JP3126694B2 - Microwave circuit device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a microwave circuit device used for radar and communication.

[0002]

2. Description of the Related Art Conventionally, microwave circuits have been connected with each other by a method of directly connecting lines with solder or the like or a method of connecting with a coaxial connector. Here, FIG. 11 shows a structure in which microwave circuits used in a conventional radar or the like are connected by a coaxial connector. FIG. 11A shows coaxial connectors 301 a and 301 connected to microwave circuits 100 and 200.
FIG. 4 is a perspective view showing a structure for connection with b. FIG. 11B is a cross-sectional view taken along line DD ′ shown in the perspective view.
In the microwave circuit 100 , a microstrip line 103 is formed on a dielectric substrate 102 (for example, an alumina substrate) laminated on a base plate 101, and an MMIC 104 connected to the microstrip line 103 is arranged on the dielectric substrate 102. ing. Microwave circuit 1
00 is electrically connected to the outside.
1a is used. The coaxial connector 301a is the center conductor 3
The center conductor 302a is connected to the microstrip line 103. Base plate 101,
The aluminum chassis 105 covering the dielectric substrate 102, the MMIC 104 and the like plays a role of mechanically holding the coaxial connector 301a. On the other hand, the microwave circuit 200 has a microwave circuit board in which dielectric substrates 201 and 202 having one surface grounded and sandwiched between transmission lines 203 are covered with an aluminum chassis 204, and a coaxial connector 301 b is provided with a center conductor 302.
b and the transmission line 203, and are fixed to the aluminum chassis 204. The microwave circuits 100 and 200 are connected via these coaxial connectors 301a and 301b.

However, as described above, when a coaxial connector is used to connect microwave circuits, each unit requires a chassis for mounting the connector. Therefore, in an array antenna or the like composed of a large number of units, this chassis has been a major cause of an increase in the mass of the entire antenna. In addition, the coaxial connectors themselves have a large quantity, which causes an increase in mass and cost.

[0004]

As described above, when a conventional coaxial type connector is used, a mechanical structure such as an aluminum chassis is required to mount the coaxial type connector. This was a major obstacle in reducing costs. Further, in the case of connecting with such a coaxial type connector, there is a loss due to the connection and the characteristics of the device are deteriorated.

In order to solve the above-mentioned problems, the present invention is to provide a microwave circuit device which can be reduced in size, weight, and cost by simplifying a mechanical structure such as an aluminum chassis, and has a small loss. Aim.

[0006]

SUMMARY OF THE INVENTION In order to achieve the above object, the present invention relates to a microwave circuit device constructed by connecting respective units comprising a microwave circuit having a transmission line. The transmission line connected to the input / output of each unit is overlapped by 1/4 wavelength of the signal and electromagnetically coupled to connect each unit comprising the microwave circuit.

Further, a slit is provided at a position corresponding to a quarter wavelength of a signal from the end of the transmission line of each unit so that the dielectric is exposed from a ground conductor sandwiching the dielectric, and the slits are overlapped. Each unit is connected by electromagnetic coupling.

[0008]

Embodiments of the present invention will be described below with reference to the drawings. 1 to 4 show the first embodiment of the present invention.
FIG. 5 to FIG. 7 show a second embodiment of the present invention, and FIG.
FIG. 10 to FIG. 10 show a third embodiment of the present invention. here,
The connection of each unit between the microwave circuits will be described.

FIG. 1 is a perspective view of a first embodiment of the present invention. A microwave joining circuit 30 is provided on the microwave circuit 20 , and the microwave circuit 10 is stacked on the microwave circuit 20 so as to fit the microwave joining circuit 30 . The microwave circuits 10 and 20 are electrically connected to input and output signals by a microwave joining circuit 30 .
FIG. 2 is a cross-sectional view taken along line AA ′ shown in the perspective view.

