JP3251711B2 - Printed wiring board and method of manufacturing printed wiring board - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates relates to a method of manufacturing a printed wiring board and printed wiring board, particularly the wiring layers includes an arrangement for connecting a conductor wire portion of the through-type, and capable of high-density wiring and mounting Reliable printed wiring board and such printing
While the wiring board aims to reduce factory number, to methods of yield can favorably manufactured.

[0002]

2. Description of the Related Art For example, in a double-sided printed wiring board or a multilayer printed wiring board, electrical connection between wiring layers such as double-sided conductive patterns is performed as follows. That is, in the case of a double-sided printed wiring board, a predetermined position of a double-sided copper foil-clad board is subjected to drilling (piercing), and the entire surface including the inner wall surface of the drilled hole is subjected to chemical plating. The electrical connection between the wiring layers is improved by increasing the thickness of the metal layer on the inner wall surface of the hole by electroplating to increase the reliability of conduction. In the case of a multilayer printed wiring board, after patterning the copper foil stretched on both sides of the substrate, the copper foil is laminated and arranged on the patterning surface via an insulating sheet (for example, prepreg) and heated. After being integrated by pressing, as in the case of the above-mentioned double-sided printed wiring board, electrical connection between wiring layers by drilling and plating, and patterning of surface copper foil are performed to form a multilayer printed wiring board. It has gained. In the case of a multilayer printed wiring board having more wiring layers, it can be manufactured by a method of increasing the number of double-sided printed wiring boards interposed in the middle. In the method for manufacturing a printed wiring board, as a means for performing electrical connection between wiring layers without depending on a plating method, a hole is formed in a predetermined position on a double-sided copper foil-clad board, and a conductive paste is printed in the hole. For example, a method of hardening the resin of the conductive paste that has been poured into the holes and hardening the wiring to electrically connect the wiring layers is also performed.

[0003]

As described above, in a method of manufacturing a printed wiring board using a plating method for electrical connection between wiring layers, a hole for electrical connection between wiring layers is formed in a substrate. Drilling (perforation) processing, a plating step including the inner wall surface of the perforated hole, and the like are required, and there are drawbacks in that the manufacturing process of the printed wiring board is redundant and the process management is complicated. On the other hand, in the case of a method of embedding a conductive paste in a hole for electrical connection between wiring layers by printing or the like,
A drilling step is required as in the case of the plating method.
Moreover, it is difficult to uniformly (uniformly) inject and embed the conductive paste in the bored hole (especially when the hole diameter is small), and there has been a problem in the reliability of electrical connection. In any case, the necessity of the perforation step and the like is reflected in the cost and yield of the printed wiring board, and has a drawback that it is impossible to respond to a demand for cost reduction.

In the case of the electrical connection between the wiring layers, a conductor hole for connection between wiring layers is provided on the front and back surfaces of the printed wiring board. Since they cannot be formed and arranged, and furthermore, it is not possible to mount electronic components, there is a problem that the improvement of the wiring density is restricted and the improvement of the mounting density of the electronic components is hindered. In other words, the printed wiring board obtained by the conventional manufacturing method has been demanded to reduce the size of circuit devices by high-density wiring and high-density mounting, and to further reduce the size of electronic devices.
It cannot be said that the method can be sufficiently satisfied, and a practically more effective method of manufacturing a printed wiring board including the above cost is desired.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and provides a method for manufacturing a highly reliable printed wiring board with a high yield, which enables a higher density wiring and mounting with a simple process. Aim.

[0006]

