JP2510695B2 - Method and device for inserting multi-pin component - Google Patents

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and apparatus for inserting a pin grid array type electronic component having a large number of connection terminals into a printed circuit board.

(Prior Art) In the field of mounting electronic components, the number of terminals for board connection of components tends to increase because it is advantageous for achieving high density. Especially, electronic parts called pin grid array type are
As shown in FIG. 36, there are several hundreds to several thousands of terminal pins 2 on the back surface, and these terminal pins are collectively inserted and soldered into through holes provided in the board. The terminal pins 2 are regularly arranged at a constant pitch and are arranged in a lattice, and the through holes on the board side to be inserted are also arranged in a similar manner corresponding to the pins.

Conventionally, as a device for inserting an electronic component into a printed circuit board, a device for a DIP type IC component has been developed and generally used. As one example thereof, Japanese Patent Application Laid-Open No. 57-18390 can be cited. The features are listed below.

(1) Before inserting the electronic component into the printed circuit board, the pin is corrected and cut to improve the insertion success rate.

(2) The method of detecting the through-hole position of the actually inserted printed circuit board is used to simplify the method of inputting the insertion position, and the positioning is performed with high accuracy in correspondence with the displacement of the board during insertion. This improves the insertion success rate.

(3) Make sure that the printed circuit board is held at the correct position on the table to eliminate any misalignment during insertion.

(4) A large number of cassettes for supplying electronic components can be set, which reduces the frequency of cassette replacement and reduces the size of the entire cassette to facilitate operation.

This conventional example is suitable for supplying a plurality of types of electronic components, selecting an electronic component to be inserted from among them, and inserting the electronic component at an appropriate position on the substrate at high speed. That is, the purpose is operability when supplying a large number of various types of parts,
It is to insert with a high success rate while satisfying the high speed of inserting a large number of electronic components in a fixed time.

(Problems to be Solved by the Invention) A PG having a large number of terminal pins to which the present invention is applied.
Compared to conventional DIP parts, A part (hereinafter referred to as multi-pin part) has not only a large number of pins but also a large difference in the nature of the insertion process. The differences are summarized below. become.

(1) Due to the large number of terminal pins and holes, the conditions under which all pin and hole combinations can be inserted are strict, and highly accurate alignment is required.

(2) The high-speed insertion of parts is not required so much, and since each part is very expensive, damage to the terminal pins due to failure in insertion cannot be tolerated.

(3) Since the connection structure of the terminal pins and the like is minute and is arranged at a high density on the plane, delicate technology is necessary to perform operations such as correction and position measurement on the terminal pins.

As described above, it is difficult to insert a multi-pin component due to the large number of pins, but there is a strong demand for reliable insertion. In order to insert these multi-pin parts with a high success rate, the present invention provides an insertion method and device having the following advantages.

1. Correct the terminal pin tip position of electronic parts with high accuracy. The conventional DIP type IC component has two rows of terminal pins, whereas the multi-pin component has many consecutive rows of terminal pins, so DI
The P-type IC terminal correction method cannot be applied because of spatial restrictions. Further, the pin tip position after straightening is required to have higher precision, and a method of straightening with high precision is required.

2.Measure the position of all terminal pins, and use the pin position information to calculate the optimum position for all pins and holes in the later alignment, and bend the terminal pins beyond the allowable range to confirm the correction result. Detects whether or not it remains. If there is a terminal pin having a bend exceeding the allowable range, the correction of the above 1 is performed again. For conventional DIP type IC parts, the position of the terminal pin is not measured at all, and the method is to insert it assuming that the insertion center is at the specified position with respect to the external shape of the checked part, or to measure the representative pin. I got it. However, in the case of multi-pin parts, high positioning accuracy is required, so the position measurement of the terminal pins is indispensable, and even in the case of the conventional method, in many cases the conventional method is to provide them continuously in a plane because of spatial restrictions. It is not possible to measure the terminal pins of multi-pin parts.

3. Measure the hole position, calculate the optimum alignment correction amount for all terminal pins and holes, and perform the alignment based on this. A general method of determining the insertion center based on the outer shape of the electronic component or the representative pin cannot consider the delicate positional relationship between the individual pin and the hole, and is particularly susceptible to the deviation in the rotation direction.
Further, the hole position of the board is not always in the designed position due to an error in manufacturing. Therefore, the positions of both pins and holes are measured, and the optimum alignment correction is performed for all pins and holes.

4.When you finish the alignment and insert the electronic parts into the board,
In addition, if there is a terminal pin that cannot be inserted, if it is inserted as it is, the pin will be damaged and a big trouble will occur. Therefore, in the insertion process, the insertion abnormality is detected online,
When an abnormality is detected, the insertion can be stopped and the operation from the correction of the above 1 can be redone to prevent damage to the pin. For this purpose, a method is known in which a reaction force in the insertion direction generated when a non-insertable pin contacts the substrate is known. However, in a multi-pin component, since the number of terminal pins is large, the total frictional force due to the contact of the majority of insertable pins with the hole wall surface of the substrate increases. Therefore, it cannot be distinguished from the reaction force received from the substrate by one non-insertable terminal pin.

5. If the terminal pins are not inserted in the holes of the board for some reason even after the insertion is completed, not only will the product not function even if manufacturing proceeds, but it will also take a great deal of effort to restore it. Therefore, it is necessary to confirm that the terminal pins are inserted into all the through holes from the back surface of the board after the parts are inserted. Various methods are provided for performing this post-insertion inspection on conventional electronic components. However, most of the DIP type electronic parts are inspected, and it is difficult to apply them to multi-pin parts in which a large number of terminal pins are arranged at high density.

(Means for Solving the Problems) The present invention uses the following means in order to achieve the above object.

Using a straightening tool in which strip-shaped thin plates were planted in parallel in multiple rows at the same intervals as the terminal pins of electronic parts, press this thin plate against the row of terminal pins to deform it in the direction perpendicular to the rows, and then In a straightening method in which the entire straightening portion is rotated by 90 ° to deform in a direction perpendicular to the front, first, a constant straightening amount T, which is the minimum required to accurately straighten each row of terminals, is set at the center as a boundary. In the opposite direction, then T in the opposite direction
Then, the terminal is deformed by an amount S in anticipation of the springback amount of each terminal, and a three-step straightening operation for aligning the terminals in a predetermined position is performed.

Laser spot light is emitted parallel to the row of terminals of the electronic component, and laser spot light is scanned in the direction perpendicular to the row of terminals to focus the laser light that is interrupted by each row of terminals. Then, measure the widths of the images of the overlapping terminals detected by the sensor and the intervals between them, and after all rows have been measured in one direction, rotate the electronic components 90 ° and make the same measurement in the direction perpendicular to the front. Measure the position and width of all terminal pin rows with.

In addition, by comparing the measured terminal width of each row with the row width in the case where a bendable terminal that cannot be inserted is included, it is detected whether or not there is a bendable terminal that cannot be inserted in each terminal row. If so, correct again.

