JP3131108U - Light or radiation detector - Google Patents

Abstract

An object of the present invention is to provide a light or radiation detector capable of reducing magnetic noise.
In a configuration in which a radiation detector 30 includes a power supply substrate 42 for driving an insulating substrate 36 and a signal processing substrate 41, the influence of magnetism generated from the power supply or the power supply substrate 42 is not affected. Permalloys 46 and 47 are provided as magnetic shields. By disposing the permalloys 46 and 47, magnetic noise from the power supply and the power supply substrate 42 can be eliminated, and magnetic noise can be reduced.
[Selection] Figure 1

Description

  The present invention relates to a light or radiation detector used in the medical field, the industrial field, and the nuclear field.

  An X-ray detector will be described as an example. The X-ray detector has an X-ray sensitive X-ray conversion layer, and the X-ray conversion layer converts into charge information by the incidence of X-rays, and detects the X-rays by reading the converted charge information. . The charge converted from X-rays by the X-ray conversion layer is very small, and it is necessary to amplify the charge. In that case, since noise is amplified, it is necessary to reduce the noise in order to obtain an image with a good S / N (signal to noise) ratio. Noise includes electrical noise and magnetic noise. In order to reduce electrical noise, a conductive fiber obtained by combining polyamide and silver having a high shielding effect is used for the detector (for example, see Patent Document 1). In order to reduce magnetic noise, the radiation detector 130 is housed in a housing 110 as shown in FIG. 6, and the housing 110 is formed of a magnetically permeable material to provide a magnetic shield. (For example, refer to Patent Document 2).

On the other hand, it is affected by scattered X-rays (hereinafter referred to as “backscattered rays”) from the side opposite to the X-ray incident surface. Is common. In the case of a medical radiation imaging apparatus or the like used for fluoroscopic imaging or the like, lead is often arranged to protect electronic components and prevent leakage X-rays.
JP 2000-116633 A (page 3, FIGS. 2, 4) Japanese Patent Laying-Open No. 2005-249658 (Pages 1-4, 6-8, FIGS. 2, 3, 5-7)

  In general, magnetic noise is often generated in a portion of a large current or high voltage, and is often radiation noise from a CRT (Cathode Ray Tube) on a computer side or a power source provided outside. However, the detector shown in FIG. 6 is a flat type, and is opposite to the X-ray incident surface of the insulating substrate 136 on which an X-ray conversion layer or the like typified by a radiation sensitive semiconductor thick film 131 is patterned. In addition, a circuit such as a power source is provided. Since magnetic noise is generated by the power source from this circuit, the influence of magnetic noise remains only by covering only the outside with a casing made of a magnetically permeable material in order to eliminate the influence of external magnetic noise.

  This invention is made in view of such a situation, and it aims at providing the light or radiation detector which can reduce a magnetic noise.

In order to achieve such an object, the present invention has the following configuration.
That is, the device according to claim 1 converts the light or radiation information into charge information by the incidence of light or radiation, a readout substrate that reads the charge information, and the read charge information as a signal. A light or radiation detector comprising a signal processing board to be processed and a power supply or power supply board for driving these boards, and detecting light or radiation by reading and processing the converted charge information. A magnetic shield is provided so as not to be affected by magnetism generated from the power source or the power source substrate.

  [Operation / Effect] According to the invention described in claim 1, in the case where the light or radiation detector includes a power source or a power source substrate for driving the readout substrate or the signal processing substrate, the power source or the power source substrate. A magnetic shield is provided so as not to be affected by the magnetism generated from the magnetic field. By providing this magnetic shield, magnetic noise from the power supply or the power supply substrate can be eliminated, and magnetic noise can be reduced.

  In the above-described device, the magnetic shield is preferably formed of a magnetically permeable material (the device according to claim 2). By forming the magnetic shield with a magnetically permeable material, it is possible to reliably avoid the influence of magnetism.

