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JP2534206Y2 - Connection device between metal base circuit board and external lead wire - Google Patents

Connection device between metal base circuit board and external lead wire

Info

Publication number
JP2534206Y2
JP2534206Y2 JP8492U JP8492U JP2534206Y2 JP 2534206 Y2 JP2534206 Y2 JP 2534206Y2 JP 8492 U JP8492 U JP 8492U JP 8492 U JP8492 U JP 8492U JP 2534206 Y2 JP2534206 Y2 JP 2534206Y2
Authority
JP
Japan
Prior art keywords
circuit board
base circuit
metal base
external lead
lead wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP8492U
Other languages
Japanese (ja)
Other versions
JPH0557762U (en
Inventor
健一郎 高橋
一英 石井
博充 中野
宗生 山本
誠治 黒住
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp, Matsushita Electric Industrial Co Ltd filed Critical Panasonic Corp
Priority to JP8492U priority Critical patent/JP2534206Y2/en
Publication of JPH0557762U publication Critical patent/JPH0557762U/en
Application granted granted Critical
Publication of JP2534206Y2 publication Critical patent/JP2534206Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Multi-Conductor Connections (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Brushless Motors (AREA)

Description

【考案の詳細な説明】[Detailed description of the invention]

【0001】[0001]

【産業上の利用分野】本考案は、金属ベース回路基板と
外部リード線との接続装置に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a device for connecting a metal base circuit board to external leads.

【0002】[0002]

【従来の技術】近年、発熱量の大きい回路の実装基板と
して、金属ベース回路基板が広く用いられている。それ
に伴い、金属ベース回路基板と外部リード線との接続に
はいろいろな方法が提案されている。
2. Description of the Related Art In recent years, metal-based circuit boards have been widely used as mounting boards for circuits that generate a large amount of heat. Accordingly, various methods have been proposed for connection between the metal base circuit board and external lead wires.

【0003】以下に、従来の金属ベース回路基板と外部
リード線との接続装置について説明する。
[0003] A conventional connection device for connecting a metal base circuit board to external lead wires will be described below.

【0004】図5において1は金属ベース回路基板、5
は外部リード線である。10は金属ベース回路基板1と
外部リード線5との接続端子で金属板で形成されてお
り、金属ベース回路基板1と外部リード線5とは、金属
ベース回路基板1にはんだ付けされた接続端子10に外
部リード線5をはんだ付けすることにより接続されてい
る。
In FIG. 5, reference numeral 1 denotes a metal-based circuit board;
Is an external lead wire. Reference numeral 10 denotes a connection terminal between the metal base circuit board 1 and the external lead wire 5 which is formed of a metal plate. The metal base circuit board 1 and the external lead wire 5 are connected to the connection terminal soldered to the metal base circuit board 1. The external lead wire 5 is connected to the lead wire 10 by soldering.

【0005】以上のように構成された金属ベース回路基
板1と外部リード線5との接続端子10について、以下
にその作用について説明する。まず、金属ベース回路基
板1に接続端子10をはんだ付けし、次に外部リード線
5を接続端子10にはんだ付けすることにより、金属ベ
ース回路基板1と外部リード線5とを電気的に接続す
る。
[0005] The operation of the connection terminal 10 between the metal base circuit board 1 and the external lead wire 5 configured as described above will be described below. First, the connection terminals 10 are soldered to the metal base circuit board 1, and then the external lead wires 5 are soldered to the connection terminals 10, thereby electrically connecting the metal base circuit board 1 and the external lead wires 5. .

【0006】[0006]

【考案が解決しようとする課題】しかしながら上記の従
来の構成では、接続端子10を金属ベース回路基板1に
はんだ付けする際、チップ部品9などの他の電子部品と
同時にリフロー炉によるはんだ付けをおこなうと接続端
子10が倒れたり傾いたりして、安定なはんだ付けが得
られない。したがって、接続端子10をはんだごてなど
で金属ベース回路基板1に後付けしなければならず、は
んだ付けの品質を著しく悪くする。
However, in the above-described conventional configuration, when the connection terminals 10 are soldered to the metal base circuit board 1, soldering is performed by a reflow furnace simultaneously with other electronic components such as the chip components 9. And the connection terminal 10 falls down or tilts, and stable soldering cannot be obtained. Therefore, the connection terminals 10 must be retrofitted to the metal base circuit board 1 with a soldering iron or the like, which significantly deteriorates the quality of soldering.

