JP2023035365A - 電子部品の固定構造、及び車載充電器 - Google Patents
電子部品の固定構造、及び車載充電器 Download PDFInfo
- Publication number
- JP2023035365A JP2023035365A JP2021142158A JP2021142158A JP2023035365A JP 2023035365 A JP2023035365 A JP 2023035365A JP 2021142158 A JP2021142158 A JP 2021142158A JP 2021142158 A JP2021142158 A JP 2021142158A JP 2023035365 A JP2023035365 A JP 2023035365A
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- fixing
- wall surface
- fastened
- pressing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000009434 installation Methods 0.000 abstract description 5
- 230000017525 heat dissipation Effects 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 3
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/12—Resilient or clamping means for holding component to structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/2049—Pressing means used to urge contact, e.g. springs
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mounting Components In General For Electric Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
2 :車載充電器
10 :固定構造
10A :固定構造
10B :固定構造
10C :固定構造
10D :固定構造
21 :筐体
100 :固定部材
100C :固定部材
110 :固定部
113 :溝(係合部)
113A :丸孔(係合部)
113B :長孔(係合部)
120 :押圧部
211 :壁面
220 :台(被締結部)
221 :ボス(被係合部)
Claims (4)
- 電子部品を筐体の壁面に押圧した状態で固定する固定部材と、
前記筐体における前記壁面から離間した位置に設けられ、前記固定部材が締結固定される被締結部と
を備え、
前記固定部材は、
前記固定部材による押圧方向に対して交差する締結方向に前記被締結部に締結固定される固定部と、
前記固定部から前記電子部品へ延び前記電子部品を前記壁面に対して前記押圧方向に押圧する押圧部と、
前記固定部に設けられた係合部と
を備え、
前記被締結部は、
前記係合部が係合し前記係合部との共働により前記固定部の前記押圧方向の反対方向への移動を制限する被係合部
を備える電子部品の固定構造。 - 複数の前記電子部品が配列されており、
複数の前記押圧部が、複数の前記電子部品の配列方向に並べて配され、
前記固定部が、前記押圧部と前記押圧部との間において前記被締結部に締結固定されている請求項1に記載の電子部品の固定構造。 - 複数の前記係合部が前記配列方向に並べて配され、
複数の前記被係合部が前記配列方向に並べて配されている請求項2に記載の電子部品の固定構造。 - 筐体と、
前記筐体の壁面に固定される電子部品と、
前記電子部品を前記壁面に押圧した状態で固定する固定部材と、
前記筐体における前記壁面から離間した位置に設けられ、前記固定部材が締結固定される被締結部と
を備え、
前記固定部材は、
前記固定部材による押圧方向に対して交差する締結方向に前記被締結部に締結固定される固定部と、
前記固定部から前記電子部品へ延び前記電子部品を前記壁面に対して前記押圧方向に押圧する押圧部と、
前記固定部に設けられた係合部と
を備え、
前記被締結部は、
前記係合部が係合し前記係合部との共働により前記固定部の前記押圧方向の反対方向への移動を制限する被係合部
を備える車載充電器。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021142158A JP7433735B2 (ja) | 2021-09-01 | 2021-09-01 | 電子部品の固定構造、及び車載充電器 |
EP22192603.3A EP4145969B1 (en) | 2021-09-01 | 2022-08-29 | Fixing structure of electronic component and in-vehicle charger |
US17/898,961 US12108554B2 (en) | 2021-09-01 | 2022-08-30 | Fixing structure of electronic component and in-vehicle charger |
CN202211055898.3A CN115734532A (zh) | 2021-09-01 | 2022-08-30 | 电子元件的固定结构和车载充电器 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021142158A JP7433735B2 (ja) | 2021-09-01 | 2021-09-01 | 電子部品の固定構造、及び車載充電器 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2023035365A true JP2023035365A (ja) | 2023-03-13 |
JP7433735B2 JP7433735B2 (ja) | 2024-02-20 |
Family
ID=83151489
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021142158A Active JP7433735B2 (ja) | 2021-09-01 | 2021-09-01 | 電子部品の固定構造、及び車載充電器 |
Country Status (4)
Country | Link |
---|---|
US (1) | US12108554B2 (ja) |
EP (1) | EP4145969B1 (ja) |
JP (1) | JP7433735B2 (ja) |
CN (1) | CN115734532A (ja) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015103800A (ja) * | 2013-11-26 | 2015-06-04 | 台達電子企業管理(上海)有限公司 | 放熱ベースと電子装置 |
JP2016034008A (ja) * | 2014-07-31 | 2016-03-10 | 富士電機株式会社 | 発熱部品の取付装置 |
US20180343775A1 (en) * | 2017-05-25 | 2018-11-29 | Delta Electronics (Thailand) Public Company Limited | Power module, power module assembly and assembling method thereof |
