JP2023086810A - Manufacturing method of light emitting module, light emitting module, and projector - Google Patents

Abstract

To provide a manufacturing method of a light emitting module capable of efficiently corresponding to various specifications, regarding the light to be output, or to provide a light emitting module which has a favorable form in which the number of light emitting elements to be mounted is adjusted.SOLUTION: A manufacturing method of a light emitting module includes the steps of: preparing a first light emitting device 20a and a second light emitting device 20b in which the numbers of light emitting elements to be mounted are different by one, in a light emitting device 20 in which a plurality of light emitting elements are mounted; preparing a first mounting substrate 10a having a mounting surface on which a plurality of same connection patterns, which are connection patterns corresponding to one light emitting device 20, are provided; and mounting the plurality of light emitting devices 20 selected out of the first light emitting devices 20a and the second light emitting devices 20b, with respect to the plurality of connection patterns provided on the mounting surface of the first mounting substrate 10a. A light emitting module 100 can be manufactured in which light emitting elements of an arbitrary number selected at least from the consecutive three numbers are mounted.SELECTED DRAWING: Figure 1A

Description

The present disclosure relates to a method for manufacturing a light emitting module, a light emitting module, and a projector.

2. Description of the Related Art Conventionally, light-emitting modules have been developed in which a light-emitting device in which a plurality of light-emitting elements are mounted in one package is mounted on one mounting substrate. Japanese Unexamined Patent Application Publication No. 2002-100000 discloses an optical unit in which a plurality of semiconductor devices each having four semiconductor elements mounted in one package are provided on a unit substrate.

JP 2007-227422 A

The required light output of the light-emitting module varies depending on the application, size, etc. of the product in which it is mounted. Therefore, as a method for flexibly responding to the required light output, a method of adjusting the number of light-emitting elements mounted on the product is conceivable. However, there is room for improvement in efficiently meeting the various specifications required for output light.

Accordingly, an object of the embodiments of the present disclosure is to provide a method of manufacturing a light-emitting module that can efficiently meet various specifications regarding output light.

Alternatively, an object of the embodiments according to the present disclosure is to provide a light-emitting module of a suitable form in which the number of light-emitting elements to be mounted is adjusted.

A light-emitting module according to an embodiment of the present disclosure includes: a first light-emitting device including a plurality of first semiconductor laser elements; a first package on which the plurality of first semiconductor laser elements are arranged in one direction; and a second package on which the plurality of second semiconductor laser elements are arranged in one direction, and a first connection pattern on which the first light emitting device is mounted. and a second connection pattern on which the second light-emitting device is mounted, and a mounting substrate having a mounting surface provided with the second semiconductor laser element mounted on the second light-emitting device. The number is one more than the number of the first semiconductor laser elements mounted on the first light emitting device, and the first package and the second package have the same outer shape.
A method for manufacturing a light-emitting module according to an embodiment of the present disclosure is a method for manufacturing a light-emitting module in which one or a plurality of light-emitting devices on which a plurality of light-emitting elements are mounted is mounted, wherein the light-emitting device a step of preparing a first light emitting device and a second light emitting device each having a different number of light emitting elements mounted thereon; and a connection pattern corresponding to one of the light emitting devices, wherein the same connection pattern preparing a first mounting substrate having a plurality of mounting surfaces; and mounting a plurality of said light emitting devices selected from among said light emitting modules, wherein said light emitting module mounted with any number of light emitting elements selected from at least three consecutive numbers can be manufactured. .

A light-emitting module according to an embodiment of the present disclosure includes a first light-emitting device that is a light-emitting device on which a plurality of light-emitting elements are mounted, and a light-emitting device on which one more light-emitting element than the first light-emitting device is mounted. a second light emitting device; and a first mounting substrate having a mounting surface provided with a plurality of the same connection patterns corresponding to one of the light emitting devices, wherein the first mounting substrate has One or more of the first light emitting devices and one or more of the second light emitting devices are connected to the plurality of connection patterns provided on the mounting surface.

A projector according to an embodiment of the present disclosure includes the light-emitting module described above, a sealing member provided on a mounting substrate of the light-emitting module, and a sealed space formed by joining the mounting substrate with the sealing member interposed therebetween. A sealing member to be formed, a light emitting device to be mounted on the mounting substrate in the formed sealed space, and an optical unit to be provided in the formed sealed space.

According to the method for manufacturing a light-emitting module according to the embodiment of the present disclosure, it is possible to efficiently meet various specifications. Further, according to the light-emitting module according to the embodiment of the present disclosure, it is possible to provide a suitable form in which the number of light-emitting elements to be mounted is adjusted.

1 is a perspective view schematically showing an example of a configuration of a light emitting module according to a first embodiment; FIG. 1 is a plan view schematically showing an example of a configuration of a light emitting module according to a first embodiment; FIG. It is a top view showing typically an example of composition of a mounting substrate concerning a 1st embodiment. FIG. 1C is a plan view showing a state in which the mounting substrate of FIG. 1C is separated into two first mounting substrates; 1 is an exploded perspective view schematically showing the configuration of a first light emitting device; FIG. It is a top view which shows typically the structure in the package of a 1st light-emitting device. FIG. 4 is an exploded perspective view schematically showing the configuration of a second light emitting device; FIG. 4 is a plan view schematically showing the configuration inside the package of the second light emitting device; FIG. 3C is a cross-sectional view taken along line IIIC-IIIC of FIG. 3B; It is a top view which shows typically the structure of the lower surface of a 2nd light-emitting device. 4 is a flow chart showing procedures of a method for manufacturing a light emitting module according to the first embodiment; FIG. 10 is a perspective view schematically showing an example of the configuration of a light emitting module according to a second embodiment; FIG. 10 is a plan view schematically showing an example of the configuration of a light emitting module according to a second embodiment; FIG. 10 is a plan view schematically showing an example of the configuration of a mounting substrate according to a second embodiment; FIG. 5C is a plan view showing a state in which the mounting board of FIG. 5C is separated into a first mounting board and a second mounting board; 8 is a flow chart showing the procedure of a method for manufacturing a light emitting module according to the second embodiment; FIG. 11 is a plan view schematically showing an example of the configuration of a light emitting module according to a third embodiment; FIG. 11 is a plan view schematically showing an example of the configuration of a light emitting module according to a third embodiment; FIG. 11 is a plan view schematically showing an example of the configuration of a light emitting module according to a third embodiment; 1 is a plan view schematically showing an example of a configuration of a light emitting module according to an embodiment; FIG. FIG. 14 is a perspective view schematically showing an example of the configuration of a light emitting module according to a fourth embodiment; FIG. 11 is a plan view schematically showing an example of the configuration of a light emitting module according to a fourth embodiment; It is a top view showing typically for explaining the 1st mounting board concerning a 4th embodiment. FIG. 11 is a plan view schematically showing a light emitting device and a thermistor mounted on a second mounting substrate according to a fourth embodiment; It is a top view showing typically for explaining the 2nd mounting board concerning a 4th embodiment. 1 is a perspective view schematically showing an example of mounting when applying a light-emitting module according to one embodiment to a projector; FIG. 1 is a perspective cross-sectional view for explaining a sealing structure of a light emitting module according to one embodiment; FIG. 1 is a perspective view schematically showing an example of mounting when applying a light-emitting module according to one embodiment to a projector; FIG. 11B is a plan view schematically showing an example of the configuration of the projector according to the embodiment of FIG. 11A; FIG. 11B is a side view schematically showing an example of the configuration of the projector according to the embodiment of FIG. 11A; FIG. 1 is a perspective view schematically showing an example of mounting when applying a light-emitting module according to one embodiment to a projector; FIG. 12B is a side view schematically showing an example of the configuration of the projector according to the embodiment of FIG. 12A; FIG. FIG. 10 is a perspective cross-sectional view for explaining another sealing structure of the light emitting module according to one embodiment;

Embodiments are described below with reference to the drawings. However, the embodiments described below are intended to exemplify the light-emitting module and the method for manufacturing the light-emitting module for embodying the technical idea of the present embodiment, and are not limited to the following. In addition, unless there is a specific description, the dimensions, materials, shapes, relative arrangements, etc. of the components described in the embodiments are not intended to limit the scope of the present invention, but are merely examples. It's nothing more than Note that the sizes and positional relationships of members shown in each drawing may be exaggerated for clarity of explanation. Also, in each embodiment, members using the same reference numerals as those in other embodiments represent the same or corresponding members, and description thereof may be omitted.

