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JP3236312B2 - Component supply management method and component supply management device - Google Patents

Component supply management method and component supply management device

Info

Publication number
JP3236312B2
JP3236312B2 JP18737191A JP18737191A JP3236312B2 JP 3236312 B2 JP3236312 B2 JP 3236312B2 JP 18737191 A JP18737191 A JP 18737191A JP 18737191 A JP18737191 A JP 18737191A JP 3236312 B2 JP3236312 B2 JP 3236312B2
Authority
JP
Japan
Prior art keywords
component
production
component supply
mounting
current production
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP18737191A
Other languages
Japanese (ja)
Other versions
JPH0537199A (en
Inventor
聡 野中
毅 栗林
浩明 倉田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp, Matsushita Electric Industrial Co Ltd filed Critical Panasonic Corp
Priority to JP18737191A priority Critical patent/JP3236312B2/en
Publication of JPH0537199A publication Critical patent/JPH0537199A/en
Application granted granted Critical
Publication of JP3236312B2 publication Critical patent/JP3236312B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Supply And Installment Of Electrical Components (AREA)

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【産業上の利用分野】本発明は、プリント基板上に部品
を実装する部品実装装置における部品供給管理方法およ
び部品供給管理装置に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component on a printed circuit board.
And a component supply management method for a component mounting apparatus
And a component supply management device .

【0002】[0002]

【従来の技術】近年、電子部品をプリント基板面上に自
動実装する無人装置の実用化が急速に進むにつれ、生産
性向上のために、種々の考案がハード,ソフトの両面か
らなされている。
2. Description of the Related Art In recent years, as practical use of an unmanned device for automatically mounting electronic components on a printed circuit board has rapidly progressed, various ideas have been made on both hardware and software to improve productivity.

【0003】以下に従来の電子部品をプリント基板面上
に実装するための、部品供給管理装置について図面を用
いて説明する。図3に示すように、部品実装装置9など
を配列したラインで部品供給部10に対して部品供給装
置11にどの部品を配置するかは、各部品実装装置9ご
と、または、各生産ごとにたとえば(表1)に示すよう
な配列データなどを用いて指示していた。
Hereinafter, a component supply management device for mounting a conventional electronic component on a printed circuit board surface will be described with reference to the drawings. As shown in FIG. 3, which components are arranged in the component supply device 11 with respect to the component supply unit 10 in a line in which the component mounters 9 and the like are arranged is determined for each component mounting device 9 or each production. For example, the instruction is made using sequence data as shown in (Table 1).

【0004】ここで、電子部品を実装するラインとは、
プリント基板に電子部品を実装する工程において、各種
の電子部品を効率よく実装するために機能や能力の異な
る、または同じ種類の部品実装装置9などをいくつか連
結したものである。
[0004] Here, the line for mounting electronic parts is
In the process of mounting electronic components on a printed circuit board, several component mounting devices 9 having different functions or capabilities or the same type are connected in order to efficiently mount various electronic components.

【0005】[0005]

【表1】 [Table 1]

【0006】(表1)において、従来の部品実装装置9
の1号機および2号機を配列した生産ラインでの各部品
供給装置11の配列と生産計画表1の一例を示す。ま
ず、生産計画表1に基づき基板Aを生産する場合につい
て説明する。このとき、部品実装装置9の1号機におけ
る部品供給装置11の配列A−1と、部品実装装置9の
2号機における部品供給装置11の配列A−2を例とし
て考える。ここで部品供給位置Z1,Z2…に電子部品A
BC,DEF,…が供給されるものとする。この配列A
−1,A−2において、生産計画表1にもとづいて基板
Aを生産したのちに、基板Bをつづけて生産するわけで
あるが、基板Bの各部品実装装置9における部品供給装
置11の配列は、各部品実装装置9ごとに指示して配列
B−1,B−2をつくり、この指示に基づき段取り替え
を行って、基板Bを生産している。
In Table 1, a conventional component mounting apparatus 9 is shown.
1 shows an example of the arrangement of the component supply devices 11 and an example of a production plan table 1 in a production line in which the first and second units are arranged. First, a case where the substrate A is produced based on the production plan table 1 will be described. At this time, the arrangement A-1 of the component supply devices 11 in the first component mounting apparatus 9 and the arrangement A-2 of the component supply devices 11 in the second component mounting apparatus 9 will be considered as examples. Here, the electronic components A are located at the component supply positions Z 1 , Z 2 ,.
BC, DEF,... Are supplied. This array A
In -1 and A-2, after the board A is produced based on the production plan table 1, the board B is continuously produced, and the arrangement of the component supply devices 11 in each component mounting apparatus 9 of the board B is performed. Produces the arrays B-1 and B-2 by instructing each of the component mounting apparatuses 9, and performs the setup change based on the instructions to produce the board B.

