JP2025016616A - METHOD FOR MANUFACTURING LIGHT-EMITTING MODULE, LIGHT-EMITTING MODULE AND PROJECTOR - Google Patents

Abstract

[Problem] To provide a manufacturing method for a light emitting module that can efficiently meet various specifications regarding the light output. Alternatively, to provide a light emitting module of a suitable form in which the number of light emitting elements mounted is adjusted. [Solution] The manufacturing method for a light emitting module includes the steps of preparing a first light emitting device 20a and a second light emitting device 20b, each of which is a light emitting device 20 on which a plurality of light emitting elements are mounted, the first light emitting device 20a and the second light emitting device 20b differing in the number of light emitting elements mounted from each other by one, preparing a first mounting board 10a having a mounting surface on which a plurality of identical connection patterns are provided, the connection patterns corresponding to one light emitting device 20, and mounting a plurality of light emitting devices 20 selected from the first light emitting device 20a and the second light emitting device 20b on the plurality of connection patterns provided on the mounting surface of the first mounting board 10a, and thus it is possible to manufacture a light emitting module 100 on which any number of light emitting elements selected from at least three consecutive numbers are mounted. [Selected Figure] Figure 1A

Description

This disclosure relates to a method for manufacturing a light-emitting module, a light-emitting module, and a projector.

Conventionally, light-emitting modules have been developed in which light-emitting devices, each of which has multiple light-emitting elements mounted in a single package, are mounted on a single mounting substrate. Patent Document 1 discloses an optical unit that includes multiple semiconductor devices, each of which has four semiconductor elements mounted in a single package, mounted on a unit substrate.

JP 2007-227422 A

The light output required for a light-emitting module varies depending on the application and size of the product in which it is installed. Therefore, one method for flexibly responding to the required light output is to adjust the number of light-emitting elements installed in the product. However, there is room for improvement in efficiently responding to the various specifications required for the light output.

Therefore, an object of the embodiment of the present disclosure is to provide a manufacturing method for a light-emitting module that can efficiently accommodate various specifications regarding the light output.

Alternatively, an object of the embodiment of the present disclosure is to provide a light-emitting module of a suitable form in which the number of light-emitting elements mounted thereon is adjusted.

An embodiment of the light emitting module of the present disclosure includes a first light emitting device including a plurality of first semiconductor laser elements and a first package in which the plurality of first semiconductor laser elements are mounted and aligned in one direction, a second light emitting device including a plurality of second semiconductor laser elements and a second package in which the plurality of second semiconductor laser elements are mounted and aligned in one direction, and a mounting substrate having a mounting surface on which a first connection pattern on which the first light emitting device is mounted and a second connection pattern on which the second light emitting device is mounted are provided, wherein the number of the plurality of second semiconductor laser elements mounted on the second light emitting device is one more than the number of the first semiconductor laser elements mounted on the first light emitting device, and the first package and the second package are packages having the same outer shape.
A manufacturing method of a light-emitting module according to an embodiment of the present disclosure is a manufacturing method of a light-emitting module in which one or more light-emitting devices having a plurality of light-emitting elements mounted thereon are mounted, the manufacturing method of the light-emitting module including the steps of: preparing a first light-emitting device and a second light-emitting device, the light-emitting devices differing from each other in the number of light-emitting elements mounted thereon by one; preparing a first mounting substrate having a mounting surface on which a plurality of the same connection patterns are provided, the first mounting substrate having a connection pattern corresponding to one of the light-emitting devices; and mounting a plurality of the light-emitting devices selected from the first light-emitting device and the second light-emitting device to the plurality of connection patterns provided on the mounting surface of the first mounting substrate, and the manufacturing method of the light-emitting module in which any number of light-emitting elements selected from at least three consecutive numbers is mounted is possible.

The light-emitting module according to the embodiment of the present disclosure includes a first light-emitting device that is a light-emitting device on which a plurality of light-emitting elements are mounted, a second light-emitting device that is a light-emitting device on which one more light-emitting element is mounted than the first light-emitting device, and a first mounting substrate having a mounting surface on which a plurality of the same connection patterns are provided, the connection patterns corresponding to one of the light-emitting devices, and one or more of the first light-emitting devices and one or more of the second light-emitting devices are connected to the plurality of connection patterns provided on the mounting surface of the first mounting substrate.

A projector according to an embodiment of the present disclosure includes the light-emitting module described above, a sealing member provided on a mounting substrate of the light-emitting module, a sealing member that is joined to the mounting substrate via the sealing member to form a sealed space, a light-emitting device that is mounted on the mounting substrate within the formed sealed space, and an optical unit that is provided within the formed sealed space.

The manufacturing method of the light-emitting module according to the embodiment of the present disclosure can efficiently accommodate various specifications. Furthermore, the light-emitting module according to the embodiment of the present disclosure can provide a suitable form in which the number of light-emitting elements mounted is adjusted.

1 is a perspective view showing a schematic example of a configuration of a light-emitting module according to a first embodiment; 1 is a plan view illustrating an example of a configuration of a light-emitting module according to a first embodiment. FIG. 2 is a plan view illustrating an example of the configuration of a mounting board according to the first embodiment. 1D is a plan view showing a state in which the mounting substrate in FIG. 1C is separated into two first mounting substrates. FIG. FIG. 2 is an exploded perspective view illustrating a schematic configuration of a first light-emitting device. FIG. 4 is a plan view illustrating a schematic configuration inside a package of the first light emitting device. FIG. 2 is an exploded perspective view illustrating a schematic configuration of a second light-emitting device. FIG. 11 is a plan view illustrating a schematic configuration inside a package of a second light emitting device. FIG. 3C is a cross-sectional view taken along line IIIC-IIIC in FIG. 3B. 11 is a plan view illustrating a schematic configuration of a lower surface of a second light-emitting device. FIG. 4 is a flowchart showing the steps of a method for manufacturing the light-emitting module according to the first embodiment. FIG. 11 is a perspective view illustrating an example of the configuration of a light-emitting module according to a second embodiment. FIG. 11 is a plan view illustrating an example of the configuration of a light-emitting module according to a second embodiment. FIG. 11 is a plan view illustrating an example of the configuration of a mounting board according to a second embodiment. 5D is a plan view showing a state in which the mounting substrate in FIG. 5C is separated into a first mounting substrate and a second mounting substrate. FIG. 10 is a flowchart showing the steps of a method for manufacturing a light-emitting module according to a second embodiment. FIG. 11 is a plan view illustrating an example of the configuration of a light-emitting module according to a third embodiment. FIG. 11 is a plan view illustrating an example of the configuration of a light-emitting module according to a third embodiment. FIG. 11 is a plan view illustrating an example of the configuration of a light-emitting module according to a third embodiment. 1 is a plan view illustrating an example of a configuration of a light-emitting module according to an embodiment. FIG. 13 is a perspective view illustrating an example of the configuration of a light-emitting module according to a fourth embodiment. FIG. 13 is a plan view illustrating an example of the configuration of a light-emitting module according to a fourth embodiment. FIG. 13 is a plan view illustrating a first mounting substrate according to a fourth embodiment. FIG. 13 is a plan view illustrating a light emitting device and a thermistor mounted on a second mounting substrate according to a fourth embodiment. FIG. 13 is a plan view illustrating a second mounting substrate according to a fourth embodiment. 1 is a perspective view showing an example of mounting a light-emitting module according to an embodiment of the present invention in a projector; 1 is a perspective cross-sectional view illustrating a sealing structure of a light-emitting module according to an embodiment; 1 is a perspective view showing a schematic example of mounting of a light-emitting module according to an embodiment in a projector; FIG. 11B is a plan view illustrating an example of the configuration of the projector according to the embodiment of FIG. 11A. FIG. 11B is a side view illustrating an example of the configuration of the projector according to the embodiment of FIG. 11A. 1 is a perspective view showing a schematic example of mounting of a light-emitting module according to an embodiment in a projector; FIG. 12B is a side view illustrating an example of the configuration of the projector according to the embodiment of FIG. 12A. 11 is a perspective cross-sectional view illustrating another sealing structure of the light emitting module according to the embodiment. FIG.

