JP3060591B2 - Semiconductor device mounting method, electronic optical device manufacturing method, and electronic printing device manufacturing method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of mounting a semiconductor device having a chip-on-flexible printed circuit structure on a circuit board, and a method of manufacturing an electro-optical device and an electronic printing device using the mounting method. It is.

FIG. 9 shows an example of a structure in which a conventional semiconductor device having a chip-on-flexible printed circuit structure is mounted on a circuit board.

A conventional semiconductor device mounting method is a chip-on-flexible printed circuit (hereinafter referred to as COF).
The outer leads 2 of the COF 1 and the soldering lands 4 of the circuit board 3 are manually soldered without prior solder coating 11 on the outer leads 2 of the first COF 1. In this case, the outer leads 2 of the COF 1 and the soldering lands 4 of the circuit board 3 are thermocompression-bonded with a heating tool or the like without solder coating 11 in advance. Therefore, the mounting structure of the conventional tape carrier is COF as shown in FIG.
No concave portion was present in the solder coating 11 of the outer lead 2.

[0004]

However, in the above-mentioned prior art, the soldering is performed manually, so that a considerable amount of processing time is required and the quality is not stable, or automatic soldering is performed using a heating tool or the like. However, it is difficult to control the quality of the connection between the outer leads of the tape carrier and the solder lands of the circuit board, and the connection strength is low and the reliability is very low.

In order to solve the above-mentioned drawbacks, the present invention provides a tape carrier in which a plurality of semiconductor devices are connected in a tape form, and then coats the outer leads with solder. A method of mounting a semiconductor device is used in which a mounting land is thermocompressed with a heating tool or the like and soldered.

An object of the present invention is to provide an inexpensive and highly reliable semiconductor device mounting structure, and an electronic optical device and an electronic printing device using the same.

[0007]

A method for mounting a semiconductor device according to the present invention is a method for mounting a semiconductor device having outer leads on a circuit board, wherein a plurality of semiconductor devices are connected in a tape shape. In the state of the tape carrier, by immersing the outer leads of the plurality of semiconductor devices in solder and flux, a step of applying a solder coating to the outer leads of the semiconductor device, and after the step of applying the solder coating, Thermocompression bonding the outer leads of the individual semiconductor devices and the solder lands formed on the circuit board.

Further, a method of manufacturing an electro-optical device according to the present invention is a method of manufacturing an electro-optical device having a semiconductor device having outer leads and a circuit board, wherein a plurality of the semiconductor devices are connected in a tape shape. Applying a solder coating to the outer leads of the semiconductor device by immersing the outer leads of the plurality of semiconductor devices in solder and flux in a state of the tape carrier in which the outer leads of the individual semiconductor devices are provided. And a step of thermocompression bonding the solder lands formed on the circuit board.

Further, a method of manufacturing an electronic printing apparatus according to the present invention is a method of manufacturing an electronic printing apparatus having a semiconductor device having outer leads and a circuit board, wherein a plurality of the semiconductor devices are connected in a tape shape. In the state of the tape carrier, by immersing the outer leads of the plurality of semiconductor devices in solder and flux, a step of applying a solder coating to the outer leads of the semiconductor device, and the outer leads of the individual semiconductor devices. And thermocompression bonding a solder land formed on the circuit board.

[0010]

BRIEF DESCRIPTION OF THE DRAWINGS FIG.

Embodiment 1 FIGS. 1 and 2 show an embodiment of a method for mounting a semiconductor device according to the present invention. In FIG. 1, 3 of the liquid crystal display element 6
COF1 is already mounted on the side terminals with an anisotropic conductive film or the like. Here, the COF 1 is a single semiconductor device in which the semiconductor element 11 is mounted on a tape carrier, and the semiconductor element 11 is separated into single parts including a wiring pattern necessary for the function. In FIG. 1 (a), the liquid crystal display element 6 in which COF1 is mounted on each terminal (hereinafter referred to as an LCD unit) is held by a vacuum suction pad or the like attached to the tip of a manipulator or the like. Can change direction freely.
Here, the LCD unit is first positioned so that the lower side thereof is substantially parallel to the flux 7 surface. Next, the LCD unit is lowered, and C at the lower side of the LCD unit is
The outer lead 2 of the OF 1 is immersed in the flux 7 to apply the flux, and the LCD unit is pulled up. By performing this operation for each side of the LCD unit, the flux 7 is applied to all the outer leads 2 of the COF 1 mounted on the liquid crystal display element 6. Next, as shown in FIG. 1B, the same operation as in FIG.
By immersing the outer lead 2 coated with the flux 7 of the COF 1 of the CD unit in the solder 9, the outer lead 2 can be coated with the solder 11. Also in this case, by performing the same operation for each side, the solder coating 11 can be applied to the outer leads 2 of all the COFs 1 of the LCD unit. COF
The immersion time of the outer lead 2 in the flux 7 and the solder 9 was 0.1 mm each. It is several seconds to ten and several seconds.