【0007】[0007]

【発明が解決しようとする課題】しかしながら、上記従
来の構成では、段取り替えをする場合に、同じラインの
部品実装装置が前の生産で使用した部品を次の生産では
別の実装装置で使用しようとしても、配置指示を部品実
装装置ごとに行っているため、別の部品実装装置がどん
な配置であるかがわからない。
However, in the above-described conventional configuration, when the setup is changed, the components used in the previous production by the component mounting apparatus on the same line will be used by another mounting apparatus in the next production. However, since the placement instruction is issued for each component mounting apparatus, it is not possible to know what layout another component mounting apparatus has.

【0008】仮に、各部品実装装置での部品供給装置の
配列をプリントアウトして表示し比較しようとしても、
従来の構成では、作業者が比較しなければならないた
め、比較に時間がかかり、比較結果の精度も悪い。した
がって、前記したように部品交換のための回数も多く、
段取り替え時の効率も悪く、作業者によって比較するた
めの、ミスも多く良品生産ができないという問題点を有
していた。
[0008] Even if an attempt is made to print out, display, and compare the arrangement of the component supply devices in each component mounting apparatus,
In the conventional configuration, since the operator has to perform the comparison, it takes a long time to perform the comparison, and the accuracy of the comparison result is poor. Therefore, as described above, the number of parts replacement is large,
The efficiency at the time of setup change was also poor, and there was a problem that many mistakes were made for comparison by the operator and no good product could be produced.

【0009】本発明は上記従来の問題点を解決するもの
で、部品交換回数の少ない部品供給管理方法および部品
供給管理装置を提供することを目的とする。
SUMMARY OF THE INVENTION The present invention solves the above-mentioned conventional problems, and provides a parts supply management method and a parts supply system with a small number of parts replacements.
It is an object to provide a supply management device .

【0010】[0010]

【課題を解決するための手段】上記目的を達成するた
め、本発明の部品供給管理方法は、プリント基板に部品
を実装する部品実装装置が複数配列されたプリント基板
の実装ラインにおけるそれぞれの部品実装装置の部品供
給部において、供給する部品名称が各々指示された部品
供給装置を複数配置するための部品供給装置の配列を決
する部品供給管理方法であって、現生産と次生産との
1ライン分で使用する部品の部品名称を比較し現生産と
次生産との両方で共通に使用する部品の有無を調べる比
較工程と、前記比較工程の後に、前記比較工程での比較
結果に基づいて、前記1ライン分に関して、次生産の部
品供給装置の配列を、現生産と次生産との両方で共通に
使用する部品の部品供給装置を現生産と同一の部品実装
装置でかつ現生産と同一の位置に配置する同一部品配置
工程と、を備えたことを特徴とする。また、上記目的を
達成するため、本発明の部品供給管理装置は、プリント
基板に部品を実装する部品実装装置が複数配列されたプ
リント基板の実装ラインにおけるそれぞれの部品実装装
置の部品供給部において、供給する部品名称が各々指示
された部品供給装置を複数配置するための部品供給装置
の配列を決定する部品供給管理装置であって、現生産と
次生産との1ライン分で使用する部品の部品名称を比較
し現生産と次生産との両方で共通に使用する部品の有無
を調べる比較手段と、前記比較手段での比較結果に基づ
いて、前記1ライン分に関して、次生産の部品供給装置
の配列を、現生産と次生産との両方で共通に使用する部
品の部品供給装置を現生産と同一の部品実装装置でかつ
現生産と同一の位置に配置する同一部品配置手段と、を
備えたことを特徴とする。
To achieve the above object, a component supply management method according to the present invention is directed to a printed circuit board in which a plurality of component mounting apparatuses for mounting components on the printed circuit board are arranged.
In the component supply unit of each component mounting apparatus in the mounting line, the arrangement of component supply apparatuses for arranging a plurality of component supply apparatuses each having a designated component name to be supplied is determined.
Is a part supply management method to determine the current production and the next production .
A comparison step of comparing part names of parts used in one line and checking for the presence or absence of a part commonly used in both current production and next production; and a comparison in the comparison step after the comparison step
Based on the result, for the one line, the arrangement of the component supply devices of the next production is changed to the component supply device of the component commonly used in both the current production and the next production with the same component mounting device as the current production and And a step of arranging the same parts at the same position as the current production. In order to achieve the above object, component supply management device of the present invention, the component mounting apparatus for mounting components on printed circuit boards are arrayed flops
In the component supply section of each of the component mounting apparatus in the PC board mounting line of component supply apparatus for arranging a plurality of component supplying device for supplying part name is instructed respectively
A part supply management device that determines the arrangement of parts, compares the part names of parts used in one line between the current production and the next production, and determines whether or not there is a part commonly used in both the current production and the next production. Comparing means to be checked , and a comparison result based on the comparison result obtained by the comparing means.
For the one line, the arrangement of the component supply devices for the next production is changed to a component supply device for components commonly used in both the current production and the next production with the same component mounting device and the current production. And the same component arranging means arranged at the same position.

