X-direction, extend; And across between the guide rail 44,44 and the guide rail 45,46 that on Y direction, extends.And, by omitting illustrated driving mechanism, cooling maintaining part 22 is constituted along guide rail 41 be free to slide, heating maintaining part 24 is constituted along guide rail 42 be free to slide, the portion of transporting 32 is constituted along guide rail 43 be free to slide, guide rail 45,46 is constituted respectively along guide rail 44,44 be free to slide.
In addition, elevating mechanism 47,48 has been installed respectively on guide rail 45,46, on relative direction, elevating mechanism 47,48 constitutes by omitting illustrated driving mechanism and is free to slide along guide rail 45,46.And, movin gdetector 37,38 has been installed, by elevating mechanism 47,48 free lifting on Z-direction on the relative position of elevating mechanism 47,48 respectively.Thus, movin gdetector 37,38 can move on X, Y, Z-direction respectively.
Fig. 4 is the stereographic map of an example that the details of the work support 21 of packing into is shown.The work support 21 of packing into shown in Figure 4 the has illustrated mounting state of square inspection substrate 8.And, packing into above the work support 21 with 5 is that row are formed with recess 211 side by side, this recess 211 is formed four angles supporting inspection substrate 8, and the user embeds inspection substrate 8 in the recess 211, thereby inspection substrate 8 is positioned on the precalculated position.
End at the work support 21 of packing into is equipped with handle 212, user's pull handle 212, from housing 2, pull out the work support 21 of packing into, thereby can be on the work support 21 of packing into inspection substrate 8 mountings, by in the recess 211 that inspection substrate 8 is embedded into the work support 21 of packing into by the user, the work support 21 of will packing into advances in the housings 2, accepts inspection substrate 8 by base board checking device 1.
Fig. 5 is the figure that the example in the table of inspection substrate 8 is shown.Inspection substrate 8 shown in Figure 5 is that for example BGA IC such as (Ball Grid Array, ball grid array) encapsulates employed base plate for packaging, is in the state that chip 82 has been installed.Fig. 5 (a) shows and is provided with the outward appearance of a side that is connected to the wiring graph of weld pad 81 grades on the circuit substrate by soldered ball, Fig. 5 (b) is the figure that the inspection substrate 8 of chip 82 has been installed in side-looking, and Fig. 5 (c) is installation in the inspection substrate 8 the has been shown planimetric map of outward appearance of a side of chip 82.
In inspection substrate shown in Figure 58, weld pad 81 is connected with chip 82 respectively via the distribution of wiring graph that forms at the internal layer of inspection substrate 8 or the wiring graph 83 that forms on interior bone and substrate surface etc., is connected with other weld pad 81 via chip 82.In addition, inspection substrate 8 is not limited to the base plate for packaging of BGA, has the situation that chip 82 is not installed, and also has between the wiring graph of the checkpoint that becomes weld pad 81 grades directly conducting and not via the situation of chip 82.
Fig. 6 is the stereoscopic figure that an example of the structure of cooling off maintaining part 22 is shown.Cooling maintaining part 22 shown in Figure 6 has: the roughly tabular cooler pan 221 that uses the high material of pyroconductivity such as aluminium for example to constitute; Arow is provided with 5 the 222a of mounting portion, 222b, 222c, 222d, 222e on cooler pan 221; With surround the mounting 222a of portion, 222b, 222c, 222d, 222e around the side wall portion 223 of the wall shape that is provided with of mode; A plurality of dividing plates 224 that the space that side wall portion 223 is surrounded at the 222a of each mounting portion, 222b, 222c, 222d, 222e separates; And the refrigeratory 220 that cooler pan 221 is cooled off.Refrigeratory 220 has and is provided in for example illustrated Peltier of omission (peltier) element of the bottom of cooler pan 221, and the cooling fan 225 that the radiating part in this peltier-element is carried out air cooling.
Fig. 7 illustrates the 222a of mounting portion and surrounds the side wall portion 223 of the mounting 222a of portion and the partial enlarged drawing of dividing plate 224.In the 222a of mounting portion shown in Figure 7, be provided with the hole 226 (the first dry air supply unit) of the dried air that the chilling temperature 6 that provide from blast dryer, that dewpoint temperature is lower than inspection substrate is provided near four limits in the 222a of mounting portion that surrounds by side wall portion 223 and dividing plate 224.In addition, the substantial middle of the cooler pan 221 in the 222a of mounting portion forms and chip 82 recess 227 of same shape roughly, is provided with via omitting the hole 228 that illustrated pipe is connected with suction pump 39 in the substantial middle of recess 227.
In addition, above the cooler pan 221 in the 222a of mounting portion, under the state of avoiding recess 227 and hole 226, be close to chip part 229 is installed.And then, be close in the bottom of recess 227 chip part 272 that constitutes 4 small pieces is installed, with around recess 227, and be formed centrally criss-cross groove in hole 228 being, promptly 228 form groove 271 radially from the hole.That is, 4 chip parts, the 272 spaced-apart bottoms that are installed in recess 227 for checkerboard that are spaced by general square shape make this form groove 271 at interval.And, form the recess of the shape that cooperates with chip 82 by chip part 229 and chip part 272.
Chip part the 229, the 272nd, the sheet of roughly tabular rubber-like heat conductivity for example uses silicon rubber to constitute.As chip part 229,272, for example can use the heat exchange sheet of the TC50TXE of chemical company of SHIN-ETSU HANTOTAI system or the 5509S of 3M corporate system etc.In addition, in this case, the criss-cross middle body in groove 271 is provided with through hole described later.
In addition, groove 271 if from the hole 228 with radial extension, be not limited to criss-cross groove.In addition, also can constitute and in cooler pan 221, not form recess 227 and smooth, on cooler pan 221 smooth, be close to installation sheet parts 229, in the thickness of chip part 229, form recess 227.In addition, also recess 227 can be set, on smooth cooler pan 221, be close to installation sheet parts 229, be provided with connect smooth chip part 229 and arrive the through hole in hole 228, from the groove of this through hole with radial extension.In addition, also can constitute and do not have suction pump 39, the low-pressure air that will provide from the outside of base board checking device 1 by pipe (attraction portion) offers hole 228.
The structure of the 222b of mounting portion, 222c, 222d, 222e is identical with the structure of the 222a of mounting portion, therefore omits its explanation.
Fig. 8 is the stereoscopic figure of an example that the structure of preheating maintaining part 23 and heating maintaining part 24 is shown.Preheating maintaining part 23 shown in Figure 8 has: the roughly tabular preheating dish 231 that uses the high material of pyroconductivity such as aluminium for example to constitute; Arow is provided with 5 the 232a of mounting portion, 232b, 232c, 232d, 232e on preheating dish 231; With surround the mounting 232a of portion, 232b, 232c, 232d, 232e around the side wall portion 233 of the wall shape that is provided with of mode; The a plurality of dividing plates 234 that separate the space that surrounds by side wall portion 233 at the 232a of each mounting portion, 232b, 232c, 232d, 232e; And be provided in the bottom of preheating dish 231, preheating that preheating dish 231 is heated is with well heater 235.
In addition, heating maintaining part 24 be the structure roughly the same with preheating maintaining part shown in Figure 8 23, has: the roughly tabular heating plate 241 that uses the high material formation of pyroconductivity such as aluminium for example; Arow is provided with 5 the 242a of mounting portion, 242b, 242c, 242d, 232e on heating plate 241; With surround the mounting 242a of portion, 242b, 242c, 242d, 242e around the side wall portion 243 of the wall shape that is provided with of mode; The a plurality of dividing plates 244 that separate the space that surrounds by side wall portion 243 at the 242a of each mounting portion, 242b, 242c, 242d, 242e; And the heater 245 that is provided in the bottom of heating plate 241, heating plate 241 is heated.
Fig. 9 illustrates the 242a of mounting portion in the heating maintaining part 24 and surrounds the side wall portion 243 of the mounting 242a of portion and the partial enlarged drawing of dividing plate 244.The substantial middle of the heating plate 241 in the 242a of mounting portion shown in Figure 9 forms and chip 82 recess 247 of same shape roughly, is provided with via omitting the hole 248 that illustrated pipe is connected with suction pump 39 in the substantial middle of recess 247.
In addition, be close to the state of avoiding recess 247 above the heating plate 241 in the 242a of mounting portion chip part 249 is installed.And then, be close in the bottom of recess 247 chip part 251 that constitutes 4 small pieces is installed, with around recess 247, and be formed centrally criss-cross groove in hole 248 being, i.e. 248 radial formation grooves 250 from the hole.That is, 4 chip parts, the 251 spaced-apart bottoms that are installed in recess 247 for checkerboard that are spaced by general square shape make this form groove 250 at interval.Thus, form the recess of the shape that cooperates with chip 82 by chip part 249 and chip part 251.
Chip part the 249, the 251st, the sheet of the roughly tabular rubber-like heat conductivity identical with chip part 229,272 for example uses silicon rubber to constitute.In addition, in this case, the criss-cross middle body in groove 250 is provided with through hole described later.
In addition, groove 250 if from the hole 248 with radial extension, be not limited to criss-cross groove.In addition, also can constitute and in heating plate 241, not form recess 247 and smooth, on heating plate 241 smooth, be close to installation sheet parts 249, in the thickness of chip part 249, form recess 247.In addition, also recess 247 can be set, on smooth heating plate 241, be close to installation sheet parts 249, be provided with and connect smooth chip part 249 and arrive the through hole in hole 248 and from the groove of this through hole with radial extension.
The structure of the 242b of mounting portion in the heating maintaining part 24,242c, 242d, 242e is identical with the structure of the 242a of mounting portion, so omit its explanation.In addition, the 232a of mounting portion in the preheating maintaining part 23,232b, 232c, 232d, 232e are identical with the 242a of mounting portion, 242b, 242c, 242d, 242e in the heating maintaining part 24, have recess 247, hole 248, chip part 249,251 and groove 250.
