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JP2022037381A - Cleaning method of workpiece - Google Patents

Cleaning method of workpiece Download PDF

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Publication number
JP2022037381A
JP2022037381A JP2020141489A JP2020141489A JP2022037381A JP 2022037381 A JP2022037381 A JP 2022037381A JP 2020141489 A JP2020141489 A JP 2020141489A JP 2020141489 A JP2020141489 A JP 2020141489A JP 2022037381 A JP2022037381 A JP 2022037381A
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Japan
Prior art keywords
workpiece
cleaning
surface side
cleaning liquid
grinding
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JP2020141489A
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Japanese (ja)
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JP7536400B2 (en
Inventor
友亮 佐藤
Tomoaki Sato
真弘 竹川
Masahiro Takekawa
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Disco Corp
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Disco Abrasive Systems Ltd
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Priority to JP2020141489A priority Critical patent/JP7536400B2/en
Priority to KR1020210094556A priority patent/KR20220026483A/en
Priority to CN202110935728.3A priority patent/CN114121600A/en
Priority to TW110130779A priority patent/TW202208079A/en
Publication of JP2022037381A publication Critical patent/JP2022037381A/en
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Publication of JP7536400B2 publication Critical patent/JP7536400B2/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0023—Other grinding machines or devices grinding machines with a plurality of working posts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B24B37/345—Feeding, loading or unloading work specially adapted to lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/06—Dust extraction equipment on grinding or polishing machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02096—Cleaning only mechanical cleaning
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H01L21/67219—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one polishing chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)

Abstract

To provide a cleaning method of a workpiece which can efficiently remove a cleaning liquid adhering to the workpiece or the like.SOLUTION: A workpiece is cleaned in a processing device by a cleaning method of the workpiece. The processing device includes: a conveying mechanism having a suction pad with a suction surface for sucking and holding an upper surface side of the workpiece; and a cleaning mechanism including a cleaning member which is arranged in a position overlapping a movement path of the suction pad and cleans a lower surface side of the workpiece, and an injection nozzle for injecting a cleaning liquid. The cleaning method includes: a cleaning step for cleaning the lower surface side of the workpiece by injecting the cleaning liquid from the injection nozzle to the lower surface side of the workpiece and moving the cleaning member while contacting with the lower surface side of the workpiece; and a removing step for removing the cleaning liquid adhering to the lower surface side of the workpiece by moving the cleaning member while contacting with the lower surface side of the workpiece in a state where injection of the cleaning liquid from the injection nozzle is stopped.SELECTED DRAWING: Figure 1

Description

本発明は、研削加工等の加工が施された被加工物を洗浄する被加工物の洗浄方法に関する。 The present invention relates to a method for cleaning a workpiece that has been subjected to processing such as grinding.

デバイスチップの製造工程では、互いに交差する複数の分割予定ライン（ストリート）によって区画された複数の領域にそれぞれデバイスが形成されたウェーハが用いられる。このウェーハを分割予定ラインに沿って分割することにより、デバイスをそれぞれ備える複数のデバイスチップが得られる。デバイスチップは、携帯電話、パーソナルコンピュータ等の様々な電子機器に搭載される。 In the device chip manufacturing process, a wafer in which a device is formed in a plurality of regions partitioned by a plurality of planned division lines (streets) intersecting each other is used. By dividing this wafer along a planned division line, a plurality of device chips each including a device can be obtained. Device chips are mounted on various electronic devices such as mobile phones and personal computers.

近年では、電子機器の小型化に伴い、デバイスチップに薄型化が求められている。そこで、分割前のウェーハを研削して薄化する手法が用いられている。ウェーハの研削には、被加工物を保持するチャックテーブルと、被加工物を研削する研削ユニットとを備える研削装置が用いられる。研削ユニットには、複数の研削砥石を有する研削ホイールが装着される。そして、ウェーハをチャックテーブルによって保持し、チャックテーブル及び研削ホイールを回転させつつ研削砥石をウェーハに接触させることにより、ウェーハが研削される。 In recent years, with the miniaturization of electronic devices, there is a demand for thinner device chips. Therefore, a method of grinding and thinning the wafer before division is used. For grinding a wafer, a grinding device including a chuck table for holding a workpiece and a grinding unit for grinding the workpiece is used. The grinding unit is equipped with a grinding wheel having a plurality of grinding wheels. Then, the wafer is ground by holding the wafer by the chuck table and bringing the grinding wheel into contact with the wafer while rotating the chuck table and the grinding wheel.

研削装置でウェーハを研削する際には、まず、ウェーハの表面側に形成されている複数のデバイスが保護テープ等の保護部材によって覆われる。そして、ウェーハの表面側が保護部材を介してチャックテーブルの保持面で保持され、ウェーハの裏面側が研削砥石によって研削される。研削加工中は、ウェーハに形成されているデバイスが保護部材によって保護され、デバイスの損傷が防止される。 When grinding a wafer with a grinding device, first, a plurality of devices formed on the surface side of the wafer are covered with a protective member such as a protective tape. Then, the front surface side of the wafer is held by the holding surface of the chuck table via the protective member, and the back surface side of the wafer is ground by the grinding wheel. During the grinding process, the device formed on the wafer is protected by the protective member to prevent damage to the device.

なお、研削砥石でウェーハを研削すると、研削によって発生した屑（加工屑）が散乱する。そして、加工屑は、ウェーハに固定された保護部材とチャックテーブルの保持面との間に入り込み、保護部材に付着することがある。この場合、研削加工後にウェーハをチャックテーブル上から搬送すると、保護部材に付着した加工屑もウェーハとともに搬送される。その結果、研削装置内で加工屑が拡散し、研削装置の内部が加工屑によって汚染されるおそれがある。 When the wafer is ground with a grinding wheel, the scraps (working scraps) generated by the grinding are scattered. Then, the work chips may enter between the protective member fixed to the wafer and the holding surface of the chuck table and adhere to the protective member. In this case, when the wafer is conveyed from the chuck table after the grinding process, the work chips adhering to the protective member are also conveyed together with the wafer. As a result, work chips may diffuse in the grinding device, and the inside of the grinding device may be contaminated by the work chips.

そこで、研削加工後のウェーハがチャックテーブル上から搬送される際に、ウェーハに固定された保護部材の洗浄が行われることがある。特許文献１には、ウェーハの搬送経路と重なる位置に、ウェーハに貼付された保護テープを洗浄する洗浄機構が設けられた研削装置が開示されている。ウェーハの搬送時に保護テープを洗浄することにより、ウェーハの搬送先が保護テープに付着した加工屑によって汚染されることを防止できる。 Therefore, when the wafer after grinding is conveyed from the chuck table, the protective member fixed to the wafer may be washed. Patent Document 1 discloses a grinding apparatus provided with a cleaning mechanism for cleaning a protective tape attached to a wafer at a position overlapping with a transfer path of the wafer. By cleaning the protective tape during wafer transfer, it is possible to prevent the wafer transfer destination from being contaminated by the work chips adhering to the protective tape.

特開２０１０－９４７８５号公報Japanese Unexamined Patent Publication No. 2010-94785

上記のように、被加工物を加工する加工装置には、被加工物の搬送時に被加工物に固定された保護部材を洗浄する洗浄機構が搭載されることがある。例えば洗浄機構は、保護部材に洗浄液を供給しつつスポンジ等の洗浄部材で保護部材を擦ることにより、保護部材に付着した加工屑を除去する。 As described above, the processing apparatus for processing the workpiece may be equipped with a cleaning mechanism for cleaning the protective member fixed to the workpiece when the workpiece is conveyed. For example, the cleaning mechanism removes processing debris adhering to the protective member by rubbing the protective member with a cleaning member such as a sponge while supplying the cleaning liquid to the protective member.

しかしながら、洗浄液を用いて保護部材を洗浄すると、洗浄後の保護部材に洗浄液が残存する。そして、保護部材に洗浄液が付着したままの状態で被加工物を搬送すると、被加工物の搬送先に洗浄液が混入し、加工装置内の意図しない領域に洗浄液が付着することがある。これにより、加工装置を構成する構成要素の劣化、故障等、様々な不都合が生じ得る。 However, when the protective member is washed with the cleaning liquid, the cleaning liquid remains on the protective member after cleaning. If the workpiece is conveyed with the cleaning liquid still attached to the protective member, the cleaning liquid may be mixed in the transport destination of the workpiece, and the cleaning liquid may adhere to an unintended region in the processing apparatus. As a result, various inconveniences such as deterioration and failure of the components constituting the processing apparatus may occur.

また、保護部材に付着した洗浄液を除去するため、気体の噴射によって保護部材を乾燥させて洗浄液を除去するノズル（乾燥ノズル）が、洗浄後の被加工物の搬送経路と重なる位置に設置されることもある。しかしながら、乾燥ノズルで洗浄液を確実に除去するためには、保護部材が固定された被加工物が乾燥ノズルの上方を通過する際に、ウェーハを減速又は停止させ、保護部材に気体を十分に吹き付ける必要がある。これにより、被加工物の搬送作業が遅延し、加工装置の稼働効率が低下してしまう。 Further, in order to remove the cleaning liquid adhering to the protective member, a nozzle (drying nozzle) for drying the protective member by spraying gas to remove the cleaning liquid is installed at a position overlapping with the transport path of the workpiece after cleaning. Sometimes. However, in order to reliably remove the cleaning liquid with the drying nozzle, the wafer is decelerated or stopped when the workpiece to which the protective member is fixed passes above the drying nozzle, and the protective member is sufficiently blown with gas. There is a need. As a result, the transfer work of the workpiece is delayed, and the operating efficiency of the processing apparatus is lowered.

一方、洗浄液を素早く除去するために、乾燥ノズルから噴出する気体の流量や流速を上げる手法も検討されている。しかしながら、保護部材に気体を強く吹き付けると、保護部材に付着した洗浄液が勢いよく吹き飛ばされて飛散し、加工装置の内部の予期しない領域に洗浄液が付着してしまうおそれがある。 On the other hand, in order to quickly remove the cleaning liquid, a method of increasing the flow rate and the flow velocity of the gas ejected from the drying nozzle is also being studied. However, if the gas is strongly blown onto the protective member, the cleaning liquid adhering to the protective member may be vigorously blown off and scattered, and the cleaning liquid may adhere to an unexpected region inside the processing apparatus.

本発明はかかる問題に鑑みてなされたものであり、被加工物等に付着した洗浄液を効率的に除去することが可能な被加工物の洗浄方法を提供することを目的とする。 The present invention has been made in view of such a problem, and an object of the present invention is to provide a cleaning method for a work piece capable of efficiently removing a cleaning liquid adhering to a work piece or the like.

