JP2884781B2 - Electronic component transfer head - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a transfer head for electronic parts, and more particularly, reflects light emitted from a light source to a camera side for observing the electronic parts adsorbed by a nozzle with a camera. The present invention relates to an arrangement structure of a light diffusion plate.

[0002]

2. Description of the Related Art In the process of adsorbing an electronic component to a nozzle of a transfer head and transferring and mounting the electronic component on a substrate, the electronic component is observed by a camera to detect a displacement of the electronic component.

FIG. 11 shows a state where an electronic component is observed by conventional means. In the drawing, reference numeral 101 denotes a transfer head, which has a plurality of nozzles 102a to 102d (the nozzle 102d is not shown).

The nozzle 102a most suitable for the electronic component P is selected from the plurality of nozzles 102a to 102d, and the electronic component P is sucked to the nozzle 102a. 103, a camera for observing the electronic component P from below, 1
Reference numeral 04 denotes a ring-shaped light source.

A light diffusion plate 105 such as a white acrylic resin plate is mounted below the transfer head 101. The light emitted from the light source 104 is reflected downward by the light diffusion plate 105, and the silhouette of the electronic component P is observed in a black background on a bright background.

FIG. 12 shows an image observed by the camera 103. Q is an inspection frame of the camera 103, and L is a lead of the electronic component P.

[0007]

However, in the above-mentioned conventional means, when the electronic component P is large, the other nozzles 102b to 102b are not used.
102d near the lead L, these nozzles 1
02b to 102d are also observed to be black like the lead L.
Therefore, the nozzles 102b to 102b become obstacles,
There was a problem that the lead L could not be clearly observed, and the displacement of the electronic component P could not be accurately detected.

Accordingly, an object of the present invention is to provide a transfer head capable of observing a large-sized electronic component clearly by eliminating adverse effects of other nozzles that do not adsorb the electronic component.

[0009]

According to the present invention, a plurality of nozzles rotating about a rotation axis, a motor rotating the rotation axis, and a nozzle selected from the plurality of nozzles are lowered. and lowering means, rotatably provided in the lower portion of the plurality of nozzles has a hole which the selected nozzle penetrates freely projecting and retracting, down to and through the hole
The light diffusion plate which is rotated by being pulled by the nozzle protruding in the direction constitutes an electronic component transfer head.

[0010]

In the above arrangement, the selected nozzle penetrates the hole of the light diffusing plate downward and sucks the electronic component. Next, light is irradiated toward the light diffusion plate, and the silhouette of the electronic component is observed with a camera. In this case, since other nozzles that do not adsorb the electronic component are hidden behind the light diffusion plate, These nozzles are not observed at all by the camera, and only the black silhouette of the electronic component can be clearly seen in a light background.

[0011]

Next, an embodiment of the present invention will be described with reference to the drawings. FIG. 1 shows an observation stage I (described later)
FIG. 3 is a side view of a main part in a state where the electronic component P is observed.
Reference numeral 1 denotes a transfer head, and a light diffusion plate 14 is provided below the transfer head. Nozzle 4 protruding from light diffusion plate 14
The electronic component P is attracted to a. 25 is the transfer head 1
A camera 26 is provided below the moving path of, and is a ring-shaped light source. When the transfer head 1 arrives above the camera 25, light is emitted from the light source 26 toward the light diffusion plate 14, and the light is reflected downward by the light diffusion plate 14,
A black silhouette of the electronic component P is observed in a light background. L is a lead of the electronic component P.

FIG. 2 is a cross-sectional view of the transfer head 1 in a nozzle projection stage F (described later). Reference numeral 2 denotes a main body case, in which a vertical rotating shaft 3 is provided. M is a motor for rotating the rotating shaft 3. A plurality of nozzles 4 (4a, 4b, 4c, 4d) are provided around the rotation shaft 3 (see also FIG. 3). The nozzle 4 is mounted below the nozzle shaft 5. Reference numeral 6 denotes a bracket surrounding the nozzle shaft 5, and a lever 7 is pivotally mounted on the bracket 6 by a pin 10. A ring-shaped spring member 9 is mounted on the lever 7, and a hook 7 a formed at the lower end of the lever 7 is engaged with an engaging portion 8 formed by cutting the nozzle 4 by the spring force of the spring member 9. Combine.

A coil spring 11 is mounted on the nozzle shaft 5. This coil spring 11
The nozzle 4 is urged downward. Reference numeral 12 denotes a block mounted below the rotary shaft 3, and the nozzle 4 is fitted into the block 12 so as to be able to move up and down. Therefore, when the rotating shaft 3 and the block 12 rotate, the nozzle 4 also moves to the rotating shaft 3
Rotate around.

