JP2895570B2 - Electrical connection member and electric circuit member - Google Patents

Description

The present invention relates to an electric connection member and an electric circuit member,
In particular, the present invention relates to an electric circuit member in which an electric connection member and an electric circuit component are connected to a base via the electric connection member.

[Background Art] Conventionally, connection between a base such as a frame body and a circuit board and an electric circuit component is performed by a connector method, a crimp terminal method, a soldering method,
Wire bonding method, TAB (Tape Automated Bonding) method, C
CB (Controlled collapsed bonding: Con
Methods such as a controlled collapsed bonding method and a method using an anisotropic conductive film are known. However, these methods have a problem that the minimum pitch for preventing adjacent connecting portions from contacting each other is relatively large, so that it is impossible to cope with a case where a small pitch between connecting portions is required. Was. Further, such a method has a problem in terms of electrical characteristics because the length of the wiring is increased and the resistance value is increased, and the stray capacitance is increased. This was particularly noticeable in high-frequency electric circuits.

In order to solve such a problem, an electric connection member having a configuration in which a plurality of conductive members are mutually insulated and held in an insulating holder, or wiring is provided inside the insulating holder and / or on the surface of the holder. A method of electrically connecting electric circuit components to each other using an electric connection member having a configuration in which both ends of a connecting conductive member are exposed on both surfaces of the holding member so as to be the same as or protrude from the surface of the holding member. (Japanese Patent Laid-Open No. 63-63)
222437, JP-A-63-224235, etc.).

FIGS. 6 (a) and 6 (b) are schematic diagrams showing electrical connections between electric circuit components using such one electrical connection member, wherein 1 is an electrical connection member, Reference numeral 3 denotes an electric circuit component to be connected. The electrical connection member 1 holds a plurality of rod-shaped conductive members 4 made of a metal or an alloy in a holding body 5 on a thin plate made of an electrically insulating material by electrically insulating the conductive members 4 from each other. The electrical circuit components 2 and 3 are formed by setting both ends of the conductive member 4 as bumps 8 and 9, respectively.
Side (see FIG. 6 (a)).

Then, the connection portion 6 of the one electric circuit component 2 and the bump 8 of the conductive member 4 and the connection portion 7 of the other electric circuit component 3 and the bump 9 of the conductive member 4 are each bonded by, for example, thermocompression bonding or ultrasonic wave. The electrical circuit components 2 and 3 are electrically connected by metallization and / or alloying by a heating method or the like (see FIG. 6 (b)).

By the way, as a method of manufacturing the electrical connection member 1, a method shown in FIGS. 7A to 7E has been proposed. In this method, first, a photosensitive resin 11 serving as the holder 5 is applied on a copper foil 10 made of a conductive material (see FIG. 7A). Next, by exposing and developing a predetermined position for embedding the conductive member 4 in a later step, a hole 12 is formed in the photosensitive resin 11.
Is formed to expose the copper foil 10. Next, the temperature is increased to cure the photosensitive resin 11 (see FIG. 7B). Then, the copper foil 10 in the vicinity of the hole 12 is etched to form a recess 13 below the hole 12 (see FIG. 7C).

Thereafter, the conductive member 4 is filled in the recesses 13 and the holes 12 by plating the copper foil 10 with gold or the like, and the bumps 9 are formed in the recesses 13.
The bumps 8 are formed on the upper surface of the substrate 11 (see FIG. 7D).

Thereafter, the electrical connection member 1 is completed by removing the copper foil 10 by metal etching (see FIG. 7 (e)).

[Problems to be Solved by the Invention] However, metallization and / or alloying by thermocompression bonding, ultrasonic heating, or the like as shown in FIG. The method of connecting the bumps has a problem that the electric circuit components are exposed to heat during the connection, so that connection cannot be made with a material having low heat resistance.