The embodiments will be described below with reference to the drawings. However, the forms shown below are illustrative of a light emitting module and a method for manufacturing the light emitting module for realizing the technical concept of the present embodiment, and are not limited to the following. Furthermore, unless otherwise specified, the dimensions, materials, shapes, relative positions, etc. of the components described in the embodiments are merely examples and are not intended to limit the scope of the present invention. Note that the sizes and positional relationships of the components shown in each drawing may be exaggerated to clarify the explanation. Furthermore, components using the same reference numerals in each embodiment as in other embodiments represent the same or corresponding components, and explanations may be omitted.

First Embodiment
FIG. 1A is a perspective view showing an example of the configuration of a light emitting module according to the first embodiment. FIG. 1B is a plan view showing an example of the configuration of a light emitting module according to the first embodiment. FIG. 1C is a plan view showing an example of the configuration of a mounting board according to the first embodiment. FIG. 1D is a plan view showing a state in which the mounting board of FIG. 1C is separated into two first mounting boards. FIG. 2A is an exploded perspective view showing an example of the configuration of a first light emitting device. FIG. 2B is a plan view showing an example of the configuration inside a package of the first light emitting device. FIG. 3A is an exploded perspective view showing an example of the configuration of a second light emitting device. FIG. 3B is a plan view showing an example of the configuration inside a package of the second light emitting device. FIG. 3C is a cross-sectional view taken along line IIIC-IIIC in FIG. 3B. FIG. 3D is a plan view showing an example of the configuration of the lower surface of the second light emitting device.

<Light Emitting Module>
The light emitting module 100 is mounted with either a first light emitting device 20a on which three light emitting elements 22 are mounted, or a second light emitting device 20b on which one more light emitting element 22 than the first light emitting device 20a is mounted, that is, four light emitting elements 22 are mounted. The first mounting board 10a has two connection patterns 15 corresponding to both the first light emitting device 20a and the second light emitting device 20b on the mounting surface. A desired light emitting device 20 selected from the first light emitting device 20a and the second light emitting device 20b is connected to the two connection patterns 15 provided on the mounting surface of the first mounting board 10a. Specifically, the light emitting device 20 is connected in any combination of two first light emitting devices 20a, two second light emitting devices 20b, or one first light emitting device 20a and one second light emitting device 20b. Furthermore, a mounting board 10 using one first mounting board 10a or a mounting board 10 using two first mounting boards 10a arranged side by side is formed.

When two mounted substrates 10 are formed, there are cases where only one light emitting device is selected and connected from the first light emitting device 20a and the second light emitting device 20b to the first mounted substrate 10a, which is one of the two substrates, or cases where two light emitting devices are selected and connected to the first mounted substrate 10a. It is also possible to form the mounted substrate 10 with one first mounted substrate 10a, and to realize a light emitting module 100 in which only one light emitting device is selected and connected to the first mounted substrate 10a from the first light emitting device 20a and the second light emitting device 20b.
In the example of Figure 1, a mounting substrate 10 is formed in which two first mounting substrates 10a are arranged side by side, and each of the first mounting substrates 10a has two connection patterns 15 each having a light-emitting module 100 in which one first light-emitting device 20a and one second light-emitting device 20b are joined together.
Each component of the light emitting module 100 will be described below.

The light emitting module 100 includes a mounting substrate 10 and a light emitting device 20 .
[Mounting board]
The mounting substrate 10 is composed of one first mounting substrate 10a or two first mounting substrates 10a each having the same configuration. In the example of Fig. 1C, the mounting substrate 10 is composed of two first mounting substrates 10a arranged side by side.
The first mounting substrate 10a has a bottom surface, a top surface, and side surfaces, and on the top surface, a connection pattern 15 consisting of a metal portion 11 and a first metal film 12, a second metal film 13, and an insulating film 14 are formed.
The first mounting board 10a has a mounting surface on the upper surface on which two identical connection patterns 15 are provided. One light emitting device 20 is mounted on one connection pattern 15, and therefore the first mounting board 10a is formed so that two light emitting devices 20 can be mounted. The first mounting board 10a employs the same connection pattern 15 in providing two connection patterns, thereby facilitating the formation of the connection patterns on the first mounting board 10a. Note that the number of connection patterns 15 may be more than two, and for example, three connection patterns 15 may be provided in a row. A plurality of connection patterns 15 are provided on one first mounting board 10a. The connection pattern 15 is composed of a metal portion 11 exposed from the insulating film 14 and a first metal film 12 formed on the insulating film 14, and the metal portion 11 and the first metal film 12 become the mounting surface of the light emitting device. Note that the metal portion 11 may be configured so that a metal film is formed on the upper surface. For example, similar to the first metal film 12, the metal portion 11 may be provided by forming a metal film on the insulating film 14.

The metal part 11 is a portion on which the light emitting device 20 is placed, and is formed in a rectangular shape in a plan view, with two metal parts formed side by side in the horizontal direction. The metal part 11 is formed without the insulating film 14 on the upper surface of the first mounting substrate 10a, with the substrate being exposed as it is. The metal part 11 may be formed of multiple metal layers. For example, a metal layer may be provided in the region of the metal part 11 of the substrate to make it the same height as the insulating film 14 or the first metal film 12 provided on the upper surface of the substrate, and the metal part 11 may be formed of multiple metal layers.
The insulating film 14 is provided on the upper surface of the first mounting substrate 10a excluding the metal portion 11. The first metal film 12 and the second metal film 13 are provided on the insulating film 14.

The first metal films 12 are formed in pairs for each metal portion 11, three on the upper side and three on the lower side of the metal portion 11, in a plan view. The second metal film 13 is provided on one of the first metal films 12 provided above and below. The second metal film 13 is not provided on the other first metal film 12. The second metal film 13 and the first metal film 12 provided on the second metal film 13 side are formed by providing a single metal film in which they are connected on an insulating film 14, and providing an insulating film 14 on top of the single metal film so as to separate the first metal film 12 and the second metal film 13. In other words, the first metal film 12 and the second metal film 13 are connected and electrically connected, although they cannot be seen from the surface.
The three first metal films 12 on the side where the second metal film 13 is not provided are connected between the two connection patterns 15. That is, similarly, a metal film connected into one is provided on the insulating film 14, and the insulating film 14 is provided from above so that there are three first metal films 12 in each connection pattern 15. Therefore, the two connection patterns 15 are connected to each other by the first metal films 12 on the side where the second metal film 13 is not provided, and are electrically connected. The metal portion 11 is not connected to the first metal film 12.
The first metal films 12, which are provided in pairs above and below the metal portion 11, are electrically connected from one to the other by bonding to a metal film 37 provided on the underside of the light emitting device 20. In addition, by mounting the light emitting device 20 on two connection patterns 15, it is possible to achieve electrical continuity from one second metal film 13 through the two light emitting devices 20 to the other second metal film 13.

In this way, the first mounting substrate 10a and the light emitting device 20 can be electrically connected. In addition, since the first metal film 12 is provided in three separate regions in the first mounting substrate 10a, self-alignment can be effectively used when mounting the light emitting device 20. When only one light emitting device 20 is mounted, electrical connection can be established from the first metal film 12 on the side of the connection pattern 15 to which the light emitting device is not joined, on which the second metal film 13 is not provided. Furthermore, since the second metal film 13 is provided only on one side, the mounting direction can be specified from the position of the second metal film. The two first mounting substrates 10a in the mounting substrate 10 are arranged side by side so that the side opposite to the side on which the second metal film 13 is formed faces each other.
The first mounting substrate 10a has through holes formed therein that penetrate in the substrate thickness direction, at positions that correspond to the left and right sides of the first metal film 12 when the direction in which the first metal film 12 is provided across the metal portion 11 is considered to be up and down, outside the region in which the two connection patterns 15 are arranged side by side. These through holes are provided for fastening positioning pins and fixing screws.

[Light-emitting device]
The light emitting device 20 includes a first light emitting device 20a and a second light emitting device 20b. Each of the first light emitting device 20a and the second light emitting device 20b includes a package 21, a semiconductor laser element 22, a submount 23, a light reflecting member 24, a protective element 25, a wire 26, a cover member 27, an adhesive portion 28, and a lens member 29.

