JP3024990B2 - Cutting method of quartz glass material - Google Patents
Cutting method of quartz glass materialInfo
- Publication number
- JP3024990B2 JP3024990B2 JP02229891A JP22989190A JP3024990B2 JP 3024990 B2 JP3024990 B2 JP 3024990B2 JP 02229891 A JP02229891 A JP 02229891A JP 22989190 A JP22989190 A JP 22989190A JP 3024990 B2 JP3024990 B2 JP 3024990B2
- Authority
- JP
- Japan
- Prior art keywords
- quartz glass
- glass material
- excimer laser
- cutting
- energy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
- B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
Description
【発明の詳細な説明】 ［産業上の利用分野］ 本発明は、石英ガラス材料を切断加工する方法に関す
る。Description: TECHNICAL FIELD The present invention relates to a method for cutting quartz glass material.
［従来の技術］ 従来、石英ガラスなどの種々の透明材料を切断加工す
る方法として、バンドソーや内周刃などの直線的な切断
機や、コアドリル、円筒研削機などの円形の加工機械が
使用され直線状又は、円筒状の加工がおこなわれてい
る。[Prior art] Conventionally, as a method of cutting various transparent materials such as quartz glass, a linear cutting machine such as a band saw or an inner peripheral blade, or a circular processing machine such as a core drill or a cylindrical grinding machine is used. Straight or cylindrical processing is performed.
また、不定形の切断加工には炭酸ガスレーザーを使用
したレーザー加工機等が使用されている。In addition, a laser processing machine using a carbon dioxide gas laser or the like is used for irregular cutting.
［発明が解決しようとする課題］ 従来の切断加工機械のバンドソーや、内周刃などでは
直線的な切断加工のみであり、また、コアドリル、円筒
研削機などの円形の加工機械は、円筒形の切断のみであ
り、複雑な加工には使用できなかった。炭酸ガスレーザ
ーを利用したレーザー切断機では、炭酸ガスレーザービ
ームの波長はガラスを透過しないため、材料表面部に集
光し表面より溶断して行くが、この場合溶断表面より内
部へ進行するに従って、溶断面のピットによりレーザー
ビームがさえぎられるので、溶断する厚さに対し限度が
あり、現状では10mm程度が限界である。[Problems to be Solved by the Invention] Conventional cutting machines such as band saws and inner peripheral blades only perform linear cutting, and circular machining machines such as core drills and cylindrical grinders have a cylindrical shape. It was only cutting and could not be used for complicated processing. In a laser cutting machine using a carbon dioxide laser, the wavelength of the carbon dioxide laser beam does not pass through the glass, so it is condensed on the surface of the material and cuts off from the surface. Since the laser beam is interrupted by the pits in the fused section, there is a limit to the thickness at which the laser beam can be blown, and currently the limit is about 10 mm.
本発明は、石英ガラス材料を複雑な形状に切断加工す
ることを目的とし、被加工物の厚味に影響を受けず、厚
板であっても自由な切断加工を可能とすることを目的と
している。The present invention aims at cutting quartz glass material into a complicated shape, without being affected by the thickness of the workpiece, and with the object of enabling free cutting even with a thick plate. I have.
［課題を解決するための手段］ そこで、本発明は、石英ガラスのバンドギャップより
低エネルギーの波長140nm以上のエキシマレーザーを多
光子吸収が発生するように集光して照射し、石英ガラス
材料内部に微小なクラックを発生させることによって切
断加工しようとするものである。[Means for Solving the Problems] In view of the above, the present invention provides an excimer laser having a wavelength of 140 nm or more, which is lower in energy than the band gap of quartz glass, is condensed and irradiated so as to generate multiphoton absorption, and the inside of the quartz glass material is irradiated. In this case, a cutting process is performed by generating minute cracks.
エキシマレーザーは、XeF（351nm）,XeCl（308nm）,K
rF（248nm）,ArF（193nm）等が挙げられる。Excimer laser, XeF (351nm), XeCl (308nm), K
rF (248 nm), ArF (193 nm) and the like.