By the way, a method of making electrical connection by bonding at a relatively low temperature without heating at a high temperature has already been known (Japanese Patent Application Laid-Open No.
No. 63-151031). In this method, the electrodes of the circuit board coated with the ultraviolet curable resin and the electrodes of the semiconductor element with bumps are positioned and pressed, and the electrical connection is made by irradiating ultraviolet rays and utilizing the curing shrinkage of the resin. In the method, it is difficult to mix the resin, and there are many technical problems to obtain a desired resin.

In addition, the connection portion is likely to contain the resin, so that the connection resistance value is increased, and the difference in thermal expansion coefficient is increased, thereby causing a quality problem.

Further, since there is a resin between adjacent connection portions, a difference in thermal expansion coefficient is large, so that quality problems such as peeling and cracks are likely to occur.

The present invention has been made in view of such circumstances,
An electric connection member and an electric circuit member that can easily connect electric circuit components at a low temperature by using an electric connection member having a conductive adhesive layer formed by a relatively easy method at a connection portion. The purpose is to provide.

[Means for Solving the Problems] That is, the present invention includes a holder made of an electrically insulating material, and a plurality of conductive members which are mounted on the holder in a mutually insulated state and are exposed. A conductive adhesive layer formed on the conductive members on both surfaces of the holder by electrophoresis from an adhesive resin solution containing one or both of ultrafine metal powder or metalized ceramic powder by electrophoresis. Wherein the conductive adhesive layer is the same as or protrudes from the surface of the holder and is exposed.

Further, the present invention has a holding member made of an electrically insulating material, and a plurality of exposed conductive members provided in the holding member in a mutually insulated state, and a conductive member on both surfaces of the exposed holding member. A conductive adhesive layer formed on the top by an electrophoretic method from an adhesive resin solution containing one or both of ultrafine metal powder or metallized ceramic powder, and the conductive adhesive layer is An electrical connection member that is the same as or protrudes from the surface of the holding member; and at least one or more connection portions, wherein the conductive portion is exposed on one surface of the holding member of the electrical connection member at the connection portion. At least one end of at least one of the conductive adhesive layers is electrically connected by bonding, and at least one or more connection parts, and the connection part holds the electric connection member. On the other side of the body At least one end of the conductive adhesive layer exposed by There are an electric circuit member, characterized in that it comprises at least one or more electrical circuit components are electrically connected by bonding.

 Hereinafter, the present invention will be described in detail.

The electrical connection member according to the present invention includes an electrical connection member having a holder made of an electrically insulating material, and a plurality of conductive members that are mounted on the holder in a mutually insulated state and are exposed. On the conductive members on both sides of the body, a conductive adhesive layer formed by codeposition from an adhesive resin solution containing one or both of ultrafine metal powder or metalized ceramic powder by electrophoresis. And the conductive adhesive layer is configured to be the same as or protrude from the surface of the holder and exposed.

This conductive adhesive layer is usually in a solid state, but the present invention is not limited to this. For example, a case in which a layer which is heated to a gel state or a sol state is used.

The average particle size of the ultrafine metal powder contained in the conductive adhesive layer formed on the conductive member of the electrical connection member is 0.01 to
The average particle size of 2 μm and the metalized ceramic powder is preferably in the range of 0.1 to 5 μm. The content of one or both of the ultrafine metal powder and the metalized ceramic powder contained in the conductive adhesive layer is preferably in the range of 30 to 80 wt%.

Next, an electric circuit member of the present invention has the above-described electric connection member and at least one or more connection portions, and the connection portion is exposed on one surface of a holder of the electric connection member. At least one end of at least one of the conductive adhesive layers has at least one or more electric circuit components electrically connected by bonding, and at least one or more connection parts,
At least one end of at least one of the conductive adhesive layers exposed on the other surface of the holder of the electrical connection member at the connection portion is connected to at least one or more electric circuit components electrically connected by bonding. Have

That is, using the above-mentioned electric connection member, the connection portion of one electric circuit component and the conductive adhesive layer of the electric connection member are electrically connected by bonding, and the connection portion of the other electric circuit component is electrically connected to the connection portion of the other electric circuit component. This is an electric circuit member formed by electrically connecting the conductive connection layer of the electrical connection member to the conductive adhesive layer by adhesion.

