JP2770425B2 - Electronic component mounting apparatus and mounting method - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to an electronic component mounting apparatus and a mounting method, and more particularly, to an electronic component supply body such as a tray or a tube feeder on a table provided in a table moving device. The electronic component is transferred and mounted on a substrate.

(Prior Art) As a device for mounting electronic components, a table provided in a table moving device is reciprocated, and electronic components of a tape unit arranged in parallel with the table are taken by a transfer head mounted on a rotary head. 2. Description of the Related Art A rotary head type mounting apparatus is known which is mounted on a substrate positioned at a positioning part and transferred to and mounted on a positioning part (for example, Japanese Patent Application Laid-Open No.
60-28298, JP-A-62-140499).

The tape unit peels off the cover tape while taking out the tape containing the electronic components from the supply reel, takes up the electronic components stored in the tape pockets by the transfer head, and transfers and loads the electronic components to the substrate. It has become.

However, relatively small electronic components such as IC chips, capacitor chips, and resistor chips are easily encapsulated in this type of tape, but relatively large electronic components with leads, such as QFP and SOP, are encapsulated. Due to the difficulty, these electronic components are stored in a tray, a tube feeder, or the like. Therefore, conventionally, relatively small electronic components encapsulated in tape are mounted on a board by the rotary head mounting device, and relatively large electronic components such as QFP and SOP are
For example, as disclosed in Japanese Patent Application Laid-Open Nos. 62-259731 and 62-42597, they are separately mounted on a substrate by a single-head type mounting device.

(Problems to be Solved by the Invention) As described above, according to the conventional means, two types of mounting devices, a rotary head type and a single head type, must be prepared according to the size of electronic components, and both devices must be used properly. Therefore, the operation and management of the apparatus are troublesome, and the equipment cost is increased accordingly.

Therefore, the present invention provides a rotary head type mounting apparatus capable of simultaneously mounting not only electronic components mounted on a tape unit but also electronic components mounted on another supply body such as a tray or a tube feeder on a substrate. The purpose is to:

(Means for Solving the Problems) For this purpose, according to the present invention, a table provided in a table moving device is provided with a mounting device for electronic components in addition to a tape unit, and a side portion of the table moving device. ,
A transfer device provided with a sub-transfer head for taking up electronic components of an electronic component supply body and transferring the electronic components to the mounting device is provided.

(Operation) According to the above configuration, the electronic components of the electronic component supply such as the tray and the tube feeder are transferred to the mounting device on the table by the sub-transfer head. Next, this table
By reciprocating on a table moving device, the transferred electronic components are taken up by a transfer head of a rotary head and transferred and mounted on a substrate.

Embodiment 1 Next, an embodiment of the present invention will be described with reference to the drawings.

FIG. 1 is a plan view of a rotary head type mounting apparatus, in which 61 is a mounting apparatus main body, and a table moving device 62 is provided behind it. The main body 61 includes a rotary head 63 that performs index rotation in the N1 direction. Reference numeral 64 denotes a transfer head arranged in parallel with the rotary head 63 along the circumferential direction. The transfer head 64 takes up electronic components of the table moving device 62, and transfers and mounts the electronic components on the substrate 66 positioned by the positioning unit 65. Reference numeral 67 denotes a conveyor for carrying the substrate 66 into and out of the positioning unit 65.

A table 70 is mounted on the table moving device 62, and a large number of tape units 71 are arranged on the table 70. Reference numeral 72 denotes a feed screw, and a nut 73 driven by a motor 74 is attached to an end of the feed screw. On the lower surface of the table 70, a nut 78 screwed to the feed screw 72 is mounted, and when the feed screw 72 rotates by being driven by the motor 74, the table 70 reciprocates in the lateral direction N2 along the feed screw 72. Then, move the desired tape unit 71 to the take-up position a.
The electronic components mounted on the tape unit 71 are taken up by the transfer head 64, and
To be transported. The tape unit 71 is equipped with relatively small electronic components such as an IC chip, a capacitor chip, and a resistance chip. Reference numeral 80 denotes an electronic component mounting device provided on a side portion of the table 70. The details will be described below with reference to FIG.