本発明の一態様によれば、加工装置内で被加工物を洗浄する被加工物の洗浄方法であって、該加工装置は、該被加工物の下面側を保持するチャックテーブルと、該チャックテーブルによって保持された該被加工物の上面側を加工する加工ユニットと、該チャックテーブルによって保持され該加工ユニットによって加工された該被加工物の上面側を吸引保持する吸引面を有する吸引パッドを含む搬送機構と、該吸引パッドの移動経路と重なる位置に設けられ、該被加工物の下面側を洗浄する洗浄部材と、洗浄液を噴射する噴射ノズルと、を含む洗浄機構と、を備え、該噴射ノズルから該被加工物の下面側に該洗浄液を噴射しながら、該洗浄部材を該被加工物の下面側に接触させつつ移動させることにより、該被加工物の下面側を洗浄する洗浄ステップと、該噴射ノズルからの該洗浄液の噴射を停止した状態で、該洗浄部材を該被加工物の下面側に接触させつつ移動させることにより、該被加工物の下面側に付着した該洗浄液を除去する除去ステップと、を備える被加工物の洗浄方法が提供される。 According to one aspect of the present invention, there is a method for cleaning a workpiece in which the workpiece is cleaned in the processing apparatus, wherein the processing apparatus includes a chuck table for holding the lower surface side of the workpiece and the chuck. A suction pad having a processing unit for processing the upper surface side of the workpiece held by the table and a suction surface for suction and holding the upper surface side of the workpiece held by the chuck table and processed by the processing unit. It is provided with a cleaning mechanism including a transport mechanism including, a cleaning member provided at a position overlapping with the movement path of the suction pad and cleaning the lower surface side of the workpiece, and an injection nozzle for injecting a cleaning liquid. A cleaning step of cleaning the lower surface side of the workpiece by moving the cleaning member while injecting the cleaning liquid from the injection nozzle onto the lower surface side of the workpiece while contacting the cleaning member with the lower surface side of the workpiece. Then, in a state where the injection of the cleaning liquid from the injection nozzle is stopped, the cleaning member is moved while being in contact with the lower surface side of the workpiece, so that the cleaning liquid adhered to the lower surface side of the workpiece is removed. A method of cleaning a workpiece comprising a removal step for removing is provided.

なお、好ましくは、該被加工物の下面側には、該被加工物を保護する保護部材が固定されており、該洗浄ステップでは、該保護部材を洗浄し、該除去ステップでは、該保護部材に付着した該洗浄液を除去する。また、好ましくは、該被加工物の洗浄方法は、該除去ステップの実施後に、該被加工物の下面側に気体を噴射して該被加工物を乾燥させる乾燥ステップを更に備える。 It should be noted that preferably, a protective member for protecting the workpiece is fixed on the lower surface side of the workpiece, the protective member is cleaned in the cleaning step, and the protective member is protected in the removal step. The cleaning liquid adhering to the cleaning solution is removed. Further, preferably, the method for cleaning the workpiece further includes a drying step of injecting gas onto the lower surface side of the workpiece to dry the workpiece after performing the removal step.

本発明の一態様に係る被加工物の洗浄方法では、洗浄ステップにおいて被加工物の下面側に付着した洗浄液が、除去ステップで除去される。これにより、洗浄後の被加工物は洗浄液が除去された状態で搬送され、被加工物の搬送先への洗浄液の混入が防止される。その結果、加工装置内の意図しない領域に洗浄液が付着することを回避でき、洗浄液に起因する不都合の発生が抑制される。また、上記の被加工物の洗浄方法では、洗浄ステップの完了後、噴射ノズルからの洗浄液の噴射を停止するのみで、直ちに除去ステップに移行できる。そのため、洗浄液の除去に要する時間を大幅に削減でき、洗浄液の効率的な除去が実現される。 In the method for cleaning a workpiece according to one aspect of the present invention, the cleaning liquid adhering to the lower surface side of the workpiece in the cleaning step is removed in the removal step. As a result, the workpiece after cleaning is transported in a state where the cleaning liquid is removed, and the cleaning liquid is prevented from being mixed into the transport destination of the workpiece. As a result, it is possible to prevent the cleaning liquid from adhering to an unintended region in the processing apparatus, and it is possible to suppress the occurrence of inconvenience caused by the cleaning liquid. Further, in the above-mentioned cleaning method of the workpiece, after the cleaning step is completed, the removal step can be immediately started by simply stopping the injection of the cleaning liquid from the injection nozzle. Therefore, the time required for removing the cleaning liquid can be significantly reduced, and efficient removal of the cleaning liquid is realized.

加工装置を示す斜視図である。It is a perspective view which shows the processing apparatus. 被加工物を示す斜視図である。It is a perspective view which shows the workpiece. 搬送機構を示す一部断面側面図である。It is a partial cross-sectional side view which shows the transport mechanism. 洗浄機構を示す斜視図である。It is a perspective view which shows the cleaning mechanism. 被加工物の下面側を洗浄する洗浄機構を示す一部断面正面図である。It is a partial cross-sectional front view which shows the cleaning mechanism which cleans the lower surface side of a work piece.

以下、添付図面を参照して本発明の一態様に係る実施形態を説明する。まず、本実施形態に係る被加工物の洗浄方法に用いることが可能な加工装置の構成例について説明する。図１は、被加工物を研削する加工装置（研削装置）２を示す斜視図である。なお、図１において、Ｘ軸方向（左右方向、第１水平方向）とＹ軸方向（前後方向、第２水平方向）とは、互いに垂直な方向である。また、Ｚ軸方向（鉛直方向、上下方向、高さ方向）は、Ｘ軸方向及びＹ軸方向と垂直な方向である。 Hereinafter, embodiments according to one aspect of the present invention will be described with reference to the accompanying drawings. First, a configuration example of a processing apparatus that can be used in the method for cleaning a workpiece according to the present embodiment will be described. FIG. 1 is a perspective view showing a processing device (grinding device) 2 for grinding a workpiece. In FIG. 1, the X-axis direction (left-right direction, first horizontal direction) and the Y-axis direction (front-back direction, second horizontal direction) are directions perpendicular to each other. The Z-axis direction (vertical direction, vertical direction, height direction) is a direction perpendicular to the X-axis direction and the Y-axis direction.

加工装置２は、加工装置２を構成する各構成要素を支持及び収容する基台４を備える。基台４の前端部の上面側には、矩形状の開口４ａが設けられている。開口４ａの内部には、加工装置２によって加工される被加工物を搬送する搬送機構（搬送ユニット）６が設けられている。 The processing device 2 includes a base 4 that supports and accommodates each component constituting the processing device 2. A rectangular opening 4a is provided on the upper surface side of the front end portion of the base 4. Inside the opening 4a, a transport mechanism (transport unit) 6 for transporting the workpiece to be machined by the machining device 2 is provided.

搬送機構６の両側には、カセット配置領域８ａ，８ｂが設けられている。カセット配置領域８ａ，８ｂ上にはそれぞれ、複数の被加工物を収容可能なカセット１０ａ，１０ｂが配置される。カセット１０ａには、加工装置２によって加工される予定の複数の被加工物（未加工の被加工物）が収容される。一方、カセット１０ｂには、加工装置２によって加工された複数の被加工物（加工済みの被加工物）が収容される。 Cassette arrangement areas 8a and 8b are provided on both sides of the transport mechanism 6. Cassettes 10a and 10b capable of accommodating a plurality of workpieces are arranged on the cassette arrangement areas 8a and 8b, respectively. The cassette 10a accommodates a plurality of workpieces (unprocessed workpieces) to be processed by the processing apparatus 2. On the other hand, the cassette 10b accommodates a plurality of workpieces (processed workpieces) processed by the processing apparatus 2.

図２は、被加工物１１を示す斜視図である。被加工物１１は、例えばシリコン等の半導体材料でなる円盤状のウェーハであり、互いに概ね平行な表面（第１面）１１ａ及び裏面（第２面）１１ｂを備える。被加工物１１は、互いに交差するように格子状に配列された複数の分割予定ライン（ストリート）１３によって、複数の矩形状の領域に区画されている。また、分割予定ライン１３によって区画された複数の領域の表面１１ａ側にはそれぞれ、ＩＣ（Integrated Circuit）、ＬＳＩ（Large Scale Integration）、ＬＥＤ（Light Emitting Diode）、ＭＥＭＳ（Micro Electro Mechanical Systems）等のデバイス１５が形成されている。 FIG. 2 is a perspective view showing the workpiece 11. The workpiece 11 is a disk-shaped wafer made of a semiconductor material such as silicon, and has a front surface (first surface) 11a and a back surface (second surface) 11b that are substantially parallel to each other. The workpiece 11 is divided into a plurality of rectangular regions by a plurality of scheduled division lines (streets) 13 arranged in a grid pattern so as to intersect each other. Further, IC (Integrated Circuit), LSI (Large Scale Integration), LED (Light Emitting Diode), MEMS (Micro Electro Mechanical Systems), etc. are located on the surface 11a side of the plurality of regions partitioned by the planned division line 13, respectively. The device 15 is formed.

なお、被加工物１１の材質、形状、構造、大きさ等に制限はない。例えば被加工物１１は、シリコン以外の半導体（ＧａＡｓ、ＩｎＰ、ＧａＮ、ＳｉＣ等）、サファイア、ガラス、セラミックス等でなる基板（ウェーハ）であってもよい。また、デバイス１５の種類、数量、形状、構造、大きさ、配置等にも制限はなく、被加工物１１にはデバイス１５が形成されていなくてもよい。 There are no restrictions on the material, shape, structure, size, etc. of the workpiece 11. For example, the workpiece 11 may be a substrate (wafer) made of a semiconductor other than silicon (GaAs, InP, GaN, SiC, etc.), sapphire, glass, ceramics, or the like. Further, there are no restrictions on the type, quantity, shape, structure, size, arrangement, etc. of the device 15, and the device 15 may not be formed on the workpiece 11.

被加工物１１を分割予定ライン１３に沿って分割すると、デバイス１５をそれぞれ備える複数のデバイスチップが製造される。また、被加工物１１の分割前に加工装置２（図１参照）によって被加工物１１を研削して薄化することにより、薄型化されたデバイスチップを得ることが可能となる。例えば、加工装置２によって被加工物１１の裏面１１ｂ側が研削される。 When the workpiece 11 is divided along the scheduled division line 13, a plurality of device chips each including the device 15 are manufactured. Further, by grinding and thinning the workpiece 11 by the processing apparatus 2 (see FIG. 1) before dividing the workpiece 11, it is possible to obtain a thin device chip. For example, the back surface 11b side of the workpiece 11 is ground by the processing device 2.

加工装置２によって被加工物１１を研削する際には、被加工物１１の表面１１ａ側に保護部材１７が固定される。保護部材１７としては、柔軟なフィルム状のテープ（保護テープ）等が用いられる。保護テープは、被加工物１１と概ね同径に形成された円形の基材と、基材上に設けられた粘着層（糊層）とを含む。例えば、基材はポリオレフィン、ポリ塩化ビニル、ポリエチレンテレフタラート等の樹脂でなり、粘着層はエポキシ系、アクリル系、又はゴム系の接着剤等でなる。また、粘着層として、紫外線の照射によって硬化する紫外線硬化型の樹脂を用いてもよい。 When the workpiece 11 is ground by the processing apparatus 2, the protective member 17 is fixed to the surface 11a side of the workpiece 11. As the protective member 17, a flexible film-shaped tape (protective tape) or the like is used. The protective tape includes a circular base material formed having substantially the same diameter as the workpiece 11 and an adhesive layer (glue layer) provided on the base material. For example, the base material is made of a resin such as polyolefin, polyvinyl chloride, or polyethylene terephthalate, and the adhesive layer is made of an epoxy-based, acrylic-based, or rubber-based adhesive. Further, as the adhesive layer, an ultraviolet curable resin that is cured by irradiation with ultraviolet rays may be used.

