JP2024047290A - Substrate processing apparatus and brush cleaning method - Google Patents

Abstract

To provide a substrate processing apparatus and a brush cleaning method that can improve the brush life without complicating the structure of a cleaning arm.SOLUTION: A control unit moves a brush 99 held by a cleaning arm 45 to a brush cleaning unit NCU. In this state, the control unit operates a pressing mechanism at least once to perform a brush cleaning process by a pumping operation. This pumping operation compresses and expands the brush 99. This causes part of dirt that has been picked up by the brush 99 to be ejected from the brush. The pumping operation is an operation performed by the pressing mechanism included in a conventional device. Therefore, there is no need to provide the cleaning arm 45 with a new mechanism. As a result, the brush life can be improved without complicating the structure of the cleaning arm 45.SELECTED DRAWING: Figure 3

Description

The present invention relates to a substrate processing apparatus and a brush cleaning method that uses a brush to perform a cleaning process on substrates such as semiconductor substrates, substrates for FPDs (Flat Panel Displays) such as liquid crystal displays and organic EL (Electroluminescence) display devices, glass substrates for photomasks, and substrates for optical disks.

Conventionally, this type of device includes a spin chuck, a nozzle, a cleaning arm, and a brush cleaning device (see, for example, Patent Document 1). The spin chuck rotates the substrate in a horizontal plane. The nozzle supplies cleaning liquid to the top surface of the substrate. The cleaning arm has a brush at its tip. The brush is rotated about a vertical axis. The cleaning arm swings the brush around its base end as an axis over the brush cleaning device and the entire top surface of the substrate.

In the apparatus configured in this way, the cleaning liquid is supplied to the substrate. In this state, the brush is rotated and a load is applied to the top surface of the substrate. Furthermore, the cleaning arm is swung to apply the brush to the entire surface of the substrate. In this way, the entire top surface of the substrate is cleaned. The brush removes particles and other contaminants that have adhered to the top surface of the substrate from the substrate by using centrifugal force to move them outward, adhering to the surface, or incorporating them into the surface layer. The performance of the brush decreases depending on the time it is used for cleaning, etc. This is also called the brush life. The brush life is the time until the brush performance can no longer be used for cleaning. In other words, the brush needs to be replaced at the end of its brush life. Therefore, throughput decreases as the apparatus is stopped during brush replacement work. In addition, replacing the brush with a new one increases costs.

In the above-mentioned device, the brush cleaning device extends the brush life, reduces the frequency of replacement, prevents a decrease in throughput, and keeps costs down. The brush cleaning device is placed in the standby position of the cleaning arm. The brush cleaning device is equipped with an ultrasonic oscillator, a dedicated liquid storage tank, and a nozzle for the cleaning tank. After cleaning with the brush is completed, the rotation of the brush is stopped and the brush is moved to the brush cleaning device. Here, the ultrasonic oscillator is operated while supplying cleaning liquid from the nozzle for the cleaning tank to clean the brush itself. Furthermore, cleaning liquid is supplied to the inside of the brush from the brush nozzle provided on the cleaning arm, and the cleaning liquid is ejected from the inside of the brush to the outside. This allows the dirt caught in the brush to be efficiently discharged.

Japanese Patent Application Laid-Open No. 11-209094

However, the conventional example having such a configuration has the following problems.
That is, in the conventional device, the cleaning arm has a built-in complicated mechanism for rotating the brush and applying pressure to the brush. Providing the cleaning arm with a brush nozzle, supply pipes, control valves, etc., causes the problem that the structure of the cleaning arm becomes even more complicated. Furthermore, a dedicated brush with a special structure is required to supply cleaning liquid to the inside. This increases the cost of the brush, resulting in a problem of increased running costs. In other words, although the conventional device can improve the brush life, it leads to the complication of the device and increased running costs.

The present invention was made in consideration of these circumstances, and aims to provide a substrate processing apparatus and a brush cleaning method that can improve brush life without complicating the structure of the cleaning arm and without using special brushes.

In order to achieve the above object, the present invention has the following configuration.
That is, the invention described in claim 1 is a substrate processing apparatus that performs a cleaning process by applying a brush to a substrate, comprising: a rotating holding part that holds the substrate in a horizontal position and rotates the substrate; a brush that acts on an upper surface of the substrate held on the rotating holding part; a cleaning arm that holds the brush and moves the brush between a waiting position away from the rotating holding part to a processing position above the substrate held on the rotating holding part and where a cleaning process is performed on the entire upper surface of the substrate; a pressing mechanism that urges the brush toward the substrate with a pressing force; a brush cleaning unit that is positioned between the waiting position and the rotating holding part and cleans the brush; and a control part that operates the pressing mechanism at least once when the brush held by the cleaning arm is moved to the brush cleaning unit to perform a brush cleaning process by a pumping action.

[Function and Effect] According to the invention described in claim 1, the control unit moves the brush held by the cleaning arm to the brush cleaning unit. In this state, the control unit operates the pressing mechanism at least once to perform a brush cleaning process using a pumping action. This pumping action compresses and expands the brush. As a result, some of the dirt captured by the brush is expelled from the brush. The pumping action is an operation performed by the pressing mechanism provided in conventional devices. Therefore, there is no need to provide a new mechanism in the cleaning arm, and no need for a brush with a special structure. As a result, the brush life can be improved without complicating the structure of the cleaning arm or using a special brush.

In the present invention, it is preferable that the control unit performs the pumping operation multiple times (Claim 2).

By pumping multiple times, more dirt can be removed from the brush.

In the present invention, it is preferable that the control unit operates the pressing mechanism to perform the pumping operation with a load greater than the load used when cleaning a substrate (Claim 3).

The pressing mechanism is operated so that the load is greater than the load during cleaning. This allows the brush to deform more significantly, allowing more dirt caught in the brush to be expelled.

In the present invention, it is also preferable that the control unit performs a scanning operation to move the brush laterally in addition to the pumping operation (Claim 4).

The scanning action can cause the brush to deform sideways, which can further remove dirt. Also, normally, an action similar to the cleaning process performed on the top surface of the substrate is simply performed within the brush cleaning unit, so no new mechanism is required.

In the present invention, it is preferable that the brush cleaning unit further includes a cleaning tank that houses the brush, and that the bottom surface of the cleaning tank facing the lower surface of the brush is formed in an uneven shape (claim 5).

The uneven bottom surface of the cleaning tank causes the underside of the brush to deform, allowing dirt that has been trapped or attached to the underside of the brush to be expelled.

In addition, in the present invention, it is preferable that the brush cleaning unit further includes a brush cleaning nozzle that supplies cleaning liquid to the brush, and an ultrasonic vibration unit that imparts ultrasonic vibrations to the cleaning liquid stored in the cleaning tank (Claim 6).

The cleaning fluid from the brush cleaning nozzle helps to loosen any dirt trapped in the brush. Ultrasonic vibrations are added to the cleaning fluid, which helps to loosen any dirt trapped in the brush.

In addition, in the present invention, it is preferable that the device further includes a waiting pot that is arranged at the waiting position and that houses the brush, and the brush cleaning unit is arranged between the waiting pot and the rotating holder and on the path of movement of the brush when the cleaning arm moves the brush (Claim 7).

Conventionally, a cleaning arm moves the brush between the waiting pot and the rotating holder. Therefore, by placing a brush cleaning unit on the path of movement of the brush, the brush cleaning process can be performed in the brush cleaning unit without changing the configuration for moving the brush.

In addition, in the present invention, it is preferable that the control unit performs the brush cleaning process after performing the cleaning process a predetermined number of times (claim 8).

The brush cleaning process is not performed after each cleaning process, but rather an appropriate number of brush cleaning processes are performed. This prevents damage to the brush and the waste of resources required for the brush cleaning process.

The invention described in claim 9 is a brush cleaning method for performing a cleaning process by applying a brush to a substrate, characterized in that it includes a substrate cleaning process in which the brush is moved by a cleaning arm holding the brush, and the brush is applied to the entire upper surface of the substrate to perform a cleaning process on the substrate, a moving process in which the cleaning arm moves the brush to a brush cleaning unit after the substrate cleaning process, and a brush cleaning process in which a pumping operation is performed at least once to press the brush against the substrate.