石英ガラス材料のエキシマレーザーに対する吸収特性
に応じて、適切なエキシマレーザーを選択する必要があ
る。It is necessary to select an appropriate excimer laser depending on the absorption characteristics of the quartz glass material with respect to the excimer laser.
エキシマレーザーは、100Hz以上の高くりかえし周波
数の方が効率的である。Excimer lasers are more efficient at high repetition frequencies of 100 Hz and above.
焦点の移動は、光学的に焦点位置を移動させても、ま
た、ワークを移動させても良く、操作しやすい方法を適
宜選択できる。The focal point can be moved by moving the focal point optically or by moving the work, and a method that is easy to operate can be appropriately selected.
焦点は、最初ワークの下側に合せ、それから上方に移
動させるのが効率的である。最初に、ワークの上方に焦
点を合せると、切断部分によりエキシマレーザーが部分
的に切断されてしまい作業効率が悪くなるからである。It is efficient to focus first on the underside of the workpiece and then move it upward. First, if the focus is placed on the upper side of the work, the excimer laser is partially cut by the cut portion, and the work efficiency is deteriorated.
エキシマレーザーが通過する表面は研磨しておき、ビ
ームが表面で散乱するのを防止し、焦点位置にビームが
集中するようにするのが好ましい。The surface through which the excimer laser passes is preferably polished to prevent the beam from being scattered on the surface and to concentrate the beam at the focal position.
［作用］ 石英ガラス材料に吸収されないエキシマレーザーを、
レンズやミラーから構成される光学系を介して石英ガラ
ス材料の内部に焦点を合せ、エキシマレーザーを石英ガ
ラス材料内部に照射する。すると、エキシマレーザーの
照射された個所に数十ミクロン以下の微小なクラックが
発生する。エキシマレーザーの照射位置を移動させて、
石英ガラス材料に連続的なクラックを発生させることに
よって石英ガラス材料を切断加工する。[Function] Excimer laser that is not absorbed by quartz glass material
Focus is made inside the quartz glass material via an optical system composed of lenses and mirrors, and an excimer laser is irradiated inside the quartz glass material. Then, a minute crack of several tens of microns or less is generated at a location irradiated with the excimer laser. By moving the irradiation position of the excimer laser,
The quartz glass material is cut by generating continuous cracks in the quartz glass material.
クラックの発生について更に詳しく説明する。 The occurrence of cracks will be described in more detail.
固体中では、荷電子のエネルギー準位は帯状のいわゆ
るバンド構造をとっている。絶縁体ではバンドギャップ
以下のフォトンエネルギーのフォトン、すなわち、長波
長の光は吸収しない。In a solid, the energy level of valence electrons has a band-like so-called band structure. The insulator does not absorb photons having a photon energy smaller than the band gap, that is, light having a long wavelength.
しかし、バンドギャップよりも低エネルギーの光で
も、レンズで集光するなどしてフォトン密度を極端に高
くすると、２個あるいは、それ以上のフォトンを同時に
吸収することにより、電子が充満帯（エネルギーギャッ
プよりエネルギーの低いエネルギーバンド）から伝導帯
（エネルギーギャップよりエネルギーが高く、通常の状
態では電子の存在しないエネルギーバンド）に励起され
る。However, even if light with a lower energy than the bandgap is used, if the photon density is extremely increased by condensing with a lens or the like, two or more photons are simultaneously absorbed, so that electrons are filled with energy (energy gap). It is excited from a lower energy band to a conduction band (an energy band higher in energy than the energy gap and free of electrons in a normal state).
このように、フォトンを同時に２個吸収することを２
光子吸収、更に一般に複数個吸収することを多光子吸収
という。Thus, the simultaneous absorption of two photons is considered to be 2
Photon absorption, and more generally absorption of a plurality of photons, is called multiphoton absorption.
