JP3000225B2 - Electrical connection member and method of manufacturing the same - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to an electrical connection member used when electrically connecting electric circuit components to each other, and a method of manufacturing the same.

[Conventional technology]

As a method of electrically connecting electric circuit components to each other,
Wire bonding method, TAB (Tape Automated bondin)
g) The method is conventionally known. However, these methods have drawbacks such as an inability to cope with an increase in the number of connection points between the two electric circuit components and an increase in cost. In order to solve such difficulties, it is necessary to electrically connect the electric circuit components to each other by using an electric connection member having a configuration in which a plurality of conductive members are provided insulated from each other in an insulating holder. It is known (JP-A-63-22224, JP-A-63-2242).
No. 35 gazette).

FIG. 3 is a schematic diagram showing such an electrical connection member and an electrical connection between electrical circuit components using the same, in which 31 is an electrical connection member, and 32 and 33 are electrical circuits to be connected. Show parts. The electrical connection member 31 includes a plurality of conductive members 34 made of a metal or an alloy, each of which is electrically insulated from each other in a holding body 35 made of an electrically insulating material. The one end 38 of the conductive member 34 protrudes toward one electric circuit component 32, and the other end 39 of the conductive member 34 protrudes toward the other electric circuit component 33 (FIG. 3A). Then, the projecting one end 38 of the conductive member 34 is deformed and joined to the connecting portion 36 of the one electric circuit component 32 by thermocompression bonding, crimping or the like, and the connecting portion 37 of the other electric circuit component 33 is joined.
The other end 39 of the conductive member 34 is deformed and bonded by thermocompression bonding, crimping, or the like (FIG. 3 (b)). In this way, the corresponding connection portions 36, 37 of the electric circuit components 32, 33 are connected.

Such an electrical connection member has the following advantages.

By miniaturizing the size of the conductive member, the connection portion of the electric circuit component can be reduced in size and the number of connection points can be increased, so that higher-density connection between the electric circuit components can be achieved.

Even for electric circuit components with different thicknesses, changing the thickness of the electrical connection member makes it possible to keep the height of the electric circuit components constant at all times. Is possible.

By increasing the protruding height of the conductive member connected to the connection portion of the electric circuit component, stable connection can be performed even if the connection portion of the electric circuit component is dropped from the surface, and the Even electrical circuit components having a shape can be easily connected.

Since the heat generated from the electric circuit component is radiated through the holder of the electric connection member, the change in the electric characteristics due to the heat is extremely small. In addition, since the heat radiation characteristics are excellent, the influence of thermal fatigue is small and the reliability is high.

Since the connection length of the connection between the electric circuit components is shortened, the impedance can be reduced and the speed of the electric circuit components can be increased.

As a method of manufacturing such an electrical connection member, there is a method proposed in Japanese Patent Application Laid-Open No. 63-133401. Hereinafter, the fourth step of this manufacturing method is schematically shown.
This will be briefly described with reference to the drawings.

First, a substrate 51 made of a metal sheet such as a copper plate is prepared (FIG. 4A), a negative photosensitive resin 52 is applied on the substrate 51 by a spin coater, and prebaked at a temperature of about 100 ° C. (FIG. 4 (b)). After irradiating (exposing) the photosensitive resin 52 with light through a photomask (not shown) having a predetermined pattern, development is performed. The photosensitive resin 52 remains in the exposed portions, and in the unexposed portions, the photosensitive resin 52 is removed by a developing process to form a plurality of holes 53 (FIG. 4 (c)). After the temperature is raised to 200 to 400 ° C. to cure the photosensitive resin 52, the substrate 51 is immersed in an etchant and etched to form a concave portion 54 communicating with the hole 53 in the substrate 51 (fourth). Figure (d). Then
Gold plating is performed using the base 51 as a common electrode, and the holes 53 and the recesses 5 are formed.
4 is filled with gold 55, and gold plating is continued until a bump is formed (FIG. 4 (e)). Finally, the base 51 is removed by etching to manufacture the electrical connection member 31 (FIG. 4 (f)).

