JP2943259B2 - Metal plate etching method - Google Patents
Metal plate etching methodInfo
- Publication number
- JP2943259B2 JP2943259B2 JP17678290A JP17678290A JP2943259B2 JP 2943259 B2 JP2943259 B2 JP 2943259B2 JP 17678290 A JP17678290 A JP 17678290A JP 17678290 A JP17678290 A JP 17678290A JP 2943259 B2 JP2943259 B2 JP 2943259B2
- Authority
- JP
- Japan
- Prior art keywords
- metal plate
- etching
- image
- etching method
- groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Optical Filters (AREA)
- ing And Chemical Polishing (AREA)
Description
本発明は、金属板のエッチング方法に関するものであ
る。The present invention relates to a method for etching a metal plate.
液晶ディスプー用カラーフィルターは、凹板オフセッ
ト印刷等の印刷手法によって現在盛んに製造されてい
る。この様にフィルターを印刷手法によって製造するた
めには、微細なストライプ状の画線溝を多数繰り返し形
成した印刷版が必要であり、現在この画線溝は主にエッ
チング手法によって刻設されている。2. Description of the Related Art Color filters for liquid crystal displays are currently being actively manufactured by printing techniques such as concave plate offset printing. In order to manufacture a filter by a printing method in this way, a printing plate in which a number of fine stripe-shaped image grooves are repeatedly formed is necessary, and these image grooves are currently engraved mainly by an etching method. .
金属板1の表面にレジスト2を所望のパターン状に残
存形成させ、例えば窓状露出部11をエッチングして画線
溝12を形成する際には、金属板1はエッチング液との接
触面に垂直にエッチングされるため、板厚方向のエッチ
ングと共に幅方向にもエッチングが同時進行するので、
レジスト2によって被覆されている下側にもエッチング
が及ぶ。したがって、エッチングの進行と共に画線溝12
は幅が広がり、またこのために両サイド程浅く形成され
る。この様な形状の画線溝からは、精度の高い画線を印
刷形成することは困難であり、また幅方向にはインキむ
らが生じて濃淡のあるカラーフィルターしか製造するこ
とが出来ないと云う問題点があった。このため、可能な
限り幅の増加が少なく、深さも出来る限り均一な画線溝
を刻設することが出来るエッチング方法の開発が強く望
まれていた。When the resist 2 is left and formed in a desired pattern on the surface of the metal plate 1, for example, when the window-shaped exposed portion 11 is etched to form the image groove 12, the metal plate 1 is brought into contact with the etching solution. Since it is etched vertically, the etching proceeds simultaneously in the width direction along with the etching in the thickness direction,
The etching extends to the lower side covered by the resist 2. Therefore, as the etching progresses, the image grooves 12
Are widened and, for this reason, are formed shallower on both sides. It is difficult to print and form a high-precision image from the image groove having such a shape, and ink unevenness occurs in the width direction, so that only a color filter having high and low density can be manufactured. There was a problem. For this reason, there has been a strong demand for the development of an etching method capable of engraving an image groove as small as possible in width and as uniform as possible in depth.
本発明は上記した従来技術の課題を解決するためにな
されたもので、レジストがパターン状に残存形成された
金属板表面に、47゜Be′を越える濃度の塩化第二鉄液を
60℃を越える温度で15cmより短い距離から2Kgf/cm2を越
える圧力でスプレー噴射することを特徴とする金属板の
エッチング方法を提供するものである。The present invention has been made in order to solve the above-mentioned problems of the prior art, and a ferric chloride solution having a concentration exceeding 47 ° Be ′ is applied to the surface of a metal plate on which a resist remains in a pattern.
An object of the present invention is to provide a method for etching a metal plate, which comprises spraying from a distance shorter than 15 cm at a temperature exceeding 60 ° C. and a pressure exceeding 2 kgf / cm 2 .
本発明のエッチング方法は、従来のエッチング法に比
べてエッチング液を高濃度、高温にして近距離から高圧
で吹き付けるため、エッチングが幅方向よりも板厚方向
に大きく進行する。このため、画線溝は幅方向にはそれ
程拡大せず、板厚方向に深く形成される。In the etching method of the present invention, the etching solution is sprayed at a high concentration and a high temperature from a short distance and at a high pressure as compared with the conventional etching method, so that the etching proceeds more in the thickness direction than in the width direction. For this reason, the image groove does not expand so much in the width direction and is formed deep in the plate thickness direction.