Figure 10 is the exploded perspective view of an example that the structure of lid 26,27 is shown.Lid 26 is identical structure with lid 27, by be clipped in spacer 262 between the sheet 261, alternately stacked 4 roughly tabular sheets 261 and spacer 262 constitute, this spacer 262 is provided with peristome on tabular parts, with corresponding with cooling maintaining part 22 and heating 222a～222e of mounting portion and the position of the 242a～242e of mounting portion in the maintaining part 24.
Thus, lid 26,27 is the heat insulation structural that 4 sheets 261 clip 3 layer of air layers, thereby reduce the heat intrusion of cooling maintaining part 22 and the heat of heating maintaining part 24 is emitted.
In addition, distolaterally be provided with upwardly extending slotted hole 263 at one of lid 26,27 in the side vertical with the length direction of lid 26,27.Slotted hole 263 is to be used to carry out the position adjustments of the inspection substrate 8 realized by video camera 33,34 and the thermometric hole of realizing by non-contact thermometer 35,36, by being made as when position adjustments or the temperature survey, taking or the infrared ray from inspection substrate 8 radiation is detected required minimal size, reduce the temperature variation of the inspection substrate 8 of institute's mounting in cooling maintaining part 22 when carrying out position adjustments or temperature survey and the heating maintaining part 24 via the image of 263 pairs of inspection substrates 8 of slotted hole.
Figure 11 is the key diagram of an example that the structure of lid 30 is shown.Lid 30 shown in Figure 11 by be clipped in spacer 302 between the sheet 301, alternately stacked 4 roughly tabular sheets 301 and spacer 302 constitute, this spacer 302 is provided with peristome on tabular parts, with corresponding with the position of the 232a～232e of mounting portion in the preheating maintaining part 23.Thus, lid 30 is identical with lid 26,27, reduces the heat of preheating maintaining part 23 and emits.
Figure 12 illustrates the fixedly key diagram of an example of the structure of lid 28,29.Fixedly lid 28 and fixedly lid 29 be roughly the same structure, identical with lid 26,27, by be clipped in spacer 282 between the sheet 281, alternately stacked 4 roughly tabular sheets 281 and spacer 282 constitute, this spacer 282 is provided with peristome on tabular parts, with corresponding with cooling maintaining part 22 and heating 222a～222e of mounting portion and the position of the 242a～242e of mounting portion in the maintaining part 24.
Thus, fixedly lid 28,29 is the heat insulation structural that 4 sheets 281 clip 3 layer of air layers, thereby reduce the heat intrusion of cooling maintaining part 22 and the heat of heating maintaining part 24 is emitted.
In addition, at a fixing distolateral peristome 283 that is provided with the size identical or littler of lid 28,29 with a mounting portion among 222a～222e of mounting portion and the 242a～242e of mounting portion.Peristome 283 is to be used to use movin gdetector 37,38 to carry out the peristome of mounting in the checking of the wiring graph that cools off the inspection substrate 8 on maintaining part 22 and the heating maintaining part 24, the required minimal size of inspection of be set as the size of a mounting portion, promptly being undertaken by 37,38 pairs of inspection substrates 8 of movin gdetector is so can reduce the temperature variation of the inspection substrate 8 beyond the inspection substrate of being checked by movin gdetector 37,38 8.
Return Fig. 2, hold work support 25 and constitute a roughly rectangular shape, but 5 inspection substrates 8 of mounting in the above.And, at the sidepiece that holds work support 25,, be equipped with 10 nozzles 31 of the dried air that the normal temperature that provides from blast dryer 3 is provided towards 5 inspection substrates 8 of the top institute mounting of holding work support 25.Be heated to for example inspection substrate 8 of the high temperature about 100 ℃ by heating maintaining part 24 having held on the work support 25 mounting, so by by nozzle 31 to holding the air that inspection substrate 8 on the work support 25 blows normal temperature, can shorten the time that inspection substrate 8 is cooled to the temperature about 40 ℃ that the people can not be burnt when holding inspection substrate 8.
In the end that holds work support 25 handle 252 is installed, can be by by user's pull handle 252, from housing 2, pull out and hold work support 25 and take out mounting in the inspection substrate that has checked 8 that holds on the work support 25.
Be provided with the vacuum head 321 of 5 absorption inspection substrates 8 in the bottom of transporting portion 32,, can make 5 vacuum head 321 liftings on Z-direction by omitting illustrated elevating mechanism.In addition, 5 vacuum heads 321 are connected with suction pump 39 via not shown pipe, keep inspection substrate 8 with absorption.
And, transport portion 32 and accept and be embedded in inspection substrate 8 in the recess 211 by the work support 21 of packing into by vacuum head 321 absorption, the 222a～222e of mounting portion in cooling maintaining part 22 transports, inspection substrate 8 by institute's mounting in the vacuum head 321 absorption cooling maintaining parts 22, the 232a～232e of mounting portion in preheating maintaining part 23 transports, inspection substrate 8 by institute's mounting in the vacuum head 321 absorption preheating maintaining parts 23, the 242a～242e of mounting portion in heating maintaining part 24 transports, inspection substrate 8 by institute's mounting in the vacuum head 321 absorption heating maintaining parts 24 transports to holding work support 25.
Non-contact thermometer the 35, the 36th, the non-contacting thermometer of the object surfaces temperature being measured by for example infrared ray is measured the temperature of the inspection substrate 8 in the 242a～242e of mounting portion of the 222a～222e of mounting portion of cooling maintaining part 22 and heating maintaining part 24 of mounting respectively.
Figure 13 is the outside drawing that the details of movin gdetector 37,38 is shown.Movin gdetector 37 is identical structure with movin gdetector 38, comprise two probes 371 that rubber-like is made of the conductive material of wire, and at two probes 371 of internal run-through of cylindrical body and be approximately perpendicular to the support component 372 that the ground, checkpoint of inspection substrate 8 supports.And, the terminal part 373 of the part that the conduct in two probes 371 contacts with the checkpoint, on the surface of two probes 371, be formed with the insulation coating.In addition, the opposition side of the terminal part 373 in two probes 371 is connected respectively on the inspection control part 50 described later via two signal wires 374.
Thus, under the situation of checking the conducting between two checkpoints, two probes 371 and a checkpoint crimping with movin gdetector 37, two probes 371 and another checkpoint crimping with movin gdetector 38, make electric current in movin gdetector 37 probe 371 and a probe 271 in the movin gdetector 38 between flow through, measure the voltage that produces between another probe 371 in the movin gdetector 37 and another probe 371 in the movin gdetector 38, thereby carry out high-precision resistance measurement based on four terminal mensurations.
Figure 14 is the block scheme of an example that the electrical structure of base board checking device 1 is shown.Base board checking device 1 shown in Figure 14 has: operation display part 11,12, monitor 15, video camera 33,34, non-contact thermometer 35,36, suction pump 39, movin gdetector 37,38, transport drive division 40, detector drive division 49, check control part 50, control part 60, temperature regulator 61,62,63, refrigeratory 220, preheating be with well heater 235 and heater 245.
Temperature regulator 61,62,63 carries out temperature controlled control circuit by the design temperature that sets according to control part 60 and constitutes, and has used the temperature controlled so-called electronic type temperature regulator that carries out based on the control of PID for example etc.The work of 61 pairs of refrigeratorys 220 of temperature regulator is controlled, and makes the temperature of cooler pan 221 become the design temperature of being set by control part 60.62 pairs of preheatings of temperature regulator are controlled with the work of well heater device 235, make the temperature of preheating dish 231 become the design temperature of being set by control part 60.The work of 63 pairs of heaters 245 of temperature regulator is controlled, and makes the temperature of heating plate 241 become the design temperature of being set by control part 60.
Transport drive division 40 (cover body opening/closing portion) for example by motor, gear, the driving mechanism of belt etc. constitutes, according to control signal from control part 60, on Y direction, carry cooling maintaining part 22 along guide rail 41, or along guide rail 42 on Y direction, carry the heating maintaining part 24, or lid 26 is slided on X-direction and to the cooling maintaining part 22 upper opening portion open and close, or lid 30 is slided on Y direction and the upper opening portion of preheating maintaining part 23 is opened and closed, or lid 27 is slided on X-direction and to the heating maintaining part 24 upper opening portion open and close, or move on X-direction along guide rail 43 and to transport portion 32, or make vacuum head 321 lifting on Z-direction.
Detector drive division 49 makes movin gdetector 37 move on X, Y direction along guide rail 44,45, or carries out lifting by elevating mechanism 47 on Z-direction according to the control signal of coming self-check control part 50.In addition, detector drive division 49 makes movin gdetector 38 move on X, Y direction along guide rail 44,46, or carries out lifting by elevating mechanism 48 on Z-direction according to the control signal of coming self-check control part 50.
Check that control part 50 is the control circuits that carry out the inspection of inspection substrate 8, for example, has CPU (the Central Processing Unit that carries out predetermined calculation process, CPU (central processing unit)), write down ROM (the Read Only Memory of expectant control program, ROM (read-only memory)), RAM of placeholder record data (Random Access Memory, random access memory) and peripheral circuit thereof etc.
Specifically, check that control part 50 is according to the control signal from control part 60, to detector drive division 49 output control signals, thereby movin gdetector 37,38 is moved to the place, checkpoint of weld pad 81 in the inspection substrate 8 etc. respectively, and carry out crimping, via the signal wire 374 that is connected with movin gdetector 37,38, measure resistance value between checkpoint, two places by four terminal mensurations.At this moment, check the position adjusting information of control part 50 bases, proofread and correct the crimping position of movin gdetector 37,38 from the position of the checkpoint that control part 60 obtains.