A cylinder 13 is provided beside the lever 7. When the rod 13a of the cylinder 13 projects, the lever 7 rotates counterclockwise about the pin 10, and the hook 7a is disengaged from the engaging portion 8. Then, the nozzle 4 is lowered by the spring force of the coil spring 11 and protrudes from the hole 19 of the light diffusion plate 14 (see FIG. 3). That is, the cylinder 13 serves as a means for lowering the nozzle 4. Of course, the nozzle 7 may be lowered by pressing the lever 7 by another means such as a cam means instead of the cylinder 13.

In FIG. 2, the light diffusing plate 14 is provided below the nozzle 4 so as to cover the nozzles 4a to 4d. The light diffusion plate 14 is rotatably mounted on the lower part of the main body case 2 via a bracket 15.
A leaf spring 16 for position regulation is mounted on the main body case 2. The leaf spring 16 elastically fits on the bracket 15 and positions the rotational position of the light diffusing plate 14.
20 is a rotary head, 21 is this rotary head 2
A guide rail 22 provided on the guide rail 0 is a slider fitted to the guide rail 21 to guide the transfer head 1 up and down.

In FIGS. 2 and 3, a hole 19 is formed in the light diffusion plate 14, and the hook 7a is engaged with the nozzle 4 in a state where the nozzle 4 is located immediately above the hole 19 as described above. When detached from the portion 8, the nozzle 4 penetrates through the hole portion 19 so as to be freely protruded and protruded downward . When the motor 10 is driven with the nozzle 4 protruding downward , the nozzle 4 rotates about the rotating shaft 3 and at this time, the light diffusion plate 14 is also pulled by the nozzle 4 penetrating downward. Being rotated.

FIG. 4 is a plan view of the electronic component mounting apparatus. Reference numeral 20 denotes a rotary head, and a large number of the transfer heads 1 are provided along the circumferential direction. An electronic component supply device 31 is provided behind the rotary head 20. Reference numeral 32 denotes a moving table on which a pallet 33 is placed. A large number of feeders 34 for electronic components P such as a tape feeder and a tube feeder are placed on the pallet 33. Reference numeral 35 denotes a ball screw, and reference numeral 30 denotes a motor for driving the ball screw 35. When the ball screw 35 rotates, the feeder 34 moves in the X direction, and stops the predetermined feeder 34 on the pickup stage G.
An XY table 36 is provided on the front side of the rotary head 20. The XY table 36 moves the substrate 37 in the XY directions.

In FIG. 4, A is a mounting stage for mounting the electronic component P sucked by the nozzle 4 on the substrate 37, and B is a return stage for returning the light diffusion plate 14 to its original position.
The original position is a position where the selected nozzle 4 can protrude from the hole 19.

C is a drop stage for dropping and discarding defective electronic components P, which are no longer mounted on the substrate 37, from the nozzles 4, and D is a nozzle stage protruding from the light diffusion plate 14.
E is a storage stage for retracting and storing above the light diffusion plate 14, and E is a nozzle for fitting the nozzle 4 suitable for the next electronic component to the hole 19.
The nozzle selection stage F is located immediately above the nozzle 4 and the rod 13a of the cylinder 13 is projected so that the selected nozzle 4
A nozzle projecting stage for projecting the electronic component P of the feeder 34 from the nozzle 4 and picking up by picking up the electronic component P of the feeder 34; a preliminary stage H;
I is an observation stage for observing the electronic component P attracted to the nozzle 4 by the camera 25, and J, K, and L are correction stages for rotating the motor 10 to correct the displacement of the electronic component P in the rotation direction. . Rotary head 20 is arrow N
By rotating the index in the direction, the transfer head 1
Circulates through each of the stages A to L.

FIGS. 5A and 5B show the respective stages A.
4 (4a to 4d) and the light diffusion plate 14
Indicates the positional relationship. In FIG. 5A, a black nozzle 4 is provided with a light diffusing plate 14 for adsorbing an electronic component P.
The nozzle protruding from the nozzle is shown. FIG. 5 (b)
In the figure, the double ring indicates a state in which the nozzle 4 projects from the hole 19. Next, the operation will be described with reference to FIGS.

The transfer head 1 picking up the electronic component P by the pickup stage G moves to the observation stage I, and the camera 25 observes the electronic component P sucked by the nozzle 4. FIG. 1 shows a state in which the electronic component P sucked by the nozzle 4a is observed. The nozzle 4a protrudes from the hole 19, and the other nozzle 4b
4b are hidden behind the light diffusion plate 14 (FIG. 5B).
See also Stage G). Therefore, the other nozzle 4b
4d does not hinder the observation by the camera 25, and only the electronic component P is clearly observed in black on a bright background as shown in FIG. Q is an inspection frame of the camera 25.

Next, in the stages J to L, the motor 10 is driven to rotate the nozzle 4a about the rotating shaft 3, thereby correcting the displacement of the electronic component P in the rotating direction. Note that the displacement of the electronic component P in the XY directions is XY
The correction is performed by driving the table 36 and moving the substrate 37 in the XY directions.

