JP2598359B2 - Substrate cleaning equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate cleaning apparatus.
And, more particularly, to a technique of immersing the thin plate-like substrate such as a semiconductor substrate or a liquid crystal glass substrate on a plurality collectively cleaning liquid.

[0002]

2. Description of the Related Art In order to maintain the performance and reliability of a semiconductor device at a high level, it is essential to maintain a high cleanliness by minimizing contaminants on the surface of a semiconductor substrate (hereinafter referred to as a wafer). For this purpose, various wafer cleaning techniques have been developed in the past, such as hydrofluoric acid (HF).
The case of the processing is shown in FIGS.

The HF processing apparatus shown here is for processing a plurality of wafers W, W,... Collectively (batch processing), and as shown in FIG. A cleaning tank a made of a corrosive material and filled with a mixed liquid (cleaning liquid) C of HF and pure water, and an outer tank b for collecting the cleaning liquid C overflowing from the cleaning tank a
And

At the bottom of the washing tank a, two liquid supply pipes d, d are provided, and these liquid supply pipes d, d are provided.
Above d, a wafer holder e for holding a plurality of wafers W, W,... is provided.

The cleaning liquid C filled in the cleaning tank a
Are placed and held in the wafer holding unit e, and immersed therein.
The cleaning liquid C is circulated through the. That is, the cleaning liquid C
Is supplied from the supply pipes d, d into the washing tank a,
An amount of the cleaning liquid C corresponding to this supply amount passes over the upper opening of the cleaning tank a, overflows, and flows into the outer tank b.

At this time, an upward flow (upflow) of the cleaning liquid C is generated in the cleaning tank a, and this upward flow flows between the wafers W as shown in FIG. (Mirror surface) Dust adhering to Wa and back surface Wb (dust) p,
are removed and carried out of the cleaning tank a together with the overflowing cleaning liquid C. After the dusts p, p,... are removed by the filter F, only the cleaning liquid C returns to the cleaning tank a again.

By circulating the cleaning liquid C for a predetermined time as described above, the front and back surfaces Wa and Wb of each wafer W are cleaned.

[0008]

In recent years, semiconductor devices have entered the submicron era, and with the miniaturization and high integration of such device structures, the surface Wa of the wafer W has very high cleanliness. Degree is required.

However, in the conventional cleaning method as described above, there is a portion where the upward flow of the cleaning liquid C causes a random flow, and particularly, the back surface dusts p, p,... It reattached to Wa, and the desired cleanliness could not be obtained on the surface Wa, which caused a problem that the yield was greatly reduced.

[0010] In this regard, the present inventor conducted various tests and researches in pursuit of the cause of the turbulent flow in the upward flow of the cleaning liquid C. As a result, the main cause was that the cleaning liquid C was provided at the bottom of the cleaning tank a. The liquid supply pipes d, d were located.

That is, these liquid supply pipes d, d
As shown in FIG. 14, a large number (for example, about 60) of outflow holes f, g, h,... Are provided, and among these outflow holes, the outflow holes f, g, h,. Only about 3 to 5 outflow holes f (three in the illustration)
, And the remaining outflow holes g, h,.
.. Are not directly opposed to each other (see FIG. 12 (a) and FIG. 14 (b)).

This takes into account that direct application of a strong cleaning liquid flow to the wafers W, W,... May cause uneven etching. Are caused by the cleaning liquid C flowing out from the large number of outflow holes g, h,... To reduce the pool.

However, in actuality, the flow of the cleaning liquid in such an outflow hole arrangement structure is not a uniform laminar flow state.
It becomes a complicated and messy flow. On the other hand, on the back surface Wb of the wafer W, dust brought in from the previous process (particularly dust by chucking such as a stepper or an implanter) p,
Many p, ... are attached. .. Are separated by the cleaning liquid C, are scattered without overflowing, flow to the front surface Wa side of the wafer W, and adhere again. .