Since the electric circuit member of the present invention can connect low-heat-resistant electric circuit components by bonding at a relatively low temperature, the connection is easy, and the selection range of the electric circuit components is widened and the application range is wide. Become.

In addition, since only the connection portion is connected, a quality problem due to a difference in thermal expansion coefficient can be avoided, and an electric circuit member having good quality characteristics can be obtained.

Further, in the electric circuit member according to the present invention, the connection portion of the electric circuit component is formed by an electrophoretic method from an adhesive resin solution containing one or both of ultrafine metal powder or metalized ceramic powder. Of the conductive member having the conductive adhesive layer exposed at one surface of the holder of the electrical connection member, at least one connection portion having the conductive adhesive layer formed. Preferably, at least one end is electrically connected by bonding.

Further, at least one of the ultrafine metal powder and the metalized ceramic powder is provided on at least a part of the metal surface opposite to the surface having the connection portion of at least one or more electric circuit components of the electric circuit member. By providing a conductive adhesive layer formed by codeposition from an adhesive resin solution containing the same, an electric circuit member having excellent electrostatic shielding properties can be obtained.

The electric circuit components used in the electric circuit member of the present invention are preferably, for example, electric circuit components such as a frame, a resin circuit board, a metal circuit board, a ceramic circuit board, a lead frame, and a semiconductor element.

[Example] Hereinafter, the present invention will be described more specifically with reference to examples.

Embodiment 1 FIGS. 1 (a) and 1 (b) are schematic views showing an embodiment of an electric circuit member of the present invention. The figure shows the
FIG. 1 (a) shows a state before the connection, and FIG. 1 (b) shows a state before the connection, through an electric connection member having a conductive adhesive layer on both surfaces. Show the later state. In the drawing, reference numeral 1 denotes an electric connection member, 3 denotes an electric circuit component (circuit board), and 2 denotes an electric circuit component (semiconductor element).

Here, a method for manufacturing the electrical connection member will be described with reference to FIGS. 2 (a) to 2 (g).

2 (a) to 2 (c), the same steps as those of the conventional method for manufacturing an electrical connection member are performed.

That is, first, a copper plate 10a as a base is prepared, and the copper plate 10a
After applying an adhesion aid using a spinner, a negative polyimide resin 11a, which is a photosensitive resin, is applied using a spinner and then prebaked (see FIG. 2 (a)).
Here, the thickness of the polyimide resin 11a to be applied is considered in consideration of the decrease in the thickness due to the scattering of the solvent and the curing of the resin itself,
It is made thicker than the desired film thickness of the holder to be manufactured.

Next, the polyimide resin 11a is irradiated (exposed) with light through a photomask (not shown) having a predetermined pattern, and then developed. At this time, the energy density of the irradiated light is set to 100 to 10,000 mJ / cm ² , and the developing time is set to ⁴ to 3 mJ / cm ^2.
0 minutes. In the present embodiment, the polyimide resin 11a remains in the exposed part, and the polyimide resin 11a is removed by a development process in the unexposed part, and the diameter is 10 to 20 μm.
About 12 holes 12 are formed. Thereafter, the temperature is raised to cure the polyimide resin 11a (see FIG. 2 (b)).

By the way, even when proper exposure conditions and development conditions are set, a residue (not shown) of the polyimide resin 11a may remain on the surface of the copper plate 10a in the hole 12. In such a case, dry etching is applied to the copper plate 10a.
Completely exposed. As dry etching, for example,
O ₂ plasma etching can be adopted, and an example of the etching conditions at this time is as follows.

High-frequency power: 200 to 400 W, O ₂ flow rate: 200 SCCM Pressure: 1 Torr, etching time: 5 to 10 minutes Next, the copper plate 10a thus treated is immersed in an etching solution to perform etching. A part of the copper plate 10a near the hole 12 is removed by etching, and a concave portion 13 communicating with the hole 12 is formed in the copper plate 10a (see FIG. 2 (c)).