Next, the mounting head 1 moves to the mounting stage A, and the electronic component P is mounted on the substrate 37 by moving the mounting head 1 up and down along the rail 21 (see also stage A in FIG. 5).

Next, the transfer head 1 moves to the return stage B, and the motor 10 rotates, so that the light diffusing plate 1 is moved.
4 returns to its original position (see also stage B in FIG. 5).

Next, the transfer head 1 moves to the drop stage C, and further moves to the nozzle storage stage D. FIG. 7 shows the nozzle storage stage D (stages C and D in FIG. 5).
See also). Reference numeral 41 denotes a cylinder as a nozzle housing means, and the rod 41a is raised so that the nozzle 4
The nozzle 4a is housed by pushing up a above the light diffusing plate 14 and engaging the hook 7a with the engaging portion 8.

Next, the transfer head 1 moves to the nozzle selection stage E. Here, when the motor 10 is driven, the nozzles 4a to 4d rotate around the rotation shaft 3, and the predetermined nozzle 4b is located directly above the hole 19 (see also the stage E in FIG. 5).

Next, the transfer head 1 moves to the nozzle projection stage F. Here, as described with reference to FIG. 2, when the rod 13a of the cylinder 13 projects, the nozzle 4b descends and projects below the light diffusion plate 14 (see also the stage F in FIG. 5).

Next, the transfer head 1 moves to the pickup stage G, and picks up the electronic component by sucking it to the selected nozzle 4b. By repeating the above operation, the electronic component P of the feeder 34 is
Will be installed sequentially.

Some electronic components are smaller than the size of the hole 19. The diameter of a nozzle for sucking such a small electronic component is also extremely small. Therefore, when such a small electronic component is attracted to the small-diameter nozzle and observed by the camera 25,
And cannot be recognized by the camera 25. As such a small electronic component, for example, there is a resistor chip having a side of 0.5 mm or less.

FIG. 8 shows a means for observing such a small electronic component Pm. One side of the electronic component Pm is 0.5 mm, and the diameter of the nozzle 4e is 0.3 mm.
The diameter of the hole 19 is 4 mm so that a large-diameter nozzle can pass therethrough. Of course, these values are exemplary.

A large diameter portion 4e 'is provided above the nozzle 4e.
Is provided. The tapered surface a of the large diameter portion 4e 'is a light diffusion surface. Therefore, the electronic component Pm is observed as a black silhouette in the bright tapered surface a.

As shown in FIG. 9, the lower surface b of the large diameter portion 4e '
May be a flat light diffusing surface. Further, as shown in FIG. 10, the nozzle 4f may be tapered, and the tapered surface c may be a light diffusing surface. As described above, various shapes of the nozzle are conceivable. In short, the nozzle may be provided with a large-diameter portion larger than the electronic component Pm, and the large-diameter portion may be used as the light diffusion surface.

[0033]

As described above , according to the present invention , the nozzle which does not suck the electronic component does not hinder the observation, and the electronic component can be clearly observed. Also, even if the nozzles are arranged close to each other, there will be no obstruction to the observation.Therefore, a large number of nozzles may be densely provided in the transfer head. To cope with the problem, the transfer head can be provided with a large number of nozzles. In addition, a protrusion that extends downward through the hole
Tow and rotate the light diffuser with the chisel
So that the hole is securely located at the predetermined rotation position,
Make sure that the nozzle to be used next projects downward from the hole
be able to.

[Brief description of the drawings]

FIG. 1 is a side view of a main part while observing an electronic component according to the present invention.

FIG. 2 is a cross-sectional view of the transfer head.

FIG. 3 is a perspective view of the transfer head.

FIG. 4 is a plan view of the electronic component mounting apparatus.

FIG. 5 is an operation diagram of the nozzle and the light diffusion plate.

FIG. 6 is an observation diagram of the same.

FIG. 7 is a side view in which the nozzle is housed.

FIG. 8 is a side view of another embodiment of the nozzle.

FIG. 9 is a side view of another embodiment of the nozzle.

FIG. 10 is a side view of another embodiment of the nozzle.

FIG. 11 is a side view of a conventional apparatus.

FIG. 12 is an observation diagram of the same.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Transfer head 3 Rotating shaft 4 Nozzle 10 Motor 13 Lowering means 14 Light diffusing plate 19 Hole

Claims (1)

(57) [Claims] A plurality of nozzles rotating about a rotation axis; a motor for rotating the rotation axis; a descent means for lowering a nozzle selected from the plurality of nozzles; A light diffusion that is rotatably provided below the nozzle, has a hole through which the selected nozzle penetrates and retracts, and is towed by the nozzle that protrudes downward through the hole and rotates. A transfer head for electronic components, comprising a plate.