【0011】[0011]

【作用】本発明は上記した構成により、段取り替え時に
おいて、1ライン分に関して、現生産と次生産との両方
で共通に使用する部品の部品供給装置の交換をしないで
済むように、1ライン分に関して、現生産と次生産との
両方で共通に使用する部品の部品供給装置を現生産と同
一の部品実装装置でかつ現生産と同一の位置に配置する
ような次生産の部品供給装置の配列を決定するため、1
回の基板の品種切り替えにおける部品供給装置の交換回
数が大幅に減り、短時間で部品供給装置の交換作業を終
えることができる。従って、段取り替えによる生産ロス
は大幅に減少でき、作業者の負担も大幅に軽減し品質ト
ラブルを防止できる優れた効果を得ることができる。
According to the present invention, the above-described configuration allows one line to be replaced by one line so that it is not necessary to replace a part supply device for parts commonly used in both the current production and the next production at the time of setup change. In terms of minutes, the parts supply device for the next production that is used in both the current production and the next production is placed in the same component mounting device as the current production and at the same position as the current production. To determine the sequence,
The number of replacements of the component supply device in one board type change is greatly reduced, and the replacement of the component supply device can be completed in a short time. Therefore, the production loss due to the setup change can be greatly reduced, the burden on the operator can be greatly reduced, and an excellent effect of preventing quality trouble can be obtained.

【0012】[0012]

【実施例】以下本発明の一実施例について、図面を参照
しながら説明する。
An embodiment of the present invention will be described below with reference to the drawings.

【0013】図1に示すように、部品供給管理装置20
は、プリント基板の生産計画を示す生産指示情報(以
下、生産計画表という)1と、部品実装装置9を動かす
ための実装データ2および2’と、前記した生産指示情
報1と実装データ2、2’から、各生産の部品供給装置
の配置を決定するための部品供給部計画生成工程3から
構成されている。
As shown in FIG. 1, a component supply management device 20
Are production instruction information (hereinafter, referred to as a production plan table) 1 indicating a production plan of a printed circuit board, mounting data 2 and 2 ′ for operating the component mounting apparatus 9, and the above-described production instruction information 1 and mounting data 2, 2 'includes a component supply section plan generation step 3 for determining the arrangement of the component supply devices for each production.

【0014】ここで、実装データ2,2′とは(表2)
に示すように、部品実装装置9を動かすために必要なデ
ータであり、電子部品を実装する位置X,Yと、部品供
給装置11を指定するZ番号と、各部品供給装置11に
対する部品名(実装する部品名)が指示されて、各行が
入れ替え可能であり、他の部品実装装置で使用する実装
データとも入れ替え可能である。
Here, the mounting data 2 and 2 'are (Table 2)
As shown in FIG. 7, the data is necessary for moving the component mounting apparatus 9, and includes positions X and Y where electronic components are mounted, a Z number designating the component supplying apparatus 11, and a component name for each component supplying apparatus 11 ( A component name to be mounted) is designated, and each row can be replaced, and can be replaced with mounting data used in another component mounting apparatus.