Also, using the position measurement data of the tips of multiple terminals and the center of the hole, the correction amount from the reference position of the electronic component and the printed circuit board is calculated so that the sum of squares of the distance between the centers of the terminals and the hole is minimized. Align based on.

In addition, the electronic components to be inserted into the printed circuit board are inserted while applying vibration, and the vibration state is configured to be detected by the acceleration detector. Changes or detection of the amplitude of the detected waveform that occurs when there are terminals that cannot be inserted When either one of the phenomena of the higher-order vibration component included in the waveform increases, the insertion is judged to be abnormal and the insertion is stopped, and the operation from the correction is performed again.

Also, on the back side of the printed circuit board immediately below the insertion position of the electronic component, the probe pin having the same number and the same arrangement as the terminal pin, and a means for detecting the pressure when the probe pin contacts the tip of the terminal pin inserted in the through hole The inspection head having the above is provided, the probe pin is aligned with the through hole to be inspected of the printed circuit board, and the probe pin is inserted from the back side of the circuit board to inspect the presence or absence of the terminal pin.

The automatic insertion device according to the present invention is equipped with all the above-mentioned means, and is inserted into the component to be inserted continuously while correcting the terminal pin, measuring the pin position, and detecting the online insertion abnormality due to vibration, and inserting from the back side of the board. This is a configuration for performing a post inspection.

(Function) As a deformation characteristic when the correction is applied to the terminal pin, there is a characteristic that a stable springback amount cannot be obtained unless the deformation amount exceeds a certain value. When pressing a straightening tool with multiple rows of thin plates against the terminal pins for reciprocating movement,
Move the orthodontic tool according to a predetermined amount of movement so that the amount of deformation above this certain amount is invariably given to the pin,
Finally, since the three-stage straightening operation of aligning the terminals at a predetermined position is performed by deforming the springback amount of each terminal in anticipation, high pin position accuracy after straightening can be obtained.

In addition, by adopting a method of terminal measurement for all rows using a laser, it is possible to measure the positions of densely arranged terminal pins one row at a time and when the measurement width of the terminals in each row is normal. Compared with, it is possible to further enhance the safety of insertion by detecting that there is no bendable terminal that cannot be inserted.

Also, when inserting an electronic component to be inserted while vibrating, if the number of pins that cannot be inserted is the vibration characteristic of the component, the amplitude of the detected waveform will be reduced to less than half that of the normal state, and the insertion failure will occur. When the number of possible pins is as large as 10 or more, there is a characteristic that the higher-order components included in the detected waveform rapidly increase. By stopping the insertion when either the decrease of the amplitude of the vibration waveform or the increase of the higher-order vibration component appears, the insertion is not affected by the pin that is already inserted into the through hole and is in friction with the wall surface. It is possible to reliably detect and stop the insertion regardless of the number of impossible pins. Therefore, the damage of the terminal pin can be prevented and the safety of insertion can be improved.

In addition, the probe pins corresponding to the terminal pins inserted in the through holes one-to-one are inserted together from the back side of the board,
By contacting the tip of each terminal pin in the through hole and transmitting the pressure to the pressure detection means through the probe pin, it is possible to detect the presence or absence of terminal pins with a simple structure even for densely arranged terminal pins. Can be detected.

(Example) Hereinafter, the Example of this invention is described.

First, the overall configuration of a device to which the present invention is applied and its operation will be described with reference to FIG.

The electronic component 1 to be inserted is gripped by the chuck 200, and the chuck 200 is attached to the insertion head 20. The insertion head 20 moves up and down by the elevating mechanism 21 so that the electronic component 1 can be inserted into the printed circuit board 3. Further lifting mechanism
21 is mounted on a moving base 24 which can move laterally on a rail 25 and can be positioned and stopped, and is driven by a moving mechanism 26 and a motor 27 which drives it.

Immediately below the insertion head 20 at the component insertion position shown in FIG. 1, there is a substrate stage 30 that mounts the printed circuit board 3 and moves in two directions at right angles, and all electronic components are placed in predetermined insertion holes of the printed circuit board. Move so that it can be inserted and stop positioning.

Reference numeral 31 is a television camera that captures the through hole 4 provided in the printed circuit board 3, and its image is enlarged and displayed on the monitor television 32. Further, reference numerals 204 and 205 denote a light projecting portion and a light receiving portion of a terminal pin measuring device using a laser beam. The laser scanning device laterally attaches to the terminal pin 2 of the electronic component 1 held by the chuck 200 of the insertion head 20 immediately above the component insertion position. It is in a position where light can be emitted. The television camera 31 and the light emitting / receiving sections 204 and 205 of the laser measuring machine are fixed by a gantry structure (not shown).

A correction unit 35 is arranged adjacent to the substrate stage 30, and the electronic component 1 that has been corrected by the correction unit 35 is carried to a component insertion position on the substrate stage 30 by an insertion head 20 moving on a rail 25. Rail 25, substrate stage 30, and correction unit 35
Are fixed on the same base plate 36.

A post-insertion inspection unit 37 is provided below the substrate stage 30 and directly below the component insertion position, and is supported and fixed by a method not shown. 38 is an operation panel and 39 is a control unit.

FIG. 2 shows an electronic component inserting process flow by the device of the present invention, and the inserting method will be described below with reference to this diagram and FIG. Assuming that the printed circuit board has already been set on the substrate stage 30, the electronic component 1 is first manually supplied to the correction unit 35 to manually correct all the terminal pins in the insertion process of one electronic component ( 1002,1004). Next, the corrected electronic component 1 is conveyed to the component insertion position by the insertion head 20 and lowered to a predetermined height, and the terminal pin position is measured by the laser measuring machines 204 and 205 (1006). As a result, if the bending width is detected with the row width measurement value exceeding the allowable range, straightening is repeated again (1008). Next, the hole position of the printed circuit board 3 is measured using the image projected on the monitor TV 23 by the TV camera 31, and the position correction amount is calculated and the position is adjusted based on this and the measurement result of the pin position ( Ten
10,1012). Then, the electronic component 1 is inserted into the printed circuit board 3 while detecting the insertion abnormality due to the vibration, and finally the inspection is performed after the insertion and the processing is finished (1014, 1016, 1018). If an abnormality is detected by the detection of insertion abnormality due to vibration at the time of insertion and the inspection after the last insertion in the process, it is appropriate to notify the operator by the display that it has ended abnormally and start over from the beginning. Take appropriate action (1020).

 FIG. 3 is a diagram showing the configuration of the control unit of this embodiment.

