JP3705370B2 - Manufacturing method of multilayer printed wiring board - Google Patents
Manufacturing method of multilayer printed wiring board Download PDFInfo
- Publication number
- JP3705370B2 JP3705370B2 JP8532995A JP8532995A JP3705370B2 JP 3705370 B2 JP3705370 B2 JP 3705370B2 JP 8532995 A JP8532995 A JP 8532995A JP 8532995 A JP8532995 A JP 8532995A JP 3705370 B2 JP3705370 B2 JP 3705370B2
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- Prior art keywords
- conductive paste
- multilayer printed
- printed wiring
- wiring board
- interlayer
- Prior art date
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- Expired - Fee Related
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- 238000004519 manufacturing process Methods 0.000 title claims description 15
- 239000011229 interlayer Substances 0.000 claims description 35
- 238000000034 method Methods 0.000 claims description 29
- 239000010410 layer Substances 0.000 claims description 19
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 14
- 238000010438 heat treatment Methods 0.000 claims description 13
- 239000011889 copper foil Substances 0.000 claims description 12
- 238000003475 lamination Methods 0.000 claims description 12
- 238000005530 etching Methods 0.000 claims description 7
- 239000000853 adhesive Substances 0.000 claims description 5
- 230000001070 adhesive effect Effects 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 5
- 229920001169 thermoplastic Polymers 0.000 claims description 4
- 229920001187 thermosetting polymer Polymers 0.000 claims description 4
- 239000004416 thermosoftening plastic Substances 0.000 claims description 4
- 230000010354 integration Effects 0.000 claims description 3
- 238000003825 pressing Methods 0.000 claims description 2
- 239000002313 adhesive film Substances 0.000 description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 239000002923 metal particle Substances 0.000 description 2
- 239000005416 organic matter Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- -1 polyethylene terephthalate Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
- H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Description
【０００１】
【産業上の利用分野】
本発明は、多層プリント配線板の製造方法に関する。
【０００２】
【従来の技術】
従来の多層プリント配線板は、加圧加熱による多層化積層工程を経て製造された多層基板に、層間接続用の貫通穴または非貫通穴を形成した後、その穴にめっきを行う方法や導電性ペーストを印刷または埋め込む方法で製造されている。
【０００３】
【発明が解決しようとする課題】
従来の多層プリント配線板の製造方法は、加圧加熱による多層化積層工程と層間の電気的接続のための工程が別れている。そのため、工程が複雑で長いという問題がある。
【０００４】
本発明は、工程が簡略であり、配線の高密度化と薄板化が可能な多層プリント配線板の製造方法を提供することを目的とする。
【０００５】
【課題を解決するための手段】
本発明の方法は、導電性ペーストで層間接続を行う多層プリント配線板の製造方法において、
（ａ）内層配線板の層間接続箇所に、多層化時の加圧加熱で流動する導電性ペーストを設け半硬化状態にする工程
（ｂ）層間接着用絶縁性フィルムの層間接続穴形成箇所に、層間接続用に設けた導電性ペーストよりも大きな貫通穴をあける工程
（ｃ）導電性ペーストを設けた内層板に、貫通穴をあけた半硬化状態にした層間接着用絶縁性フィルムと銅箔を重ね合わせて、加圧加熱積層一体化する工程
（ｄ）エッチング法によって銅箔に配線パターンを形成する工程
（ｅ）（ａ）〜（ｄ）の工程を必要な回数繰り返すことによって多層プリント配線板を製造する工程、
を順に含むことを特徴とする。
【０００６】
本発明の内層板は、基板の表面に導体配線が形成されたものであり、基板は、無機質絶縁材料や有機絶縁材料である。その表面の導体配線は、基板の表面に形成された金属皮膜のエッチング法や絶縁基板の表面に導電性ペーストを印刷したものや、無電解めっきを用いるいわゆるアディティブ法で形成されたもの等を用いることができる。