The first light emitting device 20a and the second light emitting device 20b have the same external shape, but the number of semiconductor laser elements 22 mounted inside the external shape is different. That is, in this embodiment, a package 21 capable of mounting four semiconductor laser elements 22 is adopted for both the first light emitting device 20a and the second light emitting device 20b. Therefore, for the same package 21, the first light emitting device 20a having three semiconductor laser elements 22 mounted thereon as shown in FIG. 2A and FIG. 2B, and the second light emitting device 20b having four semiconductor laser elements 22 mounted thereon as shown in FIG. 3A and FIG. 3B are manufactured. By making the first light emitting device 20a and the second light emitting device 20b have the same external shape by making the package the same, when bonding to the mounting board, it is not necessary to consider that the size of the light emitting device is different on the mounting board side, regardless of which light emitting device is mounted. As a result, multiple connection patterns can be prepared in a unified layout, as in the first mounting board 10a. 3C and 3D show a cross section of the second light emitting device and the bottom surface (rear surface) of the second light emitting device, respectively, but the same is true for the first light emitting device. The number of semiconductor laser elements 22 mounted on the first light emitting device 20a is not limited to three. For example, it may be two, or it may be four or more. Alternatively, it may be one. The number of semiconductor laser elements 22 mounted on the second light emitting device 20b is one more than the number of semiconductor laser elements 22 mounted on the first light emitting device 20a. It may be two more.

The three semiconductor laser elements 22 of the first light emitting device 20a are disposed at the same positions as three of the four semiconductor laser elements 22 of the second light emitting device 20b. This allows the mounting positions of the semiconductor laser elements 22 in the package 21 to be the same for both the first light emitting device 20a and the second light emitting device 20b.
It is possible to arbitrarily determine which of the four semiconductor laser elements 22 are to be removed. For example, the three semiconductor laser elements 22 of the first light-emitting device 20a can be arranged side by side, biased toward one side of the package 21. In other words, the arrangement is such that one of the four semiconductor laser elements 22 arranged in the second light-emitting device 20b is removed from the semiconductor laser element 22 arranged at the end. In this way, the light from the first light-emitting device 20a can be suppressed to a small range. Also, for example, the three semiconductor laser elements 22 of the first light-emitting device 20a can be arranged such that one of the four semiconductor laser elements 22 arranged in the second light-emitting device 20b is removed from the semiconductor laser element 22 arranged at the other end. In this way, the difference in the length of the light-emitting region from end to end between the first light-emitting device 20a and the second light-emitting device 20b can be reduced. Note that the arrangement is not limited to this, and for example, the three semiconductor laser elements 22 may be evenly arranged in the area where the four semiconductor laser elements 22 are arranged.

The package 21 is formed in a rectangular shape in a plan view, and has a recess 30 that is rectangular in a plan view. Note that the term "rectangle" as used herein includes shapes that are generally rectangular, such as a shape in which corners or parts of the side are cut out, as in the package 21, or a shape in which corners are curved, as in the recess 30. In addition, the package 21 has a step portion 33 formed in part of an inner surface 32 of the recess 30. Specifically, the step portion 33 is provided on two of the four inner surfaces 32 of the recess 30 that are opposed to each other in the short direction.
The package 21 can be formed mainly from ceramic. The package 21 is not limited to being formed from ceramic, and may be formed from metal. For example, ceramics such as aluminum nitride, silicon nitride, aluminum oxide, and silicon carbide can be used as the main material of the package 21. Metals such as copper, aluminum, iron, and composites such as copper molybdenum, copper-diamond composite material, and copper tungsten can be used as the main material of the package 21.

A metal film is provided on the lower surface 34 of the package 21 and on the upper surface of the step portion 33. The metal film on the lower surface 34 of the package 21 includes metal films 37 provided in pairs at both ends of the package 21, and a metal film 38 provided in the center of the lower surface 34 of the package 21 between the metal films 37 at both ends. Each of the metal films 37 is provided in three locations along each of the two opposing sides, spaced apart from each other in an approximately rectangular shape. The metal films 37 are formed to face each other so that they can be connected to the first metal film 12 of the first mounting board 10a. The metal film 38 provided in the center of the lower surface 34 of the package 21 is formed to have a larger area than any of the metal films 37. The metal film 38 is formed to face each other so that it can be connected to the metal part 11 of the first mounting board 10a. In the package 21, the metal film on the upper surface of the step portion 33 and the metal film 37 on the lower surface 34 are electrically connected by metal wiring passing through the inside.

The package 21 may be formed by joining the frame 35 and the bottom 36, which form the frame of the recess 30, together, with the frame 35 and the bottom 36 being made of different main materials. For example, the package 21 may be formed by joining the plate-shaped bottom 36, which is made mainly of metal and has a predetermined thickness, to the frame 35, which is made mainly of ceramic and has a frame of a predetermined height. In this case, instead of providing the metal film 38, the underside of the bottom 36 can be connected to the metal part 11 of the first mounting substrate 10a.

The semiconductor laser element 22 and the protective element 25 are electrically connected to the connection wiring, which is a metal film provided on the upper surface of the step portion 33. Wires 26 are joined to provide this electrical continuity. Figures 2B and 3B show examples of joining the wires 26 when the semiconductor laser elements 22 are connected in series. Note that the connection method is not limited to this. A plurality of semiconductor laser elements 22 may also be connected in parallel. As a result, the semiconductor laser element 22 and the protective element 25 are electrically connected via the metal film 37 provided on the lower surface 34 of the package 21.

The two inner surfaces 32 of the package 21 facing each other in the longitudinal direction are not provided with the step portion 33. The size of the package 21 can be reduced by not providing the step portion 33 around the entire circumference of the inner surfaces 32. The step portion 33 may be provided on the inner surface 32 located farther from the light reflecting member 24. By expanding the area in which the step portion 33 is provided, more wiring area can be secured. On the other hand, the step portion 33 does not need to be provided on the inner surface 32 located closer to the light reflecting member 24. Even if the step portion 33 is provided in this portion, the semiconductor laser element 22 and the wiring area must be joined so that the wire 26 does not obstruct the optical path, making it difficult to provide a wiring area for the semiconductor laser element 22.
Furthermore, by not providing the step portion 33 on the inner surface 32, the light reflecting member 24 can be disposed closer to the outer surface of the package 21. Although details will be described later, when mounting two light emitting devices 20 on the mounting substrate 10, the distance between the lights emitted from the two light emitting devices 20 can be reduced. Note that, as shown in Figures 2B and 3B, the inner surface 32 on the side closer to the light reflecting member 24 can also be said to be the inner surface ahead in the direction in which the laser light emitted from the semiconductor laser element travels.

In such a light emitting device 20, the pair of metal films 37 provided on the underside 34 are bonded to the first metal film 12 of the first mounting substrate 10a. In addition, the metal film 38 provided between the pair of metal films 37 is bonded to the metal portion 11 of the first mounting substrate 10a. The light emitting device 20 and the first mounting substrate 10a can be bonded by soldering. In bonding the metal films 37 and 38 on the underside 34 of the light emitting device 20 to the first metal film 12 and metal portion 11 of the first mounting substrate 10a, self-alignment is utilized when fixing the light emitting device 20 to the first mounting substrate 10a.

The semiconductor laser element 22 has a bottom surface, a top surface, and a side surface, and emits laser light from one side surface. The laser light emitted from the semiconductor laser element 22 has a spreading property, and forms an elliptical far-field pattern (hereinafter referred to as "FFP") in a plane parallel to the light emission end surface.