According to a first aspect of the present invention, there is provided a synthetic resin-based support, and a substantially conical conductor wiring penetrated in the thickness direction of the synthetic resin-based support so as to be isolated from each other. made by and a part, the other front bottom of Kishirube body wiring portion is exposed substantially flat shape on one main surface of the synthetic resin support, the top of the front Kishirube body wiring portion synthetic resin support it is printed circuit board, characterized in that forms a structure that protrudes from the main surface. Claim 2
The invention according to claim 1 is the printed wiring board according to claim 1, wherein
The thickness of the synthetic resin-based support depends on the area around the conductor wiring area and the conductor wiring area.
Characterized in that it is substantially equal in thickness with the part away from
You. According to a third aspect of the present invention, there is provided a synthetic resin-based support,
A support base laminated on one main surface of the resin support,
The surface is brought into close contact with the support base and in the thickness direction of the support,
Substantially conical conductor wiring that is buried and isolated from each other
And a top portion of the conductor wiring portion is made of synthetic resin.
That it is configured to protrude from the other main surface of the
It is a printed wiring board characterized by the following. A fourth aspect of the present invention, the synthetic
Laminated on one main surface of a resin-based support and the synthetic resin-based support
The other main surface of the support base disposed and the synthetic resin-based support
The conductive metal foil stacked and arranged on one end of the large diameter
The tip is flattened by plastic deformation due to close contact with the support base
The other end face is in close contact with the conductive metal foil and the synthetic resin
The conductor wiring part penetrated and buried in the thickness direction of the system support
It is a printed wiring board characterized by comprising. Claim
The invention according to claim 5 is the seal according to any one of claims 1 to 4.
In the printed wiring board, the support base is made of a conductive metal foil.
It is characterized by becoming. The invention of claim 6 is the invention of claim 1
5. The printed wiring board according to claim 4, wherein
The support base is made of a synthetic resin. Claim 7
The invention according to claim 6, wherein the printed wiring board according to claim 6;
A wiring pattern is formed in an area of the holder in contact with the conductor wiring section.
It is characterized by having been done. The invention of claim 8 is
A wiring pattern is formed on the main surface, and the wiring pattern
It is made of synthetic resin with conductor wiring parts protruding from
A support base, and the conductor wiring portions on both main surfaces of the support base.
Synthetic resin layered by inserting and embedding in the thickness direction
And a conductor wiring on each of the synthetic resin-based supports.
A conductive metal foil that is closely stacked on the
It is a printed wiring board characterized by comprising. The invention according to claim 9 is a step of arranging the main surface of the synthetic resin sheet in contact with the main surface of the support base having the conductive bumps formed at predetermined positions in a stacked manner, and A step of laminating and disposing a conductive metal foil on the laminate, and applying a second pressure to the laminate on which the conductive metal foil is laminated to connect a tip of a conductive bump to the conductive metal foil by deformation, thereby forming a through-type conductor. And a step of forming a wiring portion. The invention according to claim 10 is a step of laminating and disposing the synthetic resin-based sheet on the main surface of the support base on which the conductor bump group is formed at a predetermined position so that the main surface of the synthetic resin-based sheet is in contact with the main surface. The pressed body having elasticity or flexibility is arranged on the side, and the laminated body is heated and the resin content of the synthetic resin-based sheet becomes a plastic state or a glass transition temperature or more. A step of inserting and exposing the tip of the conductive bump in the thickness direction of the synthetic resin sheet, a step of laminating and arranging a conductive metal foil on the surface of the penetrating and exposing the tip of the conductive bump, and laminating the conductive metal foil Forming a through-type conductor wiring portion by subjecting the arranged laminate to secondary pressurization, connecting the tip of the conductor bump to the conductive metal foil surface by deformation, and forming a through-type conductor wiring portion. This is a method for manufacturing a printed wiring board. According to an eleventh aspect of the present invention, in the method for manufacturing a printed wiring board according to the tenth aspect , the synthetic resin sheet is a synthetic resin sheet reinforced with an insulating cloth or mat. Claim 12
According to a tenth aspect of the present invention, in the method for manufacturing a printed wiring board according to the tenth or eleventh aspect , the support base is a conductive metal foil. The invention according to claim 13 is a step of laminating the main surface of the synthetic resin-based sheet in contact with the main surface of the support base on which the conductive bump group is formed at a predetermined position; Then, a pressed body having elasticity or flexibility is arranged via a thin film that is small in elongation and easily breakable, and the laminated body is heated so that the resin content of the synthetic resin sheet becomes a plastic state or a glass transition temperature or higher. And then applying primary pressure from the supporting base side to penetrate / expose the tip of the conductor bump in the thickness direction of the synthetic resin sheet; and forming a conductive metal foil on the penetration / exposed surface of the tip of the conductor bump. And laminating the conductive metal foil to form a through-type conductive wiring portion by applying a secondary pressure to the laminated body on which the conductive metal foil is laminated to connect the tip of the conductive bump to the conductive metal foil surface by deformation. A printed wiring board characterized by comprising the steps of: It is a production method. According to a fourteenth aspect of the present invention, there is provided a method for manufacturing a printed wiring board according to the thirteenth aspect, wherein the synthetic resin sheet is a synthetic resin sheet reinforced with an insulating cloth or mat. According to a fifteenth aspect of the present invention, a prepreg-based sheet whose main surface is a cloth having a pitch larger than the diameter of the conductor bumps is brought into contact with a main surface of a support base having a group of conductor bumps formed at predetermined positions. Laminating and arranging, arranging a pressed body having elasticity or flexibility on the prepreg sheet surface side of the laminate, heating the laminate, and the resin component of the synthetic resin sheet is in a plastic state or a glass transition temperature or higher. After that, a step of firstly applying pressure from the support base side to penetrate and expose the tip of the conductor bump in the thickness direction of the prepreg sheet; A step of laminating and arranging the foils, and applying a secondary pressure to the laminate in which the conductive metal foils are laminated to connect the tips of the conductor bumps to the surface of the conductive metal foil by plastic deformation, thereby forming a through-type conductor wiring portion. Forming and forming Method of manufacturing a printed wiring board characterized by comprising. The invention according to claim 16 is a step of sequentially laminating a synthetic resin-based sheet and a releasable metal foil on a main surface of a support base on which a conductor bump group is formed at a predetermined position;
The support base side of the laminate is brought into contact with one roller surface, and heated and pressurized and passed between twin rolls formed with the other roller, and primary pressurized from the support base side to make the tip of the conductor bump a synthetic resin sheet. Step of penetrating and exposing in the thickness direction of, and removing the releasable metal foil, and
A method for manufacturing a printed wiring board, comprising a step of laminating and disposing a conductive metal foil on an exposed surface. The invention of Claim 17 is Claim 9 , Claim 10 , Claim 13 ,
The method of manufacturing a printed wiring board according to any one of claims 15 or claim 16, the through-type conductive wiring portions are connected, and by etching the conductive metal foil are integrated, the transmembrane Forming a wiring pattern connected to the conductor wiring portion.

In the present invention, examples of the support base on which the conductor bumps are formed include synthetic resin sheets having good releasability and conductive sheets (foil).
The support base may be a single sheet or a patterned one, and the shape is not particularly limited. Further, the conductor bump group is not limited to one main surface,
It is also possible to use ones formed on both main surfaces.