保護部材１７は、被加工物１１の表面１１ａ側の全体を覆うように、被加工物１１に貼付され、固定される。これにより、複数のデバイス１５が保護部材１７によって覆われて保護される。そして、被加工物１１は、保護部材１７が固定された状態でカセット１０ａ（図１参照）に収容される。例えば被加工物１１は、表面１１ａ側（保護部材１７側）が上方を向き、裏面１１ｂ側が下方を向くように、カセット１０ａ内に配置される。そして、複数の被加工物１１を収容したカセット１０ａが、カセット配置領域８ａ上に配置される。 The protective member 17 is attached and fixed to the workpiece 11 so as to cover the entire surface 11a side of the workpiece 11. As a result, the plurality of devices 15 are covered and protected by the protective member 17. Then, the workpiece 11 is housed in the cassette 10a (see FIG. 1) with the protective member 17 fixed. For example, the workpiece 11 is arranged in the cassette 10a so that the front surface 11a side (protective member 17 side) faces upward and the back surface 11b side faces downward. Then, the cassette 10a containing the plurality of workpieces 11 is arranged on the cassette arrangement area 8a.

開口４ａの斜め後方には、位置合わせ機構（アライメント機構）１２が設けられている。カセット１０ａに収容された被加工物１１は、搬送機構６によって位置合わせ機構１２に搬送される。具体的には、まず、カセット１０ａに収容されている被加工物１１の下面側（裏面１１ｂ側）が搬送機構６の先端部（吸引パッド）によって吸引され、被加工物１１がカセット１０ａから引き出される。次に、搬送機構６の先端部が回転して、被加工物１１の上下が反転する。その後、搬送機構６は、被加工物１１を裏面１１ｂ側が上方に露出するように位置合わせ機構１２上に配置する。そして、位置合わせ機構１２は被加工物１１を所定の位置に合わせて配置する。 An alignment mechanism (alignment mechanism) 12 is provided diagonally behind the opening 4a. The workpiece 11 housed in the cassette 10a is conveyed to the alignment mechanism 12 by the conveying mechanism 6. Specifically, first, the lower surface side (back surface 11b side) of the workpiece 11 housed in the cassette 10a is sucked by the tip end portion (suction pad) of the transport mechanism 6, and the workpiece 11 is pulled out from the cassette 10a. Is done. Next, the tip of the transport mechanism 6 rotates, and the workpiece 11 is turned upside down. After that, the transport mechanism 6 arranges the workpiece 11 on the alignment mechanism 12 so that the back surface 11b side is exposed upward. Then, the alignment mechanism 12 arranges the workpiece 11 in a predetermined position.

位置合わせ機構１２に隣接する位置には、被加工物１１を搬送する搬送機構（搬送ユニット、ローディングアーム）１４が設けられている。搬送機構１４は、位置合わせ機構１２によって位置合わせが行われた被加工物１１の上面側（裏面１１ｂ側）を保持した状態で旋回し、被加工物１１を後方に搬送する。 A transport mechanism (transport unit, loading arm) 14 for transporting the workpiece 11 is provided at a position adjacent to the alignment mechanism 12. The transport mechanism 14 turns while holding the upper surface side (back surface 11b side) of the workpiece 11 aligned by the alignment mechanism 12, and transports the workpiece 11 to the rear.

基台４の上面側のうち搬送機構１４の後方に位置する領域には、矩形状の開口４ｂが設けられている。開口４ｂの内部には、円盤状のターンテーブル１６が設けられている。ターンテーブル１６にはモータ等の回転駆動源（不図示）が連結されており、回転駆動源はターンテーブル１６をＺ軸方向に概ね平行な回転軸の周りで回転させる。 A rectangular opening 4b is provided in a region of the upper surface side of the base 4 located behind the transport mechanism 14. A disk-shaped turntable 16 is provided inside the opening 4b. A rotation drive source (not shown) such as a motor is connected to the turntable 16, and the rotation drive source rotates the turntable 16 around a rotation axis substantially parallel to the Z-axis direction.

ターンテーブル１６上には、被加工物１１を保持する複数のチャックテーブル（保持テーブル）１８が設けられている。図１には、３個のチャックテーブル１８がターンテーブル１６の周方向に沿って概ね等間隔に配置されている例を示している。ただし、チャックテーブル１８の数及び配置に制限はない。 A plurality of chuck tables (holding tables) 18 for holding the workpiece 11 are provided on the turntable 16. FIG. 1 shows an example in which three chuck tables 18 are arranged at substantially equal intervals along the circumferential direction of the turntable 16. However, there is no limit to the number and arrangement of the chuck tables 18.

チャックテーブル１８の上面は、被加工物１１を保持する平坦な保持面１８ａを構成している。例えば保持面１８ａは、被加工物１１の形状に対応して円形に形成される。保持面１８ａは、チャックテーブル１８の内部に形成された流路（不図示）、バルブ（不図示）を介して、エジェクタ等の吸引源に接続されている。また、チャックテーブル１８にはそれぞれ、モータ等の回転駆動源（不図示）が連結されている。回転駆動源は、チャックテーブル１８をＺ軸方向に概ね平行な回転軸の周りで回転させる。 The upper surface of the chuck table 18 constitutes a flat holding surface 18a for holding the workpiece 11. For example, the holding surface 18a is formed in a circular shape corresponding to the shape of the workpiece 11. The holding surface 18a is connected to a suction source such as an ejector via a flow path (not shown) and a valve (not shown) formed inside the chuck table 18. Further, a rotation drive source (not shown) such as a motor is connected to each of the chuck tables 18. The rotation drive source rotates the chuck table 18 around a rotation axis that is substantially parallel to the Z-axis direction.

ターンテーブル１６は、平面視で反時計回りに回転する。これにより、各チャックテーブル１８が、搬送位置Ａ、第１研削位置（粗研削位置）Ｂ、第２研削位置（仕上げ研削位置）Ｃ、搬送位置Ａの順に位置付けられる。 The turntable 16 rotates counterclockwise in a plan view. As a result, each chuck table 18 is positioned in the order of transfer position A, first grinding position (coarse grinding position) B, second grinding position (finish grinding position) C, and transfer position A.

ターンテーブル１６の後方には、直方体状の支持構造２０が配置されている。支持構造２０の前面側には、一対の移動機構（移動ユニット）２２ａ，２２ｂが固定されている。なお、移動機構２２ａは第１研削位置Ｂに配置されたチャックテーブル１８の後方に配置され、移動機構２２ｂは第２研削位置Ｃに配置されたチャックテーブル１８の後方に配置されている。 A rectangular parallelepiped support structure 20 is arranged behind the turntable 16. A pair of moving mechanisms (moving units) 22a and 22b are fixed to the front surface side of the support structure 20. The moving mechanism 22a is arranged behind the chuck table 18 arranged at the first grinding position B, and the moving mechanism 22b is arranged behind the chuck table 18 arranged at the second grinding position C.

移動機構２２ａ，２２ｂはそれぞれ、Ｚ軸方向と概ね平行に配置された一対のガイドレール２４を備える。一対のガイドレール２４には、板状の移動プレート２６がガイドレール２４に沿ってスライド可能な状態で装着されている。移動プレート２６の後面側（裏面側）にはナット部（不図示）が設けられており、このナット部には、ガイドレール２４と概ね平行に配置されたボールねじ２８が螺合されている。また、ボールねじ２８の端部には、パルスモータ３０が連結されている。パルスモータ３０でボールねじ２８を回転させると、移動プレート２６がＺ軸方向に沿って移動する。 Each of the moving mechanisms 22a and 22b includes a pair of guide rails 24 arranged substantially parallel to the Z-axis direction. A plate-shaped moving plate 26 is attached to the pair of guide rails 24 in a slidable state along the guide rails 24. A nut portion (not shown) is provided on the rear surface side (rear surface side) of the moving plate 26, and a ball screw 28 arranged substantially parallel to the guide rail 24 is screwed into the nut portion. Further, a pulse motor 30 is connected to the end of the ball screw 28. When the ball screw 28 is rotated by the pulse motor 30, the moving plate 26 moves along the Z-axis direction.

移動機構２２ａの移動プレート２６の前面側（表面側）には、被加工物１１の粗研削を行う加工ユニット（研削ユニット）３４ａを支持する支持具３２が固定されている。一方、移動機構２２ｂの移動プレート２６の前面側（表面側）には、被加工物１１の仕上げ研削を行う加工ユニット（研削ユニット）３４ｂを支持する支持具３２が固定されている。移動機構２２ａの移動プレート２６を昇降させると、加工ユニット３４ａがＺ軸方向に沿って移動する。また、移動機構２２ｂの移動プレート２６を昇降させると、加工ユニット３４ｂがＺ軸方向に沿って移動する。 A support 32 that supports a processing unit (grinding unit) 34a for rough grinding the workpiece 11 is fixed to the front surface side (front surface side) of the moving plate 26 of the moving mechanism 22a. On the other hand, a support 32 that supports a processing unit (grinding unit) 34b for finish grinding the workpiece 11 is fixed to the front surface side (front surface side) of the moving plate 26 of the moving mechanism 22b. When the moving plate 26 of the moving mechanism 22a is moved up and down, the machining unit 34a moves along the Z-axis direction. Further, when the moving plate 26 of the moving mechanism 22b is moved up and down, the machining unit 34b moves along the Z-axis direction.

加工ユニット３４ａ，３４ｂはそれぞれ、支持具３２によって支持された円柱状のハウジング３６を備える。ハウジング３６には、Ｚ軸方向に沿って配置された円柱状のスピンドル３８が収容されている。スピンドル３８の先端部（下端部）はハウジング３６から露出しており、スピンドル３８の下端部には金属等でなる円盤状のマウント４０が固定されている。また、スピンドル３８の基端部（上端部）にはモータ等の回転駆動源（不図示）が連結されており、回転駆動源はスピンドル３８をＺ軸方向と概ね平行な回転軸の周りで回転させる。 The processing units 34a and 34b each include a columnar housing 36 supported by a support 32. The housing 36 houses a columnar spindle 38 arranged along the Z-axis direction. The tip end portion (lower end portion) of the spindle 38 is exposed from the housing 36, and a disk-shaped mount 40 made of metal or the like is fixed to the lower end portion of the spindle 38. Further, a rotation drive source (not shown) such as a motor is connected to the base end portion (upper end portion) of the spindle 38, and the rotation drive source rotates the spindle 38 around a rotation axis substantially parallel to the Z-axis direction. Let me.