The reattachment of the back surface dusts p, p,... Is particularly severe when the cleaning liquid is hydrofluoric acid (HF). In other words, the oxide film on the back surface Wb of the wafer W is etched by HF, and the back surface dust attached on the oxide film is peeled off, and the silicon (Si) surface is also exposed on the front surface Wa side of the wafer W by etching. However, the dust is easily adhered to the surface, so that the separated back surface dust is re-adhered to the front surface Wa in a large amount.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned conventional problems, and an object of the present invention is to prevent a back surface dust separated from a back surface of a wafer from re-adhering to the front surface, thereby providing a semiconductor device. Provided is a substrate cleaning apparatus capable of obtaining high cleanliness in accordance with miniaturization and high integration of a structure .
And there.

[0016]

In order to achieve the above object, a substrate cleaning apparatus of the present invention performs a plurality of substrate cleanings.
This is a batch type cleaning device that stops and carries out the substrate loading / unloading section.
A wafer table for storing a plurality of substrates,
From the multiple substrates on the table,
A wafer detaching means for detaching in a direction perpendicular to the arrangement direction;
Place the wafer release means and the wafer stage in the
Rotating means for relatively rotating around the axis,
On the other hand, a plurality of substrates on the wafer table
Wafer transporter that chucks and transports all together
Step and immerse the substrate transferred by this wafer transfer means
Washing liquid is filled, and the washing liquid
Cleaning liquid tank means having a structure for generating
The cleaning liquid tank means is a cleaning tank filled with a cleaning liquid.
And the outside of collecting the overflowing cleaning liquid from this cleaning tank.
A supply tank for supplying a cleaning liquid to the bottom of the cleaning tank.
A liquid box is arranged.
A plurality of cleaning liquid supply units consisting of
These cleaning liquid supply units have an arrangement pitch
If the pitch between substrates immersed in the device is the same
In addition, it is characterized by being arranged between these substrates.
You.

[0017]

[0018]

In the present invention, a plurality of substrates arranged in the same direction are rearranged so that the front and back surfaces of the adjacent substrates are opposed to each other, and the back and back surfaces are respectively opposed to each other. By immersing the substrates in a cleaning liquid having a laminar ascending flow, reattachment of the back surface dust separated from the back surface of each substrate to the surface is prevented.

Further, a structure for ensuring a uniform laminar flow state of the upward flow of the cleaning liquid in the cleaning tank, especially between the substrates,
The back surface dust once peeled off from the back surface of the substrate is surely overflowed to the outside of the cleaning tank without flowing to the front surface side of the substrate, so that the re-adhesion to the front surface of the substrate is more reliably prevented in combination with the arrangement direction of the substrates.

[0020]

Embodiments of the present invention will be described below in detail with reference to the drawings.

FIGS. 1 and 2 show a cleaning liquid tank device which is a main part of a substrate cleaning device according to the present invention. Specifically, the substrate cleaning apparatus is of a batch type in which a plurality of semiconductor substrates (wafers) W are cleaned at a time, and a cleaning liquid tank apparatus (cleaning tank means) 1 includes hydrofluoric acid as a cleaning liquid C. (H
F) and pure water, that is, dilute hydrofluoric acid, is filled, and a plurality of wafers (25 in the illustrated example) are immersed in the cleaning liquid C collectively. .

The arrangement pitch (inter-substrate pitch) P of these wafers W, W,... Is the same throughout the processing steps of the present apparatus, and is 6.35 in the illustrated example.
mm). The arrangement of the wafers W, W,... Is such that the front surfaces Wa, Wa and the back surfaces Wb, Wb of the adjacent wafers W, W face each other, as shown in FIG.

In connection with this, a wafer reversing device, which will be described later, is provided at the substrate carrying-in portion and the substrate carrying-out portion of the substrate cleaning device (see FIGS. 5 to 8). A wafer transfer device (wafer transfer means) 2 for transferring wafers W, W,...

The cleaning liquid tank device 1 includes the wafer transfer device 2
And a cleaning tank 3 filled with the cleaning liquid C, and an outer tank 4 for collecting the cleaning liquid C overflowing from the cleaning tank 3.
Reference numeral 4 is made of a material having corrosion resistance such as quartz glass or fluororesin.