Personal computer (hereinafter referred to as personal computer) 50
Is the laser measuring machine control unit 65 and the post-insertion inspection circuit 51.
Are directly connected to each other, and perform the data acquisition control and the post-insertion inspection determination process related to the terminal pin position measurement. Further, the personal computer 50 gives a movement command to each motor through the sequencer 52 to cause each mechanism to perform a predetermined operation. 53 and 55 are motor drivers for the substrate stage 30, 54 and 56 are substrate stages X and Y
The motors for each axis are shown, and the stop positions of the substrate stage in each direction are measured by counters 57 and 58 and fed back to the personal computer 50. Reference numerals 59 and 60 denote other motors and drivers provided in the present apparatus, both of which are driven through operation control of the sequencer 52 based on commands from the personal computer 50. The image of the through hole on the printed circuit board captured by the camera 31 is displayed on the monitor television 32. A portion 61 surrounded by a dotted line represents a worker, and the worker 61 uses the joystick 62 to position the printed circuit board on the substrate stage until the through hole image projected on the monitor TV 32 is located at the center of the screen. Adjust. Then, when the through hole image coincides with the center of the screen, the hole data capturing button 64 is pressed to capture the moving stage position in the personal computer 50 at that time.

The personal computer 18 calculates a correction amount for aligning the electronic component 1 and the printed circuit board 3 based on the measurement data of the terminal pin by the laser measuring machine 19 and the measurement result of the hole position by the counters 57, 58 in the X and Y2 directions. I do.

Also, a series of operation commands according to the insertion process flow described above is also performed by the personal computer 50, but the operator can operate the switch box 63 to issue a command such as interruption or change of operation as necessary. it can.

Next, the mechanism of the terminal correction portion will be described with reference to FIG. On the upper surface of the straightening tool 150, strip-shaped thin plates 151 (hereinafter referred to as blades) are provided in parallel at the same intervals as the pitch of the terminal pins, the number of which is one more than the number of terminal rows. The straightening tool 150 has a moving mechanism 15 driven by a motor 152.
By means of 3, a translational motion is performed in a direction perpendicular to the blade with a driving force capable of deforming all the terminal pins, and the entire drive mechanism can be rotated exactly 90 ° by a rotary table 154. There is an opening 156 for setting an electronic component in the center of a plate 155 arranged so as to cover the correction tool 150, and a plate 157 for contacting and supporting the bottom surface of the electronic component is provided at the lower four corners of the opening. When the component is straightened, this plate 156 and the two fixing claws 15 which are opened and closed by a mechanism not shown in the figure.
Firmly held by 8,159. The plate 155 is held by a pair of guide mechanisms 160 and 161 so as to be slidable up and down, and a vertical mechanism 163 driven by a cylinder 162 can have two vertical heights.

In the terminal straightening procedure, the electronic component is manually set in the opening 156 at the upper position of the plate 155 and the fixing claws 158 and 159 are operated to fix the electronic component. Next, the plate 155 is lowered to the lower position so that the tip of the terminal pin is placed substantially in the center between the blades and the motor 152 is driven to give each terminal a deforming operation.
Then return the plate 155 to the upper position and move the straightening tool 90 °.
It is rotated and a deforming motion is given in the direction perpendicular to the front to finish the correction.

The fifth is the movement of the blade 151 and the deformation of the terminal pin.
It is the figure seen from the direction parallel to the row of terminal pins.
(A) shows a state in which the terminal pin is put in substantially the center of the blade. The correction tool 150 is moved leftward to deform the terminal pin leftward, as shown in FIG. Terminal pin 16
The blade 166 contacts the blade 4. When the terminal pin is deformed to the right, the correction tool 150 is moved to the right, and the blade 167 on the left side is brought into contact with the pin 164 to deform it.

Fig. 6 shows the deforming motion applied to the terminal pin when the correction is applied in one direction. First, the terminal pin is deformed to the left by T (motion), then from the initial position to T to the right. A deformation is given (motion), and finally, a deformation of S is given to the left. The deformation amounts T and S are fixed amounts determined from the deformation characteristics of the terminal pin described below.

FIG. 7 is a diagram showing the deformation characteristics of one terminal pin, where the horizontal axis represents the maximum deformation amount given to the terminal pin and the vertical axis represents the permanent deformation amount left after unloading and restoration. Theoretically, as indicated by the solid line, permanent deformation does not occur until the applied deformation amount reaches A. However, the actual terminal pin already undergoes permanent deformation before reaching the deformation amount A as shown by the dot, and the deformation amount B coincides with the theoretical straight line. Since the deformation behavior of the terminal pin is unstable in the region deviating from the theoretical straight line, it is necessary to give the deformation of B or more in order to obtain a constant permanent deformation amount. FIG. 8 shows the situation when this deformation characteristic is applied to the correction operation of FIG. First, the deformation amount S for aligning the pins in the center is equal to A in FIG. In the second operation in which the amount of deformation applied to the terminal pin is the largest, the pin tip movement amount at this time must be greater than or equal to B in FIG. 7 to enter the stable deformation area, so the positions of the terminal pins are aligned at the end of the operation. Absent. Considering that the tip of the terminal pin is at the position of the dotted line in the figure at the start of the operation due to spring back, the deformation amount T is obtained by the following equation.

2T = A + B …………………… (1) Therefore, in the straightening operation of giving three-step deformation to the terminal pins shown in FIG. 8, if the swing amount T to both sides is the amount obtained by the equation (2), all the terminal pins have a stable return amount. Since it is deformed by, it is possible to finally correct with high positional accuracy.

Next, the measurement of the terminal pin using laser light will be described. FIG. 9 shows its basic configuration. Electronic component 1
Is gripped by the chuck 200, and the chuck 200 is attached to the insertion head (not shown), and can rotate in the plane by the drive motor and the guide mechanism (not shown) and can be stopped in any direction, and the vertical insertion operation is possible at the same time. You can now stop at any height.

When the electronic component 1 is located right above the insertion position on the printed circuit board 201, the light emitting unit 204 and the light receiving unit 205 of the measuring instrument using the laser are so high that the tip of the terminal pin is irradiated with the laser light 212. The widths and center positions of the overlapping images of the terminal pins 2 arranged in rows, which will be described later in detail, can be measured. A frame 206 is fixed in front of the laser light receiving portion 205, and a slide box 208 having a dummy pin 207 having a pin width larger than the terminal pin 2 is mounted inside the frame 206 by driving a stepping motor 210 to slide a guide 209. Move up in the X direction. Further, this slide box 208 is provided with a shutter 211, and a part of the laser light emitted from the laser projector 204 is partially transferred to this shutter 2.
By completely blocking with 11, the measurement range of the laser beam 212 to the photodetector 205 can be adjusted.