FIG. 2 is a sectional view of a first embodiment of the present invention. The microwave circuit 10 includes a microstrip line 1 on a dielectric substrate 11 laminated on a base plate 19.
4 is formed, and the MMIC 13 connected to the microstrip line 14 is arranged on the dielectric substrate 11. In order to electrically connect the microwave circuit 10 to the outside, a center conductor 15b is formed on the dielectric substrate 11 at a portion where the base plate 19 is cut out.
b and the microstrip line 14 are electrically connected by a through hole 16. A ground conductor 18 is formed on the dielectric substrate 11 in a portion other than the microstrip line 14 and the center conductor 15b, and a ground formed on both surfaces of the dielectric substrate by a through hole 17 formed so as to surround the through hole 16 as a center conductor. The conductors 18 are electrically connected. Although the aluminum chassis 12 is fixed on the dielectric substrate 11 so as to cover the microstrip line 14 and the MMIC 13 and the like, it is not necessary to fix a coaxial connector for making an electrical connection with the outside unlike the conventional case, so that the aluminum chassis 12 is solid. Instead of a simple structure, simplification is possible.

On the other hand, the microwave circuit 20 has a structure in which dielectric substrates 21 and 22 having one surface as a ground conductor 26 are sandwiched between transmission lines 23, and are electrically connected to the microwave circuit 20 and a microwave bonding circuit 30 described later. The transmission line 23 is connected to the through hole 24 for connection.

The microwave bonding circuit 30 includes a dielectric plate 31
A central conductor 32b is provided therein, and is electromagnetically coupled to the microwave circuit 10 by overlapping the central conductor 15b and the central conductor 32b by a quarter wavelength via a dielectric sheet. Further, the microwave circuit 20 includes a central conductor 32
b and the through hole 24 are electrically connected.

FIG. 3 is a cutaway view of the first embodiment of the present invention. FIG. 3A shows the side of the microwave circuit 10 connected to the microwave bonding circuit. As described above, a part of the base plate 19 is notched, and the center conductor 15b and the ground conductors 15a and 15c are formed from the dielectric substrate 11 exposed from the notch. The ground conductors 15a and 15c are connected to the through holes 17 connected to the ground conductor 18, and the center conductor 15b is
Microstrip line 14 and through hole 16 shown in FIG.
Connected through. FIG. 3B shows a microwave circuit.
Exploded view of a part of 20 and microwave bonding circuit 30
FIG. Dielectric substrate 21 of microwave circuit 20
A transmission line 23 and a ground conductor pattern 27 are formed thereon. Grounding conductor pattern 27 is formed so as to surround around the through hole 24, further a dielectric board 21,
The ground conductor 26 is also connected to the ground conductor 22 by a through hole 25 disposed so as to surround the through hole 24.
The microwave bonding circuit 30 is provided with a center conductor 32b and ground conductors 32a and 32c in a dielectric plate 31, and the center conductor 32b is connected to the microwave circuit 20 by a through hole 24.
Is connected to the transmission line 23. Similarly, the ground conductor 32
32a and 32c are connected to the ground conductor 26 and the ground conductor pattern 27 of the microwave circuit 20 through the through hole 25.

As described above, in the microwave circuit 10 and the microwave bonding circuit 30 , the center conductors 15b and 32b are sandwiched between the ground conductors 15a, 15c and 32a and 32c, respectively. The microwave circuit 20 is connected to the transmission line 2.
Ground conductor 2 so as to surround through hole 24 connected to
A through-hole 25 connected to the line 6 is provided, and is similarly formed into a coaxial line in the circuit. FIG. 4 shows a microwave joining circuit 40 in the case where a plurality of lines are connected. Microwave junction circuit 40, the dielectric plate 41 to the central conductor 42b, the ground so as to sandwich the 42d conductors 42a,
42c and 42e are provided.

As described above, the structure in which the transmission / reception module and the power supply circuit are connected by the microwave bonding circuit allows the center conductor 1 to be separated by 中心 wavelength of the signal via the dielectric sheet 33.
Since 5b and 32b are electromagnetically coupled by overlapping,
Since a loss due to connection is small and a mechanical structure for holding the connector is not required, the size and weight can be reduced. Further, since the ground conductor is arranged so as to sandwich the center conductor, there is an effect of reducing radio interference between the outside and signals.

Furthermore, connection and electromagnetically coupled via the microwave circuit 20 and the dielectric sheet 33, a microwave circuit 10
The present invention is also applicable to a connection in which both the microwave circuit 20 and the microwave circuit 20 are electromagnetically coupled via the dielectric sheet 33.