  A preferred example of the above-described device is that the magnetic shield covers the substrate or the power supply substrate (the device according to claim 3). By covering the substrate or the power supply substrate with the magnetic shield, magnetic noise from the power supply or the power supply substrate can be eliminated.

  Furthermore, in another preferable example of the above-described device, a magnetic shield is disposed on a surface opposite to the light or radiation incident surface of the readout substrate, and the magnetic shield is the above-mentioned of the readout substrate provided with the magnetic shield. It has an area equal to or larger than the area on the opposite side (the device according to claim 4). Normally, the power supply or power supply board is arranged on the opposite side of the reading board from the light or radiation incident surface. Therefore, a magnetic shield is provided on the opposite side of the reading board, and the area on the opposite side is the same. Since the magnetic shield has an area of or larger than that, magnetic noise from the power supply or the power supply substrate can be eliminated. If the area is smaller than the area on the opposite side, it is affected by magnetism, so the magnetic shield has an area equivalent to or larger than the area on the opposite side. An example of the former (the device described in claim 3) and an example of the latter (the device described in claim 4) may be combined. In this specification, “equivalent area” indicates the area of the “effective area” of the readout substrate. Therefore, the magnetic shield only needs to have an area of “effective area” of the reading substrate or more.

  When a base material that is a combination of two members having different absorption coefficients for light or radiation is arranged on the side opposite to the light or radiation entrance surface of the readout substrate, the difference in the absorption coefficient of the members in the base material Causes backscattered radiation. Therefore, in the latter example (the device according to claim 4), a magnetic shield is disposed on the surface opposite to the light or radiation incident surface of the readout substrate and on the light or radiation incident surface of the substrate. (A device according to claim 5). That is, the backscattered rays described above can be attenuated by the magnetic shield.

  Moreover, an example of the base material mentioned above is a constant temperature means (device of Claim 6). That is, one of the above-described members is a pipe through which a constant-temperature liquid flows, and the other is a base on which the pipe is provided, and the pipe and the base are each formed of materials having different absorption coefficients. . Backscattered rays are generated due to the difference in absorption coefficient between the piping and the base in the thermostatic means. Such backscattered rays can be attenuated by the magnetic shield.

  According to the light or radiation detector according to the present invention, magnetic noise from the power supply or the power supply board can be eliminated by arranging the magnetic shield so as not to be affected by the magnetism generated from the power supply or the power supply board. And magnetic noise can be reduced.

Embodiments of the present invention will be described below with reference to the drawings.
1 is a schematic cross-sectional view of a radiation detector according to an embodiment, FIG. 2 is a circuit diagram showing FIG. 1 as an equivalent circuit, and FIG. 3 is a circuit diagram showing a plane. In the present embodiment, a direct conversion type radiation detector will be described as an example.

  As shown in FIGS. 1 and 2, the radiation detector 30 according to the present embodiment includes a radiation-sensitive semiconductor thick film 31 in which carriers are generated when radiation such as X-rays enters, and the semiconductor thick film. The voltage application electrode 32 provided on the surface of the semiconductor 31, the carrier collection electrode 33 provided on the back surface opposite to the radiation incident side of the semiconductor thick film 31, and the charge accumulation for collecting the collected carriers to the carrier collection electrode 33 Capacitor Ca, and a thin film transistor (TFT) Tr, which is a switch element for taking off charges that are normally OFF (blocked) for taking out the charges accumulated in the capacitor Ca. In the present embodiment, the semiconductor thick film 31 is formed of a radiation sensitive material that generates carriers by the incidence of radiation, but may be a photosensitive material that generates carriers by the incidence of light. . The semiconductor thick film 31 corresponds to the conversion layer in this device.

  In addition, the radiation detector 30 includes a data line 34 connected to the source of the thin film transistor Tr, and a gate line 35 connected to the gate of the thin film transistor Tr. 31, a carrier collecting electrode 33, a capacitor Ca, a thin film transistor Tr, a data line 34, and a gate line 35 are stacked on an insulating substrate 36. The insulating substrate 36 is formed of, for example, a glass substrate.

