JP2022077908A - Resin composition - Google Patents

Abstract

To provide a resin composition that can yield a cured product having low relative dielectric constant (Dk) and dielectric loss tangent (Df), high glass transition point (Tg), and excellent copper adhesion.SOLUTION: Provided is a resin composition that contains (A) a maleimide compound having a partial structure represented by the formula (A) (X1) (in the formula, each symbol is as described in the specification), and (B) an active ester compound.SELECTED DRAWING: None

Description

The present invention relates to a resin composition containing a maleimide compound. Further, the present invention relates to a cured product obtained by using the resin composition, a sheet-like laminated material, a resin sheet, a printed wiring board, and a semiconductor device.

As a manufacturing technique for printed wiring boards, a manufacturing method by a build-up method in which insulating layers and conductor layers are alternately stacked is known. In the build-up manufacturing method, the insulating layer is generally formed by curing the resin composition. In recent years, there has been a demand for further improvement of dielectric properties such as dielectric constant and dielectric loss tangent of an insulating layer, and further improvement of copper adhesion. On the other hand, there is a demand for an insulating layer having a high glass transition temperature.

So far, maleimide compounds containing various non-aromatic ring skeletons are known (Patent Document 1).

Japanese Unexamined Patent Publication No. 2019-203122

An object of the present invention is to provide a resin composition capable of obtaining a cured product having a low relative permittivity (Dk) and a dielectric loss tangent (Df), a high glass transition point (Tg), and excellent copper adhesion. There is something in it.

As a result of diligent studies to achieve the object of the present invention, as a component of the resin composition, a maleimide compound having a partial structure represented by the formula (A) (X1) and (B) an active ester are used. Surprisingly, by using the compound, it is possible to obtain a cured product having a low relative permittivity (Dk) and dielectric adjunct (Df), a high glass transition point (Tg), and excellent copper adhesion. We have found and completed the present invention.

That is, the present invention includes the following contents.
[1] Equation (A) (X1):

[During the ceremony,
Ring X represents a monocycloalkane ring which may have a substituent or a monocycloalkene ring which may have a substituent;
a and b independently indicate 0, 1, 2 or 3, and the sum of a and b is 1-5;
* Indicates a binding site. ]
A resin composition containing a maleimide compound having a partial structure represented by (B) and an active ester compound (B).
[2] In addition to the partial structure represented by the formula (X1), the component (A) further comprises the formula (Y1) :.

[During the ceremony,
Ring Y represents a monocycloalkane ring which may have a substituent or a monocycloalkene ring which may have a substituent;
c and d independently represent an integer of 0 or 1 or more, and the sum of c and d is 6 or more;
* Indicates a binding site. ]
The resin composition according to the above [1], which is a maleimide compound having a partial structure represented by.
[3] The resin composition according to the above [1] or [2], wherein the number of maleimide groups in one molecule of the component (A) is 2.
[4] The resin composition according to any one of the above [1] to [3], wherein the component (A) is a maleimide-terminal polyimide.
[5] The component (A) is the formula (A1) :.

[During the ceremony,
R ¹ each independently indicates a substituent;
Rings X and Y each independently represent a monocycloalkane ring which may have a substituent or a monocycloalkene ring which may have a substituent;
Ring Z independently represents a non-aromatic ring which may have a substituent or an aromatic ring which may have a substituent;
Z ¹ and Z ² are independent, single bond, alkylene group, -O-, -CO-, -S-, -SO-, -SO _2- , -CONH-, -NHCO-, -COO-, respectively. , Or -OCO-;
a and b independently indicate 0, 1, 2 or 3, and the sum of a and b is 1-5;
c and d independently represent an integer of 0 or 1 or more, and the sum of c and d is 6 or more;
e independently indicate 0 or 1;
f independently represents an integer greater than or equal to 0 or 1;
g independently indicate 0, 1 or 2;
n1 indicates an integer of 1 or more;
n2 indicates 0 or an integer greater than or equal to 1;
For m1 and m2, one of them indicates 1 and the other indicates 0. ]
The resin composition according to any one of the above [1] to [4], which is a compound represented by.
[6] The resin composition according to any one of the above [1] to [5], wherein the weight average molecular weight of the component (A) is 2000 to 50,000.
[7] The content of the component (A) is 3% by mass to 30% by mass when the non-volatile component in the resin composition is 100% by mass, according to any one of the above [1] to [6]. Resin composition.
[8] The content of the component (B) is 3% by mass to 30% by mass when the non-volatile component in the resin composition is 100% by mass, according to any one of the above [1] to [7]. Resin composition.
[9] The above-mentioned [1] to [8], wherein the mass ratio of the component (A) to the component (B) (component (A) / component (B)) is 0.5 to 3. Resin composition.
[10] The resin composition according to any one of the above [1] to [9], further comprising (C) an epoxy resin.
[11] The resin composition according to any one of the above [1] to [10], further comprising (D) an inorganic filler.
[12] The resin composition according to the above [11], wherein the content of the component (D) is 40% by mass or more when the non-volatile component in the resin composition is 100% by mass.
[13] The resin according to any one of [1] to [12] above, wherein the dielectric loss tangent (Df) of the cured product of the resin composition is 0.005 or less when measured at 5.8 GHz and 23 ° C. Composition.
[14] The above-mentioned [1] to [13], wherein the relative permittivity (Dk) of the cured product of the resin composition is 3.0 or less when measured at 5.8 GHz and 23 ° C. Resin composition.
[15] The resin composition according to any one of the above [1] to [14], wherein the cured product of the resin composition has a glass transition temperature (Tg) of 150 ° C. or higher.
[16] A cured product of the resin composition according to any one of the above [1] to [15].
[17] A sheet-like laminated material containing the resin composition according to any one of the above [1] to [15].
[18] A resin sheet having a support and a resin composition layer formed from the resin composition according to any one of the above [1] to [15] provided on the support.
[19] A printed wiring board provided with an insulating layer made of a cured product of the resin composition according to any one of the above [1] to [15].
[20] A semiconductor device including the printed wiring board according to the above [19].

According to the resin composition of the present invention, it is possible to obtain a cured product having a low relative permittivity (Dk) and a dielectric loss tangent (Df), a high glass transition point (Tg), and excellent copper adhesion.

Hereinafter, the present invention will be described in detail according to the preferred embodiment thereof. However, the present invention is not limited to the following embodiments and examples, and may be arbitrarily modified and implemented without departing from the scope of claims of the present invention and the equivalent scope thereof.

<Resin composition>
The resin composition of the present invention has the formula (A) (X1):

[In the formula, ring X represents a monocycloalkane ring which may have a substituent or a monocycloalkene ring which may have a substituent; a and b are independently 0. 1, 2 or 3 is indicated, and the sum of a and b is 1 to 5; * indicates a binding site. ]
It contains a maleimide compound having a partial structure represented by (B) and (B) an active ester compound (hereinafter, may be referred to as “specific maleimide compound”). By using such a resin composition, it is possible to obtain a cured product having a low relative permittivity (Dk) and a dielectric loss tangent (Df), a high glass transition point (Tg), and excellent copper adhesion.

The resin composition of the present invention may further contain any component in addition to (A) the specific maleimide compound and (B) the active ester compound. Optional components include, for example, (A') other radically polymerizable compounds, (C) epoxy resins, (D) inorganic fillers, (E) curing accelerators, (F) other additives, and (G). ) Organic solvents can be mentioned. Hereinafter, each component contained in the resin composition will be described in detail.

<(A) Specific maleimide compound>
The resin composition of the present invention contains (A) a specific maleimide compound. The maleimide compound means a compound containing at least one maleimide group (2,5-dihydro-2,5-dioxo-1H-pyrrole-1-yl group) in one molecule. (A) The number of maleimide groups in one molecule of the specific maleimide compound is preferably 2 or more, and particularly preferably 2. (A) The specific maleimide compound may be used alone or in combination of two or more at any ratio.

(A) The specific maleimide compound is of the formula (X1) :.

[In the formula, ring X represents a monocycloalkane ring which may have a substituent or a monocycloalkene ring which may have a substituent; a and b are independently 0. 1, 2 or 3 is indicated, and the sum of a and b is 1 to 5; * indicates a binding site. ]
It has a partial structure represented by.

Ring X represents a monocycloalkane ring which may have a substituent or a monocycloalkene ring which may have a substituent.

The monocycloalkane ring means a monocyclic aliphatic saturated hydrocarbon ring. The monocycloalkane ring is preferably a monocycloalkane ring having 4 to 14 carbon atoms, more preferably a monocycloalkane ring having 4 to 10 carbon atoms, and particularly preferably a monocycloalkane ring having 5 or 6 carbon atoms. Examples of the monocycloalkane ring include a cyclobutane ring, a cyclopentane ring, a cyclohexane ring, a cycloheptane ring, a cyclooctane ring and the like. The cycloalkene ring means a monocyclic aliphatic unsaturated hydrocarbon ring having at least one carbon-carbon double bond. The monocycloalkene ring is preferably a monocycloalkene ring having 4 to 14 carbon atoms, more preferably a monocycloalkene ring having 4 to 10 carbon atoms, and particularly preferably a monocycloalkene ring having 5 or 6 carbon atoms. Examples of the monocycloalkene ring include a cyclobutene ring, a cyclopentene ring, a cyclohexene ring, a cycloheptene ring, a cyclooctene ring, a cyclopentadiene ring, a cyclohexadiene ring and the like.

In the present specification, the "substituent" is not particularly limited, but is, for example, an alkyl group, an alkenyl group, an aryl group, an aryl-alkyl group (an alkyl group substituted with an aryl group), and an alkyl-oxy. Group, alkenyl-oxy group, aryl-oxy group, alkyl-carbonyl group, alkenyl-carbonyl group, aryl-carbonyl group, alkyl-oxy-carbonyl group, alkenyl-oxy-carbonyl group, aryl-oxy-carbonyl group, alkyl- Examples thereof include monovalent substituents such as a carbonyl-oxy group, an alkenyl-carbonyl-oxy group and an aryl-carbonyl-oxy group, and if substitutable, a divalent substituent such as an oxo group (= O) is also included. obtain.