【０００７】
これらの内層配線板の層間接続箇所に導電性ペーストを設けるが、この導電性ペーストとしては、金属粒子、導電性有機物、カーボン等の導電性粒子を混入した熱可塑性の導電性ペーストあるいは紫外線硬化性と熱硬化性を併用した導電性ペースト、同じく金属粒子、導電性有機物、カーボン等の導電性粒子を混入した熱可塑性樹脂の導電性ペーストが使用できる。
これらの導電性ペーストは、版を使用した印刷、ディスペンサを使用した印刷等によって内層配線板の所定の位置に突起として形成される。
この導電性ペーストの突起は、次の工程の加圧加熱積層工程で流動し、銅箔と接着する。
そのため熱硬化性の導電性ペーストの場合は印刷後、半硬化状態にする必要がある。
半硬化状態とは、触れた時べた付きの無い程度に硬化させた状態をいう。この突起の断面形状は、底面の幅と上面の幅が等しい矩形が理想的であるが、台形から半円状でもよい。
また、この導電性ペースト突起の高さは、層間接着用絶縁性フィルムの厚さに、ほぼ等しい厚さが望ましい。しかし、加圧加熱積層時にこの導電性ペースト突起および層間接着用絶縁性フィルムは、互いに流動するので、厚さの制御は微妙なものではない。
【０００８】
層間接着用絶縁フィルムとしては、ガラス布、有機繊維からなる布、紙等にフェノール樹脂、エポキシ樹脂、ポリイミド樹脂等の熱硬化性樹脂を含浸させて半硬化させたプリプレグや、半硬化状態の熱硬化性接着フィルムや熱可塑性の接着フィルムが使用される。この層間接着用絶縁フィルムには、内層板に設けた導電性ペースト突起よりも大きな貫通穴をあける。
この貫通穴は、ドリルやバンチング、レーザー等であける。
この貫通穴に内層板に設けた導電性ペースト突起がはまるように重ねて、その外側に銅箔を重ねて加圧加熱積層し、一体化させる。
そのため位置合わせピン等の位置合わせ用治具は、必ずしも必要ではない。
加圧加熱積層工程では、層間接着用絶縁フィルムと導電性ペースト突起が、両者の空隙を埋めるまで互いに流動して、銅箔、層間接着用絶縁フィルム、導電性ペースト突起が接着し一体化するように加圧加熱する。
【０００９】
この加圧加熱層において、銅箔と鏡板の間にクッションシートをはさんでプレスすると、層間接着用絶縁フィルムの貫通穴部分と導電性ペースト突起部分にも圧力が均一にかかるために両者の流動が促進され滑らかに空隙が埋められるので、クッションシートの使用が好ましい。
クッションシートを使用した場合のプレス構成の例を図２の（ａ）に示す。
また、その時に得られる層間接続部の断面図を（ｂ）に示す。
加圧加熱積層して一体化が完了すると、表層の銅箔をエッチング法によって配線を形成する。
更に、その表面に配線層を設ける場合には、上記した工程を繰り返すことによって、多層配線板の層数を増やすことができる。
【００１０】
上記したように、本発明では、層間接続用の導電性ペーストを内層板の表面に印刷するので、貫通穴や非貫通穴への導電性ペーストを充填する印刷法に比べて容易である。
また、層間接続穴が導電性ペーストで充填されているので、穴埋め工程無しで逐次多層が可能である。
また、比較的剛性のある内層板の上に順次多層化する逐次多層化方法なので層間接着用絶縁フィルムに薄いものが使用できる。
そのため多層板の薄型化が可能である。
また、層間接続にめっきを全く使用しないので電解銅箔メーカで製造された均一な厚さの銅箔のエッチングによって配線が形成できるので、配線のエッチング精度の向上や微細配線の形成が可能である。
また本方法では、上記したように、多層化積層工程と層間接続工程を同時化しているので、従来複雑な工程を経て製造していた多層板の製造工程が簡略になる。
【００１１】
【実施例】
実施例１
図１（ａ）に示すように板厚０．３ｍｍのガラスエポキシ片面銅張り積層板を準備する。
次に（ｂ）に示すように、通常のエッチング法で配線を形成した。
次に（ｃ）に示すように、層間接続を行う箇所に銅ペーストを使用して、直径０．１２ｍｍ、高さ０．０５ｍｍ突起を印刷した。それを１３０℃で２０分間乾燥して、半硬化状態にした。
次に（ｅ）に示すように、ポリエチレンテレフタレートフィルムにエポキシ系接着剤を厚さ０．０５ｍｍ塗布して、半硬化状態にした商品名ＡＳ−３０００（日立化成工業株式会社製、商品名）の接着フィルムを層間接着用絶縁性フィルムとして準備する。
次に（ｆ）に示すように、層間接続を行う箇所に直径０．２ｍｍの穴をドリルであけた。
次に（ｇ）に示すように、（ｃ）の工程で得た内層板と層間接続用の穴をあけた接着フィルムと更に厚さ０．０１８ｍｍの銅箔を重ね合わせる。
この工程で接着フィルムのキャリアであるポリエチレンテレフタレートフィルムは引き剥がす。
次に（ｈ）に示すように、温度１７０℃、圧力２０ｋｇ／ｃｍ2 で６０分間、加圧加熱して積層一体化させた。
次に（ｉ）に示すように、通常のエッチング法で配線を形成した。
次に（ｊ）に示すように、層間接続を行う箇所に銅ペーストを使用して、直径０．１２ｍｍ、高さ０．０５ｍｍ突起を印刷した。
それを１３０℃で２０分間乾燥して半硬化状態にした。
次に（ｋ）に示すように、（ｅ）、（ｆ）、（ｇ）と同一の工程を経て、三層構造の配線板を得た。
次に（ｌ）に示すように、更に同様な工程を経て四層構造の多層プリント配線板を得た。
【００１２】
【発明の効果】
以上に説明したように、本発明によって、簡略な工程で配線の高密度化と薄板化が可能な多層プリント配線板の製造が可能になる。
【図面の簡単な説明】
【図１】（ａ）〜（ｋ）は、それぞれ本発明の一実施例の製造工程を説明するための各工程における断面図である。
【図２】本発明の他の実施例を示す多層化積層時にクッションシートを使用した本発明の断面図である。[0001]
[Industrial application fields]
The present invention relates to a method for manufacturing a multilayer printed wiring board.
[0002]
[Prior art]
A conventional multilayer printed wiring board is a method of forming a through hole or a non-through hole for interlayer connection on a multilayer board manufactured through a multilayered lamination process by pressure heating, and then performing plating or conducting on the hole. Manufactured by printing or embedding paste.
[0003]
[Problems to be solved by the invention]
