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JP2023062255A - Substrate processing device - Google Patents

Substrate processing device Download PDF

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Publication number
JP2023062255A
JP2023062255A JP2021172123A JP2021172123A JP2023062255A JP 2023062255 A JP2023062255 A JP 2023062255A JP 2021172123 A JP2021172123 A JP 2021172123A JP 2021172123 A JP2021172123 A JP 2021172123A JP 2023062255 A JP2023062255 A JP 2023062255A
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Prior art keywords
substrate
roller
processing apparatus
transport
conveying
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JP2021172123A
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JP7408612B2 (en
Inventor
典生 芳川
Norio Yoshikawa
永二 山下
Eiji Yamashita
啓悟 鈴木
Keigo Suzuki
知輝 秋岡
Tomoki Akioka
征也 伊吹
Seiya Ibuki
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Screen Holdings Co Ltd
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Screen Holdings Co Ltd
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Priority to JP2021172123A priority Critical patent/JP7408612B2/en
Priority to TW111132430A priority patent/TWI852071B/en
Priority to KR1020220129723A priority patent/KR20230057266A/en
Priority to CN202211276682.XA priority patent/CN116009367B/en
Publication of JP2023062255A publication Critical patent/JP2023062255A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G13/00—Roller-ways
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G39/00—Rollers, e.g. drive rollers, or arrangements thereof incorporated in roller-ways or other types of mechanical conveyors 
    • B65G39/02—Adaptations of individual rollers and supports therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/3042—Imagewise removal using liquid means from printing plates transported horizontally through the processing stations
    • G03F7/3064—Imagewise removal using liquid means from printing plates transported horizontally through the processing stations characterised by the transport means or means for confining the different units, e.g. to avoid the overflow
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
    • B65G2201/02—Articles
    • B65G2201/0214—Articles of special size, shape or weigh
    • B65G2201/022—Flat

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Robotics (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Rollers For Roller Conveyors For Transfer (AREA)

Abstract

To provide a substrate processing device which reduces stripe-shaped unevenness of processing attributable to a conveyance roller, and with which the problem of a portion of processing liquid that forms paddles on a top face of a substrate flowing out to a surface of the conveyance roller, or the problem of bubbles stuck to the conveyance roller rising up to the top face of the substrate hardly occurs.SOLUTION: A conveyance mechanism 20 has a plurality of conveyance rollers 21. The conveyance rollers 21 rotate a contact part 53 which is partially formed on an outer circumferential face while keeping it in contact with an underside of a substrate 9, thereby conveying the substrate 9. A contact position of the contact part 53 that faces the underside of the substrate 9 changes in a width direction as the conveyance rollers 21 rotate. Thus, the stripe-shaped unevenness of processing attributable to the conveyance rollers 21 can be reduced. Furthermore, since a contact area of the conveyance rollers 21 to the underside of the substrate 9 is small, the problem of a portion of processing liquid that forms paddles on a top face of the substrate 9 flowing out to surfaces of the conveyance rollers 21 or the problem of bubbles stuck to the conveyance rollers 21 rising up to the top face of the substrate 9 hardly occurs.SELECTED DRAWING: Figure 3

Description

本発明は、基板を搬送しつつ処理液による処理を行う基板処理装置に関する。 The present invention relates to a substrate processing apparatus that performs processing with a processing liquid while transporting substrates.

従来、有機ＥＬパネル等の基板の製造工程では、基板を搬送しつつ、基板に対して処理液を供給する処理を行う基板処理装置が使用される。従来の基板処理装置については、例えば、特許文献１に記載されている。特許文献１の基板処理装置は、複数のローラにより、基板を水平な姿勢に支持しつつ搬送する。そして、搬送される基板の上面に現像液を供給することにより、基板の上面に、現像液のパドル（液だまり）を形成する。 2. Description of the Related Art Conventionally, in a process of manufacturing a substrate such as an organic EL panel, a substrate processing apparatus is used that carries out a process of supplying a processing liquid to the substrate while transporting the substrate. A conventional substrate processing apparatus is described in Patent Document 1, for example. The substrate processing apparatus of Patent Literature 1 transports a substrate while supporting it in a horizontal posture using a plurality of rollers. Then, a puddle (liquid pool) of the developer is formed on the upper surface of the substrate by supplying the developer to the upper surface of the substrate being transported.

特開２０１６－１６７４７５号公報JP 2016-167475 A

この種の基板処理装置では、ローラに設けられた複数のコロが、基板の下面に接触する。複数のコロは、幅方向（基板の搬送方向に対して直交し、かつ、水平な方向）に間隔をあけて配列されている。このため、基板の下面に、コロが接触する部分と、接触しない部分とが生じる。これにより、基板に、局所的な温度差や、現像液の局所的な流れが生じる。その結果、基板の上面において、搬送方向に延びる筋状の処理ムラが発生する場合がある。 In this type of substrate processing apparatus, a plurality of rollers provided on the roller come into contact with the bottom surface of the substrate. The plurality of rollers are arranged at intervals in the width direction (horizontal direction perpendicular to the direction of transport of the substrate). For this reason, the bottom surface of the substrate has a portion with which the roller contacts and a portion with which it does not. This results in local temperature differences and local flows of developer on the substrate. As a result, on the upper surface of the substrate, streak-like processing unevenness extending in the transport direction may occur.

このような処理ムラを抑制するためには、例えば、幅方向に延びる円筒状のベタローラを使用することが考えられる。ベタローラを使用すれば、基板の下面の幅方向の全体に、ローラが接触する。このため、搬送方向に延びる筋状の処理ムラを低減できる。 In order to suppress such processing unevenness, it is conceivable to use, for example, a cylindrical solid roller extending in the width direction. If a solid roller is used, the roller contacts the entire width of the bottom surface of the substrate. Therefore, it is possible to reduce streak-like processing unevenness extending in the transport direction.

ただし、ベタローラを使用すると、基板とローラとの接触面積が増加する。このため、基板の上面においてパドルを形成する処理液の一部が、表面張力によって、ローラの表面へ流出しやすくなる。そうすると、基板の上面に形成される処理液のパドルが薄くなり、現像処理が不均一になる場合がある。 However, using a solid roller increases the contact area between the substrate and the roller. Therefore, part of the processing liquid forming the puddle on the upper surface of the substrate tends to flow out to the surface of the roller due to surface tension. As a result, the puddle of the processing liquid formed on the upper surface of the substrate becomes thin, and the development processing may become non-uniform.

また、ローラの表面には、現像液の泡が付着することがあるが、ベタローラを使用する場合、基板とローラとの接触面積が大きいために、その泡が、ローラから基板の上面に乗り上がり易くなる。そうすると、基板の上面において、泡による処理ムラが生じてしまうという問題もある。 In addition, bubbles of the developer may adhere to the surface of the roller. When using a solid roller, the contact area between the substrate and the roller is large, so the bubbles rise from the roller to the upper surface of the substrate. becomes easier. In this case, there is also the problem that uneven processing due to the bubbles occurs on the upper surface of the substrate.

本発明は、このような事情に鑑みなされたものであり、搬送ローラに起因する筋状の処理ムラを低減し、かつ、基板の上面においてパドルを形成する処理液の一部が搬送ローラの表面へ流出したり、搬送ローラに付着した泡が基板の上面へ乗り上げたりする問題も生じにくい、基板処理装置を提供することを目的とする。 The present invention has been devised in view of such circumstances, and is intended to reduce streak-like processing unevenness caused by the transport roller, and to prevent a portion of the processing liquid forming the puddle on the upper surface of the substrate from spreading over the surface of the transport roller. To provide a substrate processing apparatus which hardly causes problems such as bubbles flowing out to the substrate or bubbles adhering to a conveying roller riding on the upper surface of a substrate.