CN211090385U (zh) * | 2019-10-08 | 2020-07-24 | 广东高标电子科技有限公司 | 电动车控制器 |
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US5466970A (en) * | 1992-08-24 | 1995-11-14 | Thermalloy, Inc. | Hooked spring clip |
US5327324A (en) * | 1993-11-05 | 1994-07-05 | Ford Motor Company | Spring clip for a heat sink apparatus |
WO1997014184A1 (en) * | 1995-10-13 | 1997-04-17 | Thermalloy, Inc. | Solderable transistor clip and heat sink |
FR2778309B1 (fr) * | 1998-04-30 | 2000-07-21 | Valeo Electronique | Dispositif pour le blocage mecanique d'un composant electronique par rapport a un support et procede de montage d'une carte a circuit imprime sur un support utilisant un tel dispositif |
US6266244B1 (en) * | 1999-10-25 | 2001-07-24 | Harman International Industries Incorporated | Mounting method and apparatus for electrical components |
US7021365B2 (en) * | 2002-08-15 | 2006-04-04 | Valere Power, Inc. | Component to heat sink spring clip method and apparatus |
US20050264998A1 (en) * | 2004-05-25 | 2005-12-01 | 3M Innovative Properties Company | Heat sink assembly |
TW200846881A (en) * | 2007-05-18 | 2008-12-01 | Acbel Polytech Inc | Mounting device for chips and heat dissipating fins |
US8893770B2 (en) * | 2011-07-29 | 2014-11-25 | Schneider Electric It Corporation | Heat sink assembly for electronic components |
WO2014178876A1 (en) * | 2013-05-03 | 2014-11-06 | Schneider Electric USA, Inc. | Heat sink and method of assemblying |
CN104682457B (zh) | 2013-11-26 | 2017-08-29 | 台达电子企业管理(上海)有限公司 | 电子装置及汽车的充电装置 |
JP6182474B2 (ja) * | 2014-02-13 | 2017-08-16 | オムロンオートモーティブエレクトロニクス株式会社 | 電子部品の固定構造および固定方法 |
JP2016167425A (ja) | 2015-03-10 | 2016-09-15 | セイコーエプソン株式会社 | 照明装置、表示装置 |
KR102457660B1 (ko) * | 2016-01-08 | 2022-10-24 | 엘지이노텍 주식회사 | 전력 변환 장치 |
JP6898162B2 (ja) * | 2017-06-23 | 2021-07-07 | 矢崎総業株式会社 | 電子部品の固定構造 |
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JP7288363B2 (ja) * | 2019-07-10 | 2023-06-07 | ダイヤゼブラ電機株式会社 | 電子機器および電子制御装置 |
DE102019122640A1 (de) * | 2019-08-22 | 2021-02-25 | Ebm-Papst Mulfingen Gmbh & Co. Kg | Haltevorrichtung zur thermischen Kontaktierung eines auf einer Leiterplatte montierten elektronischen Bauteils mit einem Kühlkörper |
CN111098725B (zh) * | 2019-09-27 | 2021-03-23 | 法雷奥西门子新能源汽车(深圳)有限公司 | 一种电子设备与其用于固定元件的固定模块 |
DE112021000084T5 (de) * | 2020-03-19 | 2022-04-21 | Fuji Electric Co., Ltd. | Stromrichter |
-
2021
- 2021-09-01 JP JP2021142158A patent/JP7433735B2/ja active Active
-
2022
- 2022-08-29 EP EP22192603.3A patent/EP4145969B1/en active Active
- 2022-08-30 US US17/898,961 patent/US12108554B2/en active Active
- 2022-08-30 CN CN202211055898.3A patent/CN115734532A/zh active Pending
Patent Citations (4)
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JP2015103800A (ja) * | 2013-11-26 | 2015-06-04 | 台達電子企業管理(上海)有限公司 | 放熱ベースと電子装置 |
JP2016034008A (ja) * | 2014-07-31 | 2016-03-10 | 富士電機株式会社 | 発熱部品の取付装置 |
US20180343775A1 (en) * | 2017-05-25 | 2018-11-29 | Delta Electronics (Thailand) Public Company Limited | Power module, power module assembly and assembling method thereof |
CN211090385U (zh) * | 2019-10-08 | 2020-07-24 | 广东高标电子科技有限公司 | 电动车控制器 |
Also Published As
Publication number | Publication date |
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EP4145969A1 (en) | 2023-03-08 |
EP4145969B1 (en) | 2024-01-31 |
US20230062109A1 (en) | 2023-03-02 |
CN115734532A (zh) | 2023-03-03 |
US12108554B2 (en) | 2024-10-01 |
JP7433735B2 (ja) | 2024-02-20 |
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