JP2024034806A - Substrate processing device, and method of detecting drop-off of brush - Google Patents

Abstract

To provide a substrate processing device and a method of detecting drop-off of a brush capable of increasing a detection accuracy while suppressing cost.SOLUTION: Since a detection unit DU detects the maximum push-in height H3, a control unit can determine that a brush 99 is dropped off. The detection unit DU detects that the maximum push-in height H3 has been reached on the basis of an operation of a pressing pressure mechanism 81 so that the detection unit DU can be arranged at such a position that it is not in contact with splashed treatment solution. Thereby, the detection unit DU does not need to be made of a chemical resistant material. As a result, a cost can be suppressed. In addition, there is no possibility that the treatment solution is adhered to the detection unit DU to cause diffusion of light, which can enhance the detection accuracy.SELECTED DRAWING: Figure 5

Description

The present invention performs a cleaning process by applying a brush to substrates such as semiconductor substrates, FPD (Flat Panel Display) substrates such as liquid crystal displays and organic EL (Electroluminescence) display devices, glass substrates for photomasks, and optical disk substrates. The present invention relates to a substrate processing apparatus and a brush falling detection method.

Conventionally, there is an apparatus of this type that includes a substrate holding and rotating mechanism, a cleaning section, a swing arm, and an optical brush sensor (for example, see Patent Document 1).

The substrate holding and rotating mechanism rotates the substrate while holding it in a horizontal position. The cleaning section includes a gripping member and a brush. The brush is attached to the rotating shaft via a gripping member. The rotating shaft is attached to the tip of the swing arm so as to be movable up and down. The cleaning unit is rotated together with the gripping member by the rotating shaft around the vertical axis. The swing arm swings in a plane direction above the substrate. The swing arm swings the brush on the top surface of the substrate.

The substrate processing apparatus applies pressing pressure via the rotating shaft so that the force acting on the substrate from the brush becomes a target load. The substrate processing apparatus causes the brush to act on the upper surface of the substrate with a target load, and swings the swinging arm while supplying processing liquid and the like to the substrate. This cleans the entire upper surface of the substrate.

The optical brush sensors are provided spaced apart in the outer circumferential direction of the cleaning section attached to the swing arm. Optical brush sensors monitor the brush from the side. Specifically, an optical sensor is used to check whether the brush has fallen off from the gripping member. If the brush has not fallen off, the substrate is cleaned; if the brush has fallen off, the substrate is not cleaned. Thereby, it is possible to avoid a situation where inappropriate cleaning is not performed in a state where the brush has fallen off.

Patent No. 4634426

However, the conventional example having such a configuration has the following problems.
That is, the conventional apparatus employs a configuration in which the presence or absence of a brush is detected by irradiating light horizontally from the outer circumferential direction of the cleaning section. Therefore, it is necessary to use a chemical-resistant material to prevent problems caused by the processing liquid splashed from the brush in the outer circumferential direction. Therefore, there is a problem that manufacturing costs increase.

Furthermore, there is a possibility that the cleaning liquid may adhere to the optical brush sensor and light may be scattered. Therefore, there is a problem that false detection is likely to occur.

The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a substrate processing apparatus and a brush falling-off detection method that can increase detection accuracy while suppressing costs.

In order to achieve such an object, the present invention has the following configuration.
That is, the invention according to claim 1 provides a substrate processing apparatus that cleans the substrate by applying a brush to the substrate, including: a rotation holding section that holds the substrate in a horizontal position and rotates the substrate; a brush that acts on the upper surface of the substrate held by the substrate; a brush holder to which the brush is detachably attached; a no-load height that is highest from the upper surface of the substrate and does not allow the brush to act on the substrate; moving the brush holder over an action height that is lower than a no-load height and causes the brush to act on the substrate with a predetermined load; and a maximum pushing height that is lower than the action height and moves the brush to the lowest position. a pressing mechanism; a detection unit that detects that the maximum pressing height has been reached based on the operation of the pressing mechanism; a control unit that determines that the brush has fallen off if the detection unit detects the maximum pushing height when the brush is moved to the working height by operating the brush. It is characterized by this.

[Operation/Effect] According to the invention as set forth in claim 1, when the substrate is placed on the rotating holding section and the brush has fallen off from the brush holder, the control section operates the pressing mechanism to push the brush. Attempt to move to working height. Then, since the brush has fallen off, no reaction force from the board equal to the predetermined load is generated on the brush holder. Therefore, the pressing mechanism. The brush holder continues to move and reaches the maximum pushing height. Therefore, since the detection section detects the maximum pushing height, the control section can determine that the brush has fallen off. Since the detection section detects that the maximum pushing height has been reached based on the operation of the pressing mechanism, the detection section can be placed at a location where it does not come into contact with the scattered processing liquid. Therefore, there is no need to construct the detection section from a chemically resistant material. As a result, costs can be reduced. Further, since there is no fear that the processing liquid will adhere to the detection section and light will be scattered, detection accuracy can be increased.

Further, in the present invention, the pressing mechanism is configured to be swingable about a fulcrum member, and includes a force point portion on one side with respect to the fulcrum, and an application point portion on the other side with respect to the fulcrum. a seesaw member that applies air-based driving force to the force point portion and swings the seesaw member about the fulcrum to apply pressure for pressing the brush against the upper surface of the substrate. It is preferable that the detection unit is provided on the force point side of the seesaw member and detects a height on the force point side that corresponds to the maximum pushing height (Claim 2). .

The detection unit is located at the farthest position from the brush that comes into contact with the processing liquid. Therefore, there is no need to consider the adverse effects of the processing liquid, and the degree of freedom in arranging the detection section can be increased.

Further, in the present invention, the pressing mechanism includes a rotating shaft connected to an upper part of the brush holder, and a pushing mechanism for moving the rotating shaft forward and backward toward the upper surface of the substrate and pressing the brush against the upper surface of the substrate. a pressing actuator that applies pressure; the detection unit is provided at a position capable of detecting the height of the rotating shaft, and is capable of detecting the height of the rotating shaft corresponding to the maximum pushing height. Preferable (Claim 3).

If a complicated mechanism is involved up to the detection section, there is a risk of erroneous detection due to a failure of the mechanism. However, since the height of the rotating shaft near the brush is detected, the height of the rotating shaft can be reliably detected.

Further, in the present invention, it is preferable that when the control unit determines that the brush has fallen off, it immediately stops processing the substrate being processed while being held by the rotation holding unit (Claim 4).

Since the brush has fallen off, the process is immediately stopped when it is detected. Therefore, unnecessary processing can be prevented. Accordingly, waste of processing liquid can be prevented and power can be saved.

Further, the invention according to claim 5 provides a brush falling-off detection method for detecting the presence or absence of the brush when cleaning the substrate by applying a brush to the substrate, in which the substrate is placed on the rotating holding part. a no-load height that is highest from the top surface of the substrate and does not cause the brush to act on the substrate; and an action height that is lower than the no-load height and causes the brush to act on the substrate with a predetermined load. , the brush is moved through the brush holder by a pushing mechanism that moves a brush holder to which the brush is detachably attached over a maximum pushing height that is lower than the working height and moves the brush to the lowest position; A detection unit detects that the maximum pressing height has been reached based on the movement process of moving the brush to the working height and the operation of the pressing mechanism when the brush is moved to the working height. In some cases, the present invention is characterized by comprising a determination step of determining that the brush has fallen off.