<First Embodiment>
1A is a perspective view schematically showing an example of the configuration of a light emitting module according to a first embodiment; FIG. 1B is a plan view schematically showing an example of the configuration of the light emitting module according to the first embodiment; FIG. 1C is a plan view schematically showing an example of the configuration of the mounting board according to the first embodiment; FIG. FIG. 1D is a plan view showing a state in which the mounting substrate in FIG. 1C is separated into two first mounting substrates. FIG. 2A is an exploded perspective view schematically showing the configuration of the first light emitting device. FIG. 2B is a plan view schematically showing the configuration inside the package of the first light emitting device. FIG. 3A is an exploded perspective view schematically showing the configuration of the second light emitting device. FIG. 3B is a plan view schematically showing the configuration inside the package of the second light emitting device. FIG. 3C is a cross-sectional view taken along line IIIC-IIIC of FIG. 3B. FIG. 3D is a plan view schematically showing the configuration of the bottom surface of the second light emitting device.

<Light emitting module>
In the light emitting module 100, the first light emitting device 20a on which three light emitting elements 22 are mounted, or one more light emitting device 22 than the first light emitting device 20a is mounted, that is, the four light emitting elements 22 are mounted. is mounted. It also has a first mounting board 10a on which two connection patterns 15 corresponding to both the first light emitting device 20a and the second light emitting device 20b are provided on the mounting surface. A desired light emitting device 20 selected from the first light emitting device 20a and the second light emitting device 20b is connected to the two connection patterns 15 provided on the mounting surface of the first mounting board 10a. Specifically, two first light emitting devices 20a, two second light emitting devices 20b, or one first light emitting device 20a and one second light emitting device 20b are connected. Also, the mounting board 10 using one first mounting board 10a or the mounting board 10 using two first mounting boards 10a arranged side by side is formed.

When two mounting substrates 10 are formed, one of the two first mounting substrates 10a has only one light emitting device out of the first light emitting device 20a and the second light emitting device 20b. is selected and connected, and two light emitting devices are selected and connected. Also, the mounting board 10 is formed by one first mounting board 10a, and only one light emitting device is selected from the first light emitting device 20a and the second light emitting device 20b for the one first mounting board 10a. A connected light emitting module 100 can also be realized.
In the example of FIG. 1, the mounting substrate 10 is formed by arranging two first mounting substrates 10a, and two connection patterns 15 of each of the first mounting substrates 10a have one first light emitting device. A light emitting module 100 is shown in which 20a and one second light emitting device 20b are joined together.
Each configuration of the light emitting module 100 will be described below.

The light-emitting module 100 includes a mounting board 10 and a light-emitting device 20 .
[Mounting board]
The mounting substrate 10 is composed of one first mounting substrate 10a or two first mounting substrates 10a each having the same configuration. In the example of FIG. 1C, the mounting substrate 10 is configured by arranging two first mounting substrates 10a.
The first mounting board 10a has a lower surface, an upper surface, and side surfaces, and on the upper surface, a connection pattern 15 composed of a metal portion 11 and a first metal film 12, a second metal film 13, and an insulating film 14. and are formed.
The first mounting substrate 10a has a mounting surface on which two identical connection patterns 15 are provided. One light emitting device 20 is mounted on one connection pattern 15, so that the first mounting board 10a is formed so that two light emitting devices 20 can be mounted thereon. The first mounting board 10a has two connection patterns, and by adopting the same connection pattern 15, the formation of the connection patterns on the first mounting board 10a is facilitated. Note that the number of connection patterns 15 may be more than two, and for example, three connection patterns 15 may be arranged in a row. A plurality of connection patterns 15 are provided on one first mounting board 10a. The connection pattern 15 is composed of a metal portion 11 exposed from the insulating film 14 and a first metal film 12 formed on the insulating film 14. The metal portion 11 and the first metal film 12 form the light emitting device. It becomes the mounting surface of A metal film may be formed on the upper surface of the metal portion 11 . For example, like the first metal film 12 , the metal portion 11 may be provided by forming a metal film on the insulating film 14 .

The metal part 11 is a part on which the light emitting device 20 is placed, and is formed in a rectangular shape in plan view, and two metal parts 11 are formed side by side in the horizontal direction. The insulating film 14 is not provided on the upper surface of the first mounting substrate 10a, and the metal portion 11 is formed by exposing the substrate as it is. Note that the metal portion 11 may be formed of a plurality of metal layers. For example, a metal layer is provided in the region of the metal portion 11 of the substrate so as to have the same height as the insulating film 14 or the first metal film 12 provided on the upper surface of the substrate, and a plurality of metal layers are formed. It may be
The insulating film 14 is provided on the upper surface of the first mounting substrate 10a excluding the metal portion 11. As shown in FIG. The first metal film 12 and the second metal film 13 are provided on the insulating film 14 .

The first metal films 12 are formed in pairs, three on the upper side of the metal part 11 and three on the lower side of the metal part 11 in plan view. A second metal film 13 is provided on one side of the first metal film 12 provided above and below. It is not provided on the other first metal film 12 side. The second metal film 13 and the first metal film 12 provided on the side of the second metal film 13 are connected to form a single metal film on the insulating film 14, and the first metal film is formed thereon. 12 and the second metal film 13 are formed by providing an insulating film 14 . In other words, the first metal film 12 and the second metal film 13 are not visible from the surface but are connected and electrically connected.
The three first metal films 12 on the side where the second metal film 13 is not provided are connected between the two connection patterns 15 . That is, similarly, a metal film connected to one is provided on the insulating film 14 , and the insulating film 14 is provided from above so that each connection pattern 15 has three first metal films 12 . . Therefore, the two connection patterns 15 are electrically connected by connecting the first metal films 12 on the side where the second metal film 13 is not provided. The metal part 11 is not connected to the first metal film 12 .
The first metal films 12 provided in a pair above and below with the metal portion 11 interposed therebetween are electrically connected from one to the other by bonding to the metal film 37 provided on the bottom surface of the light emitting device 20 . . Moreover, by mounting the light emitting devices 20 on the two connection patterns 15 , it is possible to conduct from one second metal film 13 through the two light emitting devices 20 to the other second metal film 13 .

Thus, the first mounting substrate 10a and the light emitting device 20 can be electrically connected. In addition, since the first metal film 12 is divided into three regions on the first mounting substrate 10a, self-alignment can be effectively activated when the light emitting device 20 is mounted. In addition, when only one light emitting device 20 is mounted, it is possible to conduct from the first metal film 12 on the side where the second metal film 13 is not provided of the connection pattern 15 to which the light emitting device is not joined. . Moreover, since the second metal film 13 is provided only on one side, the mounting direction can be specified from the position of the second metal film. The two first mounting substrates 10a in the mounting substrate 10 are arranged side by side so that the side surfaces opposite to the side on which the second metal film 13 is formed face each other.
Outside the area where the two connection patterns 15 are arranged side by side, the first mounting substrate 10a is positioned on the left and right when the direction in which the first metal film 12 is provided with the metal portion 11 interposed therebetween is taken as up and down. A through hole is formed through the substrate in the thickness direction. These through holes are provided for fastening positioning pins and fixing screws.

[Light emitting device]
The light emitting device 20 has a first light emitting device 20a and a second light emitting device 20b. Each of the first light emitting device 20a and the second light emitting device 20b includes a package 21, a semiconductor laser element 22, a submount 23, a light reflecting member 24, a protective element 25, a wire 26, a lid member 27, It has an adhesive portion 28 and a lens member 29 .

The first light emitting device 20a and the second light emitting device 20b have the same outer shape, but differ in the number of semiconductor laser elements 22 mounted inside the outer shape. That is, in this embodiment, the package 21 capable of mounting four semiconductor laser elements 22 is adopted for both the first light emitting device 20a and the second light emitting device 20b. Therefore, in the same package 21, a first light emitting device 20a having three semiconductor laser elements 22 mounted thereon as shown in FIGS. 2A and 2B and four semiconductor laser elements 22 as shown in FIGS. 3A and 3B is manufactured. Since the first light emitting device 20a and the second light emitting device 20b have the same package, they have the same outer shape. It eliminates the need to consider different device sizes. As a result, a plurality of connection patterns can be prepared in a unified layout like the first mounting board 10a. 3C and 3D respectively show the cross section of the second light emitting device and the lower surface (rear surface) of the second light emitting device, but the same applies to the first light emitting device. The number of semiconductor laser elements 22 mounted on the first light emitting device 20a is not limited to three. For example, it may be two, or four or more. Alternatively, it is possible to have one. The number of semiconductor laser elements 22 mounted on the second light emitting device 20b is one more than the number of semiconductor laser elements 22 mounted on the first light emitting device 20a. It should be noted that it is also possible to increase the number by two.