本願の第１発明は、基板を搬送しつつ処理液による処理を行う基板処理装置であって、基板を水平な姿勢に支持しつつ、水平方向である搬送方向に基板を搬送する搬送機構と、前記搬送機構により搬送される基板の上面に前記処理液を供給することにより、基板の上面に前記処理液のパドルを形成する処理液供給部と、を備え、前記搬送機構は、前記搬送方向に間隔をあけて配列された複数の搬送ローラを有し、前記搬送ローラは、外周面に部分的に形成された接触部を、基板の下面に接触させつつ、前記搬送方向に対して直交する水平方向である幅方向に延びる軸を中心として回転することにより、基板を前記搬送方向の下流側へ搬送し、前記搬送ローラの外周面において、前記軸を中心とする周方向の位置に応じて、前記接触部の前記幅方向の位置が変化する。 A first invention of the present application is a substrate processing apparatus for performing processing with a processing liquid while transporting a substrate, comprising: a transport mechanism for supporting the substrate in a horizontal posture and transporting the substrate in a horizontal transport direction; a processing liquid supply unit configured to form a puddle of the processing liquid on the top surface of the substrate by supplying the processing liquid to the top surface of the substrate transported by the transport mechanism, wherein the transport mechanism extends in the transport direction. It has a plurality of conveying rollers arranged at intervals, and the conveying rollers are horizontal rollers orthogonal to the conveying direction while bringing contact portions partially formed on the outer peripheral surface of the conveying rollers into contact with the lower surface of the substrate. The substrate is conveyed downstream in the conveying direction by rotating around the axis extending in the width direction, which is the direction, and depending on the position in the circumferential direction around the axis on the outer peripheral surface of the conveying roller, The position of the contact portion in the width direction changes.

本願の第２発明は、第１発明の基板処理装置であって、前記接触部は、前記軸を中心とする螺旋状である。 A second invention of the present application is the substrate processing apparatus according to the first invention, wherein the contact portion has a spiral shape around the axis.

本願の第３発明は、第２発明の基板処理装置であって、前記複数の搬送ローラは、前記接触部が右巻きの螺旋状である複数の右巻き搬送ローラと、前記接触部が左巻きの螺旋状である複数の左巻き搬送ローラと、を含み、前記右巻き搬送ローラと、前記左巻き搬送ローラとが、前記搬送方向に沿って交互に配列されている。 A third invention of the present application is the substrate processing apparatus according to the second invention, wherein the plurality of conveying rollers include a plurality of right-handed conveying rollers in which the contact portion has a right-handed spiral shape and a plurality of right-handed conveying rollers in which the contact portion has a left-handed spiral shape. and a plurality of spiral left-handed conveying rollers, wherein the right-handed conveying rollers and the left-handed conveying rollers are alternately arranged along the conveying direction.

本願の第４発明は、第１発明の基板処理装置であって、前記搬送ローラは、前記幅方向に配列された複数の前記接触部を有し、複数の前記接触部は、それぞれ、前記軸に対して傾斜した楕円状である。 A fourth invention of the present application is the substrate processing apparatus according to the first invention, wherein the conveying roller has a plurality of the contact portions arranged in the width direction, and the plurality of the contact portions are arranged along the shaft. It has an elliptical shape that is inclined with respect to

本願の第５発明は、第４発明の基板処理装置であって、前記搬送ローラは、前記軸に沿って延びるシャフトと、前記シャフトに固定された複数のローラ部材と、を有し、前記複数のローラ部材が、それぞれ、前記接触部を有する。 A fifth invention of the present application is the substrate processing apparatus according to the fourth invention, wherein the transport roller has a shaft extending along the axis and a plurality of roller members fixed to the shaft, and the plurality of roller members are fixed to the shaft. roller members each have the contact portion.

本願の第６発明は、第４発明または第５発明の基板処理装置であって、前記複数の搬送ローラは、複数の第１搬送ローラと、複数の第２搬送ローラと、を含み、前記第１搬送ローラと、前記第２搬送ローラとが、前記搬送方向に沿って交互に配列され、前記幅方向において、前記第１搬送ローラの前記接触部と、前記第２搬送ローラの前記接触部とが、交互に配列されている。 A sixth invention of the present application is the substrate processing apparatus according to the fourth invention or the fifth invention, wherein the plurality of transport rollers includes a plurality of first transport rollers and a plurality of second transport rollers, The first conveying roller and the second conveying roller are alternately arranged along the conveying direction, and the contact portion of the first conveying roller and the contact portion of the second conveying roller are arranged in the width direction. are arranged alternately.

本願の第７発明は、第１発明から第６発明までのいずれか１発明の基板処理装置であって、前記処理液供給部は、前記処理液を吐出するノズルを有し、前記搬送機構は、前記ノズルによる前記処理液の吐出位置から下流側に配置された１つ以上の円筒ローラをさらに有し、前記円筒ローラは、前記幅方向に沿って延びる１本の円筒面を有し、前記円筒面を基板の下面に接触させつつ、前記幅方向に延びる軸を中心として回転することにより、基板を前記搬送方向の下流側へ搬送する。 A seventh invention of the present application is the substrate processing apparatus according to any one of the first invention to the sixth invention, wherein the processing liquid supply section has a nozzle for discharging the processing liquid, and the transport mechanism comprises , further comprising one or more cylindrical rollers arranged downstream from a position where the treatment liquid is discharged by the nozzle, the cylindrical roller having one cylindrical surface extending along the width direction, the The substrate is transported downstream in the transport direction by rotating around the axis extending in the width direction while keeping the cylindrical surface in contact with the bottom surface of the substrate.

本願の第８発明は、第１発明から第７発明までのいずれか１発明の基板処理装置であって、基板の前記幅方向の端部に接触するガイドローラをさらに備える。 An eighth invention of the present application is the substrate processing apparatus according to any one of the first invention to the seventh invention, further comprising a guide roller contacting the edge of the substrate in the width direction.

本願の第９発明は、第１発明から第８発明までのいずれか１発明の基板処理装置であって、前記処理液は、基板の上面に形成されたレジスト膜を現像する現像液である。 A ninth invention of the present application is the substrate processing apparatus according to any one of the first invention to the eighth invention, wherein the processing liquid is a developer for developing a resist film formed on the upper surface of the substrate.

本願の第１発明～第９発明によれば、基板の下面に対する搬送ローラの接触位置が、搬送ローラの回転に伴い、幅方向に変化する。これにより、搬送ローラに起因する筋状の処理ムラを低減できる。また、搬送ローラの外周面に、基板と接触する接触部が、部分的に形成されている。これにより、基板の下面に対する搬送ローラの接触面積を低減できる。したがって、基板の上面においてパドルを形成する処理液の一部が、搬送ローラの表面へ流出したり、搬送ローラに付着した泡が基板の上面へ乗り上げたりする問題も、生じにくい。 According to the first to ninth inventions of the present application, the contact position of the transport roller with respect to the lower surface of the substrate changes in the width direction as the transport roller rotates. As a result, it is possible to reduce streaky processing unevenness caused by the conveying roller. Further, a contact portion that contacts the substrate is partially formed on the outer peripheral surface of the transport roller. As a result, the contact area of the transport rollers with respect to the bottom surface of the substrate can be reduced. Therefore, problems such as part of the processing liquid forming the puddle on the upper surface of the substrate flowing out to the surface of the transport roller, and bubbles adhering to the transport roller riding on the upper surface of the substrate are less likely to occur.

特に、本願の第２発明によれば、接触部を、幅方向に切れ目なく形成できる。これにより、接触部が存在しない幅方向の位置を減らすことができる。その結果、搬送ローラに起因する筋状の処理ムラを、より抑制できる。 In particular, according to the second invention of the present application, the contact portion can be formed seamlessly in the width direction. As a result, it is possible to reduce the positions in the width direction where the contact portion does not exist. As a result, it is possible to further suppress streak-like processing unevenness caused by the conveying roller.

特に、本願の第３発明によれば、基板の下面に対する搬送ローラの接触位置を、より均一化できる。したがって、搬送ローラに起因する筋状の処理ムラを、より抑制できる。 In particular, according to the third invention of the present application, the contact position of the transport roller with respect to the lower surface of the substrate can be made more uniform. Therefore, it is possible to further suppress streak-like processing unevenness caused by the conveying roller.

