JP2970151B2 - Drilling origin machine with X-ray image recognition device - Google Patents
Drilling origin machine with X-ray image recognition deviceInfo
- Publication number
- JP2970151B2 JP2970151B2 JP3331468A JP33146891A JP2970151B2 JP 2970151 B2 JP2970151 B2 JP 2970151B2 JP 3331468 A JP3331468 A JP 3331468A JP 33146891 A JP33146891 A JP 33146891A JP 2970151 B2 JP2970151 B2 JP 2970151B2
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- multilayer printed
- ray
- drilling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Control Of Cutting Processes (AREA)
- Machine Tool Sensing Apparatuses (AREA)
- Drilling And Boring (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、プリント配線板の製造
設備、特に内層の回路密度の高い高密度多層プリント配
線板用穴あけ原点加工機に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed wiring board manufacturing facility, and more particularly to a drilling origin processing machine for a high-density multilayer printed wiring board having a high inner layer circuit density.
【０００２】[0002]
【従来の技術】一般に６層以上の高多層プリント配線板
の製造においては、外層穴あけの際の穴あけ精度を向上
させるため、加工原点となる位置のある一層の内層基準
パターンを座グリにより表面に露出させ、その内層基準
パターンをねらって穴あけ用原点加工を行っている。2. Description of the Related Art In general, in the manufacture of a high multilayer printed wiring board having six or more layers, in order to improve the drilling accuracy when drilling an outer layer, one inner layer reference pattern having a position serving as a processing origin is formed on the surface by spot facing. It is exposed and the origin processing for drilling is performed with the aim of the inner layer reference pattern.
【０００３】[0003]
【発明が解決しようとする課題】上述した従来の高密度
多層プリント配線板の製造方法においては、多層プリン
ト配線板のある一層の基準パターンに対し、パターンを
狙って穴あけ用原点加工を行うため、その他の層面の内
層に対しＸ・Ｙ・θ方向のズレが発生する。このため、
この加工原点を用いて外層穴あけを行うと穴位置精度が
悪化するという欠点があった。In the above-mentioned conventional method for manufacturing a high-density multilayer printed wiring board, since a single reference pattern on the multilayer printed wiring board is subjected to drilling origin processing aiming at the pattern, Deviations in the X, Y, and θ directions occur with respect to the inner layers on the other layer surfaces. For this reason,
When the outer layer is drilled using this processing origin, there is a disadvantage that the hole position accuracy is deteriorated.
【０００４】本発明の目的は、Ｘ線画像認識を用いてか
かる多層プリント配線板の各層の内層基準パターンを測
定することにより、最適の位置に原点加工のできるＸ線
画像認識装置付穴あけ原点加工機を提供することにあ
る。An object of the present invention is to measure the inner layer reference pattern of each layer of such a multilayer printed wiring board by using X-ray image recognition, so that the origin can be machined at an optimum position. To provide machines.
【０００５】[0005]
【課題を解決するための手段】前記目的を達成するた
め、本発明によるＸ線画像認識装置付穴あけ原点加工機
においては、テーブルと、Ｘ線発生源と、スピンドル
と、コントローラとを有し、多層プリント配線板の内層
基準パターンを認識して、多層プリント配線板の外層穴
あけ原点加工を行なうＸ線画像認識装置付穴あけ原点加
工機であって、内層基準パターンは、多層プリント配線
板の各層に互いに干渉しないように配設されたものであ
り、テーブルは、多層プリント配線板をセットするもの
であり、Ｘ線受光部を内蔵し、スピンドルは、多層プリ
ント配線板に原点穴あけ加工を行うものであり、Ｘ線発
生源は、テーブル上の多層プリント配線板にＸ線を照射
するものであり、テーブルに内蔵したＸ線受光部は、照
射Ｘ線を受光し、多層プリント配線板の内層基準パター
ンデータをコントローラに出力するものであり、コント
ローラは、Ｘ線受光部からの信号を入力とし、複数の内
層のそれぞれの層に設けられた基準位置マークについ
て、設計位置座標からの変位を演算処理し、各層毎の補
正量を加味して原点加工データを作成し、そのデータに
基づいてスピントルの位置決めを行うものである。In order to achieve the above object, a drilling origin machining apparatus with an X-ray image recognition device according to the present invention has a table, an X-ray source, a spindle, and a controller, A drilling origin processing machine with an X-ray image recognition device that recognizes an inner layer reference pattern of a multilayer printed wiring board and performs an outer layer drilling origin processing of the multilayer printed wiring board, wherein an inner layer reference pattern is formed on each layer of the multilayer printed wiring board. The table is set so as not to interfere with each other, the table is for setting the multilayer printed wiring board, the X-ray receiving unit is built in, and the spindle is for drilling the origin on the multilayer printed wiring board. The X-ray source irradiates the multilayer printed wiring board on the table with X-rays. The X-ray receiving unit built in the table receives the irradiated X-rays, And outputs a lining reference pattern data of the printed wiring board to the controller, the controller inputs the signals from the X-ray receiving section, the plurality
The reference position marks provided on each layer
Then, calculate the displacement from the design position coordinates , create the origin processing data taking into account the correction amount for each layer, and add it to the data.