  As shown in FIGS. 2 and 3, for each of the carrier collection electrodes 33 formed in a large number (for example, 1024 × 1024) in a vertical / horizontal two-dimensional matrix arrangement, each capacitor Ca and thin film transistor Tr described above is provided. Are connected to each other, and the carrier collecting electrode 33, the capacitor Ca, and the thin film transistor Tr are separately formed as each detecting element DU. Further, the voltage application electrode 32 is formed over the entire surface as a common electrode of all the detection elements DU. Further, as shown in FIG. 3, the data lines 34 described above are arranged in parallel in the horizontal (X) direction, and the gate lines 35 described above are arranged in the vertical (Y) direction as shown in FIG. The data lines 34 and the gate lines 35 are connected to the detection elements DU. The data line 34 is connected to a multiplexer 38 via a charge-voltage conversion group (amplifier) 37, and the gate line 35 is connected to a gate driver 39. Note that the number of detection elements DU arranged is not limited to the above-mentioned 1024 × 1024, but can be used by changing the number of arrangement according to the embodiment. Therefore, the form with only one detection element DU may be sufficient.

  The detection elements DU are patterned on the insulating substrate 36 in a two-dimensional matrix arrangement, and the insulating substrate 36 on which the detection elements DU are patterned is also called an “active matrix substrate”. The insulating substrate 36 on which the detection element DU is patterned corresponds to the readout substrate in the present invention.

  A charge-voltage conversion group (amplifier) 37 and a multiplexer 38 are mounted in this order from the insulating substrate 36 side on the flexible substrate 40 formed of an elastic body. The flexible substrate 40 is electrically connected to a data line 34 formed on the insulating substrate 36 and a signal processing substrate 41 (see FIGS. 1 and 3) disposed on the opposite side of the insulating substrate 36 from the radiation incident side. It is connected to the. The signal processing board 41 is a board for signal processing the read charge information. The signal processing board 41 corresponds to the signal processing board in this device.

  When the radiation detector 30 formed of the semiconductor thick film 31, the insulating substrate 36, or the like is formed, the surface of the insulating substrate 36 is used by using a thin film forming technique by various vacuum deposition methods or a pattern technique by photolithography. The data line 34 and the gate line 35 are wired, and the thin film transistor Tr, the capacitor Ca, the carrier collection electrode 33, the semiconductor thick film 31, the voltage application electrode 32, and the like are sequentially stacked. The semiconductor for forming the semiconductor thick film 31 can be appropriately selected according to the application, withstand voltage, etc., as exemplified by an amorphous semiconductor and a polycrystalline semiconductor. Further, the material forming the semiconductor thick film 31 is not particularly limited as exemplified by selenium (Se). In the present embodiment, since it is a direct conversion type radiation detector, the semiconductor thick film 31 is formed of amorphous selenium.

  As shown in FIG. 1, a power supply substrate 42 for driving the insulating substrate 36 and the signal processing substrate 41 is provided. In this embodiment, a switching type is adopted as the power supply board 42, and a DC power supply (DC power supply), a DC-DC converter (not shown) including an oscillation circuit, a rectifier circuit, etc. are arranged on the power supply board 42. Has been established. Further, a thermostatic mechanism 43 is disposed between the signal processing board 41 or the power supply board 42 and the insulating board 36. The constant temperature mechanism 43 includes a base 44 formed of aluminum (Al) and a pipe 45 disposed in the base 44. The pipe 45 is made of copper (Cu), and is configured to allow a constant temperature liquid (for example, water) to flow through the pipe 45. The power supply board 42 corresponds to the power supply board in the present invention, the thermostatic mechanism 43 corresponds to the thermostatic means in the present invention, the base 44 corresponds to the base in the present invention, and the pipe 45 corresponds to the pipe in the present invention. To do. The constant temperature mechanism 43 also corresponds to the base material in this device.