特に、本願の第４発明によれば、接触部を螺旋状ではなく、閉じた楕円状とする。これにより、搬送ローラの外周面に、接触部を容易に形成できる。 In particular, according to the fourth invention of the present application, the contact portion is formed in a closed elliptical shape instead of a spiral shape. Thereby, the contact portion can be easily formed on the outer peripheral surface of the conveying roller.

特に、本願の第５発明によれば、接触部を有するローラ部材を複数作製し、それらローラ部材をシャフトに固定することで、搬送ローラを製造できる。これにより、複数の接触部を有する搬送ローラを、容易に製造できる。 In particular, according to the fifth invention of the present application, a conveying roller can be manufactured by manufacturing a plurality of roller members having contact portions and fixing the roller members to a shaft. This makes it possible to easily manufacture a conveying roller having a plurality of contact portions.

特に、本願の第６発明によれば、基板の下面に対する搬送ローラの接触位置を、より均一化できる。したがって、搬送ローラに起因する筋状の処理ムラを、より抑制できる。 In particular, according to the sixth invention of the present application, the contact position of the transport roller with respect to the lower surface of the substrate can be made more uniform. Therefore, it is possible to further suppress streak-like processing unevenness caused by the conveying roller.

特に、本願の第７発明によれば、処理液の吐出位置の直後に円筒ローラを配置する。当該円筒ローラにより、基板を精度よく水平に支持しつつ、基板の上面に、処理液のパドルを良好に形成できる。 In particular, according to the seventh invention of the present application, the cylindrical roller is arranged immediately after the treatment liquid ejection position. With the cylindrical roller, the substrate can be horizontally supported with high accuracy, and a puddle of the processing liquid can be formed satisfactorily on the upper surface of the substrate.

特に、本願の第８発明によれば、基板が搬送方向に対して斜めに移動することを抑制できる。 In particular, according to the eighth aspect of the present application, it is possible to prevent the substrate from obliquely moving with respect to the transport direction.

現像装置の側面図である。3 is a side view of the developing device; FIG. 現像装置の上面図である。3 is a top view of the developing device; FIG. 搬送機構の部分上面図である。4 is a partial top view of the transport mechanism; FIG. 第２実施形態に係る搬送機構の部分上面図である。FIG. 11 is a partial top view of a transport mechanism according to a second embodiment; 第３実施形態に係る搬送機構の部分上面図である。FIG. 11 is a partial top view of a transport mechanism according to a third embodiment; 第４実施形態に係る搬送機構の部分上面図である。FIG. 11 is a partial top view of a transport mechanism according to a fourth embodiment; 第５実施形態に係る搬送機構の部分上面図である。FIG. 11 is a partial top view of a transport mechanism according to a fifth embodiment; 第６実施形態に係る搬送機構の部分上面図である。FIG. 14 is a partial top view of a transport mechanism according to a sixth embodiment; 第７実施形態に係る現像装置の上面図である。FIG. 11 is a top view of a developing device according to a seventh embodiment;

以下、本発明の実施形態について、図面を参照しつつ説明する。 BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described with reference to the drawings.

＜１．第１実施形態＞
＜１－１．基板処理装置の構成＞
図１は、本発明に係る基板処理装置の一例となる現像装置１の側面図である。図２は、現像装置１の上面図である。この現像装置１は、有機ＥＬパネルの製造工程において、矩形状の基板９に対して、現像処理を行う装置である。現像装置１は、洗浄、レジスト液の塗布、乾燥、露光、現像等の処理を一貫して行う、いわゆるコータ・デベロッパの一部分として使用される。ただし、現像装置１は、コータ・デベロッパを構成する塗布装置や露光装置とは切り離されて、単独で使用されるものであってもよい。 <1. First Embodiment>
<1-1. Configuration of Substrate Processing Apparatus>
FIG. 1 is a side view of a developing device 1, which is an example of a substrate processing apparatus according to the present invention. FIG. 2 is a top view of the developing device 1. FIG. This developing device 1 is a device that performs development processing on a rectangular substrate 9 in the manufacturing process of an organic EL panel. The developing device 1 is used as part of a so-called coater/developer that consistently performs processes such as cleaning, application of resist solution, drying, exposure, and development. However, the developing device 1 may be separated from the coating device and the exposure device that constitute the coater/developer and be used independently.

現像装置１に搬入される基板９の上面には、レジスト膜（フォトレジストの膜）が形成されている。また、当該レジスト膜は、前段の露光装置において、部分的に露光されている。現像装置１は、このような基板９を搬送しつつ、基板９の上面に現像液Ｌを供給する。これにより、レジスト膜の露光された部分が溶解（現像）される。 A resist film (photoresist film) is formed on the upper surface of the substrate 9 carried into the developing device 1 . Also, the resist film is partially exposed in the preceding exposure device. The developing device 1 supplies the developer L onto the upper surface of the substrate 9 while transporting the substrate 9 . As a result, the exposed portion of the resist film is dissolved (developed).

図１および図２に示すように、現像装置１は、チャンバ１０、搬送機構２０、処理液供給部３０、および制御部４０を備える。なお、以下では、搬送機構２０による基板９の搬送方向の上流側を単に「上流側」と称し、搬送方向の下流側を単に「下流側」と称する。 As shown in FIGS. 1 and 2, the developing device 1 includes a chamber 10, a transport mechanism 20, a processing liquid supply section 30, and a control section 40. As shown in FIG. In the following, the upstream side in the transport direction of the substrate 9 by the transport mechanism 20 is simply referred to as "upstream side", and the downstream side in the transport direction is simply referred to as "downstream side".

チャンバ１０は、基板９の搬送方向に沿って延びる、略直方体状の筐体である。チャンバ１０の内部には、基板９に対して現像処理を行うための空間が存在する。なお、チャンバ１０の内部構造を明示するために、図１および図２では、チャンバ１０を断面の状態で示している。チャンバ１０の上流側の端部には、基板９を搬入するための搬入口１１が設けられている。チャンバ１０の下流側の端部には、基板９を搬出するための搬出口１２が設けられている。また、チャンバ１０の底面には、チャンバ１０内で使用された現像液Ｌを外部へ排出するための排液孔１３が設けられている。 The chamber 10 is a substantially rectangular parallelepiped housing extending along the transport direction of the substrate 9 . A space for developing the substrate 9 exists inside the chamber 10 . In order to clarify the internal structure of the chamber 10, FIGS. 1 and 2 show the chamber 10 in cross section. A loading port 11 for loading the substrate 9 is provided at the upstream end of the chamber 10 . A carry-out port 12 for carrying out the substrate 9 is provided at the downstream end of the chamber 10 . Further, the bottom surface of the chamber 10 is provided with a drain hole 13 for discharging the developer L used in the chamber 10 to the outside.

搬送機構２０は、チャンバ１０内において、基板９を搬送する機構である。搬送機構２０は、基板９を水平な姿勢に支持しつつ、水平方向である搬送方向に沿って、基板９を搬送する。図１および図２に示すように、搬送機構２０は、複数の搬送ローラ２１を有する。複数の搬送ローラ２１は、搬送方向に間隔をあけて配列されている。複数の搬送ローラ２１は、モータ等により構成されるローラ駆動機構２２に、接続されている。ローラ駆動機構２２を動作させると、各搬送ローラ２１は、幅方向（基板９の搬送方向に対して直交し、かつ、水平な方向）に延びる軸を中心として回転する。 The transport mechanism 20 is a mechanism that transports the substrate 9 within the chamber 10 . The transport mechanism 20 transports the substrate 9 along the horizontal transport direction while supporting the substrate 9 in a horizontal posture. As shown in FIGS. 1 and 2, the transport mechanism 20 has multiple transport rollers 21 . The plurality of transport rollers 21 are arranged at intervals in the transport direction. The plurality of conveying rollers 21 are connected to a roller drive mechanism 22 that includes a motor or the like. When the roller driving mechanism 22 is operated, each conveying roller 21 rotates around an axis extending in the width direction (horizontal direction perpendicular to the conveying direction of the substrate 9).