[Function and Effect] According to the invention described in claim 9, in the substrate cleaning process, the brush is applied to the entire upper surface of the substrate to perform the cleaning process on the substrate. Thereafter, in the movement process, the cleaning arm moves the brush to the brush cleaning unit. Then, in the brush cleaning process, a pumping operation is performed at least once to urge the brush toward the substrate with a pressing force. This pumping operation compresses and expands the brush. As a result, some of the dirt that has been taken in by the brush is discharged from the brush. The pumping operation is an operation performed by a pressing mechanism that is provided in conventional devices. Therefore, there is no need to provide a new mechanism in the cleaning arm, and no brush with a special structure is required. As a result, the brush life can be improved without complicating the structure of the cleaning arm and without using a special brush.

In the substrate processing apparatus according to the present invention, the control unit moves the brush held by the cleaning arm to the brush cleaning unit. In this state, the control unit operates the pressing mechanism at least once to perform a brush cleaning process using a pumping action. This pumping action compresses and expands the brush. This causes some of the dirt caught in the brush to be expelled from the brush. The pumping action is an operation performed by the pressing mechanism provided in conventional apparatus. Therefore, there is no need to provide a new mechanism in the cleaning arm, and no need for a brush with a special structure. As a result, the brush life can be improved without complicating the structure of the cleaning arm and without using a special brush.

1 is a plan view showing an overall configuration of a substrate processing apparatus according to an embodiment; 2 is a view of the substrate processing apparatus of FIG. 1 as seen from the rear X. FIG. 2 is a plan view showing a schematic configuration of a back surface cleaning unit according to an embodiment. FIG. 2 is a side view showing a schematic configuration of a back surface cleaning unit. FIG. 2 is a vertical cross-sectional view of the cleaning arm. FIG. 2 is a vertical cross-sectional view showing a configuration of a brush cleaning unit. FIG. 4 is a block diagram showing a control system of the back surface cleaning unit. 13 is a flowchart showing a pre-processing performed in advance. 1A is a graph showing the relationship between the opening of the electro-pneumatic regulator and the load of the electronic balance, FIG. 1B is a graph showing the relationship between the secondary pressure of the electro-pneumatic regulator and the opening, and FIG. 1C is a graph showing the relationship between the load of the pressing actuator and the secondary pressure of the electro-pneumatic regulator. 13 is a flowchart showing a cleaning process. 11A to 11C are diagrams illustrating the operation of a brush cleaning process. 11A to 11C are diagrams illustrating the operation of a brush cleaning process. 11A to 11C are diagrams illustrating the operation of a brush cleaning process. 11A to 11C are diagrams illustrating the operation of a brush cleaning process.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
Fig. 1 is a plan view showing the overall configuration of a substrate processing apparatus according to an embodiment of the present invention, Fig. 2 is a view of the substrate processing apparatus of Fig. 1 as seen from the rear X.

<1. Overall structure＞

The substrate processing apparatus 1 includes a loading/unloading block 3, an indexer block 5, and a processing block 7.

The substrate processing apparatus 1 processes substrates W. The substrate processing apparatus 1 performs, for example, a cleaning process on the substrates W. The substrate processing apparatus 1 processes substrates W in a single-wafer manner in a processing block 7. In the single-wafer manner, each substrate W is processed one by one in a horizontal position.

For convenience, in this specification, the direction in which the load/unload block 3, indexer block 5, and processing block 7 are aligned is referred to as the "front-rear direction X." The front-rear direction X is horizontal. Within the front-rear direction X, the direction from the processing block 7 toward the load/unload block 3 is referred to as the "front." The direction opposite to the front is referred to as the "rear." The horizontal direction perpendicular to the front-rear direction X is referred to as the "width direction Y." One direction in the "width direction Y" is referred to as the "right" as appropriate. The direction opposite to the right is referred to as the "left." The direction perpendicular to the horizontal direction is referred to as the "vertical direction Z." In each figure, for reference, front, back, right, left, top, and bottom are indicated as appropriate.

<2. Loading/unloading block>

The carry-in/out block 3 includes an input section 9 and an unloading section 11. The input section 9 and the unloading section 11 are arranged in the width direction Y. A plurality of substrates W (e.g., 25 substrates) are stored in a single carrier C in a horizontal orientation, stacked at regular intervals. The carrier C storing unprocessed substrates W is placed on the input section 9. The input section 9 includes, for example, two mounting tables 13 on which the carriers C are placed. The carrier C has a plurality of grooves (not shown) formed therein, which separate the surfaces of the substrates W from each other and store the substrates W one by one. The carrier C stores the substrates W, for example, with the front surface facing upward. An example of the carrier C is a front opening unify pod (FOUP). A FOUP is a sealed container. The carrier C may be an open container, and any type of carrier C may be used.

The unloading unit 11 is disposed on the opposite side of the input unit 9 across the center of the width direction Y of the substrate processing apparatus 1. The unloading unit 11 is disposed to the left Y of the input unit 9. The unloading unit 11 stores processed substrates W in carriers C and unloads the carriers C. The unloading unit 11, which functions in this manner, is equipped with, for example, two mounting tables 13 for placing carriers C, similar to the input unit 9. The input unit 9 and the unloading unit 11 are also called load ports.

＜3. Indexer block＞

The indexer block 5 is disposed adjacent to the rear X of the loading/unloading block 3 in the substrate processing apparatus 1. The indexer block 5 includes an indexer robot IR and a transfer section 15.

The indexer robot IR is configured to be rotatable around the vertical direction Z. The indexer robot IR is configured to be movable in the width direction Y. The indexer robot IR has a first hand 19 and a second hand 21. For illustrative purposes, only one hand is shown in FIG. 1. The first hand 19 and the second hand 21 each hold one substrate W. The first hand 19 and the second hand 21 are configured to be independently movable forward and backward in the forward and backward directions X. The indexer robot IR moves in the width direction Y and rotates around the vertical direction Z, and moves the first hand 19 and the second hand 21 forward and backward to transfer substrates W between each cassette C. In a similar manner, the indexer robot IR transfers substrates W between the transfer section 15.

The transfer section 15 is disposed on the boundary between the indexer block 5 and the processing block 7. The transfer section 15 is disposed, for example, in the center in the width direction Y. As shown in FIG. 2, the transfer section 15 is formed long in the vertical direction Z.

The transfer section 15 includes, from bottom to top in the vertical direction Z, a first reversing unit 23, a path section 25, a path section 27, and a second reversing unit 29.

The first inversion unit 23 inverts the top and bottom of the substrate W received from the indexer block 5. The first inversion unit 23 inverts the horizontal orientation of the substrate W. Specifically, the first inversion unit 23 converts a substrate W with its front surface facing up into an orientation in which its front surface faces down. In other words, it converts the orientation of the substrate W so that its back surface faces up.

The second inversion unit 29 performs the reverse operation. That is, the second inversion unit 29 inverts the top and bottom of the substrate W received from the processing block 7. The second inversion unit 29 converts the substrate W with its front surface facing down into a position in which its front surface faces up. In other words, it converts the position of the substrate W so that its back surface faces down.

The inversion directions of the first inversion unit 23 and the second inversion unit 29 may be opposite to each other. In other words, the first inversion unit 23 changes the orientation of the substrate W so that the front surface faces upward. The second inversion unit 29 changes the orientation of the substrate W so that the back surface faces upward.

The path sections 25 and 27 are used to transfer substrates W between the indexer block 5 and the processing block 7. The path section 25 is used, for example, to transport substrates W from the processing block 7 to the indexer block 5. The path section 27 is used, for example, to transport substrates W from the indexer block 5 to the processing block 7. Note that the transport directions of substrates W in the path sections 25 and 27 may be opposite to each other.

＜4. Processing block＞

The processing block 7 performs, for example, a cleaning process on the substrate W. The cleaning process is, for example, a process that uses a brush in addition to a processing liquid. As shown in FIG. 1, the processing block 7 is, for example, divided into a first row R1, a second row R2, and a third row R3 in the width direction Y. In detail, the first row R1 is disposed on the left side Y. The second row R2 is disposed in the center of the width direction Y. In other words, the second row R2 is disposed to the right side Y of the first row R1. The third row R3 is disposed to the right side Y of the second row R2.