Alkyl (group) means a linear, branched and / or cyclic monovalent aliphatic saturated hydrocarbon group. Unless otherwise specified, the alkyl (group) is preferably an alkyl (group) having 1 to 14 carbon atoms. Examples of the alkyl (group) include a methyl group, an ethyl group, a propyl group, an isopropyl group, a butyl group, an isobutyl group, a sec-butyl group, a tert-butyl group, a pentyl group, a hexyl group, a heptyl group, an octyl group and a nonyl group. Examples thereof include a group, a decyl group, a cyclopentyl group, a cyclohexyl group, a methylcyclohexyl group, a dimethylcyclohexyl group, a trimethylcyclohexyl group, a cyclopentylmethyl group, a cyclohexylmethyl group and the like. Alkenyl (group) means a linear, branched and / or cyclic monovalent aliphatic unsaturated hydrocarbon group having at least one carbon-carbon double bond. Unless otherwise specified, the alkenyl (group) is preferably an alkenyl group having 2 to 14 carbon atoms. Examples of the alkenyl (group) include a vinyl group, a propenyl group, a butenyl group, a pentenyl group, a hexenyl group, a heptenyl group, an octenyl group, a nonenyl group, a decenyl group, a cyclohexenyl group and the like. Aryl (group) means a monovalent aromatic hydrocarbon group. Unless otherwise specified, the aryl (group) is preferably an aryl (group) having 6 to 14 carbon atoms. Examples of the aryl (group) include a phenyl group, a 1-naphthyl group, a 2-naphthyl group and the like.

Ring X is preferably a monocycloalkane ring which may be substituted with a group selected from an alkyl group and an alkenyl group, or a monocycloalkene ring which may be substituted with a group selected from an alkyl group and an alkenyl group. be. The ring X is more preferably a monocycloalkane ring having 4 to 10 carbon atoms, which may be substituted with a group selected from an alkyl group having 1 to 6 carbon atoms and an alkenyl group having 1 to 6 carbon atoms. Alternatively, it is a monocycloalkene ring having 4 to 10 carbon atoms which may be substituted with a group selected from an alkyl group having 1 to 6 carbon atoms and an alkenyl group having 1 to 6 carbon atoms. Ring X is more preferably a monocycloalkane ring having 4 to 10 carbon atoms which may be substituted with a group selected from alkyl groups having 1 to 6 carbon atoms. Ring X is particularly preferably a cyclohexane ring that may be substituted with a methyl group.

a and b independently indicate 0, 1, 2 or 3, and the total of a and b is 1 to 5. A and b are preferably 0, 1 or 2 independently of each other, and the total of a and b is 1 or more. More preferably, a and b are independently 0 or 1, and the total of a and b is 1 or more. Of a and b, one of a and b is particularly preferably 1 and the other is 0.

The partial structure represented by the formula (X1) is preferably the formula (X2) :.

[In the formula, R ² independently indicates an alkyl group; x indicates an integer of 0 to 5; other symbols are the same as above. ]
It is a partial structure represented by.

R ² independently represents an alkyl group. Each of R ² is independently, preferably an alkyl group having 1 to 6 carbon atoms, more preferably an alkyl group having 1 to 3 carbon atoms, and particularly preferably a methyl group. x represents an integer from 0 to 5. x is preferably 0, 1, 2, 3 or 4, more preferably 1, 2, 3 or 4, still more preferably 2, 3 or 4, and particularly preferably 3.

The partial structure represented by the formula (X1) is particularly preferably the formula (X3) :.

[In the formula, * is the same as above. ]
It is a partial structure represented by.

(A) The number of partial structures represented by the formula (X1) in one molecule of the specific maleimide compound is at least 1, preferably 2 or more, and the upper limit is, for example, 20 or less, 10 or less, and the like. obtain.

The specific maleimide compound (A) preferably has a partial structure represented by the formula (X1), and further has a formula (Y1) :.

[In the formula, ring Y represents a monocycloalkane ring which may have a substituent or a monocycloalkene ring which may have a substituent; c and d are 0 independently of each other. Or an integer of 1 or more, and the sum of c and d is 6 or more; * indicates a binding site. ]
It has a partial structure represented by.

Ring Y represents a monocycloalkane ring which may have a substituent or a monocycloalkene ring which may have a substituent. Ring Y is preferably a monocycloalkane ring which may be substituted with a group selected from an alkyl group and an alkenyl group, or a monocycloalkene ring which may be substituted with a group selected from an alkyl group and an alkenyl group. be. The ring Y is more preferably a monocycloalkane ring having 4 to 10 carbon atoms, which may be substituted with a group selected from an alkyl group having 1 to 14 carbon atoms and an alkenyl group having 1 to 14 carbon atoms. Alternatively, it is a monocycloalkene ring having 4 to 10 carbon atoms which may be substituted with a group selected from an alkyl group having 1 to 14 carbon atoms and an alkenyl group having 1 to 14 carbon atoms. Ring Y is more preferably a monocycloalkane ring having 4 to 10 carbon atoms which may be substituted with a group selected from alkyl groups having 1 to 14 carbon atoms. Ring Y is particularly preferably a cyclohexane ring that may be substituted with a group selected from alkyl groups having 4 to 10 carbon atoms.

c and d independently represent an integer of 0 or 1 or more, and the total of c and d is 6 or more. c and d are preferably integers of 0 to 20 independently of each other, and the total of c and d is 6 or more. More preferably, c and d are each independently an integer of 1 to 20, and the total of c and d is 6 or more. c and d are more preferably integers of 5 to 10 independently of each other. c and d are particularly preferably 8.

The partial structure represented by the formula (Y1) is preferably the formula (Y2) :.

[In the formula, R ³ independently indicate an alkyl group; y indicates an integer of 0 to 5; other symbols are the same as above. ]
It is a partial structure represented by.

R ³ each independently represents an alkyl group. Each of R ³ is independently and preferably an alkyl group having 1 to 14 carbon atoms, more preferably an alkyl group having 4 to 10 carbon atoms, and particularly preferably an alkyl group having 6 to 8 carbon atoms. Is. y represents an integer from 0 to 5. y is preferably 0, 1, 2, 3 or 4, more preferably 1, 2, 3 or 4, still more preferably 1, 2 or 3, and particularly preferably 2.

The partial structure represented by the formula (Y1) is particularly preferably the formula (Y3) :.

[In the formula, * is the same as above. ]
It is a partial structure represented by.

(A) The number of partial structures represented by the formula (Y1) in one molecule of the specific maleimide compound is at least 1, preferably 2 or more, and the upper limit is, for example, 20 or less, 10 or less, and the like. obtain.

(A) The specific maleimide compound is preferably a maleimide-terminal polyimide in one embodiment. The maleimide-terminal polyimide is a chain-like polyimide having a maleimide group at both ends (a chain-like polymer having an imide structure as a repeating unit). It is known that the maleimide-terminated polyimide can be obtained, for example, by subjecting a component containing a diamine compound, maleic anhydride and tetracarboxylic acid dianhydride to an imidization reaction.

(A) The specific maleimide compound is, in one embodiment, of the formula (n1) :.

[In the formula, R ¹ independently indicates a substituent; ring Z may independently have a non-aromatic ring which may have a substituent or a substituent. Aromatic rings are shown; Z ¹ and Z ² are independent, single bond, alkylene group, -O-, -CO-, -S-, -SO-, -SO _2- , -CONH-, -NHCO. -, -COO-, or -OCO-; e indicates 0 or 1 independently; f indicates an integer of 0 or 1 or more independently; g indicates independent. , 0, 1 or 2; other symbols are the same as above. ]
It is preferable that the maleimide compound contains the structural unit represented by the formula (n1), and in addition to the structural unit represented by the formula (n1), the formula (n2):

[In the formula, each symbol is the same as above. ]
It is more preferable that the maleimide compound contains a structural unit represented by. The f unit and the g unit may be the same or different for each unit.

Each of R ¹ independently represents a substituent and is preferably an alkyl group. Ring Z independently represents a non-aromatic ring which may have a substituent or an aromatic ring which may have a substituent, and preferably an aromatic ring which may have a substituent. Is.

The aromatic ring means a ring according to Hückel's law in which the number of electrons contained in the π-electron system on the ring is 4p + 2 (p is a natural number). The aromatic ring may be an aromatic carbocycle having a carbon atom as a ring-constituting atom, or an aromatic heterocyclic ring having a heteroatom such as an oxygen atom, a nitrogen atom, and a sulfur atom in addition to the carbon atom as the ring-constituting atom. However, in one embodiment, it is preferably an aromatic carbon ring. In one embodiment, the aromatic ring is preferably a 5- to 14-membered aromatic ring, more preferably a 5- to 10-membered aromatic ring, and even more preferably a 5- or 6-membered aromatic ring. Preferable specific examples of the aromatic ring include a benzene ring, a naphthalene ring, an anthracene ring, a phenanthrene ring and the like, more preferably a benzene ring or a naphthalene ring, and particularly preferably a benzene ring.

The non-aromatic ring means a ring other than the aromatic ring. The non-aromatic ring is a non-aromatic carbocycle having a carbon atom as a ring-constituting atom, or a non-aromatic heterocyclic ring having a heteroatom such as an oxygen atom, a nitrogen atom, and a sulfur atom in addition to a carbon atom as a ring-constituting atom. However, in one embodiment, it is preferably a non-aromatic carbon ring. The non-aromatic ring may be a saturated ring or an unsaturated non-aromatic ring, but in one embodiment, it is preferably a saturated ring. The non-aromatic ring is preferably a 4- to 14-membered non-aromatic ring in one embodiment. Examples of the non-aromatic ring include a monocycloalkane ring such as a cyclobutane ring, a cyclopentane ring, a cyclohexane ring, a cycloheptan ring, and a cyclooctane ring; a cyclobutene ring, a cyclopentene ring, a cyclohexene ring, a cyclohepten ring, a cyclooctene ring, and a cyclopentadiene. Examples include a monocycloalkene ring such as a ring and a cyclohexadiene ring; an aromatic ring-non-aromatic ring fused ring such as an indan ring, an inden ring, a tetralin ring, and a fluorene ring.

Z ¹ and Z ² are independent, single bond, alkylene group, -O-, -CO-, -S-, -SO-, -SO _2- , -CONH-, -NHCO-, -COO-, respectively. , Or -OCO-.

The alkylene group means a linear or branched divalent aliphatic saturated hydrocarbon group. The alkylene group is preferably an alkylene group having 1 to 14 carbon atoms. Examples of the alkylene group include a linear alkylene group such as a methylene group, an ethylene group, a trimethylene group, a tetramethylene group, a pentamethylene group, a hexamethylene group, a heptamethylene group, an octamethylene group, a nonamethylene group and a decamethylene group; (-CH (CH ₃ )-), Propyridene group (-CH (CH ₂ CH ₃ )-), Isopropyridene group (-C (CH ₃ ) _2- ), Ethylmethylmethylene group (-C (CH ₃ )-) Examples thereof include a branched alkylene group such as CH ₂ CH ₃ )-) and a diethylmethylene group (-C (CH ₂ CH ₃ ) _2- ).

e represents 0 or 1, preferably 0. f independently represents an integer of 0 or 1 or more, and is preferably 0, 1 or 2. g independently represents 0, 1 or 2, and is preferably 0.