チャンバ１０内に基板９が搬入されると、複数の搬送ローラ２１は、基板９の下面に接触しつつ、回転する。これにより、基板９が水平な姿勢に支持されつつ、下流側へ搬送される。 When the substrate 9 is loaded into the chamber 10 , the multiple transport rollers 21 rotate while contacting the bottom surface of the substrate 9 . As a result, the substrate 9 is transported downstream while being supported in a horizontal posture.

処理液供給部３０は、搬送機構２０により搬送される基板９の上面に、処理液としての現像液Ｌを供給する機構である。図１に示すように、処理液供給部３０は、ノズル３１、給液配管３２、および給液タンク３３を有する。ノズル３１は、チャンバ１０内に配置されている。また、ノズル３１は、搬送機構２０による基板９の搬送経路の上方に、配置されている。ノズル３１の下端部には、幅方向に延びるスリット状の吐出口が設けられている。吐出口は、搬送機構２０により搬送される基板９の上面と、僅かな隙間を介して、上下方向に対向する。 The processing liquid supply unit 30 is a mechanism that supplies the developing liquid L as a processing liquid onto the upper surface of the substrate 9 transported by the transport mechanism 20 . As shown in FIG. 1 , the processing liquid supply section 30 has a nozzle 31 , a liquid supply pipe 32 , and a liquid supply tank 33 . A nozzle 31 is arranged in the chamber 10 . Further, the nozzle 31 is arranged above the transport path of the substrate 9 by the transport mechanism 20 . A slit-shaped ejection port extending in the width direction is provided at the lower end of the nozzle 31 . The ejection port vertically faces the upper surface of the substrate 9 transported by the transport mechanism 20 with a small gap therebetween.

給液配管３２の下流側の端部は、ノズル３１に接続されている。給液配管３２の上流側の端部は、給液タンク３３に接続されている。また、給液配管３２の経路上には、バルブ３４およびポンプ３５が設けられている。給液タンク３３には、供給前の現像液Ｌが貯留されている。現像液Ｌは、例えば、常温の水酸化テトラメチルアンモニウム（ＴＭＡＨ）である。ただし、現像液Ｌは、ＴＭＡＨ以外の液体であってもよい。 A downstream end of the liquid supply pipe 32 is connected to the nozzle 31 . The upstream end of the liquid supply pipe 32 is connected to the liquid supply tank 33 . A valve 34 and a pump 35 are provided on the route of the liquid supply pipe 32 . The developer L before supply is stored in the liquid supply tank 33 . The developer L is, for example, room temperature tetramethylammonium hydroxide (TMAH). However, the developer L may be a liquid other than TMAH.

バルブ３４を開放して、ポンプ３５を動作させると、給液タンク３３から給液配管３２を通ってノズル３１へ、現像液Ｌが供給される。そして、ノズル３１の吐出口から、下方へ向けて、現像液Ｌが吐出される。基板９は、現像液Ｌを吐出するノズル３１の下方を通過する。これにより、基板９の上面に、現像液Ｌのパドル（液だまり）が形成される。現像液Ｌは、その表面張力によって、基板９の上面に保持される。 When the valve 34 is opened and the pump 35 is operated, the developer L is supplied from the liquid supply tank 33 to the nozzle 31 through the liquid supply pipe 32 . Then, the developer L is discharged downward from the discharge port of the nozzle 31 . The substrate 9 passes below the nozzle 31 for discharging the developer L. As shown in FIG. As a result, a puddle (liquid pool) of the developer L is formed on the upper surface of the substrate 9 . The developer L is held on the upper surface of the substrate 9 by its surface tension.

制御部４０は、現像装置１の各部を動作制御するためのユニットである。制御部４０は、ＣＰＵ等のプロセッサ、ＲＡＭ等のメモリ、およびハードディスクドライブ等の記憶部を有するコンピュータにより構成される。記憶部には、現像処理を実行するためのコンピュータプログラムおよび各種データが、記憶されている。また、図１および図２中に破線矢印で示したように、制御部４０は、上述したローラ駆動機構２２、バルブ３４、およびポンプ３５と、電気的に接続されている。制御部４０は、コンピュータプログラムに従って動作することにより、上記の各部を動作制御する。これにより、現像装置１における基板９の搬送および現像処理が進行する。 The control section 40 is a unit for controlling the operation of each section of the developing device 1 . The control unit 40 is configured by a computer having a processor such as a CPU, a memory such as a RAM, and a storage unit such as a hard disk drive. The storage unit stores a computer program and various data for executing development processing. 1 and 2, the controller 40 is electrically connected to the roller drive mechanism 22, the valve 34, and the pump 35 described above. The control unit 40 operates according to a computer program to control the operation of each unit described above. As a result, the substrate 9 is transported and developed in the developing device 1 .

＜１－２．搬送機構について＞
続いて、上述した搬送機構２０について、より詳細に説明する。 <1-2. Conveying Mechanism>
Next, the transport mechanism 20 described above will be described in more detail.

図３は、搬送機構２０の部分上面図である。上述の通り、搬送機構２０は、複数の搬送ローラ２１を有する。図３に示すように、各搬送ローラ２１は、シャフト５１と、シャフト５１に固定されたローラ部材５２とを有する。 3 is a partial top view of the transport mechanism 20. FIG. As described above, the transport mechanism 20 has multiple transport rollers 21 . As shown in FIG. 3 , each transport roller 21 has a shaft 51 and a roller member 52 fixed to the shaft 51 .

シャフト５１は、幅方向に延びる軸Ａに沿って配置された、円柱状の部品である。シャフト５１は、ローラ部材５２よりも剛性が高い金属により形成される。シャフト５１の両端部は、チャンバ１０に対して静止したフレームに、ベアリングを介して、回転可能に支持される。また、シャフト５１は、上述したローラ駆動機構２２に接続されている。ローラ駆動機構２２を動作させると、複数のシャフト５１が、それぞれ、幅方向に延びる軸Ａを中心として回転する。 The shaft 51 is a cylindrical component arranged along an axis A extending in the width direction. The shaft 51 is made of metal having higher rigidity than the roller member 52 . Both ends of the shaft 51 are rotatably supported by a frame stationary with respect to the chamber 10 via bearings. Further, the shaft 51 is connected to the roller drive mechanism 22 described above. When the roller drive mechanism 22 is operated, each of the shafts 51 rotates around the axis A extending in the width direction.

ローラ部材５２は、上記の軸Ａに沿って幅方向に延びる、円筒状の部品である。ローラ部材５２は、例えば、シャフト５１よりも剛性が低い樹脂により形成される。シャフト５１は、ローラ部材５２の内側に挿入されている。ローラ部材５２は、シャフト５１の外周面に固定されている。したがって、ローラ駆動機構２２を動作させると、シャフト５１とともにローラ部材５２も、幅方向に延びる軸Ａを中心として回転する。 The roller member 52 is a cylindrical component extending in the width direction along the axis A described above. The roller member 52 is made of resin having lower rigidity than the shaft 51, for example. The shaft 51 is inserted inside the roller member 52 . The roller member 52 is fixed to the outer peripheral surface of the shaft 51 . Therefore, when the roller drive mechanism 22 is operated, the roller member 52 rotates around the axis A extending in the width direction together with the shaft 51 .

ローラ部材５２は、その外周面に、接触部５３と非接触部５４とを有する。接触部５３は、ローラ部材５２の最外径を構成する。したがって、基板９の搬送時には、接触部５３が、基板９の下面に接触する。本実施形態の接触部５３は、上記の軸Ａを中心とする螺旋状である。接触部５３は、一条の螺旋状であってもよく、複数条の螺旋状であってもよい。接触部５３は、上記の軸Ａを中心とする円筒面の一部分となっている。 The roller member 52 has a contact portion 53 and a non-contact portion 54 on its outer peripheral surface. The contact portion 53 constitutes the outermost diameter of the roller member 52 . Therefore, the contact portion 53 contacts the lower surface of the substrate 9 when the substrate 9 is transported. The contact portion 53 of this embodiment has a spiral shape centered on the axis A described above. The contact portion 53 may have a single helical shape or a plurality of helical shapes. The contact portion 53 is a portion of a cylindrical surface centered on the axis A described above.

