JPH0724273B2 - Method of manufacturing module for IC card - Google Patents
Method of manufacturing module for IC cardInfo
- Publication number
- JPH0724273B2 JPH0724273B2 JP63284439A JP28443988A JPH0724273B2 JP H0724273 B2 JPH0724273 B2 JP H0724273B2 JP 63284439 A JP63284439 A JP 63284439A JP 28443988 A JP28443988 A JP 28443988A JP H0724273 B2 JPH0724273 B2 JP H0724273B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- gate
- substrate
- cavity
- sealing resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 15
- 229920005989 resin Polymers 0.000 claims description 52
- 239000011347 resin Substances 0.000 claims description 52
- 238000007789 sealing Methods 0.000 claims description 38
- 239000000758 substrate Substances 0.000 claims description 27
- 238000000465 moulding Methods 0.000 claims description 23
- 238000000034 method Methods 0.000 claims description 10
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000002184 metal Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- NMFHJNAPXOMSRX-PUPDPRJKSA-N [(1r)-3-(3,4-dimethoxyphenyl)-1-[3-(2-morpholin-4-ylethoxy)phenyl]propyl] (2s)-1-[(2s)-2-(3,4,5-trimethoxyphenyl)butanoyl]piperidine-2-carboxylate Chemical class C([C@@H](OC(=O)[C@@H]1CCCCN1C(=O)[C@@H](CC)C=1C=C(OC)C(OC)=C(OC)C=1)C=1C=C(OCCN2CCOCC2)C=CC=1)CC1=CC=C(OC)C(OC)=C1 NMFHJNAPXOMSRX-PUPDPRJKSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14647—Making flat card-like articles with an incorporated IC or chip module, e.g. IC or chip cards
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Credit Cards Or The Like (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、基板上に樹脂部をモールド成形して半導体チ
ップを封止するICカード用モジュールの製造方法に関す
る。Description: TECHNICAL FIELD The present invention relates to a method for manufacturing an IC card module in which a resin portion is molded on a substrate to seal a semiconductor chip.
従来、ICカードに装着されるICモジュールは第５図に示
すように構成されている。Conventionally, an IC module mounted on an IC card is constructed as shown in FIG.
第５図は従来のICモジュールを示す図で、同図（ａ）は
平面図、同図（ｂ）は（ａ）図中Ｖ−Ｖ線断面図であ
る。第５図において、１は端子基板で、この端子基板１
の上面には配線回路（図示せず）が形成され、かつICチ
ップ２が実装されており、裏面には前記配線回路と接続
された電極端子（図示せず）が設けられている。３は前
記ICチップ２の表面電極（図示せず）と前記配線回路と
を接続するための金属細線、４は前記ICチップ２とを外
部環境から保護するための封止樹脂で、この封止樹脂４
はエポキシ樹脂からなり、前記端子基板１上にモールド
成形されている。この封止樹脂４は端子基板１の上面に
おける略中央部に形成され、この封止樹脂４によって封
止される部分の占有面積は端子基板１の上面の面積に較
べて小さく形成されている。なお、５は前記端子基板１
上に封止樹脂４を成形する際に同時に形成されたゲート
跡である。前記封止樹脂４を成形するには第６図および
第７図に示すようにICチップ２が実装された端子基板１
をモールド金型内に装填して行われる。FIG. 5 is a view showing a conventional IC module, FIG. 5A is a plan view, and FIG. 5B is a sectional view taken along line VV in FIG. 5A. In FIG. 5, 1 is a terminal board, and this terminal board 1
A wiring circuit (not shown) is formed on the upper surface of the IC chip, the IC chip 2 is mounted thereon, and an electrode terminal (not shown) connected to the wiring circuit is provided on the back surface. 3 is a thin metal wire for connecting a surface electrode (not shown) of the IC chip 2 to the wiring circuit, and 4 is a sealing resin for protecting the IC chip 2 from the external environment. Resin 4
Is made of epoxy resin and is molded on the terminal board 1. The sealing resin 4 is formed in a substantially central portion on the upper surface of the terminal substrate 1, and the area occupied by the sealing resin 4 is smaller than the area of the upper surface of the terminal substrate 1. In addition, 5 is the terminal board 1
It is a trace of the gate formed at the same time when the sealing resin 4 is molded on the gate. In order to mold the sealing resin 4, the terminal board 1 on which the IC chip 2 is mounted as shown in FIGS. 6 and 7.