Here, the conductive bumps are inserted through the synthetic resin sheet or the like at the stage of heating and pressurizing in a state where the resin component of the synthetic resin sheet is in a plastic state or a temperature higher than the glass transition temperature, that is, in the first pressurizing step. A material capable of plastically deforming the tip in the secondary pressurization step, for example, conductive powder such as silver, gold, copper, and solder powder, alloy powder of these, or composite (mixed). A) A conductive composition prepared by mixing a metal powder and a binder component such as a polycarbonate resin, a polysulfone resin, a polyester resin, a phenoxy resin, a phenol resin, and a polyimide resin, or a conductive metal. When the bump group is formed of a conductive composition, a bump having a high aspect ratio can be formed by, for example, a printing method using a relatively thick metal mask. The height of the bump group is preferably about 100 to 400 μm, and the height of the bump group is such that a tip of the synthetic resin sheet or the like can be inserted (penetrated) and exposed, and a height of a plurality of synthetic resin sheets or the like can be exposed. Those having a height that can be inserted (penetrated) and exposed may be appropriately mixed.

On the other hand, means for forming a bump group with a conductive metal include: (a)
For example, fine metal souls such as tin, silver, gold, copper, and solder may be sprayed on a surface of a support base provided with an adhesive layer in advance and selectively fixed (even if a mask is arranged at this time). (B) When using a copper foil or the like as the support base, print and pattern a plating resist, and then plate with copper, tin, gold, silver, solder, etc., and selectively form minute metal pillars (bumps) And (c) applying and patterning a solder resist on the surface of the supporting substrate, and immersing it in a solder bath to selectively form a group of minute metal columns (bumps). Here, the minute metal pillar having no minute metal equivalent to a bump may have a multilayer structure or a multilayer shell structure formed by combining different kinds of metals. For example, copper may be used as a core and the surface may be coated with a layer of gold or silver to provide oxidation resistance, or copper may be used as a core and the surface may be coated with a solder layer to provide solder bonding. In the present invention, when the bump group is formed of a conductive composition, the steps and the like can be further simplified as compared with the case where the bump group is formed by means such as a plating method, which is effective in terms of cost reduction.

In the present invention, as the synthetic resin-based sheet into which the conductor bump group is inserted and which forms a penetrating-type conductor wiring portion, for example, a thermoplastic resin film (sheet) can be mentioned, and its thickness is 50%. About 800 µm is preferable. Here, examples of the thermoplastic resin sheet include sheets such as polycarbonate resin, polysulfone resin, thermoplastic polyimide resin, polyethylene tetrafluoride resin, polypropylene hexafluoride resin, and polyether ether ketone resin. The thermosetting resin sheet held in a pre-cured state includes epoxy resin, bismaleimide triazine resin, polyimide resin, phenol resin, polyester resin, melamine resin, butadiene rubber, butyl rubber, natural rubber, neoprene rubber,
Examples include sheets of raw rubber such as silicone rubber.
These synthetic resins may be used alone or may contain an insulating inorganic or organic filler, and may be further combined with a reinforcing material such as glass cloth or mat, organic synthetic fiber cloth or mat, or paper. It may be a sheet. When using a prepreg sheet using a glass cloth or an organic synthetic fiber cloth as a reinforcing material, it is more desirable to select and set the diameter of the conductive bump to be smaller than the pitch of the cloth.

Further, according to the present invention, a laminate is formed by laminating a main surface of a synthetic resin sheet (including a prepreg sheet) in contact with a main surface of a support base or the like on which a conductor bump group is formed. When heating and pressurizing (primary pressing)
As the pressed body on the synthetic resin sheet side, it is necessary to select a material that is elastically deformed when the primary press is performed. The reason is that, in the primary pressing step, when the pressed body made of a material that is elastically deformed when the synthetic resin-based sheet is pressed is set to a form (state) that receives the primary pressing, This is because it has been experimentally confirmed that the tip of the conductor bump easily and reliably penetrates a synthetic resin-based sheet in which the resin component is heated to a plastic state or a glass transition temperature or higher.
At this time, if a thin film having a low elongation and a small breakage such as an aluminum foil is interposed between the pressed body and the synthetic resin-based sheet, the tip of each conductor bump can be more easily and reliably made of synthetic resin. It was also experimentally confirmed that the system sheet was inserted. In the first pressurizing step, for example, while the support base and the synthetic resin-based sheet on which the bump group is formed are rewound from the roll, for example, a heat-resistant hard resin made of a metal having a small size and deformation and being heatable. It is preferable to pass between a roller made of plastic or ceramic and a roller which is elastically deformed when pressed, for example, a roller made of rubber or polytetrafluoroethylene resin as described above.

[0012] On the other hand, the secondary pressing is performed by plastically deforming the tip of the bump group penetrating the synthetic resin sheet layer onto the conductive metal foil surface laminated and arranged on the penetrating / exposed surface. The connection is for electrical connection, and heating is not necessarily required. However, heating may be added similarly to the case of the primary pressurization. In any case, at the stage of the secondary pressurization, a conductive metal foil or the like is easily bonded and integrated by the welding action of the resin to the synthetic resin sheet and plastically deforms the tip of each of the penetrated conductor bumps. On both sides, a pressing member made of metal, hard heat-resistant resin, or ceramic with small dimensions and deformation is used. In this embodiment, it is desirable to use a roller system according to the primary pressing step.