The three semiconductor laser elements 22 of the first light emitting device 20a are arranged at the same positions as the three semiconductor laser elements 22 out of the four semiconductor laser elements 22 of the second light emitting device 20b. Thereby, the mounting position of the semiconductor laser element 22 in the package 21 can be made common to both the first light emitting device 20a and the second light emitting device 20b.
It is possible to arbitrarily decide which of the four semiconductor laser elements 22 is excluded from the arrangement. For example, the three semiconductor laser elements 22 of the first light-emitting device 20a can be arranged side by side on one side of the package 21 . That is, one of the four semiconductor laser elements 22 arranged in the second light emitting device 20b is removed from the semiconductor laser element 22 arranged at the end. By doing so, the light from the first light emitting device 20a can be suppressed to a small range. Further, for example, the three semiconductor laser elements 22 of the first light emitting device 20a are one of the four semiconductor laser elements 22 arranged in the second light emitting device 20b except for one semiconductor laser element 22 arranged at the other end. can be arranged. By doing so, it is possible to reduce the difference in the length of the light emitting region from end to end between the first light emitting device 20a and the second light emitting device 20b. The arrangement is not limited to such arrangement, and for example, three semiconductor laser elements 22 may be evenly arranged in a region where four semiconductor laser elements 22 are arranged.

The package 21 is rectangular in plan view and has a rectangular concave portion 30 in plan view. Note that the term “rectangular” used herein includes a shape that is generally rectangular, such as a shape in which corners or side surfaces are partially cut out, such as the package 21, or a shape in which the corners are curved, such as the recess 30. It is a thing. In addition, the package 21 has a stepped portion 33 formed on a portion of the inner side surface 32 of the recessed portion 30 . Specifically, the stepped portion 33 is provided on two inner side surfaces 32 of the four inner side surfaces 32 of the concave portion 30 that face each other in the lateral direction.
The package 21 can be formed using ceramic as a main material. Note that the package 21 is not limited to ceramic and may be made of metal. For example, among ceramics, aluminum nitride, silicon nitride, aluminum oxide, and silicon carbide can be used as the main material of the package 21 . As metals, copper, aluminum, iron, and composites such as copper molybdenum, copper-diamond composite material, and copper tungsten can be used as the main material of the package 21 .

A metal film is provided on each of the lower surface 34 of the package 21 and the upper surface of the stepped portion 33 . The metal films on the lower surface 34 of the package 21 include a pair of metal films 37 provided at both ends of the package 21 and a metal film 37 provided at the center of the lower surface 34 of the package 21 between the metal films 37 at both ends. 38 and . Each of the metal films 37 is substantially rectangular and spaced apart from each other at three locations along each of the two opposing sides. The metal film 37 is formed facing the first metal film 12 of the first mounting board 10a so as to be connected therewith. Further, the area of the metal film 38 provided in the center of the lower surface 34 of the package 21 is larger than that of any of the metal films 37 . The metal film 38 is formed facing the metal portion 11 of the first mounting board 10a so as to be connected thereto. In the package 21 , the metal film on the upper surface of the stepped portion 33 and the metal film 37 on the lower surface 34 are electrically connected by metal wiring running inside.

Note that the package 21 may be formed by forming the frame portion 35 forming the frame of the recess 30 and the bottom portion 36 from different main materials, and joining the frame portion 35 and the bottom portion 36 together. For example, the package 21 may be formed by joining a plate-shaped bottom portion 36 made mainly of metal and having a predetermined thickness and a frame portion 35 made mainly of ceramic and having a frame of a predetermined height. In this case, instead of providing the metal film 38, the lower surface of the bottom portion 36 can be connected to the metal portion 11 of the first mounting substrate 10a.

The semiconductor laser element 22 and the protection element 25 are electrically connected to the connection wiring, which is a metal film provided on the upper surface of the step portion 33 . A wire 26 is bonded for this continuity. 2B and 3B show an example of wire 26 bonding when semiconductor laser elements 22 are connected in series. Note that the connection method is not limited to this. Also, a plurality of semiconductor laser elements 22 may be connected in parallel. Thereby, the semiconductor laser element 22 and the protective element 25 are electrically connected via the metal film 37 provided on the bottom surface 34 of the package 21 .

No stepped portion 33 is provided on the two inner side surfaces 32 of the package 21 facing each other in the longitudinal direction. The size of the package 21 can be reduced by not providing the stepped portion 33 over the entire circumference of the inner side surface 32 of the package 21 . A stepped portion 33 may be provided on the inner side surface 32 on the far side from the light reflecting member 24 . By widening the area where the stepped portion 33 is provided, a larger wiring area can be secured. On the other hand, it is not necessary to provide the stepped portion 33 on the inner side surface 32 closer to the light reflecting member 24 . Even if the stepped portion 33 is provided in this portion, the wire 26 must be joined to the semiconductor laser element 22 and the wiring area so that the wire 26 does not interfere with the optical path.
Also, by not providing the stepped portion 33 on the inner side surface 32 , the light reflecting member 24 can be arranged closer to the outer side surface of the package 21 . Although the details will be described later, when the two light emitting devices 20 are mounted on the mounting substrate 10, the distances of the light emitted from the two light emitting devices 20 can be made closer. As shown in FIGS. 2B and 3B, the inner side surface 32 closer to the light reflecting member 24 can also be said to be the inner side surface beyond the traveling direction of the laser light emitted from the semiconductor laser element.

In such a light emitting device 20, the pair of metal films 37 provided on the lower surface 34 are bonded to the first metal film 12 of the first mounting substrate 10a. Also, the metal film 38 provided between the pair of metal films 37 is bonded to the metal portion 11 of the first mounting substrate 10a. The light emitting device 20 and the first mounting substrate 10a can be joined together by soldering. In bonding the metal films 37 and 38 on the lower surface 34 of the light emitting device 20 to the first metal film 12 and the metal portion 11 of the first mounting substrate 10a, the light emitting device 20 is fixed to the first mounting substrate 10a. is working self-alignment.

The semiconductor laser element 22 has a lower surface, an upper surface, and side surfaces, and emits laser light from one side surface. The laser light emitted from the semiconductor laser element 22 spreads and forms an elliptical far-field pattern (hereinafter referred to as "FFP") on a plane parallel to the light emitting end face.

The semiconductor laser element 22 is placed on the bottom surface 31 (bottom top surface) of the recess 30 of the package 21 via the submount 23 . A submount 23 is provided separately for each semiconductor laser element 22 . Note that the light emitting device 20 may mount a plurality of semiconductor laser elements 22 on the top surface of one submount 23 . Alternatively, the light emitting device 20 may mount the semiconductor laser element 22 directly on the bottom surface 31 of the recess 30 of the package 21 without the submount 23 interposed therebetween.
As shown in FIGS. 2B and 3B, etc., the plurality of semiconductor laser elements 22 mounted on the light emitting device 20 are arranged side by side in one direction. Specifically, they are arranged in the longitudinal direction of the package 21 . In addition, the directions of the emission end surfaces are aligned so that the mounted semiconductor laser elements 22 emit laser light in the same direction. The positions of the emitting end faces are designed so that the emitting end faces of the mounted semiconductor laser elements 22 are arranged on the same plane. Note that they do not necessarily have to be aligned on the same plane.
A plurality of semiconductor laser elements 22 arranged side by side in one direction are electrically connected in series using wires 26 . Laser light traveling in a direction orthogonal to the direction in which the plurality of semiconductor laser elements 22 are arranged is emitted from the emission end face of the plurality of semiconductor laser elements 22 .

All of the semiconductor laser elements 22 mounted on the first light emitting device 20a and the second light emitting device 20b are semiconductor laser elements that emit blue light. A semiconductor laser element that emits light other than blue light, such as red light or green light, may also be used. Further, the color emitted by the semiconductor laser element 22 mounted on the first light emitting device 20a may be different from the color emitted by the semiconductor laser element 22 mounted on the second light emitting device 20b. For example, a semiconductor laser element 22 that emits blue light is mounted on the first light emitting device 20a and red light is mounted on the second light emitting device 20b. In addition, two first light emitting devices 20a or two second light emitting devices 20b may be mounted on the first mounting substrate 10a by being joined to two connection patterns 15. In this case, Semiconductor laser elements 22 that emit light of different colors may be mounted between the two mounted light emitting devices 20 .