  The radiation detector 30 formed of the semiconductor thick film 31, the insulating substrate 36, the signal processing substrate 41, the power supply substrate 42, the constant temperature mechanism 42, and the like has the casing 10 after the semiconductor thick film 31 is molded and sealed with the resin 20. Is stored by. The housing 10 has a magnetic shield function. On the housing 10, a shielding plate 11 for shielding radiation and light other than the radiation to be detected (here, X-rays) is disposed. The shielding plate 11 is made of a material having a low shielding rate such as carbon or resin so as to minimize the attenuation of X-rays by the shielding plate 11.

The housing 10 is a magnetic shield for eliminating the influence of external magnetic noise due to radiation noise from a CRT monitor, a power supply, or the like. The casing 10 is formed of a magnetically permeable material typified by an iron-nickel (Fe—Ni) alloy, which is a ferromagnetic material, that is thermally fired (annealed) to about 1000 ° C. (hereinafter referred to as “permalloy”). ing. By forming the casing 10 with permalloy, external magnetic noise is blocked by the casing 10 and does not reach the radiation detector 30. Permalloy also has conductivity, and in this embodiment, this permalloy is grounded. Although the relative permeability of permalloy depends on the magnetic flux density and the like, it is about 10 ⁴ to several 10 ⁶ .

  In addition, since X-rays may be attenuated by permalloy, it is preferable to make the thickness of the incident surface of the housing 10 thinner than other surfaces. In this embodiment, a permalloy having a thickness of about 0.1 mm or less is formed on the incident surface, and a permalloy having a thickness of about 0.3 mm or more is formed on the other surface. If the incident surface is formed only by the shielding plate 11, the magnetic lines of force enter the radiation detector 30 through the incident surface by the wraparound of the magnetic lines of force, so that the incident surface side is also formed of permalloy.

  Next, the characteristic part of the present embodiment will be described with reference to FIG. 1 and will be described with reference to FIG. 6 for comparison with the prior art. FIG. 6 is a schematic cross-sectional view of a conventional radiation detector for comparison with FIG. Further, in FIG. 6, the reference numeral of the housing 10 in FIG. 1 is 110, the reference numeral of the shielding plate 11 in FIG. 1 is 111, the reference numeral of the resin 20 in FIG. 1 is 120, and the reference numeral of the radiation detector 30 in FIG. 1, 130 is the semiconductor thick film 31 in FIG. 1, 132 is the voltage applying electrode 32 in FIG. 1, 136 is the insulating substrate 36 in FIG. 1, and the charge-voltage conversion group in FIG. (Amplifier) 37 is denoted by 137, the multiplexer 38 in FIG. 1 is denoted by 138, the flexible board 40 in FIG. 1 is denoted by 140, the signal processing board 41 in FIG. 1 is denoted by 142, the constant temperature mechanism 43 of FIG. 1 is denoted by 143, the base 44 of FIG. 1 is denoted by 144, and the pipe of FIG.

  In this embodiment, the difference from the prior art is that, in addition to the housing 10, permalloys 46 and 47 are further provided as shown in FIG. The permalloy 46 has a casing shape and covers the power supply substrate 42. The permalloy 47 is disposed between the constant temperature mechanism 43 and the insulating substrate 36. Further, as shown in FIG. 1, the permalloy 47 has an area equivalent to the area opposite to the radiation incident surface of the insulating substrate 36 (here, X-rays). Of course, the permalloy 47 may have an area larger than the area opposite to the incident surface. Permalloys 46 and 47 correspond to the magnetic shield in this device.

  As described above, the “equivalent area” indicates the area of the “effective area” of the insulating substrate 36 corresponding to the readout substrate. In the present embodiment, the “effective area” indicates a region where the detection element DU exists. Therefore, the permalloy 47 corresponding to the magnetic shield has only to have the area of the “effective area” (that is, the region where the detection element DU exists) of the insulating substrate 36. Further, the permalloy 47 may have an area equal to or larger than that. Therefore, the permalloy 47 only needs to have an area of the effective area (area where the detection element DU exists) of the insulating substrate 36 or larger.