[0013]

According to the method of manufacturing a printed wiring board of the present invention,
The conductor wiring portion between the layers electrically connecting the wiring layers is in a state in which the tip of the conductive bump is first heated to a plastic state or a glass transition temperature or higher by primary pressurization in a so-called lamination and integration process. With a high precision and assured insertion (penetration) at a predetermined position of the synthetic resin sheet forming the interlayer insulating layer
Then, in the next secondary pressurization, the plastic state of the synthetic resin-based sheet and the plastic deformation accompanying the press-contact of the tip of the conductive bump to the conductive metal foil surface ensure reliable lamination integration and reliability. A high electrical connection between the wiring layers is achieved. In other words, a highly accurate and highly reliable electrical connection can be formed at an arbitrary position (location) between fine wiring layers while simplifying the process. It can be manufactured at a low cost. In addition, since there is no need to form connection holes in the electrical connection between the wiring layers, a printed wiring board capable of high-density wiring and high-density mounting can be obtained.

[0014]

FIG. 1 (a), (b), (c), FIG. 2 (a),
(b), FIG. 3 (a), (b), FIG. 4 (a), (b) and FIG. 5 (a),
An embodiment of the present invention will be described with reference to FIGS.

Embodiment 1 FIGS. 1 (a) and 1 (b) and FIGS. 2 (a) and 2 (b) schematically show an embodiment of this embodiment. First, a silver-based conductive paste (trade name, Unimec H9141, Hokuriku Paint Co., Ltd.) using polyethersulfone as a binder was used as a supporting base sheet 1 using 35 μm thick electrolytic copper foil used in the manufacture of printed wiring boards. ), A metal mask having a hole with a diameter of 0.3 mm was prepared at a predetermined position on a stainless steel plate having a thickness of 200 μm. Then, on one surface of the copper foil (supporting base sheet),
The metal mask is positioned and arranged, and the conductive paste is printed. After the printed conductive paste is dried, printing is repeated three times by using the same mask and printing again at the same position, and the height is less than 200 μm. Was formed (formed). FIG. 1A is a side view showing the shape of the conductive bump 2 thus formed.

On the other hand, a polyetherimide resin film (trade name, Sumilite FS-1400, Sumitomo Bakelite KK) having a thickness of 100 μm was prepared as a synthetic resin-based sheet 3, and as shown in FIG. Synthetic resin sheet 3
The support base sheet 1 was positioned and arranged so as to face the formed conductive bumps 2 to form a laminate. afterwards,
On the back surface of the synthetic resin sheet 3, a silicone rubber plate having a thickness of about 3 mm is disposed as a pressed body 4, and further, a backing plate 5 is disposed and mounted on a press device having a heating, pressing and cooling mechanism. Heated without. When the temperature rose to 250 ° C., cooling was performed while primary pressure was applied at 3 MPa. By this primary pressing, as shown in a cross-sectional view in FIG. 1 (c), the tips of the conductive bumps 2 on the surface of the supporting base sheet 1 remain intact,
A laminate in which the synthetic resin sheet 3 was accurately inserted was obtained.

Next, as shown in cross section in FIG.
On the penetrating surface of the end of the conductive bump 2 of the laminate, a thickness of 35 μm
270 m of electrolytic copper foil 6 and a polyimide resin film as a protective film 7 on the copper foil 6 surface.
It was placed between hot plates of a hot press maintained at a temperature of not more than 270 ° C. (not shown).
After the temperature reached 2 ° C., a secondary pressure of 2 MPa was applied as the resin pressure, and the resin was taken out after cooling, the protective film (sheet) 7 was peeled off, and the cross section was observed. As shown, the copper foil 6 is bonded and integrated with the synthetic resin sheet 3, and each conductive bump 2 penetrated (penetrated) through the synthetic resin sheet 3 has a leading end on the surface in contact with the copper foil 6. Is plastically deformed (crushed), is formed on the same plane, is connected to the surface of the copper foil 6, and has a double-sided copper-clad printing provided with a conductor wiring portion 8 penetrating the synthetic resin sheet 3 in the thickness direction. A wiring board substrate was obtained.

A conventional etching resist ink (trade name, PSR-40) is applied to both sides of the double-sided copper-clad printed wiring board substrate.
00H, solar ink KK) was screen-printed to mask the conductor pattern portion, and then etched using cupric chloride as an etchant, and then the resist mask was peeled off to obtain a double-sided printed wiring board. When a double-sided printed wiring board manufactured in this manner was subjected to a usual electrical check, no problems such as defects or reliability were found in all connections.

In this embodiment, when an aluminum foil having a thickness of about 15 μm is interposed between the pressed body 4 and the surface of the synthetic resin sheet 3 in the primary pressing step, each conductive bump 2 is in a good position. It was confirmed that the synthetic resin sheet 3 was more reliably inserted (penetrated) while maintaining the accuracy, and the lifting of the synthetic resin sheet 3 around the bumps 2 was surely prevented.

Embodiment 2 FIGS. 3A and 3B are cross-sectional views schematically showing an embodiment of the present embodiment. In this embodiment, in the case of the first embodiment,
3 in the same manner as in Example 1 except that a polyimide resin film having a thickness of 50 μm was used as the supporting base sheet 1.
As shown in FIG. 3 (a), the laminated body was laminated and subjected to a primary press treatment and a secondary press treatment under the same conditions under the same conditions, and as shown in FIG. A single-sided copper-clad printed wiring board substrate having a conductor wiring portion 8 which is plastically deformed to the foil 5 and densely connected to the foil 5 and penetrates the synthetic resin sheet 3 in the thickness direction with the other end surface exposed is produced.

A normal etching resist ink (trade name, PSR-4000H, solar ink KK) is screen-printed on the copper foil 5 surface of the printed wiring board substrate to mask the conductor pattern portion, After performing an etching process using copper 2 as an etchant, the resist mask was peeled off to obtain a double-sided printed wiring board having a penetrating conductor wiring portion 8. The printed wiring board thus manufactured was subjected to a usual electrical check. As a result, no problems such as defects or reliability were found in all the connections.