Here, blue light means light having an emission peak wavelength in the range of 420 nm to 494 nm. Red light means light whose emission peak wavelength is in the range of 605 nm to 750 nm. Green light refers to light whose emission peak wavelength is in the range of 495 nm to 570 nm.
The semiconductor laser element 22 is an example of a light emitting element mounted on the light emitting module according to the present invention. The light emitting element is not limited to the semiconductor laser element 22 .

The submount 23 has its lower surface joined to the bottom surface 31 of the recess 30 of the package 21 and its upper surface joined to the semiconductor laser element 22 . The semiconductor laser element 22 is mounted on the submount 23 so that the emission end face of the semiconductor laser element 22 is aligned with the side surface of the submount 23 or protrudes. This prevents the light emitted from the semiconductor laser element 22 from irradiating the upper surface of the submount 23 . Submount 23 can be formed using, for example, silicon nitride, aluminum nitride, or silicon carbide. A metal film is provided on the upper surface of the submount 23 .

The light reflecting member 24 is a member that reflects light from the semiconductor laser element 22 . The light reflecting member 24 is placed on the bottom surface of the recess 30 of the package 21 . The light reflecting members 24 are separately arranged corresponding to the respective semiconductor laser elements 22 . Also, in the three or four semiconductor laser elements 22, the distance between the emission end face of each semiconductor laser element 22 and the corresponding light reflecting member 24 is designed to be the same. Note that the distance may be determined depending on the semiconductor laser element 22 , and the distance may be different among the plurality of semiconductor laser elements 22 . Also, in the light emitting device 20 , one light reflecting member 24 may be arranged corresponding to a plurality of semiconductor laser elements 22 .

The light reflecting member 24 has a lower surface, an upper surface, side surfaces, and an inclined surface, and the inclined surface serves as a light reflecting surface. The light reflecting surface is flat and slopes from the upper surface to the lower surface. The light reflecting surface is designed to form an angle of 45 degrees with respect to the lower surface. Note that this angle is not limited to 45 degrees, and the light reflecting surface may be a curved surface instead of a flat surface.

The light reflecting member 24 can be formed by forming an outer shape using a main material, and forming a light reflecting film on a surface of the formed outer shape on which a light reflecting surface is desired. The main material is preferably a heat-resistant material such as quartz or glass such as BK7 (borosilicate glass), metal such as aluminum, or Si. The light reflection film is preferably made of a material with high light reflectance, and employs metals such as Ag and Al, dielectric multilayer films such as Ta ₂ O ₅ /SiO ₂ , TiO ₂ /SiO ₂ , Nb ₂ O ₅ /SiO _2, etc. can do. If the outer shape of the light reflecting member 24 is formed using a material having a high light reflectance such as metal as the main material, the formation of the light reflecting film may be omitted.

A major part of the light emitted from the semiconductor laser element 22 is applied to the corresponding light reflecting surface of the light reflecting member 24 . The light emitted from the semiconductor laser element 22 passes through the light reflecting member 24, so that the optical path length of the light to enter the lens can be made longer than when the light reflecting member 24 is not interposed. The longer the optical path length, the smaller the influence of mounting misalignment between the light reflecting member 24 and the semiconductor laser element 22 . It should be noted that the light emitting device 20 may have the light emitting end surface of the semiconductor laser element 22 directed upward without having the light reflecting member 24 .

A protective element 25 is mounted on the upper surface of the submount 23 . Protective element 25 is, for example, a Zener diode. The wire 26 is metal wiring. Materials for the wire 26 include metals such as Au, Ag, Cu, Pt, and Al, and alloys thereof. Note that the light emitting device 20 without the protective element 25 may be used.

The lid member 27 is a member that covers the semiconductor laser element 22 and the light reflecting member 24 . Although the lid member 27 is translucent as a whole, it may partially have a non-translucent region. The lid member 27 can be formed using sapphire as a main material. Also, the lid member 27 is provided with a metal film in a partial area. In addition to sapphire, for example, glass or the like can also be used as the main material.
The lower surface of the lid member 27 is joined to the upper surface (the upper surface of the frame portion) of the package 21 . The lid member 27 and the package 21 are provided with a metal film in the region to be joined, and are fixed via Au—Sn or the like. In the light emitting device 20, a closed space is formed by bonding the package 21 and the lid member 27 together. This closed space becomes a hermetically sealed space. By hermetically sealing the light-emitting device 20 in this manner, it is possible to suppress the collection of organic matter and the like on the light-emitting end face of the semiconductor laser element 22 .

The bonding portion 28 is formed on the upper surface of the lid member 27 in a region where the lid member 27 and the lens member 29 are bonded together. As the bonding portion 28, for example, an ultraviolet curable resin can be used. The bonding portion 28 is formed so that the lid member 27 and the lens member 29 do not come into contact with each other. The bonding portion 28 is thickened to adjust the position and height, and then bonds the lens member 29 to the lid member 27 . Also, the bonding portion 28 is formed, for example, at a position facing the outer edge of the lens member 29 so as not to be provided on the optical path of the light emitted from the semiconductor laser element 22 . Although FIGS. 2A and 3A show an example of the shape of the adhesive portion 28 after curing, the adhesive portion 28 may be soft when applied.

The lens member 29 is provided facing the upper surface of the lid member 27 . The lens member 29 is integrally formed with a lens portion 51 having a lens shape and a rectangular support plate portion 52 that supports the lens portion 51 . The lens member 29 is provided with the lens portions 51 at positions facing the optical axis of the semiconductor laser element 22 . The arrangement and shape of each lens portion 51 are designed so that the reflected light emitted from the corresponding semiconductor laser element 22 and reflected by the light reflecting member 24 passes through the lens portion 51 and is collimated. As shown in FIGS. 2A and 3A, the same lens member 29 is used in both the first light emitting device 20a and the second light emitting device 20b having different numbers of semiconductor laser elements 22 mounted thereon. In other words, the same lens member 29 as the lens member 29 of the second light emitting device 20b is used for the lens member 29 of the first light emitting device 20a. By doing so, the lens member 29 can be unified even in the first light emitting device 20a configured by excluding any of the four semiconductor laser elements 22 in the second light emitting device 20b. Also, the lens member 29 with one design can be used for the first light emitting device 20a and the second light emitting device 20b.

The lens member 29 employed in the first light emitting device 20a may have the number and arrangement of the lens portions 51 corresponding to the number and arrangement of the semiconductor laser elements 22 mounted on the package 21. FIG. By matching the number of the lens portions 51 with the number of the semiconductor laser elements 22, the lens member 29 can be made lighter than the lens member 29 matching the number of the semiconductor laser elements 22 of the second light emitting device 20b.
Glass such as BK7 and B270 can be used for the lens member 29, for example.

In the light emitting module 100 shown in FIG. 1A, two first mounting substrates 10a are arranged to form the mounting substrate 10, and two light emitting devices 20 are mounted on each of the two first mounting substrates 10a. realizes the light-emitting module 100 in which is mounted. In the light-emitting module 100 of FIG. 1A, two light-emitting devices 20 arranged in a 1-row, 2-column arrangement are mounted in directions 180 degrees different from each other on the mounting surface.
Specifically, the light-emitting module 100 is mounted on each of the first mounting substrates 10a so that one first light-emitting device 20a and one second light-emitting device 20b are arranged side by side, and the light reflecting member 24 are implemented side by side. That is, regarding two light emitting devices 20 mounted on one first mounting substrate 10a, the distance to the light reflecting member 24 arranged on one light emitting device 20 is the light reflecting member 24 arranged on the other light emitting device 20. Mounting so that the condition that the light reflecting member 24 is shorter than the member 24 and the semiconductor laser element 22 is satisfied, and that this condition is similarly satisfied even when one light emitting device 20 and the other light emitting device 20 are exchanged. be done.
Furthermore, in the light emitting module 100, the first light emitting devices 20a and the second light emitting devices 20b are mounted such that the first light emitting devices 20a and the second light emitting devices 20b are diagonally positioned. In this manner, four light emitting devices are mounted adjacent to each other on the mounting substrate 10 in the matrix direction, and the light emitting devices 20 are mounted such that the light reflecting members 24 are adjacent to each other in the row direction.