[Operation/Effect] According to the invention described in claim 5, in the movement process, the pressing mechanism attempts to move the brush to the operating height via the brush holder. Then, since the brush has fallen off, no reaction force from the board equal to the predetermined load is generated on the brush holder. Therefore, the pressing mechanism. The brush holder continues to move and reaches the maximum pushing height. Therefore, since the detection unit detects the maximum pushing height, it can be determined in the determination process that the brush has fallen off. Since the detection section detects that the maximum pushing height has been reached based on the operation of the pressing mechanism, the detection section can be placed at a location where it does not come into contact with the scattered processing liquid. Therefore, there is no need to construct the detection section from a chemically resistant material. As a result, costs can be reduced. Further, since there is no fear that the processing liquid will adhere to the detection section and light will be scattered, detection accuracy can be increased.

According to the substrate processing apparatus according to the present invention, with the substrate placed on the rotating holding section and the brush falling off from the brush holder, the control section operates the pressing mechanism to move the brush to the operating height. try to make it happen. Then, since the brush has fallen off, no reaction force from the board equal to the predetermined load is generated on the brush holder. Therefore, the pressing mechanism. The brush holder continues to move and reaches the maximum pushing height. Therefore, since the detection section detects the maximum pushing height, the control section can determine that the brush has fallen off. Since the detection section detects that the maximum pushing height has been reached based on the operation of the pressing mechanism, the detection section can be placed at a location where it does not come into contact with the scattered processing liquid. Therefore, there is no need to construct the detection section from a chemically resistant material. As a result, costs can be reduced. Further, since there is no fear that the processing liquid will adhere to the detection section and light will be scattered, detection accuracy can be increased.

1 is a plan view showing the overall configuration of a substrate processing apparatus according to an example. 2 is a diagram of the substrate processing apparatus of FIG. 1 viewed from rear X. FIG. FIG. 2 is a plan view showing a schematic configuration of a backside cleaning unit according to an example. FIG. 2 is a side view showing a schematic configuration of a back surface cleaning unit. FIG. 3 is a longitudinal cross-sectional view of the cleaning arm. It is a block diagram showing a control system of a surface cleaning unit. It is a flow chart showing pre-processing performed in advance. (a) shows the relationship between the opening degree of the electro-pneumatic regulator and the load of the electronic balance, (b) shows the relationship between the secondary pressure of the electro-pneumatic regulator and the opening degree, and (c) shows the relationship between the opening degree of the electro-pneumatic regulator and the pressure actuator. 2 is a graph showing the relationship between the load and the secondary pressure of the electro-pneumatic regulator. It is a flow chart showing cleaning processing. FIG. 7 is a longitudinal cross-sectional view of a cleaning arm according to a modified example.

Embodiments of the present invention will be described below with reference to the drawings.
FIG. 1 is a plan view showing the overall configuration of a substrate processing apparatus according to an embodiment. FIG. 2 is a diagram of the substrate processing apparatus of FIG. 1 viewed from the rear X.

<1. Overall configuration>

The substrate processing apparatus 1 includes a loading/unloading block 3, an indexer block 5, and a processing block 7.

The substrate processing apparatus 1 processes a substrate W. The substrate processing apparatus 1 performs a cleaning process on the substrate W, for example. The substrate processing apparatus 1 processes the substrate W in a single wafer process in the processing block 7 . In the single-wafer type, each substrate W is processed one by one in a horizontal position.

In this specification, for convenience, the direction in which the carry-in/out block 3, indexer block 5, and processing block 7 are lined up is referred to as the "front-back direction X." The front-rear direction X is horizontal. In the front-rear direction X, the direction from the processing block 7 to the loading/unloading block 3 is referred to as the "front". The direction opposite to the front is called "backward." The horizontal direction orthogonal to the front-rear direction X is referred to as the "width direction Y." One direction of "width direction Y" is appropriately called "right side." The direction opposite to the right side is called the "left side." A direction perpendicular to the horizontal direction is called a "vertical direction Z." In each figure, the front, rear, right, left, top, and bottom are indicated as appropriate for reference.

<2. Loading/unloading block＞

The loading/unloading block 3 includes a loading section 9 and a dispensing section 11. The input section 9 and the dispensing section 11 are arranged in the width direction Y. A plurality of substrates W (for example, 25 substrates) are stacked and housed in one carrier C in a horizontal position at regular intervals. The carrier C containing unprocessed substrates W is placed on the input section 9 . The loading unit 9 includes, for example, two mounting tables 13 on which the carriers C are mounted. The carrier C is formed with a plurality of grooves (not shown) that accommodate the substrates W one by one, with the surfaces of the substrates W separated from each other. For example, the carrier C accommodates the substrate W with its surface facing upward. An example of carrier C is FOUP (Front Opening Unify Pod). A FOUP is a closed container. The carrier C may be an open container, and any type of carrier C may be used.

The payout section 11 is disposed on the opposite side of the input section 9 across the center of the substrate processing apparatus 1 in the width direction Y. The payout section 11 is arranged on the left side Y of the input section 9. The dispensing unit 11 stores the processed substrate W in a carrier C and dispenses the carrier C together. The dispensing section 11 that functions in this manner, like the inputting section 9, includes, for example, two mounting tables 13 on which the carriers C are placed. The input section 9 and the dispensing section 11 are also called a load port.

<3. Indexer block>

The indexer block 5 is arranged adjacent to the rear X of the loading/unloading block 3 in the substrate processing apparatus 1 . The indexer block 5 includes an indexer robot IR and a delivery section 15.

The indexer robot IR is configured to be rotatable around the vertical direction Z. The indexer robot IR is configured to be movable in the width direction Y. The indexer robot IR includes a first hand 19 and a second hand 21. In FIG. 1, only one hand is shown for reasons of illustration. The first hand 19 and the second hand 21 each hold one substrate W. The first hand 19 and the second hand 21 are configured to be able to move forward and backward in the front-rear direction X independently. The indexer robot IR moves in the width direction Y and rotates around the vertical direction Z, advances and retreats the first hand 19 and the second hand 21, and transfers the substrates W to and from each cassette C. Similarly, the indexer robot IR transfers the substrate W to and from the transfer unit 15.

The delivery unit 15 is arranged in the indexer block 5 at the boundary with the processing block 7 . The delivery section 15 is arranged, for example, at the center in the width direction Y. As shown in FIG. 2, the delivery section 15 is formed long in the vertical direction Z. As shown in FIG.

The delivery section 15 includes, from below to above in the vertical direction Z, a first reversing unit 23, a path section 25, a path section 27, and a second reversing unit 29.

The first inversion unit 23 inverts the substrate W received from the indexer block 5 upside down. The first reversing unit 23 reverses the horizontal orientation of the substrate W. Specifically, the first reversing unit 23 converts the substrate W with the front surface facing upward into a posture with the front surface facing downward. In other words, the attitude of the substrate W is changed so that the back surface faces upward.