Next, the measurement principle of this measurement method will be described with reference to FIG. The laser projector 204 and the light receiver 205 have the following structure. A laser 212 oscillated from a laser oscillator 213 is incident on a polygon mirror 214 attached to a motor 215 that rotates at a constant speed, and is further reflected toward a convex lens 216 positioned so that the polygon mirror 214 is in focus. The convex lens 216 has a function of converting the laser beam 212 into parallel rays, and then converts the laser rays 212 into parallel rays.
The light receiving element 218 causes the light to be collected again at one point by the 217 and the amplifier 21
The intensity as output voltage is detected via 9. At this time, if there is an object 220 that blocks the laser light between the convex lens 216 and the condenser lens 217 and a shadow is generated, the output voltage drops. Therefore, by measuring the time during which the voltage drops, the size of the object blocking the laser light can be known from the rotation speed of the polygon mirror 214. Accordingly, when the terminal pins 2 arranged in a row are placed so that the tip portions thereof are exposed to the laser scanning light, the laser light
Since 212 is interrupted by the pin and the light or dark part is intermittent, the dimensions a, b, and c shown in FIG. 11 can be measured by measuring the duration of this light or dark. . First
FIG. 2 is a schematic diagram when the terminal pin 2 on the electronic component 1 is irradiated with laser light from above in the drawing. Laser measuring device 204,
205 measures the dimensions S _{1 to} S ₅ of the shaded portion and the dimensions l _{1 to} l ₆ of the bright portion shown in FIG. The shadow dimensions S _{1 to} S ₅ are the width of the pin row, and if the center position of the pin row is at the center of the row width, it can be calculated in combination with the pin row spacing dimensions l _{1 to} l _6. it can. When the arrangement of the terminal pin rows is not parallel to the laser scanning light, the value of the width of the terminal pin rows is increased or decreased by rotating the electronic component 1 by a small amount using the rotating mechanism of the insertion head. By utilizing this fact to find the orientation of the component that minimizes the width of each terminal pin row, the virtual lattice formed by the tips of the terminal pins can be made parallel to the laser light direction. When aligning with the substrate, which will be described later, if the electronic component is placed in this state, the rotation correction caused by the terminal pin can be omitted. After the measurement of all rows of pins in one direction is completed by the above method, the electronic component 1 is rotated by 90 ° and the same measurement is performed in the direction perpendicular to the above. The width can be measured.

It is desirable to obtain data for all columns in the measurement in each direction, but in some cases it is possible to measure the columns in proportion. The collection of these measured values, the calculation processing of the measurement results, the rotation operation of the insertion head, etc. are automatically performed by the personal computer.

When the number of terminal pins 2 is very large as in the electronic component 1 performed in this embodiment, a large number of bright or dark portions of the terminal pin row due to laser light are obtained as shown in FIG. on the other hand,
For example, only a few points ahead of the light or dark portions that are intermittent from the measurement limits of the laser measuring machines 204 and 205 can be accepted.
Therefore, when the terminal pin 2 is measured by the above-mentioned method, the shutter 211 does not work for the laser beam 212 of the terminal row for which the measurement has been completed.
Moves on the slide guide 209 so as to block the laser beam 212 and prevent the laser beam 212 from being focused on the light receiving unit 205 of the measuring instrument. Therefore, the movement of the shutter 211 can always limit the terminal row to be measured to the adjacent portion of the shutter 211. In this way, the shutter 211
Can be moved, the width and center position of the terminal pin can be measured even with an electronic component having a very large number of terminal pins as used in this embodiment.

In the terminal pin measuring method using laser light based on the above-described principle, there is a limit to the minimum measurable terminal pin diameter. This countermeasure will be described below. As shown in FIG. 13, when the laser beam 212 continuously scans the terminal pin 2, in the relationship between the time and the laser beam amount (intensity), the voltage value of the threshold level set based on the standard voltage value E _o. Let E _h be the time width Δt when the amount of laser light is smaller than this, so that the width of the terminal pin 2 can be measured from the relationship of the rotation speed of the polygon mirror 214. However, when the width of the terminal pin 2 of the target component of this embodiment is smaller than the laser beam diameter, even if the laser beam 212 scans the terminal pin 2 as shown in FIG.
_The time width below _h cannot be detected. Therefore, it becomes impossible to recognize the width of the terminal pin 2 at this time.

Therefore, next, a method for measuring a terminal pin having a pin width smaller than the laser beam diameter using a dummy pin 207 having a pin width larger than the terminal pin 2 fixed to the slide box 208 will be described in detail below.

When measuring the terminal pin row by the laser measuring machine 204, 205, first move the position of the dummy pin 207 on the slide box 208 by the driving force of the stepping motor 210,
The terminal pin 2 and the dummy pin 207 as shown in FIG. 15 are placed in such a positional relationship that they partially overlap with each other in the laser projection direction. In this state, laser light is emitted from the measuring device projecting unit 204, and the combined width A of the terminal pin 2 and the dummy pin 207, which partially overlap, is obtained and stored. Here, the width of the terminal pin 2 is d and the width of the dummy pin 207 is D. Next, the stepping motor 210 is operated again to move the dummy pin 207 in parallel with the dummy pin 207 width D in the X direction perpendicular to the laser beam 212 as shown in FIG. Part of them overlaps with the laser beam projection direction. Then, as in the previous case, the combined width B of the terminal pin 2 and the dummy pin 207 is obtained and stored.

The widths A and B of the terminal pin 2 and the dummy pin 207, which partially overlap with each other in the laser projection direction, are A = B + 2D + (f + g) because A = D + f and B = D + g, respectively.

Therefore, f + g = A + B-2D holds, while the width d of the terminal pin 2 can be said to be d = f + g, so the width d of the terminal pin 2 becomes d = A + B-2D. That is, the width of the terminal pin partially overlaps with the laser projection direction.
It is possible to calculate it by a simple calculation based on the two combined widths of the dummy pin 207 and the width of the dummy pin 207 known in advance.

Also, as is clear from the measurement principle of this laser measuring machine, if even one terminal pin that has a bend that cannot be inserted into the through hole of the board is included in the terminal pin row to be measured, The measurement result of that row shows a large value.
The upper limit of the measured value of a column that contains only insertable terminal pins
S _a , the amount of deviation from the maximum allowed reference position for each terminal pin
d _a is the non-insertable terminal pin as shown in Fig. 17.
The width of the column containing 213 is Get bigger. Therefore, by determining the judgment value S _h in consideration of the row width when this bendable terminal that cannot be inserted is included and comparing the width measurement result of each row with this, the presence or absence of non-insertable terminal pins is determined. Can be detected in advance.

FIG. 18 shows a method of obtaining the deviation from the reference position of the pin-shaped virtual lattice from the measurement result of the terminal pin thus obtained. When the amount of the center of each row obtained in the above-described method are separated from one should position originally and d ₁ to d _5, the deviation amount of the virtual lattice seeking is calculated as dx and the average this. Similarly for the y direction, dy is calculated as the shift amount.

Next, with reference to FIG. 19, the positional relationship between the hole position and the electronic component during camera measurement will be described. H _{1 to} H ₄ indicate four corner holes which are representative holes, and their coordinates are obtained by measurement with a camera. C ₁ , C ₂
Indicates the distance between the center of rotation of the camera and the insertion head, which needs to be measured once during the device adjustment stage. Once measured, it can be used as it is as a constant. dx, dy
Is the measurement result of the terminal pin described above, is the amount of deviation from the reference position of the grid formed by the pin, S is the dimension of the design position of the four corner pins, which is the substrate in the correction amount calculation by the least squares described below. This is a dimension for generating the coordinates of the virtual four corner pins P _{1 to} P ₄ of the target that approach the holes H _{1 to} H ₄ . With this S, P _{1 to} P ₄ are calculated as follows.