非接触部５４は、ローラ部材５２の外周面のうち、接触部５３以外の部分である。非接触部５４は、接触部５３よりも内側（軸Ａを中心とする径方向の内側）へ凹んでいる。このため、基板９の搬送時にも、非接触部５４は、基板９の下面に接触しない。すなわち、搬送ローラ２１は、その外周面のうち、部分的に形成された接触部５３のみを、基板９の下面に接触させつつ回転することにより、基板９を下流側へ搬送する。 The non-contact portion 54 is a portion of the outer peripheral surface of the roller member 52 other than the contact portion 53 . The non-contact portion 54 is recessed inward (inward in the radial direction about the axis A) from the contact portion 53 . Therefore, the non-contact portion 54 does not contact the lower surface of the substrate 9 even when the substrate 9 is transported. That is, the conveying roller 21 conveys the substrate 9 to the downstream side by rotating only the partially formed contact portion 53 of the outer peripheral surface of the conveying roller 21 while contacting the lower surface of the substrate 9 .

ローラ部材５２の外周面における接触部５３の幅方向の位置は、軸Ａを中心とする周方向の角度位置に応じて、変化する。このため、基板９の下面に対するローラ部材５２の接触位置は、搬送ローラ２１の回転に伴い、幅方向に変化する。このようにすれば、基板９の下面のうち、幅方向の特定の位置のみに、搬送ローラ２１が接触することを防止できる。これにより、幅方向の特定の位置に、現像液Ｌの温度変化や現像液Ｌの流れが集中することを、抑制できる。その結果、基板９の上面に形成されたレジスト膜に、搬送ローラ２１との接触に起因する筋状のムラが生じることを、抑制できる。 The position in the width direction of the contact portion 53 on the outer peripheral surface of the roller member 52 changes according to the angular position in the circumferential direction about the axis A. As shown in FIG. Therefore, the contact position of the roller member 52 with respect to the lower surface of the substrate 9 changes in the width direction as the transport roller 21 rotates. By doing so, it is possible to prevent the transport roller 21 from contacting only a specific position in the width direction of the lower surface of the substrate 9 . Thereby, it is possible to suppress the temperature change of the developer L and the concentration of the flow of the developer L at a specific position in the width direction. As a result, the resist film formed on the upper surface of the substrate 9 can be prevented from streak-like unevenness due to contact with the transport roller 21 .

また、接触部５３は、ローラ部材５２の外周面に、部分的に形成されている。このため、ローラ部材５２の外周面の全体を円筒状の接触部とする場合よりも、基板９との接触面積を低減できる。したがって、基板９の上面においてパドルを形成する現像液Ｌの一部が、表面張力によって、ローラ部材５２の表面へ流出し、それにより、パドルの厚みが減少するという問題が生じにくい。また、ローラ部材５２の外周面に付着した泡が、基板９の上面へ乗り上げるという問題も生じにくい。したがって、基板９の上面に形成される現像液Ｌのパドルを適切な厚みに維持しつつ、レジスト膜を均一に現像することができる。 Further, the contact portion 53 is partially formed on the outer peripheral surface of the roller member 52 . Therefore, the contact area with the substrate 9 can be reduced as compared with the case where the entire outer peripheral surface of the roller member 52 is a cylindrical contact portion. Therefore, the problem that part of the developer L forming the paddle on the upper surface of the substrate 9 flows out to the surface of the roller member 52 due to the surface tension and thereby reduces the thickness of the paddle does not easily occur. Moreover, the problem that the bubbles adhering to the outer peripheral surface of the roller member 52 ride on the upper surface of the substrate 9 is less likely to occur. Therefore, the resist film can be uniformly developed while maintaining the appropriate thickness of the puddle of the developer L formed on the upper surface of the substrate 9 .

特に、本実施形態のように、接触部５３を螺旋状とすれば、接触部５３を、幅方向に切れ目なく形成できる。したがって、接触部５３が存在しない幅方向の位置を低減できる。これにより、基板９の上面のレジスト膜に、搬送ローラ２１との接触に起因する筋状のムラが生じることを、より抑制できる。 In particular, if the contact portion 53 is spiral as in the present embodiment, the contact portion 53 can be formed seamlessly in the width direction. Therefore, the positions in the width direction where the contact portion 53 does not exist can be reduced. As a result, the resist film on the upper surface of the substrate 9 can be prevented from streak-like unevenness due to contact with the transport roller 21 .

また、図３に示すように、本実施形態の搬送機構２０は、複数のガイドローラ２３を有する。各ガイドローラ２３は、上下方向に延びる軸を中心として、回転可能となっている。複数のガイドローラ２３のうち、搬送経路の右側に配置されたガイドローラ２３は、基板９の右側の端縁部に接触する。複数のガイドローラ２３のうち、搬送経路の左側に配置されたガイドローラ２３は、基板９の左側の端縁部に接触する。このように、基板９の幅方向の両端縁部にガイドローラ２３が接触することで、基板９の幅方向の移動を抑制できる。特に、本実施形態では、搬送ローラ２１の接触部５３が螺旋状であるため、搬送ローラ２１から基板９に対して、斜め方向の力がかかりやすい。しかしながら、ガイドローラ２３を設けることで、基板９が斜めに移動することを抑制し、基板９を搬送方向に精度よく搬送できる。 Further, as shown in FIG. 3 , the transport mechanism 20 of this embodiment has a plurality of guide rollers 23 . Each guide roller 23 is rotatable around a vertically extending shaft. Of the plurality of guide rollers 23 , the guide roller 23 arranged on the right side of the transport path contacts the right edge portion of the substrate 9 . Of the plurality of guide rollers 23 , the guide roller 23 arranged on the left side of the transport path contacts the left edge portion of the substrate 9 . In this manner, the guide rollers 23 are brought into contact with both edges of the substrate 9 in the width direction, so that movement of the substrate 9 in the width direction can be suppressed. In particular, in the present embodiment, since the contact portion 53 of the transport roller 21 has a helical shape, the force in the oblique direction is likely to be applied from the transport roller 21 to the substrate 9 . However, by providing the guide rollers 23, the substrate 9 can be prevented from obliquely moving, and the substrate 9 can be accurately transported in the transport direction.

＜２．第２実施形態＞
続いて、本発明の第２実施形態について、説明する。なお、以下では、上述した実施形態との相違点を中心に説明する。上述した実施形態と同等の部分については、重複説明を省略する。 <2. Second Embodiment>
Next, a second embodiment of the invention will be described. In addition, below, it demonstrates centering around difference with embodiment mentioned above. Duplicate descriptions of parts equivalent to those of the above-described embodiment will be omitted.

図４は、第２実施形態に係る搬送機構２０の部分上面図である。図４に示すように、本実施形態では、複数の搬送ローラ２１が、複数の右巻き搬送ローラ２１Ａと、複数の左巻き搬送ローラ２１Ｂとを含む。右巻き搬送ローラ２１Ａは、接触部５３が右巻きの螺旋状となっている。すなわち、右巻き搬送ローラ２１Ａは、幅方向の一端から他端へ向かうにつれて、接触部５３が時計回りの螺旋状に延びる。左巻き搬送ローラ２１Ｂは、接触部５３が左巻きの螺旋状となっている。すなわち、左巻き搬送ローラ２１Ｂは、幅方向の一端から他端へ向かうにつれて、接触部５３が反時計回りの螺旋状に延びる。 FIG. 4 is a partial top view of the transport mechanism 20 according to the second embodiment. As shown in FIG. 4, in the present embodiment, the multiple transport rollers 21 include multiple right-handed transport rollers 21A and multiple left-handed transport rollers 21B. The contact portion 53 of the right-handed conveying roller 21A has a right-handed spiral shape. That is, the right-handed conveying roller 21A has the contact portion 53 extending spirally clockwise from one end to the other end in the width direction. The contact portion 53 of the left-handed conveying roller 21B has a left-handed helical shape. That is, the left-handed conveying roller 21B has the contact portion 53 extending spirally in the counterclockwise direction from one end to the other end in the width direction.