The second reversing unit 29 performs the opposite operation. That is, the second inversion unit 29 inverts the substrate W received from the processing block 7 upside down. The second reversing unit 29 converts the substrate W with the front surface facing downward into a posture with the front surface facing upward. In other words, the attitude of the substrate W is changed so that the back surface faces downward.

The reversing directions of the first reversing unit 23 and the second reversing unit 29 may be opposite to each other. That is, the first reversing unit 23 changes the attitude of the substrate W so that the front surface thereof faces upward. The second reversing unit 29 changes the attitude of the substrate W so that the back surface faces upward.

The pass units 25 and 27 are used to transfer the substrate W between the indexer block 5 and the processing block 7. The pass section 25 is used, for example, to transport the substrate W from the processing block 7 to the indexer block 5. The path unit 27 is used, for example, to transport the substrate W from the indexer block 5 to the processing block 7. Note that the transport directions of the substrates W in the path sections 25 and 27 may be opposite to each other.

<4. Processing block>

The processing block 7 performs a cleaning process on the substrate W, for example. The cleaning process is, for example, a process using a brush in addition to a treatment liquid. As shown in FIG. 1, the processing block 7 is divided, for example, in the width direction Y into a first row R1, a second row R2, and a third row R3. Specifically, the first row R1 is arranged on the left side Y. The second row R2 is arranged at the center in the width direction Y. In other words, the second row R2 is arranged to the right Y of the first row R1. The third row R3 is arranged to the right Y of the second row R2.

<4-1. 1st column>

The first row R1 of the processing block 7 includes a plurality of processing units 31. The first row R1 includes, for example, four processing units 31. In the first row R1, four processing units 31 are stacked in the vertical direction Z. Details of each processing unit 31 will be described later. Each processing unit 31 is, for example, a cleaning unit. The cleaning unit performs a cleaning process on the substrate W. The cleaning units include a front surface cleaning unit that cleans the front surface of the substrate W, and a back surface cleaning unit that cleans the back surface of the substrate W. In this embodiment, a backside cleaning unit SSR will be explained as an example of the processing unit 31.

<4-2. 2nd column>

The second row R2 of the processing block 7 includes a center robot CR. The center robot CR is configured to be rotatable around the vertical direction Z. The center robot CR is configured to be able to move up and down in the vertical direction Z. The center robot CR includes, for example, a first hand 33 and a second hand 35. The first hand 33 and the second hand 35 each hold one substrate W. The first hand 33 and the second hand 35 are configured to be able to advance and retreat independently in the front-rear direction X and the width direction Y.

<4-3. 3rd column>

The third column R3 of the processing block 7 has the same configuration as the first column R1. That is, the third row R3 includes a plurality of processing units 31. The third row R3 includes, for example, four processing units 31. In the third row R3, four processing units 31 are stacked in the vertical direction Z. Each processing unit 31 in the first row R1 and each processing unit 31 in the third row R3 are arranged to face each other in the width direction Y. This allows the central robot CR to access each of the opposing processing units 31 in the first row R1 and the third row R3 at the same height in the vertical direction Z.

The processing block 7 is configured as described above. Here, an example of the operation of the center robot CR will be briefly described. The center robot CR receives the substrate W from the first reversing unit 23, for example. The center robot CR transports the substrate W to the backside cleaning unit SSR in either the first row R1 or the third row R3 to perform a cleaning process on the backside of the substrate W. The center robot CR receives the substrate W that has been cleaned by the backside cleaning unit SSR in either the first row R1 or the third row R. The center robot CR transports the substrate W to the second reversing unit 29.

<4-4. Processing unit>

Here, the backside cleaning unit SSR (processing unit 31) will be explained with reference to FIGS. 3 to 5. FIG. 3 is a plan view showing a schematic configuration of the backside cleaning unit according to the embodiment. FIG. 4 is a side view showing a schematic configuration of the back surface cleaning unit. FIG. 5 is a longitudinal cross-sectional view of the cleaning arm.

In addition, here, the back surface cleaning unit SSR provided in the first row R1 will be explained as an example. The back surface cleaning units SSR in the third row R3 have a configuration in which the arrangement in the width direction Y is reversed.

The back surface cleaning unit SSR includes a rotation holding section 37 , a guard 39 , a first processing liquid arm 41 , a second processing liquid arm 43 , a cleaning arm 45 , and a standby pot 47 .

<4-4-1. Rotation holding part＞

The rotation holding section 37 is arranged approximately at the center of the back surface cleaning unit SSR in plan view. The rotation holding unit 37 rotates the substrate W within a horizontal plane while holding the substrate W in a horizontal position. The rotation holding section 37 includes an electric motor 49, a rotating shaft 51, a spin chuck 53, and a support pin 55.

The electric motor 49 is arranged with the rotating shaft 51 oriented in the vertical direction Z. A spin chuck 53 is attached to the upper end of the rotating shaft 51. The spin chuck 53 has a diameter slightly larger than the diameter of the substrate W. The spin chuck 53 is a circular plate member. The spin chuck 53 includes a plurality of support pins 55. In this embodiment, for example, six support pins 55 are provided. The six support pins 55 contact the outer peripheral edge of the substrate W and support the substrate W in a horizontal position. The number of support pins 55 is not limited to six as long as the plurality of support pins 55 can stably support the substrate W in a horizontal position. The six support pins 55 are erected near the outer peripheral edge of the substrate W in the spin chuck 53. The six support pins 55 release the holding of the peripheral edge of the substrate W when carrying the substrate W into the spin chuck 53 and when carrying out the substrate W from the spin chuck 53. Therefore, each support pin 55 is configured to be rotatable around the vertical direction Z. A detailed description of the configuration for performing this operation will be omitted. When the electric motor 49 is rotated, the rotation holding section 37 rotates the spin chuck 53 around the rotation center P1. The rotation center P1 is in the vertical direction Z.

<4-4-2. Guard>

The guard 39 is arranged so as to surround the rotation holding part 37 in a plan view. Specifically, the guard 39 includes a cylindrical body portion 57 and an inclined portion 59. The guard 39 is configured to be movable up and down in the vertical direction Z. The guard 39 can be raised and lowered to a lowered standby position and a processing position above the standby position. A detailed description of the configuration for raising and lowering the guard 39 will be omitted.

The body 57 of the guard 39 has a cylindrical shape. The body portion 57 is arranged such that the inner circumferential surface thereof is spaced outward from the outer circumferential side of the rotation holding portion 37 . The inclined portion 59 is narrowed from the upper portion of the body portion 57 toward the rotating shaft 51 side. The inclined portion 59 has an opening 61 at the top. The opening 61 is formed in the center of the inclined portion 59. The opening 61 is larger than the diameter of the substrate W. The opening 61 is larger than the diameter of the spin chuck 53. When loading and unloading the substrate W, the guard 39 is lowered in the vertical direction Z to a position where the spin chuck 53 protrudes upward from the opening 61. During cleaning processing of the substrate W, the guard 39 has an inclined portion 59 located near the height of the substrate W held by the spin chuck 53. The inclined portion 59 guides processing liquid and the like scattered around from the substrate W to the lower side of the guard 39 on the inclined inner circumferential surface.