And, check that control part 50 carries out following action: if in inspection substrate 8 between predefined all checkpoints, resistance value is smaller or equal to pre-set threshold, then being judged as this inspection substrate 8 is non-defective units, and to the signal of these judged results of control part 60 output expression, if and for predefined arbitrarily between the checkpoint in inspection substrate 8, resistance value has surpassed pre-set threshold, then be judged as this inspection substrate 8 and between corresponding checkpoint, have the conducting defective, and represent the signal of these judged results to control part 60 outputs.
In addition, check that control part 50 also can not carry out the resistance measurement value between control part 60 each checkpoint of output under the good situation about not judging of inspection substrate 8.In addition, the variation of the resistance value that produces between each checkpoint owing to temperature stress is small, thus used the four terminal mensurations that can carry out high-precision resistance measurement, as long as but check the resistance measurement that control part 50 carries out between the checkpoint basically.Thereby, check that control part 50 is not limited to carry out the resistance measurement based on four terminal mensurations, movin gdetector 37,38 also can have a probe 371 respectively.
In addition, also can replace movin gdetector 37,38, to push simultaneously with the contact and make it contact a plurality of checkpoints with a plurality of inspections that the spininess shape keeps, by in these a plurality of inspections with input and output inspection signal optionally between contact, carry out the resistance measurement between each checkpoint.Perhaps, also can replace movin gdetector 37,38 and use electrostatic capacitance or laser etc. to carry out the inspection of wiring graph in the noncontact mode.
Specifically, control part 60 receives by operation display part 11, the signal of the 12 expression users' that accept operation indication, according to this operation indication, to temperature regulator 61,62,63 output control signals, design temperature regulator 61,62,63 design temperature, thereby begin by temperature regulator 61,62, the 63 temperature controls of carrying out, cooling at inspection substrate 8, before the heating, the cooler pan 221 that will cool off in advance in the maintaining part 22 is cooled to predetermined design temperature, for example be 0 ℃, preheating dish 231 and heating plate 241 in preheating maintaining part 23 and the heating maintaining part 24 are heated to predetermined design temperature, for example are 100 ℃.
In addition, control part 60 makes it begin to attract action to suction pump 39 output control signals, and inspection substrate 8 is adsorbed onto on the 222a～222e of mounting portion, the 232a～232e of mounting portion, the 242a～242e of mounting portion and the vacuum head 321.
And, control part 60 is to transporting drive division 40 output control signals, inspection substrate 8 is transported to cooling maintaining part 22, preheating maintaining part 23 and heating maintaining part 24 successively, and to checking control part 50 output control signals, thereby inspection substrate 8 is being carried out the state that cools off and carrying out carrying out inspecting substrate under the heated state.In addition, control part 60 is when carrying out the inspection of inspection substrate 8 by inspection control part 50, obtain the temperature of the inspection substrate of measuring by non-contact thermometer 35,36 8 and be confirmed to be predefined temperature range, image according to the inspection substrate 8 that photographs by video camera 33 and video camera 34, obtain the position adjusting information of inspection position and send to and check after the control part 50, carry out by checking the inspection of the inspection substrate 8 that control part 50 carries out.
Then, illustrate as the action of the base board checking device 1 that constitutes above-mentionedly.At first, when connecting the power supply of blast dryer 3 and air cooling machine 4, in housing 2, provide dry air from dry air blow-off outlet 51 by blast dryer 3 and air cooling machine 4, simultaneously the air in the housing 2 returns air cooling machine 4 and circulates from dry air escape hole 52, is full of dry air in housing 2.Thus, suppressed at the surface of the inspection substrate 8 that cools off by cooling maintaining part 22, the surface of cooling off maintaining part 22 and periphery thereof etc., produced dewfall in the part that is becoming low temperature.
Then, when connecting the power supply of blast dryer 6, by blast dryer 6 for example on the cooler pan 221 of dried air from cooling maintaining part 22 of dewpoint temperature-60 ℃ set hole 226 offer the 222a～222e of mounting portion.Thus, suppressed in reaching the 222a～222e of mounting portion of minimum temperature, to produce dewfall.
Figure 15, Figure 16 are the key diagrams that is used to illustrate the work of base board checking device 1.Below, the work of base board checking device 1 is described with reference to Fig. 2, Figure 14, Figure 15, Figure 16.At first, by operation display part 11, when having accepted to begin to carry out the operation indication of inspection from user representing, according to control signal from control part 60, begin the attraction undertaken by suction pump 39, the 222a～222e of mounting portion, the 232a～232e of mounting portion, the 242a～242e of mounting portion and vacuum head 321 are in the state that can attract inspection substrate 8.
Then, represent the design temperature of temperature regulator 61 is set at for example 0 ℃ control signal by control part 60 outputs, action by temperature regulator 61 control refrigeratorys 220 for example is made as 0 ℃ (step S1) with the temperature of cooling off the cooler pan 221 in the maintaining part 22.
Equally, represent the design temperature of temperature regulator 62,63 is set at for example 100 ℃ control signal by control part 60 outputs, by the action of temperature regulator 62 control preheatings with well heater 235, the temperature of the preheating dish 231 in the preheating maintaining part 23 is made as 100 ℃ (step S2), by the action of temperature regulator 63 control heaters 245, the temperature that heats the heating plate 241 in the maintaining part 24 for example is made as 100 ℃ (step S3) simultaneously.
Thus, before the heating of the preheating of the cooling by the inspection substrate 8 that carries out of cooling maintaining part 22, the inspection substrate 8 that undertaken by preheating maintaining part 23 and the inspection substrate 8 that undertaken by heating maintaining part 24, in advance cooler pan 221 is cooled to predetermined design temperature, preheating dish 231 and heating plate 241 are heated to predetermined design temperature, make the temperature of cooler pan 221, preheating dish 231 and heating plate 241 keep design temperature respectively simultaneously.
Then, come pull handle 212 by the user, from housing 2, pull out the work support 21 of packing into, the user with embedded mode with 5 inspection substrate 8 mountings in 5 place's recesses 211 of the work support 21 of packing into, and the work support 21 of packing into pushed in, thereby being encased in the base board checking device 1, inspection substrate 8 is accepted (step S4).
Then, according to control signal, by transporting portion 32,5 inspection substrates 8 of mounting on the work support 21 of packing into are transported to respectively among the 222a of mounting portion in the cooling maintaining part 22,222b, 222c, 222d, the 222e (step S5) from control part 60.So inspection substrate 8 is in the 222a of mounting portion shown in Figure 7, chip 82 is embedded in the recess 227, and the surface of chip 82 is close on the chip part 272, and the substrate portion around the chip 82 in the inspection substrate 8 is close on the chip part 229.In this case, chip part 229,272 has elasticity, so improved the degree of being close to inspection substrate 8.
And owing to 228 siphon away air by suction pump 39 from the hole, by being pressed on the chip part 229,272, degree of being close to further improves so inspection substrate 8 is adsorbed.In this case, there are the following problems: for example exist under warpage etc., the inspection substrate 8 uneven situations at inspection substrate 8, only pass through inspection substrate 8 mountings on the 222a of mounting portion, the surface of inspection substrate 8 and chip part 229,272 are close to, cause the part perk.
But, in the 222a of mounting portion, 228 siphon away air from the hole, inspection substrate 8 is adsorbed and by being pressed on the chip part 229,272, so even inspection substrate 8 exists under the situation of warpage, also can improve the degree of being close between inspection substrate 8 and the chip part 229,272.In addition, owing on chip part 272, be formed with 228 grooves 271 that form radially,, improve the absorption affinity of the inspection substrate 8 among the mounting 222a of portion so the adsorption area of inspection substrate 8 is enlarged from the hole.
And then, at inspection substrate 8 to chip 82 opposition sides highlightedly under the situation of warpage, in the 222a of mounting portion absorption chip 82, be near the middle body of inspection substrate 8, thereby the warpage of substrate is corrected.According to experiment, to chip 82 opposition side maximums highlightedly under the situation of warpage 65.2 μ m, when measuring the warpage of substrate of inspection substrate 8 after near by the middle body of the 222a of mounting portion absorption inspection substrate 8 once more, the maximal value of warpage is 55.0 μ m, and the warpage of substrate has been improved 10.2 μ m.
In addition, be that example is illustrated with the 222a of mounting portion, but in the 222b～222e of mounting portion too, inspection substrate 8 is adsorbed and is close to chip part 229,272.
And, according to control signal from control part 60, by transporting drive division 40, lid 26 slided moves to the top of cooling maintaining part 22, closes the peristome that the upper end by side wall portion 223 among the 222a～222e of mounting portion and dividing plate 224 constitutes by lid 26.In this case, upper end open portion that is made of side wall portion 223 and dividing plate 224 and lid 26 separate the short space of degree slidably and close.
Thus, inspection substrate 8 adsorbed in the 222a～222e of mounting portion is surrounded by side wall portion 223, dividing plate 224 and lid 26, basically with atmospheric isolation.In addition, lid 26 is that 4 sheets 261 clip the heat insulation structural of 3 layer of air layers, so reduced from the heat of the outside turbulent flow to the air-flow of the intrusion in the space that surrounded by side wall portion 223, dividing plate 224 and lid 26 or inspection substrate 8 peripheries.In this case, constituted cover by side wall portion 223, dividing plate 224 and lid 26.
In addition, being not limited to be made of side wall portion 223, dividing plate 224 and lid 26 example of cover, for example also can be to make the cover of bottom tube-like cover inspection substrate 8 and the structure of encirclement.
And, in the 222a～222e of mounting portion, owing in the space that surrounds by side wall portion 223, dividing plate 224 and lid 26, be full of the air of 226 dry airs of emitting, for example dewpoint temperature-60 ℃, so suppressed in 222a～222e of mounting portion and inspection substrate 8, to produce dewfall from the hole.
In addition, by become in advance predetermined design temperature, for example 0 ℃ cooler pan 221, cool off via 229,272 pairs of inspection substrates 8 of chip part as the sheet of heat conductivity, so with situation about after inspection substrate 8 mountings are in the 222a of mounting portion cooler pan 221 being cooled off is compared, can improve the cooling velocity of inspection substrate 8.