The conductor wiring portion 8 penetrating through the one main surface.
In a printed wiring board whose end face is exposed, the exposed end face can be used as a connection pad, a lead terminal, or the like, and is suitable for, for example, a configuration of a backside mounting type mounting circuit device.

Example 3 This example is the same as Example 1 except that a 200 μm-thick prepreg made of glass cloth impregnated with epoxy resin was used as the synthetic resin sheet 3. After setting the laminated body in the press device as in the case of 1, when heating is started and the temperature reaches 120 ° C, a resin pressure of 2 MPa is applied, cooled, and the primary pressurized product is taken out. After placing the foil and heating, apply 2 MPa resin pressure,
After further heating and holding at 170 ° C. for 1 hour, and then cooling, secondary pressurization is performed by taking out the copper foil, and a double-sided copper-clad copper foil having a conductor wiring portion 8 in which both copper foils 1 and 6 are connected in a penetrating manner. A substrate for a printed wiring board was prepared.

A conventional etching resist ink (trade name, PSR-40) is applied on both sides of this double-sided copper-clad printed wiring board substrate.
00H, solar ink KK) was screen-printed to mask the conductor pattern portion, and then etched using cupric chloride as an etchant, and then the resist mask was peeled off to obtain a double-sided printed wiring board. When a double-sided printed wiring board manufactured in this manner was subjected to a usual electrical check, no problems such as defects or reliability were found in all connections. In addition, in order to evaluate the reliability of the connection between the two-sided conductive patterns, a hot oil test (260 ° C
The cycle of immersion in oil for 10 seconds and immersion in oil at 20 ° C for 20 seconds is one cycle). Even after 500 cycles, no defective connection was observed. Compared with the conventional copper plating method, The connection reliability between the conductive (wiring) pattern layers was remarkably excellent.

Embodiment 4 FIGS. 4A and 4B are cross-sectional views schematically showing another embodiment of the present embodiment. In the present embodiment, a PPS resin (trade name, Torelina 3000, Toray KK) is used with a cloth pitch of 0.4 mm.
125μm thick, 300mm width impregnated with glass cloth
Was prepared. Further, a metal screen having a through hole having a diameter of 0.3 mm formed at a predetermined position on one main surface of a tape-shaped supporting base sheet 1 made of electrolytic copper foil having a thickness of 35 μm and a width of 350 mm was used.
A tape 1 ″ was prepared by forming a bump 2 having a bottom surface of 0.3 mm square and a chevron height of 250 μm with a conductive paste made of silver powder and polysulfone resin having a thickness of 18 μm.
m, tape-shaped electrolytic copper foil 6 'of 350mm width and thickness of 15μm
A tape-shaped aluminum 9 having a width of 400 mm was prepared. On the other hand, a first twin roller device including a rubber roller 10 (with a built-in heating source functioning as the pressed body 4) and a metal roller 11 (functioning as a pressing body), and a pair of built-in heating sources A second twin roller device having a metal roller 11 'of the mold (both functioning as a pressing body) was prepared.

First, a tape-shaped support base sheet 1 'and a tape-shaped synthetic resin-based sheet 3' on which the conductive bumps 2 have been previously wound on rollers (not shown), respectively. As shown in FIG. 4 (a), while rewinding the tape-shaped aluminum 9, the metal roller 11 between the rubber roller 10 and the metal roller 11 (heated to 290 ° C.) of the first twin roller device is used. The support base sheet 1 ′, the synthetic resin sheet 3 ′, and the aluminum 9 pass through the stack in this order from the 11 side, and are pressed (primary press) from the metal roller 11 side to form the support base sheet 1. A laminated body is manufactured by inserting (penetrating) the synthetic resin sheet 3 ′ at the tip side of each bump 2 on the ′ surface. Here, when the aluminum 9 is separated from the manufactured laminate and the laminate is wound around a roller, the next step becomes easier to carry out.

Next, the above-mentioned laminate is subjected to a second pressure processing by a second twin roller device. That is, a tape-shaped electrolytic copper foil 6 'is superimposed on the surface of the laminate where the tip end side of the bump 2 is inserted (penetrated) and exposed, and the heating source set at 300 ° C. of the second twin roller device is used. Built-in metal roller 11 '
The synthetic resin sheet 3 ′ is partially softened to be integrated with the electrolytic copper foil 6 ′ while the front end of the bump 2 that has been inserted and exposed is densely deformed by plastic deformation to the electrolytic copper foil 6 ′. By connecting, a double-sided printed wiring board substrate having a conductive wiring portion 5 in which the electrolytic copper foils 1 ', 6' on both sides were connected in a penetrating manner was prepared.

This double-sided printed wiring board substrate is
As in the case of the first embodiment, a double-sided printed wiring board was manufactured by performing a patterning process, and a normal electrical check was performed. As a result, no problems such as defects or reliability were found in all connections. Was. Fifth Embodiment FIGS. 5A and 5B are cross-sectional views schematically showing still another embodiment of the present embodiment. A required conductive paste-based wiring pattern is formed on both sides of an epoxy resin-based sheet using a glass cloth having a thickness of 100 μm as a base material by a screen printing method, and at a predetermined position surface of the conductive paste-based wiring pattern, A double-sided wiring-type support base sheet 1 'having two groups of conductive bumps having a diameter of 0.3 mm and a height of 0.3 mm was prepared. Then, as shown in FIG. 5 (a), this double-sided wiring type support base sheet 1 'is laminated and arranged so as to be sandwiched between two epoxy resin-based prepreg sheets 3 each having a glass cloth having a thickness of 100 μm as a base material. Then, the silicone rubber plates 4 were arranged on both sides via thin aluminum foils 9, respectively, and subjected to a primary pressurization treatment in a heated state. An epoxy resin-based prepreg sheet 3 was inserted in the thickness direction to obtain an exposed laminate.

