JP2659676B2 - Wafer holding device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wafer gripping device for gripping a plate-like member such as a silicon wafer without impact, and more specifically, to flexibly grip the plate-like member by a linearly movable flexible actuator capable of flexible movement. The present invention relates to a wafer holding device that can be used.

[0002]

2. Description of the Related Art In a semiconductor manufacturing process, many wafer processing apparatuses such as a photographic exposure apparatus, an etching apparatus, and a vapor phase film forming apparatus are used in a dust-free room. Therefore, a silicon wafer as a semiconductor substrate is transferred between these apparatuses. Must. Conventionally, to transport a silicon wafer, the wafer has been gripped by a suction pad using an exhaust pump or the like, and transported by a mechanical movement element such as a motor or a piston mechanism. Also, when the suction pad approaches the wafer to be gripped (hereinafter, referred to as “wafer approach”), the movement by the mechanical movement element is used.

[0003]

However, the conventional wafer gripping device using the suction pad and the mechanical movement element has the following problems. First, suction pads require a rotary pump for evacuation. Since the rotary pump uses oil for a seal or the like, the cleanliness of the dust-free chamber may be impaired by oil mist.
In addition, the suction pad itself may contaminate the suction position of the wafer. Normally, the back surface of the wafer is sucked. However, depending on wafer handling during the process, the process surface may have to be sucked in some cases, resulting in a decrease in yield.

[0004] Second, there is a problem due to mechanical motion elements such as a motor and a piston. That is, these are generally rigid structures, and are configured to have a movement and positioning accuracy on the order of microns by such rigidity. If such a rigid motion element hits another member or the like while performing a predetermined motion, a mechanical impact will be generated.
This is hereinafter referred to as “hard movement”.

[0005] In the case of a silicon wafer, when a mechanical shock due to hard motion is applied, an internal defect is generated, which may affect its electrical characteristics. Further, depending on the degree of impact, the wafer itself, which is a brittle material, may be damaged or deformed. Also, particles that are inevitably generated at the time of breakage or deformation may be larger than the processing dimensions of the fine circuit elements to be formed on the wafer, so if they adhere to other wafers, they will interfere with the required fine circuit processing. And lower the yield. For these reasons, mechanical impact on the wafer should be eliminated as much as possible. Therefore, when such a hard movement is used for the movement at the time of the wafer approach, it is necessary to suppress the occurrence of mechanical shock by performing extremely detailed position control and speed control by speed control. However, the piston, which is a mechanical motion element, has a stepping behavior when driven at an extremely low speed, so that the position accuracy is poor and the instantaneous speed is not so slow, so that mechanical impact cannot be eliminated.

On the other hand, in recent years, there have been various flexible actuators capable of performing a flexible movement instead of a hard movement by combining a stretchable material such as rubber and a non-stretchable material such as a reinforcing fiber and supplying compressed air thereto. Proposed (Tanaka, Mechanical Design 36, 8 (1992-7), 32-
39 etc.). Flexible actuators can move straight, bend, bend, and flex depending on the combination of stretchable and non-stretchable materials.
Various movements such as twisting are possible. For this reason, it is considered that a wafer holding device that eliminates the occurrence of mechanical impact is realized by using the flexible actuator for the wafer approach of the wafer holding device.

[0007] However, the conventional flexible actuator is still insufficient for application to a semiconductor manufacturing process. For example, in the case of a curved flexible actuator shown in FIG. 9, since the actuator itself is basically composed of a rubber tube having no rigidity, an object to be gripped such as a wafer (hereinafter, referred to as "work") alone is gripped. Then, deformation and vibration of the tube occur due to the weight of the work, and the required positional accuracy cannot be obtained. Further, this kind of bending actuator is constituted by a combination of a rubber tube and a reinforcing fiber. Therefore, if there is a shift in the position where the reinforcing fiber is stuck, the actual deformation behavior faithfully reflects this, which also lowers the position accuracy of the bending actuator.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems of the prior art, and does not use a suction pad, which causes wafer contamination, but utilizes a straight-line flexible actuator to achieve a wafer approach. Eliminates impact, flexibly grips brittle objects such as wafers, and achieves high positional accuracy without complicated control mechanisms.
An object of the present invention is to provide a wafer holding device suitable for application to the semiconductor manufacturing field.

