JP3351891B2 - Resin sealing method for circuit board on which IC is mounted and mold for molding the same - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin sealing method for a circuit board on which an IC is mounted, and a mold for molding the same.

[0002]

2. Description of the Related Art In recent years, with the high-density mounting of IC chips,
A resin-sealed semiconductor device having a large number of electrodes has been developed. A typical example is PGA (pin grid array). The PGA has a structure in which an IC chip is mounted on one surface of a circuit board and sealed with a resin, and a plurality of pins connected to the IC chip are arranged on the other surface. PG
A has the advantage that it can be attached to and detached from the motherboard, but has the problem that it is difficult to reduce the size because it has pins.

Therefore, as a small-sized resin-sealed semiconductor device replacing the PGA, a pad array carrier (hereinafter abbreviated as PAC) in which pads are arranged instead of pins has been developed. Generally, there are a side gate method and a pin point gate method as a gate method of a resin molding die, and a thermoplastic resin molding has a pin point gate method,
In the thermosetting resin molding, a side gate method is relatively widely adopted.

[0004] Generally, IC by transfer molding in thermosetting resin molding using a side gate method
According to the resin sealing method, a gate residue communicating with the sealing portion is formed on the circuit board, so that when removing the gate residue, the wiring pattern may be destroyed, or the resin forming the sealing portion may be cracked. Further, since the gate resin flows on the circuit board surface, there is a problem that the circuit board is stained with the resin.

[0005] In the resin encapsulation of a semiconductor, the fluidity of the molten resin is poor, there is a risk of wire breakage, and a thermoplastic resin having a low sealing reliability after molding is inappropriate. Needless to say, a thermosetting resin having good shape accuracy and high reliability after sealing is optimal.

Accordingly, attention has been paid to a pinpoint gate method which eliminates the problem of the side gate method, and this is referred to as a PAC.
Adopted for the transfer mold. FIG. 4 illustrates a transfer molding of a pin point gate method 6
It is principal part sectional drawing which shows the structure of an individual molding die. In FIG. 4, reference numeral 57 denotes an upper mold, which is composed of 45 fixed-side mold plates, 48 receiving plates, and 53 fixed-side mounting plates. On the other hand, reference numeral 58 denotes a lower mold, which comprises a movable mold plate 41 and a movable receiving plate (not shown), a spacer, and a movable mounting plate (not shown) which are sequentially arranged below the movable mold plate 41. 59 is the upper mold 57
And a guide post for guiding the lower mold 58, respectively, and are disposed near the four corners of the mold. 49 is an IC, and 43 is a circuit board on which the IC 49 is mounted. A concave portion 41 a having a depth corresponding to the thickness of the circuit board 43 is formed in the movable mold plate 41. Reference numeral 42 denotes a guide pin which is a positioning portion implanted in the concave portion 41a, and a positioning guide hole 43a of the circuit board 43 is fitted.

Reference numeral 46 denotes a cavity block fitted and held in the fixed mold plate 45, and 47 denotes a cavity serving as an IC 49 sealing portion. Is formed. 48 is a receiving plate, and the receiving plate 48 and the fixed side mounting plate 5
3, the cull portion 52a, the lateral runner portion 52b, and 5
A runner section 52 is formed as a resin transfer path composed of the vertical runner section 2c. Reference numeral 52d denotes a gate portion serving as a resin injection port formed at the lower end of the vertical runner portion 52c connected to the cavity 47 below the runner portion 52. The vertical runner portion 52c is formed so as to be connected without a gap from the cavity block 46 to the receiving plate 48, and is formed in a shape in which undercut does not occur. Reference numeral 54 denotes a loaded resin tablet, and 55 denotes a pot serving as a loading port of the resin tablet 54, which is disposed at the center of the fixed side mounting plate 53 so as to guide a resin pressing plunger (not shown). . 56 is
A runner lock pin having a locking portion for locking the runner resin cured by the runner portion 52, and is fixed to the fixed side mounting plate 53. That is, a part of the outer periphery of the runner lock pin 56 intersects with the runner part 52 near the vertical runner part 52c, and the locking part of the runner lock pin 56 forms a part of the side wall of the runner part 52.
The locking portion of the runner lock pin 56 is a cutout portion opened on the outer periphery of the pin.
They are oriented in the same rotation direction about a.