加工ユニット３４ａのマウント４０の下面側には、粗研削用の研削ホイール４２ａが装着される。また、加工ユニット３４ｂのマウント４０の下面側には、仕上げ研削用の研削ホイール４２ｂが装着される。研削ホイール４２ａ，４２ｂは、回転駆動源からスピンドル３８及びマウント４０を介して伝達される動力によって、Ｚ軸方向と概ね平行な回転軸の周りを回転する。 A grinding wheel 42a for rough grinding is mounted on the lower surface side of the mount 40 of the processing unit 34a. Further, a grinding wheel 42b for finish grinding is mounted on the lower surface side of the mount 40 of the processing unit 34b. The grinding wheels 42a and 42b rotate around a rotation axis substantially parallel to the Z-axis direction by the power transmitted from the rotation drive source via the spindle 38 and the mount 40.

研削ホイール４２ａは、金属等でなりマウント４０と概ね同径に形成された環状の基台を備える。また、基台の下面側には、複数の直方体状の研削砥石が固定されている。複数の研削砥石は、基台の周方向に沿って環状に配列されている。 The grinding wheel 42a includes an annular base made of metal or the like and formed to have substantially the same diameter as the mount 40. Further, a plurality of rectangular parallelepiped grinding wheels are fixed to the lower surface side of the base. The plurality of grinding wheels are arranged in an annular shape along the circumferential direction of the base.

例えば研削砥石は、ダイヤモンド、ｃＢＮ（cubic Boron Nitride）等でなる砥粒を、メタルボンド、レジンボンド、ビトリファイドボンド等の結合材で固定することによって形成される。ただし、研削砥石の材質、形状、構造、大きさ等に制限はなく、研削砥石の個数も任意に設定できる。 For example, a grinding wheel is formed by fixing abrasive grains made of diamond, cBN (cubic Boron Nitride) or the like with a binder such as a metal bond, a resin bond or a vitrified bond. However, there are no restrictions on the material, shape, structure, size, etc. of the grinding wheel, and the number of grinding wheels can be set arbitrarily.

研削ホイール４２ｂも、研削ホイール４２ａと同様に構成される。ただし、研削ホイール４２ｂの研削砥石に含まれる砥粒の平均粒径は、研削ホイール４２ａの研削砥石に含まれる砥粒の平均粒径よりも小さい。 The grinding wheel 42b is also configured in the same manner as the grinding wheel 42a. However, the average particle size of the abrasive grains contained in the grinding wheel of the grinding wheel 42b is smaller than the average particle size of the abrasive grains contained in the grinding wheel of the grinding wheel 42a.

加工ユニット３４ａは、第１研削位置Ｂに位置付けられたチャックテーブル１８によって保持された被加工物１１を、研削ホイール４２ａで研削する。これにより、被加工物１１に粗研削が施される。また、加工ユニット３４ｂは、第２研削位置Ｃに位置付けられたチャックテーブル１８によって保持された被加工物１１を、研削ホイール４２ｂで研削する。これにより、被加工物１１に仕上げ研削が施される。 The machining unit 34a grinds the workpiece 11 held by the chuck table 18 positioned at the first grinding position B with the grinding wheel 42a. As a result, the workpiece 11 is roughly ground. Further, the machining unit 34b grinds the workpiece 11 held by the chuck table 18 positioned at the second grinding position C with the grinding wheel 42b. As a result, the workpiece 11 is subjected to finish grinding.

加工ユニット３４ａ，３４ｂの内部又は近傍にはそれぞれ、純水等の液体（研削液）を供給するための研削液供給路（不図示）が設けられている。研削液は、被加工物１１に研削加工を施す際に、被加工物１１及び研削砥石に供給される。 A grinding liquid supply path (not shown) for supplying a liquid (grinding liquid) such as pure water is provided inside or in the vicinity of the processing units 34a and 34b, respectively. The grinding fluid is supplied to the workpiece 11 and the grinding wheel when the workpiece 11 is ground.

位置合わせ機構１２によって位置合わせが行われた被加工物１１（図２参照）は、搬送機構１４によって搬送位置Ａに配置されたチャックテーブル１８上に搬送される。そして、チャックテーブル１８の保持面１８ａに吸引源の負圧を作用させると、被加工物１１の表面１１ａ側が保護部材１７を介してチャックテーブル１８によって吸引保持される。 The workpiece 11 (see FIG. 2) aligned by the alignment mechanism 12 is conveyed onto the chuck table 18 arranged at the transfer position A by the transfer mechanism 14. Then, when the negative pressure of the suction source is applied to the holding surface 18a of the chuck table 18, the surface 11a side of the workpiece 11 is sucked and held by the chuck table 18 via the protective member 17.

次に、ターンテーブル１６が回転し、被加工物１１を保持しているチャックテーブル１８が第１研削位置Ｂに位置付けられる。そして、チャックテーブル１８と研削ホイール４２ａとをそれぞれ回転させながら、研削ホイール４２ａをチャックテーブル１８側に向かって下降させる。研削ホイール４２ａの研削砥石が被加工物１１の上面側（裏面１１ｂ側）に接触すると、被加工物１１の裏面１１ｂが削り取られ、被加工物１１に粗研削が施される。 Next, the turntable 16 rotates, and the chuck table 18 holding the workpiece 11 is positioned at the first grinding position B. Then, the grinding wheel 42a is lowered toward the chuck table 18 while rotating the chuck table 18 and the grinding wheel 42a, respectively. When the grinding wheel of the grinding wheel 42a comes into contact with the upper surface side (back surface 11b side) of the workpiece 11, the back surface 11b of the workpiece 11 is scraped off and the workpiece 11 is roughly ground.

次に、ターンテーブル１６が回転し、被加工物１１を保持しているチャックテーブル１８が第２研削位置Ｃに位置付けられる。そして、チャックテーブル１８と研削ホイール４２ｂとをそれぞれ回転させながら、研削ホイール４２ｂをチャックテーブル１８側に向かって下降させる。研削ホイール４２ｂの研削砥石が被加工物１１の上面側（裏面１１ｂ側）に接触すると、被加工物１１の裏面１１ｂが削り取られ、被加工物１１に仕上げ研削が施される。 Next, the turntable 16 rotates, and the chuck table 18 holding the workpiece 11 is positioned at the second grinding position C. Then, the grinding wheel 42b is lowered toward the chuck table 18 while rotating the chuck table 18 and the grinding wheel 42b, respectively. When the grinding wheel of the grinding wheel 42b comes into contact with the upper surface side (back surface 11b side) of the workpiece 11, the back surface 11b of the workpiece 11 is scraped off, and the workpiece 11 is subjected to finish grinding.

上記のように、加工ユニット３４ａ，３４ｂによって被加工物１１の上面側が加工され、被加工物１１が所定の厚さまで薄化される。なお、研削加工中は、被加工物１１の研削によって発生した屑（加工屑）が散乱する。そして、加工屑は、被加工物１１に固定された保護部材１７（図２参照）とチャックテーブル１８の保持面１８ａとの間に入り込み、保護部材１７に付着することがある。その後、ターンテーブル１６が回転し、被加工物１１を保持しているチャックテーブル１８が再度搬送位置Ａに位置付けられる。 As described above, the upper surface side of the workpiece 11 is machined by the machining units 34a and 34b, and the workpiece 11 is thinned to a predetermined thickness. During the grinding process, the debris (machined debris) generated by grinding the workpiece 11 is scattered. Then, the work chips may enter between the protective member 17 (see FIG. 2) fixed to the workpiece 11 and the holding surface 18a of the chuck table 18 and adhere to the protective member 17. After that, the turntable 16 rotates, and the chuck table 18 holding the workpiece 11 is repositioned at the transport position A.

搬送機構１４とＸ軸方向において隣接する位置には、被加工物１１を搬送する搬送機構（搬送ユニット、アンローディングアーム）４４が設けられている。搬送機構４４は、搬送位置Ａに配置されたチャックテーブル１８によって保持されている被加工物１１の上面側（裏面１１ｂ側）を保持した状態で旋回し、被加工物１１を前方に搬送する。 A transport mechanism (transport unit, unloading arm) 44 for transporting the workpiece 11 is provided at a position adjacent to the transport mechanism 14 in the X-axis direction. The transport mechanism 44 turns while holding the upper surface side (back surface 11b side) of the workpiece 11 held by the chuck table 18 arranged at the transport position A, and transports the workpiece 11 forward.

搬送機構４４の前方側には、搬送機構４４によって搬送された被加工物１１の上面側を洗浄する洗浄機構（洗浄ユニット）４６が配置されている。搬送機構４４によって保持された被加工物１１は、洗浄機構４６に搬送されて洗浄される。そして、洗浄機構４６によって洗浄された被加工物１１は、搬送機構６によって搬送され、カセット１０ｂに収容される。 A cleaning mechanism (cleaning unit) 46 for cleaning the upper surface side of the workpiece 11 transported by the transport mechanism 44 is arranged on the front side of the transport mechanism 44. The workpiece 11 held by the transport mechanism 44 is transported to the cleaning mechanism 46 for cleaning. Then, the workpiece 11 cleaned by the cleaning mechanism 46 is conveyed by the conveying mechanism 6 and accommodated in the cassette 10b.

また、開口４ｂの内部には、被加工物１１の下面側を洗浄する洗浄機構（洗浄ユニット）４８と、被加工物１１を乾燥させるための気体を噴射する乾燥ノズル５０とが設けられている。洗浄機構４８及び乾燥ノズル５０は、搬送機構４４によって搬送される被加工物１１の移動経路と重なる位置に配置されている。なお、洗浄機構４８及び乾燥ノズル５０の構成及び機能の詳細については後述する。 Further, inside the opening 4b, a cleaning mechanism (cleaning unit) 48 for cleaning the lower surface side of the workpiece 11 and a drying nozzle 50 for injecting a gas for drying the workpiece 11 are provided. .. The cleaning mechanism 48 and the drying nozzle 50 are arranged at positions that overlap with the movement path of the workpiece 11 transported by the transport mechanism 44. The details of the configuration and function of the cleaning mechanism 48 and the drying nozzle 50 will be described later.

基台４の前端部の上面側には、加工装置２に情報を入力するための入力ユニット（入力部）５２が設けられている。例えば、入力ユニット５２は操作パネルによって構成され、オペレーターは入力ユニット５２を操作して加工装置２に加工条件等の情報を入力できる。 An input unit (input unit) 52 for inputting information to the processing apparatus 2 is provided on the upper surface side of the front end portion of the base 4. For example, the input unit 52 is composed of an operation panel, and the operator can operate the input unit 52 to input information such as machining conditions to the machining device 2.