The semiconductor laser element 22 is mounted on the bottom surface 31 (top surface of the bottom) of the recess 30 of the package 21 via the submount 23. A separate submount 23 is provided for each semiconductor laser element 22. Note that the light emitting device 20 may have a plurality of semiconductor laser elements 22 mounted on the upper surface of one submount 23. Also, the light emitting device 20 may have the semiconductor laser element 22 mounted directly on the bottom surface 31 of the recess 30 of the package 21 without the submount 23.
2B and 3B, the multiple semiconductor laser elements 22 mounted on the light emitting device 20 are aligned in one direction. Specifically, they are aligned in the longitudinal direction of the package 21. The orientation of the emission end faces of the mounted semiconductor laser elements 22 is aligned so that they emit laser light in the same direction. The positions of the emission end faces of the mounted semiconductor laser elements 22 are designed so that the emission end faces are arranged on the same plane. However, they do not necessarily have to be aligned on the same plane.
The semiconductor laser elements 22 arranged in one direction are electrically connected in series using wires 26. Laser light is emitted from the emission end faces of the semiconductor laser elements 22 in a direction perpendicular to the direction in which the semiconductor laser elements 22 are arranged.

All of the semiconductor laser elements 22 mounted on the first light-emitting device 20a and the second light-emitting device 20b are semiconductor laser elements that emit blue light. However, they may be semiconductor laser elements that emit light other than blue, such as red or green light. The color emitted by the semiconductor laser element 22 mounted on the first light-emitting device 20a may be different from the color emitted by the semiconductor laser element 22 mounted on the second light-emitting device 20b. For example, the first light-emitting device 20a is mounted with a semiconductor laser element 22 that emits blue light, and the second light-emitting device 20b is mounted with a semiconductor laser element 22 that emits red light. In addition, two first light-emitting devices 20a or two second light-emitting devices 20b may be mounted on the first mounting substrate 10a by joining them to two connection patterns 15. In this case, the semiconductor laser elements 22 that emit different colors may be mounted between the two mounted light-emitting devices 20.

Here, blue light refers to light whose peak emission wavelength is in the range of 420 nm to 494 nm, red light refers to light whose peak emission wavelength is in the range of 605 nm to 750 nm, and green light refers to light whose peak emission wavelength is in the range of 495 nm to 570 nm.
The semiconductor laser element 22 is an example of a light emitting element mounted in the light emitting module according to the present invention.

The submount 23 is bonded at its bottom surface to the bottom surface 31 of the recess 30 of the package 21, and at its top surface to the semiconductor laser element 22. The semiconductor laser element 22 is mounted on the submount 23 so that the emission end surface of the semiconductor laser element 22 is flush with or protrudes from the side surface of the submount 23. This prevents the light emitted from the semiconductor laser element 22 from irradiating the top surface of the submount 23. The submount 23 can be formed using, for example, silicon nitride, aluminum nitride, or silicon carbide. In addition, a metal film is provided on the top surface of the submount 23.

The light reflecting member 24 is a member that reflects light from the semiconductor laser element 22. The light reflecting member 24 is placed on the bottom surface of the recess 30 of the package 21. The light reflecting member 24 is arranged separately corresponding to each semiconductor laser element 22. Furthermore, in three or four semiconductor laser elements 22, the distance between the emission end surface of each semiconductor laser element 22 and the corresponding light reflecting member 24 is designed to be the same. Note that the distance may be determined according to the semiconductor laser element 22, or may be different between the multiple semiconductor laser elements 22. Furthermore, the light emitting device 20 may have one light reflecting member 24 arranged corresponding to the multiple semiconductor laser elements 22.

The light reflecting member 24 has a bottom surface, a top surface, side surfaces, and inclined surfaces, and the inclined surfaces are the light reflecting surfaces. The light reflecting surfaces are flat surfaces that are inclined from the top surface to the bottom surface. The light reflecting surfaces are designed to form a 45 degree angle with the bottom surface. Note that this angle does not have to be limited to 45 degrees, and the light reflecting surfaces may be curved surfaces rather than flat surfaces.

The light reflecting member 24 can be formed by forming its outer shape using a main material, and forming a light reflecting film on the surface of the formed outer shape where the light reflecting surface is to be provided. The main material is preferably a heat-resistant material, for example, quartz or glass such as BK7 (borosilicate glass), metal such as aluminum, or Si. The light reflecting film is preferably a material with high light reflectance, for example, metal such as Ag or Al, or dielectric multilayer film such as Ta ₂ O ₅ /SiO ₂ , TiO ₂ /SiO ₂ , or Nb ₂ O ₅ /SiO ₂ can be used. Note that when the light reflecting member 24 is formed into its outer shape using a material with high light reflectance such as metal as the main material, the formation of the light reflecting film may be omitted.

The main portion of the light emitted from the semiconductor laser element 22 is irradiated onto the light reflecting surface of the corresponding light reflecting member 24. By passing the light emitted from the semiconductor laser element 22 through the light reflecting member 24, the optical path length of the light until it enters the lens can be made longer than when the light reflecting member 24 is not interposed. This longer optical path length can reduce the influence of misalignment of the mounting of the light reflecting member 24 and the semiconductor laser element 22. Note that the light emitting device 20 may not have the light reflecting member 24 and the semiconductor laser element 22 may have an output end surface facing upward.

The protective element 25 is placed on the upper surface of the submount 23. The protective element 25 is, for example, a Zener diode. The wire 26 is a metal wiring. Examples of materials for the wire 26 include metals such as Au, Ag, Cu, Pt, and Al, and alloys thereof. The light-emitting device 20 may not have a protective element 25.

The lid member 27 is a member that covers the semiconductor laser element 22 and the light reflecting member 24. The lid member 27 is translucent as a whole, but may have a non-translucent region in part. The lid member 27 can be formed using sapphire as a main material. Also, a metal film is provided in a part of the lid member 27. Note that, other than sapphire, for example, glass, etc. can also be used as the main material.
The lower surface of the lid member 27 is bonded to the upper surface (upper surface of the frame) of the package 21. A metal film is provided in the bonded area of the lid member 27 and the package 21, and they are fixed via Au-Sn or the like. In the light emitting device 20, a closed space is formed by bonding the package 21 and the lid member 27. This closed space is a hermetically sealed space. By hermetically sealing in this manner, the light emitting device 20 can suppress the collection of organic matter and the like on the light emitting end face of the semiconductor laser element 22.

The adhesive portion 28 is formed on the upper surface of the lid member 27 in an area where the lid member 27 and the lens member 29 are bonded together. For example, an ultraviolet-curing resin can be used as the adhesive portion 28. The adhesive portion 28 is formed so that the lid member 27 and the lens member 29 do not come into contact with each other. The adhesive portion 28 is formed so that the position and height of the adhesive portion 28 are adjusted by adding a thickness, and then the lens member 29 is bonded to the lid member 27. The adhesive portion 28 is formed, for example, at a position opposite the outer edge of the lens member 29 so that the adhesive portion 28 is not provided on the optical path of the light emitted from the semiconductor laser element 22. Note that, although an example of the shape of the adhesive portion 28 after curing is shown in FIG. 2A and FIG. 3A, a soft adhesive can be used for the adhesive portion 28 when it is applied.

The lens member 29 is provided facing the upper surface of the cover member 27. The lens member 29 is formed integrally with a lens portion 51 having a lens shape and a rectangular support plate portion 52 that supports the lens portion 51. In the lens member 29, each of the lens portions 51 is provided at a position facing the optical axis of the semiconductor laser element 22. The arrangement and shape of each lens portion 51 are designed so that the reflected light emitted from the corresponding semiconductor laser element 22 and reflected by the light reflecting member 24 passes through the lens portion 51 and is collimated. As shown in Figures 2A and 3A, the same lens member 29 is used in both the first light-emitting device 20a and the second light-emitting device 20b, which have different numbers of semiconductor laser elements 22 mounted thereon. In other words, the same lens member 29 as the lens member 29 of the second light-emitting device 20b is also used for the lens member 29 of the first light-emitting device 20a. In this way, the lens member 29 can be unified even in the first light-emitting device 20a that is configured with an arrangement that excludes any of the four semiconductor laser elements 22 in the second light-emitting device 20b. In addition, the lens member 29 of the same design can be used for the first light-emitting device 20a and the second light-emitting device 20b.

The lens member 29 employed in the first light-emitting device 20a may have the number and arrangement of lens portions 51 corresponding to the number and arrangement of the semiconductor laser elements 22 mounted on the package 21. By matching the number of lens portions 51 to the number of the semiconductor laser elements 22, the lens member 29 can be made lighter than the lens member 29 of the second light-emitting device 20b that is matched to the number of the semiconductor laser elements 22.
The lens member 29 may be made of glass such as BK7 or B270.