<4-4-3. First processing liquid arm>

The first processing liquid arm 41 is arranged at the rear X of the rotation holding section 37 in plan view. The first processing arm 41 is equipped with an electric motor 42 on the base end side. The first treatment liquid arm 41 is swung around a rotation center P2 on the base end side by an electric motor 42. The rotation center P2 is in the vertical direction Z. The first treatment liquid arm 41 includes one nozzle 63. The nozzle 63 has a discharge port at the bottom. The nozzle 63 discharges the processing liquid. The first treatment liquid arm 41 is configured such that the tip of the nozzle 63 can swing between a standby position shown in FIG. 3 and a supply position near the rotation center P1. When the first treatment liquid arm 41 supplies the treatment liquid to the substrate W, the tip of the nozzle 63 is moved to the supply position. When the first treatment liquid arm 41 does not supply the treatment liquid to the substrate W, the tip of the nozzle 63 is moved to the standby position. The first treatment liquid arm 41 may swing the nozzle 63 above the substrate W so as not to interfere with the cleaning arm 45 when supplying the treatment liquid to the substrate W.

Examples of the processing liquid discharged from the nozzle 63 include a rinsing liquid. Examples of the rinsing liquid include pure water, carbonated water, electrolyzed ionized water, hydrogen water, and ozone water.

<4-4-4. Second processing liquid arm>

The second treatment liquid arm 43 is arranged on the left side Y of the rotation holding section 37 in plan view. The second treatment liquid arm 41 is equipped with an electric motor 44 on the base end side. The second treatment liquid arm is swung around the rotation center P3 on the base end side by the electric motor 44. The rotation center P3 is in the vertical direction Z. The second treatment liquid arm 43 includes three nozzles 65, 67, and 69. Each nozzle 65, 67, 69 has a discharge port at the bottom. The nozzles 65, 67, and 69 discharge the processing liquid. The second treatment liquid arm 43 is configured such that the tips of the nozzles 65, 67, and 69 can swing between a standby position shown in FIG. 3 and a supply position near the rotation center P1. When the second treatment liquid arm 43 supplies the treatment liquid to the substrate W, the tips of the nozzles 65, 67, and 69 are moved to the supply position. When the second treatment liquid arm 43 does not supply the treatment liquid to the substrate W, the tips of the nozzles 65, 67, and 69 are moved to the standby position. The second processing liquid arm 43 may swing the nozzles 65, 67, and 69 above the substrate W so as not to interfere with the cleaning arm 45 when supplying the processing liquid to the substrate W. .

Examples of the processing liquid discharged from the nozzles 65, 67, and 69 include chemical liquids. The chemical solution is, for example, a chemical solution containing at least one of sulfuric acid, nitric acid, acetic acid, hydrochloric acid, hydrofluoric acid, aqueous ammonia, and aqueous hydrogen peroxide. As a more specific chemical solution, for example, SC-1, which is a mixed solution of aqueous ammonia and aqueous hydrogen peroxide, can be used.

<4-4-5. Washing arm>

The cleaning arm 45 is configured as follows.

The cleaning arm 45 includes a rotating lifting mechanism 71, a support column 73, a housing 75, and a cleaning section 77.

The rotary elevating mechanism 71 is configured to be able to move up and down the support column 73, the housing 75, and the cleaning section 77 in the vertical direction Z. The rotary elevating mechanism 71 is configured to be able to swing the support 73, the housing 75, and the cleaning section 77 around a rotation center P4. Specifically, the rotation elevating mechanism 71 is configured by combining an electric motor and an air cylinder, for example. The rotary elevating mechanism 71 raises the cleaning section 77 in the vertical direction Z from the standby pot 47 in the standby position. The rotary elevation mechanism 71 swings the cleaning section 77 in a horizontal plane so as to pass near the rotation center P1.

The support column 73 has a cylindrical shape. The lower part of the support column 73 is connected to the rotational elevating mechanism 71. The upper part of the support column 73 is connected to one lower part of the housing 75. The housing 75 has a long axis in a horizontal plane. The housing 75 includes a cleaning section 77 at the other lower part. The cleaning section 77 is rotated around a rotation center P5. The rotation center P5 is in the vertical direction Z.

The housing 75 includes a lower housing 75a and an upper housing 75b. The lower casing 75a constitutes the lower part of the casing 75. The upper housing 75b constitutes the upper part of the housing 75. The upper housing 75b and the lower housing 75a are connected to each other.

The housing 75 includes a pressing mechanism 81 and a rotating mechanism 83. Specifically, the lower housing 75a is equipped with a pressing mechanism 81 and a rotating mechanism 83.

The pressing mechanism 81 includes a fulcrum member 85, a seesaw member 87, a pressing actuator 89, and a support mechanism 91.

The fulcrum member 85 is attached to the upper surface of the lower housing 75a. The fulcrum member 85 is erected approximately at the center of the lower housing 75a in the front-rear direction X. The fulcrum member 85 includes a swing shaft 85a at its upper portion. The swing shaft 85a is rotatable around the width direction Y. The seesaw member 87 has a central portion 87c swingably attached to the fulcrum member 85 via a swing shaft 85a. In the seesaw member 87, both ends of one side 87l (point of action) and the other side 87r (point of effort) can be raised and lowered alternately in the vertical direction Z. The seesaw member 87 has a swing shaft 85a as a fulcrum.

In the pressing actuator 89, an actuating piece 89a is arranged toward the vertical direction Z. The pressing actuator 89 raises one side 87l of the seesaw member 87 by extending the operating shaft 89a. The pressing actuator 89 is preferably an air bearing actuator, for example.

In the air bearing actuator, an operating shaft 89a is supported by air so as to be movable forward and backward with a small gap therebetween. Therefore, in theory, the sliding resistance of the operating shaft 89a becomes zero, and no friction occurs. Therefore, the air bearing actuator can move the operating shaft 89a forward and backward even with a small amount of air pressure, compared to a normal air cylinder. Therefore, it is possible to linearly advance and retreat according to the air pressure. However, a normal air cylinder can also be used as the pressing actuator 89.

In the longitudinal direction X, a support mechanism 91 is provided on the opposite side of the pressing actuator 89 with the fulcrum member 85 in between. Support mechanism 91 supports cleaning section 77 . The support mechanism 91 suspends and supports the cleaning section 77 below the housing 75.

The support mechanism 91 includes a holding member 93, a biasing section 95, and a guide section 97.

The support mechanism 91 suspends and supports the cleaning section 77. The cleaning section 77 includes a brush 99 and a brush holder 101. The brush 99 acts on the substrate W to clean it. Brush holder 101 holds brush 99. The brush holder 101 detachably holds the brush 99. A rotating shaft 103 is attached to the center of the brush holder 101 in plan view. The rotating shaft 103 extends from the brush holder 101 in the vertical direction Z.

The holding member 93 rotatably holds the rotating shaft 103. The rotating shaft 103 is, for example, a spline shaft. The rotating shaft 103 is attached to the holding member 93 via a spline nut 103a. The rotating shaft 103 is movable in the vertical direction Z with respect to the spline nut 103a. The holding member 93 holds the spline nut 103a in a rotatable state around the vertical direction Z. The spline nut 103a is attached to the holding member 93 via a bearing (not shown). The rotation shaft 103 is rotatable around a rotation center P5. A pulley 105 is attached to a spline nut 103a that protrudes from the upper part of the holding member 93. The pulley 105 is fixed to the outer peripheral surface of the spline nut 103a. When the pulley 105 rotates, the spline nut 103a rotates, and the rotating shaft 103 also rotates in the same direction.