By arranging the two light emitting devices 20 on the single first mounting substrate 10a in this way, the light emitted from the two light emitting devices 20 can be brought closer. In addition, since the distance between the semiconductor laser elements 22 between the two light emitting devices 20 can be increased, heat dissipation is improved. Also, by arranging the two first mounting boards 10 a in this way, light can be collected on the central side of the mounting board 10 .
In the optical unit disclosed in Patent Document 1, which includes a plurality of semiconductor devices in which four semiconductor elements are mounted in a package, light emitted from the semiconductor elements passes through the semiconductor devices as it is. Thus, it was not necessary to consider how to preferably mount the two light emitting devices 20 from the positional relationship between the semiconductor laser element and the light reflecting member mounted on the package.
On the other hand, in the light emitting device 20 of the light emitting module 100, a plurality of semiconductor laser elements 22 and a light reflecting member 24 are placed in a package. In this case, by mounting the two light-emitting devices 20 on the mounting board 10 in a suitable form, the light-emitting module 100 that achieves the above effects is realized.
Further, when manufacturing the light-emitting module 100 in which the two first light-emitting devices 20a in which the three semiconductor laser elements 22 are arranged in the same arrangement and the two second light-emitting devices 20b are mounted, the first light-emitting device By arranging the 20a diagonally, the semiconductor laser elements 22 of the two first light emitting devices 20a can be arranged symmetrically from the center of the mounting board 10. FIG.
Here, it is assumed that the light emitting device 20 is mounted so that the light reflecting members 24 are adjacent to each other in the row direction on the paper surface. 20 may be implemented. Alternatively, the light emitting devices 20 may be arranged such that the first light emitting devices 20a and the second light emitting devices 20b are adjacent to each other in the row direction, and the first light emitting devices 20a and the second light emitting devices 20b are arranged in the column direction. You may arrange|position the light-emitting device 20 so that it may adjoin.

<Method for manufacturing light-emitting module>
Next, an example of a method for manufacturing the light emitting module 100 according to the first embodiment will be described.
FIG. 4 is a flow chart showing the procedure of the method for manufacturing the light emitting module according to the first embodiment.
The method for manufacturing a light-emitting module according to the first embodiment is manufacturing a light-emitting module 100 in which one or a plurality of light-emitting devices on which a plurality of light-emitting elements are mounted are mounted. The method for manufacturing the light-emitting module 100 includes a step S101 of preparing a light-emitting device, a step S102 of preparing a first mounting substrate, and a step S103 of mounting the light-emitting device, which are performed in this order. Moreover, as the light emitting module 100 manufactured by this manufacturing method, it is possible to manufacture the light emitting module 100 mounted with any number of light emitting elements 22 selected from at least three consecutive numbers.

Each step of the method for manufacturing the light emitting module 100 will be described below. Note that the material, arrangement, etc. of each member are as described in the description of the light-emitting module 100, and therefore the description is omitted here as appropriate.

[Step of preparing light-emitting device]
The step S101 of preparing light-emitting devices is a step of preparing a first light-emitting device and a second light-emitting device each having a different number of mounted semiconductor laser elements, as light-emitting devices.
In step S101, a plurality of first light emitting devices 20a each having three semiconductor laser elements 22 and a plurality of second light emitting devices 20b each having four semiconductor laser elements 22 are prepared.

[Step of preparing the first mounting board]
The step S102 of preparing the first mounting board is a step of preparing the first mounting board having a mounting surface provided with a plurality of the same connection patterns 15 corresponding to one light emitting device.
In this step S102, a second light emitting device having a mounting surface provided with two connection patterns 15 corresponding to one light emitting device 20, which can correspond to both the first light emitting device 20a and the second light emitting device 20b as the light emitting device. One or two or more mounting substrates 10a are prepared.

[Step of Mounting Light Emitting Device]
The step S103 of mounting the light-emitting device is a step of mounting a plurality of light-emitting devices selected from the first light-emitting device and the second light-emitting device on the plurality of connection patterns provided on the mounting surface of the first mounting substrate. is.
In this step S103, two desired light emitting devices selected from the first light emitting device 20a and the second light emitting device 20b are connected to the two connection patterns 15 provided on the mounting surface of the first mounting substrate 10a. to implement.
In addition, as the light emitting module 100 mounted with the selected two light emitting devices 20, at least one light emitting module 100 mounted with two first light emitting devices 20a, one first light emitting device 20a and one second light emitting device 20b. A light-emitting module 100 mounted one by one and a light-emitting module 100 mounted with two second light-emitting devices 20b are manufactured. These three light-emitting modules 100 have an increasing number of light-emitting elements in order.
By manufacturing three light-emitting modules 100 mounted with two light-emitting devices 20 in different combinations in this manner, light-emitting devices mounted with an arbitrary number of light-emitting elements 22 selected from three consecutive numbers are mounted. Module 100 can be manufactured.

Note that the light-emitting module 100 in which one or a plurality of light-emitting devices mounted with a plurality of light-emitting elements are mounted, manufactured by the manufacturing method according to the first embodiment, is not limited to these three light-emitting modules 100 . A light-emitting module 100 in which one light-emitting device 20 is mounted on one first mounting substrate 10a, a light-emitting module 100 in which a total of three light-emitting devices 20 are mounted on two first mounting substrates 10a, and two first mounting substrates 10a. A light-emitting module 100 in which a total of four light-emitting devices 20 are mounted on the mounting substrate 10a can be manufactured.
In manufacturing the light-emitting module 100 shown in FIG. 1A, in step S103, two light-emitting devices 20 (the first light-emitting device 20a and the second light-emitting device 20b) arranged in a one-row, two-column arrangement structure are mounted on the mounting surface. They are mounted in directions 180 degrees different from each other. Also, in this step S103, by arranging the two first mounting substrates 10a on which two light emitting devices 20 (the first light emitting device 20a and the second light emitting device 20b) are respectively mounted, four A light-emitting module 100 mounted with the light-emitting device 20 is manufactured. As a result, when viewed as the light emitting module 100, the four light emitting devices 20 can be arranged in the center. In addition, through holes for screwing or the like are provided at both ends of the four light emitting devices 20 so as to sandwich the four light emitting devices 20, and the second metal film 13 is provided at the other end. Providing the second metal film 13 at both ends facilitates connection to a power supply rather than sandwiching between two light emitting devices 20 .

In this way, the light-emitting module 100 in which one to four light-emitting devices are mounted can be manufactured using the first mounting board 10a, the first light-emitting device 20a, and the second light-emitting device 20b. In addition, with such a light emitting module 100, the number of mounted semiconductor laser elements 22 can be adjusted to an arbitrary number from 3 to 16 (excluding 5) to efficiently meet various specifications. A light emitting module 100 can be provided.
If the number of semiconductor laser elements 22 mounted on the first light emitting device 20a is 2 and the number of semiconductor laser elements 22 mounted on the second light emitting device 20b is 3, any number from 2 to 12 can provide a light emitting module 100 that can be adjusted to . Assuming that the number of semiconductor laser elements 22 mounted on the first light emitting device 20a is 4, and the number of semiconductor laser elements 22 mounted on the second light emitting device 20b is 5, 4 to 20 (however, 6, Any number of adjustable light emitting modules 100 (except seven and eleven) can be provided.

<Second embodiment>
Next, a second embodiment will be described.
FIG. 5A is a perspective view schematically showing an example of the configuration of a light emitting module according to the second embodiment; FIG. 5B is a plan view schematically showing an example of the configuration of the light emitting module according to the second embodiment; FIG. 5C is a plan view schematically showing an example of the configuration of the mounting substrate according to the second embodiment; 5D is a plan view showing a state in which the mounting board in FIG. 5C is separated into a first mounting board and a second mounting board. The light emitting module according to the second embodiment differs in that a second mounting board is employed in addition to the first mounting board employed in the light emitting module according to the first embodiment.

<Light emitting module>
A light-emitting module 100A shown in FIG. 5A includes a mounting substrate 10A and a light-emitting device 20. As shown in FIG. Also, this light emitting module 100A is a light emitting module in which three light emitting devices 20 are mounted.
The mounting board 10A of the light emitting module 100A in this case is composed of a first mounting board 10a and a second mounting board 10b.
The second mounting board 10b has the same outer shape as the first mounting board 10a. The second mounting substrate 10b has a lower surface, an upper surface, and side surfaces, and has a mounting surface on which one connection pattern 15 that is the same as the connection pattern 15 provided on the first mounting substrate 10a is provided on the upper surface. . By using one connection pattern 15 and having the same external shape, the external shape can be made the same as in the case of mounting with two first mounting substrates 10a.