[0009]

SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, a wafer holding apparatus according to the present invention comprises a machine frame, a support shaft fixed to the machine frame, and a rotatable shaft. In a gripping device having a disc provided on a machine frame and expansion / contraction means sandwiched between the machine frame and the disc, three or more slits formed in the disc are provided fixed to the machine frame. Three or more ball slides, a slide plate slidably provided on each ball slide, a gripper claw fixedly provided on each slide plate, and each slit fixedly provided on each slide plate. And a pin provided on the machine frame.
A head for feeding a force fluid , wherein the expansion and contraction means is an artificial muscle, and the angle of the disc is changed by expansion and contraction of the artificial muscle to drive a pin fitted in each slit, thereby making each slide plate Is slid to change the position of each gripping claw to grip or release a thin plate-like object such as a wafer.

The telescopic hand in this wafer gripping device
The step is an artificial muscle that receives the delivery of pressure fluid through the head
And connects the machine frame and the disk.

[0011]

In the wafer gripping apparatus of the present invention having the above-mentioned structure, when the artificial muscle as the expansion / contraction means is pressurized, the artificial muscle expands flexibly. Since one end of the artificial muscle is attached to the machine frame and the machine frame and the disc are connected , the other end of the artificial muscle pushes the disc by extension . For this reason, the disk rotates around the support shaft, and changes the angle of each slit formed in the disk with respect to the machine frame. At this time, a pin formed on each slide plate is pulled by each slit, and each slide plate slides and moves on a ball slide. As a result, the gripping claws formed on each slide plate change their positions. When the pressure applied to the artificial muscle is released, the artificial muscle shortens and pulls the disk. For this reason, the disk rotates about the support shaft, and each slit returns to the original angle. As a result, each slide plate slides on the ball slide, and each gripper returns to its original position. Thus, the brittle thin plate-like work can be flexibly grasped and released by each grasping claw.

Here, pressurization of the artificial muscle and its
Release is achieved by the delivery of pressurized fluid through the head
You.

[0013]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Several embodiments of the present invention will be described with reference to the drawings. First, a wafer holding device 1 according to a first embodiment of the present invention will be described with reference to FIGS. Wafer holding device 1
Is basically for gripping the work flexibly by the expansion and contraction of the artificial muscle 4, and particularly considering gripping the periphery of a brittle and substantially circular flat work such as a silicon wafer.

As shown in FIG. 1 (a perspective view from above) and FIG. 2 (a perspective view from the side), the wafer gripping device 1 has an artificial muscle inside a machine frame 80 having a substantially flat cylindrical shape. 4 and the like are housed. Machine frame 80
A support shaft 81 is formed at the center of the inside. A head 82 protrudes from the center of the upper surface of the machine frame 80, and an air hose for applying and releasing compressed air to the artificial muscle 4 inside the machine frame 80 through the head 82, and a cable for outputting a signal of the linear potentiometer 60. Etc. are coming and going. In addition, three oval holes 85 are formed on the lower surface of the machine frame 80 with each other.
It is formed at a position of 20 ° and equidistant from the center (hereinafter, referred to as “three-fold symmetric position”).