Next, the molding operation of the pin point gate system in the PAC transfer molding will be described with reference to FIG. First, the upper mold 57 and the lower mold 58 heated to a predetermined temperature, for example, about 165 ° C. by a heater (not shown) installed in the mold are opened, and the circuit board 43 is mounted on the IC.
The guide hole 43a is fitted so that the guide hole 43a is fitted to the guide pin 42 with the 49 facing upward. Next, the preheated epoxy resin tablet 54 is put into the cull portion 52a from the pot 55, and the plunger is pushed in to apply pressure, thereby dissolving the melted thermosetting resin from the cull portion 52a to the horizontal runner portion 52b and the vertical runner. It is injected into the cavity 47 through the part 52c and the gate part 52d. The dissolution time of the thermosetting resin is, for example, about 8 seconds.

After filling the thermosetting resin, a predetermined thermosetting time, for example, about 90 seconds, is maintained, and then the mold is opened and the runner lock is released. First, the receiving plate 48 and the fixed side mounting plate 53 are opened, and the runner resin and PAC which is a resin molded product is opened.
Are separated by the gate 52d. At this time, the cutout portion of the runner lock pin 56 contains a hardened runner resin, and performs a runner lock function of holding the runner resin and reliably releasing the mold. Next, by a pinching operation of a hand claw of a take-out robot (not shown), a rotational force is applied to the runner resin with the vertical runner facing the cull of the runner resin as a center, and the runner resin is removed from the locking portion of the runner lock pin 56. And take it out. Further parting line 4
In step 4, the mold plate of the fixed mold plate 45 and the movable mold plate 41 is opened, and the PAC sealed with the molding resin is taken out by another hand of a take-out robot (not shown), thereby completing one cycle of the molding operation.

However, in the resin molding by the transfer molding, when the molding die is closed, the upper surface of the circuit board 43 is pressed by the cavity block 46, but the depth of the concave portion 41a is smaller than the thickness of the circuit board 43. Or, when the thickness of the circuit board 43 is larger than the depth of the concave portion 41a, the circuit board 43 is
And the movable side mold plate 41 is strongly pressed and damaged. Conversely, if the recess 41a is deep or the circuit board 43
When the thickness is small, a gap is formed between the cavity block 46 and the circuit board 43, and the resin leaks out from the gap to generate burrs. To prevent this, the precision of the thickness dimension of the circuit board 43 is strictly required.

In order to absorb the variation in the thickness of the circuit board 43, a resin mold by transfer molding as shown in FIG. This structure will be described. 5, the same components as those in FIG. 4 are denoted by the same reference numerals and names, and description thereof is omitted. Numeral 61 denotes an urging pressing portion, which is urged by a urging means comprising a compression coil spring of 60 into a concave portion formed in the movable mold plate 41 of the lower mold 58, and is slid up and down by a sliding portion 62. Is stored as Reference numeral 42 denotes a guide pin serving as a circuit board positioning section, and a circuit board 43 formed on the urging and pressing section 61.
Is implanted in a concave portion 61a having a depth smaller than the thickness of the concave portion 61a.
In order to increase the sealing position accuracy of the circuit board 43, the urging and pressing portion 61 is adjusted to slide with a small clearance at the sliding portion 62. In the mold, as shown in FIG. 6B, as shown in FIG. 6B, the circuit board 43 on which one type of IC is mounted is sealed with resin, and the upper mold 57 is shown in FIG. A pair of mold parts including the cavity block 46 and the urging and pressing part 61 shown in FIG.

The operation of the transfer mold will be described. Guide pin 4 of urging pressing portion 61 of lower mold 58
2, the circuit board 43 is mounted and the mold is clamped. The urging pressing portion 61 is urged by the compression coil spring 60 and presses the back surface of the circuit board 43. At this time, since the depth of the concave portion 61a is smaller than the thickness of the circuit board 43, the upper surface of the biasing pressing portion 61 and the lower surface of the cavity block 46 are separated,
Therefore, if the operation of the urging and pressing portion 61 in the sliding portion 62 is not hindered, the variation in the thickness of the circuit board 43 is absorbed, and the upper surface of the circuit board 43 is in close contact with the lower surface of the cavity block 46, so that the resin leaks from the cavity 47. Nothing.