Next, an electrolytic copper foil 6 and a resin film as a protective film 7 are sequentially laminated and arranged on both surfaces of the laminated body where the tips of the conductive bumps 2 are exposed, and hot pressing (secondary pressing) is performed. By performing a curing treatment, the inner layer wiring pattern forming surface, the support base sheet 1 'surface, and the electrolytic copper foil 6 surface are welded and integrated with each other, and the inner layer wiring pattern is connected to the surface copper foil 6 in a penetrating manner. A double-sided copper foil-clad printed wiring board substrate was prepared.

Next, a normal etching resist ink is screen-printed on both sides of the double-sided copper-clad board to mask the conductor pattern portion, and then etched using cupric chloride as an etchant. Thus, a double-sided printed wiring board was obtained. The printed wiring board thus manufactured was subjected to a usual electrical check, and no problems such as defects were found in all the connections.
In order to evaluate the reliability of the connection between the inner layer and the outer layer wiring pattern, a cycle of immersion in oil at 260 ° C. for 10 seconds and immersion in oil at 20 ° C. for 20 seconds was performed by a hot oil test.
No failure was observed even after 500 cycles (as one cycle), and the connection reliability between the wiring patterns was much better than in the case of the conventional copper plating method.

Embodiment 6 In Embodiment 2, except that the structure of the bump group is changed,
This is an example of manufacturing a printed wiring board in basically the same steps, and therefore, description will be given with reference to an embodiment example schematically shown in FIGS. 2 (a) and 2 (b). In this embodiment, an electrolytic copper foil 1 having a thickness of 35 μm is used in place of the polyimide resin film 1 ′ as the supporting base sheet 1, and a plating resist is printed on the roughened surface side of the copper foil 1, and a predetermined position (position ), After performing patterning to leave the exposed surface group with a diameter of 0.3 mm,
On the copper layer having a height of about 100 μm in the exposed surface area, a height of about 10 μm was formed.
A group of conductive bumps of about 110 μm as a whole was formed by laminating a gold layer of μm.

On the other hand, a polyetherimide resin film (trade name, Sumilite FS-1400, Sumitomo Bakelite KK) having a thickness of 100 μm was prepared as a synthetic resin-based sheet 3, and as shown in FIG. The support base sheet 1 and an aluminum foil (not shown) having a thickness of 15 μm were positioned and arranged on the conductive bumps 3 so that the formed conductive bumps 2 faced each other to form a laminate. Thereafter, a silicone rubber plate having a thickness of about 3 mm is disposed as a pressed body 4 on the back surface of the synthetic resin sheet 3, and a temperature of 2 mm is applied from the back surface side of the support base sheet 1.
Primary pressure was applied at 60 ° C and resin pressure of 3 MPa. By this primary pressing, the conductive bumps 2 on the support base sheet 1 ′ surface are formed.
A laminated body in which the synthetic resin sheet 3 was accurately inserted into the tip with the shape as it was was obtained.

Next, an electrolytic copper foil 6 having a thickness of 18 μm and a copper foil 6
A polyimide resin film is laminated and placed on the surface as a protective film 7 and placed between hot plates of a hot press maintained at 270 ° C. (not shown). When the synthetic resin sheet 3 is in a thermoplastic state, the resin A secondary pressure of 2 MPa was applied as a pressure, and after cooling, it was taken out, the protective film 7 was peeled off, and its cross section was observed. As shown in FIG.
The copper foil 6 is adhered to and integrated with the synthetic resin sheet 3, and each of the conductive bumps 2 penetrated (penetrated) through the synthetic resin sheet 3 has a tip plastically deformed at a surface in contact with the copper foil 6. (Crushed shape), for a double-sided copper-clad printed wiring board having a conductor wiring portion 8 connected to the copper foil 6 surface in the same plane and penetrating the synthetic resin sheet 3 in the thickness direction A substrate was obtained.

A conventional etching resist ink (trade name, PSR-4000H, Taiyo Ink K)
K) was screen-printed to mask the conductor pattern portion, and then subjected to an etching treatment using cupric chloride as an etchant, followed by removing the resist mask to obtain a double-sided printed wiring board.
When a normal electrical check was performed on the double-sided printed wiring board manufactured in this manner, the resistance of each through-type conductive wiring portion 8 was 0.01 Ω or less, and all connections had problems such as failure or reliability. I was not able to admit.

The bumps in this embodiment are formed by a solder dipping method in which the solder bath is immersed in a solder bath having a relatively low solder bath temperature, through a solder resist mask. In this case, similar results were obtained. Even if the formation of the bumps with the conductive composition in still another example was performed by the plating method, it was possible to obtain a printed wiring board in which the wiring layers were connected.