A biasing portion 95 is arranged above the pulley 105. The biasing section 95 includes an upper holding section 107, a lower holding section 109, and a coil spring 111. The upper holding part 107 is attached to the upper side of the rotating shaft 103 via a bearing (not shown). In other words, the upper holding part 107 remains stationary even when the rotating shaft 103 rotates. The lower holding part 109 is spaced apart from the upper holding part 107. The lower holding part 109 is disposed below the upper holding part 107 and above the pulley 105. The lower holding portion 109 is arranged such that its inner circumferential surface is spaced apart from the outer circumferential surface of the rotating shaft 103 . Therefore, the lower holding part 109 remains stationary even when the rotating shaft 103 rotates. Further, the lower holding portion 109 is attached to the upper surface of the pulley 103 via a bearing. Therefore, the lower holding part 109 is not affected by the rotation of the pulley 103.

The coil spring 111 is attached to the upper holding part 107 and the lower holding part 109. The coil spring 111 has an upper end fixed to the upper holding part 107. The lower end of the coil spring 111 is fixed to the lower holding part 109. The coil spring 111 has, for example, a cylindrical shape. The coil spring 111 is a compression coil spring. Therefore, the upper holding part 107 is urged upward from the upper surface of the pulley 103 and the lower holding part 109. As a result, the rotating shaft 103 is urged upward in the vertical direction Z. Therefore, in a normal state in which the pressing actuator 89 is not operating, the brush 99 is maintained at a constant height from the lower surface of the lower housing 75a. In other words, under normal conditions, the load applied by the brush 99 is zero.

The support mechanism 91 supports a rotating shaft 103 that moves up and down in the vertical direction Z. The support mechanism 91 includes a linear guide 113 and a shaft holder 115. The linear guide 113 is arranged adjacent to the holding member 93. The linear guide 113 is erected in the vertical direction Z. The linear guide 113 includes a rail 113a and a carriage 113b. The rail 113a has its longitudinal direction arranged in the vertical direction Z. A carriage 113b is attached to the rail 113a so that it can move in the vertical direction Z. The carriage 113b is arranged below the other side 87r of the seesaw member 87. The carriage 113b is arranged at a position where it comes into contact with the other side 87r of the seesaw member 87 when it is lowered.

The shaft holding part 115 holds the upper part of the rotating shaft 103. The shaft holder 115 holds the rotary shaft 103 in a state where it is allowed to rotate. The shaft holding portion 115 holds the rotating shaft 103 via, for example, a bearing (not shown). The carriage 113b is connected to the shaft holder 115. When the pressing actuator 89 raises the actuating shaft 89a with a driving force stronger than the biasing force of the coil spring 111, the one side 87l (the point of action) rises. When one side 87l goes up, the other side 87r (power point part) goes down. At this time, the other side 87r lowers the carriage 113b together with the shaft holding part 115. Then, the rotating shaft 103 descends, and the brush 99 moves downward from the predetermined position. When the pressing actuator 89 is driven in this manner, a pressing force corresponding to the driving force of the pressing actuator 89 is applied to the brush 99.

A rotation mechanism 83 is arranged adjacent to the support mechanism 91. The rotation mechanism 83 is arranged on the fulcrum member 85 side. The rotation mechanism 83 includes a mounting member 117 and an electric motor 119. The mounting member 117 disposes the electric motor 119 upwardly apart from the bottom surface of the lower housing 75a. The electric motor 119 is arranged with its rotating shaft facing downward in the vertical direction Z. The electric motor 119 rotates a rotation shaft around a rotation center P6. The rotation center P6 is substantially parallel to the rotation center P5 in the vertical direction Z. The electric motor 119 has a pulley 121 attached to its rotating shaft. A timing belt 123 is stretched between the pulley 121 and the pulley 105. Therefore, when the electric motor 119 is rotated, the rotating shaft 103 is rotated around the rotation center P5 via the timing belt 123, the pulleys 105, 121, and the spline nut 103a. Even when the rotating shaft 103 is rotated in this manner, the rotating shaft 103 can be moved up and down in the vertical direction Z.

The cleaning arm 45 is configured as described above. That is, the operation of the pressing actuator 89 is applied to the other side 87r (point of application) of the seesaw member 87 via one side 87l (force point). Therefore, by providing the seesaw member 87, the degree of freedom in arranging the pressing actuator 89 is increased. Therefore, the height of the substrate processing apparatus 1 can be suppressed. As a result, an arrangement in which the substrate processing apparatuses 1 are stacked in multiple stages can be easily realized.

A detection unit DU is arranged above the pressing actuator 89. The detection unit DU is attached via a mounting member 124. The mounting member 124 is attached to the ceiling surface of the upper housing 75b. The mounting member 124 arranges the detection unit DU above the seesaw member 87 on one side 87l. The detection unit DU is arranged in a direction opposite to the brush 99 in plan view. The detection unit DU is arranged inside the housing 75. Therefore, the processing liquid supplied to the substrate W and the processing liquid scattered around from the brush 99 do not adhere to the substrate.

The detection unit DU includes an actuation piece DP. The detection unit DU is attached with the actuation piece DP facing downward. In other words, the detection unit DU is attached with the actuation piece DP facing the one side 87l. When an external force is applied in the vertical direction Z, the actuating piece DP moves forward and backward with respect to the detection unit DU. When an external force is applied from below to above in the vertical direction Z, the actuating piece DP moves toward the detection unit DU. The actuating piece DP protrudes from the detection unit DU when the external force from below to above in the vertical direction Z is removed. The detection unit DU detects that the actuating piece DP is retracted. The detection unit DU is, for example, a microswitch. For example, the detection unit DU outputs a signal only when the actuating piece DP is recessed and turned on.

Here, the height at which the brush 99 moves up and down will be explained.

The seesaw member 87 described above is swung by a pressing actuator 89. For example, the pressing actuator 89 is operated according to a target load, as will be described later. This operation moves the brush 99 in the vertical direction Z. Specifically, the brush 99 is raised and lowered to the following height.

(1) No-load height H1: This is the height in the vertical direction Z at which the brush 99 does not act on the substrate W. This unloaded height H1 is higher than the other heights below. During normal times, except during cleaning, the brush 99 is located at this no-load height H1.

(2) Action height H2: This is the height in the vertical direction Z for making the brush 99 act on the substrate W with a predetermined load. The height is lower than the no-load height H1. When cleaning the substrate W, the brush 99 is lowered to this working height H2. However, this position is the height when a predetermined load is applied to the brush 99 and the reaction force from the substrate W and the load are balanced.

(3) Maximum pushing height H3: This is a height lower than the working height H2. This is the position where the brush 99 has moved lowest in the vertical direction Z. This maximum pushing height H3 is a position determined by the structure of the pushing mechanism 81. The brush 99 cannot move below this maximum pushing height H3.

The detection unit DU described above detects the maximum pushing height H3. That is, the detection unit DU is attached at a height such that one side 87l of the seesaw member 87 pushes up the detection piece DP when the brush 99 is lowered to the maximum pushing height H3. The detection unit DU turns on and outputs a signal only when the maximum push-in height H3 is detected.