In addition, in the present embodiment, the connection pattern 15 of the second mounting board 10b is provided near the center, and on the upper surface, the area where the connection pattern 15 of the second mounting board 10b is provided is 2 on the first mounting board 10a. It partially overlaps each of the regions in which one connection pattern 15 is provided. On the other hand, the positions of the second metal film 13 and the through holes are the same as those of the first mounting substrate 10a. By making the positions of the second metal films 13 the same, it is possible to share the connection method between the first mounting board 10a and the second mounting board 10b when electrically connecting to the external power supply. For example, the connection with the second metal film 13 can be made through a connector, a flexible substrate, a glass-epoxy substrate, a leaf spring terminal, or the like. When using such a connection member, the same connection member can be used to connect the first mounting board 10a and the second mounting board 10b. By making the positions of the through-holes the same, screwing and the like can be performed at the same positions as in the case of mounting with the two first mounting substrates 10a. In the second mounting substrate 10b, among the three pairs of the first metal films 12 with the metal part 11 interposed therebetween, the three first metal films provided on the side closer to the second metal film 13 12 is connected to one of the two second metal films 13 for electrical connection. Also, the three first metal films 12 provided farther from the second metal film 13 are connected to the other second metal film 13 and are electrically connected.
One light emitting device 20 is mounted on the second mounting substrate 10b, and one second light emitting device 20b is mounted in the example of FIG. 5A. The first mounting substrate 10a and the second mounting substrate 10b are arranged so that the side surfaces opposite to the side on which the second metal film 13 is formed face each other. Other matters are the same as those of the light emitting module 100 according to the first embodiment shown in FIG. 1A.

<Method for manufacturing light-emitting module>
Next, an example of a method for manufacturing the light emitting module 100A according to the second embodiment will be described.
FIG. 6 is a flow chart showing the steps of a method for manufacturing a light emitting module according to the second embodiment.
The method of manufacturing the light-emitting module 100A includes a step S201 of preparing a light-emitting device, a step S202 of preparing a first mounting board, a step S203 of preparing a second mounting board, and a step S204 of determining the number of mounting boards and the like. , a step S205 of mounting a light-emitting device, and a step S206 of forming a light-emitting module, which are performed in this order. Note that the material, arrangement, etc. of each member are as described in the description of the light-emitting module 100, and therefore the description is omitted here as appropriate. Further, the step S201 of preparing the light emitting device and the step S202 of preparing the first mounting substrate are the step S101 of preparing the light emitting device and the step S202 of preparing the first mounting substrate in the method for manufacturing the light emitting module 100 according to the first embodiment. Since it is the same as S102, the description is omitted here.

[Step of Preparing Second Mounting Board]
The step S203 of preparing a second mounting board is a step of preparing a second mounting board having a mounting surface provided with one connection pattern that is the same as the connection pattern provided on the first mounting board.
In step S203, a second mounting board 10b having a mounting surface provided with one connection pattern 15 that is the same as the connection pattern 15 provided on the first mounting board 10a is prepared.

[Step of determining the number of mounting boards, etc.]
In step S204 of determining the number of mounting boards, etc., the number of mounting boards used for manufacturing the light-emitting module or the number and combination thereof is determined from among a plurality of mounting boards including at least the first mounting board and the second mounting board. It is a process to do.
In this step S204, it is determined whether to form the mounting substrate 10A of the light emitting module 100A using one mounting substrate or to form the mounting substrate 10A of the light emitting module 100A using two mounting substrates. Also, if there is one board, it is determined which one of the first mounting board 10a and the second mounting board 10b is to be used. It is determined whether to combine the two mounting boards 10b one by one. Although it is possible to combine two second mounting substrates 10b to form the mounting substrate 10A, if two light emitting devices 20 are to be mounted, it is better to use one first mounting substrate 10a. 100A can be realized in a smaller size.
In manufacturing the light-emitting module 100A shown in FIG. 5A, two mounting boards are used in combination of one first mounting board 10a and one second mounting board 10b, and the mounting board 10A is Decided to configure.

[Step of Mounting Light Emitting Device]
In step S205 of mounting the light emitting device, when the second mounting board is used for the light emitting module, one light emitting device selected from the first light emitting device and the second light emitting device is mounted on the connection pattern of the second mounting board. This is the process of implementation. Further, in this step S205, when the first mounting substrate is used for the light emitting module, the plurality of connection patterns provided on the mounting surface of the first mounting substrate are selected from the first light emitting device and the second light emitting device. It is a step of mounting a plurality of light emitting devices that have been manufactured.
In manufacturing the light-emitting module 100A shown in FIG. 5A, one second light-emitting device 20b is mounted on the second mounting board 10b. In addition, one first light emitting device 20a and one second light emitting device 20b are mounted side by side on the first mounting substrate 10a, and the two light emitting devices 20 arranged in a one-row, two-column arrangement structure are mounted on the mounting surface. Mount in a different direction by 180 degrees.

[Step of Forming Light-Emitting Module]
The step S206 of forming a light-emitting module is a step of forming a light-emitting module using one or more of the first mounting substrate and the second mounting substrate on which light-emitting devices are mounted in the determined number or number and combination. is.
In manufacturing the light-emitting module 100A shown in FIG. 5A, one first mounting substrate 10a on which one first light-emitting device 20a and one second light-emitting device 20b are mounted, and one second light-emitting device The light emitting module 100A is formed by arranging the one second mounting substrate 10b on which 20b is mounted side by side. By using the second mounting board 10b when mounting one light emitting device 20, unused connection patterns 15 can be prevented compared to the case of using the first mounting board 10a. Further, in the first mounting substrate 10a, the second metal film 13 on the side of the connection pattern 15 to which the light emitting device 20 is bonded and the connection pattern 15 to which the light emitting device 20 is not bonded are used for electrical connection with an external power source. However, in the second mounting substrate 10b, the two second metal films 13 can be used for conduction. By using the first mounting substrate 10a when mounting two light emitting devices 20 on one mounting substrate and using the second mounting substrate 10b when mounting one light emitting device 20, two mounting substrates can be mounted in any case. Conduction with an external power supply can be easily achieved by using the two metal films 13 .
As described in the manufacturing method of the light-emitting module 100 according to the first embodiment, the light-emitting module 100A manufactured by the manufacturing method according to the second embodiment also has an arbitrary number of light-emitting devices 20 from 1 to 4. It is clear that a light-emitting module in which is mounted can be provided.

<Third Embodiment>
Next, a third embodiment will be described.
FIG. 7A is a plan view schematically showing an example of the configuration of a light emitting module according to a third embodiment; FIG. FIG. 7B is a plan view schematically showing an example of the configuration of the light emitting module according to the third embodiment; 7C is a plan view schematically showing an example of the configuration of a light emitting module according to the third embodiment; FIG.

In the light-emitting module 100B according to the third embodiment shown in FIG. 7A, the mounting board 10B of the light-emitting module 100B has four same connection patterns 15 and one first mounting surface having a mounting surface provided in an array of 2 rows and 2 columns. It is composed of a mounting board 10c. In the light emitting module 100B, an arbitrary number of 1 to 4 light emitting devices 20 are mounted on the four connection patterns 15. FIG. 7A to 7C each show a light-emitting module 100B in which four light-emitting devices 20 are mounted, a light-emitting module 100C in which three light-emitting devices 20 are mounted, and a light-emitting module 100D in which two light-emitting devices 20 are mounted. there is Since four light emitting devices 20 can be mounted on one mounting substrate, the manufacturing process can be simplified.

Through the first embodiment, the second embodiment, and the third embodiment, the configuration example and the manufacturing method of the light emitting module according to the present invention have been described. Further, in these descriptions, the light-emitting module includes a first light-emitting device that is a light-emitting device having a plurality of light-emitting elements mounted thereon, and a light-emitting device that has one more light-emitting element than the first light-emitting device mounted thereon. and a first mounting board having a mounting surface provided with a plurality of connection patterns corresponding to one light emitting device, the mounting surface of the first mounting board It has been described that a light-emitting module is realized in which one or more first light-emitting devices and one or more second light-emitting devices are connected to a plurality of connection patterns provided in . A light-emitting module 100E shown in FIG. 8 is a specific example of such a light-emitting module in a suitable form in which the number of light-emitting elements to be mounted is adjusted. By realizing such a light-emitting module, it is possible to provide a light-emitting module that can efficiently meet various specifications with respect to output light.