The cleaning tank 3 has an upper opening 5 serving as an overflow section, and a liquid supply box 6 disposed at the bottom. The liquid supply circuit 7 of the liquid supply box 6 has an upstream end connected to the bottom of the outer tank 4 and includes a circulation pump 8 for circulating the cleaning liquid C and a filtration filter 9. Reference numeral 50 denotes a drain plug for communicating the bottom of the cleaning tank 3 with a drain circuit (not shown).

As shown in FIG. 4, the cleaning liquid supply nozzles 10 of the liquid supply circuit 7 are provided inside the liquid supply box 6, and a plurality of cleaning liquid supply sections 11 are arranged on the upper surface 6a. Have been.

Each of the cleaning liquid supply sections 11 is composed of a large number of outflow holes 11a, 11a,... Arranged in a straight line, and the arrangement pitch P _{1 of} these cleaning liquid supply sections 11, 11,.
.) Is 6.35 mm, which is the same as the pitch P between the substrates of the wafers W, W,. The axis of the outflow hole 11a is set to extend in the up-down direction.

On the upper side of the liquid supply box 6, a pair of left and right wafer holding parts 12, 12 are provided. The upper and lower holding groove groups 13 are provided in the wafer holding portions 12 and 12, respectively.
a, 13b, and wafers W,
The lower side edges of W,... Are supported. Holding groove group 13a,
The groove pitch of 13b is set to the above-mentioned substrate pitch P.

In connection with this, the upper surface 6 of the liquid supply box 6
a are formed on an arc surface along the bottom arc portion of the wafers W, W,... held by the wafer holding units 12, 12, and the cleaning liquid supply units 11, 11,. It is arranged between W. Thus, the outflow holes 11a, 11a,... Of each of the cleaning liquid supply units 11 are positioned between the wafers W, W, in the vicinity of the bottom of the wafer W and substantially concentrically with the wafer W. The cleaning liquid C is provided between the upper and lower holding groove groups 13a and 13b of the wafer holding unit 12.
Are provided so as not to hinder the upward flow of the cleaning liquid C.

Two auxiliary liquid supply pipes 16, 16 are arranged on the left and right outer sides of the wafer holding parts 12, 12, respectively. The liquid supply pipe 16 is for preventing stagnation of the cleaning liquid C on both left and right portions of the cleaning tank 3. The liquid supply pipe 16 communicates with the liquid supply circuit 7 (not shown), and has a number of outflow holes 16a, 16
are provided upward so as to form an upward flow of the cleaning liquid C in this portion.

The outer tank 4 is provided so as to surround the overflow section 5 of the washing tank 3 over the entire circumference, and the bottom thereof is connected to the liquid supply circuit 7. An intermediate portion of the liquid supply circuit 7 is connected to the above-mentioned drain circuit via a switching valve 51. When the cleaning liquid C becomes dirty, the cleaning liquid C in the two tanks 3 and 4 is passed through the drain circuit. All of the cleaning liquid C is drained.

The wafer reversing devices provided at the substrate carry-in portion and the carry-out portion respectively include the wafers W, W,...
W,... Are reversed, and as shown in FIGS. 5 to 8, a wafer transfer device 20, a wafer mounting table 21, a wafer separating device (wafer separating device) 22, and a mounting table rotating device (rotating device) 23 are connected. Provided as the main part.

The wafer transfer device 20 transfers wafers W, W,... Between a carrier cassette (not shown) and the wafer table 21 at the substrate loading / unloading section, and can be moved between them. And a pair of left and right chucking arms 24. These chucking arms 24, 24 can be opened and closed by a drive source (not shown), and have two upper and lower chuck grooves 24a, 24b,... As shown in FIG.

Each of the chuck grooves 24a, 24b,... Is provided with twenty-five, and the interval between the chuck grooves 24a, 24b,. When the chucking arms 24 are closed, the lower edges of the wafer W are supported by the chuck grooves 24a and 24b.