<4-1. 1st column＞

The first row R1 of the processing block 7 includes a plurality of processing units 31. The first row R1 includes, for example, four processing units 31. The first row R1 has four processing units 31 stacked in the vertical direction Z. Details of each processing unit 31 will be described later. Each processing unit 31 is, for example, a cleaning unit. The cleaning unit cleans the substrate W. The cleaning units include a front surface cleaning unit that cleans the front surface of the substrate W, and a back surface cleaning unit that cleans the back surface of the substrate W. In this embodiment, the back surface cleaning unit SSR will be used as an example of the processing unit 31.

<4-2. Column 2＞

The second row R2 of the processing block 7 is equipped with a center robot CR. The center robot CR is configured to be rotatable around the vertical direction Z. The center robot CR is configured to be able to move up and down in the vertical direction Z. The center robot CR is equipped with, for example, a first hand 33 and a second hand 35. The first hand 33 and the second hand 35 each hold one substrate W. The first hand 33 and the second hand 35 are configured to be able to move forward and backward independently in the front-rear direction X and the width direction Y.

<4-3. Column 3＞

The third row R3 of the processing block 7 has the same configuration as the first row R1. That is, the third row R3 has a plurality of processing units 31. The third row R3 has, for example, four processing units 31. The third row R3 has four processing units 31 stacked in the vertical direction Z. Each processing unit 31 in the first row R1 and each processing unit 31 in the third row R3 are arranged opposite each other in the width direction Y. This allows the center robot CR to access each of the opposing processing units 31 in the first row R1 and the third row R3 at the same height in the vertical direction Z.

The processing block 7 is configured as described above. Here, an example of the operation of the center robot CR will be briefly described. The center robot CR receives the substrate W, for example, from the first reversal unit 23. The center robot CR transports the substrate W to either the back surface cleaning unit SSR in the first row R1 or the third row R3 to perform cleaning processing on the back surface of the substrate W. The center robot CR receives the substrate W that has been cleaned in either the back surface cleaning unit SSR in the first row R1 or the third row R. The center robot CR transports the substrate W to the second reversal unit 29.

＜4-4. Processing unit＞

Now, the back surface cleaning unit SSR (processing unit 31) will be described with reference to Figures 3 to 5. Figure 3 is a plan view showing the schematic configuration of the back surface cleaning unit according to the embodiment. Figure 4 is a side view showing the schematic configuration of the back surface cleaning unit. Figure 5 is a vertical cross-sectional view of the cleaning arm.

Here, the back surface cleaning unit SSR in the first row R1 will be used as an example for explanation. The back surface cleaning unit SSR in the third row R3 has a configuration in which the arrangement in the width direction Y is swapped.

The back surface cleaning unit SSR includes a rotating holder 37, a guard 39, a first processing liquid arm 41, a second processing liquid arm 43, a cleaning arm 45, a waiting pot 47, and a brush cleaning unit NCU.

The rotating holder 37 is disposed approximately in the center of the back surface cleaning unit SSR in a plan view. The rotating holder 37 rotates the substrate W in a horizontal plane while holding the substrate W in a horizontal position. The rotating holder 37 includes an electric motor 49, a rotating shaft 51, a spin chuck 53, and support pins 55.

The electric motor 49 is disposed with the rotating shaft 51 facing the vertical direction Z. The rotating shaft 51 has a spin chuck 53 attached to its upper end. The spin chuck 53 has a diameter slightly larger than the diameter of the substrate W. The spin chuck 53 is a circular plate-like member. The spin chuck 53 has a plurality of support pins 55. In this embodiment, for example, six support pins 55 are provided. The six support pins 55 abut against the outer periphery of the substrate W to support the substrate W in a horizontal position. The number of the support pins 55 is not limited to six as long as the plurality of support pins 55 can stably support the substrate W in a horizontal position. The six support pins 55 are erected near the outer periphery of the substrate W in the spin chuck 53. The six support pins 55 release the holding of the periphery of the substrate W when the substrate W is loaded into the spin chuck 53 and when the substrate W is unloaded from the spin chuck 53. Therefore, each support pin 55 is configured to be rotatable around the vertical direction Z. A detailed description of the configuration for performing this operation will be omitted. When the electric motor 49 rotates, the rotating holder 37 rotates the spin chuck 53 around the rotation center P1. The rotation center P1 is in the vertical direction Z.

＜4-4-2. Guard＞

The guard 39 is arranged to surround the rotating holder 37 in a plan view. In detail, the guard 39 has a cylindrical body portion 57 and an inclined portion 59. The guard 39 is configured to be able to rise and fall in the vertical direction Z. The guard 39 can be raised and lowered to a lowered standby position and a processing position above the standby position. A description of the specific configuration for raising and lowering the guard 39 is omitted.

The body 57 of the guard 39 is cylindrical. The inner peripheral surface of the body 57 is disposed at a distance outward from the outer peripheral side of the rotating holder 37. The inclined portion 59 is narrowed from the upper portion of the body 57 toward the rotating shaft 51. The inclined portion 59 has an opening 61 at the upper portion. The opening 61 is formed in the center of the inclined portion 59. The opening 61 is larger than the diameter of the substrate W. The opening 61 is larger than the diameter of the spin chuck 53. When the substrate W is loaded or unloaded, the guard 39 is lowered in the vertical direction Z to a position where the spin chuck 53 protrudes upward from the opening 61. When the substrate W is cleaned, the inclined portion 59 of the guard 39 is located near the height of the substrate W held by the spin chuck 53. The inclined inner peripheral surface of the inclined portion 59 guides the processing liquid and the like scattered from the substrate W to the lower portion of the guard 39.

<4-4-3. First processing liquid arm>

The first processing liquid arm 41 is disposed at the rear X of the rotating holder 37 in a plan view. The first processing liquid arm 41 is provided with an electric motor 42 on the base end side. The first processing liquid arm 41 is swung around the rotation center P2 on the base end side by the electric motor 42. The rotation center P2 is in the vertical direction Z. The first processing liquid arm 41 is provided with one nozzle 63. The nozzle 63 has an outlet on the lower side. The nozzle 63 spits the processing liquid. The first processing liquid arm 41 is configured so that the tip of the nozzle 63 can swing between a standby position shown in FIG. 3 and a supply position near the rotation center P1. When the first processing liquid arm 41 supplies the processing liquid to the substrate W, the tip of the nozzle 63 is moved to the supply position. When the first processing liquid arm 41 does not supply the processing liquid to the substrate W, the tip of the nozzle 63 is moved to the standby position. The first processing liquid arm 41 may be configured to swing and move the nozzle 63 above the substrate W so as not to interfere with the cleaning arm 45 when supplying processing liquid to the substrate W.

The processing liquid discharged from the nozzle 63 may be, for example, a rinse liquid. Examples of the rinse liquid include pure water, carbonated water, electrolytic ion water, hydrogen water, and ozone water.

<4-4-4. Second processing liquid arm>

The second processing liquid arm 43 is disposed to the left Y of the rotating holder 37 in a plan view. The second processing liquid arm 41 is provided with an electric motor 44 on the base end side. The second processing liquid arm is swung around the rotation center P3 on the base end side by the electric motor 44. The rotation center P3 is in the vertical direction Z. The second processing liquid arm 43 is provided with three nozzles 65, 67, 69. Each nozzle 65, 67, 69 has an outlet on the lower side. The nozzles 65, 67, 69 spit processing liquid. The second processing liquid arm 43 is configured so that the tips of the nozzles 65, 67, 69 can swing between the standby position shown in FIG. 3 and a supply position near the rotation center P1. When the second processing liquid arm 43 supplies processing liquid to the substrate W, the tips of the nozzles 65, 67, 69 are moved to the supply position. When the second processing liquid arm 43 is not supplying the processing liquid to the substrate W, the tips of the nozzles 65, 67, 69 are moved to standby positions. When the second processing liquid arm 43 is supplying the processing liquid to the substrate W, the nozzles 65, 67, 69 may be moved in a swinging manner above the substrate W so as not to interfere with the cleaning arm 45.