In addition, by suction pump 39 inspection substrate 8 is adsorbed onto on the rubber-like chip part 229,272, improved degree of being close to,, increased the cooling velocity of the inspection substrate of realizing by cooler pan 221 8 so increased the pyroconductivity between inspection substrate 8 and the cooler pan 221.And, because a surface of chip part 229,272 and inspection substrate 8 all is close to,, can make the temperature of each several part of inspection substrate 8 even so on whole inspection substrate 8, cool off equably.In addition, inspection substrate 8 is surrounded by side wall portion 223, dividing plate 224 and lid 26, has reduced from the intrusion of the heat of outside or the turbulent flow of the air-flow around the inspection substrate 8, so can improve the homogeneity of the temperature of the each several part in the inspection substrate 8.
Figure 17, Figure 18 are near four jiaos on the inspection substrate 8 under the situation about cooling off by cooling maintaining part 22 pairs of inspection substrates 8 and near the result's that measures of the temperature variation the central authorities curve map with experiment method.Figure 17 is the curve map that is illustrated in the result who measures under the state of opening lid 26, and Figure 18 is the curve map that is illustrated in the result who measures under the state of closing lid 26.
As shown in figure 17, under the state of having opened lid 26, inspection substrate 8 is adsorbed onto on the 222a of mounting portion, begin to cool down (T0) and play that the temperature of the inspection substrate 8 of (T1) is 4.0 ℃ at the temperature highest point after 22 seconds, at the temperature lowest part is 1.3 ℃, and then the temperature of the inspection substrate 8 of (T2) is 2.5 ℃ at the temperature highest point after beginning to cool down (T0) to play 125 seconds, is 0.6 ℃ at the temperature lowest part.
On the other hand, as shown in figure 18, under the state of having closed lid 26, inspection substrate 8 is adsorbed onto on the 222a of mounting portion, begin to cool down (T0) and play that the temperature of the inspection substrate 8 of (T1) is 2.6 ℃ at the temperature highest point after 22 seconds, at the temperature lowest part is 1.0 ℃, and then the temperature of the inspection substrate 8 of (T2) is 0.6 ℃ at the temperature highest point after beginning to cool down (T0) to play 125 seconds, is-0.1 ℃ at the temperature lowest part.
As mentioned above, according to Figure 17, experimental result shown in Figure 180, at T1 cool time, under the state of having opened lid 26, the highest 4.0 ℃, minimum 1.3 ℃, and with respect to this, under the state of having closed lid 26, the highest 2.6 ℃, minimum 1.0 ℃, at T2 cool time, under the state of having opened lid 26, the highest 2.5 ℃, minimum 0.6 ℃, and with respect to this, under the state of having closed lid 26, the highest 0.6 ℃, minimum-0.1 ℃, can confirm: no matter in time T 1, which among the T2, closed under the situation of lid 26 the temperature step-down of inspection substrate 8 time, thereby, improved the cooling velocity of inspection substrate 8 by closing lid 26.
In addition, equally, according to Figure 17, experimental result shown in Figure 180, at T1 cool time, under the state of having opened lid 26, the difference of maximum temperature and minimum temperature is 2.7 ℃, and with respect to this, under the state of having closed lid 26, the difference of maximum temperature and minimum temperature is 1.6 ℃, at T2 cool time, under the state of having opened lid 26, the difference of maximum temperature and minimum temperature is 1.9 ℃, and with respect to this, under the state of having closed lid 26, the difference of maximum temperature and minimum temperature is 0.7 ℃, can confirm: by closing lid 26, the temperature difference of temperature survey place is dwindled, make the temperature distribution homogenization in the inspection substrate 8.
Like this, carry out the cooling (step S6) of inspection substrate 8 by cooling maintaining part 22.Figure 19, Figure 20, Figure 21 are the key diagrams that is used to illustrate position adjustments, temperature survey and inspecting substrate action under the state of cooling of the inspection substrate 8 that is undertaken by cooling maintaining part 22.In Figure 19, Figure 20, Figure 21, heated condition position adjustments, temperature survey and inspecting substrate down by the inspection substrate 8 that carries out of heating maintaining part 24 described later moves also roughly the same, so also put down in writing the label of the structure relevant with the action under these heated conditions in the lump.
And, in step S6, as shown in figure 19, under the state of having closed lid 26, the inspection substrate on the cooler pan 221 8 is cooled off, the predefined schedule time of process is for example after 30 seconds, according to control signal,, carry cooling maintaining part 22 along guide rail 41 by transporting drive division 40 from control part 60, as shown in figure 20, navigate on the position relative being adsorbed on inspection substrate 8 on the 222a of mounting portion with slotted hole 263.
And, by video camera 33, the image that will be adsorbed in the inspection substrate 8 on the 222a of mounting portion via slotted hole 263 sends to control part 60, from the image of this inspection substrate 8, obtain the position adjusting information of checking the position and send to inspection control part 50 by control part 60, by checking control part 50, according to position adjusting information, proofread and correct (step S7) to being used to check the positional information of inspection substrate 8 from control part 60.In addition, by non-contact thermometer 35, measure the temperature that is adsorbed on the inspection substrate 8 on the 222a of mounting portion via slotted hole 263, the temperature data of this measurement temperature of expression is sent to control part 60, by control part 60, whether the temperature of confirming inspection substrate 8 in predefined temperature range, in for example 0 ℃ ± 3 ℃ (step S8).In this case, because slotted hole 263 is set as by video camera 33 and takes the image of inspection substrate 8 or the required minimal size of infrared ray of radiating from inspection substrate 8 by non-contact thermometer 35 detections, so reduced the situation that air is come in and gone out by slotted hole 263, reduced the temperature variation of inspection substrate 8.
And, if the temperature of inspection substrate 8 does not enter in for example 0 ℃ ± 3 ℃ the scope, then wait by the time the temperature of inspection substrate 8 reaches till this temperature range, if the temperature of inspection substrate 8 is in for example 0 ℃ ± 3 ℃ scope, then,, cooling maintaining part 22 is carried the distance of a mounting portion along guide rail 41 by transporting drive division 40 according to control signal from control part 60, thereby the 222b of mounting portion is located on the position relative with slotted hole 263, the action of repeating step S7, S8.In the case, 222a～the 222e of mounting portion is separated by dividing plate 224 respectively, during so position adjustments is handled and the inspection substrate 8 beyond the inspection substrate in the temperature survey 8 can not be exposed in the air of coming in and going out via slotted hole 263, thereby reduced the temperature variation of inspection substrate 8.
Like this, regulate and handle (step S7) and temperature survey (step S8) afterwards for being adsorbed on 5 inspection substrate 8 repeatable position on the 222a～222e of mounting portion, according to control signal from control part 60, by transporting drive division 40, carry cooling maintaining part 22 along guide rail 41, as shown in figure 21, navigate on the position relative (first checks the position) being adsorbed on inspection substrate 8 on the 222a of mounting portion with peristome 283.
Then, according to control signal, check the inspecting substrate (step S9) of control part 50 from control part 60.Specifically, according to the control signal of coming self-check control part 50, by detector drive division 49, movin gdetector 37,38 is moved, the terminal part 373 of the probe 371 in the movin gdetector 37,38 is crimped on the checkpoint, two places of inspection substrate 8 via peristome 283 respectively, by checking control part 50, measure resistance value between checkpoint, corresponding two place by four terminal mensurations.
Then, by checking control part 50, carry out following steps and carry out inspecting substrate: if in the inspection substrate 8 on being adsorbed in the 222a of mounting portion between predefined all checkpoints, resistance value is smaller or equal to pre-set threshold, then be judged as this inspection substrate 8 and be non-defective unit, the signal of this judged result of expression is exported to control part 60, on the other hand, if for predefined arbitrarily between the checkpoint in inspection substrate 8, resistance value surpasses pre-set threshold, then be judged as this inspection substrate 8 and have the conducting defective, the signal of this judged result of expression is exported to control part 60.
In this case, peristome 283 is set as the size of a mounting portion, 222a～the 222e of mounting portion is separated by dividing plate 224 respectively, so, thereby reduced the temperature variation of inspection substrate 8 by checking that the inspection substrate 8 that control part 50 carries out beyond the inspection substrate 8 that inspecting substrate handles can not be exposed in the air of coming in and going out via peristome 283.
Like this, after being adsorbed on the inspecting substrate end of the inspection substrate 8 on the 222a of mounting portion, according to control signal from control part 60, by transporting drive division 40, cooling maintaining part 22 is carried the distance of a mounting portion along guide rail 41, after this, repeat conveying action, thereby carry out inspecting substrate (step S9) for each inspection substrate 8 that is adsorbed on the 222b～222e of mounting portion by the cooling maintaining part 22 of checking inspecting substrate that control part 50 carries out and the distance by transporting the mounting portion that drive division 40 carries out.
In the case, on cooler pan 221, be provided with 5 222a～222e of mounting portion, can cool off 5 inspection substrates 8 simultaneously,, can shorten cool time so compare with the situation of an inspection substrate 8 of each cooling.In addition, on X-direction, carry 5 inspection substrates 8 by transporting portion 32 along guide rail 43, mounting is to cooler pan 221, after on the Y direction of intersecting with the carriage direction that transports portion 32, transporting cooler pan 221, inspection substrate 8 is carried out movin gdetector 37,38 inspection, so outside the moving range of the portion that transports 32 that on X-direction, carries out shift action along guide rail 43, set movin gdetector 37,38 and the guide rail 44 that drives them, 45,46, elevating mechanism 47,48, driving mechanism in the movin gdetector of detector drive division 49 grades is avoided the interference between the driving mechanism of portion that transports 32 and movin gdetector easily.
