JP2910352B2 - Article removal method and apparatus - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for removing articles used in a manufacturing process of chip components such as chip capacitors and chip resistors and a process of mounting chip components on a printed circuit board by an automatic machine. .

[0002]

2. Description of the Related Art Generally, in a manufacturing process of electronic components such as a chip capacitor and a chip resistor and a mounting process of mounting a chip component on a printed circuit board by an automatic machine, a predetermined number of chip components are arranged in a predetermined state. Processing may need to be performed.

In such a case, the chip components are sent to the next step while aligning and holding the chip components on the adhesive material layer arranged on the planar pallet, and the chip components are aligned. Remove from the adhesive material layer in the state,
A predetermined process is performed.

Conventionally, in order to remove the above-mentioned chip component from the adhesive material layer, the chip component is removed from the adhesive material layer by grasping it with a chuck, or the chip component is brushed, spatulaed or manually by a worker. It was intended to be detached from the adhesive material layer.

[0005]

However, as described above, when the chip component is gripped by the chuck and removed from the adhesive material layer, there are the following problems. -The processing speed is slow because the removal of chip components requires one to several processes at a time. -When the adhesive material layer holding the chip component has a strong adhesive force, the chip component cannot be removed from the adhesive material layer by a vacuum chuck using vacuum suction or the like because the chucking force is insufficient. In a chuck such as a collet chuck that mechanically grips a chip component, the chip component is damaged or damaged when the chip component is chucked.

[0006] Further, when the chip part is removed from the adhesive material layer by a brush, a spatula, or an operator by hand, there is the following problem. -After removing the chip components from the adhesive material layer, the chip components are disturbed from the initial alignment and fall apart. -When removing the chip components, the products collide with each other, causing scratches or damage to the chip components.

[0007] It is an object of the present invention according to claims 1 and 2 of the present invention to provide an apparatus for removing a part that reliably removes a large number of parts from an adhesive material layer in an aligned state.

[0008] An object of the invention according to claim 3 of the present application is to provide an article removing apparatus which can easily and surely remove an article held in alignment with an adhesive material layer from the adhesive material layer. is there.

An object of the present invention according to claims 4 and 5 of the present application is to provide an article removing apparatus capable of removing an article from an adhesive material layer while maintaining a vertical relationship of the article with the adhesive material layer. It is to provide.

[0010]

In order to achieve the above object, the invention according to claim 1 of the present application is held in alignment on a layer of adhesive material arranged on a planar pallet. What is claimed is: 1. A method of removing an article from an adhesive material layer in an aligned state, comprising: After the jig is moved onto the article adhesively held on the adhesive material layer and the articles are fitted in the fitting portions, the jig is moved relative to the pallet. The method is characterized in that the article is moved to remove the article from the adhesive material layer of the pallet, and discharged from the fitting portion of the jig onto the receiving member of the article receiving the article while maintaining the above-mentioned alignment state.

Further, according to a second aspect of the present invention, in the method for removing an article according to the first aspect, each article fitted in the fitting portion of the jig is arranged on an inner wall of the fitting portion. Elastically held by an elastic member, the jig is moved relative to the pallet to remove each article from the adhesive material layer of the pallet, and then each article is discharged from the fitting portion of the jig onto the receiving member. It is characterized by doing.

Further, the invention according to claim 3 of the present application is characterized in that the articles, which are aligned and held on the adhesive material layer arranged on the planar pallet, are aligned in the aligned state. What is claimed is: 1. A device for removing an article to be removed from a material layer and taken out to a receiving member for the article, the apparatus having a fitting hole formed in accordance with a shape and an alignment state of the article and having the article fitted therein, The articles are stacked on the receiving member, and each article is moved relative to the pallet in a state where the articles are fitted into the fitting holes from the opening on one end side thereof, and the articles are removed from the adhesive material layer of the pallet to form the fitting holes. And a jig for discharging the above-mentioned receiving member from the opening on the other end side while maintaining the above-mentioned alignment state.

Still further, the invention according to claim 4 of the present application is characterized in that the articles, which are aligned and held on the adhesive material layer arranged on a planar pallet, are arranged in an aligned state. An apparatus for removing an article to be removed from a material layer and taken out to a receiving member for the article, the apparatus being formed in accordance with the shape and alignment of the article, having a fitting portion into which the article is fitted, wherein each article is A jig for moving the article relative to the pallet in a state of being fitted to the fitting section and removing the article from the adhesive material layer of the pallet; and a receiving member for the article fitted to the fitting section of the jig. And an extruding member for extruding.

According to a fifth aspect of the present invention, there is provided an article removing apparatus according to the fourth aspect, wherein:
An elastic member is provided on an inner wall of the fitting portion.

[0015]

According to the first and second aspects of the present invention, the article adhered to the adhesive material layer and held in alignment is fitted to the fitting portion of the jig. Since the jig moves relative to the pallet and is removed from the adhesive material layer, a large number of components can be reliably removed from the adhesive material layer at once in an aligned state.