Next, the conductive adhesive layer 14 is provided using the copper plate 10a as a common electrode. The thickness of the conductive adhesive layer 14 is so small that it is not embedded in the polyimide resin. The step of forming the conductive adhesive layer 14 will be described below.

60 parts by weight of a polyester resin (trade name: FINETEX ES525, manufactured by Dainippon Ink and Chemicals), 40 parts by weight of a polyester resin (trade name: FINETEX 525, manufactured by Dainippon Ink and Chemicals), and a crosslinking agent (trade name: PERMASTAT R-5) 5 parts by weight, manufactured by Dainippon Ink and Chemicals, 2.5 parts by weight of a catalyst (trade name: Cat PA-20, manufactured by Dainippon Ink and Chemicals, Inc.), and further 30 parts by weight of copper powder having an average particle size of 0.02 μm And 20 parts by weight of a powder obtained by applying nickel plating on the surface of alumina having an average particle diameter of 1 μm to a thickness of 0.2 μm, dispersing the mixture in a ball mill for 30 hours, diluting the mixture with demineralized water to 15 wt%, Electrodeposition treatment was performed at an applied voltage of 100 V and a treatment time of 1 to 2 minutes using a substrate as an anode and a counter electrode as a counter electrode under conditions of ° C. and pH 8.5. Thereafter, the conductive adhesive layer 14 was formed by heating at 50 ° C. for 10 minutes (see FIG. 2D).

Next, gold 4a, which is a conductive material, was applied to the polyimide resin 1 in the recesses 13 and holes 12 by gold plating using the copper plate 10a as a common electrode.
It is embedded so as to protrude from the surface 1a (see FIG. 2 (e)).

Next, a conductive adhesive layer 14 was formed on the gold 4a in the same manner as described above using the copper plate 10a as a common electrode (see FIG. 2 (f)). The thickness of the conductive adhesive layer 14 is preferably 1 to 100 μm.

Finally, the copper plate 10a is removed by metal etching using an etchant that removes copper but does not remove the gold 4a and the conductive adhesive layer 14, and the electrical connection member as shown in FIG. 2 (g). 1 was produced.

In this embodiment, the conductive members of the electrical connection member 1 are gold 4a and the conductive adhesive layer 14, and the holder is a polyimide resin 11a.

As the dry etching, electron cyclotron resonance (ERC) plasma etching, laser etching by irradiation of excimer laser light, or the like may be employed in addition to the above-described O ₂ plasma etching.

In the above example, the gold plating is a polyimide resin 11a.
The conditions for forming the conductive adhesive layer 14 and the gold plating conditions were determined so as to be more convex than the surface of the polyimide resin 11.
You may make it concave rather than the surface of a.

Note that, in this embodiment, an example in which gold (conductive member) is filled by gold plating has been described, but another method, for example, vapor deposition may be used.

In the example, gold was used as the material of the conductive member,
In addition to gold (Au) used in the examples, Cu, Ag, Be, Ca, Mg, M
Metals or alloys such as o, Ni, W, Fe, Ti, In, Ta, Zn, Al, Sn, and Pb-Sn can also be used. The conductive member may be formed from one kind of metal and alloy, or may be formed by mixing several kinds of metal and alloy. Further, a material in which one or both of an organic material and an inorganic material are contained in a metal material may be used. The cross-sectional shape of the conductive member can be circular, square, or any other shape, but it is desirable that the conductive member has no corners in order to avoid excessive concentration of stress. Further, the conductive member does not need to be arranged vertically in the holder, and may be inclined from one surface of the holder to the other surface of the holder.

Although a polyimide resin was used as the photosensitive resin, it is not particularly limited. The photosensitive resin may contain other known materials, and the materials to be contained and the adding method may be known methods.

Further, the resin used for the conductive adhesive layer may be based on resin such as acrylic, epoxy, polyamide, acrylic / melamine, polyacrylic acid, etc. in addition to polyester.