_{P 1 = (C 1, C} 2) + (dx, dy) + (- S, S) P 2 = (C 1, C 2) + (dx, dy) + (- S, -S) P 3 = (C ₁ , C ₂ ) + (dx, dy) + (S, −S) P ₄ ＝ (C ₁ , C ₂ ) + (dx, dy) + (S, S) FIG. 20 shows correction by least squares. In the figure showing the concept of the movement amount calculation method, the i-th pin of n pins is Pi, the i-th hole corresponding to it is H _i, and the xy coordinates of each are Pi ₁ , P _i
Let i ₂ , hi ₁ and hi ₂ . The board is corrected and moved by ΔX and ΔY and the component is moved by Δθ so that the sum of squares of all combinations of the distances between the corresponding pins and holes is minimized. The amounts of movement ΔX, ΔY, Δθ can be calculated simply by giving the position coordinates of the pin and the hole, and the calculation formulas are given below.

Δθ in the expressions (3) and (4) is calculated by substituting the result of the expression (5). By performing the alignment correction by the least squares method, it is possible to obtain the optimum positions for all the pins and holes which are the objects of calculation. In the present embodiment, this calculation is applied to the position information of the terminal pin array based on the measurement results of all columns and the coordinates of the four holes measured by the four corner holes to align the components and the board.

FIG. 21 shows a configuration for detecting an insertion abnormality online during the insertion process. Electronic component 1 is 200
The insertion head 20 is constituted by the chuck 200, a rotation mechanism 401 that is rotatable in the horizontal plane and can be positioned and stopped in an arbitrary direction, a mechanism for detecting vibration described below, and the like. The rotating mechanism 401 is further provided with two leaf springs 40 on top.
2,403, which are connected to a parallel leaf spring mechanism constituted by a rod 404 connecting the centers thereof, and these parts including electronic parts constitute a vibrating part capable of vertically vibrating with the support frame 405 as a base. A vibrating device 406 is attached to the uppermost end of the vibrating section, and can vibrate the vibrating section at the amplitude and frequency adjusted by the oscillator 407 and the power amplifier 408. An acceleration detector 409 is further attached to the vibrating section to convert the vibration into an electric signal, and this output passes through the amplifier 410 and is sent to the signal analyzer 411. The signal analyzer 411 detects whether or not an insertion abnormality has occurred due to a vibration state, which will be described later, and if there is an abnormality, outputs an abnormality signal to the overall control system.

In the electronic component insertion procedure, the head 20 is lowered to a height at which the terminal pins 1 reach just before the substrate 3 when the positioning of the components is completed. Then, the vibration device 406 and the signal analyzer 411
Is operated to check whether or not the insertion abnormality has occurred, and a small amount of the head 20 is repeatedly dropped to perform the insertion. If an insertion abnormality is detected at this time, the head 20 is stopped from falling and the operator is informed and necessary measures are taken. The amplitude and frequency of the vibrating device are adjusted in advance according to the principle to be described later so that the characteristic of abnormal insertion detection can be best shown. When the head is lowered to a predetermined height where the terminal pin 2 completely enters the printed circuit board 3, the insertion is completed, the electronic parts are released, and the next operation is started.

Next, the principle of detecting the insertion abnormality due to this vibration will be described. FIG. 22 is a view showing a cross section of the vibrating part, and the insertion part 1
Letting m be the weight of the vibrating part including, and k be the longitudinal elasticity (spring constant) of the vibrating part by the leaf springs 402 and 403, the natural frequency f ₀ of the vibrating part is Is required. The amplitude of the vibrating portion when vibrating while changing the frequency becomes maximum when vibrating at the frequency f ₀ , and sharply decreases at frequencies before and after that. This state is shown in FIG. 23, in which the actual measurement data by the actual insertion part is shown, and the horizontal axis shows the vibration frequency and the vertical axis shows the amplitude of acceleration. The case of being insertable is a case where there is no terminal pin of the electronic component 1 attached to the lower end of the vibrating part that comes into contact with the printed circuit board 3 to generate a large reaction force, and the maximum frequency at that time is It matches with f ₀ in equation (6). However, when one or more non-insertable terminal pins exist, the pins themselves have elasticity and come into contact with the vibrating portion, so the natural frequency of the vibrating portion increases, and thus the non-insertable terminal pin comes into contact. The amplitude of the vibrating part excited by the previous natural frequency decreases. An abnormal insertion of the electronic component can be detected by detecting a decrease in the amplitude when the non-insertable terminal pin comes into contact with the substrate when vibrating at the natural frequency f ₀ before insertion.

Further, FIG. 24 is a diagram obtained by frequency analysis of vibration waveforms in the case where insertion is possible and in the case where insertion is not possible. The horizontal axis represents frequency, and the vertical axis represents intensity of each frequency component included in the vibration waveform. In the case of insertable (a), the peak appears only in a very limited range close to the excitation frequency f ₀ , whereas in the case of non-insertable (b), the peak appears in a high range up to a high frequency region. Appears. The number of terminal pins that cannot be inserted in this tendency
It becomes especially remarkable when the number is 10 or more. Therefore, if the increase in the higher-order vibration component at the time of insertion abnormality and the decrease in amplitude described above are detected at the same time, and if either one of them appears, it is detected as insertion abnormality. It can be carried out.

FIG. 25 is a diagram showing the configuration and operation principle of the signal analyzer 411, and the input to the terminal 414 is the amplifier 4 of the acceleration detector.
The output signal of 11 is the waveform shown in FIG. The input signal is first-stage amplified at 415 (waveform b), and is branched to the harmonic detection unit and the amplitude reduction detection unit. In the harmonic detection unit, first, the high-pass filter 416 cuts off frequency components below 500 Hz that are not to be detected, and the low-pass filter 417 shapes the waveform. The waveform after the above processing is c, which is a signal containing only high-order components. This is amplified and rectified by 418, and the magnitude of the high-order component included in the input signal is converted into the magnitude of the DC voltage value. The determiner 419 outputs an abnormal signal to the logical adder 423 when the detected voltage is higher than the determination threshold value shown by the dotted line of d. In the amplitude phenomenon detector, the signal b is fed to the low-pass filter 42.
The unnecessary higher-order component is cut to 0 and the magnitude of the signal e after passing through the amplifier 421 and the threshold value shown by the dotted line is judged by the judging device 42.
Compare using 2. This is performed by a method of outputting an abnormal signal for a certain period of time to the adder 423 if the peaks or troughs of the signal waveform exceed the determination threshold even for a small amount. The adder 423 outputs a signal to the overall control unit when it receives an abnormal signal of either harmonic increase or amplitude decrease. By configuring the signal analyzer with such an analog circuit, it is possible to detect both the amplitude decrease and the harmonic increase at the time of abnormal insertion with a small delay time.