[0036]

According to the present invention, a step of forming conductive bumps for connecting between pattern layers, a step of arranging synthetic resin-based sheets in a laminated manner and performing a first pressurization (hot press), The process of laminating and arranging conductive metal foils (layers) on the system sheet surface and performing secondary pressing, and the process of patterning the outer layer are simplified, in other words, the number of manufacturing steps is significantly reduced compared to the conventional manufacturing method. It is possible to easily manufacture a double-sided printed wiring board or a multilayer printed wiring board while reducing the amount. Particularly, in the production of a multilayer printed wiring board in which steps are frequently repeated, the number of steps is greatly reduced, which is effective in improving productivity or mass productivity. In addition, in the manufacturing process of the conventional multilayer printed wiring board and the like, since the drilling process and the plating process, which are indispensable in the manufacturing process of the conventional multilayer printed wiring board, are no longer required, defects generated in the manufacturing process are significantly suppressed and the yield is improved. In addition, a highly reliable printed wiring board can be obtained. Also, since the printed wiring board to be manufactured has no holes for interlayer connection on the surface, it is possible to significantly improve the wiring density, and the mounting area of the electronic component can be set regardless of the position of the holes. As a result, the mounting density is significantly improved and the distance between the mounted electronic components can be shortened.
The performance of the circuit can also be improved. That is, the present invention not only contributes to cost reduction of the printed wiring board, but also greatly contributes to downsizing and high performance of the mounted circuit device.

[Brief description of the drawings]

FIGS. 1A and 1B schematically show a primary pressing step in a first embodiment of the present invention, in which FIG. 1A is a side view showing conductive bumps formed on a support substrate surface, and FIG. FIG. 3 is a cross-sectional view showing a stacked arrangement state in a primary press, and FIG. 3C is a cross-sectional view showing a shape of a conductive bump pressed into a synthetic resin sheet by a primary press by a hot press.

FIG. 2 schematically shows a secondary pressing step in the first embodiment of the present invention. FIG. 2 (a) shows that a conductive bump is pressed into a synthetic resin sheet by primary pressing to obtain a laminate surface. FIG. 4B is a cross-sectional view showing a state in which a copper foil is laminated, and FIG. 4B is a cross-sectional view showing a state in which a conductor wiring portion is formed between the copper foil and a bump on which a synthetic resin-based sheet is pierced by secondary pressing.

FIG. 3 schematically shows a pressing step in a second embodiment of the present invention. FIG. 3 (a) shows a state in which conductive bumps are pressed into a synthetic resin-based sheet by primary pressing, and copper is applied to the surface of the laminate. Sectional drawing which shows the state which laminated | stacked the foil, (b) is sectional drawing which shows the state which formed the conductor wiring part between the copper foil which laminated | stacked the bump which penetrated the synthetic resin sheet | seat by the secondary press.

FIGS. 4A and 4B schematically show a pressing step in a second embodiment of the present invention, in which FIG. 4A is a cross-sectional view showing a state of a continuous primary pressing method using a roller, and FIG. Sectional drawing which shows the state of the continuous secondary pressurization method by a roller.

FIG. 5 schematically shows a pressing step in a third embodiment of the present invention. FIG. 5 (a) shows a method in which conductive bumps are pressed into a synthetic resin-based sheet by primary pressing and copper is applied to the surface of a laminate. Sectional drawing which shows the state which laminated | stacked the foil, (b) is sectional drawing which shows the state which formed the conductor wiring part between the copper foil which laminated | stacked the bump which penetrated the synthetic resin sheet | seat by the secondary press.

[Description of Signs] 1, 1 ': Supporting base sheet 1 ": Supporting base tape with conductive bumps 2: Conductive bumps 3, 3': Synthetic resin sheet 4: Pressed object 5: Backing plate
6, 6 '... copper foil 7 ... protective film 8 ... conductor wiring part (penetration type) 9 ... aluminum foil tape 10 ... elastic or flexible roller 11, 11' ... metal roller

──────────────────────────────────────────────────の Continuing on the front page (72) Inventor Yusuke Wada 1st Komukai Toshiba-cho, Saiwai-ku, Kawasaki City, Kanagawa Prefecture Inside the Komukai Plant, Toshiba Corporation (72) Inventor Kenji Sasaoka Komukai Toshiba, Saiwai-ku, Kawasaki City, Kanagawa Prefecture No. 1 in the town of Komukai Plant, Toshiba Corporation (72) Inventor Takahiro Mori 1 in Komukai Toshiba Town, Koyuki-ku, Kawasaki-shi, Kanagawa Prefecture (72) Inventor Bunya Tokushiya Ikegaya Koto, Kawasaki-shi, Kanagawa Prefecture No. 1, Muko Toshiba, Komukai Plant, Toshiba Co., Ltd. (72) Inventor, Sadao Kowatari, No. 1, Komukai Toshiba Town, Koyuki-ku, Kawasaki City, Kanagawa Prefecture, Komatsu, Toshiba Co., Ltd. (56) References JP, A) (58) Field surveyed (Int. Cl. ⁷ , DB name) H05K 3/40 H05K 3/46

Claims (17)