The detection unit DU is disposed at the farthest position from the brush 99 that comes into contact with the processing liquid. Therefore, there is no need to consider the adverse effects of the processing liquid, and the degree of freedom in arranging the detection unit DU can be increased.

<4-5. Control system>

Reference is now made to FIG. FIG. 6 is a block diagram showing the control system of the backside cleaning unit.

One end side of the piping 125 is connected to the nozzle 63 described above. The other end of the pipe 125 is connected to a rinse liquid supply source 127 . The rinsing liquid supply source 127 supplies the above-mentioned rinsing liquid. The pipe 125 is equipped with a flow control valve 129. The flow rate control valve 129 controls the flow rate of the rinse liquid in the pipe 125.

One end side of the piping 131 is connected to the nozzle 65 described above. The other end of the pipe 131 is connected to a processing liquid supply source 133 . The processing liquid supply source 133 supplies any of the various chemical liquids described above. The pipe 131 is equipped with a flow control valve 135. The flow rate control valve 135 controls the flow rate of the chemical liquid in the pipe 131.

One end side of the piping 137 is connected to the nozzle 67 described above. The other end of the pipe 137 is connected to a processing liquid supply source 139 . The processing liquid supply source 139 supplies any of the various chemical liquids described above. The pipe 137 is equipped with a flow control valve 141. The flow rate control valve 141 controls the flow rate of the chemical liquid in the pipe 139.

One end side of the piping 143 is connected to the nozzle 69 described above. The other end of the pipe 143 is connected to a processing liquid supply source 145 . The processing liquid supply source 145 supplies any of the various chemical liquids described above. The pipe 143 is equipped with a flow control valve 147. The flow rate control valve 147 controls the flow rate of the chemical liquid in the pipe 143.

One end side of the air supply pipe 149 is connected to the above-mentioned pressing actuator 89 in communication. Note that air is supplied to the pressing actuator 89 to support the operating shaft 89a with a small gap, but the piping and the like will be omitted. An air supply source 151 is connected to the other end of the air supply pipe 149 . The air supply source 151 supplies air, for example. The air is preferably dry air. Air supply source 151 is also communicatively connected to other devices. The supply pressure of the air supply source 151 is affected by the operating conditions of other devices. In other words, when the operating rate of other devices increases, the supply pressure may decrease. The air supply pipe 149 includes, in order from the air supply source 151 side, an on-off valve 153, a primary pressure gauge 155, an electropneumatic regulator 157, and a secondary pressure gauge 159.

The on-off valve 153 allows or blocks air flow in the air supply pipe 149. The primary side pressure gauge 155 measures the air pressure upstream of the electropneumatic regulator 157. The electropneumatic regulator 157 adjusts the opening degree of a built-in valve according to an input signal. Thereby, the electropneumatic regulator 157 adjusts the air pressure in the air supply pipe 139. Specifically, the electropneumatic regulator 157 adjusts the valve opening degree in accordance with the input signal provided to reduce the primary side pressure, thereby making it the secondary side pressure in the air supply pipe 139. The electropneumatic regulator 157 cannot adjust the secondary pressure higher than the primary pressure in the air supply pipe 149. The electropneumatic regulator 157 adjusts the secondary pressure to be lower than the primary pressure of the air supply pipe 139 . The electropneumatic regulator 157 can adjust the secondary pressure within a predetermined value or less when the primary pressure exceeds a predetermined value. In other words, if the primary side pressure is below a predetermined value, the electropneumatic regulator 157 may not be able to accurately adjust the secondary side pressure to a certain value or higher.

The control unit 161 centrally controls each of the above-mentioned units. Specifically, the control unit 161 controls the transport operation in the loading section 9 and the dispensing section 11, the transport operation of the indexer robot IR, the reversing operation of the first reversing unit 23 and the second reversing unit 29, the transport operation of the center robot CR, etc. control. The control unit 161 controls the rotation of the electric motor 49 in the backside cleaning unit SSR (processing unit 31), the raising and lowering operation of the guard 39, the opening and closing operation of the support pin 55 in the spin chuck 53, the swinging operation of the electric motors 42 and 44, and the flow rate. The opening and closing operations of the control valves 129, 135, 141, and 147, the rocking and lifting operations of the rotary lifting mechanism 71, the rotational operation of the electric motor 119, the opening and closing operations of the on-off valve 153, and the opening operation of the electropneumatic regulator 157 are controlled. Perform operations.

The control unit 161 includes a CPU and memory (not shown). An instruction section 163 is connected to the control section 161 . The instruction unit 163 is operated by the operator of the substrate processing apparatus 1 . The instruction unit 163 is used by an operator to instruct a recipe specifying the processing contents of the substrate W, start and stop of the processing, and the like. A notification section 165 is connected to the control section 161 . The notification unit 165 generates an alarm when a problem occurs in the substrate processing apparatus 1, and notifies the operator of the occurrence of the problem. The notification unit 165 is, for example, a display device, a lamp, a buzzer, a speaker, or the like. Preferably, the notification unit 165 can confirm the type of problem that has occurred. The control unit 161 includes an input port IP. The input port IP receives data from various electronic devices. Data input from the input port IP is processed and stored by the control unit 161.

The control unit 161 receives the measured values of the primary pressure gauge 155 and the secondary pressure gauge 159. The control unit 161 provides an input signal for operating the valve opening of the electropneumatic regulator 157 . The pressing force applied by the brush 99 to the substrate W is determined according to this input signal.

The control unit 161 receives a signal when the detection unit DU is turned on. When the control unit 161 receives a signal from the detection unit DU, it determines that the height of the brush 99 has reached the maximum pushing height H3.

Note that the backside cleaning unit SSR (processing unit 31) described above corresponds to the "substrate processing apparatus" in the present invention.

<5. Pre-processing in processing unit>

With reference to FIGS. 7 and 8, pre-processing in the above-mentioned backside cleaning apparatus SSR will be described. FIG. 7 is a flowchart showing preprocessing performed in advance. 8(a) shows the relationship between the opening degree of the electro-pneumatic regulator and the load of the electronic balance, FIG. 8(b) shows the relationship between the secondary pressure of the electro-pneumatic regulator and the opening degree, and FIG. 8(c) ) is a graph showing the relationship between the load of the pressing actuator and the secondary pressure of the electropneumatic regulator.

The operator of the substrate processing apparatus 1 operates the instruction section 163 to instruct preprocessing for one backside cleaning unit SSR.

Step S1
Place an electronic balance. Specifically, an electronic balance (not shown) is placed in the rotation holding section 37. Electronic balances are devices that measure loads. Preferably, the electronic balance includes a data output terminal. The electronic balance has a data output terminal connected to an input port IP. The electronic balance outputs a measured value from a data output terminal. The measured value is, for example, load (g).