The wafer mounting table 21 includes a plurality of wafers W, W,
Are provided with arrangement grooves (not shown) for arranging 25 wafers W, W,... At a pitch P between the substrates. The wafer table 21 is rotatably supported on a support frame 25. Reference numeral 60 denotes a wafer detection photosensor for detecting the presence or absence of wafers W, W,.

The wafer detaching device 22 is provided with the wafer table 2
Are detached from the 25 wafers W, W,... Arranged on the first wafer W. Specifically, the set of wafers W, W,. And is connected to a lifting cylinder (not shown).
The wafer release device 22 includes a pair of left and right wafer holding portions 22a, 22a as shown in FIG. 9, and these wafer holding portions have a wafer holding groove 26a and a wafer passage groove 26a.
b are provided alternately.

Both grooves 26 in each wafer holding portion 22a
The arrangement interval of the a and 26b is set to 6.35 mm, which is equal to the inter-substrate pitch P. In other words, the wafer holding groove 26a has a pitch twice as large as the wafer arrangement pitch P of the wafer mounting table 21. Are arranged.

The left and right wafer holding portions 22a, 22a
In both structural relationships, the distance between the wafer holding grooves 26a, 26a facing each other is set smaller than the diameter of the wafer W, where the lower side edges of the wafer W are supported, while the wafer passage grooves are provided. The distance between the groove bottoms of 26b, 26b is set to be larger than the diameter of the wafer W, so that the wafer W can pass in the vertical direction.

The stage rotating device 23 is for rotating the wafer detaching device 22 and the wafer stage 21 relatively around their central axes. In the illustrated example, the wafer rotating device 23 is configured to rotate only the wafer stage 21. ing.

The table rotating device 23 has a servomotor 30 as a drive source.
The center of the wafer mounting table 21, that is, the center in the wafer arrangement direction, is connected to the 0 drive shaft 30a. Then, the rotation of the servo motor 30 causes the wafer table 21 to rotate 180 ° in the forward and reverse directions about its central axis.

The wafer transfer apparatus 2 chucks and transfers wafers W, W,... From the wafer mounting table 21 collectively, and has the same basic structure as the wafer transfer apparatus 20 described above. (See FIG. 10), and a detailed description of the structure is omitted.

Next, a method of cleaning the wafers W, W,... In the substrate cleaning apparatus configured as described above will be described.

A. Loading of the wafers W, W,...: The wafer loading sections of the substrate cleaning apparatus are stored in the carrier cassette while all the wafers W, W,. (Not shown).

B. .. Inversion of the wafers W, W,...: The arrangement state of the wafers W, W,.

At the position of the carrier cassette, the wafer transfer device 20 closes the chucking arms 24, 24 and closes the chucking arms 24, 24 in the carrier cassette.
.. Are lifted while chucking and supporting the wafers W, W,... Collectively, and the wafers W, W,. Further, the wafer transfer device 20 moves to the wafer table 21 and descends, and the chucking arm 2
The wafers W,
W,... Are transferred (see FIG. 5A).

The arrangement state of the wafers W, W,... At this time is, as shown in FIG. 5B, all of them arranged in the same direction.

The wafers W, W,...
Is mounted, the wafer detachment device 22 is raised. Then, of the wafers W, W,... On the wafer table 21, every other (every two pitches) wafers W ′, W ′,.
Of the wafer holding grooves 26a, 2 (for example, 12)
.. (For example, 13 wafers) on the wafer mounting table 21 (see FIGS. 6A and 6B).

In this state, the table rotating device 23
Operates to rotate the wafer table 21 by 180 ° (see FIG. 7A). Thus, the wafers W, W,... On the wafer mounting table 21 face in the opposite direction to the wafers W ′, W ′,... On the wafer detachment device 22, as shown in FIG. .

The wafer detachment device 22 descends again and returns to the original position, and the detached wafers W ′, W ′,.
Are combined again with the wafers W, W,... On the wafer mounting table 21 and are respectively positioned between the wafers W, W (FIG. 8).
(a)). As a result, the front surface Wa and the front surface Wa of the adjacent wafers W, W, and the rear surface Wb and the rear surface Wb are rearranged to face each other.

