JP3044901B2 - Electronic component mounting equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting apparatus and, more particularly, to a chuck for chucking an electronic component on a transfer head for sucking the electronic component to a nozzle and transferring the electronic component to a substrate, thereby correcting a displacement. Means and a light diffusing plate for recognizing the displacement of the electronic component by the camera, wherein correction of the displacement by the chuck means of the electronic component and correction of the displacement by the camera are selectively performed. It is.

[0002]

2. Description of the Related Art Electronic component mounting apparatuses include electronic components (hereinafter, referred to as electronic components).
A chip in a supply unit (hereinafter simply referred to as a chip) is suctioned to a nozzle of a transfer head and transferred to and mounted on a substrate. Before the transfer and mounting, the position of the chip is corrected. The chip has a low required mounting accuracy, such as a square chip typified by a capacitor chip or a resistance chip, and the required mounting accuracy, such as a leaded chip typified by a QFP or SOP. These chips have been mounted on a substrate after correcting the positional deviation by means described below.

FIG. 6 is a front view of an electronic component mounting apparatus according to a conventional means. In the figure, reference numeral 101 denotes a tape feeder equipped with a chip P1 having a required low mounting accuracy, such as a square chip. Reference numeral 102 denotes a tray feeder on which a chip P2 with a required high mounting accuracy such as a chip with a lead is mounted, and 103 denotes a positioning portion of the substrate S. A recognition unit 105 for observing the chip P2 is provided with a light source 106 and a camera 107. 10
Reference numeral 8 denotes a first transfer head for mounting the chip P1 on the substrate S, which is provided with a nozzle 109 and four chuck claws 110 as chuck means for chucking the chip P1. Reference numeral 111 denotes a second transfer head for mounting the chip P2 on the substrate S, on which a nozzle 113 provided with a light diffusion plate 112 is mounted. These transfer heads 108 and 111 include an X table 114a and a Y table 1
It is attached to an XY table 114 composed of 14b.

Next, the operation of the conventional device will be described. When the chip P1 is mounted on the substrate S, the XY table 11 is used.
4 is driven, the chip P1 of the tape feeder 101 is attracted to the nozzle 109 of the transfer head 108 to be picked up, and the chuck claw 110 is
The chip P1 is chucked from four directions to correct the displacement, and is transferred and mounted on the substrate S.

When the chip P2 is mounted on the substrate S, the XY table 114 is driven to move the chip P2 of the tray feeder 102 to the nozzle 113 of the transfer head 111.
The chip P2 is observed by the camera 107 as a silhouette while the irradiation light emitted from the light source 106 is scattered by the light diffusion plate 112, and the chip P2 is observed in the XYθ direction. After detecting the position shift, the nozzle 113 is rotated to correct the position shift in the θ direction, and by correcting the movement stroke of the XY table 114, the position shift in the XY direction is corrected. Transferred to S.

[0006]

However, in the above-mentioned conventional means, the transfer head 108 for the chip P1 and the chip P2
That two types of transfer heads 111 are required, the structure of the entire apparatus becomes complicated, and it is difficult to manage the position adjustment and the like when assembling the transfer heads 108 and 111. was there.

Accordingly, the present invention provides an electronic component mounting apparatus capable of transferring and mounting electronic components having high required mounting accuracy and low electronic components on a substrate by correcting positional deviation of the electronic components by using a single transfer head. With the goal.

[0008]

SUMMARY OF THE INVENTION To this end, the present invention provides chucking means for chucking an electronic component sucked by a nozzle to a transfer head from four directions to correct a displacement of the electronic component, and a light source. A light diffusing plate that scatters the irradiation light irradiated from the device, and a drive unit that moves the light diffusing plate in and out of the chuck means.

[0009]

According to the above arrangement, when mounting electronic components having a low required mounting accuracy on a substrate, the electronic components of the supply section are picked up by the nozzles, and the moving means is driven to move the transfer head to the substrate. During the movement, the electronic component is chucked from four directions by the chuck means to correct the positional deviation, and is transferred and mounted on the substrate.

In the case where an electronic component with a high required mounting accuracy is mounted on a substrate, the electronic component of the supply unit is picked up by a nozzle, and the moving unit is driven to move the transfer head onto the recognition unit. At the same time, the drive unit is driven to move the light diffusing plate under the chucking unit, and the light emitted from the light source is scattered by the light diffusing plate to observe the electronic components with a camera and detect the position shift. I do. Next, the moving means is driven, and the nozzle is rotated while the transfer head is moved to the substrate, or the moving stroke of the moving means is corrected to correct the displacement of the electronic component, and similarly transferred to the substrate. Mount.