  When the switching type is adopted, an oscillation circuit or the like is disposed on the power supply substrate 42 as described above. Magnetic field lines are generated from the coil portion of the oscillation circuit, and as a result, magnetic noise is generated from the power supply substrate 42. On the other hand, with respect to the base 44 and the pipe 45 constituting the constant temperature mechanism 43, the absorption coefficients regarding the respective X-rays are different from each other. Backscattered rays are generated due to the difference in absorption coefficient between the base 44 and the pipe 45 in the thermostatic mechanism 43.

  In order to eliminate magnetic noise inside the radiation detector 30, permalloys 46 and 47 are provided. The permalloy 47 also has a function of attenuating the above-described backscattered rays. That is, as described above, permalloy 47 is mainly composed of nickel and has a higher X-ray absorption rate than aluminum or the like. Therefore, the backscattered rays are attenuated by the permalloy 47 using the high absorption rate.

  Like the case 10, it is preferable that the permalloys 46 and 47 are grounded or at a constant potential. Since Permalloy is conductive as described above, it has a function of an electrical shield that eliminates electrical noise by setting it to ground or a constant potential.

  It is preferable to keep the gap between the casing-shaped permalloy 46 and the power supply substrate 42 to a minimum. If there are many gaps, the magnetic flux leaks and the adverse effects of magnetic noise cannot be eliminated. In addition, permalloy can improve the magnetic shielding effect as the thickness increases, but a thickness of about 0.1 mm to 1.0 mm is sufficient for preventing magnetic noise from the power supply and the power supply substrate 42. An effect is obtained. Moreover, about the reduction | decrease of a backscattering ray, an effect is acquired with the thickness of about 0.5 mm-2.0 mm. Therefore, it is preferable that the casing-shaped permalloy 46, which is a box covering the power supply substrate 42, has a thickness of about 0.5 mm, and the permalloy 47 has a thickness of about 1.0 mm to prevent backscattered rays. Of course, you may unify with the material which has thickness of about 0.5 mm.

Subsequently, the operation of the radiation detector 30 will be described. While applying a bias voltage _{V A} of the voltage application electrode 32 to a high voltage (e.g., several 100V~ number about 10 kV), to be incident radiation to be detected.

  Carriers are generated by the incidence of radiation, and the carriers are stored in the charge storage capacitor Ca as charge information. The gate line 35 is selected by the scanning signal for signal extraction of the gate driver 39, and the detection element DU connected to the selected gate line 35 is selected and designated. The electric charge accumulated in the capacitor Ca of the designated detection element DU is read out to the data line 34 via the thin film transistor Tr that has been turned on by the signal of the selected gate line 35.

  Also, the address (address) designation of each detection element DU is performed based on the scanning signal for extracting signals from the data line 34 and the gate line 35. When a scanning signal for signal extraction is sent to the multiplexer 38 and the gate driver 39, each detection element DU is selected according to the scanning signal in the longitudinal (Y) direction from the gate driver 39. Then, when the multiplexer 38 is switched in accordance with the scanning signal in the horizontal (X) direction, the charge accumulated in the capacitor Ca of the selected detection element DU is transferred to the voltage-voltage conversion group (amplifier) via the data line 34. 37 and the multiplexer 38 are sequentially sent to the signal processing board 41.

  For example, when the radiation detector 30 according to this embodiment is used for detecting a fluoroscopic X-ray image of an X-ray fluoroscopic apparatus, the charge information is converted into image information on the signal processing board 41 via the data line 34 by the above-described operation. And output as an X-ray fluoroscopic image.

  According to the radiation detector 30 according to the present embodiment having the above-described configuration, in the case where the radiation detector 30 includes the power supply substrate 42 for driving the insulating substrate 36 and the signal processing substrate 41, the power supply In addition, permalloys 46 and 47 are provided as magnetic shields so as not to be affected by magnetism generated from the power supply substrate 42. By disposing the permalloys 46 and 47, magnetic noise from the power supply and the power supply substrate 42 can be eliminated, and magnetic noise can be reduced.