According to the invention of claim 3 of the present application, the jig is fitted with the article held in alignment with the adhesive material layer in the fitting hole and relatively moved with respect to the pallet. Thereby, the article is removed from the adhesive material layer in an aligned state, and can be reliably removed from the adhesive material layer by a simple structure.

According to the fourth and fifth aspects of the present invention, the jig fits the article held in alignment with the adhesive material layer from one end opening thereof into the fitting hole. By moving the article relative to the pallet and discharging the article from one end opening of the fitting hole, the article can be removed from the adhesive material layer while maintaining the vertical relationship with the adhesive material layer of the article. .

[0018]

Embodiments of the present invention will be described below with reference to the accompanying drawings.

Embodiment 1 One embodiment of the present invention is shown in FIGS. As shown in FIG. 1, an adhesive material layer 2 is formed on one main surface of a planar pallet 1, and an article 3 such as a chip capacitor is formed on the adhesive material layer 2 in a matrix. After being aligned, these articles 3 adhere to the adhesive material layer 2 and are held on the pallet 1.

On the other hand, the pallet 1 is provided with a jig 4 for removing the article 3 attached and held on the adhesive material layer 2 thereof. The jig 4 is formed so as to correspond to the shape and the state of alignment of the articles 3, and includes a fitting hole 5 into which each of the articles 3 is fitted from one end opening.

The jig 4 is provided with a receiving member 6 for receiving the article 3 under the jig 4, and as shown by an arrow A1 in FIG. Is moved so that the fitting hole 5 is located under the lower part. Then, after the article 3 is fitted into the fitting hole 5 from one end opening 5a thereof, the jig 4 and the receiving member 6 of the article 3 are placed on the pallet 1 in a direction indicated by an arrow A2 in FIG. To move. Thereby, the article 3 is removed from the adhesive material layer 2 of the pallet 1 as shown in FIG. In this state, the jig 4 and the receiving member 6 are moved downward as indicated by an arrow A3 in FIG. 3, and then the jig 4 is removed from the receiving member 6. The article 3 is taken out from the other end opening 5b of the fitting hole 5 onto the receiving member 6 of the article 3.

In this way, a number of articles 5 held in an aligned state on the adhesive material layer 2 of the pallet 1 can be simultaneously removed in a short time in an aligned state.

Embodiment 2 FIGS. 4 to 6 show another embodiment of the present invention. FIG.
3 is formed on the same pallet 1 as that of the first embodiment described in FIG. 3 according to the shape and the alignment of the article 3 attached and held on the adhesive material layer 2,
The article 3 has a fitting section 15 to which the article 3 is fitted, and moves with respect to the pallet 1 in a state where each article 3 is fitted to the fitting section 15 to move the article from the adhesive material layer 2 of the pallet. The jig 14 includes a jig 14 to be removed, and an extruding member 17 for pushing the article 3 fitted into the fitting portion 15 of the jig 14 out of the fitting recess 15. The pushing member 17 has a pin 17b projecting from the common support portion 17a and inserted into the fitting recess 15 from the bottom of the fitting recess 15 of the jig 14.

The jig 14 and the extruding member 17 face the fitting recess 15 of the jig 14 below the article 3 held in alignment with the adhesive material layer 2 and are indicated by an arrow A4 in FIG. As described above, the adhesive material layer 2 is moved below the article 3 held on the adhesive material layer 2. And for pallet 1,
In FIG. 4, the jig 14 and the pushing member 17 are moved in a direction indicated by an arrow A5. Thereby, article 3
Is removed from the adhesive material layer 2 of the pallet 1 as shown in FIG. In this state, the receiving member 16 having the adhesive material layer 12 formed on the main surface is arranged on the jig 3, and as shown in FIG. 6, the pushing member 17 is moved in the direction of arrow A <b> 6, By moving the pin 17b of the pushing member 17, the article 3 fitted into the fitting recess 15 of the jig 14 is discharged from the fitting recess 15, and is pressed against the adhesive material layer 12 of the receiving member 16 to press the adhesive material. Glue to layer 12.

In this way, the articles 3 held in an aligned state on the adhesive material layer 2 of the pallet 1 can be simultaneously arranged in a short time, and a large number of articles 3 can be maintained while maintaining the vertical direction. Can be removed.

Embodiment 3 FIGS. 7 to 9 show another embodiment of the present invention. FIG.
3 has the same configuration as the jig described in the second embodiment with respect to the pallet 1 similar to the first embodiment described in FIG. 3, and attaches an elastic member 21 such as rubber to the inner wall of the fitting concave portion 25. Jig 24 and fitting portion 25 of this jig 24
And an extruding member 27 that pushes out the article 3 fitted into the fitting recess 25. The pushing member 27 protrudes from the common support portion 27a, and the fitting concave portion 25 of the jig 24
Pin 27b inserted into the fitting recess 25 from the bottom of the
Having.

The jig 24 is arranged with the fitting recesses 25 facing each other on the article 3 held in alignment with the adhesive material layer 2, and as shown by an arrow A7 in FIG. The article 3 adhesively held on the adhesive material layer 2 is moved.
Then, the jig 24 and the pushing member 27 are moved on the pallet 1 in a direction indicated by an arrow A8 in FIG. As a result, as shown in FIG.
4 is fitted into the fitting recess 25 against the elasticity of the elastic member 21. In this state, the jig 24 is moved with respect to the pallet 1 in a direction indicated by an arrow A9 in FIG. As a result, as shown in FIG.
5 is held in the fitting recess 25 by the elasticity of the elastic member 21.