また、加工装置２は、加工装置２を構成する各構成要素（搬送機構６、位置合わせ機構１２、搬送機構１４、ターンテーブル１６、チャックテーブル１８、移動機構２２ａ，２２ｂ、加工ユニット３４ａ，３４ｂ、搬送機構４４、洗浄機構４６、洗浄機構４８、乾燥ノズル５０、入力ユニット５２等）に接続された制御ユニット（制御部）５４を備える。制御ユニット５４によって、加工装置２の構成要素の動作が制御される。 Further, the processing device 2 includes each component (transfer mechanism 6, alignment mechanism 12, transfer mechanism 14, turntable 16, chuck table 18, moving mechanisms 22a, 22b, processing units 34a, 34b, etc.) constituting the processing device 2. A control unit (control unit) 54 connected to a transport mechanism 44, a cleaning mechanism 46, a cleaning mechanism 48, a drying nozzle 50, an input unit 52, etc.) is provided. The control unit 54 controls the operation of the components of the processing apparatus 2.

例えば制御ユニット５４は、コンピュータによって構成され、加工装置２の稼働に必要な演算を行う演算部と、演算部による演算に用いられる各種の情報（データ、プログラム等）を記憶する記憶部とを含む。演算部は、ＣＰＵ（Central Processing Unit）等のプロセッサを含んで構成される。また、記憶部は、主記憶装置、補助記憶装置等として機能する各種のメモリを含んで構成される。制御ユニット５４は、記憶部に記憶されたプログラムを実行することにより、加工装置２の構成要素を制御するための制御信号を生成する。 For example, the control unit 54 includes a calculation unit that is configured by a computer and performs calculations necessary for operating the processing device 2, and a storage unit that stores various information (data, programs, etc.) used for the calculation by the calculation unit. .. The arithmetic unit includes a processor such as a CPU (Central Processing Unit). Further, the storage unit is configured to include various memories that function as a main storage device, an auxiliary storage device, and the like. The control unit 54 generates a control signal for controlling the components of the processing apparatus 2 by executing the program stored in the storage unit.

次に、加工装置２に搭載された搬送機構４４及び洗浄機構４８の詳細について説明する。図３は、搬送機構４４を示す一部断面側面図である。 Next, the details of the transport mechanism 44 and the cleaning mechanism 48 mounted on the processing device 2 will be described. FIG. 3 is a partial cross-sectional side view showing the transport mechanism 44.

搬送機構４４は、Ｌ字状のアーム６０を備える。アーム６０は、Ｚ軸方向に沿って配置された円柱状の基部６２と、基部６２の上端側から水平方向に突出するバー状の支持部６４とを備える。基部６２の下端側は、アーム６０をＺ軸方向に沿って昇降させる昇降機構６６に連結されている。例えば、昇降機構６６としてエアシリンダ等を用いることができる。また、昇降機構６６の下端側は、アーム６０及び昇降機構６６をＺ軸方向と概ね平行な回転軸の周りで双方向に回転させる、モータ等の回転駆動源６８が連結されている。 The transport mechanism 44 includes an L-shaped arm 60. The arm 60 includes a columnar base portion 62 arranged along the Z-axis direction and a bar-shaped support portion 64 projecting horizontally from the upper end side of the base portion 62. The lower end side of the base 62 is connected to an elevating mechanism 66 that elevates and elevates the arm 60 along the Z-axis direction. For example, an air cylinder or the like can be used as the elevating mechanism 66. Further, a rotation drive source 68 such as a motor that rotates the arm 60 and the elevating mechanism 66 in both directions around a rotation axis substantially parallel to the Z-axis direction is connected to the lower end side of the elevating mechanism 66.

アーム６０の支持部６４は、その内部に支持部６４の長さ方向に沿って設けられた円柱状の開口部６４ａを備える。また、支持部６４の先端部には、支持部６４を上下に貫通する円柱状の貫通孔６４ｂが設けられており、開口部６４ａの先端部は貫通孔６４ｂに接続されている。さらに、支持部６４の先端部の上端側には、貫通孔６４ｂに接続された円柱状の溝６４ｃが形成されている。溝６４ｃは、貫通孔６４ｂよりも直径が大きく、支持部６４の上端で開口している。 The support portion 64 of the arm 60 includes a columnar opening 64a provided inside the support portion 64 along the length direction of the support portion 64. Further, the tip portion of the support portion 64 is provided with a columnar through hole 64b that vertically penetrates the support portion 64, and the tip portion of the opening portion 64a is connected to the through hole 64b. Further, a columnar groove 64c connected to the through hole 64b is formed on the upper end side of the tip portion of the support portion 64. The groove 64c has a larger diameter than the through hole 64b and opens at the upper end of the support portion 64.

支持部６４の先端部には、被加工物１１を保持する吸引パッド７０が装着されている。回転駆動源６８によってアーム６０を回転させると、搬送位置Ａに配置されたチャックテーブル１８（図１参照）と洗浄機構４６（図１参照）との間で、吸引パッド７０が水平方向（ＸＹ平面方向）に沿って移動する。このとき吸引パッド７０は、アーム６０の基部６２を回転軸として、円弧状の移動経路に沿って移動する。 A suction pad 70 for holding the workpiece 11 is attached to the tip of the support portion 64. When the arm 60 is rotated by the rotation drive source 68, the suction pad 70 is moved in the horizontal direction (XY plane) between the chuck table 18 (see FIG. 1) and the cleaning mechanism 46 (see FIG. 1) arranged at the transport position A. Move along the direction). At this time, the suction pad 70 moves along the arcuate movement path with the base 62 of the arm 60 as the rotation axis.

吸引パッド７０は、金属等でなる基台７２を備える。基台７２は、円盤状の本体部（枠体）７４と、本体部７４の中央部の上面側から上方に突出する円柱状の支持部（支持軸）７６とを備える。本体部７４の中央部の下面側には、円柱状の凹部７４ａが設けられている。そして、凹部７４ａには、ポーラスセラミックス等のポーラス部材でなる円盤状の吸引部材７８が嵌め込まれている。吸引部材７８の下面は、被加工物１１の上面側を吸引保持する吸引面７８ａを構成する。 The suction pad 70 includes a base 72 made of metal or the like. The base 72 includes a disk-shaped main body portion (frame body) 74 and a columnar support portion (support shaft) 76 projecting upward from the upper surface side of the central portion of the main body portion 74. A columnar recess 74a is provided on the lower surface side of the central portion of the main body portion 74. A disk-shaped suction member 78 made of a porous member such as porous ceramics is fitted in the recess 74a. The lower surface of the suction member 78 constitutes a suction surface 78a that sucks and holds the upper surface side of the workpiece 11.

支持部７６の上端側は、アーム６０の支持部６４に設けられた貫通孔６４ｂに挿入されている。また、支持部７６の上端部には、支持部７６の外周面から支持部７６の半径方向外側に突出する円盤状の突起部７６ａが設けられている。支持部６４の溝６４ｃに突起部７６ａが嵌め込まれることにより、吸引パッド７０がアーム６０に装着される。 The upper end side of the support portion 76 is inserted into a through hole 64b provided in the support portion 64 of the arm 60. Further, a disk-shaped protrusion 76a is provided at the upper end of the support portion 76 so as to protrude outward in the radial direction of the support portion 76 from the outer peripheral surface of the support portion 76. The suction pad 70 is attached to the arm 60 by fitting the protrusion 76a into the groove 64c of the support portion 64.

吸引パッド７０がアーム６０に装着されると、吸引部材７８は、基台７２の内部に形成された流路７２ａを介して、アーム６０の開口部６４ａに設けられた配管８０に接続される。配管８０は、例えばフレキシブルパイプ等の可撓性を有するチューブであり、バルブ（不図示）を介してエジェクタ等の吸引源（不図示）に接続されている。 When the suction pad 70 is attached to the arm 60, the suction member 78 is connected to the pipe 80 provided in the opening 64a of the arm 60 via the flow path 72a formed inside the base 72. The pipe 80 is a flexible tube such as a flexible pipe, and is connected to a suction source (not shown) such as an ejector via a valve (not shown).

アーム６０の支持部６４と基台７２の本体部７４との間には、複数の付勢部材８２が設けられている。付勢部材８２としては、例えばコイルばねが用いられる。付勢部材８２の一端側は支持部６４の下端側に固定され、付勢部材８２の他端側は基台７２の本体部７４の上面側に固定される。これにより、吸引パッド７０が下方に向かって付勢される。 A plurality of urging members 82 are provided between the support portion 64 of the arm 60 and the main body portion 74 of the base 72. As the urging member 82, for example, a coil spring is used. One end side of the urging member 82 is fixed to the lower end side of the support portion 64, and the other end side of the urging member 82 is fixed to the upper surface side of the main body portion 74 of the base 72. As a result, the suction pad 70 is urged downward.

搬送位置Ａに配置されたチャックテーブル１８（図１参照）の上方に吸引パッド７０を位置付けた状態で、吸引パッド７０を昇降機構６６によって下降させると、チャックテーブル１８によって保持された被加工物１１の上面側（裏面１１ｂ側）に吸引パッド７０の吸引面７８ａが接触する。この状態で、配管８０に接続された吸引源（不図示）の負圧を吸引面７８ａに作用させると、被加工物１１が吸引パッド７０によって吸引保持される。そして、吸引パッド７０で被加工物１１を保持した状態で、回転駆動源６８によって吸引パッド７０を回転させると、被加工物１１が洗浄機構４６（図１参照）に搬送される。 When the suction pad 70 is lowered by the elevating mechanism 66 with the suction pad 70 positioned above the chuck table 18 (see FIG. 1) arranged at the transport position A, the workpiece 11 held by the chuck table 18 is lowered. The suction surface 78a of the suction pad 70 comes into contact with the upper surface side (back surface 11b side) of the above surface. In this state, when the negative pressure of the suction source (not shown) connected to the pipe 80 is applied to the suction surface 78a, the workpiece 11 is sucked and held by the suction pad 70. Then, when the suction pad 70 is rotated by the rotation drive source 68 while the workpiece 11 is held by the suction pad 70, the workpiece 11 is conveyed to the cleaning mechanism 46 (see FIG. 1).

なお、図１に示すように、搬送機構４４の吸引パッド７０の移動経路の下方には、洗浄機構４８が設けられている。そして、被加工物１１が搬送機構４４によって搬送される際、被加工物１１の下面側が洗浄機構４８によって洗浄される。 As shown in FIG. 1, a cleaning mechanism 48 is provided below the moving path of the suction pad 70 of the transport mechanism 44. Then, when the workpiece 11 is transported by the transport mechanism 44, the lower surface side of the workpiece 11 is cleaned by the cleaning mechanism 48.

図４は、洗浄機構４８を示す斜視図である。洗浄機構４８は、Ｚ軸方向に沿って配置された中空の円柱状のハウジング１００と、ハウジング１００に挿入された円柱状のシャフト（回転軸）１０２とを備える。シャフト１０２は、ハウジング１００の内部に設けられた軸受け（不図示）によって、回転可能な状態で支持されている。また、シャフト１０２の下端部は、ハウジング１００の下端から下方に突出している。 FIG. 4 is a perspective view showing the cleaning mechanism 48. The cleaning mechanism 48 includes a hollow cylindrical housing 100 arranged along the Z-axis direction, and a cylindrical shaft (rotating shaft) 102 inserted into the housing 100. The shaft 102 is rotatably supported by a bearing (not shown) provided inside the housing 100. Further, the lower end portion of the shaft 102 projects downward from the lower end portion of the housing 100.