[0013]

However, the above-described transfer molding of the PAC of the pinpoint gate type has the following problems. That is, the mold is pre-heated at the time of resin sealing, and the urging and pressing portion 61 is liable to cause seizure at the sliding portion 62, and the sliding is hindered and the pressing of the circuit board 43 becomes insufficient, A gap is formed between the circuit board 43 and the cavity block 46, which results in leakage of resin and generation of burrs. If the clearance of the sliding portion 62 is increased in order to eliminate the seizure in the sliding portion 62, the resin sealing position accuracy cannot be ensured. Also, when installing and removing the product PAC,
Although the circuit board 43 is sucked, the IC mounting part is upward and the IC mounting part must be avoided to avoid the IC mounting part. Therefore, a special suction pad is required because the suction space is limited. Since the upper mold 57 easily sticks to the cavity block 46 side, it is difficult to take out the PAC, and one cycle of resin molding requires extra time. Furthermore, when the type of the circuit board on which the IC 49 is mounted is switched, the cavity block 46 of the upper die 57 is switched.
In order to replace a pair of the urging and pressing portion 61 of the lower mold 58 with the pair, the mold cost and work time are required. Further, since the structure has the cavity 47 below the runner portion 52,
The resin residue generated at the time of separating the runner resin at the gate portion 52d or cleaning the mold enters the gate portion 52d or the cavity 47, and becomes unfilled with resin in the next cycle, or the hard resin residue enters the cavity 47, There have been various problems such as wire bending of the bonding wire, breakage and shoulder touch.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned conventional problems, and has as its object to solve the above-mentioned problems in the pinpoint gate system, and is particularly suitable for transfer molding, has a high precision of resin sealing, and has a high reliability. It is intended to provide a highly moldable resin molding method and a structure of a molding die.

[0015]

To achieve the above object, the present invention provides a resin sealing method for a circuit board on which an IC is mounted according to the present invention, wherein a lower mold is provided with a cavity for sealing the IC and the circuit. A positioning part for positioning the substrate is provided, and an upper mold is provided with a pressing part for pressing the back surface of the circuit board, and the circuit board on which the IC is mounted on the lower mold is turned downwardly. And sealed with a resin.

A runner is provided below the cavity of the lower mold, and a resin is injected into the cavity from the runner through a gate.

The pressing portion provided on the upper mold is a biasing pressing portion which is biased in a pressing direction by a biasing means, and the biasing pressing portion presses the back surface of the circuit board. It is assumed that.

The cavity of the lower mold and a positioning portion for positioning the circuit board are formed in one cavity block, and the cavity block is replaced to seal a circuit board on which an IC having a different shape is mounted. Is performed.

The upper mold is provided with an urging / pressing portion urged in a pressing direction by urging means, and the lower mold is provided with a cavity and a positioning portion for positioning the circuit board. The circuit board is formed in a cavity block, and the back surface of the circuit board on which the IC mounted in the cavity block is mounted is pressed by the urging and pressing portion to be resin-sealed.

According to the present invention, a molding die for resin-sealing a circuit board on which an IC is mounted is characterized by positioning the cavity for sealing the IC on the circuit board on which the IC is mounted and the circuit board in the lower mold. And a pressing portion for pressing the back surface of the circuit board is provided on the upper mold.

A runner portion is provided below the cavity of the lower mold, and a resin is injected into the cavity from the runner portion via a gate portion.

The upper mold has an urging / pressing portion urged in a pressing direction by urging means, and the rear surface of the circuit board is pressed by the urging / pressing portion. Is what you do.

The cavity of the lower mold and a positioning portion for positioning the circuit board are formed in one cavity block.

The upper mold is provided with an urging / pressing portion urged in a pressing direction by urging means, and the lower mold is provided with a cavity and a positioning portion for positioning the circuit board. It is characterized by being formed in a cavity block.

[0025]

Accordingly, the sliding portion of the urging and pressing portion has a large clearance, so that the sliding portion does not seize and the operation is smooth, the pressing of the circuit board is effective, and no burrs are generated. The contact surface of the urging and pressing portion with the circuit board may be flat, so that it can be shared regardless of the type of circuit board, and the cavity block can integrally form the IC sealing portion and the circuit board positioning portion. Therefore, it is possible to quickly switch types by simply exchanging the cassette type cavity block. Further, since there is a gate portion below the cavity, the resin residue does not enter the cavity. Furthermore, since the IC mounting portion of the circuit board faces downward, it is extremely easy to take out the product because the back surface of the circuit board can be sucked.