The mounting device 80 is configured by adjusting an endless belt 81 to a sprocket 82, and a mounting portion 89 for electronic components is arranged on the belt 81 in a pocket shape. 83 is a pitch feeding means for the belt 81, which includes a ratchet wheel 84, a driving lever 85, and a feed pawl 8;
6, consisting of a biasing spring 87 and the like. Reference numeral 88 denotes a cylinder provided above the lever 85. When a rod 88a of the cylinder 88 protrudes and retracts and presses the lever 85, the ratchet wheel 84 rotates at a pitch, and the belt 81 moves forward from the rear of the table moving device 62 from the rear. Is pitch-fed in the direction of arrow N3. A plurality of (four in this embodiment) mounting devices 80 are arranged side by side.
By 30 (described later), electronic components of different types are placed. 71a is a supply reel mounted on the tape unit 71, and P is an electronic component. The tape unit 71 is simply shown for convenience of drawing. A transfer device 30 for supplying electronic components to the mounting device 80 is provided on the side of the table moving device 62, and will be described in detail with reference to FIGS. I do.

2 and 3, reference numeral 1 denotes a box-shaped magazine in which a plurality of trays 3 as electronic component supply bodies mounted on the base material 2 are stacked and stored. The tray 3 contains relatively large electronic components having leads such as QFP. 10 and 11 are a lower frame and an upper frame.
It is arranged in. M1 is a motor mounted on the upper frame 11, and 13 is a timing belt driven by the motor M1 to rotate along timing pulleys 14, 15, and 16. The timing pulleys 15 and 16 are located on both sides of the upper frame 11, and feed screws 17 and 18 driven by the timing pulleys 15 and 16 are vertically provided along both side walls of the frame 11. This feed screw
Feed nuts 19 and 20 are screwed to the feed nuts 17 and 18, and the feed nuts 19 and 20 are integrally provided with brackets 21 and 22, respectively.

Two shafts 23 and 24 are provided horizontally on the upper surface of the magazine 1, and both ends thereof are supported by the brackets 21 and 22. Therefore, when the motor M1 rotates forward and backward, the feed screws 17 and 18 rotate, and the feed nuts 19 and 20 rotate the feed screws 17 and 1.
By going up and down along 8, the magazine 1 goes up and down. That is, the motor M1, the feed screws 17, 18 and the nuts 19, 20, etc., constitute an elevating device for the magazine 1.

Reference numerals 30 and 31 denote arm portions extending forward of the frame 11, and the base member 2 on which the tray 3 is mounted is connected to a plate-like support member 7 provided between the arm portions 30 and 31 by a drawer device described later. Pulled up.

Reference numeral 32 denotes a cover plate extended over the arm units 30 and 31, and reference numeral 33 denotes a sub-transfer head. As shown in FIG. 3, the base end of the sub-transfer head 33 is attached to a slider 34, and the slider 34 is a rail mounted inside the cover plate 32.
35, it is slidably mounted in the X direction.

FIG. 4 shows a drive system of the sub-transfer head 33 provided below the support member 7, and 37, 38 are rails 3
5 are sliders attached to both ends.
7 and 38 are slidably mounted in the Y direction along guide rods 39 and 40 provided inside the arms 30 and 31. MX is the X direction drive motor, 42 is the X axis winding drum, MY is Y
A directional drive motor 43 is a Y-axis winding drum,
42 and 43 have an X-direction wire 44 and a Y-direction wire 45, respectively.
Is wound. The X-direction wire 44 is connected to the slider 34
Is adjusted by bearings 46 provided on the sliders 37, 38, etc., and the forward / reverse rotation of the motor MX causes the slider 34 on which the sub-transfer head 33 is mounted to move along the rail 35 along the rail 35. Slide in the direction. The Y-direction wire 45 is connected to the frame 4
When the motor MY rotates forward and reverse, the sliders 37 and 38
The sub-transfer head 33 connected to the sliders 37, 38 moves in the Y direction along the lines 9, 40, and also moves in the same direction. That is, the motors MX and MY, the slider 34, the rail 35, the sliders 37 and 38, the rods 39 and 40, the winding drums 42 and 43, the wires 44 and 45, and the bearing 4
6, 49 and the like constitute a device for moving the sub-transfer head 33 in the XY direction.