【0015】[0015]

【表2】 [Table 2]

【0016】つぎに、部品供給部計画生成工程3につい
て説明する。図2のフローチャートに示すように、現生
産の1ライン分の実装データを入力する工程(以下、現
生産データ入力工程と呼ぶ)4、次生産の1ライン分の
実装データを入力する工程(以下、次生産データ入力工
程と呼ぶ)5、前生産と次生産で使用する部品の部品名
称を比較する工程(以下、データ比較工程と呼ぶ)6、
次生産の実装データの同一部品の行を現生産の同一部品
の行の位置へ配置する工程(以下、同一部品配置工程と
呼ぶ)7、配置されなかった残りの部品を配置する工程
(以下、残部品配置工程と呼ぶ)8から構成され、現生
産データ入力工程4と次生産データ入力工程5におい
て、それぞれ現生産,次生産の1ライン分の実装データ
を入力し、データ比較工程6において、現生産の1ライ
ン分の実装データと次生産の1ライン分の実装データか
ら使用部品を1つづつ比較し、同一部品がある場合に
は、同一部品配置工程7において、同一実装装置で実装
させるため、同一部品実装データは、同一実装装置用の
データへ振り分けられる。そして次生産に実装する部品
の数(次生産の実装データの行数)だけ、データ比較工
程6と同一部品配置工程7を繰り返す。そして、次生産
で新たに使用する部品(同一部品比較工程7において配
置されなかった部品)は、残部品配置工程8において残
っている適当な位置に配置される。
Next, the part supply part plan generation step 3 will be described. As shown in the flowchart of FIG. 2, a step of inputting mounting data of one line of the current production (hereinafter, referred to as a current production data input step) 4 and a step of inputting mounting data of one line of the next production (hereinafter, referred to as a current production data input step) 5, a process for inputting the next production data), a process for comparing component names of components used in the previous production and the next production (hereinafter, referred to as a data comparison process) 6,
A step of arranging the row of the same part of the mounting data of the next production at the position of the row of the same part of the current production (hereinafter referred to as an identical part arranging step) 7; In the current production data input step 4 and the next production data input step 5, the mounting data for one line of the current production and the next production are input, respectively, and in the data comparison step 6, The components to be used are compared one by one from the mounting data for the current production line and the mounting data for the next production line, and if there is the same component, it is mounted by the same mounting apparatus in the same component placement step 7. Therefore, the same component mounting data is sorted into data for the same mounting device. Then, the data comparison step 6 and the same component placement step 7 are repeated as many times as the number of components to be mounted in the next production (the number of rows of mounting data in the next production). Then, the parts to be newly used in the next production (parts not arranged in the same part comparison step 7) are arranged at the remaining appropriate positions in the remaining part arrangement step 8.

【0017】以上述べたように、部品供給部計画生成工
程3にて、生成された実装データ2′による部品供給装
置の配列は、(表3)に示すようになる。これによる
と、従来の技術では、部品供給装置の交換回数が、4回
あったのに対して、1回ですむことがわかる。
As described above, the arrangement of the component supply devices based on the mounting data 2 'generated in the component supply section plan generation step 3 is as shown in (Table 3). According to this, it is understood that in the conventional technique, the number of replacements of the component supply device is four, but only one.

【0018】[0018]

【表3】 [Table 3]

【0019】なお、以上の説明において、実装データ
は、部品実装の座標値と部品配列が、1つのデータであ
ったが、それぞれが2つに分かれていて、リンクしてい
てもよい。さらに、部品供給部計画生成工程において、
入力を実装データとしたが、CADからのデータを入力
とし、実装装置への振り分け工程を含んでもよい。さら
に、部品実装装置がラインになっているものとして説明
したが、各部品実装装置が独立していて連結していなく
てもよい。
In the above description, the mounting data is one data of the coordinate value of the component mounting and the component array, but each may be divided into two and linked. Furthermore, in the part supply part plan generation process,
Although the input is the mounting data, the data from the CAD may be an input and a process of distributing to the mounting apparatus may be included. Furthermore, although the description has been made assuming that the component mounting apparatuses are lines, each component mounting apparatus may be independent and not connected.