FIG. 5 is a perspective view of a second embodiment of the present invention. The microwave circuit 50 is connected so as to be stacked on the microwave circuit 60 , and the microwave circuit 50 and the microwave circuit 60 are directly connected to input / output signals. FIG. 6 is a cross-sectional view taken along line BB ′ shown in the perspective view.

FIG. 6 is a sectional view of a second embodiment of the present invention. In the microwave circuit 50 , a microstrip line 54 is formed on one surface of a dielectric substrate 51 laminated on a base plate 57, and an MMIC 53 connected to the microstrip line 54 is arranged on the dielectric substrate 51. I have. A ground conductor 55 is formed on the other surface of the dielectric substrate 51, and the base plate 57 laminated on this surface is partially removed to connect the microwave circuit 50 to the outside. This base plate 57
The microstrip line 54
A slit 56 exposing the dielectric substrate 51 from the ground conductor 55 is formed immediately below the position corresponding to the signal 1/4 wavelength from the end of the substrate. On the other hand, the microwave circuit 60 has a structure in which dielectric substrates 61 and 62 having one surface as ground conductors 64 and 65 are sandwiched between transmission lines 63, and the microwave circuit 60 is electrically connected to the outside. A slit 66 in which the dielectric substrate 62 is exposed from the ground conductor 64 is formed immediately above the position corresponding to the signal 1/4 wavelength from the end of the substrate.
The microwave circuits 50 and 60 are electromagnetically coupled by being laminated so that the slits 56 and 66 are aligned.

FIG. 7 is a sectional view of a second embodiment of the present invention. FIG. 7A shows a microwave circuit of the microwave circuit 50.
2 shows a side connected to the control unit 60 . As described above, a part of the base plate 57 is removed, and the removed surface is a quarter of the distance from the end of the microstrip line 54.
A slit 56 exposing the dielectric substrate 51 from the ground conductor 55 is formed immediately below the position corresponding to the wavelength. This slit 56 is perpendicular to the microstrip line 54,
/ 2 wavelengths. FIG. 7B is a sectional view of the microwave circuit 60 . A transmission line 63 is formed on the dielectric substrate 61 of the microwave circuit 60 , and the transmission line 63 is formed on the ground conductor 64 of the dielectric substrate 62 immediately above a position corresponding to １ ／ wavelength from the end of the transmission line 63. Is formed with a slit 66 having a length corresponding to a half wavelength in the vertical direction. The slits 56 and 66 are overlapped to perform electromagnetic coupling, and input / output signals of the microwave circuit 50 and the microwave circuit 60 are connected.

Alternatively, the present invention can be applied to a case where the base plate is not removed, and a perspective view of the third embodiment is shown in FIG. The microwave circuit 50 is connected so as to be stacked on the microwave circuit 60 , and the microwave circuit 5
0 and the microwave circuit 60 are directly connected to input / output signals. FIG. 9 shows a cross-sectional view taken along line CC ′ shown in the perspective view.

FIG. 9 is a sectional view of a third embodiment of the present invention.
You. Microwave circuit50Is stacked on the base plate 57.
The microstrip is placed on one side of the layered dielectric substrate 51.
And the microstrip line is formed.
MMIC 53 to be connected to 54 is arranged on dielectric substrate 51
Have been. Also, the other surface of the dielectric substrate 51 is grounded.
A conductor 55 is formed and a microwave circuit50The outside
Microstrip on this side to connect to
Immediately below the position of 1/4 wavelength of the signal from the end of the loop line 54
In addition, a slot that exposes the dielectric substrate 51 from the ground conductor 55
A cut 56 is formed. Microwave circuit60
Is a dielectric substrate 61 having one surface as ground conductors 64 and 65,
62 is sandwiched between transmission lines 63, and
Road60Of the transmission line 63 to electrically connect the
Ground conductor just above the signal 1/4 wavelength from the end
A slit 66 where the dielectric substrate 62 is exposed from 64 is formed.
Have been. In addition, the base plate 57
Formed in the microwave circuit50,60Is through
Align slits 56 and 66 through lit 59
It is electromagnetically coupled by laminating.