A disk 83 is provided inside the machine frame 80 so as to be rotatable with respect to the support shaft 81. And artificial muscle 4
The base holder 41 is attached to the machine frame 80, and the tip holder 42 is attached to the disk 83. Therefore, the disk 83 rotates about the support shaft 81 as the artificial muscle 4 expands and contracts.
The disk 83 has three slits 84 formed at three-fold symmetric positions. Back side of lower surface of machine frame 80 (inside machine frame 80)
In the figure, three ball slides 86 (only one is shown in the drawing in the drawing) are arranged in parallel with the adjacent hole 85 and at three times symmetrical positions. On each of the ball slides 86, a slide plate 87 having a substantially “K” shape is provided.
Each slide plate 87 can slide in parallel with the hole 85 by the action of the ball slide 86. Each slide plate 87
A bar-shaped gripping claw 88 is attached downward at one end of the gripper. Each gripping claw 88 protrudes outside the machine frame 80 through the hole 85.

At another end of each slide plate 87,
A rod-like pin 89 is attached upward. Each pin 89 is fitted in a slit 84 of the disk 83. Therefore, when the disc 83 rotates, each pin 89 is moved in accordance with a change in the position of each slit 84, and eventually each slide plate 87 slides on the ball slide 86. Each gripping claw 88 and each pin 89 are respectively equidistant from the center. The movable end 61 of the linear potentiometer 60 is attached to one of the three pins 89 via a stay 90 at the tip thereof. Thus, the position of the pin 89 can be monitored.

Here, the artificial muscle 4 will be described. The artificial muscle 4 is basically configured by holding both ends of the telescopic tube 40 with a base holder 41 and a tip holder 42. The telescopic tube 40 is formed by sticking and joining non-stretchable reinforcing fibers 52 in the circumferential direction of a flexible flexible tube 51 as shown in an external view (a) and a cross-sectional view (b) in FIG. It is. When compressed air is applied to the inside of the telescopic tube 40, the flexible tube 51 is elastically stretched to increase the volume. However, since the reinforcing fiber 52 is stuck in the circumferential direction, it can be expanded in the radial direction. Instead, the telescopic tube 40 extends only in the length direction.

The material of the flexible tube 51 may be any material such as silicone rubber or raw rubber, as long as it has appropriate flexibility and elasticity. The reinforcing fiber 52 may be made of a metal fiber, a carbon fiber, a silk thread, or the like in addition to a metal fiber or a carbon fiber. However, the reinforcing fiber 52 has good compatibility with the flexible tube 51 and the adhesive, and has high flexibility only in a bending direction and low flexibility in a stretching direction. It is better to use something. It is preferable to use the same adhesive as the flexible tube 51 as an adhesive for joining them. A vent hole is formed in the proximal end holder 41 so that compressed air can be introduced into the telescopic tube 40.

The wafer holding apparatus 1 having the above-described configuration operates as follows. First, a state where compressed air is not applied to the artificial muscle 4, that is, a case where the artificial muscle 4 is in a contracted state will be described. FIG. 1 shows this state. In the state of FIG. 1, the pins 89 of each slide plate 87 are located at the outer ends of each slit 84. Therefore, each slide plate 87 is also at the outer end position on the ball slide 86, and each gripping claw 88 is also at the outer end position in the hole 85. Accordingly, the distance between the gripping claws 88 is large, and the wafer gripping device 1 is in a state of not gripping the work.

When compressed air is applied to the artificial muscle 4, the artificial muscle 4 expands. Therefore, the tip holder 4 of the artificial muscle 4
2 pushes the disk 83 as shown by the arrow A, and the disk 83
It rotates in the direction of arrow B about 1. Accordingly, each slit 84 also moves. Then, each pin 89 also moves following the movement of each slit 84. Therefore, each slide plate 87 slides on the ball slide 86 and moves in the direction of arrow C. Accordingly, each gripping claw 88 moves inward along the hole 85. This state is shown in a perspective view in FIG. Thus, the distance between the holding claws 88 is reduced, and the wafer holding device 1 holds the work. When the compressed air applied to the artificial muscle 4 is released, the artificial muscle 4 returns to the contracted state, so that the wafer gripping device 1 returns to the state of FIG. 1 and releases the gripping of the work. In the above operation, the position of the gripping claw 88 may be controlled by means of the output signal of the linear potentiometer 60 through means such as control of the supply pressure of compressed air.