In a conventional method for producing a multilayer printed wiring board, a multilayered lamination process by pressure heating and a process for electrical connection between layers are separated. Therefore, there is a problem that the process is complicated and long.
[0004]
SUMMARY OF THE INVENTION An object of the present invention is to provide a method for manufacturing a multilayer printed wiring board that has a simple process and can increase the density and thickness of wiring.
[0005]
[Means for Solving the Problems]
The method of the present invention is a method for manufacturing a multilayer printed wiring board in which interlayer connection is performed with a conductive paste.
The interlayer connection portion (a) an inner layer circuit board, the interlayer connection hole forming portion of the to that step (b) an insulating film for interlayer adhesion in a semi-cured state is provided a conductive paste flowing at multilayered during pressing and heating (C) Opening a larger through-hole than the conductive paste provided for interlayer connection (c) Insulating film for interlayer adhesion and copper foil in a semi-cured state with a through-hole formed in the inner layer plate provided with the conductive paste (D) Multilayer printed wiring by repeating the steps (e), (a) to (d) as many times as necessary. A process of manufacturing a plate,
In order.
[0006]
The inner layer plate of the present invention is such that conductor wiring is formed on the surface of a substrate, and the substrate is an inorganic insulating material or an organic insulating material. For the conductor wiring on the surface, an etching method of a metal film formed on the surface of the substrate, a conductive paste printed on the surface of an insulating substrate, or a so-called additive method using electroless plating is used. be able to.
[0007]
Conductive paste is provided at the interlayer connection locations of these inner-layer wiring boards. As this conductive paste, thermoplastic conductive paste mixed with conductive particles such as metal particles, conductive organic matter, carbon, or ultraviolet curable Can be used as well as a conductive paste of a thermoplastic resin mixed with conductive particles such as metal particles, conductive organic matter, and carbon.
These conductive pastes are formed as protrusions at predetermined positions on the inner wiring board by printing using a plate, printing using a dispenser, or the like.
The protrusions of the conductive paste flow in the pressure and heating lamination process of the next process and adhere to the copper foil.
Therefore, in the case of a thermosetting conductive paste, it is necessary to make it a semi-cured state after printing.
The semi-cured state refers to a state of being cured to the extent that it is not sticky when touched. The cross-sectional shape of the protrusion is ideally a rectangle having the same width at the bottom and the top, but it may be trapezoidal or semicircular.