シャフト１０２は、シャフト１０２をＺ軸方向と概ね平行な回転軸の周りで回転させるモータ等の回転駆動源１０４に連結されている。具体的には、シャフト１０２の下端部には従動プーリー１０６が固定されており、回転駆動源１０４の出力軸（回転軸）には駆動プーリー１０８が固定されている。また、従動プーリー１０６と駆動プーリー１０８とには、環状のベルト１１０が架けられている。ベルト１１０は、例えば無端の歯付ベルトであり、従動プーリー１０６と駆動プーリー１０８とを連結している。 The shaft 102 is connected to a rotation drive source 104 such as a motor that rotates the shaft 102 around a rotation axis substantially parallel to the Z-axis direction. Specifically, the driven pulley 106 is fixed to the lower end of the shaft 102, and the drive pulley 108 is fixed to the output shaft (rotary shaft) of the rotary drive source 104. An annular belt 110 is hung on the driven pulley 106 and the drive pulley 108. The belt 110 is, for example, an endless toothed belt, and connects the driven pulley 106 and the drive pulley 108.

回転駆動源１０４の出力軸が回転すると、出力軸のトルクが駆動プーリー１０８、ベルト１１０、従動プーリー１０６を介してシャフト１０２に伝達される。このようにして、回転駆動源１０４の動力がシャフト１０２に伝達され、シャフト１０２が回転する。 When the output shaft of the rotary drive source 104 rotates, the torque of the output shaft is transmitted to the shaft 102 via the drive pulley 108, the belt 110, and the driven pulley 106. In this way, the power of the rotary drive source 104 is transmitted to the shaft 102, and the shaft 102 rotates.

シャフト１０２の中央部には、シャフト１０２の上端から下端に至る円柱状の貫通孔が設けられている。そして、シャフト１０２の貫通孔には、搬送機構４４の吸引パッド７０（図３参照）によって保持された被加工物１１を洗浄する洗浄ユニット１１２が挿入されている。具体的には、洗浄ユニット１１２は円柱状の支持ロッド１１４を備え、支持ロッド１１４がシャフト１０２の貫通孔に挿入される。そして、支持ロッド１１４の下端部は、シャフト１０２の下端から下方に突出する。 A cylindrical through hole extending from the upper end to the lower end of the shaft 102 is provided in the central portion of the shaft 102. A cleaning unit 112 for cleaning the workpiece 11 held by the suction pad 70 (see FIG. 3) of the transport mechanism 44 is inserted into the through hole of the shaft 102. Specifically, the cleaning unit 112 includes a columnar support rod 114, and the support rod 114 is inserted into the through hole of the shaft 102. The lower end of the support rod 114 projects downward from the lower end of the shaft 102.

また、洗浄ユニット１１２は、支持ロッド１１４の上端側に設けられた保持部材１１６を備える。例えば保持部材１１６は、金属、樹脂等でなり、平面視で十字型に形成される。そして、保持部材１１６の中央部の下面側が支持ロッド１１４の上端部に固定される。 Further, the cleaning unit 112 includes a holding member 116 provided on the upper end side of the support rod 114. For example, the holding member 116 is made of metal, resin, or the like, and is formed in a cross shape in a plan view. Then, the lower surface side of the central portion of the holding member 116 is fixed to the upper end portion of the support rod 114.

保持部材１１６上には、吸引パッド７０によって保持された被加工物１１（図３参照）の下面側を洗浄する洗浄部材１１８が設けられている。洗浄部材１１８は、保持部材１１６の上面に沿って平面視で十字型に形成され、保持部材１１６の中央部から先端部に向かって放射状に配置されている。 On the holding member 116, a cleaning member 118 for cleaning the lower surface side of the workpiece 11 (see FIG. 3) held by the suction pad 70 is provided. The cleaning member 118 is formed in a cross shape in a plan view along the upper surface of the holding member 116, and is arranged radially from the central portion to the tip portion of the holding member 116.

例えば洗浄部材１１８は、スポンジ、不織布等でなる柔軟部材である。洗浄部材１１８は、被加工物１１の下面に固定された保護部材１７（図３参照）に接触して、保護部材１７を洗浄する。なお、被加工物１１に保護部材１７が固定されていない場合には、洗浄部材１１８は被加工物１１の下面（表面１１ａ）に接触して、被加工物１１の下面を洗浄する。 For example, the cleaning member 118 is a flexible member made of a sponge, a non-woven fabric, or the like. The cleaning member 118 comes into contact with the protective member 17 (see FIG. 3) fixed to the lower surface of the workpiece 11 to clean the protective member 17. When the protective member 17 is not fixed to the workpiece 11, the cleaning member 118 comes into contact with the lower surface (surface 11a) of the workpiece 11 to clean the lower surface of the workpiece 11.

保持部材１１６には、保持部材１１６の下面から下方に突出する複数の駆動ピン（不図示）が固定されている。また、シャフト１０２の上端側には、シャフト１０２の上端で開口する複数の挿入穴（不図示）が設けられている。支持ロッド１１４がシャフト１０２の貫通孔に挿入されると、複数の駆動ピンがそれぞれシャフト１０２の挿入穴に挿入されて嵌め込まれる。これにより、シャフト１０２と洗浄ユニット１１２とが一体化される。そして、回転駆動源１０４によってシャフト１０２を回転させると、保持部材１１６及び洗浄部材１１８がシャフト１０２に連動してＺ軸方向と概ね平行な回転軸の周りで回転する。 A plurality of drive pins (not shown) projecting downward from the lower surface of the holding member 116 are fixed to the holding member 116. Further, a plurality of insertion holes (not shown) opened at the upper end of the shaft 102 are provided on the upper end side of the shaft 102. When the support rod 114 is inserted into the through hole of the shaft 102, a plurality of drive pins are inserted into and fitted into the insertion holes of the shaft 102, respectively. As a result, the shaft 102 and the cleaning unit 112 are integrated. Then, when the shaft 102 is rotated by the rotation drive source 104, the holding member 116 and the cleaning member 118 are interlocked with the shaft 102 and rotate around a rotation axis substantially parallel to the Z-axis direction.

支持ロッド１１４の下端側は、支持ロッド１１４を昇降させる昇降機構１２０に連結されている。具体的には、昇降機構１２０は昇降機構１２０の動力によって昇降する昇降部１２２を備え、昇降部１２２は支持ロッド１１４の下端部に固定されている。例えば、昇降機構１２０としてエアシリンダが用いられ、エアシリンダのピストンロッドが昇降部１２２として機能する。昇降機構１２０を駆動させると、昇降部１２２の昇降に連動して洗浄ユニット１１２の洗浄部材１１８が昇降する。 The lower end side of the support rod 114 is connected to an elevating mechanism 120 that elevates and elevates the support rod 114. Specifically, the elevating mechanism 120 includes an elevating portion 122 that elevates and descends by the power of the elevating mechanism 120, and the elevating portion 122 is fixed to the lower end portion of the support rod 114. For example, an air cylinder is used as the elevating mechanism 120, and the piston rod of the air cylinder functions as the elevating portion 122. When the elevating mechanism 120 is driven, the cleaning member 118 of the cleaning unit 112 moves up and down in conjunction with the elevating of the elevating unit 122.

また、シャフト１０２の上端部には、洗浄液を噴射する一対の噴射ノズル１２４が設けられている。例えば噴射ノズル１２４は、一端側がシャフト１０２に接続され、他端側がシャフト１０２の半径方向外側に配置されるように、保持部材１１６に沿って配置される。また、噴射ノズル１２４は、洗浄液を噴射するための複数の噴射口１２４ａを備える。 Further, a pair of injection nozzles 124 for injecting a cleaning liquid are provided at the upper end of the shaft 102. For example, the injection nozzle 124 is arranged along the holding member 116 so that one end side is connected to the shaft 102 and the other end side is arranged radially outside the shaft 102. Further, the injection nozzle 124 includes a plurality of injection ports 124a for injecting the cleaning liquid.

噴射ノズル１２４は、シャフト１０２の内部に設けられた流路（不図示）を介して、ハウジング１００に設けられた洗浄液供給路１００ａに接続されている。そして、洗浄液供給源（不図示）から洗浄液供給路１００ａに純水等の洗浄液が供給されると、洗浄液が噴射ノズル１２４に流入し、噴射ノズル１２４の噴射口１２４ａから上方に向かって噴射される。 The injection nozzle 124 is connected to the cleaning liquid supply path 100a provided in the housing 100 via a flow path (not shown) provided inside the shaft 102. Then, when a cleaning liquid such as pure water is supplied from the cleaning liquid supply source (not shown) to the cleaning liquid supply path 100a, the cleaning liquid flows into the injection nozzle 124 and is injected upward from the injection port 124a of the injection nozzle 124. ..

次に、洗浄機構４８を用いて被加工物１１の下面側を洗浄する方法の具体例について説明する。図５は、吸引パッド７０によって保持された被加工物１１の下面側を洗浄する洗浄機構４８を示す一部断面正面図である。 Next, a specific example of a method of cleaning the lower surface side of the workpiece 11 using the cleaning mechanism 48 will be described. FIG. 5 is a partial cross-sectional front view showing a cleaning mechanism 48 for cleaning the lower surface side of the workpiece 11 held by the suction pad 70.

加工ユニット３４ａ，３４ｂ（図１参照）によって研削された被加工物１１は、搬送位置Ａに配置されたチャックテーブル１８（図１参照）上から搬送機構４４によって搬送される。具体的には、搬送機構４４は、吸引パッド７０を被加工物１１の直上に位置付けた状態で、吸引パッド７０を下降させて吸引面７８ａを被加工物１１の上面側（裏面１１ｂ側）に接触させる。この状態で吸引面７８ａに吸引力（負圧）を作用させると、被加工物１１が吸引パッド７０によって吸引保持される。そして、チャックテーブル１８による被加工物１１の吸引が解除された後、搬送機構４４は昇降機構６６及び回転駆動源６８（図３参照）によって吸引パッド７０を移動させ、被加工物１１を搬送する。 The workpiece 11 ground by the processing units 34a and 34b (see FIG. 1) is conveyed by the transfer mechanism 44 from the chuck table 18 (see FIG. 1) arranged at the transfer position A. Specifically, in the transport mechanism 44, with the suction pad 70 positioned directly above the workpiece 11, the suction pad 70 is lowered to bring the suction surface 78a to the upper surface side (back surface 11b side) of the workpiece 11. Make contact. When a suction force (negative pressure) is applied to the suction surface 78a in this state, the workpiece 11 is sucked and held by the suction pad 70. Then, after the suction of the workpiece 11 by the chuck table 18 is released, the transfer mechanism 44 moves the suction pad 70 by the elevating mechanism 66 and the rotation drive source 68 (see FIG. 3) to convey the workpiece 11. ..