FIG. 10 is a cutaway view of a third embodiment of the present invention. FIG. 10A shows a side of the microwave circuit 50 connected to the microwave circuit 60 . As described above, the slit 56 exposing the dielectric substrate 51 from the ground conductor 55 is formed immediately below the position corresponding to １ ／ wavelength from the end of the microstrip line 54. The slit 56 is formed in a direction perpendicular to the microstrip line 54 and has a length corresponding to a half wavelength. The base plate 57 laminated with the dielectric substrate 51 has a through slit formed in the same direction as the slit 56. FIG. 10B is a sectional view of the microwave circuit 60 . A transmission line 63 is formed on the dielectric substrate 61 of the microwave 60 , and one end of the transmission line 63 is
Immediately above the position corresponding to 波長 wavelength, a slit 66 having a length corresponding to １ ／ wavelength is formed in a direction perpendicular to the transmission line 63.
Electromagnetic coupling is performed by overlapping these slits 56 and 66 through the through slit 59 of the base plate 57,
The input / output signals of the microwave circuit 50 and the microwave circuit 60 are connected.

As described above, with the structure in which the microwave circuits are directly connected to each other, the slits 56 and 66 at positions corresponding to 1/4 wavelength from the end of the microstrip line 54 and the end of the transmission line 63 are overlapped or the base plate 57 is formed.
The electromagnetic coupling is achieved by overlapping through the through slits 59, so that the loss due to the connection is small, the mechanical structure for holding the connector is not required, and the miniaturization and weight reduction are achieved by eliminating the connector itself (connector-less). The cost can be reduced.

[0024]

As described above, the present invention relates to a microwave circuit device comprising a microwave circuit unit having a transmission line, and a center conductor connected to the input / output of each unit via a dielectric sheet. Is connected to each unit of the microwave circuits by superimposing the signals for one quarter wavelength of the signal and electromagnetically coupling each other. Slits exposing the dielectric from the conductor are provided, and the units are connected by overlapping and electromagnetically coupling the slits. From the configuration, the mechanical structure such as the aluminum chassis is simplified to reduce the size, weight, and cost. And a microwave circuit device with less loss can be provided.

[Brief description of the drawings]

FIG. 1 is a perspective view of a first embodiment of the present invention.

FIG. 2 is a sectional view of the first embodiment of the present invention.

FIG. 3 is an exploded perspective view of the first embodiment of the present invention.

FIG. 4 is a partial perspective view of the first embodiment of the present invention.

FIG. 5 is a perspective view of a second embodiment of the present invention.

FIG. 6 is a sectional view of a second embodiment of the present invention.

FIG. 7 is a cutaway perspective view of a second embodiment of the present invention.

FIG. 8 is a perspective view of a third embodiment of the present invention.

FIG. 9 is a sectional view of a third embodiment of the present invention.

FIG. 10 is an exploded perspective view of a third embodiment of the present invention.

FIG. 11 is a perspective view and a sectional view of a conventional example.

[Explanation of Signs] 10 , 20 , 50 , 60 , 100 , 200 ... Microwave circuit 11,21,22,51,61,62,102,201,202 ... ... Dielectric substrate 12,52,105,204 ... Aluminum chassis 13,53,104 ... M
MIC 14,54,103 ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ Microstrip line 15a, 15c, 18,26,32a, 32c, 42a, 42c, 42e, 55,58,64, 65 ・ Ground conductors 15b, 32b, 42b, 42d ・ ・ ・ ・ ・ ・ ・ ・ Center conductors 16, 17, 24, 25・ ・ ・ ・ Through holes 19,57,101 ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ Base plate 23,63,203 ・ ・ ・ ・ ・ ・ ・ ・ ・ ・・ Transmission line 27 ・ ・ ・ ・ ・ ・ ・ Ground conductor pattern 30 , 40・ ・ ・ ・ ・ ・ ・ ・ ・・ ・ ・ ・ Microwave bonding circuit 31,41 ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ Dielectric plate 33 ・ ・ ・ ・ ・ ・・ ・ ・ ・ ・ ・ ・ ・ ・ Dielectric sheet 56,66 ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ Slit 59 ・ ・ ・ ・ ・ ・...・ ・ ・ ・ ・ ・ ・ Slit 300,301a, 301b ・ ・ ・ ・ ・ ・ ・ Coaxial connector 302a, 302a ・ ・ ・ ・ ・ ・ ・.... Coaxial connector center conductor