【0020】[0020]

【発明の効果】以上のように本発明は、段取り替え時に
おいて、現生産と次生産との両方で共通に使用する部品
の部品供給装置の交換をしないで済むように、現生産と
次生産との両方で共通に使用する部品の部品供給装置を
現生産と同一の部品実装装置でかつ現生産と同一の位置
に配置するような次生産の部品供給装置の配列データを
作成するため、1回の品種切り替えにおける部品供給装
置の交換回数が大幅に減り、短時間で部品供給装置の交
換作業を終えることができる。従って、段取り替えによ
る生産ロスは大幅に減少でき、作業者の負担も大幅に軽
減し品質トラブルを防止できる優れた効果を得ることが
できる。
As described above, according to the present invention, when the setup is changed,
Used in both current and next production
To avoid the need to replace parts supply equipment
Parts supply equipment for parts commonly used for both next production
The same component mounting equipment as the current production and the same position as the current production
Array data of the next production parts supply device
Component supply equipment in one type change
The number of replacements of the parts has been greatly reduced,
The replacement work can be completed. Therefore, due to setup change
Production loss can be greatly reduced, and the burden on workers is greatly reduced.
It is possible to obtain excellent effects that can reduce quality problems
it can.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の部品供給管理装置のブロック図FIG. 1 is a block diagram of a component supply management device of the present invention.

【図2】部品供給部計画生成工程のフローチャートFIG. 2 is a flowchart of a part supply unit plan generation process.

【図3】部品実装装置の外観斜視図FIG. 3 is an external perspective view of the component mounting apparatus.

【符号の説明】[Explanation of symbols]

1 生産計画表 2、2’ 実装データ 3 部品供給部計画生成工程 9 部品実装装置 20 部品供給管理装置 DESCRIPTION OF SYMBOLS 1 Production plan table 2, 2 'Mounting data 3 Component supply part plan generation process 9 Component mounting device 20 Component supply management device

───────────────────────────────────────────────────── フロントページの続き (72)発明者 倉田 浩明 大阪府門真市大字門真1006番地 松下電 器産業株式会社内 (56)参考文献 特開 昭63−256322(JP,A) 特開 平2−263500(JP,A) 特開 平3−124100(JP,A) ──────────────────────────────────────────────────続 き Continuation of the front page (72) Inventor Hiroaki Kurata 1006 Odakadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (56) References JP-A-63-256322 (JP, A) JP-A-2-2 263500 (JP, A) JP-A-3-124100 (JP, A)