  In this embodiment, the permalloys 46 and 47 as magnetic shields are made of a magnetically permeable material. By forming the magnetic shield with a magnetically permeable material, it is possible to reliably avoid the influence of magnetism.

  In the present embodiment, the casing-like permalloy 46 of the magnetic shield covers the power supply substrate 42. Since the permalloy 46 covers the power supply substrate 42, magnetic noise from the power supply and the power supply substrate 42 can be eliminated.

  In this embodiment, the permalloy 47 of the magnetic shield is arranged as follows. That is, the permalloy 47 is disposed on the surface of the insulating substrate 36 opposite to the incident surface of the radiation (here, X-rays). The permalloy 47 has an area equivalent to or larger than the area on the opposite side of the insulating substrate 36 on which the permalloy 47 is disposed. As shown in FIG. 1, the power supply substrate 42 is disposed on the opposite side of the radiation substrate (here, X-ray) incident surface of the insulating substrate 36, so that a permalloy 47 is disposed on the opposite surface. In addition, since the permalloy 47 has an area equivalent to or larger than the area on the opposite side, magnetic noise from the power supply and the power supply substrate 42 can be eliminated. If the area is smaller than the area on the opposite side, it is affected by magnetism, so the permalloy 47 has an area equivalent to or larger than the area on the opposite side.

  In the present embodiment, the thermostatic mechanism 43 is provided as a base material in which two members having different absorption coefficients relating to radiation (here, X-rays) are combined. A permalloy 47 is disposed on the surface of the insulating substrate 36 opposite to the radiation (X-ray) incident surface, and on the radiation (here X-ray) incidence surface of the thermostatic mechanism 43. One of the above-described members is a pipe 45 through which a constant temperature liquid (for example, cold water) flows, and the other is a base 44 provided with the pipe 45, and the base 44 and the pipe 45 have different absorption coefficients. Each of them is made of a material (base 44 is aluminum and pipe 45 is copper). Backscattered rays are generated due to the difference in absorption coefficient between the base 44 and the pipe 45 in the thermostatic mechanism 43. Such backscattered rays are not incident on the insulating substrate 36 while being blocked by the permalloy 47 and attenuated or incident on the insulating substrate 36. In this way, the backscattered rays can be attenuated by the permalloy 47 that is a magnetic shield.

  If only the attenuation of backscattered rays is taken into consideration, it can be realized with conventional lead, but in the case of lead, it does not function as a magnetic shield, not a magnetically permeable material. Therefore, it is more preferable to provide the permalloy 47 as in this embodiment if it functions as a magnetic shield and also functions as a backscattered ray attenuation.

  The present invention is not limited to the above embodiment, and can be modified as follows.

  (1) In the above-described embodiment, this device is applied to a direct conversion type radiation detection apparatus in which incident radiation is directly converted into charge information by the semiconductor thick film 31 (conversion layer), but the incident radiation is scintillator. The present invention may be applied to an indirect conversion type radiation detector that converts light into charge information by a semiconductor layer formed of a light sensitive substance. Further, the present invention may be applied to a photodetector that converts incident light into charge information by a semiconductor layer formed of a photosensitive material.

  (2) In the above-described embodiments, the case where X-rays are detected has been described as an example. However, the present invention can be applied to a detection device that detects γ-rays used in a nuclear medicine apparatus or the like.

(3) In the above-described embodiment, the magnetically permeable material is made of permalloy. However, if the magnetically permeable material is normally used, for example, silicon steel, manganese zinc (Mn-Zn) ferrite, iron (Fe) -based amorphous, etc. It is not specifically limited like. Further, the higher the magnetic permeability, the more effective as a magnetic shield. Preferably, it is made of a magnetically permeable material having a relative magnetic permeability of about 10 ³ or more, such as silicon steel, and more preferably a relative magnetic permeability of 10 ⁴ or more, such as permalloy.