2 and 3, reference numeral 50 denotes a front wall 2a of the base material 2.
It is a disengagement child who disengages. The engaging element 50 is rotatably supported by a pin 51, and an extending element 53 extending downward therefrom is attached to a rod 54a of a cylinder 54. The engaging element 50 is urged by a spring member 55 in a direction (clockwise in FIG. 3) to separate from the front wall 2a. When the cylinder 54 operates and the rod 54a projects, the engaging / disengaging element 50 rotates counterclockwise against the spring force of the spring member 55, and engages with the front wall 2a. When the cylinder 54 stops operating, the engagement element 50 rotates upward by the spring force of the spring member 55, and separates from the front wall 2a. That is, the cylinder 54, the spring member 55, and the like constitute an engaging and disengaging device of the engaging and disengaging element 50.

In FIG. 3, reference numeral 56 denotes a belt located below the support member 7 and tuned to the pulley 57, M2 denotes a driving motor, and 58 denotes a movable element attached to the belt 56. Above cylinder 54
Is attached to the mover 58, and the motor M2 drives the engaging / disengaging element 50 to move the base member 2 on which the tray 3 is mounted.
To move in the Y direction. That is, the belt 56,
The pulley 57, the moving element 58, the motor M2, and the like constitute a loading / unloading device that pulls out the tray 3 stored in the magazine 1 toward the table moving device 62 and stores the tray 3 in the magazine 1.

The present apparatus is configured as described above, and the overall operation will be described next.

First, the motor 74 is driven to move the table 70 to the right side of the table moving device 62, and the rightmost mounting device 80 is positioned immediately below the cylinder 88. Next, XY the sub transfer head 50
The electronic components P on the tray 3 are picked up by moving in the direction, the rods 88a of the cylinders 88 are protruded and retracted, and the belts 81 are pitch-fed, and the electronic components P are placed one by one on each mounting portion 89. I do. There are four loading devices 80. Therefore, by taking each tray 3 out of the magazine 1 and sequentially moving each loading device 80 directly below the cylinder 88, the desired electronic components can be placed on the loading portion of each belt 81. Place on 89. After the electronic components P are placed on each belt 81 in this manner, the table 70 is moved to the center of the table moving device 62, and the desired tape unit 71 or the like is moved while the table 70 is reciprocated in the lateral direction N2. The mounting device 80 is stopped by the take-up device a, the electronic component P is taken up by the transfer head 62, and is transferred and mounted on the substrate 66.

When the mounting on the board 66 is completed, the rotary head
The rotation of 63 is stopped, the substrate 66 is transported by the conveyor 67, and the next substrate 66 is carried into the positioning unit 65. In this manner, the table 70 is moved to the front of the transfer device 30 while the substrate 66 is being replaced. Then, as described above, the electronic parts P are replenished to the mounting portions 89 of the respective belts 81, and when the replenishment is completed, the table 70 is again moved to the table moving device 62.
And the mounting operation of the electronic component P on the board 66 is resumed.

When the type of the electronic component P mounted on the board 66 changes,
When the electronic components P on the tray 3 are out of stock, the tray 3 is replaced as follows. In other words, first
Pulls the base material 2 to move to the magazine 1 side, and stores the tray 3 which has been used so far in the magazine 1 together with the base material 2 to which the tray 3 has been mounted, and
Rotates upward and separates from the front wall 2a.

Next, when the motor M1 is driven, the magazine 1 is moved up and down, and the tray 3 containing the desired electronic components P is disengaged.
Relative to 50. Then, the cylinder 54 is actuated, and the engaging and disengaging element 50 is engaged with the front wall 2a of the base member 2, and then the motor M2 is driven, whereby the base member 2 is towed by the engaging and disengaging element 50 and on the support member 7. The electronic component P on the tray 3 is transferred to the loading device 80 by the sub-transfer head 33 in the same manner.