[0026]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments will be described below with reference to the drawings. FIG. 1 is a cross-sectional view of a main part showing an embodiment of the present invention, showing a method of resin sealing a circuit board on which a pinpoint gate type IC is mounted and a structure of a molding die thereof. FIG. FIG. 3 is a sectional view of the cavity block. First, in FIG. 1, reference numeral 1 denotes an upper mold, and 7
, A heat insulating member 8 for preventing the diffusion of heat to the fixed side mounting plate 7, and a fixed side mold plate 5. 2 is a lower mold, 10 movable side mold plates, 14 movable side mold plates,
The movable mold plate 14 includes a movable receiving plate, a spacer, and a movable mounting plate (not shown) which are sequentially combined with each other below the movable mold plate 14. Reference numeral 15 denotes an IC, and reference numeral 9 denotes a circuit board on which the IC 15 is mounted, and has a positioning guide hole 9a shown in FIG. Reference numeral 3 denotes an urging and pressing portion having a flat surface for pressing the back surface of the circuit board 9. The urging and pressing portion 3 is fixed to the fixed side mold plate 5 so as to slide with a sliding portion 4 having a sufficiently large clearance. Is held. Reference numeral 6 denotes a compression coil spring, which is a biasing unit that presses the biasing pressing unit 3, and is stored in the heat insulating member 8. The biasing means may be a spring member such as a leaf spring or an elastic member such as synthetic rubber instead of the compression coil spring.

Reference numeral 13 denotes a cassette type cavity block having a trapezoidal cross section as shown in FIG. 2, which is removably inserted into the movable mold plate 10 and has a recess 13a which is shallower than the thickness of the circuit board 9; 13a includes 11 cavities, which are IC sealing portions, and a pair of guide pins 12 which are inserted into guide holes 9a of the circuit board 9 and serve as positioning portions for positioning the circuit board 9 in one cavity block. 1
3 are formed at three places. Reference numeral 18d denotes a gate portion which is a resin transfer path connecting the cavity 11 and a runner portion below the cavity 11, which is located at an upper end of a vertical runner portion 18c to be described later and which serves as a resin injection port to the cavity 11. is there.

Numeral 18 denotes a runner portion which is a resin transfer path formed by the movable mold plate 10 and the movable mold plate 14. The runner portion 18 includes a cull portion 18a into which a resin tablet is put, and a cull portion 18a. A horizontal runner portion 18b extending radially from the portion 18a and a vertical runner portion 18c rising from the horizontal runner portion 18b toward the cavity 11
Consists of 19 is provided at the center of the movable mold plate 14,
A pot for guiding a plunger (not shown) that presses the resin tablet. Reference numeral 20 denotes a runner lock pin fixed to the movable side mold plate 14, and a cutout portion opened at a part of the outer periphery of the runner lock pin 20 intersects the runner portion 18, and the cutout portion is
Of the runner resin 18 formed by the runner portion 18. The notch portions, which are the locking portions of the runner lock pin 20, are directed in the same rotational direction about the cull portion 18a at all six locations.

Numeral 25 denotes a runner lock release pin which penetrates through the movable side mold plate 14 and is provided so as to be driven from the lower part of the spacer. Are arranged corresponding to the respective runner lock pins 20 so as to constitute a part of the side wall on the side to be locked. 21 is a guide post for guiding the upper mold 1 and the lower mold 2 respectively, and 22 is a parting line. The two cavity blocks 13 are point-symmetric with respect to the cull portion 18a.
By pressing the movable mold plate 10 vertically into its cross section so as to abut against a not-shown wall surface or a stopper, which is a pin, and fastening 23 holding members between the two cavity blocks 13 with bolts, two bolts are provided. Can be mounted simultaneously. At this time,
From the vertical runner portion 18c of the movable side mold plate 10 to the gate portion 18d of the cavity block 13, a resin transfer path having a shape without undercut including a joint is formed without any gap.

Next, the molding operation of the pin point gate method in the transfer molding of the PAC will be described with reference to FIGS. First, a predetermined temperature, for example, 16
The mold heated to about 5 ° C. is opened, and the guide hole 9 a of the circuit board 9 is mounted on the cavity block 13 of the lower mold 2 so that the IC 15 faces downward so as to align with the guide pin 12. The mold is closed by pressing the back surface of the circuit board 9 with the urging and pressing portion 3 of the upper mold 1. Pot 1 with pre-heated epoxy resin tablet as thermosetting resin
9, the plunger is pushed in, and pressure is applied to melt the epoxy resin from the cull portion 18a to the horizontal runner portion 18b, the vertical runner portion 18c, and the gate portion 1.
It is injected so as to be pushed up into the cavity 11 through 8d.