The partial structure represented by the formula (X1) included in the structural unit represented by the formula (n1) is preferably a partial structure represented by the formula (X2), and is a portion represented by the formula (X3). The structure is particularly preferred. The partial structure represented by the formula (Y1) included in the structural unit represented by the formula (n2) is preferably a partial structure represented by the formula (Y2), and is a portion represented by the formula (Y3). The structure is particularly preferable.

The formula (Z) included in the structural units represented by the formula (n1) and the formula (n2):

[In the formula, * is the same as above. ]
As a specific example of the partial structure represented by, the formulas (Z-1) to (Z-25):

[In the formula, * is the same as above. ]
The partial structure represented by any of the above can be mentioned, and the partial structure represented by the formula (Z-1) is preferable.

In one embodiment, the specific maleimide compound (A) is more preferably of the formula (A1) :.

[In the equation, n1 indicates an integer of 1 or more; n2 indicates an integer of 0 or 1 or more (preferably an integer of 1 or more); m1 and m2 indicate 1 for either one and 0 for the other. The other symbols are the same as above. ]
It is a compound represented by (a bond between n1 unit and n2 unit). The order and individual arrangement of n1 units and n2 units are arbitrary, and include alternate copolymers, block copolymers, random copolymers, and the like. The n1 unit and the n2 unit may be the same or different for each unit.

The partial structure represented by the formula (X1) contained in the compound represented by the formula (A1) is preferably a partial structure represented by the formula (X2), and is a partial structure represented by the formula (X3). Is particularly preferable. The partial structure represented by the formula (Y1) contained in the compound represented by the formula (A1) is preferably a partial structure represented by the formula (Y2), and is a partial structure represented by the formula (Y3). Is particularly preferable. The partial structure represented by the formula (Z) contained in the compound represented by the formula (A1) is preferably a partial structure represented by the formula (Z-1).

In one embodiment, the specific maleimide compound (A) is even more preferably of the formula (A2) :.

[In the formula, each symbol is the same as above. ]
It is a compound represented by (a bond between n1 unit and n2 unit), and particularly preferably, the formula (A3) :.

[In the formula, each symbol is the same as above. ]
It is a compound represented by (a bond between n1 unit and n2 unit).

(A) The weight average molecular weight (Mw) of the specific maleimide compound is preferably 1000 to 50,000, more preferably 2000 to 50,000, more preferably 2000 to 40,000, still more preferably 2500 to 20000. (A) The number average molecular weight (Mn) of the specific maleimide compound is preferably 1000 to 50,000, more preferably 1500 to 40,000, still more preferably 2000 to 20000. The weight average molecular weight and the number average molecular weight of the resin can be measured as polystyrene-equivalent values by the gel permeation chromatography (GPC) method.

(A) The functional group equivalent of the specific maleimide compound is preferably 500 g / eq. ~ 20000 g / eq. , More preferably 1000 g / eq. ~ 10,000 g / eq. Is. The functional group equivalent of the (A) specific maleimide compound is the mass of the (A) specific maleimide compound per one equivalent of the maleimide group.

(A) Examples of commercially available products of the specific maleimide compound include "SLK-2600" manufactured by Shin-Etsu Chemical Co., Ltd.

The content of the (A) specific maleimide compound in the resin composition is not particularly limited, but when the non-volatile component in the resin composition is 100% by mass, it is preferably 50% by mass or less, more preferably 50% by mass or less. It is 40% by mass or less, more preferably 30% by mass or less, still more preferably 20% by mass or less, and particularly preferably 15% by mass or less. The lower limit of the content of the (A) specific maleimide compound in the resin composition is not particularly limited, but is preferably 0.1% by mass or more when the non-volatile component in the resin composition is 100% by mass. , More preferably 1% by mass or more, still more preferably 3% by mass or more, still more preferably 5% by mass or more, and particularly preferably 7% by mass or more.

<(A') Other radically polymerizable compounds>
The resin composition of the present invention may further contain (A') radically polymerizable compound other than the component (A) as an optional component. (A') The radically polymerizable compound may be used alone or in any combination of two or more.

The (A') radically polymerizable compound can be, for example, a compound having a radically polymerizable unsaturated group. The radically polymerizable unsaturated group is not particularly limited as long as it can be radically polymerizable, but an ethylenically unsaturated group having a carbon-carbon double bond at the terminal or inside is preferable, and specifically, an allyl group. , 3-Cyclohexenyl group and other unsaturated aliphatic groups; p-vinylphenyl group, m-vinylphenyl group, styryl group and other unsaturated aliphatic group-containing aromatic groups; acryloyl group, methacryloyl group, male oil group (imide) When it is converted, it may be an α, β-unsaturated carbonyl group such as a maleimide group) or a fumaroyl group. The (A') radically polymerizable compound preferably has one or more radically polymerizable unsaturated groups, and more preferably two or more.

As the (A') other radically polymerizable compound, known radically polymerizable compounds can be widely used, and the present invention is not particularly limited, but for example, two or more maleimide groups other than the component (A). Maleimide radically polymerizable compound having two or more vinylphenyl radical polymerizable compounds, vinylphenyl radically polymerizable compound having two or more vinylphenyl groups, (meth) acrylic radically polymerizable compound having two or more acryloyl groups and / or methacryloyl groups, etc. Can be mentioned.

The maleimide-based radically polymerizable compound is not particularly limited, and may be an aliphatic maleimide compound containing an aliphatic amine skeleton or an aromatic maleimide compound containing an aromatic amine skeleton, as a commercially available product. For example, "BMI-1500", "BMI-1700", "BMI-3000J", "BMI-689", "BMI-2500" (maleimide compound containing dimerdiamine structure) manufactured by Designer Moleculars, designer. "BMI-6100" (aromatic maleimide compound) manufactured by Molecule's, "MIR-5000-60T", "MIR-3000-70MT" (biphenyl aralkyl type maleimide compound) manufactured by Nippon Kayaku Co., Ltd. Examples thereof include "BMI-70" and "BMI-80" manufactured by Kasei Co., Ltd., "BMI-2300" and "BMI-TMH" manufactured by Daiwa Kasei Kogyo Co., Ltd. Further, as the maleimide-based radically polymerizable compound, a maleimide resin (maleimide compound containing an indane ring skeleton) disclosed in Publication No. 2020-500211 of the Japan Institute of Invention and Innovation may be used.

The vinylphenyl radically polymerizable compound is not particularly limited, but in one embodiment, it is preferably a thermoplastic resin having a vinylphenyl group, a modified polyphenylene ether resin having a vinylphenyl group, and vinylphenyl. Resins selected from modified polystyrene resins having a group are more preferable, and commercially available products include, for example, "OPE-2St 1200" and "OPE-2St 2200" (vinyl benzyl-modified polyphenylene ether resin) manufactured by Mitsubishi Gas Chemicals, Inc.; Examples thereof include "ODV-XET-X03", "ODV-XET-X04" and "ODV-XET-X05" (divinylbenzene / styrene copolymer) manufactured by Iron Chemical & Materials Co., Ltd.

The (meth) acrylic radically polymerizable compound is not particularly limited, but in one embodiment, it is preferably a thermoplastic resin having an acryloyl group and / or a methacryloyl group, and an acryloyl group and / or a methacryloyl group. A resin selected from a modified polyphenylene ether resin having an acryloyl group and / or a modified polystyrene resin having an acryloyl group and / or a methacryloyl group is more preferable, and examples of commercially available products include "SA9000" and "SA9000-111" manufactured by SABIC Innovative Plastics. "(Methacryl-modified polyphenylene ether resin) and the like.

The functional group equivalent of the (A') other radically polymerizable compound is preferably 100 g / eq. ~ 20000 g / eq. , More preferably 200 g / eq. ~ 15000 g / eq. , More preferably 300 g / eq. ~ 10,000 g / eq. Is. The functional group equivalent of (A') other radically polymerizable compound is (A') other radical polymerization per equivalent amount of radically polymerizable unsaturated group (that is, maleimide group, vinylphenyl group, acryloyl group, methacryloyl group, etc.). The mass of the sex compound.

The weight average molecular weight (Mw) of the (A') other radically polymerizable compound is preferably 500 to 50,000, more preferably 700 to 20,000. The number average molecular weight (Mn) of the (A') other radically polymerizable compound is preferably 500 to 50,000, more preferably 700 to 20,000.

The content of the (A') and other radically polymerizable compounds in the resin composition is not particularly limited, but is preferably 50% by mass or less when the non-volatile component in the resin composition is 100% by mass. , More preferably 40% by mass or less, still more preferably 30% by mass or less, still more preferably 20% by mass or less, and particularly preferably 10% by mass or less. The lower limit of the content of the (A') and other radically polymerizable compounds in the resin composition is not particularly limited, but when the non-volatile component in the resin composition is 100% by mass, for example, 0% by mass. % Or more, 0.1% by mass or more, 1% by mass or more, 2% by mass or more, and the like.

The content of the (A) specific maleimide compound in the resin composition is preferably 100% by mass when the total radically polymerizable compound (total of the components (A) and (A')) in the resin composition is 100% by mass. It is 10% by mass or more, more preferably 30% by mass or more, still more preferably 40% by mass or more, and particularly preferably 50% by mass or more.

<(B) Active ester compound>
The resin composition of the present invention contains (B) an active ester compound. (B) The active ester compound may be used alone or in combination of two or more at any ratio. In one embodiment, when the resin composition contains (C) epoxy resin, or when the resin composition is mixed with (C) epoxy resin, the (B) active ester compound reacts with (C) epoxy resin. Can have a function as an epoxy resin curing agent to be cured.

(B) As the active ester compound, generally, two or more ester groups with high reaction activity such as phenol esters, thiophenol esters, N-hydroxyamine esters, and esters of heterocyclic hydroxy compounds are contained in one molecule. The compound to have is preferably used. The active ester compound is preferably obtained by a condensation reaction between a carboxylic acid compound and / or a thiocarboxylic acid compound and a hydroxy compound and / or a thiol compound. In particular, from the viewpoint of improving heat resistance, an active ester compound obtained from a carboxylic acid compound and a hydroxy compound is preferable, and an active ester compound obtained from a carboxylic acid compound and a phenol compound and / or a naphthol compound is more preferable. Examples of the carboxylic acid compound include benzoic acid, acetic acid, succinic acid, maleic acid, itaconic acid, phthalic acid, isophthalic acid, terephthalic acid, pyromellitic acid and the like. Examples of the phenol compound or naphthol compound include hydroquinone, resorcin, bisphenol A, bisphenol F, bisphenol S, phenolphthalin, methylated bisphenol A, methylated bisphenol F, methylated bisphenol S, phenol, o-cresol, m-. Cresol, p-cresol, catechol, α-naphthol, β-naphthol, 1,5-dihydroxynaphthalene, 1,6-dihydroxynaphthalene, 2,6-dihydroxynaphthalene, dihydroxybenzophenol, trihydroxybenzophenone, tetrahydroxybenzophenone, fluoroglucin, Examples thereof include benzenetriol, dicyclopentadiene-type diphenol compound, and phenol novolac. Here, the "dicyclopentadiene-type diphenol compound" refers to a diphenol compound obtained by condensing two phenol molecules with one dicyclopentadiene molecule.

