JP2971448B1 - Electrode equipment in continuous plating equipment - Google Patents

Abstract

An object of the present invention is to make a plating film uniform in an apparatus for vertically plating and transferring a plate-like object to be plated and performing continuous plating. SOLUTION: In an apparatus for performing plating while transferring a plate-like workpiece 3 placed vertically on a rail 2 provided in a plating tank, a power supply roller 7 is attached to a cathode rod 6 vertically provided along the rail 2. The protective film 8 is formed on the surface of the power supply roller 7 with a film material harder than the target plating film.
In addition, the device (9, 10) for peeling off the plating layer adhering to the surface of the power supply roller is in contact with the contact surface of the power supply roller 7.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electrode device for continuously transferring a plate-like object such as a semiconductor substrate in a continuous plating apparatus and vertically plating the same.

[0002]

2. Description of the Related Art Conventionally, in order to plate a plate-like object to be plated, a plurality of objects to be plated are attached one by one to a frame connected to a cathode with a fixture, and after plating is completed, one by one is removed. ing. This is a troublesome operation, and is one of the factors that hinder the efficiency of the plating operation.

[0003] In recent years, in order to avoid the work of fixing the plating object to the frame, in recent years, the plating objects have been supplied one by one individually and continuously into the plating tank, and the inside of the plating tank has been moved horizontally.
A method of continuously and efficiently plating has been proposed.

[0004] However, the size of the object to be plated varies in size, and in order to plate evenly on any of them, the arrangement of electrodes, adjustment of liquid level, current density, etc.
It is difficult to finely adjust the plating conditions. Therefore, the present inventor has developed a method in which the object to be plated is vertically supplied and is continuously supplied to the plating tank, and the above-mentioned problems have been solved.

[0005]

To vertically transfer a plate-shaped object to be plated in a plating tank, for example, as shown in FIG.
As shown in FIG. 1, a lower end of a plate-like workpiece 3 is placed on a rail 2 having a V-shaped cross section extending in a direction perpendicular to the paper, and a plurality of vertical rollers ( The object to be plated 3 is transported by a driving roller while being held by both members (not shown). Reference numeral 4 denotes an anode, which is vertically movable by a cylinder 5 according to the size of the object 3 to be plated. Reference numeral 6 denotes a cathode rod, and reference numeral 7 denotes a power supply roller attached to the cathode rod 6, which is in contact with the workpiece 3 to form a cathode.
In this case, if an unnecessary plating layer is formed near the cathode, the formation of the plating layer on the object to be plated is adversely affected. Thus, except for the cathode rod 6 itself and the power supply portion, an insulating film treatment can be performed to prevent extra plating from adhering. However, the contact surface of the power supply roller 7 with the object to be plated cannot be subjected to the insulating film treatment. Therefore, there is a possibility that the plating film adheres to this part, and the abnormally adhered plating film makes the contact with the surface of the object to be plated uneven,
There is a problem that the resulting plating film is not uniform. The present invention solves such a problem.

[0006]

SUMMARY OF THE INVENTION The present invention relates to an apparatus for plating while transferring a plate-like object to be plated vertically mounted on a rail provided in a plating tank. A power supply roller is provided for flowing current in contact with the plate-like material to be plated.The surface of the power supply roller is formed of a film material that is harder than the target plating film, and the plating layer adhering to the surface of the power supply roller is peeled off. Means for contacting the contact surface of the power supply roller with the means for performing the operation.

As the coating material harder than the target plating film, for example, a nickel plating film in the case of copper sulfate plating, a phosphor nickel plating harder than the electroless film, and the like are preferable. Further, a titanium nitride film can be used. Means for peeling off the plating layer adhering to the surface of the power supply roller include a brush, a knife edge, and a carbide engineering plastic edge. In the case of an edge, the unnecessary plating film is removed by rubbing the roller at an angle of 45 °.

[0008]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 shows an example, in which a contact surface of a power supply roller 7 attached to a cathode bar 6 with an object to be plated has a coating material harder than a target plating film such as a copper film, for example, nickel plating, and a protective film 8 made of titanium nitride thereon. To form A brush 9 is pressed by a spring 10 at an appropriate position on the contact surface of the power supply roller 7. Then, with the rotation of the power supply roller 7, the plating deposits generated on the contact surface are removed. Since the protective film 8 which is harder than the plating layer is formed on the contact surface of the power supply roller 7, the adhered plating layer can be easily removed without breaking the protective film 8. It is more preferable that the mounting position of the brush 9 is a position immediately before the power supply roller 7 rotates and comes into contact with the object 3 to be plated. In addition to the brush, a blade or other appropriate removing means can be employed.

[0009]

According to the present invention, in an apparatus for continuously feeding an object to be plated in a longitudinal direction, by providing a protective film on a contact surface of the cathode power supply roller with the object to be plated, the adhered plating film is reduced. The plating means can be easily removed by the removing means, and the plating layer formed on the surface of the object to be plated is not broken by the plating film attached to the power supply roller, so that a uniform plating film can be formed.

[Brief description of the drawings]

FIG. 1 is an explanatory diagram of an embodiment of the present invention.

FIG. 2 is an explanatory view of a vertical feeding type continuous plating apparatus.

[Explanation of symbols]

 2 Rail 3 Plated object 6 Cathode bar 7 Power supply roller 8 Protective film 9 Brush 10 Spring

──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-10-273799 (JP, A) JP-A-4-346693 (JP, A) JP-A-63-199892 (JP, A) JP-A-10-1998 29141 (JP, A) JP-A-3-104898 (JP, A) JP-A-4-78272 (JP, U) (58) Fields investigated (Int. Cl. ⁶ , DB name) C25D 7/06, 7 / 00 C25D 17 / 06,17 / 10

Claims (1)

(57) [Claims] An apparatus for plating while transferring a plate-like object vertically placed on a rail provided in a plating tank, wherein the plate-like object is brought into contact with a cathode rod vertically provided along the rail. A power supply roller is provided for flowing current, and the surface of the power supply roller is formed of a coating material harder than the target plating film, and means for removing the plating layer adhering to the surface of the power supply roller is provided by the power supply roller. An electrode device in a continuous plating apparatus, which is in contact with a contact surface.