The processing liquid discharged from the nozzles 65, 67, and 69 may be, for example, a chemical liquid. The chemical liquid may be, for example, a chemical liquid containing at least one of sulfuric acid, nitric acid, acetic acid, hydrochloric acid, hydrofluoric acid, ammonia water, and hydrogen peroxide water. A more specific example of the chemical liquid that can be used is SC-1, which is a mixture of ammonia water and hydrogen peroxide water.

<4-4-5. Cleaning arm>

The cleaning arm 45 is configured as follows:

The cleaning arm 45 includes a rotating and lifting mechanism 71, a support 73, a housing 75, and a cleaning section 77.

The rotary lifting mechanism 71 is configured to be able to raise and lower the support 73, the housing 75, and the cleaning unit 77 in the vertical direction Z. The rotary lifting mechanism 71 is configured to be able to swing the support 73, the housing 75, and the cleaning unit 77 around the rotation center P4. Specifically, the rotary lifting mechanism 71 is configured, for example, by combining an electric motor and an air cylinder. The rotary lifting mechanism 71 raises the cleaning unit 77 in the vertical direction Z from the standby pot 47 at the standby position. The rotary lifting mechanism 71 swings (moves) the cleaning unit 77 in a horizontal plane via the support 73 and the housing 75 so that the cleaning unit 77 passes near the rotation center P1 by driving the electric motor.

The support pillar 73 has a cylindrical shape. The lower part of the support pillar 73 is connected to the rotary lift mechanism 71. The upper part of the support pillar 73 is connected to one lower part of the housing 75. The housing 75 has a long axis in a horizontal plane. The housing 75 has a cleaning unit 77 at the other lower part. The cleaning unit 77 rotates around a rotation center P5. The rotation center P5 is in the vertical direction Z.

The housing 75 includes a lower housing 75a and an upper housing 75b. The lower housing 75a constitutes the lower part of the housing 75. The upper housing 75b constitutes the upper part of the housing 75. The upper housing 75b and the lower housing 75a are connected to each other.

The housing 75 includes a pressing mechanism 81 and a rotating mechanism 83. Specifically, the lower housing 75a includes the pressing mechanism 81 and the rotating mechanism 83.

The pressing mechanism 81 includes a fulcrum member 85, a seesaw member 87, a pressing actuator 89, and a support mechanism 91.

The fulcrum member 85 is attached to the upper surface of the lower housing 75a. The fulcrum member 85 is erected at approximately the center of the lower housing 75a in the front-rear direction X. The fulcrum member 85 has a swing shaft 85a at its upper part. The swing shaft 85a is rotatable around the width direction Y. The seesaw member 87 is attached to the fulcrum member 85 via the swing shaft 85a at its central part 87c so that it can swing. The seesaw member 87 can alternately move up and down at both ends, one side 87l (point of action) and the other side 87r (point of force), in the vertical direction Z. The swing shaft 85a serves as the fulcrum of the seesaw member 87.

The pressing actuator 89 has an operating piece 89a arranged in the vertical direction Z. The pressing actuator 89 raises one side 87l of the seesaw member 87 by extending the operating shaft 89a. The pressing actuator 89 is preferably, for example, an air bearing actuator.

In an air bearing actuator, the working shaft 89a is supported by air with a small gap between them so that it can move back and forth. Therefore, in theory, the sliding resistance of the working shaft 89a is zero and no friction occurs. Therefore, compared to a normal air cylinder, an air bearing actuator can move the working shaft 89a back and forth with even a small amount of air pressure. Therefore, it is possible to move the working shaft 89a back and forth linearly according to the air pressure. However, a normal air cylinder can also be used as the pressure actuator 89.

In the front-rear direction X, a support mechanism 91 is provided on the opposite side of the pressing actuator 89 across the fulcrum member 85. The support mechanism 91 supports the cleaning unit 77. The support mechanism 91 supports the cleaning unit 77 by suspending it below the housing 75.

The support mechanism 91 includes a holding member 93, a biasing portion 95, and a guide portion 97.

The support mechanism 91 supports the cleaning unit 77 in a suspended manner. The cleaning unit 77 includes a brush 99 and a brush holder 101. The brush 99 acts on the substrate W to clean it. The brush holder 101 holds the brush 99. The brush holder 101 holds the brush 99 in a removable manner. A rotation shaft 103 is attached to the center of the brush holder 101 in a plan view. The rotation shaft 103 extends from the brush holder 101 in the vertical direction Z. The brush 99 is held by the cleaning arm 45 and moves in a horizontal plane so as to pass near the rotation center P1 of the substrate W.

The holding member 93 holds the rotating shaft 103 so that it can rotate freely. The rotating shaft 103 is, for example, a spline shaft. The rotating shaft 103 is attached to the holding member 93 via a spline nut 103a. The rotating shaft 103 can move in the vertical direction Z relative to the spline nut 103a. The holding member 93 holds the spline nut 103a in a state in which it can rotate around the vertical direction Z. The spline nut 103a is attached to the holding member 93 via a bearing (not shown). The rotating shaft 103 can rotate around the rotation center P5. A pulley 105 is attached to the spline nut 103a protruding from the upper part of the holding member 93. The pulley 105 is fixed to the outer circumferential surface of the spline nut 103a. When the pulley 105 rotates, the spline nut 103a rotates, and the rotating shaft 103 rotates in the same direction.

The biasing part 95 is disposed on the upper part of the pulley 105. The biasing part 95 includes an upper holding part 107, a lower holding part 109, and a coil spring 111. The upper holding part 107 is attached to the upper side of the rotating shaft 103 via a bearing (not shown). In other words, the upper holding part 107 remains stationary even when the rotating shaft 103 rotates. The lower holding part 109 is disposed away from the upper holding part 107. The lower holding part 109 is disposed below the upper holding part 107 and above the pulley 105. The lower holding part 109 is disposed with its inner peripheral surface spaced away from the outer peripheral surface of the rotating shaft 103. Therefore, the lower holding part 109 remains stationary even when the rotating shaft 103 rotates. The lower holding part 109 is also attached to the upper surface of the pulley 105 via a bearing. Therefore, the lower holding part 109 is not affected by the rotation of the pulley 105.

The coil spring 111 is attached to the upper holding part 107 and the lower holding part 109. The upper end of the coil spring 111 is fixed to the upper holding part 107. The lower end of the coil spring 111 is fixed to the lower holding part 109. The coil spring 111 has, for example, a cylindrical shape. The coil spring 111 is a compression coil spring. Therefore, the upper holding part 107 is biased upward from the upper surface of the pulley 105 and the lower holding part 109. As a result, the rotating shaft 103 is biased upward in the vertical direction Z. Therefore, in the normal state in which the pressing actuator 89 is not operating, the brush 99 is maintained at a constant height from the lower surface of the lower housing 75a. In other words, in the normal state, the load by the brush 99 is zero.

The support mechanism 91 supports the rotating shaft 103 that moves up and down in the vertical direction Z. The support mechanism 91 includes a linear guide 113 and a shaft holding portion 115. The linear guide 113 is disposed adjacent to the holding member 93. The linear guide 113 is erected in the vertical direction Z. The linear guide 113 includes a rail 113a and a carriage 113b. The rail 113a is disposed with its longitudinal direction in the vertical direction Z. The carriage 113b is attached to the rail 113a so as to be movable in the vertical direction Z. The carriage 113b is disposed below the other side 87r of the seesaw member 87. The carriage 113b is disposed in a position where it comes into contact with the other side 87r of the seesaw member 87 when it descends.

The shaft holder 115 holds the upper part of the rotating shaft 103. The shaft holder 115 holds the rotating shaft 103 in a state where it is allowed to rotate. The shaft holder 115 holds the rotating shaft 103, for example, via a bearing (not shown). The carriage 113b is connected to the shaft holder 115. When the pressing actuator 89 raises the operating shaft 89a with a driving force stronger than the biasing force of the coil spring 111, one side 87l (point of action) rises. When the one side 87l rises, the other side 87r (point of force) descends. At this time, the other side 87r lowers the carriage 113b together with the shaft holder 115. Then, the rotating shaft 103 descends, and the brush 99 moves downward from a predetermined position. When the pressing actuator 89 is driven in this way, a pressing force corresponding to the driving force of the pressing actuator 89 is applied to the brush 99.