The positioning of the spintor is performed based on this.
【０００６】[0006]
【作用】コントローラからの出力に基づき、スピンドル
の位置は、原点穴あけ加工すべき最適位置に位置決めさ
れて外層穴あけが行われる。According to the output from the controller, the position of the spindle is positioned at the optimum position for drilling the origin and the outer layer is drilled.
【０００７】[0007]
【実施例】以下に本発明の実施例を図によって説明す
る。本発明の穴あけ原点加工機は、Ｘ線受光テーブル６
と、Ｘ線発生源９と、スピンドル７と、コントローラ１
２とを基本構成とするものである。DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below with reference to the drawings. The drilling origin processing machine according to the present invention includes an X-ray receiving table 6.
, X-ray source 9, spindle 7, controller 1
2 as a basic configuration.
【０００８】Ｘ線受光テーブル６は、Ｘ線受光部を内蔵
し、ボールネジ５に誘導されて本体１上のガイド４をＹ
軸方向に移動可能であり、別途駆動装置により駆動され
るものである。Ｘ線発生源９と、スピンドル７とは、予
め定められたピッチ，寸法でサドル８に平行に取付けら
れ、サドル８は、本体１に設立した門型ポスト１３のガ
イド４に沿い、ボールネジ１６に誘導され、テーブル６
の移動ラインを跨ってＹ軸方向を移動可能であり、サー
ボモータ１０によって駆動されるものである。The X-ray receiving table 6 has a built-in X-ray receiving section, and is guided by a ball screw 5 to guide the guide 4 on the main body 1 to Y.
It is movable in the axial direction and is separately driven by a driving device. The X-ray source 9 and the spindle 7 are mounted in parallel to the saddle 8 at a predetermined pitch and size, and the saddle 8 is moved along the guide 4 of the portal post 13 established in the main body 1 to the ball screw 16. Guided, table 6
, And can be moved in the Y-axis direction across the movement line, and is driven by the servomotor 10.
【０００９】スピンドル７は、先端に原点加工に必要と
なる径のスピンドル１１が装着され、サーボモータ１５
によって上下方向（Ｚ軸方向）に駆動されるものであ
る。The spindle 7 has a spindle 11 having a diameter required for origin machining mounted on the tip thereof, and a servo motor 15.
Driven in the vertical direction (Z-axis direction).
【００１０】Ｘ線発生源９は、テーブル６に対してＸ線
を発生し、テーブル６に内蔵したＸ線受光部は、受光Ｘ
線のデータをコントローラ１２に出力する。コントロー
ラ１２は、テーブル６の受光Ｘ線のデータを演算処理
し、処理結果に基づく穴あけ指令をサーボモータ１０，
１５に出力するものである。An X-ray source 9 generates X-rays for the table 6, and an X-ray receiving unit built in the table 6 receives X-rays.
The line data is output to the controller 12. The controller 12 performs arithmetic processing on the data of the received X-rays in the table 6, and issues a drilling command based on the processing result to the servo motor 10.
15 is output.
