JP2586378B2 - Semiconductor device manufacturing equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for manufacturing a semiconductor device, and more particularly to an apparatus for manufacturing a semiconductor device having a groove for holding a semiconductor substrate (hereinafter, referred to as a wafer) in an upright state.

[0002]

2. Description of the Related Art FIG. 6 is a perspective view of a conventional semiconductor device manufacturing apparatus having a groove for holding a wafer in an upright state.

A groove for supporting a plurality of wafers is formed in a chuck rod 2 mounted on the chuck 1, and a guide rod 4 mounted on a guide 3 is also provided with a wafer at the same pitch as the groove of the chuck rod 2. 5 are formed.
The guide 3 is attached to the support plate 6 so that the position can be finely adjusted, and the guide rod 4 is immersed in the processing tank 7. The materials of the chuck 1 and the guide 3 are rigidity, chemical resistance,
Quartz, which is the best in terms of heat resistance and purity, is used.

When the wafer 5 is put into the processing tank 7, the chuck 1 descends into the processing tank 7 while chucking the wafer, and transfers the wafer to the guide 3, where the wafer 5 is transferred.
Are supported upright on the guide rod 4.
When the wafer 5 is taken out of the processing tank 7, the chuck 1 descends into the processing tank 7, the chuck 1 chucks the wafer 5, takes it out of the tank, and transfers it to another tank.

FIG. 8 is a configuration diagram of a conventional semiconductor device manufacturing apparatus. The chemical liquid overflowing from the processing tank 7 is passed through the filter 9 by the pump 8, and the chemical liquid is jetted from the liquid supply pipe 10 into the processing tank 7 again, thereby performing circulation filtering.

[0006]

In this conventional semiconductor device manufacturing apparatus, there is a problem that a scratch is generated in a peripheral portion of the wafer which comes into contact with the grooves of the chuck rod 2 and the guide rod 4. In addition, there is a problem that particles adhere to the peripheral portion of the wafer and the upper portion thereof in contact with the groove.

The cause of the occurrence of scratches on the periphery of the wafer is described below.

When the wafer is transferred to the guide 3, that is, when the wafer is transferred, the peripheral portion of the wafer 5 contacting the groove is transferred while contacting the groove side surface 11 as shown in FIG. 7B. . Not only are they transferred while touching,
Usually, the wafer 5 is often transferred while being pressed against the groove side surface 11. The reason is that at the time of transfer,
Since the wafer 5 is inserted into the grooves of the total of seven rods of the chuck rod 2 and the guide rod 4, when the seven grooves are not on the same surface, the peripheral portion of the wafer 5 is pressed against the groove side surface 11. is there.

As shown in FIG. 7A, the dimensions of the groove are as follows: dimension a = wafer thickness + about 0.2 mm, dimension b
= Several mm, dimension c = several mm. Therefore, in order to align the seven grooves on the same plane, the positions of the seven grooves are set to ± 0.
The position of the chuck 1 and the guide 3 must be adjusted so as to be within a range of about 1 mm. However, in practice, this adjustment is very difficult, and the positions are usually shifted.

When the widths a and b of the groove are increased,
Since the wafer 5 falls down and comes into contact with an adjacent wafer, the above dimensions are the limit. Also, if the material of the chuck 1 and the guide 3 is not quartz but Teflon-based, it is considered that no scratches will be generated.
In the case of a chemical solution at a temperature of not less than ° C., there is a problem that the pitch of the groove is shifted and the transport reliability is reduced. Therefore, at present, quartz is the most excellent material.

The causes of the large number of particles are as follows: first, particles generated by scratching the periphery of the wafer 5 when the wafer 5 is transferred;
Particles that accumulate in the grooves of the guide rods 4 adhere to the wafer 5 when they come into contact with the groove side surfaces 11 or fly up, so that there are two causes: particles that adhere to the wafer 5.

Although one chuck and guide have been described above, in actuality, one apparatus has a plurality of processing tanks. For example, in a cleaning step, processing is performed several tens of times by one apparatus. Therefore, the number of times the wafer is transferred becomes several hundred times or more before the semiconductor product is completed, and the damage to the wafer becomes enormous.

[0013]

Of the present invention SUMMARY OF THE INVENTION The features of the member
The semiconductor substrate is held upright in the groove, and the side surface of the groove and
In a semiconductor device manufacturing apparatus for processing the semiconductor substrate by ejecting a liquid from a bottom surface, the part constituting the groove is provided.
The material is made of porous quartz.
In the semiconductor device manufacturing apparatus from which the liquid is ejected.

[0014]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be described with reference to the drawings.

FIG. 1 is a perspective view showing an apparatus for manufacturing a semiconductor device according to a first embodiment of the present invention, and FIG. 2 is a sectional view thereof.