この発明においては、多光子吸収を利用して、バンド
ギャップよりエネルギーが低く、本来、吸収の起こらな
い波長の光を石英ガラス材料に吸収させることにより、
石英ガラス材料の結合ボンドを切断したり、あるいは、
発熱を利用して微小なクラックを石英ガラス材料内部に
発生させるのである。In the present invention, by utilizing multiphoton absorption, the energy having a lower energy than the band gap, which is originally absorbed by a quartz glass material, is absorbed by a quartz glass material.
Cutting the bond bond of quartz glass material, or
Using heat generation, minute cracks are generated inside the quartz glass material.
石英ガラスでは、このバンドギャップは約9eV（140n
m）である。石英ガラス中に不純物や欠陥構造が無い限
り、バンドギャップよりも低エネルギー、すなわち、長
波長の光は、通常吸収しない。For quartz glass, this band gap is about 9 eV (140n
m). As long as there is no impurity or defect structure in the quartz glass, light having an energy lower than the band gap, that is, light having a long wavelength is not normally absorbed.
ここでエキシマレーザーの波長とフォトンエネルギー
を以下に示す。Here, the wavelength and photon energy of the excimer laser are shown below.
従って、エキシマレーザーはすべて波長が140nmより
長いので、通常は吸収が起きないはずである。しかし、
前記の、多光子吸収によって吸収が起こり、このため結
合ボンドの開裂あるいは発熱作用を生じ微細なクラック
が内部に発生するのである。 Therefore, all excimer lasers should have no absorption, since the wavelengths are all longer than 140 nm. But,
Absorption occurs due to the multiphoton absorption described above, so that the bond bond is cleaved or heat is generated, and a fine crack is generated inside.
荷電子を充満帯から伝導帯に励起するのに必要なフォ
トン数は、石英ガラスのバンドギャップ9eVを超えるた
めに必要な個数である。The number of photons required to excite valence electrons from the full band to the conduction band is the number required to exceed the band gap of quartz glass of 9 eV.
［実施例］ 次に、本発明を実施例によって更に詳しく説明する。[Examples] Next, the present invention will be described in more detail with reference to Examples.
実施例１ 150×150×150mmの合成石英ガラス（OH 1300ppm含
有）を使用し、エキシマレーザーとしては、不安定共振
器を用いたエキシマレーザー（KrF 248nmエネルギー密
度 50mJ/cm3パルス、くりかえし周波数150Hz）を使用
し、焦点距離500mmのレンズで集光し、ミラーで反射さ
せ、上面を予め研磨したワークである厚板の合成石英ガ
ラスの内部にエキシマレーザービームの焦点を合せエキ
シマレーザーをワークの上面から照射し、ワークを3r.
p.mの回転数で回転させながら、焦点の位置を3mm/minの
速さでワーク底面より引き上げることにより、直径30mm
の円筒形の孔を開けた。Using Example 1 150 × 150 × 150mm synthetic quartz glass (OH 1300 ppm containing), as the excimer laser, an excimer laser using an unstable resonator (KrF 248 nm energy density 50 mJ / cm 3 pulse, repetition frequency 150 Hz) Focus the light with a lens with a focal length of 500 mm, reflect it with a mirror, focus the excimer laser beam inside a thick synthetic quartz glass that is a work whose upper surface is polished in advance, and apply an excimer laser from the top of the work Irradiate the work for 3r.
By rotating the focal point at a speed of 3 mm / min from the bottom of the work while rotating at a rotation speed of pm, the diameter is 30 mm.
A cylindrical hole was made.
このとき、ワーク内部におけるエキシマレーザーのビ
ームの垂直方向の焦点位置は、レンズの位置を移動させ
ることによって変化させた。At this time, the vertical focus position of the excimer laser beam inside the work was changed by moving the position of the lens.
また、ワーク内部での焦点位置の水平方向の移動は、
ワーク自体を水平方向に移動させることによっておこな
った。Also, the horizontal movement of the focal position inside the work
This was performed by moving the work itself in the horizontal direction.