In the light-emitting module 100 shown in Fig. 1A, two first mounting substrates 10a are arranged side by side to form a mounting substrate 10, and two light-emitting devices 20 are mounted on each of them, thereby realizing the light-emitting module 100 in which four light-emitting devices 20 are mounted in an array of two rows and two columns. In the light-emitting module 100 shown in Fig. 1A, the two light-emitting devices 20 in the array structure of one row and two columns are mounted in orientations that differ from each other by 180 degrees on the mounting surface.
Specifically, the light emitting module 100 is mounted on each of the first mounting substrates 10a with one first light emitting device 20a and one second light emitting device 20b arranged side by side and with the light reflecting members 24 adjacent to each other. In other words, the two light emitting devices 20 mounted on one first mounting substrate 10a are mounted such that the distance to the light reflecting member 24 arranged on one light emitting device 20 is shorter than the distance to the light reflecting member 24 arranged on the other light emitting device 20 than the semiconductor laser element 22, and this condition is also satisfied when one light emitting device 20 and the other light emitting device 20 are swapped.
Furthermore, in the light-emitting module 100, the first light-emitting devices 20a and the second light-emitting devices 20b are mounted such that the first light-emitting devices 20a and the second light-emitting devices 20b are both positioned diagonally opposite each other. In this manner, the four light-emitting devices are mounted in a matrix direction so as to be adjacent to each other on the mounting substrate 10, and the light-emitting devices 20 are mounted such that the light-reflecting members 24 are adjacent to each other in the row direction.

By arranging two light emitting devices 20 on one first mounting substrate 10a in this manner, it is possible to bring the light emitted from the two light emitting devices 20 closer to each other. In addition, since the distance between the semiconductor laser elements 22 between the two light emitting devices 20 can be increased, heat dissipation is improved. Furthermore, by arranging the two first mounting substrates 10a in this manner, it is possible to concentrate light on the center side of the mounting substrate 10.
In the optical unit disclosed in Patent Document 1, which includes multiple semiconductor devices each having four semiconductor elements mounted in a package, the light emitted from the semiconductor elements passes directly through the semiconductor devices and exits, so there was no need to consider how best to mount the two light emitting devices 20, as in the light emitting module 100, based on the relative positioning of the semiconductor laser elements and the light reflecting member mounted in the package.
On the other hand, the light emitting device 20 of the light emitting module 100 has a package in which a plurality of semiconductor laser elements 22 and a light reflecting member 24 are mounted. In this case, the two light emitting devices 20 are mounted in a suitable form on the mounting substrate 10, thereby realizing the light emitting module 100 that obtains the above-mentioned effects.
Furthermore, when manufacturing a light-emitting module 100 in which two first light-emitting devices 20a and two second light-emitting devices 20b, each having three semiconductor laser elements 22 arranged in the same arrangement, are mounted, the first light-emitting devices 20a can be arranged diagonally opposite each other, so that the semiconductor laser elements 22 in the two first light-emitting devices 20a are arranged symmetrically with respect to the center of the mounting substrate 10.
Although the light emitting devices 20 are mounted here such that the light reflecting members 24 are adjacent to each other in the row direction on the paper, the light emitting devices 20 may be mounted such that the light reflecting members 24 are adjacent to each other in the column direction on the paper. The light emitting devices 20 may be arranged such that the first light emitting devices 20a and the second light emitting devices 20b are adjacent to each other in the row direction, or the light emitting devices 20 may be arranged such that the first light emitting devices 20a and the second light emitting devices 20b are adjacent to each other in the column direction.

<Manufacturing method of light emitting module>
Next, an example of a method for manufacturing the light emitting module 100 according to the first embodiment will be described.
FIG. 4 is a flowchart showing the steps of the method for manufacturing the light-emitting module according to the first embodiment.
The manufacturing method of the light emitting module according to the first embodiment is the manufacture of a light emitting module 100 mounted with one or more light emitting devices on which a plurality of light emitting elements are mounted. The manufacturing method of the light emitting module 100 includes a step S101 of preparing a light emitting device, a step S102 of preparing a first mounting substrate, and a step S103 of mounting the light emitting device, which are performed in this order. Furthermore, the light emitting module 100 manufactured by this manufacturing method can be a light emitting module 100 mounted with any number of light emitting elements 22 selected from at least three consecutive numbers.

The steps of the manufacturing method for the light-emitting module 100 are described below. Note that the materials and arrangement of each component are the same as those described above in the description of the light-emitting module 100, so the description will be omitted here as appropriate.

[Step of preparing a light-emitting device]
Step S101 of preparing a light emitting device is a step of preparing, as light emitting devices, a first light emitting device and a second light emitting device which are different from each other in the number of semiconductor laser elements mounted thereon by one.
In step S101, a plurality of first light emitting devices 20a each having three semiconductor laser elements 22 and a plurality of second light emitting devices 20b each having four semiconductor laser elements 22 are prepared.

[Step of Preparing First Mounting Substrate]
Step S102 of preparing a first mounting substrate is a step of preparing a first mounting substrate having a mounting surface on which a plurality of identical connection patterns are provided, the connection patterns 15 corresponding to one light emitting device.
In this step S102, one or more first mounting substrates 10a are prepared, each of which has a mounting surface on which two connection patterns 15 corresponding to one light-emitting device 20 are provided, and which can be used with either the first light-emitting device 20a or the second light-emitting device 20b as a light-emitting device.

[Process for mounting the light emitting device]
The step S103 of mounting the light emitting devices is a step of mounting a plurality of light emitting devices selected from the first light emitting device and the second light emitting device on a plurality of connection patterns provided on the mounting surface of the first mounting substrate.
In this step S103, two desired light emitting devices selected from the first light emitting device 20a and the second light emitting device 20b are mounted on the two connection patterns 15 provided on the mounting surface of the first mounting substrate 10a.
Furthermore, as light emitting modules 100 mounted with the two selected light emitting devices 20, at least a light emitting module 100 mounted with two first light emitting devices 20a, a light emitting module 100 mounted with one first light emitting device 20a and one second light emitting device 20b, and a light emitting module 100 mounted with two second light emitting devices 20b are manufactured. The number of light emitting elements mounted increases by one in each of these three light emitting modules 100.
In this way, three light emitting modules 100 each having two different combinations of light emitting devices 20 mounted thereon are manufactured, making it possible to manufacture a light emitting module 100 equipped with any number of light emitting elements 22 selected from three consecutive numbers.

Note that the light emitting module 100 mounted with one or more light emitting devices on which a plurality of light emitting elements are mounted, which is manufactured by the manufacturing method according to the first embodiment, is not limited to these three light emitting modules 100. It is possible to manufacture a light emitting module 100 in which one light emitting device 20 is mounted on one first mounting substrate 10a, a light emitting module 100 in which a total of three light emitting devices 20 are mounted on two first mounting substrates 10a, and a light emitting module 100 in which a total of four light emitting devices 20 are mounted on two first mounting substrates 10a.
In the manufacturing of the light emitting module 100 shown in FIG. 1A, in step S103, two light emitting devices 20 (first light emitting device 20a and second light emitting device 20b) in a one row and two column arrangement are mounted on the mounting surface in a direction 180 degrees different from each other. In addition, in this step S103, two first mounting boards 10a on which two light emitting devices 20 (first light emitting device 20a and second light emitting device 20b) are mounted are arranged, thereby manufacturing a light emitting module 100 on which four light emitting devices 20 are mounted in a two row and two column arrangement. As a result, when viewed as a light emitting module 100, the four light emitting devices 20 can be arranged in the center. In addition, on the outer periphery of the four light emitting devices 20, through holes for screw fastening or the like are provided at both ends of one side so as to sandwich the four light emitting devices 20, and a second metal film 13 is provided at both ends of the other side. It is easier to connect to a power source when the second metal film 13 is provided at both ends than when it is provided so as to be sandwiched between two light emitting devices 20.