(Embodiment 2) In FIG. 5, reference numeral 90 denotes a transfer device, which is an XY table 91.
A cylinder 92 is mounted on a and 91b, and a motor M is mounted on the rod 92a. MX and MY are table driving motors. 94 is a rotating arm mounted on the rotating shaft of the motor M, 95 is a sub-transfer head mounted on the tip thereof,
3 is a tray.

In this device, the electronic component P on the tray 3 is taken up by the arm 94, and the electronic component P is transferred to the mounting device 80 by rotating the arm 94. In this case, the desired electronic components P on the tray 3 are taken up by driving the XY tables 91a and 91b to move the sub-transfer head 95 in the XY direction.

(Embodiment 3) In FIG. 6, reference numeral 96 denotes a tube feeder equipped with an electronic component P such as an SOP having leads in two directions. The electronic component P sent from the tube feeder 96 falls onto the receiving table 97, and the receiving table 97 moves below the transfer head 95 by means (not shown) (see a chain line). Then, the electronic component P is taken up by the sub-transfer head 95 and is transferred to a pedestal-type mounting device 98 provided on the table 70.

(Effects of the Invention) As described above, the present invention provides a rotary head type electronic component mounting apparatus, in which a table provided in a table moving device is provided with a mounting device for electronic components in addition to a tape unit. A transfer device having a sub-transfer head for taking up electronic components of the electronic component supply body and transferring the electronic components to the above-described mounting device is provided on a side portion of the table moving device. In addition to the electronic components provided, electronic components such as QFPs and SOPs provided in other electronic component suppliers such as trays and tube feeders can be simultaneously transferred and mounted on the substrate.

[Brief description of the drawings]

FIG. 1 shows an embodiment of the present invention. FIG. 1 is a plan view of an electronic component mounting apparatus, FIG. 2 is a perspective view of a table moving apparatus, FIG. 3 is a partial side view, and FIG. FIGS. 5 and 6 are partial perspective views of another embodiment of the drive mechanism of the sub-transfer head. 3,96 Electronic component supplier 30,90 Transfer device 61 Mounting device body 62 Table moving device 63 Rotary head 64 Transfer head 65 Positioning unit 66 Substrate 70 ... Table 71 ... Tape unit 80,98 ... Placement device 81 ... Endless belt 83 ... Pitch feed means 89 ... Place

Claims (3)

(57) [Claims] 1. A mounting apparatus main body having a rotary head, and a table moving device provided behind the mounting device main body, and a table provided in the table moving device is reciprocated to move the table. In an electronic component mounting apparatus in which electronic components of a tape unit arranged in parallel are taken up by a transfer head mounted on the rotary head and transferred and mounted on a substrate positioned at a positioning unit, the electronic component is mounted on the table. A component placement device is provided, and an electronic component of an electronic component supply body is taken up on a side portion of the table moving device, and the electronic component provided with a sub-transfer head for transferring the component to the placement device. An electronic component mounting device, comprising a mounting device. 2. The mounting device according to claim 1, further comprising: an endless belt provided with electronic component mounting portions arranged in a row, and pitch feed means for feeding the endless belt from a rear portion to a front portion of the table moving device. The electronic component of the electronic component supply body is transferred to the mounting portion by the sub-transfer head while feeding the endless belt at a pitch. An electronic component mounting apparatus according to claim 1. 3. A table provided in a table moving device is reciprocated, and electronic components of a tape unit arranged in parallel with the table are taken up by a transfer head mounted on a rotary head, and positioned in a positioning section. In the electronic component mounting method, the table is moved to the side of the table moving device when the substrate is replaced, and the sub-transfer of the transfer device provided on the side is performed. An electronic component mounting method, wherein an electronic component of an electronic component supply body is taken up by a mounting head and transferred to an electronic component mounting device provided on the table.