Here, the following effects exist because the movement of the grasping claw 88 is driven by the expansion and contraction of the artificial muscle 4. That is, the artificial muscle 4 is basically constituted by the flexible tube 51 as described above, and expands and contracts by air pressure. Therefore, the artificial muscle 4 is not a hard movement like a mechanical movement element but a flexible movement. Therefore, when the gripping claws 88 approach the work due to the extension of the artificial muscle 4, it is possible to prevent the brittle work from being damaged without giving an impact. Also, the telescopic tube 40 of the artificial muscle 4
Has the reinforcing fibers 52, so that the telescopic tube 40 does not expand in the radial direction even when compressed air is applied. Accordingly, an increase in the volume of the telescopic tube 40 due to the application of pressure is efficiently converted into a telescopic movement, so that an excessive compressed air pressure is not required. Further, the operation is smooth without the outer surface of the telescopic tube 40 coming into contact with the disk 83 or the like.

Further, since both limits of the movement are restricted by the length of the slit 84, the artificial muscle 4 is prevented from deteriorating or bursting. Further, in the wafer holding device 1, since the relative positions of the three holding claws 88 are mechanically determined, the position accuracy when holding the work is excellent. If the relationship between the position of the slit 84 in the disk 83 and the attachment position of the artificial muscle 4 is changed, the relationship between the expansion and contraction of the artificial muscle 4 and the opening and closing of the gripping claws 88 can be reversed. Further, a hole 85, a ball slide 86, a slide plate 87, a gripping claw 88, a pin 8
9. The number of slits 84 is not limited to three, but may be four or more.

Next, a second embodiment of the present invention will be described. FIG. 4 is a diagram showing a configuration of a wafer holding device 10 according to the second embodiment. Wafer holding device 10 shown in FIG.
Is basically composed of a chassis part 2 and a finger part 3. The chassis part 2 includes a hollow cylindrical cylinder 21.
Have been dug. The artificial muscle 4 is embedded in the cylinder 21. Further, a ventilation port 26 for introducing compressed air into the artificial muscle 4 is provided. A rod portion 46 of the distal end holder 42 of the artificial muscle 4 projects through a hole 23 formed in the bottom 25 of the cylinder 21, and a pin 36 is formed at the distal end. In addition, a potentiometer 60 is embedded below the cylinder 21 in FIG.

The finger portion 3 has two L-shaped gripping arms 31A and 31B. A pivot hole 32A is formed at one end of the grip arm 31A.
An oval pin hole 33A is formed at an intermediate position between A and the bending portion. The opposite side of the pivot hole 32A is a gripping claw 37A. Similarly, a pivot hole 32B and a pin hole 33B are formed in the grip arm 31B.
The opposite side of the pivot hole 32B is a gripping claw 37B. A fulcrum stay 34 extends from the back of the chassis portion 2, and the fulcrum stay 34 has fulcrum shafts 35A and 3A.
5B is provided. Then, the gripping arms 31A, 3
1B pivot holes 32A and 32B
5A and 35B are rotatably fitted. The pin 36 is inserted into the pin holes 33A and 33B.
That is, when the pin 36 moves left and right in the figure due to expansion and contraction of the artificial muscle 4, the distance between the gripping claws 37A and 37B increases or decreases.

The artificial muscle 4 in the present embodiment is the same as that in the first embodiment except that the rod portion 46 and the pin 36 are formed in the distal end holder 42. It is fixed to the portion 2 and drives the gripping arms 31A and 31B by expansion and contraction to open and close.