In this way, it is possible to manufacture a light emitting module 100 in which one to four light emitting devices are mounted using the first mounting substrate 10a, the first light emitting device 20a, and the second light emitting device 20b. Furthermore, with such a light emitting module 100, it is possible to provide a light emitting module 100 that can efficiently accommodate various specifications by adjusting the number of semiconductor laser elements 22 to be mounted to any number between 3 and 16 (excluding 5).
In addition, when the number of semiconductor laser elements 22 mounted on the first light-emitting device 20a is 2 and the number of semiconductor laser elements 22 mounted on the second light-emitting device 20b is 3, it is possible to provide a light-emitting module 100 that can be adjusted to any number from 2 to 12. When the number of semiconductor laser elements 22 mounted on the first light-emitting device 20a is 4 and the number of semiconductor laser elements 22 mounted on the second light-emitting device 20b is 5, it is possible to provide a light-emitting module 100 that can be adjusted to any number from 4 to 20 (however, excluding 6, 7, and 11).

Second Embodiment
Next, a second embodiment will be described.
Fig. 5A is a perspective view showing an example of the configuration of the light emitting module according to the second embodiment. Fig. 5B is a plan view showing an example of the configuration of the light emitting module according to the second embodiment. Fig. 5C is a plan view showing an example of the configuration of the mounting board according to the second embodiment. Fig. 5D is a plan view showing a state in which the mounting board in Fig. 5C is separated into a first mounting board and a second mounting board. The light emitting module according to the second embodiment is different in that a second mounting board is adopted in addition to the first mounting board adopted in the light emitting module according to the first embodiment.

<Light Emitting Module>
The light emitting module 100A shown in Fig. 5A includes a mounting substrate 10A and a light emitting device 20. The light emitting module 100A is a light emitting module in which three light emitting devices 20 are mounted.
In this case, the mounting board 10A of the light emitting module 100A is made up of a first mounting board 10a and a second mounting board 10b.
The second mounting substrate 10b has the same outer shape as the first mounting substrate 10a. The second mounting substrate 10b has a bottom surface, a top surface, and side surfaces, and the top surface has a mounting surface on which one connection pattern 15 identical to the connection pattern 15 provided on the first mounting substrate 10a is provided. By providing only one connection pattern 15 while maintaining the same outer shape, it is possible to achieve the same outer shape as when mounting is performed using two first mounting substrates 10a.

In this embodiment, the connection pattern 15 of the second mounting substrate 10b is provided near the center, and on the upper surface, the region where the connection pattern 15 of the second mounting substrate 10b is provided partially overlaps with each of the regions where the two connection patterns 15 are provided on the first mounting substrate 10a. Meanwhile, the positions of the second metal film 13 and the through holes are the same as those of the first mounting substrate 10a. By making the position of the second metal film 13 the same, when electrically connecting to an external power source, the connection method can be made common between the first mounting substrate 10a and the second mounting substrate 10b. For example, the connection to the second metal film 13 can be made through a connector, a flexible substrate, a glass epoxy substrate, a leaf spring terminal, or the like. When such a connection member is used, the first mounting substrate 10a and the second mounting substrate 10b can be connected with the same connection member. By making the position of the through holes the same, screws can be fastened at the same position as when mounting with two first mounting substrates 10a. In the second mounting substrate 10b, of the three first metal films 12 that are paired with the metal portion 11 in between, the three first metal films 12 that are provided closer to the second metal film 13 are linked and electrically connected to one of the two second metal films 13. Also, the three first metal films 12 that are provided farther from the second metal film 13 are linked and electrically connected to the other second metal film 13.
One light emitting device 20 is mounted on the second mounting substrate 10b, and in the example of Fig. 5A, one second light emitting device 20b is mounted. The first mounting substrate 10a and the second mounting substrate 10b are arranged so that the side opposite to the side on which the second metal film 13 is formed faces each other. Other matters are the same as those of the light emitting module 100 according to the first embodiment shown in Fig. 1A.

<Manufacturing method of light emitting module>
Next, an example of a method for manufacturing the light emitting module 100A according to the second embodiment will be described.
FIG. 6 is a flowchart showing the steps of a method for manufacturing a light-emitting module according to the second embodiment.
The manufacturing method of the light emitting module 100A includes a step S201 of preparing a light emitting device, a step S202 of preparing a first mounting substrate, a step S203 of preparing a second mounting substrate, a step S204 of determining the number of mounting substrates, a step S205 of mounting a light emitting device, and a step S206 of forming a light emitting module, which are performed in this order. Note that the material and arrangement of each member are as described in the description of the light emitting module 100 above, so the description will be omitted here as appropriate. In addition, the step S201 of preparing a light emitting device and the step S202 of preparing a first mounting substrate are the same as the step S101 of preparing a light emitting device and the step S102 of preparing a first mounting substrate in the manufacturing method of the light emitting module 100 according to the first embodiment, so the description will be omitted here.

[Step of Preparing Second Mounting Substrate]
The step S203 of preparing a second mounting board is a step of preparing a second mounting board having a mounting surface on which one connection pattern identical to the connection pattern provided on the first mounting board is provided.
In this step S203, a second mounting substrate 10b is prepared, the second mounting substrate 10b having a mounting surface on which one connection pattern 15 identical to the connection pattern 15 provided on the first mounting substrate 10a is provided.

[Step of determining the number of mounting boards, etc.]
Step S204 of determining the number of mounting boards, etc. is a step of determining the number, or the number and combination, of mounting boards to be used in manufacturing the light emitting module from a plurality of mounting boards including at least the first mounting board and the second mounting board.
In this step S204, it is determined whether to form the mounting board 10A of the light emitting module 100A using one mounting board or to form the mounting board 10A of the light emitting module 100A using two mounting boards. In addition, if one board is used, it is determined whether to use the first mounting board 10a or the second mounting board 10b, and if two boards are used, it is determined whether to combine two first mounting boards 10a or to combine one first mounting board 10a and one second mounting board 10b. Although it is possible to form the mounting board 10A by combining two second mounting boards 10b, if it is desired to mount two light emitting devices 20, it is better to use one first mounting board 10a to realize a smaller light emitting module 100A.
In manufacturing the light emitting module 100A shown in FIG. 5A, it has been decided that two mounting boards, a first mounting board 10a and a second mounting board 10b, will be used in combination to form the mounting board 10A.

[Process for mounting the light emitting device]
Step S205 of mounting the light emitting device is a step of mounting one light emitting device selected from the first light emitting device and the second light emitting device to a connection pattern of the second mounting substrate when the second mounting substrate is used for the light emitting module. Also, step S205 is a step of mounting a plurality of light emitting devices selected from the first light emitting device and the second light emitting device to a plurality of connection patterns provided on the mounting surface of the first mounting substrate when the first mounting substrate is used for the light emitting module.
5A, one second light emitting device 20b is mounted on the second mounting substrate 10b. Also, one first light emitting device 20a and one second light emitting device 20b are mounted side by side on the first mounting substrate 10a, and the two light emitting devices 20 arranged in one row and two columns are mounted in orientations that differ by 180 degrees from each other on the mounting surface.

[Step of forming light-emitting module]
The step S206 of forming a light emitting module is a step of forming a light emitting module using at least one of the first mounting board and the second mounting board on which the light emitting devices are mounted in the determined number or number and combination.
In the manufacture of the light emitting module 100A shown in Fig. 5A, one first mounting board 10a on which one first light emitting device 20a and one second light emitting device 20b are mounted, and one second mounting board 10b on which one second light emitting device 20b is mounted are arranged side by side to form the light emitting module 100A. By using the second mounting board 10b when mounting one light emitting device 20, it is possible to prevent unused connection patterns 15 from occurring compared to the case of using the first mounting board 10a. In addition, in the first mounting board 10a, in order to electrically connect to an external power source, it is necessary to achieve conduction between the second metal film 13 on the connection pattern 15 side to which the light emitting device 20 is joined and the first metal film 12 of the connection pattern 15 to which the light emitting device 20 is not joined, but in the second mounting board 10b, conduction can be achieved with two second metal films 13. By using the first mounting substrate 10a when mounting two light emitting devices 20 on one mounting substrate, and by using the second mounting substrate 10b when mounting one light emitting device 20, electrical continuity with an external power source can be easily achieved using two second metal films 13 in either case.
As explained in the manufacturing method of the light emitting module 100 according to the first embodiment, it is clear that the light emitting module 100A manufactured by the manufacturing method according to the second embodiment can also provide a light emitting module having any number of light emitting devices 20 selected from 1 to 4 mounted thereon.