  (4) In the above-described embodiment, the magnetically permeable material represented by permalloy has conductivity, and the permalloy is grounded to remove electrical noise, but does not remove electrical noise. If it is, even if it is a magnetically permeable substance, it does not need to have electroconductivity. For example, the iron core of the coil is a magnetically permeable material but has no electrical conductivity. Such an iron core may be formed as a magnetic shield.

  (5) In the above-described embodiment, the power supply board is provided. However, the present invention can also be applied to a structure provided with a simple power supply that is not a board type.

  (6) In the above-described embodiment, the case 10 (see FIG. 1) formed of permalloy is provided to eliminate the influence of external magnetic noise, but the influence of external magnetic noise is not considered. It is not always necessary to provide the housing 10.

  (7) In the above-described embodiment, the permalloys 46 and 47 (see FIG. 1) are disposed together, but it is not always necessary to provide both. For example, if reduction of backscattered rays is not considered, as shown in FIG. 4, only a casing-shaped permalloy 46 may be provided. Further, even if there is no casing-like permalloy 46, magnetic noise can be eliminated even if only the permalloy 47 is provided as shown in FIG.

  (8) In the above-described embodiment, the constant temperature mechanism 43 is described as an example of a base material combining two members having different absorption coefficients related to radiation. However, the base material combining two members having different absorption coefficients. And if a backscattering ray generate | occur | produces by the difference in the absorption coefficient of the member in a base material, it will not be limited to this. For example, in order to make the detector thinner and lighter, the base material is made of a light material such as Al, and the same applies when using a heavy and strong material such as SUS to increase its strength. I can say.

It is a schematic sectional drawing of the radiation detector which concerns on an Example. FIG. 2 is a circuit diagram illustrating FIG. 1 as an equivalent circuit. It is the circuit diagram represented planarly. It is a schematic sectional drawing of the radiation detector which concerns on a modification. It is a schematic sectional drawing of the radiation detector which concerns on the further modification. It is a schematic sectional drawing of the conventional radiation detector for the comparison with FIG.

Explanation of symbols

30 ... Radiation detector 31 ... Semiconductor thick film 36 ... Insulating substrate 41 ... Signal processing substrate 42 ... Power supply substrate 43 ... Constant temperature mechanism 44 ... Base 45 ... Piping 46, 47 ... Permalloy

Claims (6)

  A conversion layer that converts light or radiation information into charge information upon incidence of light or radiation, a readout substrate that reads the charge information, a signal processing substrate that performs signal processing on the read charge information, and these substrates A light source or radiation detector that detects power or radiation by reading out the converted charge information and processing the signal, and comprising a magnetic power generated from the power source or the power supply substrate. A light or radiation detector, wherein a magnetic shield is disposed so as not to be affected.   The light or radiation detector according to claim 1, wherein the magnetic shield is made of a magnetically permeable material.   3. The light or radiation detector according to claim 1, wherein the magnetic shield covers the substrate or the power supply substrate.   The light or radiation detector according to any one of claims 1 to 3, wherein the magnetic shield is disposed on a surface opposite to the light or radiation incident surface of the readout substrate, and the magnetic shield is: An optical or radiation detector having an area equivalent to or larger than the area on the opposite side of the readout substrate provided with a magnetic shield.   5. The light or radiation detector according to claim 4, wherein a base material in which two members having different absorption coefficients for light or radiation are combined is disposed on a side opposite to the light or radiation incident surface of the readout substrate. And an absorption coefficient of the member in the substrate by disposing the magnetic shield on a surface opposite to the light or radiation incident surface of the readout substrate and on the light or radiation incident surface of the substrate. A light or radiation detector characterized by attenuating backscattered rays caused by the difference by a magnetic shield.   6. The light or radiation detector according to claim 5, wherein the base material is a constant temperature means, and one of the members is a pipe for flowing a constant temperature liquid, and the other is a base provided with a pipe. A light or radiation detector, wherein the pipe and the base are formed of materials having different absorption coefficients.

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