Specifically, the (B) active ester compound includes a dicyclopentadiene type active ester compound, a naphthalene type active ester compound containing a naphthalene structure, an active ester compound containing a phenol novolac acetylated product, and a phenol novolak benzoyl compound. The active ester compound is preferable, and at least one selected from the dicyclopentadiene type active ester compound and the naphthalene type active ester compound is more preferable, and the dicyclopentadiene type active ester compound is further preferable. As the dicyclopentadiene type active ester compound, an active ester compound containing a dicyclopentadiene type diphenol structure is preferable.

(B) Commercially available products of the active ester compound include "EXB9451", "EXB9460", "EXB9460S", "EXB-8000L" and "EXB-8000L-65M" as active ester compounds containing a dicyclopentadiene type diphenol structure. , "EXB-8000L-65TM", "HPC-8000L-65TM", "HPC-8000", "HPC-8000-65T", "HPC-8000H", "HPC-8000H-65TM", (manufactured by DIC). ); As active ester compounds containing a naphthalene structure, "EXB-8100L-65T", "EXB-8150-60T", "EXB-8150-62T", "EXB-9416-70BK", "HPC-8150-60T", "HPC-8150-62T", "EXB-8" (manufactured by DIC); "EXB9401" (manufactured by DIC) as a phosphorus-containing active ester compound, and "DC808" (DC808) as an acetylated compound of phenol novolac. Mitsubishi Chemical Co., Ltd.), "YLH1026", "YLH1030", "YLH1048" (manufactured by Mitsubishi Chemical Co., Ltd.) as active ester compounds which are benzoylated compounds of phenol novolac, and "PC1300-02" as active ester compounds containing styryl group and naphthalene structure. -65MA "(manufactured by Air Water Co., Ltd.) and the like.

(B) The active ester group equivalent of the active ester compound is preferably 50 g / eq. ~ 500 g / eq. , More preferably 50 g / eq. ~ 400 g / eq. , More preferably 100 g / eq. ~ 300 g / eq. Is. The active ester group equivalent is the mass of the active ester compound per active ester group equivalent.

The content of the (B) active ester compound in the resin composition is not particularly limited, but when the non-volatile component in the resin composition is 100% by mass, it is preferably 50% by mass or less, more preferably 50% by mass or less. It is 40% by mass or less, more preferably 30% by mass or less, still more preferably 20% by mass or less, and particularly preferably 15% by mass or less. The lower limit of the content of the (B) active ester compound in the resin composition is not particularly limited, but is preferably 0.1% by mass or more when the non-volatile component in the resin composition is 100% by mass. , More preferably 1% by mass or more, still more preferably 3% by mass or more, still more preferably 5% by mass or more, and particularly preferably 7% by mass or more.

The mass ratio ((A) component / (B) component) of the (A) specific maleimide compound to the (B) active ester compound in the resin composition is preferably 0.1 or more, more preferably 0.5 or more, particularly. It is preferably 0.7 or more. The upper limit of the mass ratio ((A) component / (B) component) of the (A) specific maleimide compound to the (B) active ester compound in the resin composition is preferably 10 or less, more preferably 3 or less, and particularly preferably. It is 1.5 or less.

<(C) Epoxy resin>
The resin composition of the present invention may contain (C) epoxy resin as an optional component. (C) The epoxy resin is a curable resin having an epoxy group.

Examples of the epoxy resin include bixilenol type epoxy resin, bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, bisphenol AF type epoxy resin, dicyclopentadiene type epoxy resin, and trisphenol type. Epoxy resin, naphthol novolac type epoxy resin, phenol novolac type epoxy resin, tert-butyl-catechol type epoxy resin, naphthalene type epoxy resin, naphthol type epoxy resin, anthracene type epoxy resin, glycidylamine type epoxy resin, glycidyl ester type epoxy resin , Cresol novolak type epoxy resin, phenol aralkyl type epoxy resin, biphenyl type epoxy resin, linear aliphatic epoxy resin, epoxy resin having a butadiene structure, alicyclic epoxy resin, heterocyclic epoxy resin, spiro ring-containing epoxy resin, Cyclohexane type epoxy resin, cyclohexanedimethanol type epoxy resin, naphthylene ether type epoxy resin, trimethylol type epoxy resin, tetraphenylethane type epoxy resin, isocyanurate type epoxy resin, phenolphthalimidine type epoxy resin, phenolphthaline Examples include type epoxy resins. (C) One type of epoxy resin may be used alone, or two or more types may be used in combination.

The resin composition preferably contains, as the (C) epoxy resin, an epoxy resin having two or more epoxy groups in one molecule. (C) The ratio of the epoxy resin having two or more epoxy groups in one molecule to 100% by mass of the non-volatile component of the epoxy resin is preferably 50% by mass or more, more preferably 60% by mass or more, and particularly preferably. Is 70% by mass or more.

The epoxy resin may be a liquid epoxy resin at a temperature of 20 ° C. (hereinafter, may be referred to as “liquid epoxy resin”) or a solid epoxy resin at a temperature of 20 ° C. (hereinafter, “solid epoxy resin”). ). The resin composition of the present invention may contain only the liquid epoxy resin or only the solid epoxy resin as the epoxy resin, or may contain the liquid epoxy resin and the solid epoxy resin in combination. You may be. The epoxy resin in the resin composition of the present invention is preferably a solid epoxy resin or a combination of a liquid epoxy resin and a solid epoxy resin, and more preferably a solid epoxy resin.

As the liquid epoxy resin, a liquid epoxy resin having two or more epoxy groups in one molecule is preferable.

Examples of the liquid epoxy resin include bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol AF type epoxy resin, naphthalene type epoxy resin, glycidyl ester type epoxy resin, glycidylamine type epoxy resin, phenol novolac type epoxy resin, and ester skeleton. An alicyclic epoxy resin having an alicyclic epoxy resin, a cyclohexane type epoxy resin, a cyclohexanedimethanol type epoxy resin, and an epoxy resin having a butadiene structure are preferable.

Specific examples of the liquid epoxy resin include "HP4032", "HP4032D", and "HP4032SS" (naphthalene type epoxy resin) manufactured by DIC; "828US", "828EL", "jER828EL", and "825" manufactured by Mitsubishi Chemical Co., Ltd. , "Epicoat 828EL" (bisphenol A type epoxy resin); "jER807", "1750" (bisphenol F type epoxy resin) manufactured by Mitsubishi Chemical Co., Ltd .; "jER152" (phenol novolak type epoxy resin) manufactured by Mitsubishi Chemical Co., Ltd.; Mitsubishi Chemical's "630", "630LSD", "604" (glycidylamine type epoxy resin); ADEKA's "ED-523T" (glycilol type epoxy resin); ADEKA's "EP-3950L", "EP-3980S" (glycidylamine type epoxy resin); "EP-4088S" (dicyclopentadiene type epoxy resin) manufactured by ADEKA; "ZX1059" (bisphenol A type epoxy resin) manufactured by Nittetsu Chemical & Materials Chemicals Co., Ltd. Bisphenol F type epoxy resin mixture); Nagase Chemtex's "EX-721" (glycidyl ester type epoxy resin); Daicel's "Selokiside 2021P" (alicyclic epoxy resin with an ester skeleton); "PB-3600" manufactured by Nippon Soda, "JP-100", "JP-200" (epoxy resin having a butadiene structure); "ZX1658", "ZX1658GS" manufactured by Nittetsu Chemical & Material Chemical Co., Ltd. (Liquid 1,4-glycidylcyclohexane type epoxy resin) and the like can be mentioned. These may be used individually by 1 type, or may be used in combination of 2 or more types.

As the solid epoxy resin, a solid epoxy resin having three or more epoxy groups in one molecule is preferable, and an aromatic solid epoxy resin having three or more epoxy groups in one molecule is more preferable.

Examples of the solid epoxy resin include bixilenol type epoxy resin, naphthalene type epoxy resin, naphthalene type tetrafunctional epoxy resin, naphthol novolac type epoxy resin, cresol novolac type epoxy resin, dicyclopentadiene type epoxy resin, and trisphenol type epoxy resin. Naftor type epoxy resin, biphenyl type epoxy resin, naphthylene ether type epoxy resin, anthracene type epoxy resin, bisphenol A type epoxy resin, bisphenol AF type epoxy resin, phenol aralkyl type epoxy resin, tetraphenylethane type epoxy resin, phenol phthali Midin type epoxy resin and phenol phthalein type epoxy resin are preferable.

Specific examples of the solid epoxy resin include "HP4032H" (naphthalene type epoxy resin) manufactured by DIC; "HP-4700" and "HP-4710" (naphthalen type tetrafunctional epoxy resin) manufactured by DIC; DIC. "N-690" (cresol novolac type epoxy resin); DIC "N-695" (cresol novolac type epoxy resin); DIC "HP-7200", "HP-7200HH", "HP" -7200H "," HP-7200L "(dicyclopentadiene type epoxy resin);" EXA-7311 "," EXA-7311-G3 "," EXA-7311-G4 "," EXA-7311-G4S "manufactured by DIC. , "HP6000" (naphthylene ether type epoxy resin); "EPPN-502H" (trisphenol type epoxy resin) manufactured by Nippon Kayaku Co., Ltd .; "NC7000L" (naphthol novolac type epoxy resin) manufactured by Nihon Kayaku Co., Ltd.; "NC3000H", "NC3000", "NC3000L", "NC3000FH", "NC3100" (biphenyl type epoxy resin) manufactured by Nippon Kayaku Co., Ltd .; "ESN475V", "ESN4100V" (naphthalen type) manufactured by Nittetsu Chemical & Materials Co., Ltd. Epoxy resin); "ESN485" (naphthol type epoxy resin) manufactured by Nittetsu Chemical &Materials; "ESN375" (dihydroxynaphthalene type epoxy resin) manufactured by Nittetsu Chemical &Materials; "YX4000H" manufactured by Mitsubishi Chemical Co., Ltd., "YX4000", "YX4000HK", "YL7890" (bixilenol type epoxy resin); "YL6121" (biphenyl type epoxy resin) manufactured by Mitsubishi Chemical Co., Ltd .; "YX8800" (anthracen type epoxy resin) manufactured by Mitsubishi Chemical Co., Ltd.; Chemical's "YX7700" (phenol aralkyl type epoxy resin); Osaka Gas Chemical's "PG-100", "CG-500"; Mitsubishi Chemical's "YL7760" (bisphenol AF type epoxy resin); Mitsubishi "YL7800" manufactured by Chemical Co., Ltd. (fluorene type epoxy resin); "jER1010" manufactured by Mitsubishi Chemical Co., Ltd. (bisphenol A type epoxy resin); "jER1031S" manufactured by Mitsubishi Chemical Co., Ltd. (tetraphenylethane type epoxy resin); Examples thereof include "WHR991S" (phenol phthalimidine type epoxy resin) manufactured by the same company. These may be used individually by 1 type, or may be used in combination of 2 or more types.