Ultrafine metal powders are not limited to copper, but include Au, Ag, Al, Be, Ca, Mg,
Mo, Fe, Ni, Co, Mn, W, Cr, Nb, Zr, Ti, Ta, Zn, Sn, Pb-Sn and the like.

In addition, the ceramic powder is SiO ₂ , B ₂ O ₃ , Al ₂ O ₃ , Na ₂ O, K
₂ O, CaO, ZnO, BaO, PbO, Sb ₂ O ₃ , As ₂ O ₃ , La ₂ O ₃ , ZrO ₂ , P ₂ O ₅ , TiO
_{2, MgO, SiC, BeO,} BP, BN, AlN, B 4 C, TaC, TiB 2, CrB 2, TiN, Si 3 N
₄ , ceramics such as Ta ₂ O ₅ , diamond, glass, carbon, boron and the like.

As the metalized ceramic powder, a ceramic powder obtained by attaching a metal material to the above ceramic powder is used. The method for attaching the metal material may be a wet method such as plating or a dry method such as vapor deposition or sputtering.

The average particle size of the ultrafine metal powder contained in the conductive adhesive layer formed on the conductive member of the electrical connection member is 0.01 to
2 μm, preferably 0.05 to 1.5 μm, and the average particle size of the metallized ceramic powder is in the range of 0.1 to 5 μm, preferably 1.5 to 4 μm. In the conductive adhesive layer,
One or both of ultra-fine metal powder or metallized ceramic powder is contained, but the content is usually 30 to 80 wt.
%, Preferably in the range of 35 to 45% by weight.

When both the ultrafine metal powder and the metallized ceramic powder are contained, the metallized ceramic powder is blended in a ratio of 20 to 80 parts by weight with respect to 100 parts by weight of the ultrafine metal powder. Mixed powders are preferred.

Next, another method for manufacturing the electrical connection member of the present invention will be described with reference to the process charts shown in FIGS. 4 (a) to 4 (h).

4 (a) and 4 (b) are performed in the same steps as those in FIG. Next, the copper plate 10a is thinner and slightly etched than in the case of FIG. 2 (see FIG. 4 (c)).

Thereafter, as shown in FIGS. 2 (e) and 2 (f), gold plating is performed so as to be slightly convex from the surface of the polyimide resin 11a (see FIG. 4 (d)), and then a conductive adhesive layer 14 is provided (see FIG. 4 (d)). (See FIG. 4 (e)). Next, a metal 4b is formed by vapor deposition on the conductive adhesive layer 14 and the exposed polyimide resin 11a (see FIG. 4 (f)). This metal 4b will later become a common electrode. Thereafter, the copper plate 10a is removed by etching, and metal 4
b is used as a common electrode, and a conductive adhesive layer 14 is provided on the gold 4a opposite to the metal 4b (see FIG. 4 (g)). Thereafter, the metal 4b used as the common electrode is removed to obtain the electrical connection member 1 (see FIG. 4 (h)).

The step of providing the common electrode may be performed after the copper plate 10a is removed.

Next, in the electric circuit members shown in FIGS. 1 (a) and 1 (b), as shown in FIG. 2 or FIG. 4, the electric connection member 1 has a plurality of conductive members 4 made of gold and a conductive adhesive layer. Is replaced with a conductive member 4 made of polyimide.
The bump 8 having the conductive adhesive layer 14 formed at one end of the conductive member 4 is exposed to the electrical circuit component 2 side, and the conductive member 4 is electrically insulated at the other end of the conductive member 4. The bump 9 on which the adhesive layer 14 is formed is exposed on the circuit board 3 side (see FIG. 1A).

Then, the connection portion 15 of the electric circuit component 2 that is not covered with the passivation film 16 is electrically connected to the bump 8 having the conductive adhesive layer 14 of the conductive member 4 exposed to the electric circuit component 2 by bonding. I do. In addition, the connection portion 17 of the electric circuit component 3 and the bump 9 on which the conductive adhesive layer 14 of the conductive member 4 exposed to the electric circuit component 3 is formed are connected by bonding to achieve electrical connection (FIG. 1 ( b)). The connection temperature between the connection portion 15 of the electric circuit component 2 and the conductive adhesive layer of the conductive member 4 exposed on the electric circuit component 2 side;
And the conductive member 4 exposed on the side of the electric circuit component 3
Can be connected at a low temperature of 180 ° C. or less, and a good connection was obtained.