In the electrical connection member 31 manufactured in this manner, the gold 55 constitutes the conductive member 34, and the photosensitive resin 52 is
Make up 35. The conductive member 34 includes a member 34a (hereinafter referred to as a columnar portion 34a) embedded in the holder 35 and portions 34b (ends 38, 39 in FIG. 3) protruding from both surfaces of the holder 35.
Hereinafter, referred to as a bump portion 34b). The dimensions of each part of the electrical connection member 31 are
The thickness of the (photosensitive resin 52) is about 10 μm, the diameter of the conductive member 34 (columnar portion 34a) is about 15 μm, the pitch is about 40 μm, and the protrusion amount of the conductive member 34 is about several μm on both sides.

[Problems to be solved by the invention]

By the way, when the conductive member of such an electrical connection member is bonded to the connection portion of the electric circuit component by crimping or thermocompression, both the columnar portion 34a and the bump portion 34b are deformed, so that the bump portion 34b is deformed. Extra force is required. Therefore, in order to join the conductive member to the connection portion of the electric circuit component as shown in FIG. 3 by deforming the bump portion 34b,
It is necessary to apply 2 to 10 times the pressure of normal compression and thermocompression. As described above, the conventional electric connection member has a disadvantage that it is necessary to perform joining by applying a high load,
There was room for further improvement.

The present invention has been made in view of such circumstances, and by making the hardness of the columnar portion of the conductive member higher than the hardness of the bump portion, the columnar portion reduces deformation as much as possible during crimping and thermocompression bonding. An object of the present invention is to provide an electrical connection member that can easily join a conductive member to a connection portion of an electric circuit component even when a low load is applied, and a method for manufacturing the same.

[Means for solving the problem]

The electrical connection member according to the present invention includes a holder made of an electrically insulating material, and a plurality of conductive members provided in the holder in an insulated state from each other. In the electrical connection members protruding on both surfaces of the holding body, each of the conductive members is made of a single kind of conductive material, and a portion embedded in the holding body is larger than a portion protruding from the holding body. It is characterized by high hardness.

A first method for manufacturing an electrical connection member according to the present invention includes a holder made of an electrically insulating material, and a plurality of conductive members provided in the holder in an insulated state from each other. In a method for manufacturing an electrical connection member in which both ends of a conductive member protrude on both surfaces of the holder, a step of providing an insulating layer serving as the holder on a base, and removing the insulating layer by patterning to form a plurality of layers. Forming a hole, exposing the base, etching and removing a part of the exposed base, filling the formed hole with a conductive material protruding from both surfaces of the insulating layer by plating, A step of forming a conductive member and a step of removing the remaining base, in the step of forming the conductive member by filling the conductive material, compared with a case where a portion embedded in the insulating layer is formed. Protruding from the insulating layer Characterized by raising the temperature of the plating solution in the case of forming a portion.

A second method for manufacturing an electrical connection member according to the present invention includes a holder made of an electrically insulating material, and a plurality of conductive members provided in the holder in an insulated state from each other. In a method for manufacturing an electrical connection member in which both ends of a conductive member protrude on both surfaces of the holding member, a step of providing a holding layer serving as the holding member on a base, and removing a plurality of the insulating layers by patterning the insulating layer Forming a hole, exposing the base, etching and removing a part of the exposed base, filling the formed hole with a conductive material protruding from both surfaces of the insulating layer by plating, A step of forming a conductive material and a step of removing the remaining base, and in a step of filling the conductive material to form a conductive member, compared with a case where a portion embedded in the insulating layer is formed. Protruding from the insulating layer Characterized in that to increase the current density in the case of forming the portions.

[Action]

In the electrical connection member according to the present invention, the hardness of each conductive member made of a single kind of conductive material has a portion embedded in the holder (a columnar portion) and a portion protruding from the holder (a bump portion). ), And the columnar portion has a higher hardness than the bump portion. When such a conductive member is joined to the connection portion of the electric circuit component by hot pressing and pressure bonding, the deformation of the bump portion is larger than the deformation of the columnar portion. Therefore, the load to be applied in this case may be low. Further, the force applied to the holder is reduced, and damage to the holder can be reduced.

In the method for manufacturing an electrical connection member of the present invention, when filling a conductive material to be a conductive member by electrolytic plating, when forming a bump portion, compared with the case of forming a columnar portion, plating Increase the temperature of the liquid or increase the current density. Then, in the columnar portion, the crystal grain of the conductive material becomes smaller, dendritic, or amorphous, and the hardness becomes higher than in the bump portion.

〔Example〕

Hereinafter, the present invention will be specifically described with reference to the drawings shown in the embodiments.