Is loaded into the molding die.
第６図は従来のICモジュールの製造方法における樹脂封
止工程においてモールド金型内に端子基板１を型締めし
封止用樹脂を注入した状態を示す断面図、第７図は同じ
く封止工程において下金型に端子基板を装填した状態を
示す平面図である。これらの図において、６は下金型、
７は上金型で、これら下金型６および上金型７によって
モールド金型が構成されている。前記下金型６には端子
基板１が嵌装される凹部6aが形成され、また、上金型７
にはICチップ２および金属細線３が臨むキャビティ7a
と、このキャビティ7a内に封止用樹脂を注入するための
ゲート7bおよびランナー7cが形成されている。前記下金
型６の凹部6aおよび上金型７のキャビティ7a,ゲート7b
は第７図に示すように一つのモールド金型に対して複数
形成されており、多数の端子基板１を同時に樹脂封止す
ることができるように構成されている。なお、第７図に
おいては下金型６に対する上金型７のキャビティ7a,ゲ
ート7bおよびランナー7cの位置を二点鎖線で示した。す
なわち、端子基板１上に封止樹脂４をモールド成形する
には、先ず、下金型６の凹部6a内に端子電極を下側にし
て端子基板１を挿入する。次いで、この下金型６上に上
金型７を圧接させ、端子基板１を両金型6,7で型締めす
る。この状態で第７図に示すように、ICチップ２が上金
型７のキャビティ7a内に臨むことになる。そして、加熱
溶融された封止用樹脂をランナー7cおよびゲート7bを介
してキャビティ7a内に注入する。この際、封止用樹脂は
ゲート7b内において下金型６上から端子基板１上を通っ
て流され、モールド成形されることになる。封止用樹脂
が硬化し、モールド金型から端子基板１をそれぞれ離型
させた後、ゲート7b内で硬化した封止用樹脂を端子基板
１の端部から切断させて樹脂封止工程が終了する。FIG. 6 is a cross-sectional view showing a state where the terminal substrate 1 is clamped in a molding die and a sealing resin is injected in the resin sealing step in the conventional IC module manufacturing method, and FIG. 7 is the same sealing step. FIG. 7 is a plan view showing a state in which the terminal substrate is loaded in the lower mold in FIG. In these figures, 6 is a lower mold,
Reference numeral 7 denotes an upper die, and the lower die 6 and the upper die 7 form a molding die. The lower mold 6 is formed with a recess 6a into which the terminal board 1 is fitted, and the upper mold 7
The cavity 7a facing the IC chip 2 and the thin metal wire 3
And, a gate 7b and a runner 7c for injecting a sealing resin are formed in the cavity 7a. The recess 6a of the lower mold 6, the cavity 7a of the upper mold 7, and the gate 7b
As shown in FIG. 7, a plurality of molds are formed for one molding die, and a large number of terminal boards 1 can be simultaneously resin-sealed. In FIG. 7, the positions of the cavity 7a, the gate 7b, and the runner 7c of the upper mold 7 with respect to the lower mold 6 are shown by a chain double-dashed line. That is, in order to mold the sealing resin 4 on the terminal board 1, first, the terminal board 1 is inserted into the recess 6 a of the lower mold 6 with the terminal electrode facing downward. Then, the upper mold 7 is pressed onto the lower mold 6, and the terminal substrate 1 is clamped by the two molds 6, 7. In this state, as shown in FIG. 7, the IC chip 2 faces the cavity 7a of the upper mold 7. Then, the heat-melted sealing resin is injected into the cavity 7a through the runner 7c and the gate 7b. At this time, the encapsulating resin is flowed from above the lower mold 6 through above the terminal substrate 1 in the gate 7b to be molded. After the encapsulating resin is cured and the terminal substrate 1 is released from the mold, the encapsulating resin cured in the gate 7b is cut from the end of the terminal substrate 1 to complete the resin encapsulation process. To do.