Next, the configuration of the post-insertion inspection unit will be described with reference to 26th. The probe pins 501 are arranged on the upper surface of the inspection head 500 in the same number and the same arrangement as the terminal pins of the electronic component.
Although not shown in the drawing, 0 has means for detecting a pressure at which the probe pin 501 contacts a terminal pin inserted in the printed circuit board 3 and converting the pressure into electrical conduction. Immediately below the inspection head is a circuit board 502 that detects this electrical continuity.
Is placed and connected to the inspection head pressure-sensitive section by a method described later. The entire inspection head is moved up and down by the guide mechanism 503 and the cylinder 504, and at the elevated position, the height is adjusted so that the probe pin 501 comes into contact with the tip of the terminal pin in the substrate 3. Further, the guide 503 and the cylinder 504 are driven by three motors 505, 506 and 507, and are fixed to a fine movement plate 508 which is slidably supported front and back and left and right by four slide mounts 570. The fine movement mechanism positions the probe pin 501 of the inspection head 500 so that it can be inserted into the through hole of the substrate from the back side.

The operation procedure of the post-insertion inspection unit starts from the time when the electronic component is completely inserted into the board, and first, based on the position correction data when the electronic component and the board are aligned, the three motors 505, 506, 507 are operated. The amount of movement is calculated with a personal computer, and the motor is rotated and the inspection head is aligned. Then cylinder 50
4 is raised to insert the probe pin 501 into the through hole, and the detection circuit 502 is operated based on a command from the person to perform an inspection. Cylinder after inspection or when performing other work
504 is lowered to prevent interference with the substrate stage 30.

To describe the fine movement mechanism in FIG. 26 in more detail, a square block 509 shown in FIG. 27 is attached to the back surface of the fine movement plate 508, and three rollers 510,
511 and 512 are provided. Each roller is fixed to a screw shaft 513, and the screw shaft 513 is a mechanism driven by a motor 505 via gears 514 and 515. The movement amount of each axis is x,
If y ₁ and y ₂ are set, when the fine movement mechanism is driven in the X direction in the figure, only the motor 505 is rotated and moved by -x. When driving in the Y direction, the motors 511 and 512 are rotated by the same amount and moved by y ₁ = y ₂ . When rotating the fine movement mechanism, the motors 511 and 512 are driven in opposite directions while the motor 505 is stopped. The movement amounts y ₁ and y ₂ at this time are the fine rotation angle θ and the roller 51
If the distance between 1,512 is l, If the movement is performed in accordance with the equation (7), it is possible to perform fine rotational fine movement with high accuracy. It is not necessary to make the operating range of the fine movement mechanism in each of the X, Y and rotation directions so large. The reason is that the insertion of the electronic component into the substrate and the subsequent post-insertion inspection performed at the same position are performed at the same position. Therefore, if the position of the post-insertion inspection unit is set to the insertion position in advance, the operating range of the fine movement mechanism is the electronic component or the substrate. This is because it is sufficient to deal with the dimensional error of.

 Next, the structure of the post-insertion inspection head will be described.

FIG. 28 is a perspective sectional view showing the structure of the detection head unit. The terminal pin 2 of the electronic component 1 and the probe pin 501 supported by the guide 516 are formed at the respective positions corresponding to the terminal pin 2 and the push block 517 is provided immediately below the probe pin 501.
There is. Further, the electrode plates 518, 519 and the pressure conductive sheet 520 are arranged in close contact with the guide 516. A flexible substrate having electrodes 521, 522 formed at positions corresponding to the terminal pins is used as the electric plates 518, 519, and the electrode plate 521 is provided with a projection-shaped post 535 for the purpose described later.

The terminal pin 2 of the electronic component 1 is inserted into the through hole of the substrate 3. At this time, if each terminal pin is completely inserted in the through hole, the probe pin 501 of the inspection head unit 500 is pushed, and this force is applied through the pushing block 517 to the electrode plates 518,5.
It is transmitted to the pressure conductive sheet 520 sandwiched between 19 and both. Since the pressure transmission sheet 520 has a characteristic that the electric resistance of the portion rapidly decreases when a force of a certain value or more is applied, and therefore when the pressure applied by the probe pin 501 is applied, the corresponding electrodes 521, 522 are formed. It is possible to detect the success and the successful insertion of the electronic component 1 into the substrate 3.

As an example of the detection method using conduction, as shown in FIG. 29 (a), a flexible conductive sheet 524 closely arranged on the back surface of the substrate and a terminal pin 532 of the electronic component 531 are supported. An insulating sheet 526 having an opening 525 at a position, electrodes 529 individually arranged at positions corresponding to the opening 525 of the insulating sheet 526, an insulating sheet 523, an insulating plate 528, and a detection circuit 5
When the terminal pin 532 of the electronic component 531 is inserted into a predetermined insertion hole of the printed board 534, the conductive sheet 524 is pressed down by the terminal pin 532 and deformed downward as shown in FIG. 29 (b). Then, the deformed portion comes into contact with the individual electrode 529 thereunder through the opening 525 of the insulating sheet 526 to complete circuit continuity, and it is detected that the terminal pin 532 has been inserted into the insertion hole to a predetermined position. Something is confirmed by circuit 530.

In this detection method, it is effective in the case of an electronic component in which the tip of the terminal pin 532 is flat, but an electronic component in which the tip of the terminal pin is sharp (for example, V-cut) is used for the purpose of improving the insertion rate. There is a possibility that the insulating sheet may be damaged and the application is limited. Further, since the conductive sheet is bent by the terminal pin and comes into contact with the electrode through the narrow opening, a force sufficient to bring the conductive sheet into contact with the electrode is applied to the terminal pin, and therefore a book with a small terminal pin diameter is used. The terminal pins of the subject parts of the invention may be bent.

The present embodiment has an apparatus configuration that can deal with the above problems.

The probe pin 501 shown in FIG. 30 contacts the terminal pin 2 of the electronic component 1 and transmits the pressing force to the pressing block 517. The pressing block 517 further prevents the electrode plate 518 from being damaged by the probe pin 501 and disperses the pressing force into an averaged force to transmit it to the pressing conductive sheet 520.

Electrode patterns shown in FIGS. 32 (a) and 32 (b) are formed on the electrode plates 518 and 519, respectively, on the surface facing the pressure conductive sheet 520. For electrode plate 518, probe pin 5
A post 535 is formed to prevent the pressure conductive sheet 520 from being pressed by its own weight of 01 to prevent this.

Therefore, as shown in FIG. 31 (a), when the terminal pin 2 is smoothly inserted into the insertion hole, the terminal pin 2 becomes the probe pin 501.
Is pressed downwards, the pressure conductive sheet 520 is pressed, and the vicinity of the pressure is changed from the insulating state to the conductive state.
It can be detected that the insertion of the electronic component 1 in which the conduction between the 1,522 is completed is successful. However, as shown in FIG. 31 (b), when the terminal pin 2a of the electronic component 1 is not inserted into the insertion hole and is bent, the probe pin 501 does not descend and the pressure conductive sheet 520 is not pressed. The conduction between the electrodes 521 and 522 is not completed and it is detected that the insertion is defective.