As described above, according to this means, by selectively using the chuck means and the light diffusing plate, it is possible to use a single transfer head to combine the electronic parts with the required high mounting precision and the electronic parts with the low mounting precision together. It can be mounted on a substrate after correcting the displacement.

[0012]

Next, an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a front view of the electronic component mounting apparatus. 1
Is a tape feeder as a chip supply unit, and is equipped with a chip P1 having a low required mounting accuracy, such as a capacitor chip or a resistance chip. Reference numeral 2 denotes a tray feeder on which a chip P2 having a high required mounting accuracy is placed, such as a chip with a lead. Reference numeral 3 denotes a positioning unit for positioning the substrate S, and reference numeral 5 denotes a recognition unit for observing the chip P2. The light source 6 and the camera 7 are provided. Reference numeral 8 denotes a transfer head, which is a vertically movable nozzle 9, four chuck claws 10 as chuck means for chucking the chip P1 from four directions, and a light diffusion plate for scattering the irradiation light emitted from the light source 6. 12 are integrally mounted.
The position of the light source is not limited to this embodiment. Reference numeral 14 denotes an XY table as a moving unit to which the transfer head 8 is attached, and includes an X table 14a and a Y table 14b. By driving the XY table 14, the transfer head 8 reciprocates between the feeder 1 or 2 and the substrate S. The recognition unit 5 is provided below the moving path of the transfer head 8. Next, the transfer head 8 will be described in detail with reference to FIGS.

In FIG. 2, reference numeral 8a denotes a through hole formed in the center of the transfer head 8, and a nozzle shaft 11 holding the nozzle 9 is freely inserted into the through hole 8a so as to be able to move up and down. The means for raising and lowering the nozzle shaft 11 includes:
For example, it is a well-known means as disclosed in Japanese Patent Application Laid-Open No. 62-111496, and the description thereof is omitted. FIG.
2A, the frame 1 is provided below the transfer head 8.
A chuck 6 is rotatably attached to the chuck pawl 10 by a pin 17. 18 is attached to the upper end of each chuck claw 10 and
0 is a spring that maintains a normally open state. The mechanism for opening and closing the chuck claw 10 is also a well-known means as disclosed in the above-mentioned publication, and thus the description is omitted.

In FIG. 2, reference numeral 19 denotes a bracket provided on the side surface of the transfer head 8, and a pair of downwardly extending arms 20 are rotatably mounted by pins 21 respectively. Projecting portions 20a are formed on the side surfaces of each arm 20 facing each other. At the lower end of each arm 20, a pair of light diffusion plates 12 made of a white acrylic plate is provided.
Is mounted in a cantilevered state. These light diffusion plates 1
2 is opened and closed by rotating about the pin 21. Chip P2
During observation by the camera 7, the light diffusion plate 12 is closed as shown in FIG. A cutout portion 12a that fits into the nozzle 9 when the light diffusion plate 12 is closed is formed on the opposite side surface of each light diffusion plate 12 (see also FIG. 5). Reference numeral 23 denotes a spring for maintaining these arms 20 in a normally closed state.

In FIG. 2, reference numeral 24 denotes a cylinder for opening and closing the light diffusing plate 12. When the cylinder 24 is driven to project the rod 25, the projecting portion 20a is pressed downward, and each arm 20 is driven by a spring. Against the urging force of 23, the light diffusing plate 12 is opened by rotating in the direction away from each other about the pin 21 as shown by the arrow in the figure. When the rod 25 of the cylinder 24 is retracted, the arms 20 are rotated inwardly and closed by the urging force of the spring 23. That is, the cylinder 24 connects the light diffusion plate 12 to the chuck claw 1.
It is an in / out driving means for putting in / out below 0.

As described above, the present means comprises one transfer head 8
In addition, a chuck claw 10 for correcting the displacement of the chip P1 and a light diffusing plate 12 for observing the chip P2 with the camera 7 are integrally provided. Chuck claws 10 according to the type
And the light diffusion plate 12 are selectively used.