Third Embodiment
Next, a third embodiment will be described.
Fig. 7A is a plan view showing an example of the configuration of a light emitting module according to a third embodiment, Fig. 7B is a plan view showing an example of the configuration of a light emitting module according to a third embodiment, and Fig. 7C is a plan view showing an example of the configuration of a light emitting module according to a third embodiment.

In the light-emitting module 100B according to the third embodiment shown in FIG. 7A, the mounting board 10B of the light-emitting module 100B is configured as a single first mounting board 10c having a mounting surface on which four identical connection patterns 15 are arranged in a two-row, two-column array. In the light-emitting module 100B, any number of light-emitting devices 20 (1 to 4) are mounted on the four connection patterns 15. In FIG. 7A to FIG. 7C, a light-emitting module 100B on which four light-emitting devices 20 are mounted, a light-emitting module 100C on which three light-emitting devices 20 are mounted, and a light-emitting module 100D on which two light-emitting devices 20 are mounted are shown. By being able to mount four light-emitting devices 20 on a single mounting board, the manufacturing process can be simplified.

Through the first, second and third embodiments, configuration examples and manufacturing methods of the light emitting module according to the present invention have been described. In addition, in these descriptions, it has been stated that a light emitting module is realized that has a first light emitting device that is a light emitting device on which a plurality of light emitting elements are mounted, a second light emitting device that is a light emitting device on which one more light emitting element is mounted than the first light emitting device, and a first mounting board having a mounting surface on which a plurality of the same connection patterns are provided, which is a connection pattern corresponding to one light emitting device, and one or more first light emitting devices and one or more second light emitting devices are connected to the plurality of connection patterns provided on the mounting surface of the first mounting board. The light emitting module 100E shown in FIG. 8 shows a specific example of such a light emitting module in a suitable form in which the number of mounted light emitting elements is adjusted. By realizing such a light emitting module, it is possible to provide a light emitting module that can efficiently respond to various specifications regarding the light output.

Fourth Embodiment
Next, a fourth embodiment will be described.
Fig. 9A is a perspective view showing a schematic example of the configuration of a light emitting module according to the fourth embodiment. Fig. 9B is a plan view showing a schematic example of the configuration of a light emitting module according to the fourth embodiment. Fig. 9C is a plan view showing a schematic example of a first mounting substrate according to the fourth embodiment. Fig. 9D is a plan view showing a schematic example of a light emitting device and a thermistor mounted on a second mounting substrate according to the fourth embodiment. Fig. 9E is a plan view showing a schematic example of a second mounting substrate according to the fourth embodiment.

The light-emitting module according to the fourth embodiment differs from the mounting boards described in the first to third embodiments in that a metal film for mounting a thermistor is further provided on the mounting surface of the mounting board.
9C, in the first mounting board 10d according to the fourth embodiment, in addition to the metal part 11, the first metal film 12, the second metal film 13, and the insulating film 14, a third metal film 16 and a fourth metal film 17 are further provided on the mounting surface. The connection pattern 15 constituted by the metal part 11 and the first metal film 12 is similar to the contents described in the previous embodiments.

In the first mounting substrate 10d, the third metal film 16 is provided, and therefore the distance between the first metal film 12 and the second metal film 13 is greater than that in the first mounting substrate 10a. The two third metal films 16 are provided between the first metal film 12 and the second metal film 13, and are provided at positions with the same distance from the emitted light from the two light emitting devices 20. Therefore, in the first mounting substrate 10d, the two third metal films 16 are provided at positions with the same distance from the two connection patterns 15. In other words, the two third metal films 16 are provided so that the distance from one connection pattern 15 to one third metal film 16 is the same as the distance from the other connection pattern 15 to the other third metal film 16.
In addition, since the fourth metal film 17 is provided between the two second metal films 13, the distance between the two second metal films 13 is greater than that of the first mounting substrate 10a. Each of the two fourth metal films 17 is provided at a position sandwiched between the two second metal films 13.
The third metal film 16 and the fourth metal film 17 are formed by providing a single metal film in which the third metal film 16 and the fourth metal film 17 are connected on the insulating film 14, and providing the insulating film 14 on top of the single metal film so that the film is divided into the third metal film 16 and the fourth metal film 17. In other words, the third metal film 16 and the fourth metal film 17 are connected and electrically connected, although they cannot be seen from the surface. One third metal film 16 is connected to one fourth metal film 17, and the other third metal film 16 is connected to the other fourth metal film 17.

9A and 9B, a thermistor 90 is mounted on the third metal film 16. The thermistor 90 is an example of a temperature detection element used to measure the temperature when the light emitting module 100F is operating. The thermistor 90 is mounted in a state of being connected to both of the two third metal films 16, thereby allowing electrical conduction from one fourth metal film 17 through the thermistor 90 to the other fourth metal film 17.
In the light-emitting module 100F, the semiconductor laser elements 22 of the two light-emitting devices 20 mounted on the first mounting substrate 10d mainly serve as heat sources, and therefore the thermistor 90 is preferably disposed in a position close to both of the two light-emitting devices 20 and at the same distance from the emitted light of both light-emitting devices 20. In other words, when the two light-emitting devices 20 are designed so that the centers of the light emitted from the semiconductor laser elements 22 mounted on the two light-emitting devices 20 pass through the vertices of the lens portions 51, the thermistor 90 intersects with a midline that is equidistant from a straight line connecting the vertices of the lens portions 51 of one light-emitting device 20 and a straight line connecting the vertices of the lens portions 51 of the other light-emitting device 20, as viewed from above.

9D and 9E according to the fourth embodiment, like the first mounting board 10d, a third metal film 16 and a fourth metal film 17 are provided, and a thermistor 90 is mounted on the third metal film 16. Also, like the first mounting board 10d, the third metal film 16 is provided between the first metal film 12 and the second metal film 13, and the fourth metal film 17 is provided at a position sandwiched between two second metal films 13.
On the other hand, the thermistor 90 is provided at a position close to the emitted light from the light emitting device 20, and therefore, in the second mounting substrate 10e, it is provided at a position close to the apex of the lens portion 51 in the lens member 29 of the light emitting device 20. In other words, when the light emitting device 20 is designed so that the center of the light emitted from the multiple semiconductor laser elements 22 mounted thereon passes through the apex of the lens portion 51, the thermistor 90 intersects with a straight line connecting the apexes of the lens portions 51 in a top view.
As described above, in the light-emitting module 100F according to the fourth embodiment, the mounting substrate 10 is provided with a metal film for mounting the thermistor 90, which makes it possible to measure the temperature during operation of the light-emitting module 100F. Therefore, the operation of the semiconductor laser element 22 can be controlled in response to the measured temperature.

The light-emitting module manufactured in this manner can be used, for example, in various projectors with different specifications. Specifically, a light-emitting module formed using one or more of the first mounting board and the second mounting board on which the light-emitting devices are mounted in a determined number or number and combination is mounted on a heat sink to become a component of the projector.

Next, an example of mounting when the light emitting module according to this embodiment is applied to a projector will be described. Note that, here, a mounting board composed of one or more first mounting boards 10a will be described as an example, but it goes without saying that the present invention is not limited to this. The mounting board can be configured by using the desired first mounting board or second mounting board described in the first to fourth embodiments.
FIG. 10A is a perspective view showing an example of mounting when a light-emitting module according to an embodiment is applied to a projector. FIG. 10B is a perspective cross-sectional view for explaining a sealing structure of the light-emitting module according to an embodiment. FIG. 11A is a perspective view showing an example of mounting when a light-emitting module according to an embodiment is applied to a projector. FIG. 11B is a plan view showing an example of a configuration of the projector according to the embodiment of FIG. 11A. FIG. 11C is a side view showing an example of a configuration of the projector according to the embodiment of FIG. 11A. FIG. 12A is a perspective view showing an example of mounting when a light-emitting module according to an embodiment is applied to a projector. FIG. 12B is a side view showing an example of a configuration of the projector according to the embodiment of FIG. 12A. FIG. 13 is a perspective cross-sectional view for explaining another sealing structure of the light-emitting module according to an embodiment.
For the sake of convenience, these drawings show a part of the inside of the projector in a see-through manner.