(57) [Claims] 1. A synthetic resin-based support, made comprises a said synthetic resin-based conductor wiring of the substantially conical in inserted through in the thickness direction are embedded in isolation from each other of the support, before Kishirube bottom of the body wiring portion is exposed substantially flat shape on one main surface of the synthetic resin support, the top of the front Kishirube body wiring portion forms a structure protruding from the other main surface of the synthetic resin support A printed wiring board, characterized in that: 2. The method according to claim 1, wherein the thickness of the synthetic resin-based support is a conductor arrangement.
Substantially the same thickness around the wire part and the part away from the conductor wiring part
The printed wiring board according to claim 1, wherein 3. A synthetic resin support and said synthetic resin support.
A support base laminated on one main surface of the holding body,
Closely contact the support base and penetrate in the thickness direction of the support
A substantially conical conductor wiring portion embedded and isolated from each other.
The top portion of the conductor wiring portion is formed from the other main surface of the synthetic resin-based support.
Printed wiring characterized by having a protruding configuration
Board. 4. A synthetic resin support and said synthetic resin support.
A support substrate laminated on one main surface of the holding body;
A conductive metal foil laminated on the other main surface of the oil-based support,
One end face of the large diameter is in close contact with the support base and is plastically deformed.
The other end face whose tip is flat is in close contact with the conductive metal foil.
Is inserted and buried in the thickness direction of the synthetic resin-based support.
And a conductive wiring portion provided
Wiring board. 5. The support base is made of a conductive metal foil.
The printed wiring board according to claim 1. 6. The method according to claim 1, wherein the supporting base is made of a synthetic resin.
Item 5. The printed wiring board according to any one of Items 1 to 4. 7. A region of said support which is in contact with said conductor wiring portion.
Wiring pattern is formed in the area
The printed wiring board according to claim 6. 8. A wiring pattern formed on both main surfaces,
Conductor wiring parts protrude from the wiring pattern on the main surface
Support base made of synthetic resin, and both main surfaces of the support base
The conductor wiring section is inserted and buried in the thickness direction and
Placed synthetic resin-based support, and each of the synthetic resin-based supports
A conductive layer which is closely stacked on the conductive wiring portion
A printed wiring board comprising a metal foil . 9. A step of arranging and laminating a synthetic resin-based sheet on a main surface of a support base on which conductive bumps are formed at predetermined positions so that the main surface of the synthetic resin-based sheet is in contact with the main surface of the support base; Stacking and arranging conductive metal foils; secondary pressurizing the stacked body having the conductive metal foils stacked thereon, connecting the tip of a conductive bump to the conductive metal foil by deformation, and forming a through-type conductive wiring portion. Forming a printed wiring board. 10. A step of arranging and laminating a synthetic resin-based sheet on a main surface of a support base on which a conductor bump group is formed at a predetermined position with the main surface of the synthetic resin-based sheet facing the synthetic resin-based sheet. A pressed body having elasticity or flexibility is arranged, and the laminated body is heated to raise the resin content of the synthetic resin sheet to a plastic state or a glass transition temperature or higher. A step of inserting and exposing the leading end in the thickness direction of the synthetic resin sheet, a step of laminating and disposing a conductive metal foil on the penetrating and exposing surface of the conductive bump tip, and laminating and disposing the conductive metal foil. Forming a through-type conductor wiring portion by subjecting the laminated body to secondary pressurization to connect the tip of the conductor bump to the conductive metal foil surface by deformation, thereby forming a through-type conductor wiring portion. Plate manufacturing method. 11. The method of manufacturing a printed wiring board according to claim 10, wherein the synthetic resin sheet is a synthetic resin sheet reinforced with an insulating cloth or mat. 12. The method of claim 10 or claim 11 a method of manufacturing a printed wiring board, wherein the support substrate is a conductive metal foil. 13. A step of laminating a main surface of a synthetic resin sheet on a main surface of a support base on which a conductive bump group is formed at a predetermined position so that the main surface of the synthetic resin sheet is in contact with the main body. A pressed body having elasticity or flexibility is arranged via an easily breakable thin film with a small elongation, and the laminated body is heated so that the resin content of the synthetic resin-based sheet becomes a plastic state or a glass transition temperature or more. A step of firstly applying pressure from the supporting base side to penetrate / expose the tip of the conductor bump in the thickness direction of the synthetic resin sheet; and laminating a conductive metal foil on the penetration / exposed surface of the tip of the conductor bump. And a step of forming a through-type conductor wiring portion by deforming the laminate by laminating the conductive metal foil and connecting the tip of the conductive bump to the conductive metal foil surface by deformation. And a printed wiring board characterized by comprising: Production method. 14. The method according to claim 13 , wherein the synthetic resin sheet is a synthetic resin sheet reinforced with an insulating cloth or mat. 15. A prepreg-based sheet whose main surface is a cloth having a pitch larger than the diameter of the conductive bumps, and is stacked and arranged on the main surface of the support base on which the conductive bumps are formed at predetermined positions. And placing a pressed body having elasticity or flexibility on the prepreg-based sheet surface side of the laminate, and heating the laminate to increase the resin content of the synthetic resin-based sheet to a plastic state or a glass transition temperature or higher. And then applying primary pressure from the support substrate side to penetrate and expose the tip of the conductor bump in the thickness direction of the prepreg sheet; and applying a conductive metal foil to the penetration and exposure surface of the tip of the conductor bump. Stacking and arranging, and applying a second pressurization to the stacked body on which the conductive metal foil is stacked to connect the tip of the conductive bump to the surface of the conductive metal foil by plastic deformation to form a through-type conductive wiring portion And a step of Method of manufacturing a printed wiring board characterized by comprising Te. 16. A step of sequentially laminating a synthetic resin-based sheet and a releasable metal foil on a main surface of a support base having a conductive bump group formed at a predetermined position; Heating and pressurizing between the twin rollers formed with the other roller, and primary pressurizing from the support base side to penetrate and expose the tip of the conductive bump in the thickness direction of the synthetic resin sheet. And a step of removing the releasable metal foil and laminating and disposing a conductive metal foil on the penetrating / exposed surface at the tip of the conductive bump. 17. A process for forming a wiring pattern connected to the through-type conductor wiring portion by performing an etching process on the conductive metal foil connected and integrated with the through-type conductor wiring portion. Claim 9 characterized by the above-mentioned.
10, claim 13, a method of manufacturing a printed wiring board according to any one of claims 15 or claim 16.