【0007】さらに外部リード線5を接続端子10には
んだ付けする際、接続端子10の先端部に外部リード線
5を巻き付けてはんだごてではんだ付けするので接続端
子10の先端部に力が加わり、接続端子10に曲がりを
生じたり、金属ベース回路基板1と接続端子10との接
合部である接続ランド3の銅箔はがれを生じたりして、
断線を生じやすいという問題を有していた。
Further, when the external lead wire 5 is soldered to the connection terminal 10, the external lead wire 5 is wound around the tip of the connection terminal 10 and soldered with a soldering iron, so that a force is applied to the tip of the connection terminal 10. In addition, the connection terminal 10 may be bent, or the copper foil of the connection land 3 which is a joint between the metal base circuit board 1 and the connection terminal 10 may be peeled off.
There is a problem that disconnection is likely to occur.

【0008】本考案は上記従来の問題点を解決するもの
で、金属ベース回路基板と外部リード線との接合部を弱
めることなく、断線のない強い電気的接続が可能な金属
ベース回路基板と外部リード線との接続装置を提供する
ことを目的とする。
SUMMARY OF THE INVENTION The present invention solves the above-mentioned conventional problems. The present invention solves the above-mentioned problems by reducing the joint between the metal base circuit board and the external lead wires without breaking the metal base circuit board. It is an object of the present invention to provide a connection device with a lead wire.

【0009】[0009]

【課題を解決するための手段】この目的を達成するため
に本考案の金属ベース回路基板と外部リード線との接続
装置は、金属ベース回路基板と、この金属ベース回路基
板に設けられた突起部と、この突起部の接続ランドと、
一方の面が前記接続ランドに接合され、他方の面に外部
リード線を電気接続例えばはんだ接続可能な金属板と、
前記突起部を電気的に絶縁し、前記外部リード線を外周
に巻き付け可能な電気絶縁性樹脂カバーとを備えた構成
を有している。
In order to achieve this object, a connecting device for connecting a metal base circuit board to an external lead wire according to the present invention comprises a metal base circuit board and a projection provided on the metal base circuit board. And a connection land of the protrusion,
One surface is joined to the connection land, and an external lead wire is electrically connected to the other surface, for example, a metal plate capable of being soldered,
An electrical insulating resin cover is provided which electrically insulates the protrusion and allows the external lead wire to be wound around the outer periphery.

【0010】[0010]

【作用】この構成により、金属板と金属ベース回路基板
との接合は、他の電子部品などと金属板とを同時にリフ
ロー炉などによりはんだ付け実装することにより、工数
の少ない信頼性の高い接合が得られる。
With this configuration, the metal plate and the metal base circuit board can be joined together by soldering and mounting other electronic components and the metal plate together with a reflow furnace at the same time, so that a highly reliable joint with a small number of steps can be achieved. can get.

【0011】さらに金属ベース回路基板の突起部に装着
された電気絶縁性樹脂カバーの外周と金属板とに外部リ
ード線を巻き付け、金属板の外部リード線を巻き付けて
いる面にはんだごてなどによりはんだ付けを行うのであ
るが、はんだごてによるはんだ付けの際の力に対して十
分に強度が得られ、接続端子の曲がりや接続ランドの銅
箔はがれのない、強い電気的接続が可能な金属ベース回
路基板と外部リード線との接続装置が得られる。
Further, an external lead wire is wound around the outer periphery of the electrically insulating resin cover mounted on the projection of the metal base circuit board and the metal plate, and a soldering iron or the like is applied to the surface of the metal plate around which the external lead wire is wound. A metal that is strong enough to withstand the forces of soldering with a soldering iron, and has no bending of the connection terminals and no peeling of the copper foil of the connection lands. A connection device between the base circuit board and the external lead wires is obtained.

【0012】[0012]

【実施例】(実施例1) 以下本考案の実施例1について、図面を参照しながら説
明する。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiment 1 Embodiment 1 of the present invention will be described below with reference to the drawings.