In the case of connection, the electric circuit component 2 and the electric circuit component 3
However, since the pitch of the conductive member 4 of the electric connection member 1 is smaller than the pitch of the connection portion 15 of the electric circuit component 2 and the pitch of the connection portion 17 of the electric circuit component 3, the electric connection member 1 The positioning may be rough.

In this embodiment, the electrical connection member 1 and the electrical circuit component 2 are connected, and then the electrical connection member 1 and the electrical circuit component 3 are connected. However, the order may be reversed or simultaneous.

Embodiment 2 FIGS. 3 (a) and 3 (b) are schematic views showing another embodiment of the electric circuit member of the present invention. The figure shows a method in which a conductive adhesive layer of an electrical connection member of the first embodiment is provided on a connection portion 17 made of copper foil of the electrical circuit component 3 of the first embodiment and a connection portion 15 of the electrical circuit component 2. The conductive adhesive layer 14a is provided by the same method, and the other configuration is the same as that of the first embodiment. In this electric circuit member, electric circuit components 2,
Good connection can be obtained even if 3 is warped.

Embodiment 3 FIGS. 5 (a) and 5 (b) are schematic views showing still another embodiment of the electric circuit member of the present invention. The figure shows a method in which a conductive adhesive layer of the electrical connection member of the first embodiment is provided on the surface of the electric circuit component 3 of the first embodiment opposite to the surface on which the connection portion 17 made of copper foil is provided. A conductive adhesive layer 14b is provided in the same manner as described above, and the other configuration is the same as that of the first embodiment. In this electric circuit member, Embodiment 1
In the same manner as described above, good connection was possible, and an electric circuit member having a good electrostatic shielding effect was obtained by providing a conductive adhesive layer on the opposite surface.

[Effects of the Invention] As described above, in an electric circuit member using the electric connection member of the present invention, a high-density electric circuit member can be obtained because a narrower pitch and more pins can be joined than in the past. be able to. Also, since the wiring length of the conductive member can be shortened, the wiring becomes low-resistance wiring, heat generation is reduced, and stray capacitance is reduced. Therefore, electric characteristics such as signal delay are improved, and electric characteristics are good. Is obtained. This effect is particularly large in the case of a high-frequency circuit.

Further, the present invention provides a conductive adhesive layer formed on a conductive member by electrophoresis from an adhesive resin solution containing one or both of ultrafine metal powder or metallized ceramic powder by electrophoresis. Since it is provided, in connection, electrical connection by adhesion is performed, so that it is possible to use even relatively low heat-resistant electric circuit parts, and since it can be easily connected, parts having a wide range of application and A device is obtained. Furthermore, since only the connection portion is connected, a highly reliable and high-quality electric circuit member can be obtained.

Further, in the present invention, since the conductive adhesive layer is provided on a metal surface opposite to a surface having a connection portion of at least one or more electric circuit components, an electric circuit having a good electrostatic shielding effect is provided. A member is obtained, and electromagnetic noise entering the electric circuit member from the electric circuit member to the outside or from the outside is relatively easily blocked, so that a very good electric circuit member can be obtained.

