JP2634350C - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION       [0001]     [Industrial applications]   The present invention relates to a thin substrate such as a semiconductor substrate or a glass substrate for a liquid crystal or a photomask. (Hereinafter, simply referred to as “wafer”) in various chemical solutions for surface treatmentToWho do
The law and its apparatus.       [0002]     [Prior art]   Instead of holding the wafer in the carrier, it is held directly by holding means such as a chuck.
Carrier-less type wafer processing system that immerses wafers in a predetermined processing tank and performs surface treatment
, The carrier (wafer container) is not required, so each processing tank is
Can be typed. As a result, the amount of chemical solution and cleaning solution consumed is small, and
There is an advantage that the time can be reduced.       [0003]   Particularly recently, the diameter of the wafer has tended to increase from 6 inches to 8 inches,
As described above, the carrierless type wafer processing apparatus has a low maintenance cost and
Since the processing capacity is superior to that of the conventional carrier method, the wafer processing
Is becoming the mainstream of nature.       [0004]   In such a carrierless type wafer processing apparatus, first, a wafer is processed.
The wafer is held directly by a wafer holding device and transported above a predetermined processing tank. Next, the wafer
Lower the holding device and align the wafer on the wafer holding holder installed in the processing tank.
Or raise the wafer holder and lift it from the wafer holding device.
After receiving the wafer, it is lowered and immersed in the processing tank.
I have. The processing tank is filled with chemicals and cleaning liquids necessary for wafer processing.
After performing the necessary surface treatment here, the wafer is pulled up again and the next processing tank
Alternatively, the wafers are transported to a dryer and the wafers are sequentially processed.       [0005]   At this time, in order to reduce the manufacturing cost, it is necessary to increase the processing capacity of the wafer processing.
Needless to say, the wafer is sized according to the SEMI standard.
N sheets (usually 25 sheets) in a carrier (wafer container) at a predetermined pitch P according to the
) Are stored. Therefore, conventionally, when processing a wafer, two
Take out the wafer from the carrier, hold 2n wafers together by chuck,
place It was to be transported to the treatment tank.       [0006]     [Problems to be solved by the invention]   However, the pitch P between wafers is determined by the SEMI standard as described above.
In order to process 50 wafers at once,The cThe width of the eha group in the row direction is
The depth of the treatment tank, which stores them all at once.
Must be large, the amount of chemicals consumed, etc.
It will take time to change.       [0007]   While maintaining the number of wafers processed at one time at 2n, a processing tank for surface treatment is used.
To reduce the internal volume, the pitch between the wafers specified in the SEMI standard
Can be converted to a smaller size, but carrierless wafer processing
There has been no apparatus that performs such a processing method.       [0008]   The present invention solves the above-described problems and maintains the number of processed wafers at one time.
Minimize the internal volume of the processing tank, which reduces maintenance costs and processing
An object of the present invention is to provide a wafer processing method and apparatus capable of reducing processing time.
And       [0009]     [Means for Solving the Problems]   In order to achieve the above object, a wafer processing method according to the present invention comprises:   (A) n wafersPitch PFrom the two carriers, each of which has been stored
Extract the wafer,Pitch PWith the first wafer groupPitch PSecond wafer group
Forming a (B) Each wafer of the second wafer group is mutually inserted into each gap between the wafers of the first wafer group.
Insert without contact,The width in the arrangement direction is substantially the same as that of the first wafer group,2
forming a third wafer group consisting of n wafers; (C) a step of immersing the third wafer group in a processing solution in a processing tank and performing surface treatment
And characterized by the following.       [0010]   Further, in order to carry out this wafer processing method, a wafer processing apparatus according to the present invention is provided.
Removes the wafer from the carrier and transports it by transport
Wafer processing equipment for performing surface treatment on the wafer by immersing it in a processing tank
In place (A) n wafersPitch PInsert the wafer from the carrier
Means for inserting and removing a wafer to be moved in and out, (B) inserting and removing a wafer from two carriers by the wafer insertion and ejection means;Pi
Pitch PWith the first wafer groupPitch PForming a second wafer group, the first wafer group
Each wafer of the second wafer group is inserted into each gap between wafers without contacting each other
By doingThe width in the arrangement direction is substantially the same as that of the first wafer group,2n pieces of c
A wafer pitch converting means for forming a third wafer group made of eha; (C) The third wafer group formed by the wafer pitch conversion means is collectively collected.
And a conveying means for conveying to the processing tank.       [0011]     [Action]   According to the wafer processing method of the present invention, the wafer stored in the two carriers
From the carrierPitch PWith the first wafer groupPitch PThe second c
By forming eha group and inserting wafers in the gap between each other,With the first wafer group
Almost the same width in the alignment directionA third wafer group is formed. The third group of wafers
Although the width in the arrangement direction is substantially the same as that of the first wafer group, the number of wafers is the first wafer group.
Double the group. The third wafer group is immersed in the processing solution in the processing tank all at once,
Perform processing.       [0012]   In addition, according to the wafer processing apparatus of the present invention, the wafer insertion / removal means allows the wafer to be inserted into the wafer processing apparatus.
Insert a wafer from one carrierPitch PWith the first wafer groupPitch PNo.
The second wafer group is formed, and the wafer of the first wafer group is
Inserting the respective wafers of the second wafer group into the respective gaps without contacting each other
ByThe width in the arrangement direction is substantially the same as that of the first wafer group.Form third wafer group Then, the transfer means for transferring the third wafer group to the processing tank in a lump by the transfer means.
Thus, the above-described wafer processing method can be performed.       [0013]     【Example】   Hereinafter, embodiments of a wafer processing apparatus according to the present invention will be described in detail with reference to the drawings.
However, it should be understood that the technical scope of the present invention is not limited thereby.
It is. (1) First Embodiment of Wafer Processing Apparatus and Its Operation   FIG. 1 shows a first embodiment of a wafer processing apparatus according to the present invention.
1 shows an outline of a wafer processing apparatus 1 that performs a type of processing in one tank.       [0014]   The wafer processing apparatus 1 includes a loading unit on which a carrier 3 containing a wafer 2 is placed.
4. Wafer insertion / removal unit 5 for inserting / removing wafer 2 from / to carrier 3;
Wafer pitch converter 6, which converts the pitch of the alignment, is immersed in a chemical solution to perform various surface treatments.
Wafer processing unit 7 for cleaning and processing, and rotating wafer 2 after cleaning at a high speed to dry
Drying section 8.       [0015]   The wafer 2 is stored in a carrier 3 for carrying the wafer and a robot (not shown).
And is placed on the load section 4 of the wafer processing apparatus 1. This carry
A 3 is shaped, for example, as shown in FIG.
The groove 3a is formed in parallel at a constant pitch P, and the outer edge of the wafer 2 is
It is inserted into the guide groove 3a, and is housed vertically aligned at regular intervals.
Swelling. The upper surface of the carrier 3 is provided with a laterally extending flange 3b.
The carrier 3 is easily transported by engaging an arm or the like of the transport means with this portion.
It has become lickable. An opening 3c is formed on the bottom surface, and will be described later.
The wafer loading / unloading devices 53 and 54 of FIG.
It is designed to be inserted upward.       [0016]   The carrier 3 placed on the load unit 4 is loaded with a carrier transport device 120 (described later). 4) and sequentially transferred onto transfer positions 51 and 52 of the wafer insertion / ejection section 5
And placed.       [0017]   Below the transfer positions 51 and 52, insertion / extraction devices 53 and 54 are arranged.
Has been established.       [0018]   Each of the insertion / extraction devices 53 and 54 has n guide grooves in parallel at a pitch P on the upper surface.
The engraved holding plates 531 and 541 and the arms 532 and 542 that support them are provided.
And an actuator 533 for driving the arms 532 and 542 up and down.
543. The holding plates 531 and 541 are connected to the actuator 53.
3 and 543, the carrier 3 is pushed upward through the opening 3c of the carrier 3.
The lower outer edge of the wafer 2 is used as a guide groove of the holding plates 531 and 541.
The wafer 2 is pushed upward while being inserted, and
2 is extracted to form a first wafer group 21.       [0019]   Above the transfer position 51, the first wafer group 21 is held and the next wafer group 21 is held.
The first transfer device 55 for transferring to the pitch conversion unit 6 is on standby.       [0020]   The first transfer device 55 includes a holding member 551 that holds the wafer 2 and a supporting member 551 that supports the holding member 551.
Arm 552 and a head 553 for holding the arm 552 openably and closably.
Has become.       [0021]   Since the outer edge of the wafer 2 passes through the inner surface of the holding member 551 as shown in FIG.
The large-perforated passage groove 551a contacts the outer edge of the wafer 2 to hold it.
N guide grooves 551b are alternately engraved at pitch P / 2
Have been.       [0022]   The wafer pitch conversion unit 6 has 2n guide grooves on the upper surface in parallel at a pitch P / 2.
At least the engraved pitch conversion holding plate 61 and the guide groove are aligned in the direction in which the guide grooves are arranged. Is provided with a slide device 62 that can slide only by a pitch P / 2.
You.       [0023]   The operation of the wafer pitch conversion is performed as follows.       [0024]   First, the loading / unloading device 53 is operated, and the carrier placed at the transfer position 51 is moved.
3 is pushed upward to form a first wafer group, and the first wafer group is formed.
The group C is held by the holding member 551 of the first transfer device 55. In this case, the holding member 55
The wafer 2 is held by one guide groove 551b.       [0025]   After that, the first transfer device 55 is moved horizontally to a position above the wafer pitch conversion unit 6.
And the first wafer group 21 is formed on the upper surface of the pitch conversion holding plate 61.
And inserted into the guide groove and held at a pitch P.       [0026]   Next, the carrier placed at the transfer position 52 is operated by operating the insertion / removal device 54.
3 is pushed upward to form a second wafer group 22 and the second wafer group 22 is formed.
The wafer group 22 is held by the holding member 551 of the first transfer device 55 in the same manner as described above,
It moves horizontally and stops above the wafer pitch converter 6.       [0027]   The holding plate 61 for pitch conversion was slid by P / 2 by the slide device 62.
Thereafter, the first transfer device 55 is lowered, and the second wafer is moved between the wafers of the first wafer group 21.
Each wafer of the EHA group 22 is inserted and aligned and held in the guide groove of the pitch conversion holding plate 61.
Let it. At this time, the holding member 551 of the first transfer device 55 is passed through as described above.
An excess groove 551a and a guide groove 551b are formed, and the wafer of the second wafer group 22 is formed.
The outer edge of c is held in the guide groove 551b and has already been formed on the pitch conversion holding plate 61.
The outer edge of the wafer 21 of the first wafer group 21 mounted thereon is inserted into the passage groove 55 at the time of insertion.
1a, the holding member 551 contacts the wafers of the first wafer group 21.
The wafer 2 of the second wafer group 22 is inserted smoothly without any
Is held on the holding plate 61 for use.       [0028]   The third wafer group 23 thus formed has a pitch of 2n wafers.
It is converted to P / 2, and it is set in the same arrangement width as the conventional case of n sheets.
Become.       [0029]   According to such a pitch conversion method, the first wafer group 21 and the holding member 551
Since there is no mechanical sliding between the two, the wafer 2 is not damaged and the wafer processing is badly affected.
There is no dust that affects the sound, and the pitch can be halved all at once.
The wafer pitch can be converted efficiently.       [0030]   As a result, the depth of the processing bath 71 in the next wafer processing unit 7 is reduced to almost half the conventional depth.
Can be minutes.       [0031]   The wafer processing unit 7 supplies a processing tank 71 and various chemicals and cleaning liquids to the processing tank 71.
And a second liquid supply device 72 for transporting the third wafer group 23 above the processing tank 71.
Transportapparatus73. In the processing tank 71, 2n wafers 2 are picked up on the upper surface.
And three guide rods 711 each having a guide groove for vertical holding by the switch P / 2.
A guide plate 712 for horizontally holding the guide bar is provided.
2 is driven vertically by a vertical driving device (not shown) to
It is possible to move between the second transporting device 73 and the processing layer 71 while holding 23.       [0032]   The chemical liquid supply device 72 includes an electromagnetic switching valve 721 and a first chemical liquid supply device connected thereto.
722, a second chemical liquid supply device 723, and a cleaning liquid supply device 724.       [0033]   These first chemical liquid supply device 722, second chemical liquid supply device 723, and cleaning liquid supply device
724 has a supply pump and a liquid storage tank (not shown) inside,
1 and the supply pump is operated to enter the processing tank 71 from the inflow port 725.
It supplies the necessary liquid.       [0034]   In the second transporting device 73, 2n guide grooves are engraved on the inner surface at a pitch P / 2.
The holding member 731, a pair of arms 732 for holding the holding member 731, and the arms 732 are opened.
Drive means 733 for closing drive.       [0035]   The second transfer device 73 is moved to the wafer pitch conversion unit 6 and holds the pitch conversion holding plate 6.
1 is held by the holding member 731 and the third wafer group
Move up and stop. Then, the guide plate 712 is moved to a vertical driving device (not shown).
Is moved upward. Guide groove of guide rod 711ToOf the third wafer group 23
When the lower outer edge of each wafer 2 is inserted, the arm 732 is opened, and the third wafer group is opened.
23 is transferred to the guide rod 711.       [0036]   Thereafter, the guide plate 712 is moved downward to move the third wafer group 23 into the processing tank 71.
The chemicals in the processing tank 71 are successively replaced by the chemical supply device 72.
While performing a predetermined wafer process.       [0037]   At this time, the pitch between the wafers 2 of the third wafer group 23 is １ ／ of the conventional pitch.
Therefore, the chemical solution flowing in the gap forms a laminar flow, and the surface of the wafer 2 is made more uniform.
Can be processed.       [0038]   Further, in the present embodiment, the holding portion of the second transfer device 73 is lowered to directly move the third transfer device 73.
Without placing the eha group 23 on the guide rod 711 in the processing tank 71,712On
By moving the guide rod 711 above the processing tank 71 and the second transfer device 73
The third advantage is as follows because the third wafer group 23 is received.       [0039]   (A) The wafer holding portion of the second transfer device 73, that is, the arm 732 and the holding member 7
Since it is not necessary to insert the base 31 into the processing tank 71, the holding portion is not contaminated with the chemical.
There is no risk of staining (the holding member 731 contacts only the wafer 2 before processing and after cleaning).
It is not polluted. ). Therefore, the wafer is transported by the second transport device 73.
There is no danger of contamination, and no special equipment is required to clean the wafer holding part. It is.       [0040]   (B) Insert the wafer holding portion of the second transfer device 73 into the processing tank 71.
When aligning the wafer directly on the guide rod 711 by using732Processing tank 7
1, the processing tank 7 has an extra space for the opening and closing operation.
The width of 1 must be increased, and the internal volume increases. However, in this embodiment,
Adopts the method of transferring the guide plate 712 upward and downward as described above.
Therefore, the width of the processing tank 71 need only be slightly larger than the diameter of the wafer 2.
No extra space is required, and the internal volume can be reduced.       [0041]   At the end of the chemical solution processing, the wafer processing unit 7 switches to the cleaning liquid supply device 724 to perform cleaning.
After the cleaning solution is supplied into the processing tank 71 to wash out the chemical solution attached to the surface of the wafer 2,
The guide plate 712 is raised again to take out the third wafer group 23 from the processing bath 71.
Then, it is held by the holding member 731 of the second transporting device 73 that is waiting above, and the next drying is performed.
Transfer to part 8.       [0042]   The drying in the drying unit 8 is performed by transferring the third wafer group 23 to the rotating plate 81 with the guide rod 82.
The rotating plate 81 is rotated at a high speed by a rotation driving device (not shown).
This is achieved by dissipating moisture on the surface of the wafer 2 by centrifugal force.       [0043]   The third wafer group 23 that has completed all the processes in this manner is again transferred to the second transfer device.
Each of the guides 73 is transferred to the wafer pitch conversion unit 6 by the
It is set up in the groove. Therefore, the first transfer device 55 controls the inside of the third wafer group 23.
, One of the wafer groups, for example, the first wafer group 21 is extracted by the first transfer device 55
Then, the holding plate 53 of the insertion / extraction device 53 which is pushed out above the carrier 3 and is on standby
1 and the holding plate 531 is lowered so that the carrier 3
The EHA group 21 is stored, and the carrier 3 is transported by the carrier transport device 120 (see FIG. 4).
Move to loading section (unloading section) 4.       [0044]   During this time, the first conveying means 55 faces the pitch changing holding plate 61 and
Replacement holding plate61Is slid by P / 2 to hold the second wafer group 22 and
The second wafer group 22 is stored in the carrier 3 in the same manner as described above, and the
The wafer is transferred to the memory unit 4 to complete a series of wafer processing operations.       [0045]   In the above-described embodiment, only one processing tank 71 is provided.
And a plurality of these are provided to perform one-bath processing in each processing tank 71.
By doing so, each transport means can be shared, and the processing capacity is doubled. (2) Specific example of the wafer pitch converter in the first embodiment   From the load section 4 of the wafer processing apparatus according to the above embodiment to the wafer pitch conversion section 6
A description will be given of a specific configuration.       [0046]   FIG. 4 is a perspective view of the periphery of the wafer pitch conversion unit of the wafer processing apparatus 100 viewed from obliquely above.
FIG. The loading portion 110 has a positioning protrusion when the carrier 3 is placed.
The loading unit 110 includes a transfer robot (not shown).
Alternatively, a person engages the lower corner of the carrier 3 with the positioning projection 111.
And place it.       [0047]   The carrier transport device 120 rotates around the y-direction, the z-direction, and the support 123.
Arm 121 is attached to the head 122 so that it can open and close freely.
Have been.       [0048]   In order to transfer the carrier 3 placed on the loading unit 110 to the wafer loading / unloading unit 130
First, rotate the head 122 of the carrier transport device 120 by 180 degrees from the position shown in the figure.
At the same time, it is moved in the y-direction and moved in front of the carrier 3 to be conveyed. A
The arm 121 is extended, the head 122 is lowered, and the position of the arm 121 is
3, the distance between the arms 121 is reduced, and the head 12
2 moves upward, the upper surface of the arm 121 contacts the lower surface of the flange 3b, and
A3 also rises. Then, the head 122 is rotated by 180 degrees and the carrier 3 is moved to the first position. It is placed on a first rotating plate 131 provided at the eha insertion / removal position. This rotating plate 13
1 rotates 90 degrees and changes the direction of the carrier to the direction of FIG.       [0049]   Similarly, another carrier 3 is placed on the second rotating plate 132 and rotated by 90 degrees.
You.       [0050]   At the center of the first rotating plate 131 and the second rotating plate 132, n guides are provided on the upper surface.
The holding members 133 and 134 in which the grooves 133a and 134a are engraved at the pitch P are located.
And an insertion / removal device (see 53 and 54 in FIG. 1) installed below the stage.
The wafer 2 is loaded by pushing up the lever holding members 133 and 134 upward.
It can be pulled out from the rear 3.       [0051]   The wafer pitch conversion unit 140 is provided with a pitch conversion holding plate 141 in the y direction.
It is provided so that it can be id. The holding plate 141 for pitch conversion also has a
It is set to be able to move up and down.       [0052]   On the upper surface of the pitch conversion holding plate 141, 2n guide grooves 141a have a pitch P /
It is engraved with 2.       [0053]   The first transfer device 150 includes a holding member 151 and a pair of arms 152 that support the holding member 151.
And a head 153 that rotatably supports the arm 152, and the head 153 has x
It is supported by a column 154 that can move in the direction. N pieces on the inner surface of the holding member 151
Are formed at a pitch P.       [0054]   Similarly, the second transfer device 160 includes a holding member 161 and a pair of arms supporting the holding member 161.
A head 163 that rotatably supports the arm 162.
63 is supported by a column 164 movable in the x direction.       [0055]   However, the arm 162 is rotatable, and the holding member 161 is turned by 180 degrees. And the guide grooves on both main surfaces thereof can be used. Holding member 161
As shown in FIG. 5, the groove formed on both main surfaces of the
Groove 161a for holding the wafer and guide groove 161b for firmly holding the wafer
Are alternately engraved at n pitches of P / 2, and guide grooves 16 are formed on the outer surface.
1c are engraved at 2n pitches P / 2.       [0056]   In the above-described configuration, when performing the pitch conversion by the wafer pitch conversion unit 140,
The following operation is performed.       [0057]   First, the first transport device 150 is moved in the −x direction and stopped in front of the rotating plate 131,
The arm 152 is rotated in a direction to expand the lower end of the holding member 151 so that the guide groove is vertically
And wait. The wafer 2 is pushed up by an insertion / removal device (not shown)
Insert from 3 The arm 152 is rotated in a direction to close the lower end of the holding member 151.
Then, the wafer (first wafer group) is held and moved in the + x direction. During this time the pitch change
The replacement holding plate 141 is moved in the −y direction to move the replacement holding plate 141 under the arm 152 of the first transfer device 150.
, And the pitch conversion holding plate 141 is raised to move the first transfer device
The first group of wafers is received from the mounting unit 150, and moves down again in the + y direction.       [0058]   Next, the second transporting device 160 is moved in the −x direction, and stopped in front of the rotating plate 132.
, And waits for the guide groove of the holding member 161 to be vertical. Insert not shown
The wafer 2 is pushed up from the carrier 3 placed on the rotating plate 132 by the access device, and
The lower end of the holding member 161 is closed by rotating the
2 (second wafer group), and moves in the + x direction. Pitch conversion holding plate 14
1 moves in the + y direction, and when the head 163 is lowered, the second wafer group is
Stops at the position where it is inserted into the gap between the wafers of the first wafer group already placed
doing. Therefore, the pitch conversion holding plate 141 is raised to move the second wafer group to the second wafer group.
Arm between the wafers of one wafer group162The lower end of the holding member 161 is opened.
Guides the holding plate 141 for pitch conversionGroove 12n pieces of c on 41a
The wafers are arranged at a pitch of P / 2, and a third wafer group is formed.       [0059]   As described above, the inner surface of the holding member 161 is formed with the guide groove 161b and the passage groove 161a.
Are alternately arranged at every pitch P / 2, so that the wafers 2 in the first wafer group
Since it passes through the center of the passage groove 161a without contacting the groove,
There is no danger of the first wafer group being damaged, and no dust is generated due to mechanical sliding.
No.       [0060]   Thereafter, the holding plate 141 for pitch conversion is slightly lowered, and the arm 162 is moved 180 degrees.
Then, the outer surface of the holding member 161 is changed to the inner side by rotating the holding member 161 by degrees.       [0061]   After raising the pitch conversion holding plate 141 again, the holding member 161
The third wafer group placed on the pitch conversion holding plate 141 is held at once, and the next wafer group is held.
The wafer is transferred to the wafer processing unit and the process shown in FIG. 1 is performed.       [0062]   By the operation almost reverse to the above, the processed third wafer group is combined with the first wafer group.
The wafers are separated into two wafer groups, stored in the carrier 3, and loaded into the load (unload) section 110.
Move to end a series of operations.       [0063]   Note that in this specific example, the pitch transfer holding plate 141 is moved up and down to
The wafer 2 was transferred between the transfer device 150 and the second transfer device 160,
The first transfer device 150, the second transfer device 16
0 so that each of the heads 153 and 163 can be moved up and down.
Good. However, in this case, two devices for vertical driving are required, so that the cost is reduced.
In the aspect, the former is better. (3) Second Embodiment of Wafer Processing Apparatus and Its Operation   The groove of the holding member 551 of the first transporting means 55 in FIG.
With this configuration, the pitch conversion process can be further simplified.       [0064]   On the inner surface of the holding member 561, a normal guide groove 562 and a variable guide groove 563 are provided. They are arranged alternately at n pitches at a pitch of P / 2.       [0065]   The variable guide groove 563 has a greater groove width and depth than the guide groove 562.
The piezoelectric element 564 is stacked on the bottom surface 563a in a multilayer manner,
A groove plate 566 having a groove 565 is attached, and a predetermined voltage is applied to the piezoelectric element 564.
When pressure is applied, the groove plate 566 is pushed upward.       [0066]   FIG. 7 shows a wafer when the holding member 561 having such a variable guide groove is used.
1 shows the configuration of the processing device 100, and the components denoted by the same reference numerals as those in FIG.
Since the same contents are shown, the description is omitted.       [0067]   Insert the carrier 3 after placing it at the transfer position 51 and the transfer position 52Loading
The first wafer group 21 is pushed up by the device 53 and held by the holding member 561 of the transfer device 56.
I do.       [0068]   After that, the transfer device 56 is moved to the position 52, and is moved upward by the insertion / removal device 54.
The second wafer group 22 is pushed up. Each wafer of the second wafer group 22 is held
Since it passes through the variable guide groove 563 of the member 561, it has been described in the first embodiment.
Thus, the first wafer group 21 does not contact the holding member 561,
The wafers of the second wafer group 22 are smoothly inserted between the respective wafers 21.       [0069]   On the other hand, on the upper surface of the holding plate 544 attached to the upper portion of the insertion / removal device 54,
2n guide grooves are engraved at a pitch of P / 2.
The lower outer edge of the wafer group 21 is inserted, and the positions of the first wafer group and the second wafer group 22 are changed.
When the positions overlap, the ascent / descent device 54 is stopped from rising.       [0070]   Thereafter, a predetermined voltage is applied to the piezoelectric element 564 in the variable guide groove 563 of the holding member 561.
A pressure is applied to move the groove plate 566 to hold the outer edge of the second wafer group 22 firmly.
Carry. The holding plate 544 is lowered by the insertion / removal device 54, and the third wafer group 23 is It is formed.       [0071]   The third wafer group is transferred by the transfer device 56 above the processing tank 71 of the wafer processing section 7.
Then, the same operation as the wafer processing apparatus 1 shown in FIG. 1 is performed.       [0072]   In such a wafer processing apparatus 100, at the transfer position 52, the wafer shown in FIG.
(C) The wafer pitch conversion unit 6 in the processing apparatus 1 can also be used.
The pace can be saved, and the second transport device 73 can be eliminated, so that the
The configuration and control system can be simplified.       [0073]   Note that instead of the piezoelectric element 564 in the variable guide groove 563, for example,
A memory alloy is attached, and a heater coil and a cooling element are provided inside the holding member 561.ChildBuried
By changing the voltage applied thereto, the temperature of the variable guide groove 563 is changed.
Degree, thereby deforming the shape memory alloy and displacing the position of the groove plate 566.
It is also possible to make it position. (4) Another embodiment of the wafer pitch converter   According to the present invention, the second wafer is provided between the wafers of the first wafer group without a mechanical sliding portion.
There is a great feature in that pitch conversion is performed by inserting wafers in the eha group.
The groove is formed by using a holding member in which a passage groove and a guide groove are alternately engraved at a pitch of P / 2.
In addition to performing the pitch conversion, for example, two comb-shaped holding plates for pitch conversion are prepared.
It is also possible to insert each of the comb-shaped teeth so as to cross each other.       [0074]   FIG. 8 shows such a comb.ConditionOf the embodiment of the holding plate for pitch conversion of FIG.
The figure is shown. The first pitch conversion holding plate 63 is a bar-shaped holding plate arranged at a pitch P.
Each holding portion 631 has an outer edge of the wafer 2 inserted therein.
Guide groove 632 is formed.       [0075]   On the other hand, the second pitch conversion holding plate 64 is also similar to the first pitch conversion holding plate 63.
Has a rod-shaped holding portion 641 and a guide groove 642. First pitch conversion hold Between the holding portions 631 and 641 of the plate 63 and the second pitch holding plate 64
The widths of the gaps 633 and 643 in FIG.
They have as much spacing as possible and are inserted into each other.       [0076]   However, in wafer processing equipment, there is no mechanical contact to avoid generation of dust.
It is necessary to avoid as much as possible, so that the holding portions 631 and 641 do not contact each other.
The width of the gaps 633 and 643 is set to a small extent.       [0077]   FIG. 9 shows a case where the pitch is converted by the pitch conversion holding plates 63 and 64 in FIG.
It is a figure showing an operation.       [0078]   Holds first wafer group 21 and second wafer group 22 transferred by transfer device
If both of the first pitch conversion holding plate 63 and the second pitch conversion holding plate 64
Or only one of them is slid so that the holding portions 631 and 641 cross each other.
. The positions of the first wafer group 21 and the second wafer group 22 are completely overlapped, and the third wafer group
A group 23 is formed. 2n guide grooves 741 are formed on the inner surface at a pitch of P / 2.
The third wafer group is held by the transfer unit 74 having the holding member 742, and the processing tank 71 (
(Fig. 1).       [0079]   In the present embodiment, a carrierless single-wafer processing apparatus will be described.
However, the present invention can be similarly applied to a normal carrierless type wafer processing apparatus.
Things.       [0080]   Further, the second wafer group 22 is formed between the wafers of the first wafer group 21 as described above.
It is not always necessary to make the pitch P / 2 just by inserting it at the center, and the first wafer
An appropriate gap is provided so that the wafers of the group 21 and the second wafer group 22 do not come into contact with each other.
Just insert it.       [0081]     【The invention's effect】   According to the wafer processing method of the present invention, two wafers are extracted.Pi
Pitch PWith the first wafer groupPitch PInsert the second wafer group into the gap between them
EnterThe width in the arrangement direction is substantially the same as that of the first wafer group.Form third wafer group
To change the pitch, the internal volume of the processing tank can be reduced to about half
. For this reason, the amount of the chemical solution to be consumed can be reduced to half, and the processing in the wafer processing apparatus can be performed.
The time required to replace the chemical in the bath can be significantly reduced, and
Wafer processing capability can be improved, and manufacturing costs can be reduced.       [0082]   According to the wafer processing apparatus of the present invention, the wafer pitch conversion means
Pitch PIn each gap between wafers of the first wafer groupPitch PEach of the second wafer group
Insert the wafers without touching each other,Almost the same arrangement as the first wafer group
Direction widthA third group of wafers is formed, and these are collectively processed by a transfer means.
The above-mentioned wafer processing method can be implemented by
is there. Also, by reducing the size of the processing tank, the space in the clean room can be reduced.
Wear.

[Brief description of the drawings]     FIG.   FIG. 1 is a diagram illustrating an outline of a wafer processing apparatus according to a first embodiment of the present invention.     FIG. 2   FIG. 3 is a diagram illustrating a shape of a carrier.     FIG. 3   FIG. 2 is a diagram illustrating a groove shape of a holding member of the first transport device in FIG. 1.     FIG. 4   FIG. 2 is a perspective view illustrating a specific mechanism of a pitch converter in the embodiment of FIG. 1.     FIG. 5   FIG. 5 is a diagram illustrating a groove shape of a holding member of the second transport device in FIG. 4.     FIG. 6   It is a figure showing another example of a holding member of a conveyance device.     FIG. 7   FIG. 7 is a diagram illustrating a configuration of a wafer processing apparatus using the transfer device of FIG. 6.     FIG. 8   It is a figure which shows another Example of the holding plate for pitch conversion.     FIG. 9   FIG. 9 is a diagram showing how the pitch is converted by the pitch conversion holding plate of FIG. 8.     [Explanation of symbols]     1,100 Wafer processing equipment     2 wafer     3 career     4 Load section     5 Wafer loading / unloading section     6 Wafer pitch converter     7 Wafer processing unit     8 Drying section   21 First wafer group   22 Second wafer group   23 Third wafer group   53, 54 insertion / removal device   55 1st transfer device   61 Pitch conversion holding plate   62 Slide device   71 Processing tank   71 Chemical supply device   73 Second transport device   81 Rotating body   82 Guide Rod

Claims (1)

[Claims 1] (a) the n wafers from the two carriers Seiritsu respectively housed at a pitch P extracting the wafer, a second first wafer group and the pitch P of the pitch P a step of forming a wafer group, (b) each wafer of the second wafer group was inserted in a state not in contact with each other in the gap between the first wafer group of the wafer, approximately the first wafer group A step of forming a third wafer group having the same width in the arrangement direction and comprising 2n wafers; and (c) immersing the third wafer group altogether in a processing solution in a processing tank to perform surface treatment. A wafer processing method comprising: 2. A wafer processing apparatus for removing a wafer from a carrier, transporting the wafer by a transport means, and immersing the wafer in a processing bath filled with a predetermined chemical solution to perform a surface treatment on the wafer. A wafer insertion / removal means for inserting / removing the wafer from / into a carrier which arranges and stores the wafers at a pitch P ; and
A first wafer group having a pitch P and a second wafer group having a pitch P are formed, and each wafer of the second wafer group is inserted into each gap between the wafers of the first wafer group without being in contact with each other. Thereby, a wafer pitch converting means for forming a third wafer group consisting of 2n wafers having substantially the same width in the arrangement direction as the first wafer group, and (c) a third pitch formed by the wafer pitch converting means. 3. A wafer processing apparatus, comprising: a transfer unit configured to transfer the wafer group of No. 3 to a processing tank at a time.