The base holder 41 is a substantially columnar member fixedly fitted in the cylinder 21.
0, and the outside and the telescopic tube 4
A through hole 47 is formed for communicating with the inside of the zero. Therefore, compressed air can be introduced from the ventilation port 26 into the telescopic tube 40 via the through hole 47.
The tip holder 42 is a substantially cap-shaped member, and has a fitting head 45 for fitting the telescopic tube 40, the rod portion 46, and the flange portion 43. The rod portion 46 is slidable with respect to the hole 23 of the cylinder 21,
The pin 36 is formed at the tip as described above.
The diameter of the flange portion 43 is smaller than the inner surface of the cylinder 21, and the bottom 2 of the cylinder 21 is provided on the opposite side of the fitting head 45.
A contact surface 48 is formed to abut on the contact surface 5.

Next, the operation of the wafer holding device 10 having the above-described configuration will be described. First, when compressed air is not introduced from the ventilation port 26, the telescopic tube 40 is in a contracted state as shown in FIG. 4, and therefore the artificial muscle 4 is in a contracted state. For this reason, the tip holder 42 moves rightward in the drawing, and accordingly, the pin 36 also moves rightward.
Accordingly, the gripping arms 31A and 31B are pulled rightward on the sides with the pin holes 33A and 33B, respectively. Therefore, the gripping arm 31A moves counterclockwise around the fulcrum shaft 35A and the gripping arm 31B moves the fulcrum shaft 35B. It rotates clockwise to the center, and as a result, the gap between the gripping claws 37A and 37B is widened. That is, the wafer holding device 10 is in a state of releasing the work.

Next, when compressed air is introduced from the ventilation port 26, the state shown in FIG. 5 is obtained. That is, the inside of the telescopic tube 40 becomes high pressure by the introduced compressed air, and the telescopic tube 40 extends in the axial direction. Accordingly, the distal end holder 42 moves leftward in the figure until the artificial muscle 4 is in the extended state and the contact surface 48 contacts the bottom 25 of the cylinder 21, and the pin 36 also moves leftward. Accordingly, the sides of the gripping arms 31A and 31B having the pin holes 33A and 33B are pushed leftward. Therefore, the grip arm 31
A is a clockwise rotation about the fulcrum shaft 35A,
B rotates counterclockwise about the fulcrum shaft 35B, and as a result, the distance between the gripping claws 37A and 37B is reduced. That is, the wafer gripping device 10 is in a state of gripping the work.

Here, the extension of the artificial muscle 4 is stopped at a predetermined position by the contact surface 48 contacting the bottom portion 25, so that the distance between the gripping claws 37A and 37B is prevented from being excessively narrowed. The flexible tube 51 is prevented from being overstretched and deteriorated or damaged. When the compressed air is released from the ventilation port 26, the wafer holding device 10 returns to the state shown in FIG. In the above operation, the extension movement of the artificial muscle 4 may be monitored by the potentiometer 60, and the position of the gripping claws 37A and 37B may be controlled by means such as control of the supply pressure of compressed air.

Since the operation of the wafer gripping device 10 is based on the expansion and contraction of the artificial muscle 4, the movement is the first movement.
The movement is flexible as in the embodiment, and does not give an impact to the workpiece even when approaching. Also, it operates efficiently without requiring excessive compressed air pressure. Further, the extension of the artificial muscle 4 is restricted by the contact surface 48, so that deterioration and rupture are prevented. Further, since the telescopic tube 40 of the artificial muscle 4 has the reinforcing fibers 52, the telescopic tube 40 does not expand in the radial direction even when compressed air is applied. Accordingly, an increase in the volume of the telescopic tube 40 due to the application of pressure is efficiently converted into a telescopic movement, so that an excessive compressed air pressure is not required. The operation is smooth without the outer surface of the telescopic tube 40 coming into contact with the cylinder 21. The wafer gripping apparatus 10 is suitable for gripping a chip obtained by dicing a processed wafer.