【0013】図1において1は金属ベース回路基板、2
は金属ベース回路基板の突起部、3は金属ベース回路基
板の回路パターンと電気的に接続された突起部2に設け
られた接続ランド、4は一方の面が接続ランド3に接合
され、他方の面に外部リード線を電気接続例えばはんだ
接続の可能な金属板、5は外部リード線、6は突起部2
を電気的に絶縁し外周に外部リード線5を巻き付けた電
気絶縁性樹脂カバーである。
In FIG. 1, reference numeral 1 denotes a metal-based circuit board;
Is a projection of the metal base circuit board, 3 is a connection land provided on the projection 2 electrically connected to the circuit pattern of the metal base circuit board, and 4 is one side joined to the connection land 3 and the other side. An external lead wire is electrically connected to the surface, for example, a metal plate capable of solder connection, 5 is an external lead wire, 6 is a protrusion 2
Is an electrically insulating resin cover that is electrically insulated and has an outer lead wire 5 wound around the outer periphery.

【0014】金属板4は、他の電子部品9などと同時に
金属ベース回路基板1にリフロー炉などによりはんだ付
け実装される。従って金属板4は従来例における接続端
子10のようにはんだごてなどで金属ベース回路基板1
に後付けすることがないので、はんだ付けによるばらつ
きがなく信頼性の高い接合が得られる。金属板4を金属
ベース回路基板1の突起部2に実装し、次に突起部2に
電気絶縁性樹脂カバー6を装着する。さらに外部リード
線5を電気絶縁性樹脂カバー6の外周に巻き付ける。こ
のとき外部リード線5を電気絶縁性樹脂カバー6と突起
部2に実装された金属板4とに同時に巻き付ける。金属
板4と外部リード線5とをはんだ付けなどにより(はん
だ部20)電気的に接続する。このとき金属板4と金属
ベース回路基板1の突起部2との機械的強度が強いの
で、はんだ付け時のはんだごての加圧力に対して、従来
例における接続端子10の曲がりや接続ランド3の銅箔
はがれなどを発生させることがなく、強い電気的接続が
得られる。
The metal plate 4 is soldered and mounted on the metal base circuit board 1 at the same time as other electronic components 9 by a reflow furnace or the like. Therefore, the metal plate 4 is soldered to the metal base circuit board 1 like the connection terminal 10 in the conventional example.
Since there is no need for post-attachment, a highly reliable bonding without variation due to soldering can be obtained. The metal plate 4 is mounted on the projection 2 of the metal base circuit board 1, and then the electrically insulating resin cover 6 is attached to the projection 2. Further, the external lead wire 5 is wound around the outer periphery of the electrically insulating resin cover 6. At this time, the external lead wire 5 is simultaneously wound around the electrically insulating resin cover 6 and the metal plate 4 mounted on the projection 2. The metal plate 4 and the external lead wire 5 are electrically connected by soldering or the like (solder portion 20). At this time, since the mechanical strength of the metal plate 4 and the protrusion 2 of the metal base circuit board 1 is strong, the bending of the connection terminals 10 and the connection lands 3 in the conventional example against the pressing force of the soldering iron at the time of soldering. The copper foil does not peel off, and a strong electrical connection can be obtained.

【0015】電気絶縁性樹脂カバー6の外周に設けられ
た溝7は、外部リード線5と金属板4との位置合わせを
確実にするためのものであり、電気絶縁性樹脂カバー6
に巻き付けられた外部リード線5がはんだ付けされる前
にずれるのを防ぐためのものである。
The groove 7 provided on the outer periphery of the electrically insulating resin cover 6 is for ensuring alignment between the external lead wire 5 and the metal plate 4.
This is to prevent the external lead wire 5 wound around the wire from shifting before being soldered.

【0016】電気絶縁性樹脂カバー6に設けられた爪部
8は、突起部2に電気絶縁性樹脂カバー6を装着した
後、爪部8が金属板4に引っ掛かることにより、電気絶
縁性樹脂カバー6の突起部2から抜け外れるのを防止す
るためにある。これにより次の外部リード線5を巻き付
ける工程も確実に実施できる。
The claw 8 provided on the electrically insulating resin cover 6 is formed by attaching the electrically insulating resin cover 6 to the projection 2 and then hooking the claw 8 on the metal plate 4. 6 to prevent the protrusion 6 from coming off. Thereby, the step of winding the next external lead wire 5 can be reliably performed.