And, for being adsorbed on all inspection substrates 8 on the 222a～222e of mounting portion when being through with inspecting substrate, according to control signal from control part 60, by transporting drive division 40, along the Y direction of guide rail 41 in Fig. 2 side conveying nearby cooling maintaining part 22, open lid 26, the vacuum head 321 that transports in the portion 32 is navigated on the transporting position (first transporting position) of each inspection substrate 8 among the adsorbable mounting 222a～222e of portion.
Then, according to control signal from control part 60, by transporting portion 32,5 inspection substrates 8 of the mounting portion 222a～222e last mounting of cooling in the maintaining part 22 are transported on the 232a～232e of mounting portion in the preheating maintaining part 23, by transporting drive division 40, lid 30 is slided move to the top of preheating maintaining part 23, close the peristome (step S10) that the upper end by side wall portion 233 among the 232a～232e of mounting portion and dividing plate 234 constitutes by lid 30.
So inspection substrate 8 is in the 232a of mounting portion shown in Figure 9, chip 82 is embedded in the recess 247, and the surface of chip 82 is close on the chip part 251, and the substrate portion around the chip 82 in the inspection substrate 8 is close on the chip part 249.In the case because chip part 249,251 has elasticity, so improved and inspection substrate 8 between degree of being close to.
And, identical with situation in above-mentioned step S5 by the 222a of mounting portion in the cooling maintaining part 22～222e absorption inspection substrate 8, adsorb inspection substrate 8 by the 232a of mounting portion in the preheating maintaining part 23～232e, inspection substrate 8 and chip part 249,251 are close to.Thus, by becoming predetermined design temperature in advance, 100 ℃ preheating dish 231 for example, heat via 249,251 pairs of inspection substrates 8 of chip part as the sheet of heat conductivity, so with inspection substrate 8 mountings are compared the situation that preheating dish 231 heats after the 232a～232e of mounting portion is last, can improve the firing rate of inspection substrate 8.
In addition, by suction pump 39, inspection substrate 8 is adsorbed onto on the rubber-like chip part 249,251, thereby degree of being close to improves, so increased the pyroconductivity between inspection substrate 8 and the preheating dish 231, improved the firing rate of the inspection substrate of realizing by preheating dish 231 8.And a surperficial integral body of chip part 249,251 and inspection substrate 8 is close to, so can heat equably whole inspection substrate 8, makes the equalizing temperature of the each several part of inspection substrate 8.
In addition, inspection substrate 8 is surrounded by side wall portion 233, dividing plate 234 and lid 30, has reduced the turbulent flow to the air-flow of the heat radiation of outside or inspection substrate 8 peripheries, so can improve the temperature homogeneity of the each several part in the inspection substrate 8.
Like this, carry out the heating (step S11) of inspection substrate 8 by preheating maintaining part 23.On the other hand, in during the processing of execution in step S6～S10, owing on the work support 21 of packing into, do not have mounting inspection substrate 8, so the user can pull out the work support 21 of packing into from housing 2, on the work support 21 of packing into after 5 new inspection substrates 8 of mounting, the work support 21 of will packing into pushes in, thereby is encased in (step S12) in the base board checking device 1.
Thus, can concurrently new inspection substrate 8 be encased in the base board checking device 1 with the processing of step S6～S10, so sensuously new inspection substrate 8 being encased in the activity duration required in the base board checking device 1 can be zero, can shorten the supervision time of inspection substrate 8.
And, identical with step S5, S6, with the heating of inspection substrate 8 among the step S11 concurrently, by transporting portion 32, new 5 inspection substrates 8 of mounting on the work support 21 of packing into are transported among the 222a～222e of mounting portion that cools off in the maintaining part 22 (step S13), by cooling maintaining part 22,5 new inspection substrates 8 are cooled to design temperature, for example 0 ℃ (step S14).
Thus, since carry out concurrently inspection substrate 8 heating, be transported to new inspection substrate 8 in the cooling maintaining part 22 and cool off, so sensuously can shorten transporting and cooling off the required processing time of inspection substrate 8.
And, begin through the predefined schedule time, for example after 30 seconds from the heating (step S11) of the inspection substrate 8 that undertaken by preheating maintaining part 23, according to control signal from control part 60, by transporting drive division 40, make lid 30 slips move and open, the vacuum head 321 that transports in the portion 32 is navigated on the transporting position of each inspection substrate 8 among the adsorbable mounting 232a～232e of portion.
Then, in the cooling of the new inspection substrate 8 in step S14, according to control signal from control part 60, by transporting portion 32,5 inspection substrates 8 of the last mounting of the 232a～232e of mounting portion in the preheating maintaining part 23 are transported on the 242a～242e of mounting portion that heats in the maintaining part 24, by transporting drive division 40, lid 27 is slided move to the top of preheating maintaining part 23, close the peristome (step S15) that the upper end by side wall portion 243 among the 242a～242e of mounting portion and dividing plate 244 constitutes by lid 27.
So inspection substrate 8 is in the 242a of mounting portion shown in Figure 9, chip 82 is embedded in the recess 247, and the surface of chip 82 is close on the chip part 251, and the substrate portion around the chip 82 in the inspection substrate 8 is close on the chip part 249.In the case because chip part 249,251 has elasticity, so improved and inspection substrate 8 between degree of being close to.
Then, identical with situation in above-mentioned step S5 by the 222a of mounting portion in the cooling maintaining part 22～222e absorption inspection substrate 8, adsorb inspection substrate 8 by the 242a of the mounting portion～242e in the heating maintaining part 24, inspection substrate 8 and chip part 249,251 are close to.Thus, by becoming predetermined design temperature in advance, 100 ℃ heating plate 241 for example, heat via 249,251 pairs of inspection substrates 8 of chip part as the sheet of heat conductivity, so with inspection substrate 8 mountings are compared the situation that heating plate 241 heats after the 242a～242e of mounting portion is last, can improve the firing rate of inspection substrate 8.
In addition, by suction pump 39, inspection substrate 8 is adsorbed onto on the rubber-like chip part 249,251, thereby degree of being close to improves, so increased the pyroconductivity between inspection substrate 8 and the heating plate 241, improved the firing rate of the inspection substrate of realizing by heating plate 241 8.And a surperficial integral body in chip part 249,251 and the inspection substrate 8 is close to, so can heat equably whole inspection substrate 8, makes the equalizing temperature of the each several part in the inspection substrate 8.
In addition, inspection substrate 8 is surrounded by side wall portion 243, dividing plate 244 and lid 27, thereby has reduced the turbulent flow to the air-flow of the heat radiation of outside or inspection substrate 8 peripheries, so can improve the temperature homogeneity of the each several part in the inspection substrate 8.
Figure 22, Figure 23 are expressions with experiment method near four jiaos on the inspection substrate 8 under the situation about heating by heating maintaining part 24 pairs of inspection substrates 8 and near the result's that measures of the temperature variation the central authorities curve map.Figure 22 is the curve map that is illustrated in the result who measures under the state of opening lid 27, and Figure 23 is the curve map that is illustrated in the result who measures under the state of closing lid 27
As shown in figure 22, under the state of having opened lid 27, from inspection substrate 8 is adsorbed onto the 242a of mounting portion and goes up, begins heating (T4) after 43 seconds the temperature of the inspection substrate 8 of (T5) be 96.8 ℃ at the temperature highest point, at the temperature lowest part is 95.7 ℃, and then from begin the heating (T4) after 130 seconds the temperature of the inspection substrate 8 of (T6) be 98.2 ℃ at the temperature highest point, be 97.0 ℃ at the temperature lowest part.
On the other hand, as shown in figure 23, under the state of having closed lid 27, from inspection substrate 8 is adsorbed onto the 242a of mounting portion and goes up, begins heating (T4) after 43 seconds the temperature of the inspection substrate 8 of (T5) be 99.9 ℃ at the temperature highest point, at the temperature lowest part is 98.8 ℃, and then from begin the heating (T4) after 130 seconds the temperature of the inspection substrate 8 of (T6) be 100.9 ℃ at the temperature highest point, be 100.2 ℃ at the temperature lowest part.
As mentioned above, according to Figure 22, experimental result shown in Figure 23, in time T 5, under the state of having opened lid 27, the highest 96.8 ℃, minimum 95.7 ℃, and with respect to this, under the state of having closed lid 27, the highest 99.9 ℃, minimum 98.8 ℃, in time T 6, under the state of having opened lid 27, the highest 98.2 ℃, minimum 97.0 ℃, and with respect to this, under the state of having closed lid 27, the highest 100.9 ℃, minimum 100.2 ℃, can confirm: no matter in time T 5, which among the T6 time, to have closed under the situation of lid 27, the temperature of inspection substrate 8 uprises, thereby, improved the firing rate of inspection substrate 8 by closing lid 27.
In addition, equally, according to Figure 22, experimental result shown in Figure 23, in time T 5, under the state of having opened lid 27, the difference of maximum temperature and minimum temperature is 1.1 ℃, and with respect to this, under the state of having closed lid 27, the difference of maximum temperature and minimum temperature is 1.1 ℃, in time T 6, under the state of having opened lid 27, the difference of maximum temperature and minimum temperature is 1.2 ℃, and with respect to this, under the state of having closed lid 27, the difference of maximum temperature and minimum temperature is 0.7 ℃, can confirm: no matter in time T 5, which among the T6 by closing lid 27 time, the temperature difference of temperature survey place is dwindled, make the temperature distribution homogenization in the inspection substrate 8.