【００１１】テーブル６上には、捨板２を介して多層プ
リント配線板３を設置する。多層プリント配線板３は、
図２の示すように各々の層の４隅に、互いに干渉しない
ように各層毎の内層基準パターンＰが配設されている。The multilayer printed wiring board 3 is set on the table 6 via the discard plate 2. The multilayer printed wiring board 3
As shown in FIG. 2, inner layer reference patterns P for each layer are arranged at four corners of each layer so as not to interfere with each other.
【００１２】次にコントローラ１２に予めセットされた
多層プリント配線板３の内層基準パターンの位置に対応
したデータが呼び出される。一方、Ｘ線発生源９より発
したＸ線がテーブル６上の多層プリント配線板３上に照
射され、各層の内層基準パターンＰがテーブル６のＸ線
受光部に受光され、そのデータがコントローラ１２に出
力される。Next, data corresponding to the position of the inner-layer reference pattern of the multilayer printed wiring board 3 preset in the controller 12 is called. On the other hand, X-rays emitted from the X-ray source 9 are radiated onto the multilayer printed wiring board 3 on the table 6, the inner-layer reference pattern P of each layer is received by the X-ray receiving section of the table 6, and the data is sent to the controller 12. Is output to
【００１３】コントローラ１２では、受光データと、予
めセットされたパターンとを比較し、多層プリント配線
板３の各層の基準パターンＰの設計位置座標からの変位
を測定して各層面のＸ，Ｙ，θ方向の平均補正量の演算
を行う。The controller 12 compares the received light data with a preset pattern, measures the displacement of each layer of the multilayer printed wiring board 3 from the design position coordinates of the reference pattern P, and calculates the X, Y, and The average correction amount in the θ direction is calculated.
【００１４】次に、この補正量を加味した原点加工デー
タが駆動装置に出力され、Ｘ軸方向は、テーブル６の送
りにより、Ｙ軸方向は、サドル８の送りによりスピンド
ル７の位置決めを行い、さらにスピンドルを下降させて
多層プリント配線板３の最適位置に穴あけ原点Ｏを加工
する。Next, origin processing data taking this correction amount into account is output to the drive unit, and the spindle 7 is positioned by feeding the table 6 in the X-axis direction and by feeding the saddle 8 in the Y-axis direction. Further, the spindle is lowered, and a drilling origin O is formed at an optimum position of the multilayer printed wiring board 3.
【００１５】[0015]
【発明の効果】以上説明したように本発明のＸ線画像認
識装置付原点加工機によれば、多層プリント配線板の外
層穴あけの原点加工を座グリを行うことなく、内層各層
の基準パターンをＸ線画像認識を用いることにより、認
識して穴の位置ズレを解消し、高密度の多層板形成が実
現できるという効果がある。As described above, according to the origin processing machine with an X-ray image recognition device of the present invention, the reference pattern of each inner layer can be set without counterboring the origin processing for drilling the outer layer of the multilayer printed wiring board. By using X-ray image recognition, there is an effect that the positional deviation of the holes can be eliminated by recognition, and a high-density multilayer board can be formed.
【図１】本発明のＸ線画像認識装置付原点加工機の斜視
図である。FIG. 1 is a perspective view of an origin processing machine with an X-ray image recognition device of the present invention.
【図２】本発明の多層プリント配線板の穴あけ原点の加
工要領を示す図である。FIG. 2 is a diagram showing a processing procedure of a drilling origin of the multilayer printed wiring board according to the present invention.