<Fourth Embodiment>
Next, a fourth embodiment will be described.
FIG. 9A is a perspective view schematically showing an example of the configuration of a light emitting module according to a fourth embodiment; 9B is a plan view schematically showing an example of the configuration of a light emitting module according to the fourth embodiment; FIG. FIG. 9C is a schematic plan view for explaining the first mounting board according to the fourth embodiment. FIG. 9D is a plan view schematically showing the light emitting device and the thermistor mounted on the second mounting board according to the fourth embodiment. FIG. 9E is a schematic plan view for explaining the second mounting board according to the fourth embodiment.

In the light-emitting module according to the fourth embodiment, the mounting surface of the mounting substrate is further provided with a metal film for mounting the thermistor. different from the substrate.
As shown in FIG. 9C, in addition to the metal portion 11, the first metal film 12, the second metal film 13, and the insulating film 14, the first mounting substrate 10d according to the fourth embodiment further includes a third metal film. 16, a fourth metal film 17 is provided on the mounting surface. The connection pattern 15 composed of the metal part 11 and the first metal film 12 is the same as the contents described in the previous embodiments.

Since the third metal film 16 is provided on the first mounting substrate 10d, the distance between the first metal film 12 and the second metal film 13 is correspondingly larger than that of the first mounting substrate 10a. The two third metal films 16 are provided between the first metal film 12 and the second metal film 13 and are provided at the same distance from the light emitted from the two light emitting devices 20 . Therefore, on the first mounting board 10d, the distances from the two connection patterns 15 are the same. That is, the two third metal films 16 are arranged such that the distance from one connection pattern 15 to one third metal film 16 is the same as the distance from the other connection pattern 15 to the other third metal film 16 . is provided.
Moreover, since the fourth metal film 17 is provided between the two second metal films 13, the distance between the two second metal films 13 is larger than that of the first mounting board 10a. Both of the two fourth metal films 17 are provided at positions sandwiched between the two second metal films 13 .
The third metal film 16 and the fourth metal film 17 are connected to form a single metal film on the insulating film 14, and the third metal film 16 and the fourth metal film 17 are separated thereon. It is formed by providing an insulating film 14 . In other words, the third metal film 16 and the fourth metal film 17 are not visible from the surface but are connected and electrically connected. One third metal film 16 and one fourth metal film 17 are connected, and the other third metal film 16 and the other fourth metal film 17 are connected.

A thermistor 90 is mounted on the third metal film 16 in a light emitting module 100F according to the fourth embodiment shown in FIGS. 9A and 9B. The thermistor 90 is an example of a temperature sensing element used to measure the temperature when the light emitting module 100F is operating. The thermistor 90 is mounted in a state of being connected to both of the two third metal films 16 , thereby making it possible to conduct from one fourth metal film 17 through the thermistor 90 to the other fourth metal film 17 . .
In the light-emitting module 100F, the heat source is mainly the semiconductor laser elements 22 of the two light-emitting devices 20 mounted on the first mounting substrate 10d. It is preferable to arrange them at the same distance from the light emitted from either light emitting device 20 . That is, when designed so that the center of the light emitted from the plurality of semiconductor laser elements 22 mounted on the two light emitting devices 20 passes through the apex of the lens portion 51, the thermistor 90 is A straight line connecting the vertices of the lens portions 51 of one light emitting device 20 and a straight line connecting the vertices of the lens portions 51 of the other light emitting device 20 intersect with an intermediate line at an equal distance.

A second mounting board 10e according to the fourth embodiment shown in FIGS. 9D and 9E is provided with a third metal film 16 and a fourth metal film 17, similarly to the first mounting board 10d. A thermistor 90 is mounted on the . Also, regarding the fact that the third metal film 16 is provided between the first metal film 12 and the second metal film 13 and the fourth metal film 17 is provided at a position sandwiched between the two second metal films 13, , and the first mounting board 10d.
On the other hand, since the thermistor 90 is provided at a position close to the light emitted from the light emitting device 20, the thermistor 90 is close to the apex of the lens portion 51 of the lens member 29 of the light emitting device 20 on the second mounting substrate 10e. position. That is, if the center of light emitted from the plurality of semiconductor laser elements 22 mounted on the light emitting device 20 is designed to pass through the apex of the lens portion 51, the thermistor 90 is arranged in each lens portion when viewed from above. It intersects the straight line connecting the 51 vertices.
As described above, in the light-emitting module 100F according to the fourth embodiment, the mounting substrate 10 is provided with a metal film for mounting the thermistor 90, thereby measuring the temperature when the light-emitting module 100F is operated. be able to. Therefore, the operation of the semiconductor laser element 22 can be controlled according to the measured temperature.

A light-emitting module manufactured in this manner can be used, for example, in various projectors with different specifications. Specifically, the light-emitting modules formed using one or more of the first mounting substrate and the second mounting substrate on which the light-emitting devices are mounted in the determined number or the number and combination are mounted on the radiator plate. become a component of the projector.

Next, an example of mounting when applying the light-emitting module according to the present embodiment to a projector will be described. In addition, although a mounting board configured by one or a plurality of first mounting boards 10a will be described as an example here, it goes without saying that the present invention is not limited to this. The mounting board can be configured using the desired first mounting board or second mounting board described in the first to fourth embodiments.
FIG. 10A is a perspective view schematically showing an example of mounting when applying the light-emitting module according to one embodiment to a projector. FIG. 10B is a perspective cross-sectional view for explaining the sealing structure of the light emitting module according to one embodiment. FIG. 11A is a perspective view schematically showing an example of mounting when applying the light-emitting module according to one embodiment to a projector. FIG. 11B is a plan view schematically showing an example of the configuration of the projector according to the embodiment of FIG. 11A. 11C is a side view schematically showing an example of the configuration of the projector according to the embodiment of FIG. 11A; FIG. FIG. 12A is a perspective view schematically showing an example of mounting when applying the light-emitting module according to one embodiment to a projector. 12B is a side view schematically showing an example of the configuration of the projector according to the embodiment of FIG. 12A; FIG. FIG. 13 is a perspective cross-sectional view for explaining another sealing structure of the light emitting module according to one embodiment.
For the sake of convenience, these drawings show a portion of the inside of the projector as transparent.

As shown in FIGS. 10A and 10B, projector 200 includes sealing member 60 .
The sealing member 60 is a member for forming a sealed space surrounding the light emitting device 20 mounted on the mounting board 10 in the light emitting module. Also, the optical system of the projector is mounted inside this sealed space. That is, an optical unit is mounted for generating a projected image projected by the projector. Examples of optical units include lenses, mirrors, DMDs (Digital Mirror Devices), prisms, and the like. In addition, an optical unit including a liquid crystal panel, a phosphor wheel, a rod integrator, etc., or an optical unit using appropriate components from these components may be configured. is designed. A projected image generated by the optical unit is emitted from the sealing member 60 to the outside and projected onto the screen of the projector. In order to further reduce the probability that the output of the projector will decrease due to light dust collection, it is preferable that all of the components that make up the optical unit are housed in the sealed space formed by the sealing member 60 and the mounting board 10 . . When downsizing the sealing member 60, only a part of the components constituting the optical unit may be housed in the sealed space.

In the projector 200, a light-emitting module is manufactured in which two light-emitting devices 20 are mounted on one first mounting substrate 10a, which is covered with a sealing member 60. As shown in FIG. Although the sealing member 60 is formed in a rectangular parallelepiped shape here, the shape of the sealing member 60 is not particularly limited. That is, it can have a shape corresponding to the shape of the designed optical unit.
A sealing member 70 is provided around the light emitting devices 20 and surrounds the two light emitting devices 20 on the first mounting substrate 10a. Also, the sealing member 70 is provided between the first metal film 12 and the second metal film 13 so that the second metal film 13 is provided outside the sealed space. This makes it possible to easily connect the light emitting device 20 to an external power source. Further, the sealing member 70 is provided inside the through holes on both sides so that the through holes of the first mounting substrate 10a are provided outside the sealed space. This eliminates the need to consider the influence of the through holes in forming the closed space. The sealing member 60 is joined to the first mounting board 10a via the sealing member 70 to form a sealed space. This prevents objects that cause optical dust collection, such as dust, resin outgas, and organic components of grease, from entering the sealing member 60 .