右巻き搬送ローラ２１Ａと左巻き搬送ローラ２１Ｂとは、搬送方向に沿って、交互に配列されている。このようにすれば、基板９の下面に対する搬送ローラ２１の接触位置を、より均一化できる。したがって、基板９の上面のレジスト膜に、搬送ローラ２１との接触に起因する筋状のムラが生じることを、より抑制できる。 The right-handed conveying rollers 21A and the left-handed conveying rollers 21B are alternately arranged along the conveying direction. In this way, the contact position of the conveying roller 21 with respect to the lower surface of the substrate 9 can be made more uniform. Therefore, the resist film on the upper surface of the substrate 9 can be prevented from streak-like unevenness due to contact with the transport roller 21 .

＜３．第３実施形態＞
続いて、本発明の第３実施形態について、説明する。なお、以下では、上述した実施形態との相違点を中心に説明する。上述した実施形態と同等の部分については、重複説明を省略する。 <3. Third Embodiment>
Next, a third embodiment of the invention will be described. In addition, below, it demonstrates centering around difference with embodiment mentioned above. Duplicate descriptions of parts equivalent to those of the above-described embodiment will be omitted.

図５は、第３実施形態に係る搬送機構２０の部分上面図である。図５に示すように、本実施形態では、ローラ部材５２が、連続した螺旋状の接触部５３ではなく、複数の孤立した接触部５３を有する。複数の接触部５３は、幅方向に沿って、等間隔に配列されている。各接触部５３は、幅方向に延びる軸Ａに対して傾斜した楕円状となっている。 FIG. 5 is a partial top view of the transport mechanism 20 according to the third embodiment. As shown in FIG. 5, in this embodiment the roller member 52 has a plurality of isolated contact portions 53 rather than a continuous spiral contact portion 53 . The plurality of contact portions 53 are arranged at regular intervals along the width direction. Each contact portion 53 has an elliptical shape that is inclined with respect to an axis A extending in the width direction.

このような形態でも、ローラ部材５２の外周面における接触部５３の幅方向の位置は、軸Ａを中心とする周方向の角度位置に応じて、変化する。このため、基板９の下面に対するローラ部材５２の接触位置は、搬送ローラ２１の回転に伴い、幅方向に変化する。したがって、基板９の下面のうち、幅方向の特定の位置のみに、搬送ローラ２１が接触することを防止できる。これにより、基板９の上面のレジスト膜に、搬送ローラ２１との接触に起因する筋状のムラが生じることを、抑制できる。 Even in such a form, the position of the contact portion 53 on the outer peripheral surface of the roller member 52 in the width direction changes according to the angular position in the circumferential direction about the axis A. Therefore, the contact position of the roller member 52 with respect to the lower surface of the substrate 9 changes in the width direction as the transport roller 21 rotates. Therefore, it is possible to prevent the conveying roller 21 from contacting only a specific position in the width direction of the lower surface of the substrate 9 . As a result, it is possible to prevent streaky unevenness from occurring in the resist film on the upper surface of the substrate 9 due to contact with the transport roller 21 .

また、接触部５３を、閉じた楕円状とすることで、螺旋状の場合よりも、接触部５３の加工が容易となる。すなわち、ローラ部材５２の外周面に、接触部５３を容易に形成できる。したがって、複数の接触部５３を有するローラ部材５２を、容易に製造できる。 Further, by forming the contact portion 53 into a closed elliptical shape, the contact portion 53 can be processed more easily than in the case of a spiral shape. That is, the contact portion 53 can be easily formed on the outer peripheral surface of the roller member 52 . Therefore, the roller member 52 having a plurality of contact portions 53 can be easily manufactured.

＜４．第４実施形態＞
続いて、本発明の第４実施形態について、説明する。なお、以下では、上述した実施形態との相違点を中心に説明する。上述した実施形態と同等の部分については、重複説明を省略する。 <4. Fourth Embodiment>
Next, a fourth embodiment of the invention will be described. In addition, below, it demonstrates centering around difference with embodiment mentioned above. Duplicate descriptions of parts equivalent to those of the above-described embodiment will be omitted.

図６は、第４実施形態に係る搬送機構２０の部分上面図である。図６に示すように、本実施形態の搬送ローラ２１は、１本の円筒状のローラ部材５２ではなく、複数のローラ部材５２を有する。複数のローラ部材５２は、幅方向に沿って、等間隔に配列されている。各ローラ部材５２は、シャフト５１の外周面に固定されている。また、各ローラ部材５２は、幅方向に延びる軸Ａに対して傾斜した楕円状の接触部５３を有する。 FIG. 6 is a partial top view of the transport mechanism 20 according to the fourth embodiment. As shown in FIG. 6 , the conveying roller 21 of this embodiment has a plurality of roller members 52 instead of one cylindrical roller member 52 . The plurality of roller members 52 are arranged at regular intervals along the width direction. Each roller member 52 is fixed to the outer peripheral surface of the shaft 51 . Each roller member 52 has an elliptical contact portion 53 inclined with respect to the axis A extending in the width direction.

本実施形態の構造では、接触部５３を有する小型のローラ部材５２を多数作製し、それらをシャフト５１に固定することで、搬送ローラ２１を製造できる。これにより、複数の接触部５３を有する搬送ローラ２１を、より容易に製造できる。 In the structure of the present embodiment, the conveying roller 21 can be manufactured by manufacturing a large number of small roller members 52 having contact portions 53 and fixing them to the shaft 51 . Thereby, the transport roller 21 having a plurality of contact portions 53 can be manufactured more easily.

なお、図６の例では、１つのローラ部材５２が、１つの楕円状の接触部５３を有していた。しかしながら、１つのローラ部材５２が、楕円状の接触部５３を、複数有していてもよい。また、各ローラ部材５２は、螺旋状の接触部５３を有していてもよい。 In addition, in the example of FIG. 6, one roller member 52 has one elliptical contact portion 53 . However, one roller member 52 may have a plurality of elliptical contact portions 53 . Each roller member 52 may also have a spiral contact portion 53 .

＜５．第５実施形態＞
続いて、本発明の第５実施形態について、説明する。なお、以下では、上述した実施形態との相違点を中心に説明する。上述した実施形態と同等の部分については、重複説明を省略する。 <5. Fifth Embodiment>
Next, a fifth embodiment of the present invention will be described. In addition, below, it demonstrates centering around difference with embodiment mentioned above. Duplicate descriptions of parts equivalent to those of the above-described embodiment will be omitted.

図７は、第５実施形態に係る搬送機構２０の部分上面図である。図７に示すように、本実施形態では、複数の搬送ローラ２１が、複数の第１搬送ローラ２１Ｃと、複数の第２搬送ローラ２１Ｄとを含む。第１搬送ローラ２１Ｃおよび第２搬送ローラ２１Ｄは、それぞれ、第４実施形態と同様に、複数のローラ部材５２を有する。複数のローラ部材５２は、幅方向に沿って、等間隔に配列されている。各ローラ部材５２は、幅方向に延びる軸Ａに対して傾斜した楕円状の接触部５３を有する。 FIG. 7 is a partial top view of the transport mechanism 20 according to the fifth embodiment. As shown in FIG. 7, in the present embodiment, the multiple transport rollers 21 include multiple first transport rollers 21C and multiple second transport rollers 21D. The first conveying roller 21C and the second conveying roller 21D each have a plurality of roller members 52 as in the fourth embodiment. The plurality of roller members 52 are arranged at regular intervals along the width direction. Each roller member 52 has an elliptical contact portion 53 inclined with respect to an axis A extending in the width direction.