(C) When the liquid epoxy resin and the solid epoxy resin are used in combination as the epoxy resin, the mass ratio of the liquid epoxy resin to the solid epoxy resin (liquid epoxy resin / solid epoxy resin) is not particularly limited. However, it is preferably 10 or less, more preferably 5 or less, still more preferably 1 or less, still more preferably 0.5 or less, and particularly preferably 0.1 or less.

The epoxy equivalent of the (C) epoxy resin is preferably 50 g / eq. ~ 5,000 g / eq. , More preferably 60 g / eq. ~ 2,000 g / eq. , More preferably 70 g / eq. ~ 1,000 g / eq. , Even more preferably 80 g / eq. ~ 500 g / eq. Is. Epoxy equivalent is the mass of resin per equivalent of epoxy group. This epoxy equivalent can be measured according to JIS K7236.

The weight average molecular weight (Mw) of the epoxy resin (C) is preferably 100 to 5,000, more preferably 250 to 3,000, and even more preferably 400 to 1,500. The weight average molecular weight of the resin can be measured as a polystyrene-equivalent value by a gel permeation chromatography (GPC) method.

The content of the (C) epoxy resin in the resin composition is not particularly limited, but when the non-volatile component in the resin composition is 100% by mass, it is preferably 60% by mass or less, more preferably 50. It is 0% by mass or less, more preferably 40% by mass or less, still more preferably 30% by mass or less, and particularly preferably 20% by mass or less. The lower limit of the content of the (C) epoxy resin in the resin composition is not particularly limited, but when the non-volatile component in the resin composition is 100% by mass, it is, for example, 0% by mass or more, which is preferable. Is 0.01% by mass or more, preferably 0.1% by mass or more, more preferably 0.5% by mass or more, still more preferably 1% by mass or more, still more preferably 5% by mass or more, and particularly preferably 10% by mass. That is all.

The mass ratio ((A) component / (C) component) of the (A) specific maleimide compound to the (C) epoxy resin in the resin composition is preferably 0.1 or more, more preferably 0.3 or more, and particularly preferably. Is 0.5 or more. The upper limit of the mass ratio ((A) component / (C) component) of the (A) specific maleimide compound to the (C) epoxy resin in the resin composition is preferably 10 or less, more preferably 3 or less, and particularly preferably 1. It is as follows.

<(D) Inorganic filler>
The resin composition of the present invention may contain (D) an inorganic filler as an optional component. (D) The inorganic filler is contained in the resin composition in the form of particles.

(D) An inorganic compound is used as the material of the inorganic filler. (D) Materials for the inorganic filler include, for example, silica, alumina, glass, cordierite, silicon oxide, barium sulfate, barium carbonate, talc, clay, mica powder, zinc oxide, hydrotalcite, boehmite, and water. Aluminum oxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, magnesium oxide, boron nitride, aluminum nitride, manganese nitride, aluminum borate, strontium carbonate, strontium titanate, calcium titanate, magnesium titanate, bismuth titanate, titanium oxide , Zirconium oxide, barium titanate, barium zirconate titanate, barium zirconate, calcium zirconate, zirconium phosphate, zirconium tungstate phosphate and the like. Of these, silica is particularly suitable. Examples of silica include amorphous silica, fused silica, crystalline silica, synthetic silica, hollow silica and the like. Further, as silica, spherical silica is preferable. (D) The inorganic filler may be used alone or in combination of two or more at any ratio.

(D) Commercially available inorganic fillers include, for example, "UFP-30" manufactured by Denka Kagaku Kogyo Co., Ltd .; "SP60-05" and "SP507-05" manufactured by Nippon Steel & Sumikin Materials Co., Ltd .; "YC100C", "YA050C", "YA050C-MJE", "YA010C"; "UFP-30" manufactured by Denka Corporation; "Silfil NSS-3N", "Silfil NSS-4N", "Silfil NSS-" manufactured by Tokuyama Corporation. 5N ”;“ SC2500SQ ”,“ SO-C4 ”,“ SO-C2 ”,“ SO-C1 ”manufactured by Admatex;“ DAW-03 ”,“ FB-105FD ”manufactured by Denka, and the like.

(D) The average particle size of the inorganic filler is not particularly limited, but is preferably 10 μm or less, more preferably 5 μm or less, still more preferably 2 μm or less, still more preferably 1 μm or less, and particularly preferably 0. It is 7 μm or less. (D) The lower limit of the average particle size of the inorganic filler is not particularly limited, but is preferably 0.01 μm or more, more preferably 0.05 μm or more, still more preferably 0.1 μm or more, and particularly preferably 0. .2 μm or more. (D) The average particle size of the inorganic filler can be measured by a laser diffraction / scattering method based on the Mie scattering theory. Specifically, it can be measured by creating a particle size distribution of the inorganic filler on a volume basis by a laser diffraction / scattering type particle size distribution measuring device and using the median diameter as the average particle size. As the measurement sample, 100 mg of an inorganic filler and 10 g of methyl ethyl ketone can be weighed in a vial and dispersed by ultrasonic waves for 10 minutes. The measurement sample was measured using a laser diffraction type particle size distribution measuring device, the light source wavelengths used were blue and red, and the volume-based particle size distribution of the inorganic filler was measured by the flow cell method. The average particle size was calculated as the median diameter. Examples of the laser diffraction type particle size distribution measuring device include "LA-960" manufactured by HORIBA, Ltd.

(D) The specific surface area of the inorganic filler is not particularly limited, but is preferably 0.1 m ² / g or more, more preferably 0.5 m ² / g or more, still more preferably 1 m ² / g or more. Particularly preferably, it is 3 m ² / g or more. (D) The upper limit of the specific surface area of the inorganic filler is not particularly limited, but is preferably 100 m ² / g or less, more preferably 70 m ² / g or less, still more preferably 50 m ² / g or less, and particularly preferably. Is 40 m ² / g or less. For the specific surface area of the inorganic filler, nitrogen gas is adsorbed on the sample surface using a specific surface area measuring device (Maxorb HM-1210 manufactured by Mountech) according to the BET method, and the specific surface area is calculated using the BET multipoint method. It can be obtained by.

(D) The inorganic filler is preferably surface-treated with an appropriate surface treatment agent. By surface treatment, (D) the moisture resistance and dispersibility of the inorganic filler can be enhanced. Examples of the surface treatment agent include vinyl-based silane coupling agents such as vinyltrimethoxysilane and vinyltriethoxysilane; 2- (3,4-epyloxycyclohexyl) ethyltrimethoxysilane and 3-glycidoxypropylmethyldimethoxysilane. , 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldiethoxysilane, 3-glycidoxypropyltriethoxysilane and other epoxy-based silane coupling agents; p-styryltrimethoxysilane and other styryl-based Silane coupling agents; methacrylic silane coupling agents such as 3-methacryloxypropylmethyldimethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-methacryloxypropylmethyldiethoxysilane, 3-methacryloxypropyltriethoxysilane; Acrylic silane coupling agents such as 3-acryloxypropyltrimethoxysilane; N-2- (aminoethyl) -3-aminopropylmethyldimethoxysilane, N-2- (aminoethyl) -3-aminopropyltrimethoxysilane , 3-Aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-triethoxysilyl-N- (1,3-dimethyl-butylidene) propylamine, N-phenyl-3-aminopropyltrimethoxysilane, N -Amino-based silane coupling agents such as phenyl-8-aminooctyltrimethoxysilane, N- (vinylbenzyl) -2-aminoethyl-3-aminopropyltrimethoxysilane; tris- (trimethoxysilylpropyl) isocyanurate, etc. Isocyanurate-based silane coupling agent; ureido-based silane coupling agent such as 3-ureidopropyltrialkoxysilane; mercapto-based silane coupling agent such as 3-mercaptopropylmethyldimethoxysilane and 3-mercaptopropyltrimethoxysilane. An isocyanate-based silane coupling agent such as 3-isocyanatepropyltriethoxysilane; an acid anhydride-based silane coupling agent such as 3-trimethoxysilylpropylsuccinic anhydride; a silane coupling agent such as; methyltrimethoxysilane, Dimethyldimethoxysilane, phenyltrimethoxysilane, methyltriethoxysilane, dimethyldiethoxysilane, phenyltriethoxysilane, n-propyltrimethoxysilane, n-propyltriethoxysilane, hexyltrimeth Examples thereof include alkylalkoxysilane compounds such as xysilane, hexyltriethoxysilane, octyltriethoxysilane, decyltrimethoxysilane, 1,6-bis (trimethoxysilyl) hexane, and trifluoropropyltrimethoxysilane. Further, the surface treatment agent may be used alone or in combination of two or more at any ratio.

Examples of commercially available surface treatment agents include "KBM-1003" and "KBE-1003" (vinyl-based silane coupling agents) manufactured by Shin-Etsu Chemical Industry Co., Ltd .; "KBM-303", "KBM-402", and "KBM-402". KBM-403 "," KBE-402 "," KBE-403 "(epoxy-based silane coupling agent);" KBM-1403 "(styryl-based silane coupling agent);" KBM-502 "," KBM-503 " , "KBE-502", "KBE-503" (methacrylic silane coupling agent); "KBM-5103" (acrylic silane coupling agent); "KBM-602", "KBM-603", "KBM-" 903 ”,“ KBE-903 ”,“ KBE-9103P ”,“ KBM-573 ”,“ KBM-575 ”(amino silane coupling agent);“ KBM-9569 ”(isocyanurate-based silane coupling agent); "KBE-585" (ureido-based silane coupling agent); "KBM-802", "KBM-803" (mercapto-based silane coupling agent); "KBE-9007N" (isocyanate-based silane coupling agent); "X" -12-967C "(acid anhydride-based silane coupling agent);" KBM-13 "," KBM-22 "," KBM-103 "," KBE-13 "," KBE-22 "," KBE-103 " , "KBM-3033", "KBE-3033", "KBM-3063", "KBE-3063", "KBE-3083", "KBM-3103C", "KBM-3066", "KBM-7103" ( Alkylalkoxysilane compound) and the like.

The degree of surface treatment with the surface treatment agent is preferably within a predetermined range from the viewpoint of improving the dispersibility of the inorganic filler. Specifically, 100% by mass of the inorganic filler is preferably surface-treated with 0.2% by mass to 5% by mass of a surface treatment agent, and is surface-treated with 0.2% by mass to 3% by mass. It is more preferable that the surface is treated with 0.3% by mass to 2% by mass.