被加工物１１が吸引パッド７０によってチャックテーブル１８から洗浄機構４６（図１参照）へ搬送される際の吸引パッド７０の移動経路と重なる位置には、洗浄機構４８が設けられている。そして、吸引パッド７０によって保持された被加工物１１の下面側が、洗浄機構４８によって洗浄される（洗浄ステップ）。 A cleaning mechanism 48 is provided at a position overlapping the movement path of the suction pad 70 when the workpiece 11 is conveyed from the chuck table 18 to the cleaning mechanism 46 (see FIG. 1) by the suction pad 70. Then, the lower surface side of the workpiece 11 held by the suction pad 70 is cleaned by the cleaning mechanism 48 (cleaning step).

具体的には、搬送機構４４は、被加工物１１を保持した吸引パッド７０を、洗浄機構４８の洗浄ユニット１１２の直上で停止させる。次に、回転駆動源１０４（図４参照）によってシャフト１０２及び洗浄ユニット１１２を回転させつつ、昇降機構１２０（図４参照）によって洗浄ユニット１１２を上昇させる。これにより、洗浄部材１１８が被加工物１１の下面側（表面１１ａ側）に接触した状態で移動（回転）する。 Specifically, the transport mechanism 44 stops the suction pad 70 holding the workpiece 11 directly above the cleaning unit 112 of the cleaning mechanism 48. Next, the shaft 102 and the cleaning unit 112 are rotated by the rotation drive source 104 (see FIG. 4), and the cleaning unit 112 is raised by the elevating mechanism 120 (see FIG. 4). As a result, the cleaning member 118 moves (rotates) in a state of being in contact with the lower surface side (surface 11a side) of the workpiece 11.

なお、本実施形態においては被加工物１１の下面に保護部材１７が固定されているため、洗浄部材１１８は保護部材１７に接触する。ただし、被加工物１１に保護部材１７が固定されていない場合には、洗浄部材１１８は被加工物の下面（表面１１ａ）に接触する。 In this embodiment, since the protective member 17 is fixed to the lower surface of the workpiece 11, the cleaning member 118 comes into contact with the protective member 17. However, when the protective member 17 is not fixed to the workpiece 11, the cleaning member 118 comes into contact with the lower surface (surface 11a) of the workpiece 11.

また、洗浄部材１１８が被加工物１１の下面側に接触する際、噴射ノズル１２４から純水等の洗浄液が被加工物１１の下面側に向かって噴射される。そのため、被加工物１１の下面側（保護部材１７）は、洗浄液が付着した状態で洗浄部材１１８によって擦られる。その結果、被加工物１１の下面側（保護部材１７）に付着している加工屑が洗い流される。 Further, when the cleaning member 118 comes into contact with the lower surface side of the workpiece 11, a cleaning liquid such as pure water is ejected from the injection nozzle 124 toward the lower surface side of the workpiece 11. Therefore, the lower surface side (protective member 17) of the workpiece 11 is rubbed by the cleaning member 118 with the cleaning liquid attached. As a result, the work chips adhering to the lower surface side (protective member 17) of the work piece 11 are washed away.

次に、被加工物１１の下面側に付着した洗浄液を除去する（除去ステップ）。具体的には、洗浄部材１１８の移動（回転）を維持した状態で、噴射ノズル１２４からの洗浄液の噴射を停止する。これにより、被加工物１１の下面側（保護部材１７）に洗浄液が供給されない状態で、洗浄部材１１８が被加工物１１の下面側に接触しつつ移動する。その結果、被加工物１１の下面側に付着している洗浄液が洗浄部材１１８によって拭われて除去される。 Next, the cleaning liquid adhering to the lower surface side of the workpiece 11 is removed (removal step). Specifically, the injection of the cleaning liquid from the injection nozzle 124 is stopped while the movement (rotation) of the cleaning member 118 is maintained. As a result, the cleaning member 118 moves while being in contact with the lower surface side of the workpiece 11 in a state where the cleaning liquid is not supplied to the lower surface side (protective member 17) of the workpiece 11. As a result, the cleaning liquid adhering to the lower surface side of the workpiece 11 is wiped off by the cleaning member 118.

なお、除去ステップでは、被加工物１１の下面側に残存する洗浄液が洗浄部材１１８によって拭われれば十分であり、洗浄部材１１８の回転数は比較的少なくて済む。例えば、洗浄部材１１８の回転数は、５以下、好ましくは３以下に設定できる。 In the removal step, it is sufficient that the cleaning liquid remaining on the lower surface side of the workpiece 11 is wiped by the cleaning member 118, and the rotation speed of the cleaning member 118 is relatively small. For example, the rotation speed of the cleaning member 118 can be set to 5 or less, preferably 3 or less.

上記の通り、本実施形態に係る被加工物の洗浄方法では、洗浄ステップにおいて被加工物１１の下面側に付着した洗浄液が、除去ステップで除去される。これにより、洗浄後の被加工物１１は洗浄液が除去された状態で搬送され、被加工物１１の搬送先への洗浄液の混入が防止される。その結果、加工装置２内の意図しない領域に洗浄液が付着することを回避でき、洗浄液に起因する不都合（加工装置２の構成要素の劣化、故障等）の発生が抑制される。 As described above, in the method for cleaning a workpiece according to the present embodiment, the cleaning liquid adhering to the lower surface side of the workpiece 11 in the cleaning step is removed in the removing step. As a result, the workpiece 11 after cleaning is transported in a state where the cleaning liquid is removed, and the cleaning liquid is prevented from being mixed into the transport destination of the workpiece 11. As a result, it is possible to prevent the cleaning liquid from adhering to an unintended region in the processing device 2, and it is possible to suppress the occurrence of inconveniences (deterioration, failure, etc. of the components of the processing device 2) caused by the cleaning liquid.

また、上記の被加工物の洗浄方法では、洗浄ステップの完了後、噴射ノズル１２４からの洗浄液の噴射を停止するのみで、直ちに除去ステップに移行できる。そのため、洗浄液の除去を被加工物１１の洗浄とは別の場所で別の設備を用いて実施する場合と比較して、洗浄液の除去に要する時間を大幅に削減でき、洗浄液の効率的な除去が実現される。 Further, in the above-mentioned cleaning method of the workpiece, after the cleaning step is completed, the removal step can be immediately started by simply stopping the injection of the cleaning liquid from the injection nozzle 124. Therefore, as compared with the case where the cleaning liquid is removed by using a different facility at a place different from the cleaning of the workpiece 11, the time required for removing the cleaning liquid can be significantly reduced, and the cleaning liquid can be efficiently removed. Is realized.

なお、被加工物１１の下面側に付着した洗浄液の量、成分、洗浄部材１１８の材質等によっては、除去ステップの実施によって被加工物１１の下面側から洗浄液を完全に除去することが困難な場合がある。この場合には、除去ステップの実施後、被加工物１１の下面側に気体を噴射して被加工物１１を乾燥させてもよい（乾燥ステップ）。 Depending on the amount and composition of the cleaning liquid adhering to the lower surface side of the workpiece 11, the material of the cleaning member 118, etc., it is difficult to completely remove the cleaning liquid from the lower surface side of the workpiece 11 by performing the removal step. In some cases. In this case, after the removal step is performed, the work piece 11 may be dried by injecting gas onto the lower surface side of the work piece 11 (drying step).

図１に示すように、吸引パッド７０の移動経路と重なる位置には、乾燥ノズル５０が設けられている。例えば乾燥ノズル５０は、中空の円柱状に形成され、開口４ｂの前端部にＸ軸方向に沿って配置されている。乾燥ノズル５０にはエアー等の気体を供給する気体供給源（不図示）が接続されており、気体供給原から乾燥ノズル５０の内部に気体が所定の圧力で供給される。 As shown in FIG. 1, a drying nozzle 50 is provided at a position overlapping the moving path of the suction pad 70. For example, the drying nozzle 50 is formed in a hollow columnar shape and is arranged at the front end of the opening 4b along the X-axis direction. A gas supply source (not shown) for supplying gas such as air is connected to the drying nozzle 50, and gas is supplied from the gas supply source to the inside of the drying nozzle 50 at a predetermined pressure.

図３に示すように、乾燥ノズル５０は、乾燥ノズル５０の内部と外部とを接続する複数の噴射口５０ａを有する。例えば、複数の噴射口５０ａは、乾燥ノズル５０の長さ方向に沿って概ね等間隔に配列されている。乾燥ノズル５０の内部に気体が供給されると、複数の噴射口５０ａから気体が噴射される。 As shown in FIG. 3, the drying nozzle 50 has a plurality of injection ports 50a connecting the inside and the outside of the drying nozzle 50. For example, the plurality of injection ports 50a are arranged at substantially equal intervals along the length direction of the drying nozzle 50. When the gas is supplied to the inside of the drying nozzle 50, the gas is injected from the plurality of injection ports 50a.

被加工物１１を保持した吸引パッド７０が乾燥ノズル５０の上方を通過する際、乾燥ノズル５０から被加工物１１の下面側（保護部材）に気体が吹き付けられる。これにより、被加工物１１の乾燥が行われ、被加工物１１の下面側（保護部材１７）に付着している洗浄液が除去される。 When the suction pad 70 holding the workpiece 11 passes above the drying nozzle 50, gas is blown from the drying nozzle 50 to the lower surface side (protective member) of the workpiece 11. As a result, the workpiece 11 is dried, and the cleaning liquid adhering to the lower surface side (protective member 17) of the workpiece 11 is removed.

なお、図３に示すように、噴射口５０ａは、乾燥ノズル５０の上端よりも後方側（洗浄機構４８側）に形成されることが好ましい。この場合、気体は乾燥ノズル５０から後方側に向かって噴射される。これにより、被加工物１１の下面側に付着した洗浄液が加工装置２の前方側に飛散しにくくなり、加工装置２の前方側への洗浄液の混入が防止される。 As shown in FIG. 3, the injection port 50a is preferably formed on the rear side (cleaning mechanism 48 side) of the upper end of the drying nozzle 50. In this case, the gas is ejected from the drying nozzle 50 toward the rear side. As a result, the cleaning liquid adhering to the lower surface side of the workpiece 11 is less likely to scatter toward the front side of the processing device 2, and the cleaning liquid is prevented from being mixed into the front side of the processing device 2.

また、上記の乾燥ステップは、除去ステップの実施によって被加工物１１の下面側から洗浄液の大半が除去された後に実施される。そのため、残りの洗浄液は乾燥ノズル５０から噴射される気体によって容易に除去される。従って、被加工物１１が乾燥ノズル５０の上方を通過する際に、吸引パッド７０を大きく減速又は停止させて被加工物１１に気体が吹き付けられる時間を増加させるような稼働が不要となり、被加工物１１の搬送効率の低下が抑制される。 Further, the above-mentioned drying step is performed after most of the cleaning liquid is removed from the lower surface side of the workpiece 11 by carrying out the removal step. Therefore, the remaining cleaning liquid is easily removed by the gas ejected from the drying nozzle 50. Therefore, when the workpiece 11 passes above the drying nozzle 50, the suction pad 70 is largely decelerated or stopped to eliminate the need for an operation that increases the time for which the gas is blown onto the workpiece 11. The decrease in the transport efficiency of the object 11 is suppressed.