C. Cleaning of the wafers W, W,...
All five wafers W, W,... Are taken out,
After being transported to above the cleaning tank 3 of the cleaning liquid tank device 1, it is placed on the wafer holding unit 12 in the cleaning tank 3 (see FIGS. 1 and 2).

At this time, the cleaning tank 3 is filled with the cleaning liquid C, and the cleaning liquid filtered by the filtration filter 9 by the circulation pump 8 through the liquid supply box 6 and the auxiliary liquid supply pipes 16, 16. C is supplied from the liquid supply circuit 7. As a result, an amount of the cleaning liquid C corresponding to the outflow amount from the liquid supply box 6 overflows from the overflow section 5 of the cleaning tank 3 to the outer tank 4 and flows to the liquid supply circuit 7 again.

As described above, the cleaning liquid C is supplied to the liquid supply circuit 7.
The cleaning liquid C is circulated in the closed circuit of the cleaning tank 3 to generate an upward flow of the cleaning liquid C in the cleaning tank 3 (see arrows in FIGS. 1 and 2). This ascending flow flows between the wafers W, W as shown in FIG. 3, and separates the dust (dust) p, p,... Adhered to the front (mirror) Wa and the back Wb of each wafer W. It is carried out of the cleaning tank 3 together with the overflowing cleaning liquid C. After the dusts p, p,... Are removed by the filtration filter 9 of the liquid supply circuit 7, only the cleaning liquid C is returned to the cleaning tank 3 again.

As described above, by circulating the cleaning liquid C for a predetermined time, the front and back surfaces Wa and Wb of each wafer W are cleaned.

Particularly, in this case, adjacent wafers W, W,.
Are arranged so as to face each other, and the back surfaces Wb and Wb are opposed to each other. Moreover, the cleaning liquid supply section 11 of the liquid supply box 6 (outflow holes 11a, 11a, ...).
Is located between the wafers W and W in close proximity to the bottom of the wafer W, so that a uniform upward flow of the cleaning liquid C between the wafers W and W is ensured.

Therefore, the back surface dusts p, p,... Once peeled off from the back surface Wb of the wafer W are surely discharged to the outside of the cleaning tank 3 without going to the front surface Wa side.
There is almost no risk of redeposition on a.

D. , Which has been cleaned by the above-mentioned cleaning liquid tank device 1, is again taken out of the cleaning tank 3 by the wafer transfer device 2, and is then placed on standby at the substrate unloading section. After the wafer is placed on the wafer mounting table 21 of the apparatus, the above-described reversing step B is performed in reverse order. .. On the wafer mounting table 21, all of them are rearranged in the same direction as shown in FIG. 5 (b).

E. Unloading of wafers W, W,...: Wafers W, W,... For which all the cleaning steps have been completed are transferred from wafer mounting table 21 to a carrier cassette by wafer transfer device 20, and then unloaded to the next step. (Not shown).

The following test was conducted in order to confirm the effect of the apparatus of the present invention configured as described above to prevent the back surface dust p from adhering.

In this test, the front surface Wa of the wafers W, and the back surfaces Wb, Wb of the wafers W, W,... , The wafer W,
When W,... Are arranged in the same direction (Comparative Example 1), FIG.
The wafer W, W, W,
The front wafers Wa, and the back Wb, Wb are opposed to each other (Comparative Example 2), and the wafers W, W,. A series of cleaning steps are performed under the same conditions for the four cases where the wafers are arranged in the direction (Comparative Example 3: Conventional method), and the influence of the back surface dust p, p,. I tried.

From the test results, the method of the present invention → Comparative Example 1
→ Comparative Example 2 → Comparative Example 3 (conventional method) was found to increase the number of adhered dust p on the surface Wa of the wafer W. That is, when the method of the present invention is performed using the apparatus of the present invention (the method of the present invention), the amount of redeposition of the back surface dust p is the smallest, and subsequently, the method of the present invention is performed using the conventional apparatus (Comparative Example). 1) In the case where the conventional method is performed using the apparatus of the present invention (Comparative Example 2), the number increases in the order, and the case where the conventional method is performed using the conventional apparatus (Comparative Example 3: Conventional method) has the largest back surface dust p. It was found that the amount of redeposition was large.