The rotation mechanism 83 is disposed adjacent to the support mechanism 91. The rotation mechanism 83 is disposed on the fulcrum member 85 side. The rotation mechanism 83 includes an attachment member 117 and an electric motor 119. The attachment member 117 disposes the electric motor 119 at a distance above the bottom surface of the lower housing 75a. The electric motor 119 is disposed with its rotation shaft facing downward in the vertical direction Z. The electric motor 119 rotates its rotation shaft around a rotation center P6. The rotation center P6 is approximately parallel to the rotation center P5 in the vertical direction Z. The electric motor 119 has a pulley 121 attached to its rotation shaft. A timing belt 123 is stretched between the pulley 121 and the pulley 105. Therefore, when the electric motor 119 rotates, the rotation shaft 103 rotates around the rotation center P5 via the timing belt 123, the pulleys 105 and 121, and the spline nut 103a. Even when the rotating shaft 103 is rotated in this manner, the rotating shaft 103 can be raised and lowered in the vertical direction Z.

The cleaning arm 45 is configured as described above. That is, the action of the pressing actuator 89 is applied to one side 87r (point of action) of the seesaw member 87 via one side 87l (point of force). Therefore, by providing the seesaw member 87, the degree of freedom in the arrangement of the pressing actuator 89 is increased. Therefore, the height of the substrate processing apparatus 1 can be reduced. As a result, an arrangement in which the substrate processing apparatus 1 is stacked in multiple tiers can be easily realized.

Here, we will explain the height to which the brush 99 can be raised and lowered.

The seesaw member 87 described above is swung by the pressing actuator 89. For example, the pressing actuator 89 is operated according to a target load, as described below. This operation moves the brush 99 in the vertical direction Z. Specifically, the brush 99 is raised and lowered to the following heights:

(1) No-load height H1: This is the height in the vertical direction Z at which the brush 99 does not act on the substrate W. This no-load height H1 is higher than the other heights described below. During normal times, except when cleaning, the brush 99 is located at this no-load height H1.

(2) Working height H2: This is the height in the vertical direction Z at which the brush 99 acts on the substrate W with a predetermined load. This height is lower than the no-load height H1. When performing a cleaning process on the substrate W, the brush 99 is lowered to this working height H2. However, this position is the height at which a predetermined load is applied to the brush 99 and the reaction force from the substrate W is balanced with the load.

(3) Maximum pushing height H3: A height lower than the action height H2. This is the lowest position to which the brush 99 has moved in the vertical direction Z. This maximum pushing height H3 is a position determined by the structure of the pressing mechanism 81. The brush 99 cannot move below this maximum pushing height H3.

<4-4-6. Nozzle cleaning unit>

The brush cleaning unit NCU will now be described with reference to Figures 3 and 6. Figure 6 is a vertical cross-sectional view showing the configuration of the brush cleaning unit.

The brush cleaning unit NCU has a function of cleaning the brush 99. As shown in FIG. 3, the brush cleaning unit NCU is disposed between the waiting pot 47 disposed at the waiting position and the rotating holder 37 in a plan view. More specifically, the brush cleaning unit NCU is disposed between the waiting pot 47 and the body 57 of the guard 39 in a plan view.

The brush cleaning unit NCU includes a cleaning tank 201, a brush cleaning nozzle 203, an ultrasonic vibration unit 205, a protrusion 207, and a drainage port 209.

The cleaning tank 201 accommodates the brush 99. The cleaning tank 201 only needs to have an opening area large enough to accommodate at least the brush 99. In this embodiment, the cleaning tank 201 has a length that is approximately twice the diameter of the brush 99. In detail, as shown in FIG. 3, the length of the cleaning tank 201 along the path along which the brush 99 moves as the cleaning arm 45 swings is approximately twice the diameter of the brush 99. Therefore, the brush 99 can be moved horizontally within the cleaning tank 201 at least a distance equivalent to the diameter of the brush 99.

The cleaning tank 201 is disposed on the above-mentioned movement path. In this embodiment, the cleaning tank 201 has a fan shape in a plan view. This reduces the area occupied by the brush cleaning unit NCU. Therefore, the brush cleaning unit NCU can be easily added to an existing device. The brush cleaning process can be performed in the brush cleaning unit NCU without changing the configuration for moving the brush 99.

The cleaning tank 201 has a depth that can accommodate the portion of the brush 99 that contributes to the cleaning process. The cleaning tank 201 is provided with a brush cleaning nozzle 203. In this embodiment, the brush cleaning nozzle 203 is arranged, for example, penetrating from the side wall of the cleaning tank 201 to the inside. The brush cleaning nozzle 203 supplies a cleaning liquid. The cleaning liquid is the same as the processing liquid supplied by the first processing liquid arm 41 described above. The processing liquid is a rinse liquid, for example, pure water. The cleaning liquid is the same as the processing liquid supplied by the second processing liquid arm 43 described above. The processing liquid is a chemical liquid, for example, SC-1. The cleaning liquid from the brush cleaning nozzle 203 makes it easier to remove dirt that has been taken in by the brush 99.

The cleaning tank 201 is equipped with an ultrasonic vibration unit 205 on its bottom surface. The ultrasonic vibration unit 205 applies ultrasonic vibrations to the cleaning liquid stored in the cleaning tank 201. The ultrasonic vibration unit 205 generates ultrasonic vibrations with a frequency of, for example, several hundred kHz to several MHz. The generated ultrasonic vibrations are propagated to the cleaning liquid via the cleaning tank 201. As ultrasonic vibrations are applied to the cleaning liquid, the vibrations make it easier for dirt caught in the brush 99 to be detached from the brush 99.

The cleaning tank 201 has a plurality of protrusions 207 formed on its bottom surface. In other words, the cleaning tank 201 has an uneven bottom surface. In detail, the cleaning tank 201 has a plurality of protrusions 207 formed on its bottom surface facing the underside of the brush 99. It is preferable that the corners of these protrusions 207 are removed so that the underside of the brush 99 is not easily damaged even if the brush 99 comes into contact with it. The underside of the brush 99 is deformed by the plurality of protrusions 207 on the bottom surface of the cleaning tank 201. Therefore, dirt that has been caught in or attached to the underside of the brush 99 can be discharged.

The cleaning tank 201 has a drainage port 209 formed on the bottom surface. The drainage port 209 drains the cleaning liquid stored in the cleaning tank 201. The drainage port 209 discharges the debris detached from the brush 99 together with the cleaning liquid.

＜4-5. Control system＞

Now let's refer to Figure 7. Figure 7 is a block diagram showing the control system of the back surface cleaning unit.

One end of a pipe 125 is connected to the nozzle 63 described above. The other end of the pipe 125 is connected to a rinse liquid supply source 127. The rinse liquid supply source 127 supplies the rinse liquid described above. The pipe 125 is equipped with a flow control valve 129. The flow control valve 129 controls the flow rate of the rinse liquid in the pipe 125.

One end of a pipe 131 is connected to the nozzle 65 described above. The other end of the pipe 131 is connected to a processing liquid supply source 133. The processing liquid supply source 133 supplies any one of the various chemical liquids described above. The pipe 131 is equipped with a flow control valve 135. The flow control valve 135 controls the flow rate of the chemical liquid in the pipe 131.

One end of a pipe 137 is connected to the nozzle 67 described above. The other end of the pipe 137 is connected to a processing liquid supply source 139. The processing liquid supply source 139 supplies any one of the various chemical liquids described above. The pipe 137 is equipped with a flow control valve 141. The flow control valve 141 controls the flow rate of the chemical liquid in the pipe 139.

One end of the pipe 143 is connected to the nozzle 69 described above. The other end of the pipe 143 is connected to a processing liquid supply source 145. The processing liquid supply source 145 supplies any one of the various chemical liquids described above. The pipe 143 is equipped with a flow control valve 147. The flow control valve 147 controls the flow rate of the chemical liquid in the pipe 143.