In the above state, as shown in FIG. 9, the pushing member 27 is moved in the direction of arrow A10, and the pushing member 2 is moved.
7, the article 3 fitted in the fitting recess 25 of the jig 24 is discharged from the fitting recess 25 onto the receiving member 6.

In this way, the articles 3 held in an aligned state on the adhesive material layer 2 of the pallet 1 are aligned in a short time, and the receiving members 6 are maintained in the up-down direction. Can be removed simultaneously.

In FIGS. 4 to 9, parts corresponding to those in FIGS. 1 to 3 are denoted by corresponding reference numerals, and redundant description will be omitted.

The present invention can be applied not only to chip capacitors but also to chip components such as chip resistors and chip-shaped piezoelectric components.

[Brief description of the drawings]

FIG. 1 is an explanatory diagram showing a state before removing an article from an adhesive material layer of a pallet according to a first embodiment of the present invention.

FIG. 2 is an explanatory view of removing an article from the adhesive material layer of the pallet according to the first embodiment of the present invention.

FIG. 3 is an explanatory view showing a state in which the article is removed from the adhesive material layer of the pallet according to the first embodiment of the present invention to the receiving member.

FIG. 4 is an explanatory view showing a state before removing an article from an adhesive material layer of a pallet according to a second embodiment of the present invention.

FIG. 5 is an explanatory view of a state in which an article is removed from the adhesive material layer of the pallet according to the second embodiment of the present invention.

FIG. 6 is an explanatory view showing a state in which the article removed from the adhesive material layer of the pallet according to the second embodiment of the present invention is discharged from the fitting recess of the jig and adhered to the receiving member.

FIG. 7 is an explanatory view showing a state before removing an article from an adhesive material layer of a pallet according to a third embodiment of the present invention.

FIG. 8 is an explanatory view showing a state in which an article is removed from the adhesive material layer of the pallet according to the third embodiment of the present invention.

FIG. 9 is an explanatory view showing a state in which an article is removed from the adhesive material layer of the pallet according to the third embodiment of the present invention to the receiving member.

[Explanation of symbols]

 Reference Signs List 1 pallet 2 adhesive material layer 3 article 4 jig 5 fitting hole 5a one end opening 5b other end opening 6 receiving member 12 adhesive material layer 14 jig 15 fitting concave portion 15a one end opening 16 receiving member 17 extrusion member 17a support portion 17b Pin 21 Elastic member 25 Fitting recess 25a One end opening 27 Extruding member 27a Supporting portion 17b Pin

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. ⁶ , DB name) B23P 19/04 H05K 13/04 B23P 19/00 301

Claims (5)

(57) [Claims] 1. A method for removing an article from an adhesive material layer in an aligned state, wherein the articles are aligned and held on an adhesive material layer disposed on a flat pallet, the method comprising: A jig formed corresponding to the shape and alignment of the article and having a fitting portion to which the article is fitted, and the jig held by the adhesive on the adhesive material layer. After moving the jigs relative to the pallet, the articles are removed from the adhesive material layer of the pallet, and then the jigs are displaced from the adhesive material layer of the pallet. A method for removing an article, wherein the article is discharged onto a receiving member for receiving the article while maintaining the above-mentioned alignment. 2. Each of the articles fitted in the fitting portion of the jig is elastically held by an elastic member disposed on the inner wall of the fitting portion, and the jig is moved relative to the pallet to thereby hold each article. 2. The method for removing articles according to claim 1, wherein the articles are ejected from the fitting portion of the jig onto the receiving member after the articles are detached from the adhesive material layer of the pallet. 3. An article, which is aligned and held on an adhesive material layer arranged on a planar pallet, is removed from the adhesive material layer in an aligned state and is taken out to a receiving member of the article. An article removal device, which is formed in accordance with the shape and alignment of the article, has a fitting hole into which the article is fitted, and is stacked on a receiving member of the article, and each article is The article is removed from the adhesive material layer of the pallet by moving relative to the pallet in a state where the article is fitted into the fitting hole from the opening on one end side, and the aligned state is opened from the opening on the other end side of the fitting hole. An apparatus for removing an article, comprising: a jig for holding and discharging the article onto the receiving member. 4. An article, which is aligned and held on an adhesive material layer arranged on a flat pallet, is removed from said adhesive material layer in an aligned state and is taken out to a receiving member of the article. An article removal device, which is formed in accordance with the shape and alignment of the article, has a fitting portion into which the article is fitted, and the pallet is provided in a state where each article is fitted to the fitting section. A jig for moving the article relative to the pallet to remove the article from the adhesive material layer of the pallet; and an extruding member for pushing out the article fitted to the fitting portion of the jig to a receiving member. For removing objects to be removed. 5. An article removing apparatus according to claim 4, wherein an elastic member is provided on an inner wall of said fitting portion.