As described above, according to the method of the present invention, the problem of the back surface dust p peeled off from the back surface Wb of the wafer W to the surface (mirror surface) Wa side and further reattachment is much more compared with the conventional method. It was confirmed that there were few.

It should be noted that the above-described embodiments merely show preferred specific examples of the present invention, and the present invention should not be construed as being limited thereto, and various designs may be made within the scope of the present invention. Can be changed.

For example, the structure of each constituent device of the substrate cleaning apparatus is not limited to the illustrated example, but may be another structure. As an example, a rotating unit for rotating the wafer detaching device 22 may be employed instead of the table rotating device 23.

Further, the wafer transfer device 2 includes a wafer table 2
.., 50 wafers W, W,... May be collectively transferred. That is, the chuck grooves 24a, 24 of the pair of chucking arms 24, 24 are provided.
.. have a structure in which 50 wafers (two times the number of wafers arranged on the wafer mounting table 21) are provided, as shown in FIG. Means for arranging two units in parallel in the arrangement direction are additionally provided, and the structure of the cleaning liquid tank apparatus 1 is correspondingly modified. With such a configuration, a more efficient cleaning process can be performed.

[0065]

As described in detail above, according to the present invention,
Since the substrate is immersed in a cleaning liquid that has caused a laminar upflow in a state where the front and back surfaces of the adjacent substrates are opposed to each other, and the back surface and back surface are opposed to each other, the back surface dust separated from the back surface of each substrate must be reapplied to the surface Prevents adhesion.

Further, since a uniform laminar state of the upward flow of the cleaning liquid in the cleaning tank, particularly between the substrates, is ensured, the back surface dust once peeled off from the back surface of the substrate does not flow to the front surface side of the substrate without fail. As a result, the effect of preventing re-adhesion to the surface of the substrate is further enhanced.

[Brief description of the drawings]

FIG. 1 is a front sectional view showing a cleaning liquid tank device as a main part of a substrate cleaning device according to one embodiment of the present invention.

FIG. 2 is a side sectional view taken along the line II-II in FIG. 1 showing the cleaning liquid tank device.

FIG. 3 is a diagram showing a relationship between an arrangement state of substrates and a flow of a cleaning liquid in the cleaning liquid tank device.

4 (a) is a plan view, and FIG. 4 (b) is a view showing a liquid supply box in the cleaning liquid tank device. FIG.
FIG. 4 is a sectional view taken along line -IV.

5A and 5B are diagrams for explaining the operation of the wafer reversing device in the substrate cleaning apparatus. FIG. 5A shows a state in which a wafer is transferred onto a wafer mounting table by a wafer transfer device, and FIG.
Indicates the wafer arrangement state at that time.

FIG. 6 is a view for explaining the operation of the wafer reversing device in the same substrate cleaning apparatus.
FIG. 6B shows the wafer arrangement state at that time.

7A and 7B are diagrams for explaining the operation of the wafer reversing device in the substrate cleaning apparatus. FIG. 7A shows a state in which a wafer stage is rotated by a stage rotating device, and FIG. 7B shows a wafer arrangement state at that time. Is shown.

8A and 8B are diagrams for explaining the operation of the wafer reversing device in the substrate cleaning apparatus, and FIG. 8A shows a state in which every other wafer is returned to the wafer mounting table by the wafer removing device;
(b) shows the wafer arrangement state at that time.

FIG. 9 is a plan view showing a main part of a wafer detaching device of the wafer reversing device.

FIG. 10 is a plan sectional view showing a main part of a chucking arm in the wafer transfer device and the wafer transfer device of the substrate cleaning apparatus, and shows a state where the wafer is chucked and supported.

FIG. 11 is a plan sectional view corresponding to FIG. 10 and showing a modification of the main part of the chucking arm.

FIG. 12 is a diagram showing a configuration of a conventional cleaning liquid tank device, and FIG.
2 (a) is a front sectional view, and FIG. 12 (b) is a cross-sectional view of FIG.
FIG. 2 is a side sectional view taken along the line II-XII.