FIG. 2 is a cross-sectional view showing one embodiment of a method for mounting a semiconductor device according to the present invention, and shows a step following FIG. In FIG. 2A, the C mounted on the liquid crystal display element 6
The outer lead 2 of the OF 1 on which the solder coating 11 is applied is aligned and disposed on the soldering land 4 of the circuit board 3, and a heating tool 12 for soldering is on standby on the outer lead 2. doing. FIG.
In FIG. 2B, the heating tool 12 waiting in FIG.
Then, the outer leads 2 are pressed against the soldering lands 4 and simultaneously heated to melt the solder of the solder coating 11, and the outer leads 2 and the soldering lands 4 are soldered. At this time, the heating method of the heating tool 12 is an instantaneous heating method using a pulse current, but may be an instantaneous heating method using a laser beam, a heating wire, or the like, or another general constant heating method. In FIG. 2C, FIG.
The heating tool 12 that has completed the soldering of the outer leads 2 and the solder lands 4 in (b) is lifted upward away from the soldering portion. After the heating tool 2 is lifted, the solder coating 11 of the outer lead 2 has a concave portion 13 which is a mark of the heating tool 12 left. Examples of specifications of the COF 1, the circuit board 3, the flux 7, and the solder 9 used in the present embodiment are as follows.

<Specifications of COF1> Base film: 25 to 75 μm thick polyimide resin, polyester resin, etc.

Copper foil (outer lead material): number to 5
0 μm thick electrolytic copper foil, etc.

・ Coating of copper foil: several μm
Sn plating, Au plating, etc.

<Specifications of circuit board 3> Board material: glass epoxy resin, epoxy composite material, paper phenol resin, bakelite, etc.

Copper foil (soldering land 4): number to 5
0 μm thick electrolytic copper foil, etc.

・ Coating of copper foil: several μm
~ Several tens of solder plating, Au plating, etc.

Surface: Insulating agent application and the like.

<Specifications of flux 7> Standard: R of Nippon Almit
F-35M RMA flux and the like.

<Solder 9>: Pb
/ Sn ratio = 60/40 solder etc.

[Embodiment 2] FIG. 3 is a view showing one embodiment of a method of mounting a semiconductor device according to the present invention. As compared with Embodiment 1, application of flux 7 to outer leads 2 of COF 1 and solder coating are performed. 11
Is performed not in the LCD unit state but in the tape carrier 5 state. 3 shows the tape carrier 5
It can be seen that the solder coating 11 is applied to the outer lead 2 of the COF 1 on the tape carrier by partially immersing the outer lead 2 in the flux 7 and the solder 9 and moving it.

Embodiment 3 FIG. 4 is a sectional view showing an embodiment of a mounting structure of a semiconductor device according to the present invention, which is an example used for a liquid crystal display device as an example of an electro-optical device. This embodiment is formed by using the tape carrier mounting method of the first embodiment. As shown in FIG. 4, the outer lead 2 has a recess 13 at the center of the solder coating 11. By observing the appearance of the recess 13, it is possible to accurately and easily judge whether or not the outer leads 2 and the soldering lands 4 of the circuit board 3 are securely soldered.

Embodiment 4 FIG. 5 is a sectional view showing an embodiment of a mounting structure of a semiconductor device according to the present invention. In the present embodiment, the liquid crystal display element 6 is opposite to the front and rear sides of the liquid crystal display element 6 according to the third embodiment, and accordingly, the direction of the COF 1 is also opposite, and the semiconductor element 14 comes to the circuit board 3 side. A feature is that a semiconductor element escape hole 15 is provided in the substrate 3 to allow the outer shape of the semiconductor element 14 to escape. There are many combinations of the electronic display element such as the liquid crystal display element 6, the electronic printing element, the COF 1 and the front and back directions of the circuit board 3, but it can be realized by slightly changing the mounting structure.