Further, the height of the conductive paste protrusion is desirably substantially equal to the thickness of the interlayer adhesive insulating film. However, since the conductive paste protrusions and the interlayer adhesive insulating film flow with each other during pressure heating lamination, the thickness control is not delicate.
[0008]
As an insulating film for interlayer adhesion, glass cloth, cloth made of organic fibers, paper, etc. are impregnated with thermosetting resin such as phenol resin, epoxy resin, polyimide resin and semi-cured, or semi-cured heat A curable adhesive film or a thermoplastic adhesive film is used. A through hole larger than the conductive paste protrusion provided on the inner layer plate is formed in the interlayer adhesive insulating film.
This through hole can be drilled, bunched, lasered or the like.
The conductive paste protrusions provided on the inner layer plate are overlapped with the through holes so that the conductive paste protrusions are fitted, and the copper foil is stacked on the outer side of the through holes, followed by pressure heating lamination, and integrated.
Therefore, an alignment jig such as an alignment pin is not always necessary.
In the pressure heating lamination process, the insulating film for interlayer adhesion and the conductive paste protrusion flow to each other until the gap between them is filled, so that the copper foil, the insulating film for interlayer adhesion, and the conductive paste protrusion are bonded and integrated. Pressurize and heat.
[0009]
In this pressure heating layer, when the cushion sheet is pressed between the copper foil and the end plate, the pressure is evenly applied to the through-hole part and the conductive paste protrusion part of the insulating film for interlayer adhesion, so the flow of both Use of a cushion sheet is preferred because it facilitates and smoothly fills voids.
An example of a press configuration when a cushion sheet is used is shown in FIG.
A cross-sectional view of the interlayer connection obtained at that time is shown in FIG.
When integration is completed by pressurizing and heating lamination, wiring is formed by etching the copper foil on the surface layer.
Furthermore, when providing a wiring layer on the surface, the number of layers of the multilayer wiring board can be increased by repeating the above-described steps.
[0010]
As described above, in the present invention, since the conductive paste for interlayer connection is printed on the surface of the inner layer plate, it is easier than the printing method in which the conductive paste is filled into the through holes and the non-through holes.
In addition, since the interlayer connection holes are filled with the conductive paste, multiple layers can be sequentially formed without a hole filling step.
In addition, since it is a sequential multilayering method in which multilayering is sequentially performed on a relatively rigid inner layer plate, a thin insulating film for interlayer adhesion can be used.
Therefore, the multilayer board can be thinned.
In addition, since no plating is used for interlayer connection, wiring can be formed by etching a copper foil with a uniform thickness manufactured by an electrolytic copper foil manufacturer, so that it is possible to improve wiring etching accuracy and to form fine wiring. .
Further, in the present method, as described above, the multi-layer lamination process and the interlayer connection process are simultaneously performed, so that the manufacturing process of the multi-layer board that has been conventionally manufactured through complicated processes is simplified.
[0011]
【Example】
Example 1
As shown in FIG. 1A, a glass epoxy single-sided copper-clad laminate having a thickness of 0.3 mm is prepared.
Next, as shown in (b), wiring was formed by a normal etching method.
Next, as shown in (c), a copper paste was used at the location where the interlayer connection was made, and a protrusion having a diameter of 0.12 mm and a height of 0.05 mm was printed. It was dried at 130 ° C. for 20 minutes to a semi-cured state.
Next, as shown in (e), a product name AS-3000 (trade name, manufactured by Hitachi Chemical Co., Ltd.) in which a polyethylene terephthalate film is coated with an epoxy adhesive to a thickness of 0.05 mm to make it semi-cured. An adhesive film is prepared as an insulating film for interlayer adhesion.
Next, as shown in (f), a hole having a diameter of 0.2 mm was drilled at a location where interlayer connection was performed.
Next, as shown in (g), the inner layer plate obtained in the step (c), an adhesive film having holes for interlayer connection, and a copper foil having a thickness of 0.018 mm are overlapped.
In this step, the polyethylene terephthalate film that is the carrier of the adhesive film is peeled off.
Next, as shown in (h), the temperature is 170 ° C. and the pressure is 20 kg / cm 2. For 60 minutes under pressure for heating and lamination.
Next, as shown in (i), wiring was formed by a normal etching method.