The present apparatus has the above-described configuration, and the operation will be described next. In FIG. 1, when the chip P1 is mounted on the substrate S, the light diffusion plate 12 is opened by projecting the rod 25 of the cylinder 24. Then, the nozzle 9 is moved up and down on the tape feeder 1 to pick up the chip P1 (see FIG. 3A), and the XY table 14 is driven to transfer the picked up chip P1 toward the substrate S of the positioning unit 3. . On the way, as shown in FIG. 3B, the nozzle 9 is raised to the chuck position of the chip P1, and the chip P1 is chucked from four directions by the chuck claws 10 to correct the positional deviation. As shown in (c), the chip P1 is transferred and mounted on the substrate S by moving the transfer head 8 onto the substrate S and moving the nozzle 9 up and down. During the above operation, the light diffusion plate 12 is opened so as not to obstruct the nozzle 9 for sucking the chip P1.

Next, when the chip P2 is mounted, FIG.
, The nozzle 9 is moved up and down on the tray feeder 2 to pick up the chip P2. Next, the XY table 14 is driven to move the transfer head 8 toward the recognition unit 5. On the way, rod 2 of cylinder 24
5, the light diffusing plate 12 is closed below the chuck claw 10, and as shown in FIG. Is observed to detect a position shift in the XYθ direction. Next, the transfer head 8 moves toward the substrate S. In the middle of the movement, the nozzle 9 is rotated to correct the position shift in the θ direction, and the moving stroke of the XY table 14 is corrected to change the position in the XY direction. After correcting the displacement, it is transferred and mounted on the substrate S.

At the time of the above observation, the light diffusion plate 12 is closed below the chuck claw 10, and the chuck claw 10 is hidden from the visual field of the camera 7, so that the chuck claw 10 is
Therefore, the camera 7 can accurately detect the displacement of the chip P2. The present invention is not limited to the above embodiment.
A cam mechanism or the like other than the cylinder 24 can be used as the drive mechanism for inserting and removing the light source 2. In short, the light diffusion plate 12 can be easily inserted and removed below the chuck claw 10.

[0020]

As described above, according to the present invention, since one transfer head is provided with the chuck means and the light diffusion plate which can be taken in and out, it is possible to selectively use the chuck means and the light diffusion plate. With one transfer head, it is possible to transfer and mount electronic parts with high required mounting accuracy and low electronic parts together on a substrate, and the overall configuration is simplified as compared with the conventional two transfer head type. Also, assembling of the transfer head, maintenance management and operation management become easy.

[Brief description of the drawings]

FIG. 1 is a front view of an electronic component mounting apparatus according to the present invention.

FIG. 2 is a perspective view of a transfer head according to the present invention.

FIG. 3A is a front view of a main part of the electronic component according to the present invention during mounting. FIG. 3B is a front view of a main part of the electronic component according to the present invention during mounting. Main part front view of

FIG. 4 is a front view of a main part of the electronic component according to the present invention during observation.

FIG. 5 is a plan view of a main part of the electronic component according to the present invention during observation.

FIG. 6 is a front view of an electronic component mounting apparatus according to a conventional means.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Supply part 2 Supply part 3 Positioning part 5 Recognition part 6 Light source 7 Camera 8 Transfer head 9 Nozzle 10 Chuck means 12 Light diffusing plate 14 Moving means 24 In / out drive means P Electronic component S board

Continuation of the front page (56) References JP-A-4-238332 (JP, A) JP-A-4-35095 (JP, A) JP-A-2-143499 (JP, A) JP-A-4-800 (JP) JP-A-4-354626 (JP, A) JP-A-3-221328 (JP, A) JP-A-2-148900 (JP, A) (58) Fields investigated (Int. Cl. ⁷ , DB (Name) H05K 13/04 H05K 13/08

Claims (1)

(57) [Claims] A transfer section provided with a positioning section on which a substrate is positioned, an electronic component supply section, and a vertically movable nozzle; and moving the transfer head between the supply section and the positioning section. The electronic component mounting apparatus, comprising: a moving unit; and an electronic component recognition unit which is provided below a moving path of the transfer head and has a camera for observing the electronic component sucked by the nozzle. Chucking means for chucking the electronic component adsorbed on the nozzle from four directions to the head to correct the displacement of the electronic component; a light diffusion plate for scattering the irradiation light emitted from the light source; An electronic component mounting apparatus, comprising: a loading / unloading drive unit for allowing a plate to enter and exit below a chuck unit.