Step S2
Measure the load. Specifically, for example, the control unit 161 varies the input signal to the electro-pneumatic regulator 157 while the on-off valve 153 is open, and measures the load X (g) of the electronic balance for each input signal at that time. do. In addition, the operator actually instructs several loads (target loads X (g)) to be applied with the brush 99 from the instruction unit 163 in the process, so that the measured value of the electronic balance becomes each target load X (g). The input signal to the electropneumatic regulator 157 may be varied to obtain an input signal corresponding to each target load X(g) at that time. At this time, the control unit 161 receives the secondary pressure that is the measured value of the secondary pressure gauge 159 for each load.

Step S3
The control unit 161 stores the correspondence relationship between the measured loads. Through the measurement in step S2, the control unit 161 stores the opening degree (input signal) of the electropneumatic regulator 89 and the load of the electronic balance (target load X (g )) and the relationship between the secondary side pressure and the opening degree of the electropneumatic regulator 89 as shown in FIG. 8(b) are obtained. The control unit 161 stores in the memory the relationship between the load of the pressing actuator 89 and the secondary pressure of the electropneumatic regulator 157 as shown in FIG. 8(c), as well as the above relationship.

Step S4
The operator of the substrate processing apparatus 1 operates the instruction section 163 to instruct one backside cleaning unit SSR to finish the preprocessing. The operator of the substrate processing apparatus 1 removes the electronic balance from the rotary holding section 37. If necessary, perform similar pretreatment for other backside cleaning units SSR.

<6. Cleaning process in the processing unit>

Next, the cleaning process will be explained with reference to FIG. FIG. 9 is a flowchart showing the cleaning process.

Step S11
The operator instructs to start processing. Specifically, a recipe including the target load X(g) is also instructed. Then, the substrate W is transferred from the indexer block 5 to the transfer section 15, and its attitude is changed by the first reversing unit 23 so that the back surface is facing upward.

Step S12
The substrate W with its back surface facing upward is transported to one back surface cleaning unit SSR by a central robot CR. The back surface cleaning unit SSR starts the cleaning process. Specifically, the control unit 161 refers to the above relationship acquired in advance (FIG. 8(c)), and determines whether the secondary pressure of the secondary pressure gauge 159 is equal to or less than the secondary pressure corresponding to the target load X(g). The input signal to the electropneumatic regulator 157 is adjusted so that the next side pressure is Z (Pa). As a result, air is supplied from the electropneumatic regulator 157 to the pressing actuator 159, and cleaning is performed with the target load X (g) being applied to the substrate W from the brush 99. In other words, the control unit 161 moves the brush 99 from the no-load height H1 to the working height H2. At this time, the first treatment liquid arm 41 is swung, and pure water is supplied to the entire surface of the substrate W at a position where it does not interfere with the cleaning arm 45. At this time, the brush 99 acts on the back surface of the substrate W to perform the cleaning process. The control unit 161 operates the rotational drive mechanism 71 to swing the cleaning arm 45 within the diameter of the substrate W so that the brush 99 passes through the rotation center P1 and is reversed on both end surfaces of the substrate W.

Step S13
The control unit 161 monitors the presence or absence of a signal from the detection unit DU at the start of the cleaning process described above, and specifically after the pressing mechanism 81 applies a load to the brush 99. When the control unit 161 receives the signal from the detection unit DU, it determines that the brush 99 has fallen off from the brush holder 101.

Note that step S12 described above corresponds to the "moving process" in the present invention, and step S13 described above corresponds to the "determination process" in the present invention.

Here, first, a case will be described where the detection unit DU is off and does not output a signal.

Step S14
Continue processing. After supplying pure water for a predetermined period of time, the second treatment liquid arm 43 is swung instead of the first treatment liquid arm 41 . Thereby, the chemical solution is supplied to the entire surface of the substrate W at a position where it does not interfere with the cleaning arm 45. At this time, the brush 99 is applied to the back surface of the substrate W. After the chemical solution has been supplied for a predetermined period of time, the first processing liquid arm 41 is swung again instead of the second processing liquid arm 43, and the chemical solution is replaced with pure water. At this time, the brush 99 is applied to the back surface of the substrate W. Thereafter, the first treatment liquid arm 41, the second treatment liquid arm 43, and the cleaning arm 45 are moved to the standby position. Then, the control unit 161 dries the substrate W. Specifically, the control unit 161 rotates the electric motor 49 at high speed to shake off the pure water adhering to the substrate W and dry it.

Step S15
After the processing is completed, the substrate W is carried out. The control unit 161 lowers the guard 39 to the standby position. The center robot CR carries out the substrate W that has finished the drying process from the backside cleaning unit SSR. The unloaded substrate W is reversed by the second reversing unit 29 so that the surface thereof faces upward. The substrate W with the front surface facing upward is carried out to the payout section 11 by the indexer robot IR.

Step S16
The process moves on to the next substrate W. The control unit 161 performs a cleaning process on the next substrate W carried in by the central robot CR. In other words, the process returns to step S12.

Here, a case will be described in which the control unit 161 detects that the detection unit DU is turned on in step S13 described above. In detail, a processing example will be described when the control unit 161 determines that the brush 99 has reached the maximum pushing height H3, that is, the brush 99 has fallen off.

Step S17
Issue an alarm. The control unit 161 operates the notification unit 165 to issue an alarm. This allows the operator of the substrate processing apparatus 1 to know that the brush 99 has fallen off.

Step S17
The process is stopped and the substrate W is carried out. The control unit 161 immediately stops processing the substrate W and carries out the substrate W. In other words, the processing is stopped immediately without completing the entire cleaning process for the substrate W. In other words, the cleaning process is stopped midway through, and the substrate W is carried out.

In this way, when the falling off of the brush 99 is detected, the process is immediately stopped at the time of detection. Therefore, unnecessary processing on the substrate W can be prevented. This prevents waste of processing liquid and saves power required for wasteful processing.

Note that step S17 described above corresponds to the "processing stop process" in the present invention.

According to this embodiment, when the substrate W is placed on the rotation holding section 37 and the brush 99 has fallen off from the brush holder 101, the control section 161 operates the pressing mechanism 81 to raise the brush 99 to the operating height. Try to move it to H2. If the brush 99 has fallen off, no reaction force from the substrate W equal to the predetermined load is generated in the brush holder 101. Therefore, the pressing mechanism 81. The brush holder 101 continues to move and reaches the maximum pushing height H3. Therefore, since the detection unit DU detects the maximum push-in height H3, the control unit 161 can determine that the brush 99 has fallen off. Since the detection unit DU detects that the maximum pushing height H3 has been reached based on the operation of the pressing mechanism 81, the detection unit DU can be placed at a location where it does not come into contact with the scattered processing liquid. Therefore, there is no need to configure the detection unit DU with a chemical-resistant material. As a result, costs can be reduced. Moreover, since there is no possibility that the processing liquid will adhere to the detection unit DU and light will be scattered, detection accuracy can be increased.

<Modified example>

A modification of this embodiment will be described with reference to FIG. 10. FIG. 10 is a longitudinal cross-sectional view of a cleaning arm according to a modification. Note that the same components as those of the cleaning arm 45 in the above-mentioned embodiment are given the same reference numerals, and detailed description thereof will be omitted.

The detection unit DUa includes a non-contact sensor 191 and a detection piece 193. The detection unit DUa is provided on the opposite side in the front-rear direction X from the detection unit DU of the above-described embodiment. The detection unit DUa is provided on the support mechanism 91 and biasing unit 95 side.