しかるに、従来の樹脂封止方法においては、ゲート7b内
で硬化された封止用樹脂が第５図に示すように端子基板
１上にゲート跡５となって残り、カード基体（図示せ
ず）にICモジュールを装着する際にこのゲート跡５が邪
魔となり装着しにくかった。このような不具合を解消す
るための従来においては、封止樹脂４が接着するのを阻
止するような処理を端子基板１のゲート7bと対応する部
位に樹脂封止前に予め施しておいたり、ゲート跡５を機
械的に取り除く方法が採られていたが、前記非接着処理
を施す場合には、樹脂封止後のICモジュールをカード基
体内に装着させる接着する際にも接着されにくくなり悪
影響を与え、また、機械的に除去する場合には、端子基
板１上の配線回路を誤って損傷させないような処置が必
要になり作業が煩わしくなるばかりか、ゲート跡５が端
子基板１に強固に接着されているために除去するにも時
間がかかる。さらにまた、下金型６における凹部6aの開
口端縁と端子基板１の側面との間に形成された僅かな間
隙内に封止用樹脂が入り込み、この漏れた樹脂が端子基
板１の電極端子側へ廻り込むという問題もあった。However, in the conventional resin encapsulation method, the encapsulating resin cured in the gate 7b remains as the gate mark 5 on the terminal board 1 as shown in FIG. 5, and the card base (not shown). When installing the IC module on the, the gate marks 5 got in the way and were difficult to install. Conventionally, in order to eliminate such a problem, a treatment for preventing the sealing resin 4 from adhering is performed in advance on the portion of the terminal substrate 1 corresponding to the gate 7b before the resin sealing, Although a method of mechanically removing the gate trace 5 has been adopted, when the non-adhesion treatment is performed, the IC module after resin sealing is not easily adhered even when it is adhered to the inside of the card base, which has an adverse effect. In addition, in the case of mechanically removing the wiring, it is necessary to take measures to prevent the wiring circuit on the terminal board 1 from being accidentally damaged, and the work becomes troublesome. It takes time to remove it because it is bonded. Furthermore, the sealing resin enters into a slight gap formed between the opening edge of the recess 6a of the lower mold 6 and the side surface of the terminal board 1, and the leaked resin is used as the electrode terminal of the terminal board 1. There was also the problem of getting around to the side.
本発明に係るICカード用モジュールの製造方法は、モー
ルド金型における樹脂封止部成形用キャビティと対応す
る開口部が形成されかつランナーおよびゲートと対向す
る面を有する遮蔽板を基板上に密接させてモールド金型
内に型締めし、しかる後、前記遮蔽板上を通してキャビ
ティ内にモールド用樹脂を注入するものである。A method for manufacturing an IC card module according to the present invention includes a shield plate having an opening corresponding to a resin-molded portion molding cavity in a molding die and having a surface facing a runner and a gate, which is closely contacted with the substrate. Then, the mold is clamped in the mold, and then the molding resin is injected into the cavity through the shielding plate.
封止用樹脂は基板に接することなくモールド金型のキャ
ビティ内に注入され、離型後に遮蔽板を基板から取り外
すことによってゲートで硬化された封止用樹脂を取り除
くことができる。The sealing resin is injected into the cavity of the molding die without coming into contact with the substrate, and the sealing plate cured at the gate can be removed by removing the shielding plate from the substrate after releasing the mold.
以下、本発明の一実施例を第１図ないし第４図によって
詳細に説明する。An embodiment of the present invention will be described in detail below with reference to FIGS.
第１図は本発明に係るICカード用モジュールの製造方法
によって形成されたICモジュールを示す図で、同図
（ａ）は平面図、同図（ｂ）は（ａ）図中Ｉ−Ｉ線断面
図、第２図は離型後のICモジュールを示す側断面図、第
３図は本発明に係るICモジュールの製造方法における樹
脂封止工程においてモールド金型内に封止用樹脂を注入
した状態を示す断面図、第４図は同じく本発明に係るIC
モジュールの製造方法における封止工程において下金型
に端子基板を装填した状態を示す平面図である。これら
の図において前記第５図ないし第７図で説明したものと
同一もしくは同等部材については同一符号を示し、ここ
において詳細な説明は省略する。これらの図において、
11は端子基板１上のゲート跡５を取り除くための遮蔽板
で、この遮蔽板11は厚みが0.1mmのステンレス鋼板によ
って形成されており、上金型７のキャビティ7aと対応す
る開口部11aが形成され、かつゲート7b,ランナー7cと対
向する平坦面11bが形成されている。また、この遮蔽板1
1の幅方向両側部には下金型６の位置決めピン6bと嵌合
される位置決め用透孔11cが複数穿設されている。前記
遮蔽板11における開口部11aの開口面積は、上金型７に
おけるキャビティ7aの開口面積より、換言すれば端子基
板１上にモールド成形された封止樹脂４の外径寸法より
僅かに大きくなるように設定され、封止樹脂４をモール
ド成形した際に遮蔽板11が端子基板１の上側へ抜け易く
なるように設けられている。なお、13は前記上金型７に
穿設され、前記下金型６の位置決めピン6bが臨むピン穴
である。1A and 1B are views showing an IC module formed by the method for manufacturing an IC card module according to the present invention. FIG. 1A is a plan view and FIG. 1B is a line I-I in FIG. A sectional view, FIG. 2 is a side sectional view showing the IC module after release, and FIG. 3 is a resin molding step in a method of manufacturing an IC module according to the present invention, in which a sealing resin is injected into a molding die. FIG. 4 is a sectional view showing a state, and FIG. 4 is an IC according to the present invention.