The above-mentioned pressing actuator 89 is connected to one end of an air supply pipe 149. The pressing actuator 89 is supplied with air to support the operating shaft 89a with a small gap, but this piping is omitted. The other end of the air supply pipe 149 is connected to an air supply source 151. The air supply source 151 supplies, for example, air. The air is preferably dry air. The air supply source 151 is also connected to other devices. The supply pressure of the air supply source 151 is affected by the operating state of the other devices. In other words, the supply pressure may decrease when the operating rate of the other devices increases. The air supply pipe 149 is equipped with an opening/closing valve 153, a primary side pressure gauge 155, an electropneumatic regulator 157, and a secondary side pressure gauge 159, in that order from the air supply source 151 side.

The on-off valve 153 allows or blocks the flow of air in the air supply pipe 149. The primary pressure gauge 155 measures the air pressure upstream of the electro-pneumatic regulator 157. The electro-pneumatic regulator 157 adjusts the opening of the built-in valve in response to the input signal. In this way, the electro-pneumatic regulator 157 adjusts the air pressure in the air supply pipe 149. In detail, the electro-pneumatic regulator 157 adjusts the valve opening in response to the input signal given to reduce the primary pressure to the secondary pressure in the air supply pipe 149. The electro-pneumatic regulator 157 cannot adjust the secondary pressure to be higher than the primary pressure in the air supply pipe 149. The electro-pneumatic regulator 157 adjusts the secondary pressure to be equal to or lower than the primary pressure of the air supply pipe 149. When the primary pressure exceeds a predetermined value, the electro-pneumatic regulator 157 can adjust the secondary pressure to be equal to or lower than the predetermined value. In other words, if the primary pressure is below a predetermined value, the electropneumatic regulator 157 may not be able to accurately adjust the secondary pressure to a constant value or higher.

One end of a pipe 211 is connected to the brush cleaning nozzle 203 described above. The other end of the pipe 211 is connected to a cleaning liquid supply source 213. The cleaning liquid supply source 213 supplies any one of the various cleaning liquids described above. The pipe 211 is equipped with a flow control valve 215. The flow control valve 215 controls the flow rate of the cleaning liquid in the pipe 211.

The control unit 161 performs overall control of the above-mentioned units. Specifically, the control unit 161 controls the transport operation in the input unit 9 and the discharge unit 11, the transport operation of the indexer robot IR, the reversal operation of the first reversal unit 23 and the second reversal unit 29, the transport operation of the center robot CR, and the like. The control unit 161 performs control of the rotation of the electric motor 49 in the back surface cleaning unit SSR (processing unit 31), the lifting and lowering operation of the guard 39, the opening and closing operation of the support pin 55 in the spin chuck 53, the swinging operation of the electric motors 42 and 44, the opening and closing operation of the flow control valves 129, 135, 141, 147, and 215, the rotation and lifting operation of the rotary lift mechanism 71, the rotation operation of the electric motor 119, the opening and closing operation of the on-off valve 153, and the opening degree operation of the electro-pneumatic regulator 157.

The control unit 161 includes a CPU and a memory (not shown). The control unit 161 is connected to an instruction unit 163. The instruction unit 163 is operated by an operator of the substrate processing apparatus 1. The instruction unit 163 is used by the operator to instruct a recipe that specifies the contents of processing of the substrate W, and to start and stop processing. The control unit 161 is connected to a notification unit 165. When a problem occurs in the substrate processing apparatus 1, the notification unit 165 generates an alarm to notify the operator of the problem. The notification unit 165 is, for example, a display device, a lamp, a buzzer, a speaker, etc. It is preferable that the notification unit 165 can confirm the type of problem that has occurred. The control unit 161 includes an input port IP. The input port IP receives data from various electronic devices. The data input from the input port IP is processed or stored by the control unit 161.

The control unit 161 receives the measured values of the primary pressure gauge 155 and the secondary pressure gauge 159. The control unit 161 provides an input signal for controlling the valve opening of the electropneumatic regulator 157. The pressing force applied to the substrate W by the brush 99 is determined according to this input signal.

The control unit 161 counts the number of cleaning processes using the same brush 99. In detail, after the brush 99 is replaced, the number of cleaning processes is stored in memory until the next time the brush 99 is replaced. Although a detailed explanation is omitted, the operator operates the instruction unit 163 to stop the back surface cleaning unit SSR, and then replaces the brush 99. Then, after the replacement of the brush 99 is completed, the operator operates the instruction unit 163 to start the back surface cleaning unit SSR. The operation of the instruction unit 163 at this time triggers the resetting of the number of cleaning processes, and the number of cleaning processes is counted up for each cleaning process using a new brush 99.

It is preferable to weight the number of washes according to the time required for the cleaning process, the number of times the cleaning arm 45 oscillates, and the size of the target load. For example, instead of counting all washes as the same 1, the longer the time required for the cleaning process, the more times the cleaning arm 45 oscillates, and the larger the target load, the higher the weighting. This allows the brush cleaning process described below to be carried out appropriately according to the degree of dirt on the brush 99.

The above-mentioned back surface cleaning unit SSR (processing unit 31) corresponds to the "substrate processing apparatus" in this invention.

＜5. Pre-processing in the processing unit＞

The pre-processing in the above-mentioned back surface cleaning device SSR will be described with reference to Figures 8 and 9. Figure 8 is a flow chart showing the pre-processing that is performed in advance. Figure 9(a) shows the relationship between the opening of the electro-pneumatic regulator and the load of the electronic balance, Figure 9(b) shows the relationship between the secondary pressure of the electro-pneumatic regulator and the opening, and Figure 9(c) is a graph showing the relationship between the load of the pressing actuator and the secondary pressure of the electro-pneumatic regulator.

The operator of the substrate processing apparatus 1 operates the instruction unit 163 to instruct pre-processing for one of the back surface cleaning units SSR.

Step S1
An electronic balance is placed. Specifically, an electronic balance (not shown) is placed on the rotating holder 37. The electronic balance is a device that measures load. The electronic balance preferably has a data output terminal. The data output terminal of the electronic balance is connected to the input port IP. The electronic balance outputs a measurement value from the data output terminal. The measurement value is, for example, a load (g).

Step S2
The load is measured. Specifically, for example, the control unit 161 varies the input signal to the electropneumatic regulator 157 while the on-off valve 153 is open, and measures the load X (g) of the electronic balance for each input signal at that time. Note that the operator may specify several loads (target loads X (g)) that he or she actually wants to apply with the brush 99 in the process from the instruction unit 163, vary the input signal to the electropneumatic regulator 157 so that the measured value of the electronic balance becomes each target load X (g), and obtain an input signal corresponding to each target load X (g) at that time. At this time, the control unit 161 receives the secondary pressure, which is the measured value of the secondary pressure gauge 159 for each load.

Step S3
The control unit 161 obtains, through the measurement in step S2, the relationship between the opening degree (input signal) of the electropneumatic regulator 89 and the load of the electronic balance (target load X (g)) as shown in Figure 9(a), and the relationship between the secondary pressure of the electropneumatic regulator 89 and the opening degree as shown in Figure 9(b). In addition to the above relationships, the control unit 161 stores in memory the relationship between the load of the pressing actuator 89 and the secondary pressure of the electropneumatic regulator 157 as shown in Figure 9(c).

Step S4
The operator of the substrate processing apparatus 1 operates the instruction unit 163 to instruct the end of pre-processing for one of the back surface cleaning units SSR. The operator of the substrate processing apparatus 1 removes the electronic balance from the spin holder 37. If necessary, similar pre-processing is performed for the other back surface cleaning units SSR.

<6. Cleaning process in the processing unit>

Next, the cleaning process will be described with reference to FIG. 10. FIG. 10 is a flowchart showing the cleaning process.

Step S11
The operator instructs the start of processing. Specifically, the operator also instructs a recipe including a target load X (g). Then, the substrate W is transported from the indexer block 5 to the transfer part 15, and the orientation of the substrate W is changed in the first reversal unit 23 so that the back surface faces up.