The degree of surface treatment with the surface treatment agent can be evaluated by the amount of carbon per unit surface area of the inorganic filler. The amount of carbon per unit surface area of the inorganic filler is preferably 0.02 mg / m ² or more, more preferably 0.1 mg / m ^{2 or more, and 0.2 mg / m 2 from} the viewpoint of improving the dispersibility of the inorganic filler. The above is more preferable. On the other hand, from the viewpoint of preventing an increase in the melt viscosity of the resin composition and the melt viscosity in the sheet form, 1.0 mg / m ² or less is preferable, 0.8 mg / m ² or less is more preferable, and 0.5 mg / m ² or less is preferable. The following is more preferable.

(D) The amount of carbon per unit surface area of the inorganic filler can be measured after the surface-treated inorganic filler is washed with a solvent (for example, methyl ethyl ketone (MEK)). Specifically, a sufficient amount of MEK as a solvent is added to the inorganic filler surface-treated with a surface treatment agent, and ultrasonic cleaning is performed at 25 ° C. for 5 minutes. After removing the supernatant and drying the solid content, the amount of carbon per unit surface area of the inorganic filler can be measured using a carbon analyzer. As the carbon analyzer, "EMIA-320V" manufactured by HORIBA, Ltd. or the like can be used.

The content of the (D) inorganic filler in the resin composition is not particularly limited, but when the non-volatile component in the resin composition is 100% by mass, it is preferably 90% by mass or less, more preferably 90% by mass or less. It can be 80% by mass or less, more preferably 75% by mass or less, and particularly preferably 70% by mass or less. The lower limit of the content of the (D) inorganic filler in the resin composition is not particularly limited, but when the non-volatile component in the resin composition is 100% by mass, for example, 0% by mass or more and 1% by mass. % Or more, preferably 10% by mass or more, more preferably 30% by mass or more, still more preferably 40% by mass or more, and particularly preferably 50% by mass or more.

The mass ratio ((A) component / (D) component) of the (A) specific maleimide compound to the (D) inorganic filler in the resin composition is preferably 0.01 or more, more preferably 0.05 or more, particularly. It is preferably 0.1 or more. The upper limit of the mass ratio ((A) component / (D) component) of the (A) specific maleimide compound to the (D) inorganic filler in the resin composition is preferably 1 or less, more preferably 0.5 or less, particularly. It is preferably 0.3 or less.

<(E) Curing accelerator>
The resin composition of the present invention may contain (E) a curing accelerator as an optional component. In one embodiment, the (E) curing accelerator cures the (C) epoxy resin when the resin composition contains (C) epoxy resin, or when the resin composition is mixed with (C) epoxy resin. It has a function to promote it.

Examples of the curing accelerator include phosphorus-based curing accelerators, urea-based curing accelerators, guanidine-based curing accelerators, imidazole-based curing accelerators, metal-based curing accelerators, amine-based curing accelerators, and the like. Of these, an imidazole-based curing accelerator is preferable from the viewpoint of improving the crosslinkability. (E) The curing accelerator may be used alone or in combination of two or more.

Examples of the phosphorus-based curing accelerator include tetrabutylphosphonium bromide, tetrabutylphosphonium chloride, tetrabutylphosphonium acetate, tetrabutylphosphonium decanoate, tetrabutylphosphonium laurate, bis (tetrabutylphosphonium) pyromeritate, and tetrabutylphosphonium hydro. Alitriphenylphosphine salts such as genhexahydrophthalate, tetrabutylphosphonium 2,6-bis [(2-hydroxy-5-methylphenyl) methyl] -4-methylphenorate, di-tert-butyldimethylphosphonium tetraphenylphosphine; Methyltriphenylphosphonium bromide, ethyltriphenylphosphonium bromide, propyltriphenylphosphonium bromide, butyltriphenylphosphonium bromide, benzyltriphenylphosphonium chloride, tetraphenylphosphonium bromide, p-triltriphenylphosphoniumtetra-p-trilborate, tetraphenyl Triphenylphosphinephosphine, tetraphenylphosphinetetrap-trilborate, triphenylethylphosphoniumtetraphenylborate, tris (3-methylphenyl) ethylphosphonium tetraphenylborate, tris (2-methoxyphenyl) ethylphosphonium tetraphenylborate, (4) -Arophenylphosphine salts such as triphenylphosphine thiosianate, tetraphenylphosphine thiosianate, butyl triphenyl phosphonium thiosianate; aromatic phosphine-boran complex such as triphenylphosphine / triphenylboran; triphenylphosphine / p-benzoquinone. Arophenylphosphine / quinone addition reactants such as addition reactants; tributylphosphine, tri-tert-butylphosphine, trioctylphosphine, di-tert-butyl (2-butenyl) phosphine, di-tert-butyl (3-methyl-). 2-Butenyl) phosphine, tricyclophenylphosphine and other aliphatic phosphine; dibutylphenylphosphine, di-tert-butylphenylphosphine, methyldiphenylphosphine, ethyldiphenylphosphine, butyldiphenylphosphine, diphenylcyclophosphine, triphenylphosphine, tri-o -Triphenylphosphine, tri-m-triphenylphosphine, tri-p-tril Phosphine, Tris (4-ethylphenyl) phosphine, Tris (4-propylphenyl) phosphine, Tris (4-isopropylphenyl) phosphine, Tris (4-butylphenyl) phosphine, Tris (4-tert-butylphenyl) phosphine, Tris (2,4-dimethylphenyl) phosphine, tris (2,5-dimethylphenyl) phosphine, tris (2,6-dimethylphenyl) phosphine, tris (3,5-dimethylphenyl) phosphine, tris (2,4,6) -Trimethylphenyl) phosphine, tris (2,6-dimethyl-4-ethoxyphenyl) phosphine, tris (2-methoxyphenyl) phosphine, tris (4-methoxyphenyl) phosphine, tris (4-ethoxyphenyl) phosphine, tris ( 4-tert-butoxyphenyl) phosphine, diphenyl-2-pyridylphosphine, 1,2-bis (diphenylphosphine) ethane, 1,3-bis (diphenylphosphine) propane, 1,4-bis (diphenylphosphine) Examples thereof include aromatic phosphines such as butane, 1,2-bis (diphenylphosphino) acetylene, and 2,2'-bis (diphenylphosphino) diphenyl ether.

Examples of the urea-based curing accelerator include 1,1-dimethylurea; 1,1,3-trimethylurea, 3-ethyl-1,1-dimethylurea, 3-cyclohexyl-1,1-dimethylurea, 3-. Aliphatic dimethylurea such as cyclooctyl-1,1-dimethylurea; 3-phenyl-1,1-dimethylurea, 3- (4-chlorophenyl) -1,1-dimethylurea, 3- (3,4-dichlorophenyl) ) -1,1-dimethylurea, 3- (3-chloro-4-methylphenyl) -1,1-dimethylurea, 3- (2-methylphenyl) -1,1-dimethylurea, 3- (4- (4- Methylphenyl) -1,1-dimethylurea, 3- (3,4-dimethylphenyl) -1,1-dimethylurea, 3- (4-isopropylphenyl) -1,1-dimethylurea, 3- (4-) Methoxyphenyl) -1,1-dimethylurea, 3- (4-nitrophenyl) -1,1-dimethylurea, 3- [4- (4-methoxyphenoxy) phenyl] -1,1-dimethylurea, 3- [4- (4-Chlorophenoxy) phenyl] -1,1-dimethylurea, 3- [3- (trifluoromethyl) phenyl] -1,1-dimethylurea, N, N- (1,4-phenylene) Aromatic dimethylurea such as bis (N', N'-dimethylurea), N, N- (4-methyl-1,3-phenylene) bis (N', N'-dimethylurea) [toluene bisdimethylurea] And so on.

Examples of the guanidine-based curing accelerator include dicyandiamide, 1-methylguanidine, 1-ethylguanidine, 1-cyclohexylguanidine, 1-phenylguanidine, 1- (o-tolyl) guanidine, dimethylguanidine, diphenylguanidine, and trimethylguanidine. Tetramethylguanidine, pentamethylguanidine, 1,5,7-triazabicyclo [4.4.0] deca-5-ene, 7-methyl-1,5,7-triazabicyclo [4.4.0] Deca-5-ene, 1-methylbiguanide, 1-ethylbiguanide, 1-n-butylbiguanide, 1-n-octadecylbiguanide, 1,1-dimethylbiguanide, 1,1-diethylbiguanide, 1-cyclohexylbiguanide, 1 -Allyl biguanide, 1-phenylbiguanide, 1- (o-tolyl) biguanide and the like can be mentioned.

Examples of the imidazole-based curing accelerator include 2-methylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 1,2-dimethylimidazole, 2-ethyl-4-methylimidazole, 1,2-dimethylimidazole, and the like. 2-Ethyl-4-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 1-benzyl-2-methylimidazole, 1-benzyl-2-phenylimidazole, 1-cyanoethyl-2-methylimidazole, 1-Cyanoethyl-2-undecylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-undecylimidazolium trimellitate, 1-cyanoethyl- 2-Phenylimidazolium trimellitate, 2,4-diamino-6- [2'-methylimidazolyl- (1')]-ethyl-s-triazine, 2,4-diamino-6- [2'-undecyl Imidazolyl- (1')]-ethyl-s-triazine, 2,4-diamino-6- [2'-ethyl-4'-methylimidazolyl- (1')]-ethyl-s-triazine, 2,4- Diamino-6- [2'-methylimidazolyl- (1')]-ethyl-s-triazine isocyanuric acid adduct, 2-phenylimidazole isocyanuric acid adduct, 2-phenyl-4,5-dihydroxymethylimidazole, 2- Phenyl-4-methyl-5-hydroxymethylimidazole, 2,3-dihydro-1H-pyrrolo [1,2-a] benzimidazole, 1-dodecyl-2-methyl-3-benzylimidazolium chloride, 2-methylimidazoline , 2-Imidazole compounds such as phenylimidazolin and adducts of imidazole compounds and epoxy resins can be mentioned.

As the imidazole-based curing accelerator, a commercially available product may be used, for example, "1B2PZ", "2MZA-PW", "2PHZ-PW" manufactured by Shikoku Chemicals Corporation, and "P200-H50" manufactured by Mitsubishi Chemical Corporation. And so on.

Examples of the metal-based curing accelerator include organic metal complexes or organic metal salts of metals such as cobalt, copper, zinc, iron, nickel, manganese, and tin. Specific examples of the organic metal complex include an organic cobalt complex such as cobalt (II) acetylacetonate and cobalt (III) acetylacetonate, an organic copper complex such as copper (II) acetylacetonate, and zinc (II) acetylacetonate. Examples thereof include organic zinc complexes such as iron (III) acetylacetonate, organic nickel complexes such as nickel (II) acetylacetonate, and organic manganese complexes such as manganese (II) acetylacetonate. Examples of the organic metal salt include zinc octylate, tin octylate, zinc naphthenate, cobalt naphthenate, tin stearate, zinc stearate and the like.