As shown in FIGS. 10A and 10B, the projector 200 includes a sealing member 60.
The sealing member 60 is a member for forming a sealed space surrounding the light emitting device 20 mounted on the mounting substrate 10 in the light emitting module. In addition, the optical system of the projector is mounted inside this sealed space. That is, an optical unit for generating a projection image projected by the projector is mounted. Examples of the optical unit include a lens, a mirror, a DMD (Digital Mirror Device), a prism, and the like. In addition, an optical unit including an optical unit including a liquid crystal panel, a phosphor wheel, a rod integrator, and the like, or an optical unit using appropriate components from each of these components may be configured, and an appropriate optical system is designed. The projection image generated by the optical unit is emitted to the outside from the sealing member 60 and projected onto the screen of the projector. In order to further reduce the probability of a decrease in the output of the projector due to light dust collection, it is preferable that all of the components constituting the optical unit are accommodated in the sealed space formed by the sealing member 60 and the mounting substrate 10. When the sealing member 60 is made small, only a part of the components constituting the optical unit may be accommodated in the sealed space.

In the projector 200, a light-emitting module is manufactured in which two light-emitting devices 20 are mounted on one first mounting substrate 10a, and the light-emitting module is covered with a sealing member 60. Note that although the sealing member 60 is formed in a rectangular parallelepiped shape here, the shape of the sealing member 60 is not particularly limited. In other words, the sealing member 60 can have a shape according to the shape of the optical unit to be designed.
A sealing member 70 is provided on the first mounting substrate 10a around the light emitting device 20 and surrounds the two light emitting devices 20. The sealing member 70 is provided between the first metal film 12 and the second metal film 13 so that the second metal film 13 is provided outside the sealed space. This allows the light emitting device 20 to be easily connected to an external power source. The sealing member 70 is provided inside the through holes on both sides so that the through holes of the first mounting substrate 10a are provided outside the sealed space. This makes it unnecessary to consider the influence of the through holes in forming the sealed space. The sealing member 60 is bonded to the first mounting substrate 10a via the sealing member 70 to form a sealed space. This prevents objects that cause light dust collection, such as dust, resin outgassing, and organic components of grease, from entering the sealing member 60.

Examples of the material of the sealing member 60 include metal, glass, sapphire, etc. It is only necessary that the portion of the sealing member 60 through which light is emitted to the outside is made of a light-transmitting material such as glass or sapphire.
Examples of the material of the sealing member 70 include metal, resin, rubber, and the like. Also, the material of the sealing member 70 may be, for example, a material that easily deforms when pressed, such as sponge, clay, and the like. When a metal is used for the sealing member 70, it is preferable to provide a sufficient gap between the sealing member 70 and the first metal film 12 provided on the side farther from the second metal film 13 to avoid the sealing member 70 coming into contact with the first metal film 12. This makes it possible to prevent a short circuit caused by the sealing member 70. If an insulating material is used, the sealing member 70 will not be conductive even if it comes into contact with the first metal film 12 or the second metal film 13.

A projector 200A shown in FIGS. 11A, 11B, and 11C includes a sealing member 60A.
In the projector 200A, a light emitting module is manufactured in which four light emitting devices 20 are mounted on two first mounting substrates 10a, and the light emitting module is covered with a sealing member 60A. In addition, a sealing member 70 is formed so as to surround two light emitting devices 20 for each first mounting substrate 10a.
The sealing member 60A has a convex first pressing portion 63 across the boundary between the first mounting substrates 10a. The first pressing portion 63 presses the sealing member 70 provided along the boundary in each of the first mounting substrates 10a, and closes the boundary between the two first mounting substrates 10a. If the two first mounting substrates 10a are joined at the boundary, the first pressing portion 63 may not be required. For example, since each mounting substrate has a member tolerance, it is possible to arrange the first mounting substrates 10a side by side with a width that does not contact each other, rather than joining two first mounting substrates 10a to form the mounting substrate 10. If the first mounting substrates 10a are too far apart, the size of the light-emitting module or projector will increase, so if you want to reduce the size, it is better to reduce the width. For example, it is better to provide a width between the two mounting substrates in the range of 0.1 mm to 1.0 mm. Alternatively, it can be said that the distance from one mounting board to the other mounting board is preferably 0.1 mm or more and 1.0 mm or less. When mounting with a gap like this, the provision of the first pressing portion 63 can prevent outside air from entering through the boundary and ensure airtightness.
10A and 11A are merely examples, and any of the light-emitting modules manufactured by the above-mentioned manufacturing method can be applied. That is, a light-emitting module in which one or two mounting substrates are arbitrarily selected from the first mounting substrate 10a and the second mounting substrate 10b to form the mounting substrate 10 can be applied. Also, a light-emitting module in which any number of first light-emitting devices 20a and second light-emitting devices 20b are mounted on the mounting substrate 10 can be applied.

Furthermore, the present invention is not limited to a single light emitting module, but may also be applied to a plurality of light emitting modules.
A projector 200B shown in FIGS. 12A and 12B includes a sealing member 60B.
In the projector 200B, two light emitting modules are manufactured, each having two light emitting devices 20 mounted on two first mounting substrates 10a, and two more light emitting modules are arranged side by side. Therefore, a total of eight light emitting devices 20 are covered with the sealing member 60B. In addition, the sealing member 70 is formed for each first mounting substrate 10a.
In the projector 200B, two mounting substrates 10 are arranged side by side with their through holes adjacent to each other.
In addition to the first pressing portion 63, the sealing member 60B has a convex second pressing portion 64 that spans the through holes of the two mounting substrates 10. The second pressing portion 64 presses the sealing members 70 provided on the two mounting substrates 10 to form a sealed space. Each mounting substrate 10 is fixed by passing a fixing screw 80 through the through hole for fixing the mounting substrate 10 to the heat sink. By providing the second pressing portion 64, it is possible to prevent outside air from entering through the through hole and ensure hermeticity.

Also, FIG. 13 shows another example of a sealing structure using a sealing member and a sealing member. In this way, the sealing member 60C may have a protrusion 65 that joins with the sealing member 70 at the side and bottom. The protrusion 65 covers the side of the sealing member 70 facing the light emitting device 20. By having the sealing member 60C have the protrusion 65, the joint with the sealing member 70 has a claw structure. With such a structure, the adhesion between the sealing member 60C and the sealing member 70 is further improved, and the sealing ability of the sealing member 60C is improved.

10, 10A, 10B, 10C Mounting substrate 10a, 10c, 10d First mounting substrate 10b, 10e Second mounting substrate 11 Metal portion 12 First metal film 13 Second metal film 14 Insulating film 15 Connection pattern 16 Third metal film 17 Fourth metal film 20 Light emitting device 21 Package 22 Light emitting element (semiconductor laser element)
Reference Signs List 23 Submount 24 Light reflecting member 25 Protective element 26 Wire 27 Lid member 28 Adhesive portion 29 Lens member 30 Recess 31 Bottom surface of recess 32 Inner side surface of recess 33 Step portion 34 Lower surface 35 Frame portion 36 Bottom portion 37 Metal film 38 Metal film 51 Lens portion 52 Support plate portion 60, 60A, 60B, 60C Sealing member 63 First pressing portion 64 Second pressing portion 65 Protrusion portion 70 Sealing member 80 Fixing screw 90 Thermistor 100, 100A, 100B, 100C, 100D, 100E, 100F Light emitting module 200, 200A, 200B Projector

Claims (1)

Two light emitting devices each including a package, a plurality of semiconductor laser elements mounted on the package, and one or a plurality of light reflecting members mounted on the package and configured to reflect laser light emitted from the plurality of semiconductor laser elements;
a mounting substrate having a mounting surface on which the two light emitting devices are mounted;
The two light emitting devices are mounted on the mounting surface of the mounting substrate in orientations that are 180 degrees different from each other.

Images