１ 本体 ２ 捨板 ３ 多層プリント配線板 ４，１４ ガイド ５，１６ ボールネジ ６ Ｘ線受光テーブル ７ スピンドル ８ サドル ９ Ｘ線発生源 １０，１５ サーボモータ １１ ドリル １２ コントローラ １３ ポスト Ｐ 内層基準パターン Ｏ 穴あけ原点 DESCRIPTION OF SYMBOLS 1 Main body 2 Discard board 3 Multilayer printed wiring board 4, 14 guide 5, 16 ball screw 6 X-ray receiving table 7 spindle 8 saddle 9 X-ray generation source 10, 15 Servo motor 11 Drill 12 Controller 13 Post P Inner layer reference pattern O Drilling origin
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 ＦＩ Ｈ０５Ｋ 3/46 Ｈ０５Ｋ 3/46 Ｙ (58)調査した分野(Int.Cl.6，ＤＢ名) B23Q 17/22 B23B 41/00 B23B 49/00 B26D 5/30 H05K 3/00 H05K 3/46 ──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. 6 identification symbol FI H05K 3/46 H05K 3/46 Y (58) Field surveyed (Int.Cl. 6 , DB name) B23Q 17/22 B23B 41 / 00 B23B 49/00 B26D 5/30 H05K 3/00 H05K 3/46
Claims (1)
と、コントローラとを有し、多層プリント配線板の内層
基準パターンを認識して、多層プリント配線板の外層穴
あけ原点加工を行なうＸ線画像認識装置付穴あけ原点加
工機であって、 内層基準パターンは、多層プリント配線板の各層に互い
に干渉しないように配設されたものであり、 テーブルは、多層プリント配線板をセットするものであ
り、Ｘ線受光部を内蔵し、 スピンドルは、多層プリント配線板に原点穴あけ加工を
行うものであり、 Ｘ線発生源は、テーブル上の多層プリント配線板にＸ線
を照射するものであり、 テーブルに内蔵したＸ線受光部は、照射Ｘ線を受光し、
多層プリント配線板の内層基準パターンデータをコント
ローラに出力するものであり、 コントローラは、Ｘ線受光部からの信号を入力とし、複
数の内層のそれぞれの層に設けられた基準位置マークに
ついて、設計位置座標からの変位を演算処理し、各層毎
の補正量を加味して原点加工データを作成し、そのデー
タに基づいてスピントルの位置決めを行うものであるこ
とを特徴とするＸ線画像認識装置付穴あけ原点加工機。An X-ray image having a table, an X-ray generation source, a spindle, and a controller, recognizing an inner layer reference pattern of a multilayer printed wiring board, and performing an outer layer drilling origin processing of the multilayer printed wiring board. A drilling origin processing machine with a recognition device, wherein the inner layer reference pattern is disposed so as not to interfere with each layer of the multilayer printed wiring board, and the table is for setting the multilayer printed wiring board. The X-ray receiving unit is built in. The spindle is for drilling the origin on the multilayer printed wiring board. The X-ray source is for irradiating the multilayer printed wiring board on the table with X-rays. The built-in X-ray receiving unit receives the irradiated X-ray,
And outputs a lining reference pattern data of the multilayer printed wiring board to the controller, the controller inputs the signals from the X-ray receiving unit, double
The reference position mark provided on each of the inner layers
Then, the displacement from the design position coordinates is calculated and processed for each layer.
Create the origin processing data in consideration of the amount of correction, the Day
A drilling origin processing machine with an X-ray image recognition device, which performs positioning of a spintor based on data.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3331468A JP2970151B2 (en) | 1991-11-20 | 1991-11-20 | Drilling origin machine with X-ray image recognition device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3331468A JP2970151B2 (en) | 1991-11-20 | 1991-11-20 | Drilling origin machine with X-ray image recognition device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH05138503A JPH05138503A (en) | 1993-06-01 |
| JP2970151B2 true JP2970151B2 (en) | 1999-11-02 |
Family
ID=18243984
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3331468A Expired - Fee Related JP2970151B2 (en) | 1991-11-20 | 1991-11-20 | Drilling origin machine with X-ray image recognition device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2970151B2 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DK176448B1 (en) * | 2003-02-03 | 2008-03-03 | Coloplast As | Stomistötte garment piece and manufacture of this |
| JP2009202252A (en) * | 2008-02-26 | 2009-09-10 | Motoronikusu:Kk | Drilling machine using multi-stage drill |
| CN109663958A (en) * | 2017-10-13 | 2019-04-23 | 大族激光科技产业集团股份有限公司 | A kind of multiaxis PCB molding machine |
| CN111558737A (en) * | 2020-05-02 | 2020-08-21 | 武汉哈撒给科技有限公司 | Power distribution cabinet drilling machine |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61168458A (en) * | 1985-01-22 | 1986-07-30 | Sumitomo Bakelite Co Ltd | Preferential boring device for inner layer circuitboard |
-
1991
- 1991-11-20 JP JP3331468A patent/JP2970151B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH05138503A (en) | 1993-06-01 |
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|---|---|---|---|
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Free format text: PAYMENT UNTIL: 20080827 Year of fee payment: 9 |
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