Step S12
The substrate W with its back surface facing up is transported by the center robot CR to one of the back surface cleaning units SSR. The back surface cleaning unit SSR starts the cleaning process. Specifically, the control unit 161 refers to the above-mentioned relationship ( FIG. 9( c )) acquired in advance, and adjusts the input signal to the electropneumatic regulator 157 so that the secondary pressure of the secondary pressure gauge 159 becomes the secondary pressure Z (Pa) corresponding to the target load X (g). As a result, air is supplied from the electropneumatic regulator 157 to the pressing actuator 159, and cleaning is performed in a state in which the brush 99 applies a load of the target load X (g) to the substrate W. In other words, the control unit 161 moves the brush 99 from the no-load height H1 to the action height H2. At this time, the first processing liquid arm 41 is swung, and pure water is supplied to the entire front surface of the substrate W at a position where it does not interfere with the cleaning arm 45. At this time, the brush 99 acts on the back surface of the substrate W to perform the cleaning process. The control unit 161 operates the rotation drive mechanism 71 to drive the cleaning arm 45 holding the brush 99, and the cleaning arm 45 causes the brush 99 to swing (move) within the diameter of the substrate W so that the brush 99 passes through the rotation center P1 and is inverted at both end faces of the substrate W. That is, this causes the cleaning process to be performed at a processing position above the substrate W held by the spin chuck 53, where the cleaning process is performed on the entire upper surface of the substrate W.

Step S13
The processing is continued. After the supply of the pure water for a predetermined time, the second processing liquid arm 43 is swung in place of the first processing liquid arm 41. As a result, the chemical liquid is supplied to the entire front surface of the substrate W at a position that does not interfere with the cleaning arm 45. At this time, the brush 99 is applied to the rear surface of the substrate W. After the supply of the chemical liquid for a predetermined time, the first processing liquid arm 41 is swung again in place of the second processing liquid arm 43, and the chemical liquid is replaced with the pure water. At this time, the brush 99 is applied to the rear surface of the substrate W. Thereafter, the first processing liquid arm 41, the second processing liquid arm 43, and the cleaning arm 45 are moved to the standby position. Then, the control unit 161 dries the substrate W. Specifically, the control unit 161 rotates the electric motor 49 at high speed to shake off the pure water adhering to the substrate W and dry it.

Step S14
After completing the processing, the substrate W is unloaded. The controller 161 lowers the guard 39 to the standby position. The center robot CR unloads the substrate W for which the drying processing has been completed from the back surface cleaning unit SSR. The unloaded substrate W is inverted by the second reversal unit 29 so that its front surface faces upward. The substrate W with its front surface facing upward is unloaded to the discharge part 11 by the indexer robot IR.

Step S15
The control unit 161 judges whether the number of cleaning processes has reached a predetermined number. Specifically, the control unit 161 refers to the memory, judges whether the number of cleaning processes has reached a predetermined number, and branches the process. For example, if the number of cleaning processes has not reached the predetermined number, the process proceeds to step S16.

Here, we will first explain what happens if the number of cleaning processes has not reached the specified number.

Step S16
The process moves to the processing of the next substrate W. The controller 161 performs the cleaning process on the next substrate W carried in by the center robot CR. That is, the process returns to step S12.

Next, in step S15, a case where the number of cleaning processes reaches a predetermined number will be described. The predetermined number here is preferably 2 or more. In other words, it is preferable not to perform the brush cleaning process every time a cleaning process is performed, but to perform the brush cleaning process after multiple cleaning processes have been performed. In this way, it is possible to prevent damage to the brush 99 due to excessive brush cleaning processes and to prevent the waste of resources required for the brush cleaning processes.

Step S17 (brush cleaning process)

Now, let us refer to Figures 11 to 14. Figures 11 to 14 are explanatory diagrams of the operation of the brush cleaning process. Note that, for the sake of illustration, the brush cleaning nozzle 203, protrusions 207, and drainage port 209 are omitted from Figures 11 to 14. Also, dust that has adhered to or been taken in by the brush 99 is depicted diagrammatically as a black circle.

Refer to FIG. 11. The control unit 161 operates the rotary lift mechanism 71 to swing the cleaning arm 45 from the standby position and move the brush 99 to the first position FS of the brush cleaning unit NCU. The first position FS is one side in the longitudinal direction of the brush cleaning unit NCU. At this time, the control unit 161 operates the flow control valve 215 to cause the cleaning liquid to be discharged into the cleaning tank 210. The control unit 161 operates the pressing mechanism 81 to position the brush 99 in the brush cleaning unit NCU at the no-load height H1. Next, the control unit 161 operates the pressing mechanism 81 to apply a cleaning load to the brush 99 and move the brush 99 to the operating height H2.

The cleaning load at this time is preferably a load larger than the target load during the cleaning process. In other words, the pressing mechanism 81 is operated so that the load is larger than the load during the cleaning process. Therefore, the brush 99 can be deformed more than during the cleaning process. As a result, the dirt caught in the brush 99 can be further discharged.

At this time, it is preferable to operate the rotation mechanism 83 to rotate the brush 99 on its axis. Because the brush cleaning unit NCU is small, it is preferable that the rotation speed is the same as or smaller than the rotation speed during the cleaning process. This makes it possible to prevent the cleaning liquid from scattering from the brush cleaning unit NCU. Furthermore, at this time, the ultrasonic vibration unit 205 is operated to impart ultrasonic vibrations to the cleaning liquid. This makes it easier for dirt caught in the brush 99 to be released by the vibration.

Refer to FIG. 12. The control unit 161 operates the rotary lifting mechanism 71 to swing the cleaning arm 45 by a predetermined angle. Specifically, the brush 99 at the operating height H2 is moved horizontally in the forward and backward directions X within the cleaning tank 201. The brush 99 is moved from the first position FS to the second position SS. The second position SS is the other side in the longitudinal direction of the brush cleaning unit NCU. As a result, the underside of the brush 99 is pressed against the protrusion 207 and moved in contact with it. The outer circumferential surface of the brush 99 also rubs against the cleaning liquid. These actions allow the dirt to be removed. Moving the brush 99 horizontally in this manner is called a scanning operation.

This type of scanning operation can cause the brush 99 to deform laterally, which can further remove dirt. Furthermore, normally, an operation similar to that performed during cleaning processing on the upper surface of the substrate W is simply performed within the brush cleaning unit NCU. Therefore, no new mechanism is required for the cleaning arm 45.

Refer to FIG. 13. The control unit 161 operates the pressing mechanism 81 to raise the brush 99 from the working height H2 to the unloaded height H1. This completes the pumping operation by pressing the brush 99 from the unloaded height H1 to the working height H2 in FIG. 11 and releasing the pressure from the working height H2 to the unloaded height H1. In other words, this is the operation of pressing the brush 99 and then releasing the pressure on the brush 99. This single pumping operation compresses and expands the brush 99 in the vertical direction Z. As a result, some of the dirt that has been taken in by the brush 99 is expelled from the brush 99.

Refer to FIG. 14. The control unit 161 operates the rotary lift mechanism 71 to swing the cleaning arm 45 holding the brush 99 with the brush 99 positioned at the second position SS. This causes the control unit 161 to move the brush 99 held by the cleaning arm 45 to the first position FS of the brush cleaning unit NCU.

The control unit 161 repeats the above-mentioned brush cleaning process a predetermined number of times. This causes the pumping operation and scanning operation to be performed multiple times.

After performing the brush cleaning process described above, the control unit 161 transitions to step S16. Performing the brush cleaning process multiple times results in multiple pumping and scanning operations, allowing more dust to be removed from the brush.

The above-mentioned steps S12 and S13 correspond to the "substrate cleaning process" in this invention. The above-mentioned step S17 corresponds to the "movement process" and the "brush cleaning process" in this invention.

According to this embodiment, the control unit 161 moves the brush 99 held by the cleaning arm 45 to the brush cleaning unit NCU. In this state, the control unit 161 activates the pressing mechanism 81 to perform a brush cleaning process by pumping. This pumping action compresses and expands the brush 99. As a result, some of the dirt captured by the brush 99 is discharged from the brush. The pumping action is an operation performed by the pressing mechanism 81 that is provided in conventional devices. Therefore, there is no need to provide a new mechanism in the cleaning arm 45, and no need for a brush with a special structure. As a result, the brush life can be improved without complicating the structure of the cleaning arm 45 and without using a special brush.