Figure 24 is expression near four jiaos on the inspection substrate 8 under the situation about heating by preheating maintaining part 23 and heating maintaining part 24 pairs of inspection substrates 8 and near the curve map of the experimental result measured of the temperature variation the central authorities.At first, in time T 7, by the heating of preheating maintaining part 23 beginning inspection substrates 8, the temperature of the inspection substrate 8 of (T8) is 99.2 ℃ at the temperature highest point after 30 seconds, at the temperature lowest part is 97.3 ℃, with respect to 100 ℃ of temperature differences that produce maximum 2.7 ℃ of design temperature.Then, from preheating maintaining part 23 to heating after maintaining part 24 transported inspection substrate 8, in time T 9, heating by heating maintaining part 24 beginning inspection substrates 8, the temperature of the inspection substrate 8 of (T10) is 101.2 ℃ at the temperature highest point after 30 seconds, at the temperature lowest part is 100.0 ℃, is 1.2 ℃ to the maximum with respect to the temperature difference of 100 ℃ of design temperatures.
Promptly, only use heating maintaining part 24 for example will be controlled at respect to the temperature difference of 100 ℃ of design temperatures 1.5 ℃ with interior situation under, 30 seconds preheating time and 60 seconds heat time heating time altogether, 30 seconds heat time heating time from time T 9 to time T10 that approximately need be from time T 7 to time T8.On the other hand, in base board checking device 1, can use preheating maintaining part 23 and heating maintaining part 24 to carry out the preheating of preheating maintaining part 23 and the heating of heating maintaining part 24 concurrently, so sensorial heat time heating time, be single products production time (tact time) in the heat treated of inspection substrate 8 to be about 30 seconds, the single products production time can be foreshortened to about 1/2.
Like this, carry out the heating (step S16) of inspection substrate 8 by heating maintaining part 24.And, cooling that passing through the new inspection substrate 8 that carries out of cooling maintaining part 22 from step S14 begins to pass through the predefined schedule time, for example after 30 seconds, identical with step S7, S8, according to control signal from control part 60, by transporting drive division 40, carry cooling maintaining part 22 along guide rail 41, carry out position adjustments for 5 inspection substrates 8 of mounting on the cooler pan 221 and handle (step S17) and temperature survey (step S18) afterwards, S9 is identical with step, uses the inspecting substrate (step S19) of movin gdetector 37,38.
Then, in step S19, for being adsorbed on all inspection substrates 8 on the 222a～222e of mounting portion when being through with inspecting substrate, according to control signal from control part 60, by transporting drive division 40, carry cooling maintaining part 22 along the side nearby of guide rail 41 in Fig. 2, open lid 26, the vacuum head 321 that transports in the portion 32 is navigated on the transporting position of each adsorbed among the adsorbable mounting 222a～222e of portion inspection substrate 8.
In addition, though show in the cooling of the new inspection substrate 8 in step S14, the example that transports action of the inspection substrate 8 among the execution in step S15 concurrently, but among the step S15 transport action also can be for example with the processing of step S17～S19 in carry out concurrently.
Then, adding of inspection substrate 8 in step S16, pine for, according to control signal from control part 60, by transporting portion 32,5 inspection substrates 8 of the mounting portion 222a～222e last mounting of cooling in the maintaining part 22 are transported on the 232a～232e of mounting portion in the preheating maintaining part 23, by transporting drive division 40, lid 30 is slided move to the top of preheating maintaining part 23, close the peristome (step S20) that the upper end by side wall portion 233 among the 232a～232e of mounting portion and dividing plate 234 constitutes by lid 30, S11 is identical with step, carries out the preheating (step S21) by the inspection substrate 8 of preheating maintaining part 23 realizations.
On the other hand, in during the processing of execution in step S14～S21, on the work support 21 of packing into, there is not mounting inspection substrate 8, so the user can pull out the work support 21 of packing into from housing 2, and then on the work support 21 of packing into 5 new inspection substrates 8 of mounting, the work support 21 of will packing into pushes in, thereby is encased in (step S22) in the base board checking device 1.
Then, identical with step S5, S6, with the heating of inspection substrate 8 among the step S16 concurrently, by transporting portion 32, another new 5 inspection substrates 8 of mounting on the work support 21 of packing into are transported to the 222a～222e of mounting portion last (step S23) that cools off in the maintaining part 22, by cooling maintaining part 22,5 new inspection substrates 8 are cooled to design temperature, for example 0 ℃ (step S24).
In this case, for the new inspection substrate 8 that is cooling off by cooling maintaining part 22, carry out position adjustments concurrently with the heat treated (step S16) that heats the inspection substrate 8 in the maintaining part 24 and handle (step S17), temperature survey (step S18), inspecting substrate (step S19), transport (the step S20) of inspection substrate 8 from cooling maintaining part 24 to preheating maintaining part 23, the part of the thermal pretreatment of inspection substrate 8 (step S21), the processing (step S22) of packing into of inspection substrate 8, and inspection substrate 8 from the work support 21 of packing into to cooling the transporting of maintaining part 22 (step S23), so sensuously can shorten the position adjustments of inspection substrate 8, temperature survey, inspecting substrate, from cooling maintaining part 24 transporting to preheating maintaining part 23, preheating, substrate is packed into, and from work support 21 the transporting the required processing time of packing into to cooling maintaining part 22.
Then, in step S16, as shown in figure 19, under the state of having closed lid 27, the inspection substrate on the heating plate 241 8 is heated, through the predefined schedule time, for example after 30 seconds, according to control signal,, carry heating maintaining part 24 along guide rail 42 by transporting drive division 40 from control part 60, as shown in figure 20, navigate on the position relative being adsorbed in inspection substrate 8 on the 242a of mounting portion with slotted hole 263.
Then, by video camera 34, the image that will be adsorbed in the inspection substrate 8 on the 242a of mounting portion via slotted hole 263 sends to control part 60, by control part 60, from the image of this inspection substrate 8, obtain the position adjusting information of checking the position and send to and check control part 50, by checking control part 50,, proofread and correct (step S25) to being used to check the positional information of inspection substrate 8 according to position adjusting information from control part 60.In addition, by non-contact thermometer 36, the temperature that is adsorbed onto the inspection substrate 8 on the 242a of mounting portion via 263 pairs of slotted holes is measured, the temperature data of this measurement temperature of expression is sent to control part 60, by control part 60, whether the temperature of confirming inspection substrate 8 is predefined temperature range, for example 100 ℃ ± 3 ℃ (step S26).In this case, because slotted hole 263 is set as position adjustments or the required minimal size of temperature survey,, reduced the temperature variation of inspection substrate 8 so reduced the situation that air is come in and gone out via slotted hole 263.
Then, if the temperature of inspection substrate 8 does not enter in for example 100 ℃ ± 3 ℃ the scope, then wait by the time the temperature of inspection substrate 8 reaches till this temperature range, if the temperature of inspection substrate 8 is in for example 100 ℃ ± 3 ℃ scope, then according to control signal from control part 60, by transporting drive division 40, heating maintaining part 24 is carried the distance of a mounting portion along guide rail 42, the 242b of mounting portion is navigated on the position relative with slotted hole 263 action of repeating step S25, S26.In this case, 242a～the 242e of mounting portion is separated by dividing plate 244 respectively, during so position adjustments is handled and the inspection substrate 8 beyond the inspection substrate in the temperature survey 8 can not be exposed in the air of coming in and going out via slotted hole 263, thereby reduced the temperature variation of inspection substrate 8.
Like this, regulate and handle (step S25) and temperature survey (step S26) afterwards for being adsorbed on 5 inspection substrate 8 repeatable position on the 242a～242e of mounting portion, according to control signal from control part 60, by transporting drive division 40, carry heating maintaining part 24 along guide rail 42, as shown in figure 21, navigate on the position relative being adsorbed in inspection substrate 8 on the 242a of mounting portion with peristome 283.
Then, according to control signal, check the inspecting substrate (step S27) of control part 50 from control part 60.Specifically, at first, according to the control signal of coming self-check control part 50, by detector drive division 49 (inspection delivery section), make movin gdetector 37,38 along guide rail 44 from the position relative, promptly be used for checking that mounting is transported to the position relative with the peristome 283 of fixing lid 29, promptly is used to check the inspection position (second checks the position) of the inspection substrate 8 of mounting on heating maintaining part 24 in the inspection position of the inspection substrate 8 on the cooling maintaining part 22 (first checks the position) with peristome 283 the fixing lid 28.
Thus, movin gdetector 37,38 can be common to the inspecting substrate of the inspection substrate 8 under the state of cooling and the inspecting substrate of the inspection substrate under the heated condition 8, so needn't have two movin gdetectors 37,38, thereby can reduce the quantity of movin gdetector 37,38 and reduce the cost of base board checking device 1.
In addition, though show the example that movin gdetector 37,38 is common to the inspecting substrate of the inspecting substrate of the inspection substrate 8 under the state of cooling and the inspection substrate under the heated condition 8, but the movin gdetector (the first inspection portion) that the inspecting substrate that also can have the inspection substrate 8 under the state of cooling in the position relative with peristome 283 in the fixing lid 28 is used has the movin gdetector (the second inspection portion) that the inspecting substrate of the inspection substrate 8 under the heated condition is used in addition in the position relative with peristome 283 in the fixing lid 29.
In addition, control part 60 also can be after the inspection among the step S19 finishes, in the processing of step S16, S25, S26 by detector drive division 49 with movin gdetector 37,38 from the position (first check position) relative with peristome 283 the fixing lid 28 to fixing lid 29 in the relative position (second checks the position) of peristome 283 carry.Thus, shortened the time of delivery of the movin gdetector 37,38 among the step S27.
And then, the terminal part 373 that makes the probe 371 in the movin gdetector 37,38 is crimped onto respectively on the checkpoint, two places of inspection substrate 8 via the peristome 283 in the fixing lid 29, by checking control part 50, utilize four terminal mensurations that the resistance value between checkpoint, corresponding two place is measured.
Then, by checking control part 50, carry out following steps and carry out inspecting substrate: if in the inspection substrate 8 on being adsorbed on the 242a of mounting portion between predefined all checkpoints, resistance value is smaller or equal to pre-set threshold, then be judged as this inspection substrate 8 and be non-defective unit, the signal of this judged result of expression is exported to control part 60, on the other hand, if for predefined arbitrarily between the checkpoint in inspection substrate 8, resistance value has surpassed pre-set threshold, then be judged as this inspection substrate 8 and have the conducting defective, the signal of this judged result of expression is exported to control part 60.