1 (a), 1 (b) and 1 (c) are cross-sectional views of an electrical connection member 1 according to the present invention. The electrical connection member 1 includes a plurality of conductive members 2 made of, for example, gold, and a holder 3 made of, for example, a polyimide resin provided with the conductive members 2 so that the respective conductive members 2 are in an electrically insulated state. Have been. Each conductive member 2 has both ends protruding from both surfaces of the holder 3, and a columnar portion 2 a embedded in the holder 3,
It comprises two bump portions 2b, 2b protruding from the holder 3. The hardness of the columnar portion 2a and the bump portion 2b constituting the conductive member 2 is different, and the hardness of the columnar portion 2a is different from that of each bump portion.
2b, higher than 2b hardness. The dimensions of each part of the electrical connection member 1 are substantially the same as those of the conventional one, and the thickness of the holder 3 is about 10 μm, the diameter of the conductive member 2 (columnar portion 2a) is about 15 μm, 2 is about 40 μm, and the amount of protrusion of the conductive member 2 (the protrusion height of each bump 2b, 2b) is about 5 μm.
μm.

Next, an example of a method for manufacturing an electrical connection member having such a configuration (a method for manufacturing an electrical connection member according to the present invention) will be described with reference to FIG.

First, a copper plate 11 serving as a base is prepared (FIG. 2A), and a polyimide resin of a negative photosensitive resin is formed on one surface of the copper plate 11.
12 is applied and prebaked at a temperature of about 100 ° C. (FIG. 2B). The thickness of the polyimide resin 12 to be applied is set to be larger than a desired thickness of the holding member in the manufactured electrical connection member in consideration of a decrease due to curing shrinkage. In addition, as a coating method, a spin coater, a roll coater, or the like can be used, and any method may be adopted as long as a uniform film thickness can be obtained.

After irradiating (exposing) light to the polyimide resin 12 through a photomask (not shown) having a predetermined pattern,
Perform development. In this example, the polyimide resin 12 remains in the exposed portion, and the polyimide resin 12 is removed by a development process in the unexposed portion, and a plurality of holes 13 are formed in the polyimide resin 12 (FIG. 2 (c)). )). Then reduce the temperature to 20
The temperature is raised to 0 to 400 ° C. to cure the polyimide resin 12.

Next, the copper plate 11 thus treated is immersed in an etching solution to perform etching. Copper plate near hole 13
A recess 14 communicating with the hole 13 is formed in the copper plate 11 by removing a part of 11 by etching (FIG. 2 (d)). At this time, the diameter of the recess 14 to be formed is larger than the diameter of the hole 13 and smaller than half the distance to the outer periphery of the adjacent hole 13. As described above, by controlling the size of the concave portion 14, an electrical connection member in which adjacent conductive members do not conduct with each other and the conductive members do not drop out can be manufactured.

Next, the copper plate 11 is used as a common electrode, and the holes 13 and the concave portions 14 are filled with gold 15 by electrolytic plating using a sulfurous acid-based gold plating solution (for example, Neutronex 21ON). Gold plating is continued until the gold 15 protrudes from the surface of the polyimide resin 12 to form the conductive member 2 made of the gold 15 (FIG. 2 (e)). Here, in the manufacturing method of the present invention, the concave portion 14
In addition, when the portions protruding from the polyimide resin 12 are plated with gold to form the bumps 2b, 2b, the temperature of the plating solution is set higher than when the holes 13 are plated with gold to form the columnar portions 2a. For example, the plating conditions for forming the bumps 2b, 2b are as follows: the temperature of the plating solution is set to 60 ° C., the time is set to 30 minutes, the deposition thickness is set to 5 μm, and the plating conditions for forming the columnar portion 2a are: The temperature of the plating solution was set at 20 ° C., the time was set at 40 minutes, and the deposition thickness was set at 10 μm. In each case, the current density was always constant (0.4 A / cm ² ). Finally, copper is etched but gold
The copper plate 11 is removed by metal etching using an etchant that does not etch the 15 and the polyimide resin 12, thereby manufacturing the electrical connection member 1 as shown in FIG. 1 (FIG. 2 (f)).

In this embodiment, in the manufactured electrical connection member 1, the gold 15 constitutes the conductive member 2 and the polyimide resin 12 constitutes the holder 3. Since the conductive member 2 is formed by changing the temperature of the plating solution, the bumps 2b, 2b
The crystal grains are smaller than b and the hardness is higher. Under the plating conditions as described above, the hardness of the columnar portion 2a is 100 to 1
The hardness was 20 degrees (Vickers hardness), and the hardness of the bumps 2b, 2b was 60 to 80 degrees (Vickers hardness).