FIG. 33 shows a conduction path formed through the pressure conductive rubber 520 when all the terminal pins are inserted. The upper electrode 518 is shown in a complete line, the lower diameter 519 is shown in a broken line, and a resistance symbol is shown to show that the pressure conductive rubber is short-circuited by the pressure from the terminal pin. Since the upper and lower electrodes 518 and 519 are connected in a pattern of two staggered patterns, a horizontal one-row conduction path is formed when pressure is applied by all the terminal pins, and electrodes 519 ′,
There is conduction between terminals X ₁ and Y connected to 519 ″. However, if there is any terminal not inserted in this horizontal line, the corresponding electrodes will be insulated. Therefore, insulation is provided between terminals X ₁ and Y. Therefore, with the electronic components inserted and all probe pins inserted into the board holes, terminals X ₁ and
By checking the conduction state between X ₂ , ..., It is possible to check whether or not the electronic component includes a defective insertion pin.

Next, the connection structure of the detection head unit and the detection circuit unit in the post-insertion inspection device will be described.

Conduction determination between the electrodes in the detection head unit 500,
It is conducted by being guided to a detection circuit through a signal cable connected to the electrodes 521 and 522. In that case, if the number of terminal pins 2 of the electronic component 1 is large, the number of signal cables will also increase significantly, and in the case of the target component of the present invention, several tens of signal cables are required. When the number of signal cables increases in this way, the method of extracting the wiring from the detection head unit 500 becomes a problem. In this case, the signal cable moves up and down the detection head 500 and the substrate stage 3
It is necessary to be completely protected in the movement of 0, and it is not preferable to keep a large number of signal cables for a long time in view of stability of detection against noise and the like.

FIG. 34 shows a cross section of an apparatus in which a detection head unit and a detection circuit unit according to the present invention are integrated. In Fig. 34, the guide
The pressure conductive sheet 520 and two flexible substrates 518 and 519 (electrode plates) sandwiching the pressure conductive sheet 520 are housed between the plate 516 and the plate 536 to form the detection head unit 500. The detection circuit unit 540 is arranged immediately below the detection head unit 500. The flexible boards 518 and 519 are provided with wiring lead-out portions 537 and 538 having a wiring pattern extending from the periphery to form a cable shape, and are bent downward to detect the detection circuit boards 541 and 54, respectively.
It is connected to the board connectors 542, 542 'provided on the 1'. The cable that connects the detection circuit board 539, 541, 541 'to the outside is the base on which the detection head unit 500 and the detection circuit unit 540 are mounted.
It is guided downward through a small hole 544 in 543. Detection head section 50
0 and the detection circuit unit 540 vertically move the guide unit 545 arranged below the base 543 by the lifting mechanism 547 including the cylinder 546. The wiring lead-out portions 537, 538 from the flexible boards 518, 519 are protected by a cover 548 mounted around the base 543 and are not exposed to the outside.

FIG. 35 is a diagram showing a circuit configuration of the detection circuit unit 540, and 549 is a pressure conductive sheet 520 and electrodes 52 of the flexible substrates 518 and 519.
A switch group composed of 1,522 is shown. The analog multiplexer 550 (MX-1 to MX-8) is the input signal
Depending on the combination of A, B and C, the analog input signal (+ V) to the X terminal is transmitted to any one terminal of X _{1 to} X ₉ .
The digital multiplexer 551 (DMX) selects one of a plurality of analog multiplexers 550 that operates, or one of the analog multiplexers 550, by the signal I. The above-mentioned switching unit corresponds to the serial conductive path formed by the electrodes 521 and 522 of the flexible substrates 518 and 519 and the pressure conductive sheet 549, and selects a conductive path to be inspected from these.

The conduction state of the conduction path selected by the analog multiplexer 550 is amplified and output by the inverting circuit 552 and the transistor 553. When such a circuit is used, the number of signal cables to the outside is reduced to several.

(Effects of the Invention) As described in detail above, according to the present invention, all of the terminal pins continuously arranged on the plane of a multi-pin component can be collectively corrected with high precision, and Since all terminal pins can be collectively measured by laser for each row, it is possible to perform alignment based on the position of all terminal pins and to detect terminal pins that are bent beyond the permissible range. The alignment correction amount is calculated in consideration of the positional relationship between the pins and the board, so that the alignment can be performed with higher accuracy, and an insertion error is detected online when a multi-pin component is inserted into the board. It is possible to prevent possible damage to the terminal pins, and after inserting the multi-pin component, it is confirmed that all the terminal pins are inserted into the through holes from the back side of the board, so proceed to the next step with defective insertion. Do Since it is possible to prevent this, there is an effect of improving the efficiency of the process due to the increased success rate in the process of inserting an electronic component having such a large number of terminal pins into the printed circuit board and improving the safety of the product and the component itself. .

[Brief description of drawings]

FIG. 1 is an overall configuration diagram of an embodiment of the present invention, FIG. 2 is a flow chart of an electronic component inserting process by the device of the present invention, FIG. 3 is a diagram showing a control unit configuration in an embodiment of the present invention, and FIG. Is a perspective view showing the mechanism of the terminal correction unit, FIGS. 5 (a) and 5 (b) are diagrams showing movement of the blade and deformation of the terminal pin, and FIG. 6 is a diagram showing deformation operation given to the terminal pin, FIG. 7 is a diagram showing the deformation characteristic of one terminal pin, FIG. 8 is a diagram showing the deformation characteristic shown in FIG. 7 when it is applied to the correction operation of FIG. 6, and FIG. A perspective view showing the basic configuration of the terminal pin measurement used, FIG. 10 is a conceptual diagram showing the measurement principle in the terminal pin measurement, FIG. 11 is a perspective view when the terminal pin is measured with laser light, and FIG. 12 is Top view showing the measurement state of the terminal pin by laser light, FIG. 13 (a), (b), FIG. 14 (a),
(B) is a schematic diagram of scanning the terminal pin with laser light and a graph showing the relationship between the laser light quantity and time at that time, FIGS. 15 and 16 are explanatory diagrams of the measuring method, and FIG. 17 is a non-insertable terminal. FIG. 18 is a diagram showing a terminal pin row in the case of including pins, FIG. 18 is a diagram for explaining a method for obtaining the deviation of the terminal pin from the reference position, and FIG. 19 is a positional relationship between hole positions and electronic parts during camera measurement. Fig. 20 is a diagram showing the concept of the correction movement amount calculation method by least squares, Fig. 21 is a perspective view showing a configuration for performing online insertion abnormality detection, and Fig. 22 is a cross section of the vibrating part. Figures and 23 are graphs showing the vibration frequency and the acceleration amplitude of the head at that time with and without insertion. Figures 24 (a) and (b) show the cases with and without insertion. Fig. 25 is a frequency analysis diagram of the vibration waveform of Fig. 25. Fig. 25 is a diagram showing the configuration and operating principle of the signal analyzer. FIG. 26 is a perspective view showing the configuration of the inspection unit after insertion, FIG. 27 is a schematic view showing the fine movement mechanism, and FIG.
The figure shows a partial cross-sectional perspective view of the detection head, Fig. 29 (a),
(B) is a cross-sectional view of an example of an inspection device using continuity, FIG. 30,
FIGS. 31 (a) and 31 (b) are sectional views of the inspection head according to this embodiment, FIGS. 32 (a) and 32 (b) are electrode pattern diagrams on a flexible substrate, and FIG. 33 is a configuration at the time of inspecting all terminal pins. FIG. 34 is a perspective view showing a conduction path to be formed, FIG. 34 is a vertical sectional view of a portion accommodating an inspection head portion and a detection circuit according to the present invention, FIG. 35 is a circuit configuration diagram of the detection circuit portion, and FIG. 36 is this embodiment. 3A and 3B are a bottom view and a side view of the electronic component used in FIG. 1 ... Electronic parts, 2 ... Terminal pins, 3 ... Substrate, 20 ...
Insertion head, 27 ... Motor, 30 ... Substrate stage, 31 ...
… TV camera, 32… Monitor TV, 35… Correction department,
37 …… Inspection section after insertion, 150 …… Correcting tool, 151 …… Blade, 204 …… Laser measuring machine light emitting section, 205 …… Laser measuring machine light receiving section, 207 …… Dummy pin, 211 …… Shutter, 214 …… Polygon mirror, 401 …… Rotating mechanism, 402,40
3 ... Wave spring, 406 ... Exciter, 407 ... Oscillator, 409 ...
… Accelerometer, 411 …… Signal analyzer, 419 …… Judge,
500 ... Inspection head, 501 ... Probe pin, 503 ... Guide mechanism, 505, 506, 507 ... Motor, 517 ... Push block, 518, 519 ... Electrode plate (flexible substrate), 520 ...
Pressurized conductive sheet, 521,522 …… electrode, 535 …… post, 54
0 …… Detection circuit section, 537,538 …… Wiring extraction section, 539,541,54
1 '... Detection circuit board, 542, 542' ... Board connector, 54
3 ... Base, 545 ... Guide part, 546 ... Cylinder, 547
...... Lifting mechanism, 548 ...... Cover, 550 ...... Analog multiplexer, 551 ...... Digital multiplexer, 553 ...... Transistor.