The present invention is not limited to the above embodiment, but can be modified as follows:

(1) In the above-described embodiment, a back surface cleaning unit SSR has been used as an example of a substrate processing apparatus. However, the present invention is not limited to a back surface cleaning unit SSR. For example, the present invention can also be applied to a front surface cleaning unit that cleans the front surface of a substrate with a brush 99.

(2) In the above-described embodiment, a configuration has been described in which the back surface cleaning unit SSR (processing unit 31) as the substrate processing apparatus is provided in the substrate processing apparatus 1 that includes the load/unload block 3 and the indexer block 5. However, the present invention is not limited to such a configuration. For example, the apparatus may be configured with only the back surface cleaning unit SSR (processing unit 31).

(3) In the embodiment described above, the cleaning arm 45 does not include a mechanism for detecting the load applied to the brush 99. However, the present invention is not limited to this configuration. For example, the force applied to the carriage 113b may be detected by a load cell, and the degree of agreement with the target load may be detected.

(4) In the above-described embodiment, the brush cleaning unit NCN is configured as a separate entity from the waiting pot 47. However, this configuration is not essential to the present invention. For example, the waiting pot 47 and the brush cleaning unit NCN may be configured as an integrated unit. This allows for effective use of space.

(5) In the above-described embodiment, the brush cleaning process is performed multiple times, but the present invention is not limited to such an embodiment. In other words, the present invention can contribute to cleaning the brush 99 by performing the pumping operation at least once. Furthermore, the scanning operation is not essential. If the scanning operation is not performed, the brush cleaning unit NCU can be configured with an area equivalent to at least one brush 99. Therefore, the brush cleaning unit NCU can be further miniaturized.

(6) In the above-described embodiment, the cleaning tank 201 has a fan shape in a planar view. However, the present invention does not limit the planar shape of the cleaning tank 201 to such a shape.

(7) In the above-described embodiment, the brush cleaning unit NCU is disposed between the waiting pot 47 disposed at the waiting position and the rotating holder 37 in a plan view. However, the present invention is not limited to such an arrangement. For example, it may be disposed in front of the cleaning arm 45 at the X in FIG. 3. In this case, the range of movement of the cleaning arm 45 to move the brush 99 may be expanded forward of the X from the waiting position.

(8) In the above-described embodiment, the bottom surface of the cleaning tank 201 is provided with a plurality of protrusions 207. However, this configuration is not essential to the present invention. In other words, the bottom surface of the cleaning tank 201 may be configured as a smooth surface.

(9) In the above-described embodiment, the brush cleaning unit NCU is equipped with a brush cleaning nozzle 203, but this configuration is not essential. For example, the brush cleaning unit NCU may be configured to include a suction nozzle and to suck the outer peripheral surface of the brush 99 to clean the brush.

(10) In the above-described embodiment, the brush cleaning unit NCU is equipped with an ultrasonic vibration unit 205, but this configuration is not required.

(11) In the above-described embodiment, the movement of the brush 99 between the processing position of the entire upper surface of the substrate W held by the spin chuck 53, the waiting pot 47, and the brush cleaning unit NCU, and the movement of the brush 99 from the first position FS to the second position SS in the brush cleaning unit NCU were performed by rotating the cleaning arm 45 with the rotary lift mechanism 71 to swing the brush 99. However, the present invention is not limited to such a configuration. For example, the cleaning arm 45 may be linearly driven by a linear motion mechanism using a ball screw and a linear guide, and the brush 99 held by the cleaning arm 45 may be linearly moved. In such a case, the center of the substrate W, the brush cleaning unit NCU, and the waiting pot 47 may be arranged so as to be located on a straight line along which the brush 99 moves in a straight line in a plan view. In addition, the brush cleaning unit NCU may be formed so that the first position FS and the second position SS in the brush cleaning unit NCU are located on a straight line along which the brush 99 moves in a straight line.

REFERENCE SIGNS LIST 1 ... substrate processing apparatus 3 ... loading/unloading block 5 ... indexer block 7 ... processing block W ... substrate C ... carrier IR ... indexer robot 15 ... transfer section 23 ... first reversal unit 25, 27 ... path section 29 ... second reversal unit 31 ... processing unit SSR ... back surface cleaning unit CR ... center robot 37 ... rotation holding section 39 ... guard 41 ... first processing liquid arm 42 ... electric motor 43 ... second processing liquid arm 45 ... cleaning arm 47 ... standby pot 53 ... spin chuck 71 ... rotation lift mechanism 75 ... housing 77 ... cleaning section 81 ... pressing mechanism 83 ... rotation mechanism 85 ... fulcrum member 87 ... seesaw member 87c ... center section 87l ... one side 87r ... other side 89 ... pressing actuator 91 LIST OF REFERENCE NUMERALS 93 support mechanism 95 biasing portion 97 guide portion 99 brush 101 brush holder 103 rotating shaft 111 coil spring 113 linear guide H1 unloaded height H2 action height H3 maximum pushing height 149 air supply pipe 151 air supply source 155 primary pressure gauge 157 electro-pneumatic regulator 159 secondary pressure gauge 161 control portion 163 instruction portion 165 notification portion NCU brush cleaning unit 201 cleaning tank 203 brush cleaning nozzle 205 ultrasonic vibration unit 207 protrusion 209 drain port

Claims (9)

In a substrate processing apparatus that performs a cleaning process on a substrate by applying a brush to the substrate,
a rotation holder that holds the substrate in a horizontal position and rotates the substrate;
A brush that acts on an upper surface of the substrate held by the rotating holder;
a cleaning arm that holds the brush and moves the brush between a standby position that is laterally spaced from the rotating holder and a processing position that is above the substrate held by the rotating holder and that performs a cleaning process on the entire upper surface of the substrate;
a pressing mechanism that applies a pressing force to the brush toward the substrate;
a brush cleaning unit disposed between the standby position and the rotation holding portion and configured to clean the brush;
a control unit that operates the pressing mechanism at least once to perform a brush cleaning process by a pumping action in a state in which the brush held by the cleaning arm is moved to the brush cleaning unit;
A substrate processing apparatus comprising: 2. The substrate processing apparatus according to claim 1,
The control unit controls the substrate processing apparatus to perform the pumping operation a plurality of times. 3. The substrate processing apparatus according to claim 1,
The control unit operates the pressing mechanism to perform the pumping operation with a load larger than a load used when cleaning a substrate. 3. The substrate processing apparatus according to claim 1,
The substrate processing apparatus according to claim 1, wherein the control unit performs a scanning operation of moving the brush laterally in addition to the pumping operation. 3. The substrate processing apparatus according to claim 1,
The brush cleaning unit further includes a cleaning tank for accommodating the brush,
The substrate processing apparatus according to claim 1, wherein the cleaning tank has a bottom surface that faces a lower surface of the brush and is formed with projections and recesses. 6. The substrate processing apparatus according to claim 5,
The substrate processing apparatus according to claim 1, wherein the brush cleaning unit further comprises a brush cleaning nozzle that supplies a cleaning liquid to the brush, and an ultrasonic vibration unit that applies ultrasonic vibration to the cleaning liquid stored in the cleaning tank. 3. The substrate processing apparatus according to claim 1,
a waiting pot disposed at the waiting position and accommodating the brush;
The substrate processing apparatus is characterized in that the brush cleaning unit is located between the waiting pot and the rotary holder, and is disposed on a path along which the brush moves when the cleaning arm moves the brush. 3. The substrate processing apparatus according to claim 1,
The control unit controls the substrate processing apparatus to perform the brush cleaning process after the cleaning process has been performed a predetermined number of times. A brush cleaning method for performing a cleaning process on a substrate by applying a brush thereto, comprising:
a substrate cleaning process in which the brush is moved by a cleaning arm holding the brush and the brush is applied to the entire upper surface of the substrate to perform a cleaning process on the substrate;
a moving step of the cleaning arm moving the brush to a brush cleaning unit after the substrate cleaning step;
a brush cleaning step of performing a brush cleaning process by performing at least one pumping operation of pressing the brush against the substrate;
A method for cleaning a brush, comprising carrying out the steps of:

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