【0017】以上のように本実施例1による金属ベース
回路基板と外部リード線との接続装置は、従来例に比
べ、断線のない強い電気的接続が得られ、製造工数の低
域の点でも優れた効果を奏する。
As described above, the connection device for connecting the metal base circuit board and the external lead wires according to the first embodiment can provide a stronger electrical connection without disconnection as compared with the conventional example, and can reduce the number of manufacturing steps. It has excellent effects.

【0018】(実施例2) 図2において金属ベース回路基板1の一方の面上には、
図示されていないが絶縁層を介してプリント配線が形成
されており、そのプリント配線上にドライバIC11や
位置センサ12やその他表面実装用部品と本考案による
接続装置が搭載されている。
(Embodiment 2) In FIG. 2, on one surface of the metal base circuit board 1,
Although not shown, printed wiring is formed via an insulating layer, and the driver IC 11, the position sensor 12, other components for surface mounting, and the connecting device according to the present invention are mounted on the printed wiring.

【0019】樹脂封止部13にはパワートランジスタな
どのベアチップ部品が実装されている。14は巻線済み
固定子鉄心で、シュラウド部15,16の軸方向先端が
金属ベース回路基板1の駆動回路部品搭載面に当接され
るように組み合わされて、図3に示すように固定子巻線
完成品18となる。
A bare chip component such as a power transistor is mounted on the resin sealing portion 13. Numeral 14 denotes a wound stator core, which is assembled so that the axial ends of the shroud portions 15 and 16 are brought into contact with the drive circuit component mounting surface of the metal base circuit board 1, and as shown in FIG. The finished winding product 18 is obtained.

【0020】図4はこの状態の斜視図で、外部リード線
5である駆動巻線17の巻線端19は電気絶縁性樹脂カ
バー6の外周に巻き付けられ、金属板4にはんだ付けな
どで導電固定されている。
FIG. 4 is a perspective view showing this state. The winding end 19 of the drive winding 17 as the external lead wire 5 is wound around the outer periphery of the electrically insulating resin cover 6 and is electrically connected to the metal plate 4 by soldering or the like. Fixed.

【0021】以上のような構成にすることにより、外部
リード線5である駆動巻線17の巻線端19と金属ベー
ス回路基板1との短絡もなく、金属ベース回路基板1上
の駆動回路と外部リード線5である駆動巻線17の巻線
端19との信頼性の高い接続が得られる。
With the above configuration, there is no short circuit between the winding end 19 of the drive winding 17 which is the external lead wire 5 and the metal base circuit board 1, and the drive circuit on the metal base circuit board 1 A highly reliable connection with the winding end 19 of the drive winding 17 which is the external lead wire 5 can be obtained.

【0022】[0022]

【考案の効果】以上の実施例の説明により明らかなよう
に本考案の金属ベース回路基板と外部リード線との接続
装置によれば、金属ベース回路基板と金属ベース回路基
板に設けられた突起部と、前記突起部の接続ランドと、
一方の面が前記接続ランドに接合され、他方の面に外部
リード線を電気接続例えばはんだ接続可能な金属板4
と、前記突起部を電気的に絶縁し、前記外部リード線を
外周に巻き付け可能な電気絶縁性樹脂カバーとを備えた
構成により、従来例のような接続端子の曲がりや接続ラ
ンドの銅箔はがれのない、断線のない強い電気的接続が
可能な金属ベース回路基板と外部リード線との接続装置
が得られ、信頼性向上および製造工数の低減の点でも多
大な効果を実現できるものである。
As is apparent from the above description of the embodiment, according to the connecting device of the present invention for connecting the metal base circuit board and the external lead wires, the metal base circuit board and the projections provided on the metal base circuit board are provided. And a connection land of the protrusion,
One surface is joined to the connection land, and the other surface is electrically connected to an external lead wire, for example, a metal plate 4 capable of being soldered.
And an electrically insulating resin cover that electrically insulates the protruding portion and allows the external lead wire to be wound around the outer periphery, thereby bending the connection terminal and peeling the copper foil of the connection land as in the conventional example. A connection device between a metal base circuit board and external lead wires, which can perform strong electrical connection without disconnection and without disconnection, can be obtained, and a great effect can be realized in terms of improvement in reliability and reduction in manufacturing man-hours.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本考案の実施例1の金属ベース回路基板と外部
リード線との接続装置の部分を示す斜視図
FIG. 1 is a perspective view showing a part of a connecting device for connecting a metal base circuit board and external lead wires according to a first embodiment of the present invention;

【図2】(a)は、本考案の実施例2の金属ベース回路
基板と外部リード線との接続装置のモータの制御用金属
ベース回路基板への応用例の固定子巻線の部分の斜視図 (b)は、同表面実装部品と接続装置が搭載された金属
ベース回路基板の部分の斜視図
FIG. 2A is a perspective view of a stator winding part of an application example of a connection device between a metal base circuit board and external lead wires according to a second embodiment of the present invention, which is applied to a motor control metal base circuit board; FIG. 2B is a perspective view of a portion of the metal base circuit board on which the surface mount component and the connection device are mounted.