切断に当っては、焦点位置は、ワークの底面から上方
向に移動させた。In cutting, the focal position was moved upward from the bottom surface of the work.
［効果］ 以上、述べてきたように、石英ガラス材料の内部に焦
点を合せ、石英ガラス材料に対し吸収の無いエキシマレ
ーザーを照射すると、微細なクラックが石英ガラス材料
の内部に発生する。これを連続させることによって石英
ガラス材料を複雑な形状に切断加工できる。[Effect] As described above, when the inside of the quartz glass material is focused and the quartz glass material is irradiated with an excimer laser having no absorption, fine cracks are generated inside the quartz glass material. By making this continuous, the quartz glass material can be cut into a complicated shape.
焦点をワークの内部に結ばせているのでワークの厚味
に影響を受けず、自由な形状に加工できる。Since the focus is focused inside the work, it can be processed into any shape without being affected by the thickness of the work.
焦点の移動をコンピュータにプログラムしておくこと
によって、円錐形、ひょうたん型など、その形状は制約
を受けないといってもよいものである。By programming the movement of the focal point in the computer, the shape such as a cone or a gourd is not restricted.
第１図は本発明の概念図である。 FIG. 1 is a conceptual diagram of the present invention.
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 昭62−54587（ＪＰ，Ａ) 特開 昭63−121015（ＪＰ，Ａ) 特開 昭57−209838（ＪＰ，Ａ) 特開 平１−271084（ＪＰ，Ａ) (58)調査した分野(Int.Cl.7，ＤＢ名) B23K 26/00 ──────────────────────────────────────────────────続 き Continuation of front page (56) References JP-A-62-54587 (JP, A) JP-A-63-121015 (JP, A) JP-A-57-209838 (JP, A) JP-A-1- 271084 (JP, A) (58) Fields investigated (Int. Cl. 7 , DB name) B23K 26/00
Claims (3)
ギーの波長140nm以上のエキシマレーザーを多光子吸収
が発生するように集光して照射する石英ガラス材料の切
断加工方法。1. A method for cutting a quartz glass material in which an excimer laser having a wavelength of 140 nm or more having a lower energy than the band gap of the quartz glass is condensed and irradiated so as to generate multiphoton absorption.
ス材料の下側にエキシマレーザーを集光し、次に、上方
に焦点を移動させる石英ガラス材料の切断加工方法。2. A method for cutting a quartz glass material according to claim 1, wherein an excimer laser is focused on a lower side of the quartz glass material, and then the focal point is moved upward.
て、エキシマレーザーは、100Hz以上の高くりかえし周
波数である石英ガラス材料の切断加工方法。3. A method for cutting a quartz glass material according to claim 1, wherein the excimer laser has a high repetition frequency of 100 Hz or more.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP02229891A JP3024990B2 (en) | 1990-08-31 | 1990-08-31 | Cutting method of quartz glass material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP02229891A JP3024990B2 (en) | 1990-08-31 | 1990-08-31 | Cutting method of quartz glass material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04111800A JPH04111800A (en) | 1992-04-13 |
| JP3024990B2 true JP3024990B2 (en) | 2000-03-27 |
Family
ID=16899342
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP02229891A Expired - Fee Related JP3024990B2 (en) | 1990-08-31 | 1990-08-31 | Cutting method of quartz glass material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3024990B2 (en) |
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| US10068801B2 (en) | 2002-03-12 | 2018-09-04 | Hamamatsu Photonics K.K. | Substrate dividing method |
| US10622255B2 (en) | 2002-03-12 | 2020-04-14 | Hamamatsu Photonics K.K. | Substrate dividing method |
| CN100448593C (en) * | 2002-03-12 | 2009-01-07 | 浜松光子学株式会社 | Laser machining method |
| US11424162B2 (en) | 2002-03-12 | 2022-08-23 | Hamamatsu Photonics K.K. | Substrate dividing method |
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| JPH04111800A (en) | 1992-04-13 |
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