Continuation of front page (56) References JP-A-3-129902 (JP, A) JP-A-9-298409 (JP, A) IEEE Trans. MTT, Vol. 43, No. 7. 1996. pp. 1516-1523 1994 IEEE MTT-S Dig. pp. 1141/1144 (58) Field surveyed (Int. Cl. ⁷ , DB name) H01P 5/02 603 H01P 5/08 H01L 23/12 301 H01L 27/04 JICST file (JOIS)

Claims (10)

(57) [Claims] In a microwave circuit device configured by connecting each unit composed of a microwave circuit having a transmission line, a transmission line connected to an input / output of each unit via a dielectric sheet is connected to a signal line. A microwave circuit device, wherein the units are electrically connected by overlapping by / 4 wavelength and electromagnetically coupled, and the units are stacked and connected. 2. A microwave bonding circuit comprising a dielectric plate, a center conductor provided on the dielectric plate, and a dielectric sheet laminated on the dielectric plate, wherein one surface of the dielectric plate is A center conductor is directly connected to the transmission line of the microwave circuit, and the other surface of the dielectric plate connects the center conductor and the transmission line of the other microwave circuit to one another of a signal via the dielectric sheet. 2. The microwave circuit device according to claim 1, wherein the connection is made by overlapping by four wavelengths. 3. A microwave bonding circuit comprising a dielectric plate, a center conductor provided on the dielectric plate, and a dielectric sheet laminated on the dielectric plate, wherein the center conductor is formed of the microwave circuit. The transmission line and another transmission line of the microwave circuit are connected by overlapping each other by １ ／ wavelength of a signal on both surfaces of the dielectric plate via the dielectric sheet. 2. The microwave circuit device according to 1. 4. The microwave bonding circuit in which a first ground conductor is formed on a dielectric plate so as to be sandwiched between the center conductors provided on the dielectric plate, and one surface of the dielectric plate is formed by the microwave bonding circuit. A second ground conductor formed so as to be sandwiched between sides of the transmission line of the microwave circuit and the first ground conductor are directly connected, and the other surface of the dielectric plate is connected to another transmission line of the microwave circuit. The third ground conductor formed so as to be sandwiched between the sides and the first ground conductor are connected to each other by overlapping by a quarter wavelength of a signal via a dielectric sheet. Microwave circuit device. 5. The microwave bonding circuit in which a first ground conductor is formed on a dielectric plate so as to be sandwiched between sides of the center conductor provided on the dielectric plate, the first ground conductor being formed by the microwave. The second formed to be sandwiched between the sides of the transmission line of the circuit
And a third ground conductor formed so as to be sandwiched between the sides of the other transmission line of the microwave circuit, on both sides of the dielectric plate via the dielectric sheet. 4. The microwave circuit device according to claim 3, wherein the connection is performed by overlapping by a wavelength. 6. A microwave joining circuit in which said center conductor and said ground conductor are alternately formed so that the center conductor is sandwiched between ground conductors, and the units comprising said microwave circuits are connected to each other. The microwave circuit device according to claim 4. 7. The micro unit according to claim 2, wherein each unit is connected by fitting said microwave joining circuit into a notch provided in said unit comprising a microwave circuit. Wave circuit device. 8. A microwave circuit comprising: a first through hole connected to the transmission line; and a second through hole connected to a ground conductor so as to surround the first through hole as a center. 7. The microwave circuit device according to claim 2, wherein the microwave circuit device is a coaxial line. 9. In a microwave circuit device configured by connecting units formed of a microwave circuit having a transmission line, at least one of the units sandwiches a dielectric substrate whose one surface is a ground conductor between the transmission lines. The transmission line is a slit that exposes the dielectric from the ground conductor that sandwiches the dielectric at a position one quarter wavelength of the signal from the end of the transmission line of each unit. /> Provided and laminated on the base plate and the base plate
And a transmission line formed on the dielectric substrate
A microwave circuit having a path and
A notch portion is provided, and another unit is provided in the notch portion.
And electromagnetically coupled by overlapping the slits
In a microwave circuit device, characterized in that electrically connecting between the units. 10. A slit is provided in a transmission line of the unit.
Vertical to the signal, and has a length equal to half the wavelength of the signal
The microwave circuit device according to claim 9, wherein: