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JP2604216B2 - Component supply device setup change method and electronic component automatic mounting device - Google Patents

Component supply device setup change method and electronic component automatic mounting device

Info

Publication number
JP2604216B2
JP2604216B2 JP63286950A JP28695088A JP2604216B2 JP 2604216 B2 JP2604216 B2 JP 2604216B2 JP 63286950 A JP63286950 A JP 63286950A JP 28695088 A JP28695088 A JP 28695088A JP 2604216 B2 JP2604216 B2 JP 2604216B2
Authority
JP
Japan
Prior art keywords
linear guide
component supply
component
mounting
base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP63286950A
Other languages
Japanese (ja)
Other versions
JPH02132895A (en
Inventor
克尚 臼井
和義 大山
晴久 鈴木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Original Assignee
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electric Co Ltd filed Critical Sanyo Electric Co Ltd
Priority to JP63286950A priority Critical patent/JP2604216B2/en
Publication of JPH02132895A publication Critical patent/JPH02132895A/en
Application granted granted Critical
Publication of JP2604216B2 publication Critical patent/JP2604216B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Supply And Installment Of Electrical Components (AREA)

Description

【発明の詳細な説明】 (イ)産業上の利用分野 本発明は、部品供給装置により供給されるチップ状電
子部品をプリント基板上に装着する電子部品自動装着装
置に関する。
The present invention relates to an electronic component automatic mounting device for mounting a chip-shaped electronic component supplied by a component supply device on a printed circuit board.

(ロ)従来の技術 従来技術として、本出願人が先に出願した特願昭61−
247913号に添付した明細書等にテープカセットベース
(本出願による部品供給台)に設けられたカセット位置
決め孔(同じく取付穴)に各カセット(同じく部品供給
装置)の底面から突出したカセット位置決めピン(同じ
く支持ピン)を挿入して前記カセットベースに前記カセ
ットを取り付けるようにした技術が開示されている。
(B) Conventional technology As a conventional technology, Japanese Patent Application No.
In the specification and the like attached to 247913, a cassette positioning pin (also a component supply device) protruding from the bottom surface of each cassette (a component supply device) is inserted into a cassette positioning hole (also a mounting hole) provided in a tape cassette base (a component supply table according to the present application). A technique has been disclosed in which a support pin is inserted to attach the cassette to the cassette base.

然し乍ら、この方法に依るとカセットの段取り替え作
業が繁雑で、然も取り付け調整が困難であった。
However, according to this method, the work of changing the cassette is complicated, and the mounting adjustment is difficult.

(ハ)発明が解決しようとする課題 従って、前記段取り替え作業を簡易なものとすること
である。
(C) Problems to be Solved by the Invention Therefore, it is an object of the present invention to simplify the setup change operation.

(ニ)課題を解決するための手段 そこで、本発明はプリント基板上に装着されるチップ
状電子部品を順次供給する部品供給装置の左右移動を案
内するリニアガイドにリニアガイド軸受を介して所望数
の部品供給装置群が架設された部品供給台を有する電子
部品自動装着装置において、前記リニアガイドに対し直
線となるように別のリニアガイドが設けられた入れ替え
レール台を連設させ、前記リニアガイド軸受を介して部
品供給装置群が載置された前記部品供給台をリニアガイ
ド上をスライドさせて、前記連設されている別のリニア
ガイドを介して入れ替えレール台上に移載するようにし
たものである。
(D) Means for Solving the Problems Accordingly, the present invention provides a linear guide that guides the left and right movement of a component supply device that sequentially supplies chip-shaped electronic components mounted on a printed circuit board through a linear guide bearing. In the electronic component automatic mounting apparatus having a component supply table on which a group of component supply apparatuses is installed, a replacement rail table provided with another linear guide is provided so as to be linear with respect to the linear guide. The component supply table on which the component supply device group is mounted is slid on a linear guide via a bearing, and is transferred to a replacement rail table via the another linear guide provided continuously. Things.

また、本発明はプリント基板上に装着されるチップ状
電子部品を順次供給する部品供給装置の左右移動を案内
するリニアガイドにリニアガイド軸受を介して所望数の
部品供給装置群が架設された部品供給台を有する電子部
品自動装着装置において、前記部品供給台を前記リニア
ガイド軸受に取り付けられるメインベースと、該メイン
ベースに取り付け金具を介して取り付けられる前記部品
装置群が架設されたサブベースとに分けたものである。
In addition, the present invention provides a component in which a desired number of component supply devices are installed via a linear guide bearing on a linear guide that guides the left and right movement of a component supply device that sequentially supplies chip-shaped electronic components mounted on a printed circuit board. In an electronic component automatic mounting apparatus having a supply base, a main base for mounting the component supply base on the linear guide bearing, and a sub-base on which the component device group mounted on the main base via a mounting bracket are installed. It is divided.

また、本発明はプリント基板上に装着されるチップ状
電子部品を順次供給する部品供給装置を複数個架設しス
ライド機構に駆動されリニアガイドによりリニアガイド
軸受を介して案内されて左右方向に移動する部品供給台
を有する電子部品自動装着装置において、前記スライド
機構を有する第1の載置台と、前記リニアガイドが設け
られると共に該第1の載置台に着脱可能に設けられた第
2の載置台とを有するものである。
The present invention also provides a plurality of component supply devices for sequentially supplying chip-shaped electronic components mounted on a printed circuit board, is driven by a slide mechanism, is guided by a linear guide via a linear guide bearing, and moves in the left-right direction. In an electronic component automatic mounting apparatus having a component supply table, a first mounting table having the slide mechanism, and a second mounting table provided with the linear guide and detachably provided on the first mounting table. It has.

(ホ)作 用 従って、作業者が電子部品自動装着装置のリニアガイ
ドに対し、入れ替えレール台のリニアガイドが直線とす
るように連設させることにより、リニアガイド軸受を介
して部品供給装置群が載置された部品供給台が入れ替え
レール台上に移載される。
(E) Operation Therefore, the operator connects the linear guide of the electronic component automatic mounting device to the linear guide of the replacement rail base so as to be linear, so that the component supply device group can be connected via the linear guide bearing. The mounted component supply table is transferred onto the replacement rail table.

また、リニアガイド軸受に取り付けられたメインベー
スに取付金具を介して部品供給装置群が架設されたサブ
ベースが取り付けられる。
In addition, a sub-base on which a component supply device group is installed is mounted on a main base mounted on the linear guide bearing via a mounting bracket.

また、部品供給台を載置したリニアガイドを有する第
2の載置台を該供給台の移動を駆動するスライド機構を
有する第1の載置台から離脱して部品装着装置の交換を
行う。
Further, the second mounting table having the linear guide on which the component supply table is mounted is detached from the first mounting table having the slide mechanism for driving the movement of the supply table, and the component mounting device is replaced.

(ヘ)実施例 以下、本発明の一実施例について第1図乃至第6図に
基づき詳述する。
(F) Embodiment Hereinafter, an embodiment of the present invention will be described in detail with reference to FIGS.

(1)はチップ状電子部品(図示せず)をプリント基
板(図示せず)上に装着する電子部品自動装着装置の基
台である。
(1) is a base of an automatic electronic component mounting apparatus for mounting a chip-shaped electronic component (not shown) on a printed circuit board (not shown).

(2)(3)は前記基板を搬送させるための一対のコ
ンベアである。
(2) and (3) are a pair of conveyors for transporting the substrate.

(4)は下面に前記部品を後述する部品供給装置
(5)より取り出し搬送する吸着ノズル(図示せず)が
複数個設けられた吸着ヘッド部(図示せず)が多数設置
される回転盤で、図示しない回転盤駆動源により間欠回
転される。
(4) a rotary disk on which a plurality of suction heads (not shown) provided with a plurality of suction nozzles (not shown) for taking out and transporting the components from a component supply device (5) described below are provided on the lower surface. , Are intermittently rotated by a rotating disk drive source (not shown).

(6)は前記部品供給装置(5)が多数列設される部
品供給台で、基台(1)にリニアガイド(7)及びリニ
アガイド軸受(8)を介して基台(1)長手方向に移動
可能に設けられ、部品供給装置(5)の下部に設けられ
た支持ピン(9)(10)が部品供給台(6)に設けられ
た取付穴(図示せず)に位置決め状態で設置されてい
る。
(6) is a component supply table in which a number of the component supply devices (5) are arranged in a row, and the base (1) is provided with a linear guide (7) and a linear guide bearing (8). The support pins (9) and (10) provided at the lower part of the component supply device (5) are positioned and installed in mounting holes (not shown) provided in the component supply table (6). Have been.

(11)はその図示しない駆動源により回動されるボー
ルネジ(12)の回動により前記部品供給装置(5)を移
動させるスライド機構である。
(11) is a slide mechanism for moving the component supply device (5) by turning a ball screw (12) turned by a driving source (not shown).

(13)は前記部品供給台(6)から延出された支持ア
ームで、この支持アーム(13)上には、テープリール
(14)が取り付けられるテープリール取り付け板(15)
の下端面部(15A)が非固定状態で支持されている。
(13) is a support arm extending from the component supply table (6), and on this support arm (13), a tape reel mounting plate (15) on which a tape reel (14) is mounted.
Is supported in a non-fixed state at the lower end surface portion (15A).

(16A)(16B)は夫々リニアガイド(7A)(7B)を有
し、部品供給装置(5)を入れ替える新しい部品供給装
置(5)を備えた入れ替えレール台及び空の入れ替えレ
ール台である。
Reference numerals (16A) and (16B) denote a replacement rail base and an empty replacement rail base that have linear guides (7A) and (7B), respectively, and are provided with a new component supply device (5) for replacing the component supply device (5).

以下、動作について図面に基づき詳述する。 Hereinafter, the operation will be described in detail with reference to the drawings.

ボールネジ(12)の回動により所望の部品供給装置
(5)が部品取り出し位置に待機させられ、テープリー
ル(14)に収納されたテープ内の部品は吸着ノズルによ
り取り出され、回転盤(4)の回転によりコンベア
(2)(3)で搬送されて来た基板上に搬送され、基板
の所定位置に装着される。
The rotation of the ball screw (12) causes the desired component supply device (5) to wait at the component removal position, and the components in the tape stored in the tape reel (14) are removed by the suction nozzle, and the rotary disk (4) The substrate is conveyed onto the substrate conveyed by the conveyors (2) and (3) by the rotation of the substrate and is mounted on a predetermined position of the substrate.

次に、部品供給装置(5)の段取り替え動作について
説明すると、電子部品自動装着装置の部品供給台(6)
のリニアガイド(7)に対し作業者が直線的に第5図に
示す通り、左側に新しい部品供給装置(5)を備えた入
れ替えレール台(16A)と右側に空の入れ替えレール台
(16B)とを設置し、現在リニアガイド(7)上の部品
供給台(6)を空の入れ替えレール台(16B)上へ移載
し、移載終了後に新しい部品供給装置(5)をリニアガ
イド(7)上へ移載する(第6図参照)。
Next, the setup change operation of the component supply device (5) will be described.
As shown in FIG. 5, the operator linearly moves the linear guide (7) to the replacement rail base (16A) provided with the new component supply device (5) and the empty replacement rail base (16B) to the right. And the component supply table (6) on the current linear guide (7) is transferred onto the empty replacement rail base (16B). After the transfer is completed, the new component supply device (5) is moved to the linear guide (7). ) Transferred to above (see FIG. 6).

また、部品供給台(6)をメインベース(17)、サブ
ベース(18)とに分けて部品供給装置(5)の段取り替
えを簡易とした他の実施例について第7図及び第8図に
基づき説明する。
FIGS. 7 and 8 show another embodiment in which the component supply table (6) is divided into a main base (17) and a sub-base (18) to simplify the changeover of the component supply device (5). It is explained based on.

サブベース(18)に設けられた夫々のロケートピン
(19)を介して所望数の部品供給装置(5)が位置決め
状態で設置され、このサブベース(18)がリニアガイド
軸受(8)上に設けられたメインベース(17)に設けら
れているロケートピン(20)により位置決め状態で、サ
ブベース固定ボルト(21)により固定されることにより
部品供給装置(5)はリニアガイド軸受(8)に取り付
けられる。つまり、部品供給装置(5)が取り付けられ
たサブベース(18)を多数用意しておくことにより、作
業者は現在メインベース(17)に取り付けられているサ
ブベース(18)を固定ボルト(21)を緩めて取り外し、
新しいサブベース(18)を固定するだけで簡単に部品供
給装置(5)の段取り替えが行える。
A desired number of component supply devices (5) are installed in a positioning state via respective locating pins (19) provided on the sub-base (18), and the sub-base (18) is provided on the linear guide bearing (8). The component supply device (5) is attached to the linear guide bearing (8) by being fixed by the sub-base fixing bolt (21) while being positioned by the locate pin (20) provided on the main base (17) provided. . That is, by preparing a large number of sub-bases (18) to which the component supply device (5) is attached, the operator can attach the sub-base (18) currently attached to the main base (17) to the fixing bolts (21). ) And remove it,
Just by fixing the new sub-base (18), the setup of the component supply device (5) can be easily changed.

更に、第9図及び第10図に示す通り基台(1)を電子
部品自動装着装置本体側の載置台(1A)と部品供給装置
(5)の載置台(1B)とに分けて、所望の部品供給装置
(5)を、その載置台(1B)ごとロケートピン(22A)
(22B)(22C)による位置決め状態で、連結部材として
の取り付けボルト(23A)(23B)により固定させること
により簡単に部品供給装置(5)の段取り替えが行え
る。
Further, as shown in FIGS. 9 and 10, the base (1) is divided into a mounting table (1A) on the electronic component automatic mounting device main body side and a mounting table (1B) of the component supply device (5). Locating pin (22A) with the mounting table (1B)
In the state of positioning by (22B) and (22C), the component supply device (5) can be easily exchanged by fixing it with the mounting bolts (23A) and (23B) as connecting members.

(ト)発明の効果 以上のように請求項1の発明によれば、部品供給装置
を架設する部品供給台を移動させて高速な部品装着を実
現できるとともに、部品供給台の交換はリニアガイド上
をスライドさせて迅速に行うことができ部品装着の稼働
率を下げなくて済む。しかも別の入れ替えレール台を用
いるので、装置自体は小型化でき部品供給台からの部品
供給装置の交換作業も安全にできる。
(G) Effects of the Invention As described above, according to the first aspect of the present invention, the component supply table on which the component supply device is installed can be moved to realize high-speed component mounting, and the component supply table can be replaced on the linear guide. Can be performed quickly by sliding, so that the operation rate of component mounting does not need to be lowered. Moreover, since another replacement rail base is used, the apparatus itself can be reduced in size, and the work of replacing the component supply device from the component supply table can be performed safely.

また、部品供給装置群を載置する部品供給台のみを交
換して、供給台を移動させるガイドの部分はそのままに
残すので、ガイドの部分までを一括して交換する場合に
比較して部品供給装置群の交換の間に部品装着の稼働率
を下げることのないように次の部品供給装置群からの部
品装着動作が行えるようにするのに、軽い部品供給台の
みを複数個用意して重く大きいレール台は必要最低限の
台数のみ用意すれば済み、これらの保管場所のスペース
を節約でき、取扱いも容易にできる。
In addition, since only the component supply table on which the component supply device group is mounted is replaced and the guide portion for moving the supply table is left as it is, the component supply is compared to the case where the guide portion is replaced all at once. To make it possible to perform the component mounting operation from the next component supply device group so that the operation rate of component mounting does not decrease during the replacement of the device group, prepare multiple Only a minimum number of large rail stands need to be prepared, which saves space in these storage locations and facilitates handling.

また請求項2の発明によれば、部品供給装置を架設す
る部品供給台を移動させて高速な部品装着を実現できる
とともに、部品供給台に設けられたメインベースよりサ
ブベースを着脱可能にしたので、部品供給装置群を比較
的軽量の状態で一括交換でき、手作業で一括交換するこ
とも可能になる等交換の作業が簡単になる。しかも次の
部品供給装置群を架設するサブベースを直ちにメインベ
ース上に装着すれば部品装着の稼働率を下げることなく
部品供給装置の交換が可能となる。
According to the second aspect of the present invention, the component supply table on which the component supply device is installed can be moved to realize high-speed component mounting, and the sub base can be attached to and detached from the main base provided on the component supply table. In addition, the replacement operation can be simplified, for example, the parts supply device group can be replaced collectively in a relatively lightweight state, and the batch replacement can be performed manually. In addition, if the sub-base on which the next component supply device group is installed is immediately mounted on the main base, the component supply device can be replaced without lowering the operation rate of component mounting.

さらには、複数のサブベースがメインベース上に載置
可能であれば、1つのサブベースを取り外しても他のサ
ブベース上の部品供給装置のみで部品供給が可能であ
り、部品装着の稼働率を維持できる。
Furthermore, if a plurality of sub-bases can be placed on the main base, even if one sub-base is detached, components can be supplied only with the component supply device on another sub-base, and the operating rate of component mounting Can be maintained.

また、サブベースは軽量でスペースが少なくて済むた
め部品供給台の移動を案内するガイドの部分までを一括
して交換する場合に比較して部品供給装置群の交換の間
に部品装着の稼働率を下げることのないように次の部品
供給装置群からの部品装着動作が行えるようにするの
に、軽いサブベースのみを複数個用意すれば済み、これ
らの保管場所のスペースを節約でき、取扱いも容易にで
きる。
In addition, since the sub-base is lightweight and requires little space, the operating rate of component mounting during replacement of the component supply unit group is lower than when the parts up to the guide that guides the movement of the component supply table are replaced at once. In order to be able to perform component mounting operations from the next component supply device group without lowering the number of units, it is only necessary to prepare a plurality of light sub-bases, which saves space in these storage locations and facilitates handling. Easy.

さらに、部品供給装置の交換をするのに他の部品供給
台が移動する隣で行う必要もなくなり安全に行うことが
可能となる。
Further, it is not necessary to perform the replacement of the component supply device next to the movement of another component supply table, so that the component supply device can be safely performed.

また、請求項3の発明によれば、部品供給装置を架設
する部品供給台を移動させて高速な部品装着を実現でき
るとともに、部品供給台を載置したリニアガイドを有す
る第2の載置台を該供給台の移動を駆動するスライド機
構を有する第1の載置台から離脱して部品装着装置の交
換ができるので、部品装着の稼働率を下げなく済み、さ
らにはスライド機構を複数の第2の載置台で共用でき
る。
According to the third aspect of the present invention, the component supply table on which the component supply device is erected is moved to realize high-speed component mounting, and the second mounting table having the linear guide on which the component supply table is mounted is provided. Since the component mounting device can be replaced by detaching from the first mounting table having the slide mechanism for driving the movement of the supply table, the operation rate of component mounting does not need to be reduced, and the slide mechanism can be replaced by a plurality of second mounting mechanisms. Can be shared on the mounting table.

【図面の簡単な説明】[Brief description of the drawings]

第1図及び第2図は本発明を適用した電子部品自動装着
装置の概略的平面図及び側面図、第3図及び第4図は入
れ替えレール台を示す図、第5図及び第6図は段取り替
え作業を示す図、第7図乃至第10図は他の実施例を示す
図を示す。 (5)……部品供給装置、(6)……部品供給台、
(7)……リニアガイド、(17)……メインベース、
(18)……サブベース。
1 and 2 are schematic plan views and side views of an electronic component automatic mounting apparatus to which the present invention is applied, FIGS. 3 and 4 are views showing a replacement rail base, and FIGS. FIGS. 7 to 10 show a setup change operation, and FIGS. 7 to 10 show other embodiments. (5) ... parts supply device, (6) ... parts supply stand,
(7) ... linear guide, (17) ... main base,
(18) ... Sub-base.

───────────────────────────────────────────────────── フロントページの続き (72)発明者 鈴木 晴久 大阪府守口市京阪本通2丁目18番地 三 洋電機株式会社内 (56)参考文献 特開 昭61−121398(JP,A) 特開 昭61−77398(JP,A) 特開 昭63−98185(JP,A) ──────────────────────────────────────────────────続 き Continuation of front page (72) Inventor Haruhisa Suzuki 2-18-18 Keihanhondori, Moriguchi-shi, Osaka Sanyo Electric Co., Ltd. (56) References JP-A-61-121398 (JP, A) JP-A Sho 61-77398 (JP, A) JP-A-63-98185 (JP, A)