Next, a third embodiment of the present invention will be described. FIG. 6 shows a wafer holding device 1 according to the third embodiment.
1 is a diagram showing a configuration of FIG. The wafer holding device 11 basically includes the chassis portion 2 and the finger portion 7. The chassis part 2 is the wafer gripping device 1 of the second embodiment.
0 has the same internal configuration as that of the chassis portion 2, and therefore detailed description is omitted. By changing the positional relationship between the pivot hole and the pin hole, the finger portion 7 is opened and closed in a direction opposite to that of the finger portion 7 in the wafer holding device 10 of the second embodiment.

That is, the finger portion 7 has two L-shaped gripping arms 71A and 71B.
2A and 72B are formed not at the ends of the gripping arms 71A and 71B but at the bending portions. Then, the grip arm 71
A and 71B have pin grooves 73A and 73B at their shorter ends.
Are formed. The same as the second embodiment in that gripping claws 77A and 77B are provided on the opposite sides of the pin grooves 73A and 73B. A fulcrum stay 74 is extended from the back of the chassis portion 2, and the fulcrum stay 74 is provided with fulcrum shafts 75A and 75B.
1A, the pivot holes 72A, 72B of 71B are rotatably fitted to the fulcrum shafts 75A, 75B, respectively;
The point that the pin 76 formed on the movable holder 42 of the artificial muscle 4 is fitted in the pin groove 73A, 73B is also the same as in the case of the second embodiment.

Wafer holding device 11 having such a configuration
Performs the reverse operation of the wafer gripping device 10 of the second embodiment. That is, it is the same in that the artificial muscle 4 expands by introducing compressed air from the ventilation port 26 and returns to the original state by releasing the compressed air.
This is because the relationship between the expansion and contraction of the artificial muscle 4 and the opening and closing of the grip claws 77A and 77B is opposite.

First, a state in which compressed air is not applied will be described. In this state, the artificial muscle 4 is in a contracted state as in the second embodiment. For this reason, the tip holder 42 has moved rightward in the figure, and accordingly, the pin 76 has also moved rightward. Thereby, the gripping arms 71A, 71B
Is pulled to the right on the side where the pin grooves 73A and 73B are located, so that the gripping arm 71A is rotated counterclockwise around the fulcrum shaft 75A, and the gripping arm 71B is
In the clockwise direction, and as a result, the gripping claws 77A, 7
The interval of 7B is narrow. That is, the wafer holding device 11
Is in a state of gripping the work, contrary to the second embodiment. FIG.
Indicates this state.

Next, when compressed air is introduced from the ventilation port 26, the state shown in FIG. 7 is obtained. That is, as in the second embodiment, the artificial muscle 4 is extended by the introduced compressed air, and the tip holder 42 moves leftward in the figure until the contact surface 48 contacts the bottom 25 of the cylinder 21. Accordingly, the pin 76 also moves to the left. Thereby, the grip arm 71
As for A and 71B, the sides with the pin grooves 73A and 73B are respectively pushed leftward. Accordingly, the gripping arm 71A rotates clockwise about the fulcrum shaft 75A, and the gripping arm 71B rotates counterclockwise about the fulcrum shaft 75B. As a result, the distance between the gripping claws 77A and 77B increases. That is, the wafer holding device 11 is in a state of releasing the work, contrary to the second embodiment.

Here, as in the second embodiment, the extension of the artificial muscle 4 is stopped at a predetermined position by the contact surface 48 abutting against the bottom 25, so that the distance between the gripping claws 77A and 77B is excessively widened. This prevents the flexible tube 51 from being overstretched and deteriorated or damaged. When the pressure is released from the ventilation port 26, the wafer holding device 11 returns to the state of FIG. In the above operation,
As in the second embodiment, the gripper 7 is controlled by the potentiometer 60.
Position control of 7A and 77B may be performed.