つぎに、本発明を比較例との関連で詳細に説明する。 金属板1として板厚が100μmのステンレス鋼鈑を用
い、この片面に適宜のレジスト(例えばカゼイン)2を
10μmの厚さで均一に塗膜し、従来周知のホトリソグラ
フィの手法によってマスク露光させ、例えば露光部を40
μm幅に除去して金属板1の中央部に窓状露出部11を形
成した。 前記窓状露出部11を上に向けて金属板1を水平に設置
し、上方からエッチング液の塩化大二鉄液3を表−1に
示した条件でスプレー噴射し、金属板1の窓状露出部11
に対応して刻設された深さ50μmの画線溝12の形状を比
較した。 エッチング状況の優劣は、画線溝の深さ、幅等を単独
で比較するのではなく、第4図に示す様に窓状露出部11
の幅をW1、実際に刻設された画線溝12の深さをD、幅を
W2としたとき、次式によって定義されるエッチファクタ
ーE.Fを求め、この値をパラメーターとして比較した。
なお、このエッチファクターE.Fは定義から分る様に値
が大きい程、加工精度の観点から好ましい。 比較結果を示す第1図から明らかな様に、本発明の実
験番号15と16は、他の実験番号のエッチファクターE.F
より高い。したがって、幅方向より、深さ方向にエッチ
ングが効果的に進行したことが分かる。これは、実験番
号16によって刻設された画線溝12の断面形状(第2a図)
と、実験番号1により得られた画線溝12の断面形状(第
2b図)の比較からも明らかである。この様に、本発明の
エッチング方法によれば、従来と同一の深さの画線溝12
を形成する際にも、溝幅の増加が少ないので、予め適宜
の幅に窓状露出部11を形成しておくと、この幅から大き
く拡がることがないため、溝幅の精度を高めることが出
来る。そして、画線溝12の両サイドも従前の技術と比較
すると、浅くなる程度が大幅に解消されているので、カ
ラーフィルター等の印刷形成に用いた場合に、幅精度が
高く、しかも幅方向に濃淡の安定した画線が容易に形成
される。 なお、本発明は上記実施例に限定されるものではない
ので、金属板1としては銅板のほかにも黄銅、ニッケ
ル、鉄/ニッケル合金、SUS−304等のステンレス鋼、キ
ュープロニッケル等であって良いし、レジスト2につい
ても所望の精度でエッチングすべき部分のみを露出する
ことが出来るものであれば、材質等は問うものではない
し、露出させる形状、大きさ、個数等についても限定さ
れるものではない。また、塩化第二鉄液を吹き付ける方
法についても、金属板1の露出表面に一様な圧力で吹き
付けることの出来る方法であれば何れの方法であっても
構わない。Next, the present invention will be described in detail with reference to comparative examples. A stainless steel plate having a thickness of 100 μm is used as the metal plate 1, and an appropriate resist (for example, casein) 2 is coated on one surface of the stainless steel plate.
A uniform coating with a thickness of 10 μm is exposed by a mask using a conventionally known photolithography technique.
By removing to a width of μm, a window-shaped exposed portion 11 was formed at the center of the metal plate 1. The metal plate 1 was placed horizontally with the window-shaped exposed portion 11 facing upward, and a ferrous chloride solution 3 of an etching solution was sprayed from above under the conditions shown in Table 1 to spray the window-shaped metal plate 1. Exposed part 11
The shape of the image groove 12 having a depth of 50 μm, which was engraved corresponding to FIG. The superiority of the etching condition is not determined by comparing the depth and width of the image groove alone, but by the window-like exposed portion 11 as shown in FIG.
Is W 1 , the depth of the actually engraved image groove 12 is D, and the width is
When the W 2, determine the etch factor EF defined by the following equation, and compares this value as a parameter.
As can be seen from the definition, the larger the etch factor EF, the more preferable from the viewpoint of processing accuracy. As is clear from FIG. 1 showing the comparison results, the experiment numbers 15 and 16 of the present invention were different from those of the other experiment numbers in terms of the etch factor EF.
taller than. Therefore, it can be seen that the etching progressed more effectively in the depth direction than in the width direction. This is the cross-sectional shape of the object groove 12 engraved by Experiment No. 16 (Fig. 2a).
And the cross-sectional shape of the object groove 12 obtained by Experiment No. 1 (No.
It is clear from the comparison of FIG. 2b). As described above, according to the etching method of the present invention, the image groove 12 having the same depth as the conventional one is obtained.
Also, when forming, since the increase in groove width is small, if the window-shaped exposed portion 11 is formed in advance to an appropriate width, since it does not greatly expand from this width, it is possible to improve the accuracy of the groove width. I can do it. Also, compared to the prior art, both sides of the image groove 12 have been largely eliminated in the degree of shallowness, so when used for printing such as a color filter, the width accuracy is high, and in the width direction. An image with stable shading is easily formed. Since the present invention is not limited to the above-described embodiment, the metal plate 1 may be made of brass, nickel, iron / nickel alloy, stainless steel such as SUS-304, cupro nickel, or the like, in addition to the copper plate. As long as the resist 2 can expose only a portion to be etched with desired accuracy, the material and the like are not limited, and the shape, size, number, and the like to be exposed are also limited. Not something. In addition, as for the method of spraying the ferric chloride liquid, any method may be used as long as the method can spray the exposed surface of the metal plate 1 at a uniform pressure.