Claims (3)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】プリント基板上に装着されるチップ状電子
部品を順次供給する部品供給装置の左右移動を案内する
リニアガイドにリニアガイド軸受を介して所望数の部品
供給装置群が架設された部品供給台を有する電子部品自
動装着装置において、前記リニアガイドに対し直線とな
るように別のリニアガイドが設けられた入れ替えレール
台を連設させ、前記リニアガイド軸受を介して部品供給
装置群が載置された前記部品供給台をリニアガイド上を
スライドさせて、前記連設されている別のリニアガイド
を介して入れ替えレール台上に移載するようにしたこと
を特徴とする部品供給装置の段取り替え方法。
1. A component in which a desired number of component supply groups are installed via a linear guide bearing on a linear guide that guides the left and right movement of a component supply unit that sequentially supplies chip-shaped electronic components mounted on a printed circuit board. In an electronic component automatic mounting apparatus having a supply table, a replacement rail table provided with another linear guide is provided so as to be linear with respect to the linear guide, and a component supply apparatus group is mounted via the linear guide bearing. Wherein the component supply table placed is slid on a linear guide and transferred onto a replacement rail table via the another linear guide provided continuously. How to replace.
【請求項2】プリント基板上に装着されるチップ状電子
部品を順次供給する部品供給装置の左右移動を案内する
リニアガイドにリニアガイド軸受を介して所望数の部品
供給装置群が架設された部品供給台を有する電子部品自
動装着装置において、前記部品供給台を前記リニアガイ
ド軸受に取り付けられるメインベースと、該メインベー
スに取り付け金具を介して取り付けられる前記部品装置
群が架設されたサブベースとに分けたことを特徴とする
電子部品自動装着装置。
2. A component in which a desired number of component supply device groups are installed via a linear guide bearing on a linear guide that guides left and right movement of a component supply device that sequentially supplies chip-shaped electronic components mounted on a printed circuit board. In an electronic component automatic mounting apparatus having a supply base, a main base for mounting the component supply base on the linear guide bearing, and a sub-base on which the component device group mounted on the main base via a mounting bracket are installed. An electronic component automatic mounting device characterized by being divided.
【請求項3】プリント基板上に装着されるチップ状電子
部品を順次供給する部品供給装置を複数個架設しスライ
ド機構に駆動されリニアガイドによりリニアガイド軸受
を介して案内されて左右方向に移動する部品供給台を有
する電子部品自動装着装置において、前記スライド機構
を有する第1の載置台と、前記リニアガイドが設けられ
ると共に該第1の載置台に着脱可能に設けられた第2の
載置台とを有することを特徴とする電子部品自動装着装
置。
3. A plurality of component supply devices for sequentially supplying chip-like electronic components mounted on a printed circuit board are mounted, driven by a slide mechanism, guided by a linear guide via a linear guide bearing, and moved in the left-right direction. In an electronic component automatic mounting apparatus having a component supply table, a first mounting table having the slide mechanism, and a second mounting table provided with the linear guide and detachably provided on the first mounting table. An electronic component automatic mounting device, comprising:
JP63286950A 1988-11-14 1988-11-14 Component supply device setup change method and electronic component automatic mounting device Expired - Fee Related JP2604216B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63286950A JP2604216B2 (en) 1988-11-14 1988-11-14 Component supply device setup change method and electronic component automatic mounting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63286950A JP2604216B2 (en) 1988-11-14 1988-11-14 Component supply device setup change method and electronic component automatic mounting device

Publications (2)

Publication Number Publication Date
JPH02132895A JPH02132895A (en) 1990-05-22
JP2604216B2 true JP2604216B2 (en) 1997-04-30

Family

ID=17711054

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63286950A Expired - Fee Related JP2604216B2 (en) 1988-11-14 1988-11-14 Component supply device setup change method and electronic component automatic mounting device

Country Status (1)

Country Link
JP (1) JP2604216B2 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2540673B2 (en) * 1991-07-10 1996-10-09 株式会社テンリュウテクニックス Tray and electronic component feeder
US6789310B1 (en) 1995-11-06 2004-09-14 Matsushita Electric Industrial Co., Ltd. Component mounting apparatus
JP4429465B2 (en) 1999-12-07 2010-03-10 パナソニック株式会社 Parts supply unit batch replacement cart
JP2007150105A (en) * 2005-11-29 2007-06-14 Hitachi High-Tech Instruments Co Ltd Electronic component mounter

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6177398A (en) * 1985-02-19 1986-04-19 ティーディーケイ株式会社 Tape feeder device
JPS61121398A (en) * 1984-11-16 1986-06-09 松下電器産業株式会社 Method of automatically exchanging cassette for part feeder
JPH07107957B2 (en) * 1986-10-15 1995-11-15 株式会社日立製作所 Component mounting device

Also Published As

Publication number Publication date
JPH02132895A (en) 1990-05-22

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