In this case, fixedly the peristome 283 in the lid 29 is set as the size of a mounting portion, 242a～the 242e of mounting portion is separated by dividing plate 244 respectively, so, reduced the temperature variation of inspection substrate 8 by checking that control part 50 carries out inspection substrate 8 beyond the inspection substrate 8 that inspecting substrate handles and can not be exposed in the air via peristome 283 discrepancy in the fixing lid 29.
Like this, after being adsorbed on the inspecting substrate end of the inspection substrate 8 on the 242a of mounting portion, according to control signal from control part 60, by transporting drive division 40, heating maintaining part 24 is carried the distance of a mounting portion along guide rail 41, after this, repeat by checking the conveying action of inspecting substrate that control part 50 carries out and the heating maintaining part 24 by transporting the mounting portion distance that drive division 40 carries out, thereby carry out inspecting substrate (step S27) for each inspection substrate 8 that is adsorbed on the 242b～242e of mounting portion.
In this case, on heating plate 241, be provided with 5 242a～242e of mounting portion, can heat 5 inspection substrates 8 simultaneously,, can shorten heat time heating time so compare with the situation of an inspection substrate 8 of each heating.In addition, by transporting portion 32, on X-direction, transport inspection substrate 8 along guide rail 43, mounting is to heating plate 241, after on the Y direction of intersecting with the carriage direction that transports portion 32, transporting heating plate 241, can check by 37,38 pairs of inspection substrates 8 of movin gdetector, so outside the moving range of the portion that transports 32 that on X-direction, carries out shift action along guide rail 43, set the driving mechanism of movin gdetector, can easily avoid the interference between the driving mechanism of portion that transports 32 and movin gdetector.
In addition, though the adding of inspection substrate 8 that shows in step S16, pine for, carry out the example that transports action that transports the another new inspection substrate 8 among action and the step S23 of the new inspection substrate 8 among the step S20, but the action of transporting among step S20, the S23 for example also can execution concurrently in the processing of step S25～S27.
Then, for being adsorbed on all inspection substrates 8 on the 242a～242e of mounting portion when being through with inspecting substrate, according to control signal from control part 60, by transporting drive division 40, carry heating maintaining part 24 along the side nearby of guide rail 42 in Fig. 2, open lid 27, transporting the transporting position (second transporting position) that vacuum head 321 in the portion 32 navigates to each adsorbed among the adsorbable mounting 242a～242e of portion inspection substrate 8.
Then, in the thermal pretreatment of the new inspection substrate 8 in step S21 and in the cooling processing of the another new inspection substrate 8 in step S24, according to control signal from control part 60, by transporting portion 32,5 inspection substrates 8 of the last mounting of the 242a～242e of mounting portion in the heating maintaining part 24 are transported to hold the top of work support 25 and carry out mounting (step S28).
In this case, owing to carry out the thermal pretreatment (step S21) of the new inspection substrate 8 in the preheating maintaining part 23, the cooling processing (step S24) of transporting the another new inspection substrate 8 in processing (step S28) and the cooling maintaining part 22 that the position adjustments in the heating maintaining part 24 is handled (step S25), temperature survey (step S26), inspecting substrate (step S27) and inspection substrate 8 concurrently, so can shorten the sensorial processing time, increase the inspection quantity of the inspection substrate 8 in the unit interval.
In addition, for being transported to the inspection substrate 8 that holds work support 25 from heating maintaining part 24, inspecting substrate under the low-temperature condition among the step that the is through with S9 and the inspecting substrate under the condition of high temperature among the step S27, so by control part 60, expression is sent to operation display part 12 for the signal that holds the check result of 5 inspection substrates 8 of mounting on the work support 25, show this check result by operation display part 12.
And, by 10 nozzles 31 to mounting in holding the dried air (step S29) that inspection substrate 8 on the work support 25 blows out normal temperature.Thus, shortened the time that the temperature that makes inspection substrate 8 is cooled to the temperature about 40 ℃.
On the other hand, beginning of the heating (step S21) of the new inspection substrate 8 that carries out from preheating maintaining part 23 through the predefined schedule time, for example after 30 seconds, according to control signal from control part 60, by transporting drive division 40, make lid 30 slips move and open, the vacuum head 321 that transports in the portion 32 is navigated on the transporting position of each adsorbed among the adsorbable mounting 232a～232e of portion inspection substrate 8.
And, S15 is identical with step, in the cooling of the inspection substrate 8 in step S29, by transporting portion 32, the new inspection substrate 8 of the last mounting of the 232a～232e of mounting portion in the preheating maintaining part 23 is transported to the 242a～242e of mounting portion last (step S30) that heats in the maintaining part 24, S16 is identical with step, by heating maintaining part 24, new inspection substrate 8 is heated (step S31).
On the other hand, the cooling of the another new inspection substrate 8 that the cooling maintaining part 22 from step S24 is carried out began through the predefined schedule time, for example after 30 seconds, with step S7, S8 is identical, according to control signal from control part 60, by transporting drive division 40, carry cooling maintaining part 22 along guide rail 41, carry out position adjustments for 5 inspection substrates 8 of mounting on the cooler pan 221 and handle (step S32) and temperature survey (step S33) afterwards, according to the control signal of coming self-check control part 50, by detector drive division 49 (inspection delivery section), along guide rail 44 with movin gdetector 37,38 from step S27, check heated condition inspection substrate 8 second check that the position is transported to and the relative position (first checks the position) of peristome 283 in the fixing lid 28, S9 is identical with step, uses movin gdetector 37,38 inspecting substrate (step S34).
In addition, control part 60 also can finish the back in the inspection among the step S27, in the processing of step S28～33, by detector drive division 49 movin gdetector 37,38 is transported to and the relative position (first checks the position) of peristome 283 in the fixing lid 28.Thus, shortened the time of delivery of the movin gdetector 37,38 among the step S34.
In addition, on the other hand, by the air that blows out by 10 nozzles 31 to after holding inspection substrate 8 on the work support 25 and carry out the cooling of the schedule time among the step S29, by hold the handle 252 of work support 25 by user's pulling, to hold work support 25 pulls out from housing 2, take out mounting in the inspection substrate that has checked 8 (step S35) that holds on the work support 25, in step S4, being through with is encased in the inspection of the inspection substrate 8 in the base board checking device 1.
In this case, owing to carry out concurrently and hold the cooling processing (step S29) of the inspection substrate 8 in the work support 25 and the taking-up (step S35) of inspection substrate 8, transport (the step S30) of new inspection substrate 8 from preheating maintaining part 23 to heating maintaining part 24, heat treated (step S31) in the heating maintaining part 24, the cooling processing (step S24) of the another new inspection substrate 8 in the cooling maintaining part 22, position adjustments is handled (step S32), temperature survey (step S33) and inspecting substrate (step S34), so can shorten the sensorial processing time, increase the inspection quantity of the inspection substrate 8 in the unit interval.
In addition, though show in the cooling of the another new inspection substrate 8 in step S24, the example that transports action of the inspection substrate 8 among the execution in step S28 concurrently, but transporting action and also can in the processing of for example step S32～S34, carry out concurrently among the step S28.
And, for new inspection substrate 8, in step S41～S45, S51, repeat the processing identical with step S25～S29, S35, in step S51, the new inspection substrate 8 that has checked is taken out, finish to check.In this case, the inspecting substrate that from step S35, finishes inspection substrate 8 begin, finish in the step S51 till the inspecting substrate of new inspection substrate 8 time, be that single products production time T becomes the sensorial processing time for 5 new inspection substrates 8.Single products production time T is the part of heat time heating time of the inspection substrate 8 among the step S31 and the time altogether in processing time of step S41～S45, S51.
On the other hand, do not carrying out the above-mentioned work support 21 of packing into, cooling maintaining part 22, preheating maintaining part 23, heating maintaining part 24 and holding under the situation of parallel processing of work support 25, in the inspection of new inspection substrate 8, need step S12～S14, S17～S21, S30, S31, S41～S45, processing time among the S51, and with respect to this, base board checking device 1 is by the work support 21 of packing into, cooling maintaining part 22, preheating maintaining part 23, heating maintaining part 24, and hold work support 25 and carry out parallel processing based on so-called streamline (pipe line) action, sensuously can shorten step S12～S14 thus, S17～S21, the part in the processing time among processing time among the S30 and the step S31 is carried out the inspection of new inspection substrate 8 according to single products production time T.
After, by base board checking device 1,, repeat the inspection of 5 new inspection substrates 8, so, can increase the inspection quantity of the inspection substrate 8 in the unit interval with respect to the situation of not carrying out above-mentioned processing arranged side by side at each single products production time T.
In addition, though show following structure: have cooling maintaining part 22, preheating maintaining part 23, and heating maintaining part 24, after at first under the state of cooling, inspection substrate 8 being checked by cooling maintaining part 22, by 23 pairs of inspection substrates of preheating maintaining part 8 carry out preheating and by the heating maintaining part 24 under heated state, check, but also can be following structure: the precooling portion that has with cooling maintaining part 22 same general configuration replaces preheating maintaining part 23, after at first under heated condition, inspection substrate 8 being checked, inspection substrate 8 is carried out precooling and under the state of cooling, check by cooling maintaining part 22 by precooling portion by heating maintaining part 24.