It is a top view which shows the state which loaded the terminal board in the lower metal mold | die in the sealing process in the manufacturing method of a module. In these figures, the same or equivalent members as those described in FIGS. 5 to 7 are designated by the same reference numerals, and detailed description thereof will be omitted here. In these figures,
Reference numeral 11 denotes a shield plate for removing the gate marks 5 on the terminal board 1. The shield plate 11 is formed of a stainless steel plate having a thickness of 0.1 mm, and the opening 11a corresponding to the cavity 7a of the upper mold 7 is A flat surface 11b that is formed and faces the gate 7b and the runner 7c is formed. Also, this shield 1
A plurality of positioning through holes 11c to be fitted with the positioning pins 6b of the lower mold 6 are formed on both sides of the width direction 1 of the lower die 6. The opening area of the opening 11a in the shielding plate 11 is slightly larger than the opening area of the cavity 7a in the upper mold 7, that is, the outer diameter of the sealing resin 4 molded on the terminal board 1. The shielding plate 11 is set so as to be easily removed to the upper side of the terminal substrate 1 when the sealing resin 4 is molded. Reference numeral 13 is a pin hole formed in the upper mold 7 and facing the positioning pin 6b of the lower mold 6.
このように構成された遮蔽板11を使用してICカード用モ
ジュールを製造するには、先ず、第３図に示すように、
下金型６の凹部6a内に端子電極を下側にして端子基板１
を挿入する。そして、第４図に示すように、前記端子基
板１のICチップ２および金属細線３を開口部11a内に臨
ませて遮蔽板11を下金型６上に載置させる。この際、遮
蔽板11の透孔11c内に下金型６の位置決めピン6bを嵌合
させることによって遮蔽板11が所定位置に配置されるこ
とになる。次いで、上金型７を遮蔽板11上に圧接させ、
端子基板１および遮蔽板11を両金型6,7で型締めする。
この状態で第３図に示すように、ICチップ２が上金型７
のキャビティ7a内に臨むことになる。そして、加熱溶融
された封止用樹脂をランナー7cおよびゲート7bを介して
キャビティ7a内に注入する。この際、封止用樹脂はラン
ナー7cおよびゲート7bと遮蔽板11との間を流され、モー
ルド成形されることになる。封止用樹脂が硬化した後、
第２図に示すように、モールド金型から端子基板１をそ
れぞれ離型させる。そして、遮蔽板11を端子基板１のチ
ップ実装面の上側へ引張り、端子基板１から取り外す。
遮蔽板11を端子基板１から取り外すことによって、第１
図に示すように、ゲート7b内で硬化した封止用樹脂が封
止樹脂４から切断されることになり、樹脂封止工程が終
了する。In order to manufacture an IC card module using the shielding plate 11 configured as described above, first, as shown in FIG.
The terminal substrate 1 with the terminal electrode facing downward in the recess 6a of the lower mold 6.
Insert. Then, as shown in FIG. 4, the shield plate 11 is placed on the lower mold 6 with the IC chip 2 and the thin metal wire 3 of the terminal board 1 facing the opening 11a. At this time, the shielding plate 11 is arranged at a predetermined position by fitting the positioning pin 6b of the lower mold 6 into the through hole 11c of the shielding plate 11. Next, the upper mold 7 is pressed onto the shield plate 11,
The terminal board 1 and the shield plate 11 are clamped with both molds 6 and 7.