Claims (8)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】 プリント基板に部品を実装する部品実装
装置が複数配列されたプリント基板の実装ラインにおけ
るそれぞれの部品実装装置の部品供給部において、供給
する部品名称が各々指示された部品供給装置を複数配置
するための部品供給装置の配列を決定する部品供給管理
方法であって、 現生産と次生産との1ライン分で使用する部品の部品名
称を比較し現生産と次生産との両方で共通に使用する部
品の有無を調べる比較工程と、 前記比較工程の後に、前記比較工程での比較結果に基づ
いて、前記1ライン分に関して、次生産の部品供給装置
の配列を、現生産と次生産との両方で共通に使用する部
品の部品供給装置を現生産と同一の部品実装装置でかつ
現生産と同一の位置に配置する同一部品配置工程と、を
備えたことを特徴とする部品供給管理方法。
1. Component mounting for mounting components on a printed circuit board
In a printed circuit board mounting line where multiple devices are arranged
In the component supply section of the component mounting apparatus of Rusorezore, a component supply management method for determining the arrangement of the component supply apparatus for arranging a plurality of component supplying device for supplying part name is instructed respectively, current production and the next A comparison step of comparing the part names of parts used in one line of production and checking for the presence / absence of parts commonly used in both the current production and the next production; and a comparison in the comparison step after the comparison step Based on the result
For the one line, the arrangement of the component supply devices for the next production is changed to the component supply device for the components commonly used in both the current production and the next production with the same component mounting device as the current production and the current production. A component placement step of placing the components at the same position.
【請求項2】 同一部品配置工程の後に、次生産で新た
に使用する部品の部品供給装置をいずれかの部品実装装
置の未配置である位置に配置する残部品配置工程を備え
た請求項1記載の部品供給管理方法。
2. The method according to claim 1, further comprising, after the same component arranging step, a remaining component arranging step of arranging a component supplying device for a component newly used in the next production at a position where one of the component mounting devices has not been arranged. Component supply management method described.
【請求項3】 現生産と次生産とで使用する部品を指定
する実装データを入力するデータ入力工程を備えた請求
項1または請求項2記載の部品供給管理方法。
3. The component supply management method according to claim 1, further comprising a data input step of inputting mounting data for specifying a component to be used in the current production and the next production.
【請求項4】 現生産と次生産とで使用する部品を指定
するCADデータを入力するデータ入力工程を備えた請
求項1または請求項2記載の部品供給管理方法。
4. The parts supply management method according to claim 1, further comprising a data input step of inputting CAD data specifying parts used in the current production and the next production.
【請求項5】 プリント基板に部品を実装する部品実装
装置が複数配列されたプリント基板の実装ラインにおけ
るそれぞれの部品実装装置の部品供給部において、供給
する部品名称が各々指示された部品供給装置を複数配置
するための部品供給装置の配列を決定する部品供給管理
装置であって、 現生産と次生産との1ライン分で使用する部品の部品名
称を比較し現生産と次生産との両方で共通に使用する部
品の有無を調べる比較手段と、前記比較手段での比較結果に基づいて、前記1ライン分
に関して、 次生産の部品供給装置の配列を、現生産と次
生産との両方で共通に使用する部品の部品供給装置を現
生産と同一の部品実装装置でかつ現生産と同一の位置に
配置する同一部品配置手段と、を備えたことを特徴とす
る部品供給管理装置。
5. Component mounting for mounting components on a printed circuit board
In a printed circuit board mounting line where multiple devices are arranged
In the component supply section of the component mounting apparatus of Rusorezore, a component supply management device for determining an arrangement of the component supply apparatus for arranging a plurality of component supplying device for supplying part name is instructed respectively, current production and the next comparison means to check for parts used in common in both the comparing part name of the part to be used current production and the next production in one line with the production, based on the comparison result in said comparing means, said 1 line
Regarding the arrangement of the component supply devices for the next production, the component supply devices for components commonly used in both the current production and the next production are arranged at the same component mounting device as the current production and at the same position as the current production. A component supply management device, comprising: a same component placement unit.
【請求項6】 同一部品配置手段が部品供給装置を配置
させた後に、次生産で新たに使用する部品の部品供給装
置をいずれかの部品実装装置の未配置である位置に配置
する残部品配置手段を備えた請求項5記載の部品供給管
理装置。
6. A remaining component arrangement for arranging a component supply device of a component newly used in the next production at a position where one of the component mounting devices has not been arranged after the same component arrangement means arranges the component supply device. 6. The component supply management device according to claim 5, further comprising: means.
【請求項7】 現生産と次生産とで使用する部品を指定
する実装データを入力するデータ入力手段を備えた請求
項5または請求項6記載の部品供給管理装置。
7. The component supply management device according to claim 5, further comprising data input means for inputting mounting data for designating components used in the current production and the next production.
【請求項8】 現生産と次生産とで使用する部品を指定
するCADデータを入力するデータ入力手段を備えた請
求項5または請求項6記載の部品供給管理装置。
8. The parts supply management device according to claim 5, further comprising data input means for inputting CAD data for specifying parts used in the current production and the next production.
JP18737191A 1991-07-26 1991-07-26 Component supply management method and component supply management device Expired - Lifetime JP3236312B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18737191A JP3236312B2 (en) 1991-07-26 1991-07-26 Component supply management method and component supply management device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18737191A JP3236312B2 (en) 1991-07-26 1991-07-26 Component supply management method and component supply management device

Publications (2)

Publication Number Publication Date
JPH0537199A JPH0537199A (en) 1993-02-12
JP3236312B2 true JP3236312B2 (en) 2001-12-10

Family

ID=16204838

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18737191A Expired - Lifetime JP3236312B2 (en) 1991-07-26 1991-07-26 Component supply management method and component supply management device

Country Status (1)

Country Link
JP (1) JP3236312B2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018008157A1 (en) 2016-07-08 2018-01-11 富士機械製造株式会社 Production plan creation system and production plan creation method

Also Published As

Publication number Publication date
JPH0537199A (en) 1993-02-12

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