After the thermosetting resin is filled and held for a predetermined thermosetting time, for example, about 90 seconds, the movable side mold plate 10 and the movable side mold plate 14 are opened, and the runner lock pin 20 The runner resin held on the movable mold plate 14 side by the locking action is separated from the molding resin at the gate portion. Next, by pushing out the runner lock release pin 25, a rotational force is applied to the runner resin in contact with the slope of the tip of the runner lock release pin 25, and the runner resin is pushed laterally so as to be disengaged from the locking portion of the runner lock pin 20. Is released, and then the runner resin is taken out by a take-out robot (not shown). Next, the upper mold 1 and the lower mold 2 are opened at the parting line 22,
The PAC, which is a product sealed with the molding resin, is taken out. The PAC can be easily taken out by suction means such as a general-purpose suction pad or by using light air blowing together since the back side of the circuit board 9 is upward and has a planar shape. When the circuit board 9 is mounted on the guide pins 12 of the cavity block 13, the back side, which is the plane of the circuit board, is located at the upper side, and the work is easy. The PAC may be taken out before the runner resin is taken out.

The clearance of the sliding part 4 between the urging and pressing part 3 and the fixed-side mold plate 5 can be made large because it is independent of the sealing position accuracy. Accordingly, the sliding portion 4 operates smoothly without causing seizure due to heat at the time of molding, and effectively presses the circuit board 9, so that even if there is a variation in the thickness of the circuit board 9, it absorbs this and at the same time, absorbs the flash. There is no occurrence. Since the contact surface of the urging and pressing portion 3 with the circuit board 9 may be flat, it is possible to use the same regardless of the type of the circuit board 9. Further, since the compression coil spring 6 serving as the urging means is stored in the heat insulating member 8, the function thereof can be maintained for a long time without sagging due to heat during molding.

The cassette type cavity block 13 has 3
The IC 15 mounted on many circuit boards can be sealed at the same time. In the case of a strip having three circuit boards in a row, the number of guide pins 12 can be reduced to one pair. Instead of the guide pins 12, the positioning portion of the circuit board 9 may be a recess 13a formed so as to guide the outer shape of the circuit board 9 and shallower than the thickness of the circuit board 9. Further, as shown in FIG. 3, the switching of the type of the circuit board 9 is performed on the lower mold 2 in accordance with the circuit board 9 of FIG.
Since the cavity block 13 is merely replaced, and since the cavity block 13 is a cassette type, it is possible to quickly switch types. Since the guide pins 12 serving as positioning portions of the circuit board 9 and the cavities 11 serving as sealing portions are provided in one cavity block 13, the positional accuracy of the sealing portion with respect to the circuit board 9 is extremely well secured. Further, since the runner portion 18 is provided below the cavity 11, the resin residue generated due to the resin cutting or the mold cleaning at the gate portion 18d does not enter the cavity 11, and the filling failure due to the clogging of the resin residue can be prevented. No breakage of the bonding wire occurs.

As described above, the features of the resin sealing method of the circuit board on which the IC of the present embodiment is mounted and the structure of the molding die thereof are as follows. The cavity was formed in the upper part of the runner part by pushing up and pouring. In the lower mold,
The cavity and the positioning part of the circuit board are arranged in one cavity block, and the cavity block is made into a cassette type for easy attachment and detachment, ensuring the sealing position accuracy and quickly responding to the change of product type. Furthermore, in the upper mold,
By providing a sufficiently large clearance in the sliding portion between the biasing pressing portion for pressing the back surface of the circuit board by the biasing means and the fixed-side mold plate, the sliding portion is not seized and the pressing of the circuit board is effective, and the flash is reduced. The urging and pressing portion has a flat contact portion with the circuit board, so that it is possible to share the switching between types.

[0035]

As described above, according to the present invention,
The sealing resin precision is improved without causing unfilled resin or damage to the wire due to the resin residue. The urging and pressing portion operates smoothly and causes no burrs on the molded product, and the type can be changed quickly only by replacing the cavity block. Since the circuit board can be attached and detached with the flat back side of the circuit board facing upward, a general-purpose suction pad or the like can be used. As described above, a highly reliable and highly reliable resin sealing method and a structure of a molding die thereof can be provided.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view of a principal part showing a structure of a resin sealing molding die of a circuit board on which a pin point gate type IC according to an embodiment of the present invention is mounted.