【図3】同、実施例2の固定子巻線完成品の正面図FIG. 3 is a front view of a completed stator winding product according to the second embodiment.

【図4】同、固定子巻線部分の完成品の斜視図FIG. 4 is a perspective view of a completed product of the stator winding portion.

【図5】従来の金属ベース回路基板と外部リード線との
接続装置の部分を示す斜視図
FIG. 5 is a perspective view showing a conventional connection device for connecting a metal base circuit board to external lead wires.

【符号の説明】[Explanation of symbols]

1 金属ベース回路基板 2 突起部 3 接続ランド 4 金属板 5 外部リード線 6 電気絶縁性樹脂カバー DESCRIPTION OF SYMBOLS 1 Metal base circuit board 2 Projection part 3 Connection land 4 Metal plate 5 External lead wire 6 Electrically insulating resin cover

───────────────────────────────────────────────────── フロントページの続き (72)考案者 山本 宗生 大阪府門真市大字門真1006番地 松下電 器産業株式会社内 (72)考案者 黒住 誠治 大阪府門真市大字門真1006番地 松下電 器産業株式会社内 ──────────────────────────────────────────────────の Continued on the front page (72) Muneo Yamamoto 1006 Kazuma Kadoma, Kadoma, Osaka Prefecture Inside Matsushita Electric Industrial Co., Ltd. In company

Claims (3)

(57)【実用新案登録請求の範囲】(57) [Scope of request for utility model registration] 【請求項1】金属ベース回路基板と、この金属ベース回
路基板に設けられた突起部と、この突起部に設けられた
接続ランドと、一方の面が前記接続ランドに接合され、
他方の面に外部リード線を電気接続可能にした金属板
と、前記突起部を電気的に絶縁し、前記外部リード線を
外周に巻き付けた電気絶縁性樹脂カバーとを備えた金属
ベース回路基板と外部リード線との接続装置。
1. A metal base circuit board, a projection provided on the metal base circuit board, a connection land provided on the projection, and one surface joined to the connection land,
A metal base circuit board including a metal plate on the other surface capable of electrically connecting an external lead wire, and an electrically insulating resin cover in which the protrusion is electrically insulated and the external lead wire is wound around the outer periphery; Connection device for external lead wires.
【請求項2】外周に外部リード線巻き付け用溝を設けた
電気絶縁性樹脂カバーを備えた請求項1記載の金属ベー
ス回路基板と外部リード線との接続装置。
2. The connection device according to claim 1, further comprising an electrically insulating resin cover having an outer lead winding groove on an outer periphery thereof.
【請求項3】金属板の側面に引っ掛かる爪部を設けた電
気絶縁性樹脂カバーを備えた請求項1記載の金属ベース
回路基板と外部リード線との接続装置。
3. The connection device between a metal base circuit board and external lead wires according to claim 1, further comprising an electrically insulating resin cover having a claw portion hooked on a side surface of the metal plate.
JP8492U 1992-01-07 1992-01-07 Connection device between metal base circuit board and external lead wire Expired - Lifetime JP2534206Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8492U JP2534206Y2 (en) 1992-01-07 1992-01-07 Connection device between metal base circuit board and external lead wire

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8492U JP2534206Y2 (en) 1992-01-07 1992-01-07 Connection device between metal base circuit board and external lead wire

Publications (2)

Publication Number Publication Date
JPH0557762U JPH0557762U (en) 1993-07-30
JP2534206Y2 true JP2534206Y2 (en) 1997-04-30

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP8492U Expired - Lifetime JP2534206Y2 (en) 1992-01-07 1992-01-07 Connection device between metal base circuit board and external lead wire

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JP (1) JP2534206Y2 (en)

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Publication number Publication date
JPH0557762U (en) 1993-07-30

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