In the above-described embodiment, the temperature of the plating solution was changed.
Even when gold plating is performed by setting the current density at the time of forming 2b, 2b higher than the current density at the time of forming the columnar portion 2a, the electrical connection member 1 as shown in FIG. 1 can be manufactured. . For example, the plating conditions for forming the bumps 2b, 2b were set to a current density of 0.8 A / cm ² , a time of 15 minutes, and a deposition thickness of 5 μm.
0.4A / cm ² , time 40 minutes, deposition thickness 10μm, the hardness of the columnar portion 2a is 80-100 degrees when the plating solution temperature is always constant (40 ° C) in any case. And the bumps 2b, 2b
Has a hardness of 60 to 80 degrees. The other steps are the same as those in the embodiment in which the temperature of the plating solution is changed, and thus the description thereof is omitted.

Also, in the gold plating step, it is a matter of course that the electrical connection member 1 as shown in FIG. 1A can be manufactured even when both the temperature of the plating solution and the current density are changed.

By the way, in the above-mentioned electric connection member, the bump portions 2b, 2b of the conductive member 2 are assumed to have uniform hardness, but they need not necessarily be uniform as shown in FIG. 1 (c). The configuration may be such that the hardness gradually increases as the distance from the columnar portion 2a increases. When the electrical connection member having such a configuration is manufactured, the temperature or the current density of the plating solution is continuously changed when the bump portions 2b, 2b of the conductive member 2 are formed in the gold plating process. What should I do? Further, as shown in FIG.
The columnar portion 2a is not necessarily uniform in hardness, and may have a configuration in which hardness increases at the center.

In this embodiment, gold is used as the material of the conductive member 2. However, in addition to gold (Au), Cu, Ag, Be, Ca, Mg, Mo, Ni, W, Fe, T
Metals or alloys such as i, In, Ta, Zn, Al, Sn, and Pb-Sn can be used. Further, a material in which one or both of an organic material and an inorganic material are contained in a metal material may be used. The cross-sectional shape of the conductive member 2 can be circular, square, or any other shape, but preferably has no corners in order to avoid excessive concentration of concave force. Further, the conductive member 2 does not need to be vertically discharged into the holder 3 and may be obliquely moved from one surface of the holder 3 to the other surface of the holder 3.

Further, in the present embodiment, the polyimide resin 12 is used as the holding member 3, but there is no particular limitation. Hole due to exposure and development
In the case of forming the holes 13, it is necessary to use a photosensitive resin, but if the holes 13 are formed by, for example, irradiation of a high energy beam instead of exposure and development processing, the resin must be a photosensitive resin. Nor. In addition, one or more of inorganic materials, metal materials, and alloy materials having a desired shape such as powder, fiber, plate, rod, and sphere may be dispersed and contained in the resin. Good. Specifically, as the contained metal material and alloy material, Au, Ag, Cu, Al, Be, Ca, Mg, Mo, Fe, Ni, C
o, Mn, W, Cr, Nb, Zr, Ti, Ta, Zn, Sn, Pb-Sn and the like, as inorganic materials _{contained, SiO 2, B 2 O 3} , Al 2 O 3, Na 2 O, K ₂ O, C
aO, ZnO, BaO, PbO, Sb 2 O 3, As 2 O 3, La 2 O 3, ZrO 2, P 2 O 5, TiO 2, Mg
O, SiC, BeO, BP, BN, AlN, B ₄ C, TaC, TiB ₂ , CrB ₂ , TiN, Si ₃ N ₄ , Ta
Ceramics such as ₂ O ₅ , diamond, glass, carbon, boron and the like can be mentioned.

Further, although the copper plate 11 was used as the base in the present embodiment, the present invention is not limited to this, but Au, Ag, Be, Ca, Mg, Mo, Ni, W, Fe, Ti, In, Ta, Zn, A
Thin plates of metals or alloys such as l, Sn, Pb-Sn can be used.
However, since only the substrate is selectively etched away in the final step, it is necessary to make the material of the conductive member 2 different from the material used for the substrate.