また、本実施形態では、加工装置（研削装置）２内で被加工物１１の下面側が洗浄機構４８によって洗浄される例について説明したが、洗浄機構４８が搭載される加工装置は研削装置に限られない。例えば洗浄機構４８は、切削装置、研磨装置、レーザー加工装置等の加工装置に搭載することもできる。 Further, in the present embodiment, an example in which the lower surface side of the workpiece 11 is cleaned by the cleaning mechanism 48 in the processing apparatus (grinding apparatus) 2 has been described, but the processing apparatus on which the cleaning mechanism 48 is mounted is limited to the grinding apparatus. I can't. For example, the cleaning mechanism 48 can be mounted on a processing device such as a cutting device, a polishing device, or a laser processing device.

切削装置は、被加工物１１を切削する切削ユニットを備える。切削ユニットはスピンドルを備えており、スピンドルの先端部には被加工物１１を切削するための環状の切削ブレードが装着される。切削ブレードを回転させながら被加工物１１に切り込ませることにより、被加工物１１が切削される。 The cutting device includes a cutting unit that cuts the workpiece 11. The cutting unit includes a spindle, and an annular cutting blade for cutting the workpiece 11 is attached to the tip of the spindle. The workpiece 11 is cut by cutting into the workpiece 11 while rotating the cutting blade.

研磨装置は、被加工物１１を研磨する研磨ユニットを備える。研磨ユニットはスピンドルを備えており、スピンドルの先端部には円盤状の研磨パッドが装着される。研磨パッドを回転させながら被加工物１１に接触させることにより、被加工物１１が研磨される。 The polishing device includes a polishing unit for polishing the workpiece 11. The polishing unit is provided with a spindle, and a disk-shaped polishing pad is attached to the tip of the spindle. By bringing the polishing pad into contact with the workpiece 11 while rotating it, the workpiece 11 is polished.

レーザー加工装置は、被加工物１１を加工するためのレーザービームを照射するレーザー照射ユニットを備える。例えばレーザー照射ユニットは、所定の波長のレーザーをパルス発振するレーザー発振器と、レーザー発振器から発振されたレーザーを集光させる集光器とを備える。レーザー照射ユニットからウェーハにレーザービームを照射することにより、被加工物１１にレーザー加工が施される。 The laser processing apparatus includes a laser irradiation unit that irradiates a laser beam for processing the workpiece 11. For example, the laser irradiation unit includes a laser oscillator that oscillates a laser having a predetermined wavelength in a pulsed manner, and a condenser that condenses the laser oscillated from the laser oscillator. By irradiating the wafer with a laser beam from the laser irradiation unit, the workpiece 11 is subjected to laser processing.

上記のような各種の加工装置に、加工後の被加工物１１の上面側を保持する搬送機構（図１の搬送機構４４参照）と、洗浄機構４８とが搭載される。そして、搬送機構によって被加工物１１が搬送される際、洗浄機構４８によって被加工物１１の下面側の洗浄（洗浄ステップ）と洗浄液の除去（除去ステップ）とが実施される。 A transport mechanism (see the transport mechanism 44 in FIG. 1) for holding the upper surface side of the workpiece 11 after machining and a cleaning mechanism 48 are mounted on various processing devices as described above. Then, when the workpiece 11 is transported by the transport mechanism, the cleaning mechanism 48 performs cleaning (cleaning step) on the lower surface side of the workpiece 11 and removal (removal step) of the cleaning liquid.

その他、上記実施形態に係る構造、方法等は、本発明の目的の範囲を逸脱しない限りにおいて適宜変更して実施できる。 In addition, the structure, method, and the like according to the above-described embodiment can be appropriately modified and implemented as long as they do not deviate from the scope of the object of the present invention.

１１ 被加工物
１１ａ 表面（第１面）
１１ｂ 裏面（第２面）
１３ 分割予定ライン（ストリート）
１５ デバイス
１７ 保護部材
２ 加工装置（研削装置）
４ 基台
４ａ，４ｂ 開口
６ 搬送機構（搬送ユニット）
８ａ，８ｂ カセット配置領域
１０ａ，１０ｂ カセット
１２ 位置合わせ機構（アライメント機構）
１４ 搬送機構（搬送ユニット搬送、ローディングアーム）
１６ ターンテーブル
１８ チャックテーブル（保持テーブル）
１８ａ 保持面
２０ 支持構造
２２ａ，２２ｂ 移動機構（移動ユニット）
２４ ガイドレール
２６ 移動プレート
２８ ボールねじ
３０ パルスモータ
３２ 支持具
３４ａ，３４ｂ 加工ユニット（研削ユニット）
３６ ハウジング
３８ スピンドル
４０ マウント
４２ａ，４２ｂ 研削ホイール
４４ 搬送機構（搬送ユニット、アンローディングアーム）
４６ 洗浄機構（洗浄ユニット）
４８ 洗浄機構（洗浄ユニット）
５０ 乾燥ノズル
５０ａ 噴射口
５２ 入力ユニット（入力部）
５４ 制御ユニット（制御部）
６０ アーム
６２ 基部
６４ 支持部
６４ａ 開口部
６４ｂ 貫通孔
６４ｃ 溝
６６ 昇降機構
６８ 回転駆動源
７０ 吸引パッド
７２ 基台
７２ａ 流路
７４ 本体部（枠体）
７４ａ 凹部
７６ 支持部（支持軸）
７６ａ 突起部
７８ 吸引部材
７８ａ 吸引面
８０ 配管
８２ 付勢部材
１００ ハウジング
１００ａ 洗浄液供給路
１０２ シャフト
１０４ 回転駆動源
１０６ 従動プーリー
１０８ 駆動プーリー
１１０ ベルト
１１２ 洗浄ユニット
１１４ 支持ロッド
１１６ 保持部材
１１８ 洗浄部材
１２０ 昇降機構
１２２ 昇降部
１２４ 噴射ノズル
１２４ａ 噴射口 11 Work piece 11a Surface (first surface)
11b back side (second side)
13 Scheduled division line (street)
15 Devices 17 Protective members 2 Processing equipment (grinding equipment)
4 Base 4a, 4b Opening 6 Conveying mechanism (conveying unit)
8a, 8b Cassette placement area 10a, 10b Cassette 12 Alignment mechanism (alignment mechanism)
14 Conveyance mechanism (conveyance unit transport, loading arm)
16 Turntable 18 Chuck table (holding table)
18a Holding surface 20 Support structure 22a, 22b Moving mechanism (moving unit)
24 Guide rail 26 Moving plate 28 Ball screw 30 Pulse motor 32 Supports 34a, 34b Machining unit (grinding unit)
36 Housing 38 Spindle 40 Mount 42a, 42b Grinding wheel 44 Conveying mechanism (conveying unit, unloading arm)
46 Cleaning mechanism (cleaning unit)
48 Cleaning mechanism (cleaning unit)
50 Dry nozzle 50a Injection port 52 Input unit (input unit)
54 Control unit (control unit)
60 Arm 62 Base 64 Support 64a Opening 64b Through hole 64c Groove 66 Elevating mechanism 68 Rotation drive source 70 Suction pad 72 Base 72a Flow path 74 Main body (frame)
74a Recess 76 Support part (support shaft)
76a Protrusion 78 Suction member 78a Suction surface 80 Piping 82 Biasing member 100 Housing 100a Cleaning liquid supply path 102 Shaft 104 Rotational drive source 106 Driven pulley 108 Drive pulley 110 Belt 112 Cleaning unit 114 Support rod 116 Holding member 118 Cleaning member 120 Lifting mechanism 122 Elevating part 124 Injection nozzle 124a Injection port

Claims (3)

加工装置内で被加工物を洗浄する被加工物の洗浄方法であって、
該加工装置は、
該被加工物の下面側を保持するチャックテーブルと、
該チャックテーブルによって保持された該被加工物の上面側を加工する加工ユニットと、
該チャックテーブルによって保持され該加工ユニットによって加工された該被加工物の上面側を吸引保持する吸引面を有する吸引パッドを含む搬送機構と、
該吸引パッドの移動経路と重なる位置に設けられ、該被加工物の下面側を洗浄する洗浄部材と、洗浄液を噴射する噴射ノズルと、を含む洗浄機構と、を備え、
該噴射ノズルから該被加工物の下面側に該洗浄液を噴射しながら、該洗浄部材を該被加工物の下面側に接触させつつ移動させることにより、該被加工物の下面側を洗浄する洗浄ステップと、
該噴射ノズルからの該洗浄液の噴射を停止した状態で、該洗浄部材を該被加工物の下面側に接触させつつ移動させることにより、該被加工物の下面側に付着した該洗浄液を除去する除去ステップと、を備えることを特徴とする被加工物の洗浄方法。 It is a cleaning method of the workpiece that cleans the workpiece in the processing equipment.
The processing device is
A chuck table that holds the lower surface side of the workpiece and
A processing unit that processes the upper surface side of the workpiece held by the chuck table, and
A transport mechanism including a suction pad having a suction surface that is held by the chuck table and sucks and holds the upper surface side of the workpiece machined by the machining unit.
A cleaning mechanism provided at a position overlapping with the movement path of the suction pad and including a cleaning member for cleaning the lower surface side of the workpiece and an injection nozzle for injecting a cleaning liquid is provided.
Cleaning that cleans the lower surface side of the workpiece by moving the cleaning member in contact with the lower surface side of the workpiece while injecting the cleaning liquid from the injection nozzle onto the lower surface side of the workpiece. Steps and
With the injection of the cleaning liquid from the injection nozzle stopped, the cleaning member is moved while being in contact with the lower surface side of the workpiece to remove the cleaning liquid adhering to the lower surface side of the workpiece. A method of cleaning a workpiece, characterized in that it comprises a removal step. 該被加工物の下面側には、該被加工物を保護する保護部材が固定されており、
該洗浄ステップでは、該保護部材を洗浄し、
該除去ステップでは、該保護部材に付着した該洗浄液を除去することを特徴とする請求項１記載の被加工物の洗浄方法。 A protective member that protects the workpiece is fixed to the lower surface side of the workpiece.
In the cleaning step, the protective member is cleaned and
The cleaning method for a workpiece according to claim 1, wherein in the removal step, the cleaning liquid adhering to the protective member is removed. 該除去ステップの実施後に、該被加工物の下面側に気体を噴射して該被加工物を乾燥させる乾燥ステップを更に備えることを特徴とする請求項１又は２記載の被加工物の洗浄方法。 The method for cleaning a work piece according to claim 1 or 2, further comprising a drying step of injecting gas onto the lower surface side of the work piece to dry the work piece after performing the removal step. ..
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