JP2566151Y2 - Electronic components with lead wire holding function - Google Patents

Description

[Detailed description of the invention]

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component having a function of holding a lead wire when the lead wire is soldered to an electronic component such as a switch used in electronic equipment.

[0002]

2. Description of the Related Art A conventional electronic component having a lead wire holding function will be described with reference to a slide switch shown in FIGS.

The conventional electronic component having a lead wire holding function shown in FIG. 9 is one in which a lead wire 4 is passed through a lead wire 4 into a lead wire insertion hole 3 provided in a terminal 2 of a slide switch 1 and soldered by a solder 4a. 10 has a fixed contact 6 of a slide switch 5.
The lead wire 7 is solidly soldered with a solder 7a.

[0004]

However, in the above-mentioned conventional configuration, it is indispensable to hold the lead wire by hand until the solder is solidified in any case in soldering. In addition to variations in the time for holding the lead wire, in the case of solid soldering having the configuration shown in FIG. When the soldering is performed with the core in mind, there is a problem that the soldering area is reduced, the soldering strength is reduced, and the reliability of the soldering is not sufficient, for example, the detachment of the solder.

The present invention solves such a problem and provides an electronic component with a lead wire holding function having a highly reliable lead wire holding function when soldering a lead wire to the electronic component. The purpose is to do so.

[0006]

SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention is to form a lead wire near a soldering portion such as a terminal of an electronic component into a width smaller than an outer dimension of a lead wire for holding the lead wire.
The formed lead wire holding portion having the U-shaped groove is provided on the insulating substrate, and the lead wire is pressed and inserted into the U-shaped groove.
The above-mentioned problem is intended to be solved by soldering from the beginning.

[0007]

According to the present invention, therefore, a U-shaped U-shape formed to have a width smaller than the external dimensions of the lead wire is provided near the soldered portion of the lead wire connection portion such as the terminal of the electronic component. the lead wire retaining function consisting of lead wire holding portion having a groove provided on the insulating substrate, by allowing the lead wire can be soldered by holding in pressed state to the U-shaped groove, during soldering, the solder This eliminates the need to hold the lead wire by hand until completely solidified, so that stable soldering can be performed.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of an electronic component having a lead wire holding function according to the present invention will be described with reference to slide switches shown in FIGS.

According to FIG. 1, reference numeral 13 denotes a terminal provided with a lead wire insertion hole 12 to be soldered. The terminal 13 is implanted in an insulating substrate 14 and slides so that the lead wire insertion hole 12 of the terminal 13 projects outside. It is attached to switch 11 and 17
Is the lead wire 1 in the direction of the lead wire insertion hole 12 of the terminal 13.
5 is smaller than the external dimensions of the lead wire that is held in a press-fit state
This is a lead wire holding portion having a U-shaped groove 16 formed in a width, and is provided integrally with the insulating substrate 14. Lead wire 1
5 designates a tip soldering portion 18 with a lead wire insertion hole 12 of a terminal 13.
And is pressed into the U-shaped groove 16 of the lead wire holding portion 17 provided on the insulating substrate 14 from the F direction and soldered with the solder 15a.

FIGS. 4 and 5 show another embodiment of an electronic component having a lead wire holding function used for a slide switch.
Shows the case of soldering subjecting solid to the fixed contact 21 secured to the insulating substrate 20 of the slide switch 19, Lee
A lead wire holding portion 24 having a U-shaped groove 23 formed to have a width smaller than the outer dimension of the lead wire 22 and sandwiching the lead wire 22 is provided on the insulating substrate 20.

The lead wire holding portion 24 has a U-shaped groove 23.
And the center of the fixed contact 21 are aligned with each other, and the lead wire 22 is pressed into the U-shaped groove 23 and clamped.
In the state, the tip soldering portion 25 of the lead wire 22 and the fixed contact 21
Is soldered by the solder 22a.

FIGS. 6 to 8 further facilitate the positioning of the lead wires of the embodiment shown in FIGS. 4 and 5.
The lead wire 2 is placed on a line connecting the U-shaped groove 27a of the lead wire holding portion 27 and the center of the fixed contact 26 with the fixed contact 26 interposed therebetween.
The lead wire holding portion is formed by providing a holding portion 30 having a hole 31 for holding the tip soldering portion 29 of the lead wire 8, and the center deviation between the center of the lead wire 28 and the fixed contact 26 can be eliminated. By soldering with the solder 28a, there is no lifting of the soldering portion 29 at the end of the lead wire 28, so that highly reliable soldering can be performed.

[0013] Furthermore, since the soldering portion at the tip of the lead wire is fixed, automatic soldering is also possible, which has the advantage that the soldering quality (reliability) can be improved and the soldering can be unmanned. is there.

[0014]

As is apparent from the above embodiment, the lead wire is connected to the lead wire connection portion such as a terminal or a fixed contact and the lead wire.
It has a U-shaped groove formed with a width smaller than the external dimensions. <br/> It is pinched by a lead wire holding function comprising a lead wire holding portion.
By doing so, it is not necessary to hold the lead wires by hand and solder them as in the case of conventional electronic components, so that after soldering, the solder can be solidified stably, and the uniformity of soldering quality and Improvement and increase the number of parts
Without, Ru effect Oh <br/> of reducing the number of assembly steps.

[Brief description of the drawings]

FIG. 1 is a perspective view of a slide switch having a lead wire holding function according to an embodiment of the present invention;

FIG. 2 is a cross-sectional view of a main part for describing an operation of holding the lead wire.

FIG. 3 is an essential part cross-sectional view for explaining a holding state of the lead wire.

FIG. 4 is a perspective view of a slide switch having a lead wire holding function according to another embodiment of the present invention.

FIG. 5 is an essential part side view for explaining a holding state of the lead wire.

FIG. 6 is a perspective view of a slide switch having a lead wire holding function according to another embodiment of the present invention.

FIG. 7 is an essential part plan view for explaining a holding state of the lead wire;

FIG. 8 is a sectional view of the main part.

FIG. 9 is a perspective view for explaining a method of holding a lead wire on a conventional slide switch.

FIG. 10 is a perspective view for explaining a method of holding a lead wire on another conventional slide switch.

[Explanation of symbols]

 12 Lead wire insertion hole 13 Terminal 14, 20 Insulating board 15, 22, 28 Lead wire 16, 23, 27a U-shaped groove 17, 24, 27 Lead wire holding part 21, 26 Fixed contact 30 Holding part

Claims (2)

(57) [Scope of request for utility model registration] 1. A clamping and terminals that are embedded in an insulating substrate constituting an electronic component provided with a lead wire connecting portion lead wire tip is connected, the lead wires connected to the lead wire connection portion of the terminal To a width smaller than the external dimensions of the lead wire
The lead wire of the insulating substrate having the formed U-shaped groove
An electronic component with a lead wire holding function comprising a lead wire holding portion provided integrally in a lead wire holding direction of a connection portion . 2. A hole into which a lead wire tip is inserted.
Connect the second lead wire holding part with the lead wire connecting part
The electronic component with a lead wire holding function according to claim 1, wherein the electronic component is provided at a position facing the lead wire holding portion.