ただし、本実施形態では、幅方向において、第１搬送ローラ２１Ｃの接触部５３と、第２搬送ローラ２１Ｄの接触部５３とが、交互に配列されている。換言すると、第２搬送ローラ２１Ｄの接触部５３は、第１搬送ローラ２１Ｃの隣り合う接触部５３の間に相当する幅方向の位置に、配置されている。したがって、第１搬送ローラ２１Ｃの接触部５３の幅方向の中心位置と、第２搬送ローラ２１Ｄの接触部５３の幅方向の中心位置とは、軸方向に重ならない。 However, in this embodiment, the contact portions 53 of the first conveying roller 21C and the contact portions 53 of the second conveying roller 21D are alternately arranged in the width direction. In other words, the contact portion 53 of the second conveying roller 21D is arranged at a position in the width direction corresponding to between the adjacent contact portions 53 of the first conveying roller 21C. Therefore, the center position of the contact portion 53 of the first conveying roller 21C in the width direction and the center position of the contact portion 53 of the second conveying roller 21D in the width direction do not overlap in the axial direction.

第１搬送ローラ２１Ｃと第２搬送ローラ２１Ｄとは、搬送方向に沿って、交互に配列されている。このようにすれば、基板９の下面に対する搬送ローラ２１の接触位置を、より均一化できる。したがって、基板９の上面のレジスト膜に、搬送ローラ２１との接触に起因する筋状のムラが生じることを、より抑制できる。 The first transport rollers 21C and the second transport rollers 21D are alternately arranged along the transport direction. In this way, the contact position of the conveying roller 21 with respect to the lower surface of the substrate 9 can be made more uniform. Therefore, the resist film on the upper surface of the substrate 9 can be prevented from streak-like unevenness due to contact with the transport roller 21 .

＜６．第６実施形態＞
続いて、本発明の第６実施形態について、説明する。なお、以下では、上述した実施形態との相違点を中心に説明する。上述した実施形態と同等の部分については、重複説明を省略する。 <6. Sixth Embodiment>
Next, a sixth embodiment of the present invention will be described. In addition, below, it demonstrates centering around difference with embodiment mentioned above. Duplicate descriptions of parts equivalent to those of the above-described embodiment will be omitted.

図８は、第６実施形態に係る搬送機構２０の部分上面図である。本実施形態の搬送ローラ２１は、上述した第４実施形態および第５実施形態と同様に、複数のローラ部材５２を有する。ただし、本実施形態では、各ローラ部材５２が、非接触部５４に相当する部分をもたない、楕円形状の板となっている。このようにすれば、各ローラ部材５２の形状が、より単純化される。したがって、複数のローラ部材５２を，より容易に製造できる。 FIG. 8 is a partial top view of the transport mechanism 20 according to the sixth embodiment. The conveying roller 21 of this embodiment has a plurality of roller members 52 as in the fourth and fifth embodiments described above. However, in this embodiment, each roller member 52 is an elliptical plate that does not have a portion corresponding to the non-contact portion 54 . In this way, the shape of each roller member 52 is simplified. Therefore, the plurality of roller members 52 can be manufactured more easily.

＜７．第７実施形態＞
続いて、本発明の第７実施形態について、説明する。なお、以下では、上述した実施形態との相違点を中心に説明する。上述した実施形態と同等の部分については、重複説明を省略する。 <7. Seventh Embodiment>
Next, a seventh embodiment of the present invention will be described. In addition, below, it demonstrates centering around difference with embodiment mentioned above. Duplicate descriptions of parts equivalent to those of the above-described embodiment will be omitted.

図９は、第７実施形態に係る現像装置１の上面図である。図９に示すように、本実施形態の搬送機構２０は、複数の搬送ローラ２１と、複数の円筒ローラ（ベタローラ）２４とを有する。複数の円筒ローラ２４は、ノズル３１による現像液Ｌの吐出位置から下流側へ向かう所定範囲の領域に、搬送方向に間隔をあけて配列されている。複数の搬送ローラ２１は、基板９の搬送経路のうち、円筒ローラ２４が配置される上記領域以外の領域に、配置されている。複数の搬送ローラ２１および複数の円筒ローラ２４は、ローラ駆動機構２２に接続されている。このため、ローラ駆動機構２２を動作させると、複数の搬送ローラ２１および複数の円筒ローラ２４は、それぞれ、幅方向に延びる軸Ａを中心として回転する。 FIG. 9 is a top view of the developing device 1 according to the seventh embodiment. As shown in FIG. 9 , the transport mechanism 20 of this embodiment has a plurality of transport rollers 21 and a plurality of cylindrical rollers (solid rollers) 24 . The plurality of cylindrical rollers 24 are arranged at intervals in the transport direction in a predetermined range from the ejection position of the developer L by the nozzle 31 toward the downstream side. The plurality of transport rollers 21 are arranged in areas other than the above-mentioned area where the cylindrical rollers 24 are arranged in the transport path of the substrate 9 . A plurality of conveying rollers 21 and a plurality of cylindrical rollers 24 are connected to a roller driving mechanism 22 . Therefore, when the roller driving mechanism 22 is operated, the plurality of conveying rollers 21 and the plurality of cylindrical rollers 24 each rotate around the axis A extending in the width direction.

各円筒ローラ２４のローラ部材の外周面は、幅方向に沿って延びる１本の円筒面となっている。円筒ローラ２４は、その円筒面を、基板９の下面に接触させつつ回転することにより、基板９を下流側へ搬送する。 The outer peripheral surface of the roller member of each cylindrical roller 24 is a single cylindrical surface extending in the width direction. The cylindrical roller 24 conveys the substrate 9 downstream by rotating while keeping its cylindrical surface in contact with the lower surface of the substrate 9 .

円筒ローラ２４は、基板９との接触面積が小さい搬送ローラ２１よりも、基板９を、精度よく水平に支持できる。本実施形態では、このような円筒ローラ２４が、処理液の吐出位置の直後に配置されている、これにより、基板９を精度よく水平に支持しつつ、基板９の上面に、処理液のパドルを形成できる。 The cylindrical roller 24 can horizontally support the substrate 9 more accurately than the transport roller 21 having a small contact area with the substrate 9 . In the present embodiment, such a cylindrical roller 24 is arranged immediately after the ejection position of the treatment liquid. Thereby, while supporting the substrate 9 horizontally with high accuracy, a puddle of the treatment liquid is applied to the upper surface of the substrate 9. can be formed.

なお、図９の例では、ノズル３１による現像液Ｌの吐出位置の直後に、３本の円筒ローラ２４が配置されている。しかしながら、円筒ローラ２４の数は、１～２本であってもよく、４本以上であってもよい。 In the example of FIG. 9, three cylindrical rollers 24 are arranged immediately after the position where the developer L is discharged by the nozzles 31 . However, the number of cylindrical rollers 24 may be one or two, or four or more.

＜８．変形例＞
上記の実施形態では、基板９の上面に処理液としての現像液Ｌを供給する現像装置１について説明した。しかしながら、本発明の基板処理装置は、現像装置１に限定されるものではない。例えば、基板処理装置は、基板の上面に処理液としてのレジスト液を塗布する塗布装置であってもよい。また、基板処理装置は、基板の上面に処理液としてのエッチング液を供給するエッチング装置であってもよい。また、基板処理装置は、基板の上面に処理液としての洗浄液を供給する洗浄装置であってもよい。 <8. Variation>
In the above embodiment, the developing device 1 that supplies the developer L as the processing liquid to the upper surface of the substrate 9 has been described. However, the substrate processing apparatus of the present invention is not limited to the developing device 1 . For example, the substrate processing apparatus may be a coating apparatus that coats the upper surface of the substrate with a resist liquid as a processing liquid. Further, the substrate processing apparatus may be an etching apparatus that supplies an etchant as a processing liquid to the upper surface of the substrate. Further, the substrate processing apparatus may be a cleaning apparatus that supplies a cleaning liquid as a processing liquid onto the upper surface of the substrate.