Claims (5)
1. base board checking device carries out the inspection of the distribution that forms on substrate, it is characterized in that,
Have:
Keep body, its arranged in one direction a plurality of substrates of mounting respectively a plurality of mounting portion, around described a plurality of mounting portion, have a side wall portion;
The temperature applying unit, it applies the position in predetermined temperature, makes the temperature of described maintenance body become predetermined temperature;
Inspection portion, its substrate after predetermined inspection position inspection becomes predetermined temperature by described temperature applying unit;
Moving part, it applies between position and the described inspection position in described temperature and moves; And
Cover, it applies position, described inspection position and applies the position to the mobile route of described inspection position from described temperature in described temperature, covers described a plurality of mountings position,
The inspection peristome that described cover has the size at a described mounting position in described inspection position,
Described moving part makes described maintenance body relatively move with respect to described cover, so that described a plurality of mountings position is relative with peristome with described inspection successively,
Described inspection portion carries out the inspection of the described substrate of mounting on described a plurality of mountings position successively with peristome via described inspection.
2. base board checking device as claimed in claim 1 is characterized in that,
Described cover has:
First lid, it applies the position in described temperature and covers described a plurality of mountings position; And
Second lid, its on described mobile route and described inspection position cover described a plurality of mountings position,
Described first lid constitutes and can open and close.
3. base board checking device as claimed in claim 1 is characterized in that,
Described cover is laminated by a plurality of sheet components.
4. base board checking device as claimed in claim 1 is characterized in that,
Also with described first and second lids in any one relatively have the video camera of the image of the substrate of mounting on the mounting position of taking described maintenance body,
Described inspection portion is based on the image that is photographed by described video camera, carries out the position adjustments in the inspection of this substrate,
In described first and second lids any one with the relative position of described video camera on, have than a position adjustments peristome that described mounting position is little,
Described video camera is obtained the image of described substrate with peristome via described position adjustments.
5. as any described base board checking device in the claim 1 to 4, it is characterized in that,
Also with described first and second lids in any one relatively have the thermometer that the temperature of the substrate of mounting on the mounting position of described maintenance body is measured, under the situation of described inspection portion in the temperature that is gone out by described thermometer measure is in predefined temperature range, carry out the inspection of this substrate, in described first and second lids any one with the relative position place of described thermometer, have than a temperature survey peristome that described mounting position is little, described thermometer is measured the temperature of described substrate with peristome via described temperature survey.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005245060A JP2007059727A (en) | 2005-08-25 | 2005-08-25 | Substrate inspection device and substrate inspection method |
| JP2005-245060 | 2005-08-25 | ||
| JP2005245060 | 2005-08-25 | ||
| JP2005245065A JP2007057444A (en) | 2005-08-25 | 2005-08-25 | Board inspection device and temperature maintenance mechanism for same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1920585A CN1920585A (en) | 2007-02-28 |
| CN1920585B true CN1920585B (en) | 2011-08-24 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2006100802489A Expired - Fee Related CN1920585B (en) | 2005-08-25 | 2006-05-15 | Substrate detector |
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| Country | Link |
|---|---|
| JP (2) | JP2007057444A (en) |
| KR (1) | KR100827465B1 (en) |
| CN (1) | CN1920585B (en) |
Families Citing this family (42)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101413978B (en) * | 2007-10-16 | 2011-03-23 | 京元电子股份有限公司 | Semiconductor encapsulation component test device |
| JP5377915B2 (en) * | 2008-09-30 | 2013-12-25 | 東京エレクトロン株式会社 | Inspection apparatus and inspection method |
| KR101011457B1 (en) * | 2009-02-23 | 2011-01-28 | 양 전자시스템 주식회사 | Apparatus for cooling and desiccating FPD substrate during the electric property test |
| CN101852819B (en) * | 2009-04-02 | 2013-01-23 | 名硕电脑(苏州)有限公司 | Automatic heat engine device of circuit board |
| JP2011075498A (en) * | 2009-10-01 | 2011-04-14 | Mitsubishi Electric Corp | Inspection apparatus, and inspection method |
| JP5466043B2 (en) * | 2010-02-25 | 2014-04-09 | タツモ株式会社 | Method for inspecting printed circuit board used in electronic equipment and inspection apparatus used therefor |
| JP2011185746A (en) * | 2010-03-09 | 2011-09-22 | Tatsumo Kk | Method for inspecting printed circuit board, and inspection device used for it |
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| JP5218871B2 (en) * | 2011-08-01 | 2013-06-26 | アキム株式会社 | Temperature characteristic measuring device |
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| TWI629490B (en) * | 2017-07-07 | 2018-07-11 | 鴻勁精密股份有限公司 | Electronic component testing equipment with lower-type cold source conveying device |
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| CN112454604A (en) * | 2020-12-07 | 2021-03-09 | 山东海超机械有限公司 | Panel banding area preheater |
| US12007411B2 (en) | 2021-06-22 | 2024-06-11 | Teradyne, Inc. | Test socket having an automated lid |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1447406A (en) * | 2002-03-22 | 2003-10-08 | 精工爱普生株式会社 | Mfg. appts. of electronic device, mfg. method of electronic device and mfg. program of electronic device |
| CN1565054A (en) * | 2002-10-21 | 2005-01-12 | 东京毅力科创株式会社 | Prober and probe testing method for temperature-controlling object to be tested |
| CN1601732A (en) * | 2003-09-25 | 2005-03-30 | Smc株式会社 | Temp regulator of semiconductor substrate |
Family Cites Families (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55147363A (en) * | 1979-05-08 | 1980-11-17 | Toshiba Corp | Device for automatically testing wiring bedplate |
| JPS63150679A (en) * | 1986-12-16 | 1988-06-23 | Sony Corp | Inspecting device for circuit board |
| JPS63207928A (en) * | 1987-02-23 | 1988-08-29 | Hitachi Ltd | Dew condensation preventive apparatus |
| JPH03222400A (en) * | 1990-01-26 | 1991-10-01 | Nec Home Electron Ltd | Heating test device and printed board unloading device thereof |
| JPH05150001A (en) * | 1991-05-22 | 1993-06-18 | Tokyo Electron Yamanashi Kk | Conveyor device for semiconductor device |
| JPH0786375A (en) * | 1993-09-17 | 1995-03-31 | Dainippon Screen Mfg Co Ltd | Substrate transfer device |
| JPH0829050A (en) * | 1994-07-18 | 1996-02-02 | Tabai Espec Corp | Insulating container having inner lid of door |
| JPH0843482A (en) * | 1994-08-01 | 1996-02-16 | Tokyo Electron Ltd | Temperature-regulating device |
| JPH0875819A (en) * | 1994-08-25 | 1996-03-22 | Sunright Pte Ltd | Reusable carrier for burn-in inspection of die that is not sealed into package |
| JPH08105938A (en) * | 1994-10-06 | 1996-04-23 | Advantest Corp | Ic test handler |
| JPH08210881A (en) * | 1995-02-06 | 1996-08-20 | Tokyo Electron Ltd | Method and device of inspection |
| JPH09329643A (en) * | 1996-06-06 | 1997-12-22 | Hitachi Electron Eng Co Ltd | Test device for ic device |
| JP3494871B2 (en) * | 1997-02-12 | 2004-02-09 | 東京エレクトロン株式会社 | Probe device and probe method |
| JPH1144727A (en) * | 1997-07-24 | 1999-02-16 | Hioki Ee Corp | Circuit board inspecting device |
| JPH11231018A (en) * | 1998-02-17 | 1999-08-27 | Hitachi Electron Eng Co Ltd | Thermostatic device for testing ic device |
| JP2000114149A (en) * | 1998-10-07 | 2000-04-21 | Hitachi Ltd | Glass substrate holding apparatus |
| JP2000174416A (en) * | 1998-12-07 | 2000-06-23 | Matsushita Electric Ind Co Ltd | Method of inspecting printed wiring board and inspecting device thereof |
| JP2000206194A (en) * | 1999-01-11 | 2000-07-28 | Advantest Corp | Tray for electronic component board test and test device of electronic component board |
| JP2000329819A (en) * | 1999-05-17 | 2000-11-30 | Advantest Corp | Test device and test method of electronic part substrate |
| JP2000329809A (en) * | 1999-05-17 | 2000-11-30 | Advantest Corp | Testing device for electronic part substrate and testing method therefor |
| JP2000356665A (en) * | 1999-06-14 | 2000-12-26 | Advantest Corp | Tray for electronic part substrate, testing device and test method of electronic part substrate |
| JP2001281294A (en) * | 1999-09-17 | 2001-10-10 | Nec Corp | Device temperature characteristic measuring instrument |
| JP2002286792A (en) * | 2001-03-22 | 2002-10-03 | Espec Corp | Semiconductor device loading device |
| JP2002361159A (en) * | 2001-06-07 | 2002-12-17 | Sharp Corp | Wet sheet treatment device |
| KR101015594B1 (en) * | 2005-02-28 | 2011-02-17 | 주식회사 비아트론 | Heat Treatment Apparatus of Semiconductor Device |
-
2005
- 2005-08-25 JP JP2005245065A patent/JP2007057444A/en active Pending
- 2005-08-25 JP JP2005245060A patent/JP2007059727A/en active Pending
-
2006
- 2006-05-15 CN CN2006100802489A patent/CN1920585B/en not_active Expired - Fee Related
- 2006-07-25 KR KR1020060069460A patent/KR100827465B1/en not_active IP Right Cessation
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1447406A (en) * | 2002-03-22 | 2003-10-08 | 精工爱普生株式会社 | Mfg. appts. of electronic device, mfg. method of electronic device and mfg. program of electronic device |
| CN1565054A (en) * | 2002-10-21 | 2005-01-12 | 东京毅力科创株式会社 | Prober and probe testing method for temperature-controlling object to be tested |
| CN1601732A (en) * | 2003-09-25 | 2005-03-30 | Smc株式会社 | Temp regulator of semiconductor substrate |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2007057444A (en) | 2007-03-08 |
| KR100827465B1 (en) | 2008-05-06 |
| KR20070024354A (en) | 2007-03-02 |
| JP2007059727A (en) | 2007-03-08 |
| CN1920585A (en) | 2007-02-28 |
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