Embodiment 5 FIG. 6 is a sectional view showing an embodiment of a mounting structure of a semiconductor device according to the present invention. This embodiment is different from the third embodiment in that COF
1 is bent 90 °. In FIG. 6, C
Although the lead slit 16 is provided in the bent portion of the OF1, the lead slit 16 may not be provided. Also CO
The bending angle of F1 may be bent up to 180 °.

[Embodiment 6] FIG. 7 is a sectional view showing an embodiment in which the semiconductor device mounting structure of the present invention is used in a liquid crystal display device which is a kind of an electro-optical device. In FIG. 7, the liquid crystal display element 6 is provided on the backlight 18, and the terminal of the liquid crystal display element 6 has C
The OF1 is mounted, and the outer lead 2 of the COF1 is coated with the solder coating 11 and is thermocompression-bonded by the heating tool 12, thereby forming the concave portion 13. The liquid crystal display element 6 is fixed to the backlight 18 by a frame 19, a pressing rubber 20, and the like, thereby forming a liquid crystal display device.

Embodiment 7 FIG. 8 is a cross-sectional view showing an embodiment in which the semiconductor device mounting structure of the present invention is used in an electronic printing device such as a thermal head of a thermal printer. In this embodiment, the third embodiment
Was used for an electronic printing device.

[0028]

As described above, according to the method of mounting a semiconductor device of the present invention, a semiconductor device can be coated with solder in a tape carrier in which a plurality of semiconductor devices are connected in a tape shape. Coating can be performed efficiently.

Further, since the variation in the solder coating between the respective semiconductor devices can be suppressed to be small, a highly reliable mounting structure can be obtained.

[Brief description of the drawings]

FIG. 1 is a diagram showing one embodiment of the present invention.

FIG. 2 is a diagram showing one embodiment of the present invention.

FIG. 3 is a diagram showing one embodiment of the present invention.

FIG. 4 is a diagram showing one embodiment of the present invention.

FIG. 5 is a diagram showing one embodiment of the present invention.

FIG. 6 is a diagram showing one embodiment of the present invention.

FIG. 7 is a diagram showing one embodiment of the present invention.

FIG. 8 is a diagram showing one embodiment of the present invention.

FIG. 9 is a diagram showing a conventional technology example.

[Explanation of symbols]

 1. COF 2. Outer lead 3. Circuit board 4. Soldering land 5. Tape carrier 6. 6. Liquid crystal display device (LCD) Flux 8. Flux tank 9. Solder 10. Solder tank 11. Solder coating 12. Heating tool 13. Recess 14. Semiconductor device 15. Semiconductor element relief hole 16. Lead slit 17. Electronic printing element 18. Backlight 19. Frame 20. Presser rubber

Claims (3)

(57) [Claims] 1. A method for mounting a semiconductor device having a semiconductor device having outer leads on a circuit board, the method comprising: mounting a plurality of semiconductor devices in a tape carrier in a tape shape. A step of applying a solder coating to the outer leads of the semiconductor device by immersing the outer leads in solder and flux; and, after the step of applying the solder coating, to the outer leads and the circuit board of each of the semiconductor devices. And a step of thermocompression bonding the formed soldering lands. 2. A method for manufacturing an electro-optical device having a semiconductor device having outer leads and a circuit board, wherein the plurality of semiconductor devices are arranged in a tape carrier in which the plurality of semiconductor devices are connected in a tape shape. A step of applying a solder coating to the outer leads of the semiconductor device by immersing the outer leads of the device in solder and flux, and after the step of applying the solder coating, the outer leads of the individual semiconductor devices and the And a step of thermocompression bonding a solder land formed on the circuit board. 3. A method of manufacturing an electronic printing apparatus having a semiconductor device having outer leads and a circuit board, wherein the plurality of semiconductor devices are arranged in a tape carrier in which the plurality of semiconductor devices are connected in a tape shape. Dipping the outer leads in solder and flux to apply a solder coating to the outer leads of the semiconductor device; and, after the step of applying the solder coating, the outer leads and the circuit of the individual semiconductor devices. A method of thermocompression bonding soldering lands formed on a substrate to an electronic printing apparatus.