Next, as shown in (j), protrusions having a diameter of 0.12 mm and a height of 0.05 mm were printed using a copper paste at locations where interlayer connections were to be made.
It was dried at 130 ° C. for 20 minutes to a semi-cured state.
Next, as shown in (k), a wiring board having a three-layer structure was obtained through the same steps as (e), (f), and (g).
Next, as shown in (l), a multilayer printed wiring board having a four-layer structure was obtained through a similar process.
[0012]
【The invention's effect】
As described above, according to the present invention, it is possible to manufacture a multilayer printed wiring board capable of increasing the density and reducing the thickness of the wiring by a simple process.
[Brief description of the drawings]
FIGS. 1A to 1K are cross-sectional views in each step for illustrating a manufacturing process of an embodiment of the present invention.
FIG. 2 is a cross-sectional view of the present invention in which a cushion sheet is used at the time of multilayer lamination, showing another embodiment of the present invention.
Claims (6)
（ａ）内層配線板の層間接続箇所に、多層化時の加圧加熱で流動する導電性ペーストを設け半硬化状態にする工程
（ｂ）層間接着用絶縁性フィルムの層間接続穴形成箇所に、層間接続用に設けた導電性ペーストよりも大きな貫通穴をあける工程
（ｃ）導電性ペーストを設けた内層板に、貫通穴をあけた半硬化状態にした層間接着用絶縁性フィルムと銅箔を重ね合わせて、加圧加熱積層一体化する工程
（ｄ）エッチング法によって銅箔に配線パターンを形成する工程
（ｅ）（ａ）〜（ｄ）の工程を必要な回数繰り返す工程
を含むことを特徴とする多層プリント配線板の製造方法。In the method of manufacturing a multilayer printed wiring board that performs interlayer connection with a conductive paste,
The interlayer connection portion (a) an inner layer circuit board, the interlayer connection hole forming portion of the to that step (b) an insulating film for interlayer adhesion in a semi-cured state is provided a conductive paste flowing at multilayered during pressing and heating (C) Opening a larger through-hole than the conductive paste provided for interlayer connection (c) Insulating film for interlayer adhesion and copper foil in a semi-cured state with a through-hole formed in the inner layer plate provided with the conductive paste (D) including a step of repeating the steps (e), (a) to (d) as many times as necessary (d) forming a wiring pattern on the copper foil by an etching method. A method for producing a multilayer printed wiring board, which is characterized.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8532995A JP3705370B2 (en) | 1995-04-11 | 1995-04-11 | Manufacturing method of multilayer printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8532995A JP3705370B2 (en) | 1995-04-11 | 1995-04-11 | Manufacturing method of multilayer printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH08288649A JPH08288649A (en) | 1996-11-01 |
| JP3705370B2 true JP3705370B2 (en) | 2005-10-12 |
Family
ID=13855603
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8532995A Expired - Fee Related JP3705370B2 (en) | 1995-04-11 | 1995-04-11 | Manufacturing method of multilayer printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3705370B2 (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE69839964D1 (en) | 1997-06-06 | 2008-10-16 | Ibiden Co Ltd | ONE-SIDED PCB AND METHOD FOR THE PRODUCTION THEREOF |
| JPH11354684A (en) | 1998-06-09 | 1999-12-24 | Nitto Denko Corp | Low heat expansion wiring board and multilayer wiring board |
| JP2000012723A (en) | 1998-06-23 | 2000-01-14 | Nitto Denko Corp | Circuit board mounting structure and multilayer circuit board therefor |
| JP2001203459A (en) * | 2000-01-20 | 2001-07-27 | Hitachi Chem Co Ltd | Multilayer printed wiring board and its manufacturing method |
| JP4968616B2 (en) * | 2005-04-21 | 2012-07-04 | 住友電気工業株式会社 | Manufacturing method of multilayer printed wiring board |
| JP5719560B2 (en) * | 2009-10-21 | 2015-05-20 | 株式会社半導体エネルギー研究所 | Manufacturing method of terminal structure |
| WO2014127381A1 (en) * | 2013-02-15 | 2014-08-21 | Ormet Circuits, Inc. | Structures for z-axis interconnection of multilayer electronic substrates |
-
1995
- 1995-04-11 JP JP8532995A patent/JP3705370B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH08288649A (en) | 1996-11-01 |
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