FIG. 13 is a diagram showing a relationship between an arrangement state of substrates and a flow of a cleaning liquid in the conventional cleaning liquid tank apparatus.

14 (a) is a plan view, and FIG. 14 (b) is a view showing a liquid supply pipe in the conventional cleaning liquid tank device.
FIG. 4A is a sectional view taken along line XIV-XIV in FIG.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Cleaning liquid tank apparatus 2 Wafer transfer apparatus (wafer transfer means) 3 Cleaning tank 4 Outer tank 6 Liquid supply box 6a Upper surface of liquid supply box 11 Cleaning liquid supply part 11a Outflow hole of cleaning liquid supply part 12 Wafer holding parts 13a, 13b Holding groove group DESCRIPTION OF SYMBOLS 20 Wafer transfer apparatus 21 Wafer mounting table 22 Wafer removing apparatus (wafer releasing means) 22a Wafer holding part of wafer removing apparatus 23 Mounting table rotating apparatus (rotating means) 24 Chucking arms 24a, 24b Chucking groove of chucking arm 26a Wafer removing apparatus Wafer holding groove 26b Wafer wafer passage groove of wafer removal device 30 Servo motor of mounting table rotating device W Semiconductor substrate (wafer) Wa Wafer surface Wb Wafer back surface p Dust C Cleaning liquid P Wafer inter-substrate pitch P ₁ Arrangement of cleaning liquid supply unit pitch

Continuation of the front page (56) References JP-A-4-181833 (JP, A) JP-A-2-1143 (JP, A) JP-A-2-90522 (JP, A) JP-A-1-104034 (JP) , U)

Claims (4)

(57) [Claims] 1. A batch type cleaning apparatus for cleaning a plurality of substrates collectively, comprising: a wafer mounting table for storing a plurality of substrates in a substrate loading / unloading section; and a plurality of substrates on the wafer mounting table. A wafer detaching means for detaching a set of every other substrate in the direction perpendicular to the arrangement direction thereof, and a rotating means for relatively rotating the wafer detaching means and the wafer mounting table around a central axis in the arrangement direction of the substrates. On the other hand, the substrate cleaning section is filled with a wafer transporting means for chucking and transporting a plurality of substrates on the wafer mounting table collectively, and a cleaning liquid for immersing the substrate transported by the wafer transporting means, I and a cleaning liquid tank means having a structure that causes the upward flow of laminar flow in the washing liquid
Ri, the washing liquid tank means includes a cleaning tank cleaning liquid is filled, this
And an outer tank that collects the cleaning solution overflowing from the washing tank.
A supply box for supplying a cleaning liquid is provided at the bottom of the cleaning tank.
The washing that consists of a large number of outflow holes
Liquid supply portion is a plurality of rows arranged, these cleaning liquid supply section, the arrangement pitch of the wafer transportable
If the pitch between substrates immersed by the feeder is the same
A cleaning apparatus for a substrate, wherein the apparatus is disposed between the substrates. 2. The wafer detaching means includes a pair of wafer holding portions that support lower side edges of the substrate.
2. The substrate cleaning apparatus according to claim 1 , wherein the wafer holding unit has a plurality of wafer holding grooves arranged at a pitch twice as large as a substrate arrangement pitch of the wafer mounting table . 3. The wafer transfer apparatus includes a pair of openable and closable chucking arms for gripping lower side edges of the substrate, wherein the chucking arms are arranged at a substrate arrangement pitch of the wafer mounting table. 2. The substrate washing apparatus according to claim 1 , further comprising: means for arranging the substrate holding grooves twice as many as the number of wafer mounting table substrates arranged, and further comprising means for arranging two wafer mounting tables in parallel in the arrangement direction of the substrates.
Purification equipment. Wherein the top surface of the liquid supply box, while being an arc surface along the bottom arcuate portion of the substrate to be crushed immersion, claims the arcuate surface is provided near to the bottom arc portion of the substrate Item 2. A substrate cleaning apparatus according to Item 1.