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor, Yoichi Fukuoka, 292 Yoshida-cho, Totsuka-ku, Yokohama-shi, Kanagawa, Hitachi, Ltd., Institute of Industrial Science (56) Reference JP-A-61-121499 (JP, A) JP JP 62-5686 (JP, A) JP 63-8505 (JP, A) JP 59-29499 (JP, A) JP 58-131797 (JP, A) JP 62-285500 (JP , A) JP 62-190800 (JP, A) Actually open 61-9899 (JP, U) Actually open 59-191757 (JP, U)

Claims (9)

(57) [Claims] 1. A method of inserting an electronic component having a pin grid array-shaped terminal into a through hole provided on a printed circuit board, wherein the pitches of the tip positions of all the terminals of the electronic component are substantially equal. The terminals are rectified, then the positions of the terminal tips of the electronic parts are measured, and if the pitches of the terminal tips of the electronic parts are not equal, the correction is performed again. If the pitches are substantially equal, the printed circuit board is displaced. The position of the electronic component or the printed circuit board is oscillated in the direction of inserting the printed circuit board into the through hole of the printed circuit board, and the electronic component or the printed circuit board is oscillated at low and high frequencies. The level is detected, and the vibration level of the low frequency is higher than a predetermined level,
A method of inserting an electronic component, characterized in that the electronic component is inserted when the high frequency component is smaller than a predetermined level. 2. A chuck mechanism that can rotate in a horizontal plane while holding a component and can be positioned in an arbitrary direction; a mechanism that mechanically vibrates a portion that grips the component at an arbitrary amplitude and frequency; It has a head that has a mechanism that vertically supports these included parts and that can detect and analyze the vibration of the part that vibrates together with the electronic parts.The head is moved up and down to insert the electronic parts into the printed circuit board. And a stage mechanism that has a movable vertical axis and a moving mechanism that can move and stop the head laterally, and that can mount and position the printed circuit board immediately below the head insertion position and can move in two directions at right angles. A means to measure the position of the through-hole on the printed circuit board on the stage with a camera, and also to irradiate the terminal of the electronic component with laser scanning light from the lateral direction at the head insertion position. And means for measuring the position, the insertion device of the electronic component, characterized in that a terminal straightening device next in and head that are movable position of the stage. 3. The method of inserting an electronic component according to claim 1, wherein it is detected from the back side of the substrate that the terminal of the electronic component that has been inserted is in the through hole. 4. The insertion device according to claim 2, wherein the probe pins are provided on the back side of the printed circuit board immediately below the head insertion position and have the same number and the same arrangement as the terminal pins of the electronic component, and the probe pins are inserted into the through holes. When the tip of the terminal pin is contacted, it has an inspection head having means for detecting the pressure, the fine movement mechanism for aligning the probe pin of the inspection head with the through hole of the printed circuit board to be inspected, and the probe pin after the positioning is completed. An insertion device comprising a mechanism for raising an inspection head until it comes into contact with a terminal pin in a through hole. 5. A straightening tool, in which a strip-shaped thin plate is planted in parallel in multiple rows at equal intervals with terminals of an electronic component, is pressed against each row of terminals of the electronic component and moved in a direction perpendicular to the planting direction of the strip-shaped plate. Then, each terminal is deformed, and then the entire correction section is rotated 90 ° to correct it in the direction perpendicular to the front.First, in order to correct each row of terminals accurately, the minimum It is deformed in one direction with the required constant correction amount T as the boundary, and then it is deformed in the opposite direction by T, and finally, the correction amount S in anticipation of the springback amount of each terminal.
A terminal straightening device, characterized in that it is given a three-step operation of deforming only the terminals to align them in a predetermined position. 6. The insertion method according to claim 1, wherein the sum of squares of the distance between the centers of the terminals and the holes is minimized by using the position measurement data of the tips of the terminals and the centers of the holes. An electronic component insertion method, characterized in that a correction amount from a reference position is calculated, and alignment is performed based on the calculated correction amount. 7. The detection method according to claim 1, wherein a vibration is applied to an electronic component which is being inserted into a printed circuit board and the vibration state is detected by an acceleration detector, and a detection waveform is generated when a non-insertable terminal exists. A method of inserting an electronic component, characterized in that when any one of a change in the amplitude of the signal and an increase in a higher-order vibration component included in the detected waveform appears, the insertion is stopped as an insertion error to prevent terminal damage. 8. The insertion device according to claim 4, wherein the inspection head has probe pins corresponding to the terminal pins in a one-to-one correspondence, and a pair of flexible members having the same number of electrodes as the probe pins and posts for preventing pressure by the weight of the probe pins. Insertion head inspection head for electronic parts, comprising a conductive printed circuit board and a conductive element that exhibits a resistance change in response to a pressure stimulus. 9. The inspection head according to claim 8, wherein an electric circuit portion for detecting a resistance change of the conductive element is arranged directly below the inspection head portion, and a peripheral portion of the flexible printed circuit board is extended and formed. A terminal pin insertion detection device for an electronic component, characterized in that the wiring lead-out portion is bent downward and directly connected to a board connector provided on a detection circuit board.