Here, the above-mentioned wafer holding device 11
Is driven by the expansion and contraction of the artificial muscle 4 as in the second embodiment, the gripping claws 77A and 77B approach the work by a flexible movement, and the work is prevented from being damaged without giving an impact. . In addition, since the telescopic tube 40 has the reinforcing fibers 52 as in the second embodiment, it can operate efficiently and smoothly without requiring excessive compressed air pressure. Similarly to the second embodiment, the wafer holding device 11 is also suitable for holding chips obtained by dicing a processed wafer.

As described above, in the wafer gripping apparatus of each of the above embodiments, the gripping claws can be flexibly driven by the expansion and contraction of the artificial muscle so that the workpiece can be gripped even during approach without giving any impact. , Work breakage and the like are prevented. In addition, since the artificial muscle is constituted by the flexible tube and the reinforcing fibers, normally used compressed air is sufficient and the operation is smooth. Further, in the wafer holding device of the first embodiment, the positional accuracy of the work to be held is excellent. As a result, an excellent wafer holding device that can be applied to wafer transfer of a semiconductor manufacturing apparatus that does not like impact is realized. The embodiments do not limit the present invention, and various modifications and improvements can be made without departing from the spirit of the present invention.

[0039]

As is apparent from the above description, in the wafer holding device of the present invention, the disk provided rotatably around the support shaft fixed to the machine frame is used to expand and contract the artificial muscle. , The slide plate slides on the ball slide through the movement of the slit formed in the disc, and the gripper is opened and closed to grip and release the periphery of the work. In this case, the work can be gripped without giving an impact to the work, so that the breakage of the brittle work is prevented, and the accuracy of the gripping position is excellent.

Further, since the artificial muscle is constituted by the flexible tube and the reinforcing fibers, the normally used compressed air is sufficient, the operation is smooth, and no complicated drive control is required. This makes it possible to provide an excellent wafer holding device that can be applied to wafer transfer in a semiconductor manufacturing apparatus.

[Brief description of the drawings]

FIG. 1 is a perspective view from above of a wafer holding device according to the present invention.

FIG. 2 is a perspective view of the wafer holding device shown in FIG. 1 from a side.

FIG. 3 is a diagram showing a state in which a workpiece of the wafer gripping device shown in FIG. 1 is being gripped.

FIG. 4 is a configuration diagram of another wafer holding device according to the present invention.

FIG. 5 is a diagram showing a state in which a workpiece of the wafer gripping device shown in FIG. 4 is being gripped.

FIG. 6 is a configuration diagram of still another wafer holding device according to the present invention.

FIG. 7 is a view showing a state in which the work of the wafer holding device shown in FIG. 6 is released.

FIG. 8 is a view showing a configuration of an artificial muscle telescopic tube used in the wafer gripping device according to the present invention.

FIG. 9 is a diagram showing an example of a conventional flexible actuator.

[Explanation of symbols]

 1, 10, 11 Plate-like member gripping device 2 Chassis part 31A, 31B, 71A, 71B Arm 35A, 35B, 75A, 75B Support point 4 Artificial muscle 80 Machine frame 81 Support shaft 83 Disk 84 Slit 86 Ball slide 87 Slide plate 88 Gripping claw 89 pin

Claims (1)

(57) [Claims] 1. A machine frame, a support shaft fixed to the machine frame, a disk provided rotatably about the support shaft, and connected by being sandwiched between the machine frame and the disk. in the gripping device and a telescoping means for, and three or more slits formed in the disc, and three or more balls slide fixedly mounted on the machine frame, slidably in each ball slide A slide plate provided, a gripping claw fixed to each slide plate, a pin fixed to each slide plate and fitted to each slit, and a pressure fluid provided to the machine frame. The expansion and contraction means receives supply of pressure fluid through the head.
The disk is rotated by the expansion and contraction of the artificial muscle, the pins fitted into the slits are driven, and the slide plates are slid to change the positions of the gripping claws and the wafer. And a thin plate-like object such as the above.