Examples of the amine-based curing accelerator include trialkylamines such as triethylamine and tributylamine, 4-dimethylaminopyridine, benzyldimethylamine, 2,4,6, -tris (dimethylaminomethyl) phenol, and 1,8-diazabicyclo. (5, 4, 0) -Undesen and the like can be mentioned.

As the amine-based curing accelerator, a commercially available product may be used, and examples thereof include "MY-25" manufactured by Ajinomoto Fine-Techno Co., Ltd.

The content of the (E) curing accelerator in the resin composition is not particularly limited, but when the non-volatile component in the resin composition is 100% by mass, it is preferably 15% by mass or less, more preferably. It is 10% by mass or less, more preferably 5% by mass or less, and particularly preferably 3% by mass or less. The lower limit of the content of the (E) curing accelerator in the resin composition is not particularly limited, but when the non-volatile component in the resin composition is 100% by mass, for example, 0% by mass or more, 0. It can be 001% by mass or more, 0.01% by mass or more, 0.1% by mass or more, 0.5% by mass or more, and the like.

<(F) Other additives>
The resin composition of the present invention may further contain any additive as a non-volatile component. Examples of such additives include radical polymerization initiators such as peroxide-based radical polymerization initiators and azo-based radical polymerization initiators; phenol-based curing agents, acid anhydride-based curing agents, thiol-based curing agents, and benzos. Epoxy curing agents other than active ester compounds such as oxadin-based curing agents, cyanate ester-based curing agents, carbodiimide-based curing agents, imidazole-based curing agents, and amine-based curing agents; phenoxy resin, polyvinyl acetal resin, polyolefin resin, polysulfone resin, poly Thermoplastic resins such as ether sulfone resins, polyphenylene ether resins, polycarbonate resins, polyether ether ketone resins, polyester resins; organic fillers such as rubber particles; organic metal compounds such as organic copper compounds, organic zinc compounds and organic cobalt compounds; Colorants such as phthalocyanine blue, phthalocyanine green, iodin green, diazo yellow, crystal violet, titanium oxide, carbon black; polymerization prohibiting agents such as hydroquinone, catechol, pyrogallol, phenothiazine; silicone-based leveling agents, acrylic polymer-based leveling agents, etc. Leveling agents; thickeners such as Benton and montmorillonite; antifoaming agents such as silicone-based defoaming agents, acrylic-based defoaming agents, fluorine-based defoaming agents, vinyl resin-based defoaming agents; benzotriazole-based ultraviolet absorbers, etc. UV absorbers; adhesion improvers such as ureasilane; adhesion enhancers such as triazole-based adhesion-imparting agents, tetrazole-based adhesion-imparting agents, triazine-based adhesion-imparting agents; hindered phenol-based antioxidants, etc. Antioxidant; Fluorescent whitening agent such as stilben derivative; Surface active agent such as fluorine-based surfactant, silicone-based surfactant; Phosphorus-based flame retardant (for example, phosphoric acid ester compound, phosphazene compound, phosphinic acid compound, red phosphorus) ), Nitrogen-based flame retardant (for example, melamine sulfate), halogen-based flame retardant, inorganic flame-retardant (eg, antimony trioxide) and other flame-retardant; phosphoric acid ester-based dispersant, polyoxyalkylene-based dispersant, acetylene-based dispersant. , Silicone-based dispersants, anionic dispersants, cationic dispersants and other dispersants; borate-based stabilizers, titanate-based stabilizers, aluminate-based stabilizers, zirconate-based stabilizers, isocyanate-based stabilizers, carboxylic acid-based stabilizers Examples thereof include stabilizers such as agents and carboxylic acid anhydride-based stabilizers. (F) As the other additives, one type may be used alone, or two or more types may be used in combination at any ratio. (F) The content of other additives can be appropriately set by those skilled in the art.

<(G) Organic solvent>
The resin composition of the present invention may further contain an arbitrary organic solvent as a volatile component in addition to the above-mentioned non-volatile component. As the (G) organic solvent, known ones can be appropriately used, and the type thereof is not particularly limited. (G) Examples of the organic solvent include ketone solvents such as acetone, methyl ethyl ketone, methyl isobutyl ketone, and cyclohexanone; methyl acetate, ethyl acetate, butyl acetate, isobutyl acetate, isoamyl acetate, methyl propionate, ethyl propionate, and γ-. Ester-based solvents such as butyrolactone; ether-based solvents such as tetrahydropyran, tetrahydrofuran, 1,4-dioxane, diethyl ether, diisopropyl ether, dibutyl ether, diphenyl ether and anisol; alcohol-based solvents such as methanol, ethanol, propanol, butanol and ethylene glycol Solvents: Ether ester solvents such as 2-ethoxyethyl acetate, propylene glycol monomethyl ether acetate, diethylene glycol monoethyl ether acetate, ethyl diglycol acetate, γ-butyrolactone, methyl methoxypropionate; methyl lactate, ethyl lactate, 2-hydroxyiso Ester alcohol solvent such as methyl butyrate; ether alcohol solvent such as 2-methoxypropanol, 2-methoxyethanol, 2-ethoxyethanol, propylene glycol monomethyl ether, diethylene glycol monobutyl ether (butyl carbitol); N, N-dimethylformamide , N, N-dimethylacetamide, N-methyl-2-pyrrolidone and other amide solvents; dimethylsulfoxide and other sulfoxide solvents; acetonitrile, propionitrile and other nitrile solvents; hexane, cyclopentane, cyclohexane, methylcyclohexane and the like. The above-mentioned aliphatic hydrocarbon-based solvent; aromatic hydrocarbon-based solvents such as benzene, toluene, xylene, ethylbenzene, and trimethylbenzene can be mentioned. (G) The organic solvent may be used alone or in combination of two or more at any ratio.

In one embodiment, the content of the (G) organic solvent is not particularly limited, but when all the components in the resin composition are 100% by mass, for example, 60% by mass or less and 40% by mass or less. , 30% by mass or less, 20% by mass or less, 15% by mass or less, 10% by mass or less, and the like.

<Manufacturing method of resin composition>
The resin composition of the present invention can be, for example, in an arbitrary preparation container with (A) a specific maleimide compound, (B) an active ester compound, (A') other radically polymerizable compounds as needed, and (C) as needed. ) Epoxy resin, (D) inorganic filler as needed, (E) curing accelerator as needed, (F) other additives as needed, and (G) organic solvent as needed. It can be produced by adding and mixing in any order and / or part or all at the same time. Further, in the process of adding and mixing each component, the temperature can be appropriately set, and heating and / or cooling may be performed temporarily or from beginning to end. Further, the resin composition may be uniformly dispersed by stirring or shaking using, for example, a stirring device such as a mixer or a shaking device in the process of adding and mixing, or thereafter. Further, at the same time as stirring or shaking, defoaming may be performed under low pressure conditions such as under vacuum.

<Characteristics of resin composition>
The resin composition of the present invention contains (A) a specific maleimide compound and (B) an active ester compound. By using such a resin composition, it is possible to obtain a cured product having a low relative permittivity (Dk) and a dielectric loss tangent (Df), a high glass transition point (Tg), and excellent copper adhesion.

The cured product of the resin composition of the present invention may have a feature of low dielectric loss tangent (Df). Therefore, in one embodiment, the dielectric loss tangent (Df) of the cured product of the resin composition when measured at 5.8 GHz and 23 ° C. as in Test Example 1 below is preferably 0.020 or less and 0.010 or less. , More preferably 0.009 or less, 0.008 or less, still more preferably 0.007 or less, 0.006 or less, and particularly preferably 0.005 or less, 0.004 or less.

The cured product of the resin composition of the present invention may have a feature of having a low relative permittivity (Dk). Therefore, in one embodiment, the relative permittivity (Dk) of the cured product of the resin composition when measured at 5.8 GHz and 23 ° C. as in Test Example 1 below is preferably 5.0 or less, more preferably. It can be 4.0 or less, more preferably 3.5 or less, and particularly preferably 3.0 or less.

The cured product of the resin composition of the present invention may have a feature of having a high glass transition point (Tg). Therefore, in one embodiment, the glass transition temperature (Tg) measured as in Test Example 2 below is preferably 120 ° C. or higher, more preferably 140 ° C. or higher, still more preferably 150 ° C. or higher, and particularly preferably 160 ° C. or higher. Can be above ° C.

The cured product of the resin composition of the present invention may have a feature of excellent copper adhesion. Therefore, in one embodiment, the adhesion strength of the base copper (copper foil) when measured in accordance with JIS C6481 as in Test Example 5 below is preferably 0.2 kgf / cm or more, more preferably 0.3 kgf / cm. It can be cm or more, more preferably 0.4 kgf / cm or more, and particularly preferably 0.5 kgf / cm or more. The upper limit is not particularly limited, but may be, for example, 10 kgf / cm or less. Further, in one embodiment, the copper plating peel strength calculated from the load when the copper-plated conductor layer is formed on the cured product and the copper-plated conductor layer is peeled off in the vertical direction as in Test Example 4 below is preferable. Can be 0.2 kgf / cm or more, more preferably 0.3 kgf / cm or more, still more preferably 0.35 kgf / cm or more, and particularly preferably 0.4 kgf / cm or more. The upper limit is not particularly limited, but may be, for example, 10 kgf / cm or less.

In one embodiment, the cured product of the resin composition of the present invention may have a feature that the arithmetic average roughness (Ra) of the surface after the roughening treatment is low. Therefore, in one embodiment, the arithmetic average roughness (Ra) of the surface of the cured product after the roughening treatment measured as in Test Example 3 below is preferably 300 nm or less, more preferably 200 nm or less, still more preferably 170 nm. Below, it can be even more preferably 150 nm or less, and particularly preferably 130 nm or less. The lower limit is not particularly limited and may be, for example, 1 nm or more and 2 nm or more.

<Use of resin composition>
The resin composition of the present invention can be suitably used as a resin composition for insulating use, particularly as a resin composition for forming an insulating layer. Specifically, a resin composition for forming the insulating layer for forming the conductor layer (including the rewiring layer) formed on the insulating layer (resin for forming the insulating layer for forming the conductor layer). It can be suitably used as a composition). Further, in a printed wiring board described later, it can be suitably used as a resin composition for forming an insulating layer of a printed wiring board (resin composition for forming an insulating layer of a printed wiring board). The resin composition of the present invention also requires a resin composition such as a resin sheet, a sheet-like laminated material such as a prepreg, a solder resist, an underfill material, a die bonding material, a semiconductor encapsulant, a hole filling resin, and a component embedding resin. Can be used in a wide range of applications.