Examples of materials for the sealing member 60 include metal, glass, and sapphire. The sealing member 60 may be formed of a light-transmitting member such as glass or sapphire at a portion through which light is emitted to the outside.
Examples of the material of the sealing member 70 include metal, resin, rubber, and the like. As the material of the sealing member 70, for example, a member such as sponge or clay that is easily deformed when pressed may be used. When a metal is used for the sealing member 70, a sufficient space must be provided to avoid contact between the sealing member 70 and the first metal film 12 provided on the far side from the second metal film 13. is preferred. As a result, it is possible to prevent a short circuit caused by the sealing member 70 . If an insulating material is used, the sealing member 70 does not conduct even if it comes into contact with the first metal film 12 or the second metal film 13 .

A projector 200A shown in FIGS. 11A, 11B, and 11C includes a sealing member 60A.
In projector 200A, a light-emitting module is manufactured in which four light-emitting devices 20 are mounted on two first mounting substrates 10a and covered with sealing member 60A. Also, the sealing member 70 is formed so as to surround the two light emitting devices 20 for each first mounting substrate 10a.
The sealing member 60A has a convex first pressing portion 63 straddling the boundary between the first mounting substrates 10a and 10a. The first pressing portion 63 presses the sealing member 70 provided along the boundary between the first mounting substrates 10a and closes the boundary between the two first mounting substrates 10a. In addition, when the two first mounting substrates 10a are joined at the boundary, the first pressing portion 63 may be omitted. For example, since each mounting board has a component tolerance, rather than joining two first mounting boards 10a to form the mounting board 10, the first mounting boards 10a are arranged side by side with a width that prevents them from coming into contact with each other. form is conceivable. Note that if the first mounting substrates 10a are too far apart, the size of the light emitting module or the projector will be increased. For example, it is preferable to provide a width between the two mounting substrates in the range of 0.1 mm to 1.0 mm. Alternatively, it can be said that the distance from one mounting board to the other mounting board should be 0.1 mm or more and 1.0 mm or less. In the case of mounting with such a gap, providing the first pressing portion 63 can prevent outside air from entering from the boundary and ensure airtightness.
Note that the light-emitting modules shown in FIGS. 10A and 11A are examples, and any light-emitting module manufactured by the manufacturing method described above can be applied. That is, it is possible to apply a light-emitting module in which one or two mounting boards are arbitrarily selected from the first mounting board 10a and the second mounting board 10b and the mounting board 10 is formed. In addition, any number of light-emitting modules mounted on the mounting substrate 10 can be applied from among the first light-emitting devices 20a and the second light-emitting devices 20b.

Furthermore, not only one light emitting module but also a plurality of light emitting modules can be applied.
A projector 200B shown in FIGS. 12A and 12B includes a sealing member 60B.
In the projector 200B, two light emitting modules in which two light emitting devices 20 are mounted on each of the two first mounting substrates 10a are manufactured, and the two light emitting modules are arranged side by side. Therefore, a total of eight light emitting devices 20 are covered with the sealing member 60B. Also, the sealing member 70 is formed for each first mounting substrate 10a.
In the projector 200B, two mounting boards 10 are arranged side by side so that the through holes are adjacent to each other.
The sealing member 60</b>B has, in addition to the first pressing portion 63 , a convex second pressing portion 64 straddling the through-holes of the two mounting substrates 10 . The second pressing portion 64 presses the sealing members 70 provided on the two mounting substrates 10 to form a closed space. Each mounting board 10 is fixed by passing a fixing screw 80 through the through-hole for fixing the mounting board 10 to the heat sink. By providing the second pressing portion 64, it is possible to prevent outside air from entering through the through-hole and to ensure sealing.

Moreover, FIG. 13 shows another example of a sealing structure with a sealing member and a sealing member. Thus, the sealing member 60C may have protrusions 65 that join with the sealing member 70 on the side surface and the bottom surface. The protrusion 65 covers the side surface of the sealing member 70 on the light emitting device 20 side. Since the sealing member 60</b>C has the protrusion 65 , the joining portion with the sealing member 70 has a claw structure. With such a structure, the adhesion between the sealing member 60C and the sealing member 70 is further improved, and the sealing performance of the sealing member 60C is improved.

10, 10A, 10B, 10C Mounting substrates 10a, 10c, 10d First mounting substrates 10b, 10e Second mounting substrate 11 Metal part 12 First metal film 13 Second metal film 14 Insulating film 15 Connection pattern 16 Third metal film 17 Fourth metal film 20 Light emitting device 21 Package 22 Light emitting element (semiconductor laser element)
23 Submount 24 Light reflecting member 25 Protective element 26 Wire 27 Lid member 28 Adhesive portion 29 Lens member 30 Recess 31 Bottom surface of recess 32 Inner surface of recess 33 Stepped portion 34 Lower surface 35 Frame 36 Bottom 37 Metal film 38 Metal film 51 Lens Part 52 Supporting plate parts 60, 60A, 60B, 60C Sealing member 63 First pressing part 64 Second pressing part 65 Projection part 70 Sealing member 80 Fixing screw 90 Thermistor 100, 100A, 100B, 100C, 100D, 100E, 100F light-emitting modules 200, 200A, 200B projector

Claims (11)

a package, a plurality of semiconductor laser elements mounted on the package, and one or more light reflecting members mounted on the package and reflecting laser light emitted from the plurality of semiconductor laser elements; two light emitting devices;
a mounting substrate having a mounting surface on which the two light emitting devices are mounted;
A light-emitting module in which the two light-emitting devices are mounted in directions 180 degrees different from each other on the mounting surface of the mounting substrate. a package, a plurality of semiconductor laser elements mounted on the package, and one or more light reflecting members mounted on the package and reflecting laser light emitted from the plurality of semiconductor laser elements; two light emitting devices;
a mounting substrate having a mounting surface on which the two light emitting devices are mounted;
The two light emitting devices are mounted side by side on the mounting surface of the mounting substrate so that the two light emitting devices are adjacent to each other, and the light reflecting member in one light emitting device and the light reflecting member in the other light emitting device A light-emitting module mounted so as to be adjacent to the light reflecting member. a package, a plurality of semiconductor laser elements mounted on the package, and one or more light reflecting members mounted on the package and reflecting laser light emitted from the plurality of semiconductor laser elements; two light emitting devices;
a mounting substrate having a mounting surface on which the two light emitting devices are mounted;
The two light-emitting devices mounted on the mounting substrate have a distance from the light-reflecting member arranged on one of the light-emitting devices to the light-reflecting member arranged on the other light-emitting device on the mounting surface. is shorter than the distance from the light reflecting member arranged in one light emitting device to the semiconductor laser element arranged in the other light emitting device, and the light reflecting member arranged in the other light emitting device The distance from a member to the light reflecting member arranged in one of the light emitting devices is the distance from the light reflecting member arranged in the other light emitting device to the semiconductor laser element arranged in one of the light emitting devices. Light-emitting module shorter than 4. The light-emitting module according to any one of claims 1 to 3, wherein the two light-emitting devices have the same package shape. 5. The light-emitting module according to claim 1, wherein the plurality of semiconductor laser elements mounted on the light-emitting device each emit laser light in the same direction from the emission end face. In the package, a stepped portion provided with a connection wiring for electrically connecting the semiconductor laser element is formed on a part of the inner surface,
6. The light-emitting module according to claim 1, wherein the stepped portion is not provided on the inner side surface ahead of the direction in which laser light emitted from the electrically connected semiconductor laser element travels. . 7. The light-emitting module according to claim 1, wherein the same number of semiconductor laser elements are mounted in said two light-emitting devices. 7. The light emitting device according to claim 1, wherein the two light emitting devices are composed of a first light emitting device and a second light emitting device having more semiconductor laser elements than the first light emitting device. 10. The light-emitting module according to claim 1. In the two light emitting devices, the plurality of semiconductor laser elements mounted on one of the light emitting devices has a color different from that of the light emitted from the plurality of semiconductor laser elements mounted on the other light emitting device. 9. A light-emitting module according to any one of claims 1 to 8, comprising a semiconductor laser element for emitting light. The plurality of semiconductor laser elements mounted on the other light emitting device emit light of a color different from any of the light emitted from the plurality of semiconductor laser elements mounted on the one light emitting device. 10. A light emitting module according to claim 9, comprising a semiconductor laser device. 11. The light emitting module according to any one of claims 1 to 10, wherein each of said two light emitting devices comprises a lens member through which light reflected by said one or more light reflecting members passes.

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