以上説明した様に従来のエッチング法に比べてエッチ
ング液を高濃度、高温にして近距離から高圧で吹き付け
る本発明の金属板のエッチング方法は、エッチングが幅
方向よりも板厚方向に大きく進行するので、画線溝は幅
方向にはそれ程拡大せず、板厚方向に深く形成される。
したがって、両サイドが殆ど浅くなっていない形状の画
線溝が高い精度で刻設されるため、液晶ディスプー用カ
ラーフィルター等の印刷版を製造する上で極めて有効な
エッチング方法である。As described above, in the method of etching a metal plate of the present invention in which the etching solution is sprayed at a high concentration and a high temperature from a short distance and at a high pressure as compared with the conventional etching method, the etching proceeds more largely in the thickness direction than in the width direction. Therefore, the object groove does not expand so much in the width direction and is formed deep in the plate thickness direction.
Therefore, since the image groove having a shape in which both sides are almost not shallow is formed with high precision, this is an extremely effective etching method for manufacturing a printing plate such as a color filter for a liquid crystal display.
第1図は本発明の実施例と比較例の実験結果を示す説明
図、第2a図と第2b図は各々実験番号16と1による画線溝
の断面形状を示す図、第3図はエッチング要領を示す説
明図、第4図は形状測定例を示す説明図である。 1……金属板 11……窓状露出部 12……画線溝 2……レジスト 3……塩化第二鉄液FIG. 1 is an explanatory diagram showing the experimental results of the embodiment of the present invention and a comparative example, FIGS. 2a and 2b are diagrams showing the cross-sectional shapes of image grooves according to experiment numbers 16 and 1, respectively, and FIG. FIG. 4 is an explanatory diagram showing the outline, and FIG. 4 is an explanatory diagram showing an example of shape measurement. DESCRIPTION OF SYMBOLS 1 ... Metal plate 11 ... Window-like exposed part 12 ... Image groove 2 ... Resist 3 ... Ferric chloride liquid
Claims (1)
属板表面に、47゜Be′を越える濃度の塩化第二鉄液を60
℃を越える温度で15cmより短い距離から2Kgf/cm2を越え
る圧力でスプレー噴射することを特徴とする金属板のエ
ッチング方法。1. A ferric chloride solution having a concentration exceeding 47 ° Be 'is applied to the surface of a metal plate on which a resist is left in a pattern.
A method for etching a metal plate, which comprises spraying from a distance shorter than 15 cm at a temperature exceeding ℃ and a pressure exceeding 2 kgf / cm 2 .
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17678290A JP2943259B2 (en) | 1990-07-04 | 1990-07-04 | Metal plate etching method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17678290A JP2943259B2 (en) | 1990-07-04 | 1990-07-04 | Metal plate etching method |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0466680A JPH0466680A (en) | 1992-03-03 |
JP2943259B2 true JP2943259B2 (en) | 1999-08-30 |
Family
ID=16019750
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP17678290A Expired - Lifetime JP2943259B2 (en) | 1990-07-04 | 1990-07-04 | Metal plate etching method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2943259B2 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002356793A (en) * | 2001-05-30 | 2002-12-13 | Kyushu Hitachi Maxell Ltd | Electrocasting metal and method of manufacturing for the same |
-
1990
- 1990-07-04 JP JP17678290A patent/JP2943259B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH0466680A (en) | 1992-03-03 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN100531526C (en) | Metal photo-etching product and production method therefor | |
JP2524458B2 (en) | Electrochemical micromachining method | |
KR102341452B1 (en) | Metal mask substrate for vapor deposition, metal mask for vapor deposition, production method for metal mask substrate for vapor deposition, and production method for metal mask for vapor deposition | |
GB2332650A (en) | Etching photoresist patterned metal substrate with specific surface roughness | |
JP2943259B2 (en) | Metal plate etching method | |
JP6221585B2 (en) | Vapor deposition mask and method of manufacturing vapor deposition mask | |
CN109195312B (en) | Stiffening plate and method for improving etching precision of stiffening plate | |
US3155460A (en) | Fine mesh screens | |
US5480519A (en) | Electrochemical etch system and method | |
JP2502852B2 (en) | Intaglio and its manufacturing method | |
CN1031747C (en) | Steel mould intaglio etching liquid specially for transfer machine electronic | |
US3776820A (en) | Method of forming miniature electrical conductors | |
US20240347231A1 (en) | Method for producing shaped parts from an electrically conductive planar element and circuit board having atleast one shaped part of this type | |
JP3474927B2 (en) | Manufacturing method of intaglio for printing | |
JPS5987845A (en) | Manufacture of lead frame | |
JPH0117253B2 (en) | ||
JPH09209175A (en) | Etching method | |
JPS5848668A (en) | Production of blanked plate of paper piece or the like | |
JPH07272622A (en) | Manufacture of plate having extra fine perforation | |
JPH0113097B2 (en) | ||
JP2022110552A (en) | Vapor deposition mask, method for manufacturing the same and method for manufacturing display device | |
JP2002353124A (en) | Manufacturing method of mask for charged beam projection exposure | |
JPH0643635B2 (en) | Method of forming fine grooves | |
KR0160971B1 (en) | Marking method of wafer | |
KR20230141605A (en) | Metal mask and production method therefor |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080625 Year of fee payment: 9 |
|
FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090625 Year of fee payment: 10 |
|
FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100625 Year of fee payment: 11 |