In FIG. 1, the cutting lines SS, TT, H-
The cross sections of the portions indicated by H and GG are respectively shown in FIG.
3A is a cross section SS, a cross section TT, a cross section HH, and a cross section GG in FIG. FIG. 2B is a cross-sectional view taken along a line AA in FIG.

As shown in FIG. 2, a porous quartz rod 13 is welded to a quartz rod 12 provided with a pipe 14 for flowing a chemical solution to form a guide rod (FIG. 2B).

[0018] Porous quartz is small pore quartz that can pass through a fluid. The guide rod is attached to the guide plate 15 provided with the pipe 14 for flowing the chemical solution by welding three pipes so that the pipe 14 is connected. A guide plate 16 is welded to the other. Grooves are simultaneously formed at the same pitch on the three guide rods of the guide manufactured as described above.

In addition, an air operation valve 18 with a flow rate adjusting needle is attached to the introduction pipe 17 so that the chemical solution flowing into the pipe 14 can be turned on / off and the flow rate can be adjusted.

As shown in FIG.
Thereafter, the pipe to the liquid supply pipe 10 of the processing tank 7 is branched and connected to the introduction pipe 17 to be supplied to the pipe 14.

FIG. 4 is a cross-sectional view showing the direction in which the chemical solution is ejected from the groove 21 by arrows. The chemical solution is also ejected from the side surface 22 and the bottom surface 23 of the groove 21 and the portion where the groove is not formed.

The timing of the ejection is when there is no wafer and when the wafer is being transferred. If chemical solution is ejected after wafer transfer is completed, the wafer will vibrate and cause dust,
After the wafer is transferred to the guide, the ejection of the chemical solution is stopped. The reason for jetting when there is no wafer is to prevent particles from accumulating in the groove. The reason why the chemical solution is ejected during the transfer of the wafer is that the chemical solution serves as a lubricant, so as to reduce friction between the wafer and the side surface of the groove and to prevent the wafer from being damaged.

FIG. 5 is a partial perspective view of a guide according to a second embodiment of the present invention. Piping 14 on quartz rod 20 with grooves
The quartz bar 20 is attached to the quartz bar 12 by welding to form a guide bar.

The second embodiment has the following advantages as compared with the first embodiment.

First, since there is no ejection of the chemical solution from portions other than the groove, the flow rate of the chemical solution ejected from the groove increases, and the effect of alleviating the friction between the wafer and the groove increases.

Secondly, in the case of the first embodiment, the porous quartz may be clogged and the ejection of the chemical solution may be reduced.
Such a situation does not occur in the second embodiment.

Although the embodiment has been described above with the chemical solution tank, the present invention can be similarly applied to a pure water washing tank.

[0028]

As described above, according to the present invention, the contact friction between the wafer and the guide groove is reduced by ejecting the chemical or pure water from the groove of the guide, so that the damage on the peripheral portion of the wafer is drastically reduced. In addition, there is an effect that particles adhering to the wafer can be reduced.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a first embodiment of the present invention.

FIG. 2 is a sectional view showing a first embodiment of the present invention.

FIG. 3 is a configuration diagram showing a first embodiment of the present invention.

FIG. 4 is an enlarged sectional view showing a direction in which a chemical solution is ejected from a groove of a guide according to the first embodiment of the present invention.

FIG. 5 is a perspective view showing a guide portion according to a second embodiment of the present invention.

FIG. 6 is a perspective view showing a conventional technique.

FIG. 7 is a cross-sectional view showing a groove of a conventional guide.

FIG. 8 is a configuration diagram showing a conventional technique.

[Explanation of symbols]

 Reference Signs List 1 chuck 2 chuck rod 3 guide 4 guide rod 5 wafer 6 support plate 7 processing tank 8 pump 9 filter 10 liquid supply pipe 11 groove side surface 12 quartz rod 13 porous quartz rod 14 piping 15 piping engraving guide plate 16 guide plate 17 introduction pipe 18 Air operated valve with flow rate adjusting needle 19 Hole 20 Quartz rod with groove engraved 21 Groove 22 Side of groove 23 Bottom of groove

Claims (3)

(57) [Claims] A semiconductor substrate is held upright in a groove of a member.
And ejects liquid from the side and bottom surfaces of the groove to form the half
Apparatus for manufacturing a semiconductor device for processing a conductive substrate, before
The member constituting the groove is made of porous quartz.
An apparatus for manufacturing a semiconductor device, wherein the liquid is ejected from pores of porous quartz . 2. The apparatus according to claim 1, wherein the liquid is a chemical for treating the semiconductor substrate. Wherein said liquid apparatus for manufacturing a semiconductor device according to claim 1, characterized in that the pure water treatment washing the semiconductor substrate.