また、上記の実施形態では、処理対象となる基板９が、有機ＥＬパネル用の基板であった。しかしながら、本発明の基板処理装置において、処理対象となる基板は、液晶パネル用基板、プラズマディスプレイ用基板、太陽電池パネル用基板、光ディスク用基板、半導体ウェハ等の他の基板であってもよい。 Further, in the above embodiment, the substrate 9 to be processed is a substrate for an organic EL panel. However, in the substrate processing apparatus of the present invention, substrates to be processed may be liquid crystal panel substrates, plasma display substrates, solar cell panel substrates, optical disk substrates, semiconductor wafers, and other substrates.

その他、上記の実施形態および変形例に登場した各要素を、矛盾が生じない範囲で、適宜に組み合わせてもよい。 In addition, the respective elements appearing in the above embodiments and modifications may be appropriately combined within a range that does not cause contradiction.

１ 現像装置
９ 基板
１０ チャンバ
１３ 排液孔
２０ 搬送機構
２１ 搬送ローラ
２１Ａ 右巻き搬送ローラ
２１Ｂ 左巻き搬送ローラ
２１Ｃ 第１搬送ローラ
２１Ｄ 第２搬送ローラ
２２ ローラ駆動機構
２３ ガイドローラ
２４ 円筒ローラ
３０ 処理液供給部
３１ ノズル
４０ 制御部
５１ シャフト
５２ ローラ部材
５３ 接触部
５４ 非接触部
Ａ 軸
Ｌ 現像液 Reference Signs List 1 developing device 9 substrate 10 chamber 13 drain hole 20 transport mechanism 21 transport roller 21A right-hand transport roller 21B left-hand transport roller 21C first transport roller 21D second transport roller 22 roller drive mechanism 23 guide roller 24 cylindrical roller 30 treatment liquid supply Part 31 Nozzle 40 Control Part 51 Shaft 52 Roller Member 53 Contact Part 54 Non-Contact Part A Axis L Developer

Claims (9)

基板を搬送しつつ処理液による処理を行う基板処理装置であって、
基板を水平な姿勢に支持しつつ、水平方向である搬送方向に基板を搬送する搬送機構と、
前記搬送機構により搬送される基板の上面に前記処理液を供給することにより、基板の上面に前記処理液のパドルを形成する処理液供給部と、
を備え、
前記搬送機構は、
前記搬送方向に間隔をあけて配列された複数の搬送ローラ
を有し、
前記搬送ローラは、外周面に部分的に形成された接触部を、基板の下面に接触させつつ、前記搬送方向に対して直交する水平方向である幅方向に延びる軸を中心として回転することにより、基板を前記搬送方向の下流側へ搬送し、
前記搬送ローラの外周面において、前記軸を中心とする周方向の位置に応じて、前記接触部の前記幅方向の位置が変化する、基板処理装置。 A substrate processing apparatus that performs processing with a processing liquid while transporting a substrate,
a transport mechanism that transports the substrate in a horizontal transport direction while supporting the substrate in a horizontal position;
a processing liquid supply unit that forms a puddle of the processing liquid on the top surface of the substrate by supplying the processing liquid onto the top surface of the substrate that is transported by the transport mechanism;
with
The transport mechanism is
Having a plurality of transport rollers arranged at intervals in the transport direction,
The conveying roller rotates about an axis extending in the width direction, which is a horizontal direction orthogonal to the conveying direction, while contacting the lower surface of the substrate with a contact portion partially formed on the outer peripheral surface of the conveying roller. , conveying the substrate downstream in the conveying direction;
The substrate processing apparatus, wherein the position of the contact portion in the width direction changes according to the position in the circumferential direction around the axis on the outer peripheral surface of the transport roller. 請求項１に記載の基板処理装置であって、
前記接触部は、前記軸を中心とする螺旋状である、基板処理装置。 The substrate processing apparatus according to claim 1,
The substrate processing apparatus, wherein the contact portion has a spiral shape around the axis. 請求項２に記載の基板処理装置であって、
前記複数の搬送ローラは、
前記接触部が右巻きの螺旋状である複数の右巻き搬送ローラと、
前記接触部が左巻きの螺旋状である複数の左巻き搬送ローラと、
を含み、
前記右巻き搬送ローラと、前記左巻き搬送ローラとが、前記搬送方向に沿って交互に配列されている、基板処理装置。 The substrate processing apparatus according to claim 2,
The plurality of conveying rollers are
a plurality of right-handed conveying rollers in which the contact portion has a right-handed spiral shape;
a plurality of left-handed conveying rollers, the contact portion of which has a left-handed spiral shape;
including
The substrate processing apparatus, wherein the right-handed transport roller and the left-handed transport roller are alternately arranged along the transport direction. 請求項１に記載の基板処理装置であって、
前記搬送ローラは、前記幅方向に配列された複数の前記接触部を有し、
複数の前記接触部は、それぞれ、前記軸に対して傾斜した楕円状である、基板処理装置。 The substrate processing apparatus according to claim 1,
The conveying roller has a plurality of the contact portions arranged in the width direction,
The substrate processing apparatus, wherein each of the plurality of contact portions has an elliptical shape inclined with respect to the axis. 請求項４に記載の基板処理装置であって、
前記搬送ローラは、
前記軸に沿って延びるシャフトと、
前記シャフトに固定された複数のローラ部材と、
を有し、
前記複数のローラ部材が、それぞれ、前記接触部を有する、基板処理装置。 The substrate processing apparatus according to claim 4,
The conveying roller is
a shaft extending along the axis;
a plurality of roller members secured to the shaft;
has
The substrate processing apparatus, wherein each of the plurality of roller members has the contact portion. 請求項４または請求項５に記載の基板処理装置であって、
前記複数の搬送ローラは、
複数の第１搬送ローラと、
複数の第２搬送ローラと、
を含み、
前記第１搬送ローラと、前記第２搬送ローラとが、前記搬送方向に沿って交互に配列され、
前記幅方向において、前記第１搬送ローラの前記接触部と、前記第２搬送ローラの前記接触部とが、交互に配列されている、基板処理装置。 The substrate processing apparatus according to claim 4 or 5,
The plurality of conveying rollers are
a plurality of first transport rollers;
a plurality of second transport rollers;
including
The first conveying roller and the second conveying roller are arranged alternately along the conveying direction,
The substrate processing apparatus, wherein the contact portions of the first transport roller and the contact portions of the second transport roller are alternately arranged in the width direction. 請求項１から請求項６までのいずれか１項に記載の基板処理装置であって、
前記処理液供給部は、
前記処理液を吐出するノズル
を有し、
前記搬送機構は、
前記ノズルによる前記処理液の吐出位置から下流側に配置された１つ以上の円筒ローラ
をさらに有し、
前記円筒ローラは、前記幅方向に沿って延びる１本の円筒面を有し、前記円筒面を基板の下面に接触させつつ、前記幅方向に延びる軸を中心として回転することにより、基板を前記搬送方向の下流側へ搬送する、基板処理装置。 The substrate processing apparatus according to any one of claims 1 to 6,
The processing liquid supply unit
having a nozzle for ejecting the treatment liquid,
The transport mechanism is
further comprising one or more cylindrical rollers arranged downstream from a position where the treatment liquid is discharged from the nozzle;
The cylindrical roller has one cylindrical surface extending along the width direction, and rotates around an axis extending in the width direction while bringing the cylindrical surface into contact with the lower surface of the substrate, thereby moving the substrate to the A substrate processing apparatus that conveys downstream in a conveying direction. 請求項１から請求項７までのいずれか１項に記載の基板処理装置であって、
基板の前記幅方向の端部に接触するガイドローラ
をさらに備える、基板処理装置。 The substrate processing apparatus according to any one of claims 1 to 7,
The substrate processing apparatus, further comprising a guide roller that contacts the edge of the substrate in the width direction. 請求項１から請求項８までのいずれか１項に記載の基板処理装置であって、
前記処理液は、基板の上面に形成されたレジスト膜を現像する現像液である、基板処理装置。 The substrate processing apparatus according to any one of claims 1 to 8,
The substrate processing apparatus, wherein the processing liquid is a developer for developing a resist film formed on the upper surface of the substrate.
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