In this state, as shown in FIG. 3, the IC chip 2 is placed on the upper die 7
It faces the inside of the cavity 7a. Then, the heat-melted sealing resin is injected into the cavity 7a through the runner 7c and the gate 7b. At this time, the sealing resin is flown between the runner 7c and the gate 7b and the shielding plate 11 to be molded. After the sealing resin has hardened,
As shown in FIG. 2, the terminal substrate 1 is released from the molding die. Then, the shielding plate 11 is pulled to the upper side of the chip mounting surface of the terminal board 1 and removed from the terminal board 1.
By removing the shield plate 11 from the terminal board 1, the first
As shown in the figure, the sealing resin cured in the gate 7b is cut from the sealing resin 4, and the resin sealing step is completed.
なお、ゲート7b内で硬化したゲート跡５として残った封
止用樹脂を封止樹脂４から容易に切断することができる
ように、離型後に封止樹脂４とゲート跡５との接合部に
切り込みを設けてもよい。It should be noted that, in order that the sealing resin remaining as the gate trace 5 cured in the gate 7b can be easily cut from the sealing resin 4, the joint portion between the sealing resin 4 and the gate trace 5 is removed after the mold release. Notches may be provided.
以上説明したように本発明に係るICカード要モジュール
の製造方法にれば、モールド金型における樹脂封止部成
形用キャビティと対応する開口部が形成されかつランナ
ーおよびゲートと対向する面を有する遮蔽板を基板上に
密接させてモールド金型内に型締めし、しかる後、前記
遮蔽板上を通してキャビティ内にモールド用樹脂を注入
するため、封止用樹脂は基板に接することなくモールド
金型のキャビティ内に注入され、離型後に遮蔽板を基板
から取り外すことによってゲートで硬化された封止用樹
脂を基板上から取り除くことができる。したがって、ゲ
ートで硬化された封止用樹脂を容易にしかも再現性良く
確実に取り除くことができ、基板と下金型との境目から
樹脂が漏れ、基板の電極端子側へ廻り込むのを防ぐこと
ができるから信頼性の高いICモジュールを得ることがで
きる。As described above, according to the method of manufacturing the IC card module according to the present invention, the shield having the surface corresponding to the runner and the gate, in which the opening corresponding to the resin molding portion molding cavity in the molding die is formed. The plate is brought into close contact with the substrate and clamped in the molding die, and then the molding resin is injected into the cavity through the shielding plate, so that the sealing resin does not come into contact with the substrate. The sealing resin, which is injected into the cavity and hardened at the gate by removing the shielding plate from the substrate after releasing, can be removed from the substrate. Therefore, the encapsulating resin hardened at the gate can be easily and reliably removed with good reproducibility, and it is possible to prevent the resin from leaking from the boundary between the substrate and the lower mold and wrapping around to the electrode terminal side of the substrate. Therefore, a highly reliable IC module can be obtained.
第１図は本発明に係るICカード用モジュールの製造方法
によって形成されたICモジュールを示す図で、同図
（ａ）は平面図、同図（ｂ）は（ａ）図中Ｉ−Ｉ線断面
図、第２図は離型後のICモジュールを示す側断面図、第
３図は本発明に係るICモジュールの製造方法における樹
脂封止工程においてモールド金型内に封止用樹脂を注入
した状態を示す断面図、第４図は同じく本発明に係るIC
モジュールの製造方法における封止工程において下金型
に端子基板を装填した状態を示す平面図、第５図は従来
のICモジュールを示す図で、同図（ａ）は平面図、同図
（ｂ）は（ａ）図中Ｖ−Ｖ線断面図、第６図は従来のIC
モジュールの製造方法における樹脂封止工程においてモ
ールド金型内に端子基板１を型締めし封止用樹脂を注入
した状態を示す断面図、第７図は同じく封止工程におい
て下金型に端子基板を装填した状態を示す平面図であ
る。 １……端子基板、２……半導体チップ、４……封止樹
脂、６……下金型、７……上金型、7a……キャビティ、
7b……ゲート、7c……ランナー、11……遮蔽板、11a…
…開口部、11b……平坦面。1A and 1B are views showing an IC module formed by the method for manufacturing an IC card module according to the present invention. FIG. 1A is a plan view and FIG. 1B is a line I-I in FIG. A sectional view, FIG. 2 is a side sectional view showing the IC module after release, and FIG. 3 is a resin molding step in a method of manufacturing an IC module according to the present invention, in which a sealing resin is injected into a molding die. FIG. 4 is a sectional view showing a state, and FIG. 4 is an IC according to the present invention.