The non-contact sensor 191 is fixed at a predetermined height in the vertical direction Z. The non-contact sensor 191 is, for example, a transmission type optical sensor. A transmissive optical sensor is turned on, for example, when a light shielding member is located in a central detection area. The detection piece 193 is made of a non-transparent material. The detection piece 193 is attached to the upper holding part 107, for example. The detection piece 193 moves up and down in the vertical direction Z together with the rotating shaft 103. The detection piece 193 moves up and down in the vertical direction Z according to the no-load height H1, the working height H2, and the maximum pushing height H3. The detection piece 193 turns on the non-contact sensor 191 when the maximum pushing height H3 is reached. In the non-contact sensor 191, the detection area is shielded from light by the detection piece 193 when the maximum pushing height H3 is reached.

According to such a modification, since the height of the rotating shaft 103 near the brush 99 is detected, the height of the rotating shaft 103 can be reliably detected. If a complicated mechanism is involved up to the detection unit DUa, there is a risk of erroneous detection due to a failure of the mechanism. However, in this modification, this fear can be suppressed.

Note that instead of the non-contact sensor 191 described above, a contact type sensor may be employed as in the embodiment described above.

The present invention is not limited to the above embodiments, and can be modified as described below.

(1) In the embodiments described above, the backside cleaning unit SSR was used as an example of the substrate processing apparatus. However, the present invention is not limited to the backside cleaning unit SSR. For example, a surface cleaning unit that cleans the surface of the substrate with a brush 99 can also be applied.

(2) In the above-mentioned embodiment, the backside cleaning unit SSR (processing unit 31) as a substrate processing apparatus is provided in the substrate processing apparatus 1 equipped with the loading/unloading block 3, the indexer block 5, etc., as an example. . However, the present invention is not limited to such a configuration. For example, it may be configured only with the back surface cleaning unit SSR (processing unit 31).

(3) In the embodiment described above, the cleaning arm 45 does not have a mechanism for detecting the load applied to the brush 99. However, the present invention is not limited to such a configuration. For example, a configuration may be adopted in which the force applied to the carriage 113b is detected by a load cell, and the degree of agreement with the target load is detected.

(4) In the embodiment described above, an alarm is generated when the maximum pushing height H3 is detected. However, the present invention does not require the generation of an alarm. In other words, the process may be stopped without issuing an alarm.

(5) In the embodiment described above, when the maximum push-in height H3 is detected, the process is immediately stopped. However, the present invention does not require immediate stopping. That is, the process may be stopped (also called cycle stop) when the process on the substrate W being processed is completed.

(6) In the embodiments and modifications described above, the cleaning arm 45 includes a seesaw member 87 and a brush moving member 177, and the force point part and the application point part are separated in the front-rear direction X. are doing. However, the present invention is not limited to such a configuration. That is, the structure may be such that the force point part and the action point part are provided at substantially the same position in the front-rear direction X.

1... Substrate processing device 3... Loading/unloading block 5... Indexer block 7... Processing block W... Substrate C... Carrier IR... Indexer robot 15... Delivery section 23... First reversing unit 25, 27... Pass section 29... Second reversing unit 31... Processing unit SSR... Back cleaning unit CR... Center robot 37... Rotating holding part 39... Guard 41... First processing liquid arm 42... Electric motor 43... Second processing liquid arm 45... Cleaning arm 47... Standby pot 53 ... Spin chuck 71 ... Rotating lifting mechanism 75 ... Housing 77 ... Cleaning section 81 ... Pressing mechanism 83 ... Rotating mechanism 85 ... Support member 87 ... Seesaw member 87c ... Center part 87l ... One side 87r ... Other side 89 ... Pressing actuator 91... Support mechanism 93... Holding member 95... Biasing part 97... Guide part 99... Brush 101... Brush holder 103... Rotating shaft 111... Coil spring 113... Linear guide DU... Detection part DP... Actuation piece 124... Mounting member H1... None Load height H2... Working height H3... Maximum pushing height 149... Air supply pipe 151... Air supply source 155... Primary pressure gauge 157... Electropneumatic regulator 159... Secondary pressure gauge 161... Control section 163... Indication section 165... Notification Department

Claims (6)

In a substrate processing apparatus that cleans a substrate by applying a brush to the substrate,
a rotation holding unit that holds the board in a horizontal position and rotates the board;
a brush that acts on the upper surface of the substrate held by the rotation holding part;
a brush holder to which the brush can be detachably attached;
an unloaded height that is highest from the top surface of the substrate and does not cause the brush to act on the substrate; an acting height that is lower than the unloaded height and causes the brush to act on the substrate with a predetermined load; and the acting height. a pushing mechanism that moves the brush through the brush holder over a maximum pushing height that moves the brush to the lowest position;
a detection unit that detects that the maximum pressing height has been reached based on the operation of the pressing mechanism;
When the detection unit detects the maximum pushing height when the brush is moved to the operating height by operating the pushing mechanism with the substrate placed on the rotation holding unit. a control unit that determines that the brush has fallen off;
A substrate processing apparatus comprising: The substrate processing apparatus according to claim 1,
The pressing mechanism is
a seesaw member configured to be swingable about a fulcrum member, including a force point portion on one side with respect to the fulcrum, and an action point portion on the other side with respect to the fulcrum;
a pressing actuator that applies a driving force based on air to the force point portion and swings the seesaw member about the fulcrum to apply pressing pressure to press the brush against the upper surface of the substrate;
Equipped with
The substrate processing apparatus is characterized in that the detection section is provided on the force point side of the seesaw member and detects a height on the force point side corresponding to the maximum pushing height. The substrate processing apparatus according to claim 1,
The pressing mechanism is
a rotating shaft connected to the upper part of the brush holder;
a pressing actuator that advances and retreats the rotating shaft toward the top surface of the substrate and applies pressing pressure to press the brush against the top surface of the substrate;
Equipped with
The substrate processing apparatus is characterized in that the detection section is provided at a position where the height of the rotation shaft can be detected, and detects the height of the rotation shaft corresponding to the maximum push-in height. The substrate processing apparatus according to any one of claims 1 to 3,
The substrate processing apparatus is characterized in that, when the control unit determines that the brush has fallen off, it immediately stops processing the substrate that is being processed while being held by the rotation holding unit. In a brush fall detection method for detecting the presence or absence of a brush when cleaning a substrate by applying a brush to the substrate,
With the substrate placed on the rotating holding part, the brush is set at a predetermined height, which is the highest from the top surface of the substrate and is lower than the no-load height, at which the brush does not act on the substrate. By means of a pressing mechanism that moves a brush holder to which the brush is detachably attached, over an action height at which a load is applied to the substrate and a maximum pushing height that is lower than the action height and moves the brush to the lowest position. , a moving step of moving the brush to the working height via the brush holder;
When the brush is moved to the working height, if the detection unit detects that the maximum pushing height has been reached based on the operation of the pushing mechanism, it is determined that the brush has fallen off. The judgment process of
A method for detecting falling of a brush, comprising: The method for detecting falling of a brush according to claim 5,
If it is determined in the determination process that the brush has fallen off, a process stop process is performed to immediately stop processing the substrate being processed while being held by the rotating holding unit. Method.

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