FIG. 2 is a perspective view of a cavity block according to the embodiment of the present invention.

FIG. 3 is a cross-sectional view of a cavity block and a circuit board according to the embodiment of the present invention.

FIG. 4 is a cross-sectional view of a main part showing a structure of a circuit board resin molding die on which a conventional pinpoint gate type IC is mounted.

FIG. 5 is a sectional view of a main part showing a structure of a circuit board resin molding die on which a conventional pinpoint gate type IC is mounted.

FIG. 6 is a sectional view of a conventional cavity block, a circuit board, and an urging and pressing unit.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 upper die 2 lower die 3 biasing pressing part 6 compression coil spring 9 circuit board 11 cavity 12 guide pin 15 IC 18 runner part 18d gate part

Continuation of front page (56) References JP-A-7-205191 (JP, A) JP-A-7-314492 (JP, A) JP-A-7-290489 (JP, A) JP-A-6-120278 (JP, A) JP-A-2-1397 (JP, A) JP-A-1-234217 (JP, A) JP-A-5-144862 (JP, A) WO 95/19251 (WO, A1) WO 88 / 4227 (WO, A1) (58) Fields investigated (Int. Cl. ⁷ , DB name) H01L 21/56 B29C 45/02 B29C 45/26 B29L 31:34 B29C 45/14

Claims (10)

(57) [Claims] 1. A resin sealing method for a circuit board on which an IC is mounted, wherein a cavity is formed by an upper mold and a lower mold, and the circuit board on which the IC is mounted is mounted in a molding die and resin-sealed. The lower mold is provided with a cavity for sealing the IC and a positioning portion for positioning the circuit board, and the upper mold is provided with a pressing portion for pressing the back surface of the circuit board. A method of sealing a circuit board having an IC mounted thereon, wherein the circuit board having the IC mounted on the lower mold is mounted downward and sealed with a resin. 2. The method according to claim 1, wherein a runner portion is provided below the cavity of the lower mold, and a resin is injected into the cavity from the runner portion via a gate portion.
A resin sealing method for a circuit board on which the above-described IC is mounted. 3. The pressing portion provided on the upper mold is a biasing pressing portion biased in a pressing direction by a biasing means,
2. The method according to claim 1, wherein the urging portion presses the back surface of the circuit board. 4. A resin for a circuit board in which a cavity of the lower mold and a positioning portion for positioning the circuit board are formed in one cavity block, and the cavity block is replaced to mount an IC having a different shape. The method for resin sealing a circuit board on which an IC is mounted according to claim 1, wherein sealing is performed. 5. The upper mold is provided with an urging and pressing part urged in a pressing direction by urging means, and the lower mold is provided with a cavity and a positioning part for positioning the circuit board. 2. The IC according to claim 1, wherein the back surface of the circuit board on which the IC mounted on the cavity block is mounted is formed by pressing the back surface of the circuit board with the biasing pressing portion and is sealed with a resin. Resin sealing method for circuit boards. 6. A molding die for a circuit board on which an IC is mounted in which a cavity is formed by an upper die and a lower die, and the circuit board on which the IC is mounted is mounted in the molding die and resin-sealed. The lower mold is provided with the IC of the circuit board on which the IC is mounted.
And a positioning portion for positioning the circuit board, and a pressing portion for pressing the back surface of the circuit board is provided in the upper mold. Mold for the mounted circuit board. 7. The method according to claim 6, wherein a runner portion is provided below the cavity of the lower mold, and a resin is injected into the cavity from the runner portion via a gate portion. For forming a circuit board on which the above IC is mounted. 8. The apparatus according to claim 8, wherein said upper mold has an urging and pressing part urged in a pressing direction by urging means, and said urging and pressing part presses a back surface of said circuit board. A molding die for a circuit board on which the IC according to claim 6 is mounted. 9. The method according to claim 6, wherein the cavity of the lower mold and a positioning portion for positioning the circuit board are formed in one cavity block.
Mold for forming a circuit board on which C is mounted. 10. The upper mold is provided with an urging and pressing portion urged in a pressing direction by urging means, and the lower mold is provided with a cavity and a positioning portion for positioning the circuit board. 7. A molding die for a circuit board on which an IC is mounted according to claim 6, wherein the molding die is formed in one cavity block.