[Brief description of the drawings]

FIGS. 1 (a) and (b), FIGS. 3 (a) and (b) and FIGS. 5 (a) and (b) are schematic views each showing an embodiment of the electric circuit member of the present invention. The state before connection in (a) of each figure,
(B) shows the state after connection. 2 (a) to 2 (g) are process diagrams showing an example of the method for manufacturing an electrical connection member of the present invention, and FIGS. 4 (a) to 4 (h) are diagrams of a method for manufacturing an electrical connection member according to the present invention. Process drawings showing another example, FIGS. 6 (a) and (b)
FIGS. 3A and 3B are schematic diagrams showing a conventional electric circuit member, wherein FIG. 3A shows a state before connection and FIG. 3B shows a state after connection. 7 (a) to 7 (e) are process diagrams showing an example of a method of manufacturing a conventional electrical connection member. 1 ... electric connection member, 2,3 ... electric circuit component 4 ... conductive member, 4a ... gold 4b ... metal, 5 ... holding body 6,7,15,17 ... connection part 8,9 ...... Bump, 10 Copper foil 10a Copper plate, 11 Photosensitive resin 11a Polyimide resin, 12 Hole 13 Concavity 14, 14a, 14b Conductive adhesive layer 16 Passivation film

──────────────────────────────────────────────────続 き Continued on the front page (58) Fields surveyed (Int.Cl. ⁶ , DB name) H01R 11/01 H01R 4/04 H05K 3/36

Claims (7)

(57) [Claims] 1. A holding member made of an electrically insulating material, and a plurality of exposed conductive members mounted on the holding member in a mutually insulated state, and the conductive members on both surfaces of the exposed holding member are provided. To
A conductive adhesive layer formed by electrophoresis from an adhesive resin solution containing one or both of ultrafine metal powder or metallized ceramic powder, wherein the conductive adhesive layer holds the conductive adhesive layer. An electrical connection member, which is the same as or protrudes from a body surface and is exposed. 2. The method according to claim 1, wherein the average particle size of the ultrafine metal powder contained in the conductive adhesive layer is 0.01 to 2 μm and the average particle size of the metallized ceramic powder is 0.1 to 5 μm. The electrical connection member according to claim 1, wherein the content of one or both of the ultrafine metal powder and the metalized ceramic powder contained in the layer is 30 to 80 wt%. 3. A holding member made of an electrically insulating material, and a plurality of exposed conductive members provided on the holding member so as to be insulated from each other, and a conductive member on both surfaces of the exposed holding member is provided. Having a conductive adhesive layer formed by electrophoresis from an adhesive resin solution containing one or both of ultrafine metal powder or metallized ceramic powder, wherein the conductive adhesive layer is An electrical connection member that is the same as or protrudes from the surface of the holding body; and at least one or more connection portions, and the conductive portion is exposed on one surface of the holding body of the electrical connection member at the connection portion. At least one end of at least one of the adhesive layers is electrically connected by adhesion, and at least one or more electric circuit components; and at least one or more connection parts, and a holder for the electric connection member at the connection parts On the other side of Electrical circuit member at least one end and having at least one or more electrical circuit components are electrically connected by bonding of the exposed portion of the conductive adhesive layer. 4. A conductive adhesive formed by electrophoresis from an adhesive resin solution containing one or both of an ultrafine metal powder and a metalized ceramic powder, wherein a connection portion of an electric circuit component is formed. At least one connection part having a layer, at which one end of at least one of the conductive members having the conductive adhesive layer exposed on one surface of the holder of the electrical connection member is provided. The electric circuit member according to claim 3, wherein the electric circuit member is electrically connected by bonding. 5. An ultrafine metal powder and / or a metallized ceramic powder on at least a part of the metal surface of the at least one electric circuit component opposite to the surface having the connection portion. 5. The electric circuit member according to claim 3, further comprising a conductive adhesive layer formed by codeposition from an adhesive resin solution containing: 6. An ultrafine metal powder contained in the conductive adhesive layer has an average particle size of 0.01 to 2 μm, and the metalized ceramic powder has an average particle size of 0.1 to 5 μm. The electric circuit member according to any one of claims 3 to 5, wherein the content of one or both of the ultrafine metal powder and the metalized ceramic powder contained in the layer is 30 to 80 wt%. 7. The electric circuit component is at least one selected from a frame, a resin circuit board, a metal circuit board, a ceramic circuit board, a lead frame, and a semiconductor element.
7. The electric circuit member according to any one of items 6 to 6.