〔The invention's effect〕

As described in detail above, in the electrical connection member of the present invention, in each conductive member made of a single type of conductive material, the hardness of the columnar portion is higher than the hardness of the bump portion. When a member is thermocompression-bonded or crimped to the connection part of an electric circuit component, the bump part deforms better than the columnar part, and the conductive member can be joined to the connection part of the electric circuit part with a low load. It is possible. In the past, when a large number of conductive members were used, an extremely large load had to be applied in batch joining. However, in the case of the electrical connection member of the present invention, the deformed portion was concentrated on the bump portion. , It is possible to join a large number of conductive members to the connection portion of the electric circuit component at once. Furthermore, the applied load becomes a load for deforming the bump, and the bump deformation amount can be easily controlled, so that high-density bonding can be performed.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view of an electrical connection member according to the present invention, FIG. 2 is a schematic cross-sectional view showing steps of an embodiment of a manufacturing method according to the present invention, and FIG. FIG. 4 is a schematic sectional view showing steps of a conventional manufacturing method. DESCRIPTION OF SYMBOLS 1 ... Electrical connection member, 2 ... Conductive member, 2a ... Column-shaped part, 2b ... Bump part, 3 ... Holder, 11 ... Copper plate, 12 ...
... Polyimide resin, 13 ... Hole, 14 ... Recess, 15 ... Gold

──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Hiroshi Kondo 3-30-2 Shimomaruko, Ota-ku, Tokyo Canon Inc. (72) Inventor Takashi Sakaki 3-30-2 Shimomaruko, Ota-ku, Tokyo Canon (72) Inventor Yoshimi Terayama 3-30-2 Shimomaruko, Ota-ku, Tokyo Canon Inc. (72) Yoichi Tamura 1-3-1, Otemachi, Chiyoda-ku, Tokyo Sumitomo Metal Industries, Ltd. (72) Inventor Takahiro Okabayashi 1-3-1 Otemachi, Chiyoda-ku, Tokyo Sumitomo Metal Industries, Ltd. (72) Inventor Kazuo Kondo 1-3-1, Otemachi, Chiyoda-ku, Tokyo Sumitomo Metal Industries, Ltd. (72) Inventor Yasuo Nakatsuka 1-3-1 Otemachi, Chiyoda-ku, Tokyo Sumitomo Metal Industries, Ltd. (72) Inventor Yuichi Ikegami Osaka, Osaka Chuo-ku Kitahama 4-chome No. 5 No. 33 Sumitomo Metal Industries, Ltd. in the (56) Reference Patent flat 3-276512 (JP, A) (58 ) investigated the field (Int.Cl. ^7, DB name) H01R 43 / 00 H01R 11/01 H01L 21/60

Claims (3)

(57) [Claims] 1. A holding body made of an electrically insulating material, and a plurality of conductive members provided in the holding body in an insulated state from each other, and both ends of each of the conductive members are formed on both surfaces of the holding body. In the electrical connection member protruding, the conductive members are made of a single type of conductive material, and a portion embedded in the holder has a higher hardness than a portion where the holder protrudes. An electrical connection member characterized by the following. 2. A holding body made of an electrically insulating material, and a plurality of conductive members provided in the holding body in an insulated state from each other, and both ends of each of the conductive members are provided on both sides of the holding body. A step of providing an insulating layer serving as the holder on a base, and a step of exposing the base by removing a pattern of the insulating layer to form a plurality of holes. And a step of etching and removing a part of the exposed base, filling a formed hole with a conductive material protruding from both sides of the insulating layer by plating to form the conductive member, and forming the conductive member. Removing the base, and forming a portion protruding from the insulating layer as compared to forming a portion embedded in the insulating layer in the step of forming the conductive member by filling the conductive material. Plating solution A method of manufacturing an electrical connection member, wherein the temperature of the electrical connection member is increased. 3. A holder comprising an electrically insulating material, and a plurality of conductive members provided in the holder in a state of being insulated from each other, wherein both ends of each of the conductive members are provided on both sides of the holder. A step of providing an insulating layer serving as the holder on a base, and a step of exposing the base by removing a pattern of the insulating layer to form a plurality of holes. And a step of etching and removing a part of the exposed base, filling a formed hole with a conductive material protruding from both sides of the insulating layer by plating to form the conductive member, and forming the conductive member. Removing the base, and forming a portion protruding from the insulating layer as compared to forming a portion embedded in the insulating layer in the step of forming the conductive member by filling the conductive material. Current density The manufacturing method of the electrical connection member characterized by making high.