FIG. 5 is a plan view showing a state in which a lower mold is loaded with a terminal substrate in a sealing step in the method of manufacturing a module, FIG. 5 is a view showing a conventional IC module, FIG. ) Is a sectional view taken along line VV in (a), and FIG. 6 is a conventional IC
FIG. 7 is a cross-sectional view showing a state in which the terminal substrate 1 is clamped into the mold and the sealing resin is injected in the resin sealing step in the method for manufacturing the module, and FIG. It is a top view which shows the state which loaded. 1 ... Terminal board, 2 ... Semiconductor chip, 4 ... Sealing resin, 6 ... Lower mold, 7 ... Upper mold, 7a ... Cavity,
7b ... gate, 7c ... runner, 11 ... shield, 11a ...
… Aperture, 11b… flat surface.
Claims (1)
金型内に型締めし、基板の半導体チップ搭載面上に樹脂
部をモールド成形して半導体チップを封止するICカード
用モジュールの製造方法において、モールド金型におけ
る樹脂封止部成形用キャビティと対応する開口部が形成
されかつランナーおよびゲートと対向する面を有する遮
蔽板を基板上に密接させてモールド金型内に型締めし、
しかる後、前記遮蔽板上を通してキャビティ内にモール
ド用樹脂を注入することを特徴とするICカード用モジュ
ールの製造方法。1. A method of manufacturing an IC card module in which a substrate on which a semiconductor chip is mounted is clamped in a molding die, and a resin portion is molded on the semiconductor chip mounting surface of the substrate to seal the semiconductor chip. In, in the molding die, an opening corresponding to the resin sealing portion molding cavity is formed and a shielding plate having a surface facing the runner and the gate is brought into close contact with the substrate and clamped in the molding die,
Then, a method for manufacturing an IC card module, characterized by injecting a molding resin into the cavity through the shielding plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63284439A JPH0724273B2 (en) | 1988-11-09 | 1988-11-09 | Method of manufacturing module for IC card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63284439A JPH0724273B2 (en) | 1988-11-09 | 1988-11-09 | Method of manufacturing module for IC card |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02129933A JPH02129933A (en) | 1990-05-18 |
| JPH0724273B2 true JPH0724273B2 (en) | 1995-03-15 |
Family
ID=17678561
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63284439A Expired - Lifetime JPH0724273B2 (en) | 1988-11-09 | 1988-11-09 | Method of manufacturing module for IC card |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0724273B2 (en) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0883866A (en) * | 1994-07-15 | 1996-03-26 | Shinko Electric Ind Co Ltd | Production of single side resin sealed semiconductor device and carrier frame therefor |
| NL9401682A (en) * | 1994-10-12 | 1996-05-01 | Fico Bv | Method for encapsulating a chip, and separation strip and mould half to be used with said method |
| FR2734947A1 (en) * | 1995-05-31 | 1996-12-06 | Sgs Thomson Microelectronics | Encapsulation of semiconductor devices partic. those without pin connections |
| FR2734948B1 (en) * | 1995-05-31 | 1997-07-18 | Sgs Thomson Microelectronics | ENCAPSULATION BOX WITH WELDING BALL ARRAY AND ENCAPSULATION METHOD. |
| KR19980069839A (en) * | 1997-01-08 | 1998-10-26 | 듀흐 메리 에스 | Semiconductor molding method and apparatus |
| US6372553B1 (en) * | 1998-05-18 | 2002-04-16 | St Assembly Test Services, Pte Ltd | Disposable mold runner gate for substrate based electronic packages |
| NL1012488C2 (en) * | 1999-07-01 | 2001-01-03 | Fico Bv | Apparatus and method for encapsulating electronic components mounted on a support. |
| JP2002009096A (en) * | 2000-06-20 | 2002-01-11 | Apic Yamada Corp | Method and apparatus for resin sealing |
| KR100600171B1 (en) * | 2000-12-26 | 2006-07-12 | 앰코 테크놀로지 코리아 주식회사 | Circuit board for preventing flash |
| JP6321892B1 (en) * | 2016-12-26 | 2018-05-09 | 新電元工業株式会社 | Electronic device manufacturing method and electronic device |
-
1988
- 1988-11-09 JP JP63284439A patent/JPH0724273B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02129933A (en) | 1990-05-18 |
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