Further, for example, when the semiconductor chip package is manufactured through the following steps (1) to (6), the resin composition of the present invention is for a rewiring forming layer as an insulating layer for forming the rewiring layer. Can also be suitably used as a resin composition (resin composition for forming a rewiring forming layer) and a resin composition for encapsulating a semiconductor chip (resin composition for encapsulating a semiconductor chip). When the semiconductor chip package is manufactured, a rewiring layer may be further formed on the sealing layer.
(1) Step of laminating a temporary fixing film on a base material,
(2) A process of temporarily fixing a semiconductor chip on a temporary fixing film,
(3) Step of forming a sealing layer on a semiconductor chip,
(4) Step of peeling the base material and the temporary fixing film from the semiconductor chip,
(5) A step of forming a rewiring forming layer as an insulating layer on the surface from which the base material and the temporary fixing film of the semiconductor chip are peeled off, and (6) a rewiring layer as a conductor layer is formed on the rewiring forming layer. Forming process

Further, since the resin composition of the present invention provides an insulating layer having good component embedding property, it can be suitably used even when the printed wiring board is a component built-in circuit board.

<Sheet-like laminated material>
The resin composition of the present invention can be applied and used in a varnished state, but industrially, it is generally preferable to use the resin composition in the form of a sheet-like laminated material containing the resin composition.

As the sheet-shaped laminated material, the following resin sheets and prepregs are preferable.

In one embodiment, the resin sheet comprises a support and a resin composition layer provided on the support, and the resin composition layer is formed from the resin composition of the present invention.

The thickness of the resin composition layer is preferably 50 μm or less from the viewpoint of reducing the thickness of the printed wiring board and providing a cured product having excellent insulating properties even if the cured product of the resin composition is a thin film. It is preferably 40 μm or less. The lower limit of the thickness of the resin composition layer is not particularly limited, but may be usually 5 μm or more, 10 μm or more, or the like.

Examples of the support include a film made of a plastic material, a metal foil, and a release paper, and a film made of a plastic material and a metal foil are preferable.

When a film made of a plastic material is used as a support, the plastic material may be, for example, polyethylene terephthalate (hereinafter abbreviated as "PET") or polyethylene naphthalate (hereinafter abbreviated as "PEN"). ) And other polyesters, polycarbonate (hereinafter sometimes abbreviated as "PC"), acrylics such as polymethylmethacrylate (PMMA), cyclic polyolefins, triacetylcellulose (TAC), polyethersulfide (PES), polyethers. Examples thereof include ketones and polyimides. Of these, polyethylene terephthalate and polyethylene naphthalate are preferable, and inexpensive polyethylene terephthalate is particularly preferable.

When a metal foil is used as the support, examples of the metal foil include copper foil, aluminum foil, and the like, and copper foil is preferable. As the copper foil, a foil made of a single metal of copper may be used, and a foil made of an alloy of copper and another metal (for example, tin, chromium, silver, magnesium, nickel, zirconium, silicon, titanium, etc.) may be used. You may use it.

The support may be matted, corona-treated, or antistatic-treated on the surface to be joined to the resin composition layer.

Further, as the support, a support with a release layer having a release layer on the surface to be joined to the resin composition layer may be used. Examples of the release agent used for the release layer of the support with the release layer include one or more release agents selected from the group consisting of alkyd resin, polyolefin resin, urethane resin, and silicone resin. .. As the support with a release layer, a commercially available product may be used. For example, "SK-1" and "SK-1" manufactured by Lintec Corporation, which are PET films having a release layer containing an alkyd resin-based mold release agent as a main component. Examples include "AL-5", "AL-7", "Lumilar T60" manufactured by Toray Industries, "Purex" manufactured by Teijin Ltd., and "Unipee" manufactured by Unitika Ltd.

The thickness of the support is not particularly limited, but is preferably in the range of 5 μm to 75 μm, and more preferably in the range of 10 μm to 60 μm. When a support with a release layer is used, the thickness of the entire support with a release layer is preferably in the above range.

In one embodiment, the resin sheet may further contain any layer, if desired. Examples of such an arbitrary layer include a protective film similar to the support provided on a surface of the resin composition layer that is not bonded to the support (that is, a surface opposite to the support). Be done. The thickness of the protective film is not particularly limited, but is, for example, 1 μm to 40 μm. By laminating the protective film, it is possible to suppress the adhesion and scratches of dust and the like on the surface of the resin composition layer.

For the resin sheet, for example, a resin varnish prepared by dissolving the resin composition as it is in a liquid resin composition or in an organic solvent is applied onto a support using a die coater or the like, and further dried. It can be produced by forming a resin composition layer.

Examples of the organic solvent include the same organic solvents as those described as the components of the resin composition. The organic solvent may be used alone or in combination of two or more.

Drying may be carried out by a known method such as heating or blowing hot air. The drying conditions are not particularly limited, but the resin composition layer is dried so that the content of the organic solvent is 10% by mass or less, preferably 5% by mass or less. Depending on the boiling point of the organic solvent in the resin composition or resin varnish, for example, when a resin composition or resin varnish containing 30% by mass to 60% by mass of an organic solvent is used, the temperature is 50 ° C to 150 ° C for 3 minutes to 10 The resin composition layer can be formed by drying for a minute.

The resin sheet can be rolled up and stored. If the resin sheet has a protective film, it can be used by peeling off the protective film.

In one embodiment, the prepreg is formed by impregnating a sheet-like fiber base material with the resin composition of the present invention.

The sheet-shaped fiber base material used for the prepreg is not particularly limited, and those commonly used as a prepreg base material such as glass cloth, aramid non-woven fabric, and liquid crystal polymer non-woven fabric can be used. From the viewpoint of reducing the thickness of the printed wiring board, the thickness of the sheet-shaped fiber base material is preferably 50 μm or less, more preferably 40 μm or less, still more preferably 30 μm or less, and particularly preferably 20 μm or less. The lower limit of the thickness of the sheet-shaped fiber base material is not particularly limited. Usually, it is 10 μm or more.

The prepreg can be produced by a known method such as a hot melt method or a solvent method.

The thickness of the prepreg may be in the same range as the resin composition layer in the above-mentioned resin sheet.

The sheet-shaped laminated material of the present invention can be suitably used for forming an insulating layer of a printed wiring board (for an insulating layer of a printed wiring board), and for forming an interlayer insulating layer of a printed wiring board (printed). It can be more preferably used for the interlayer insulating layer of the wiring board).

<Printed wiring board>
The printed wiring board of the present invention includes an insulating layer made of a cured product obtained by curing the resin composition of the present invention.

The printed wiring board can be manufactured, for example, by using the above-mentioned resin sheet by a method including the following steps (I) and (II).
(I) A step of laminating a resin sheet on an inner layer substrate so that the resin composition layer of the resin sheet is bonded to the inner layer substrate (II) The resin composition layer is cured (for example, thermosetting) to form an insulating layer. Process to do

The "inner layer substrate" used in the step (I) is a member that becomes a substrate of a printed wiring board, and is, for example, a glass epoxy substrate, a metal substrate, a polyester substrate, a polyimide substrate, a BT resin substrate, and a thermosetting polyphenylene ether substrate. And so on. Further, the substrate may have a conductor layer on one side or both sides thereof, and the conductor layer may be patterned. An inner layer board in which a conductor layer (circuit) is formed on one side or both sides of the board may be referred to as an "inner layer circuit board". Further, an intermediate product in which an insulating layer and / or a conductor layer should be further formed when the printed wiring board is manufactured is also included in the "inner layer substrate" in the present invention. When the printed wiring board is a circuit board with built-in components, an inner layer board containing built-in components may be used.

The inner layer substrate and the resin sheet can be laminated, for example, by heat-pressing the resin sheet to the inner layer substrate from the support side. Examples of the member for heat-pressing the resin sheet to the inner layer substrate (hereinafter, also referred to as “heat-bonding member”) include a heated metal plate (SUS end plate or the like) or a metal roll (SUS roll). It is preferable not to press the heat-bonded member directly onto the resin sheet, but to press it through an elastic material such as heat-resistant rubber so that the resin sheet sufficiently follows the surface irregularities of the inner layer substrate.

The inner layer substrate and the resin sheet may be laminated by a vacuum laminating method. In the vacuum laminating method, the heat crimping temperature is preferably in the range of 60 ° C. to 160 ° C., more preferably 80 ° C. to 140 ° C., and the heat crimping pressure is preferably 0.098 MPa to 1.77 MPa, more preferably 0. It is in the range of .29 MPa to 1.47 MPa, and the heat crimping time is preferably in the range of 20 seconds to 400 seconds, more preferably 30 seconds to 300 seconds. Lamination can be carried out under reduced pressure conditions preferably with a pressure of 26.7 hPa or less.

Lamination can be performed by a commercially available vacuum laminator. Examples of the commercially available vacuum laminator include a vacuum pressurizing laminator manufactured by Meiki Co., Ltd., a vacuum applicator manufactured by Nikko Materials, and a batch type vacuum pressurizing laminator.

After laminating, the laminated resin sheet may be smoothed by pressing under normal pressure (under atmospheric pressure), for example, from the support side. The press conditions for the smoothing treatment can be the same as the heat-bonding conditions for the above-mentioned lamination. The smoothing process can be performed by a commercially available laminator. The laminating and smoothing treatment may be continuously performed using the above-mentioned commercially available vacuum laminator.

The support may be removed between steps (I) and step (II) or after step (II).

In step (II), the resin composition layer is cured (for example, thermosetting) to form an insulating layer made of a cured product of the resin composition. The curing conditions of the resin composition layer are not particularly limited, and the conditions usually adopted when forming the insulating layer of the printed wiring board may be used.

For example, the thermosetting conditions of the resin composition layer differ depending on the type of the resin composition and the like, but in one embodiment, the curing temperature is preferably 120 ° C. to 240 ° C., more preferably 150 ° C. to 220 ° C., still more preferable. Is 170 ° C to 210 ° C. The curing time can be preferably 5 minutes to 120 minutes, more preferably 10 minutes to 100 minutes, and even more preferably 15 minutes to 100 minutes.

Before the resin composition layer is thermally cured, the resin composition layer may be preheated at a temperature lower than the curing temperature. For example, prior to thermosetting the resin composition layer, the resin composition layer is heated at a temperature of 50 ° C. to 120 ° C., preferably 60 ° C. to 115 ° C., more preferably 70 ° C. to 110 ° C. for 5 minutes or more. Preheating may be preferably 5 to 150 minutes, more preferably 15 to 120 minutes, still more preferably 15 to 100 minutes.

In manufacturing the printed wiring board, (III) a step of drilling a hole in the insulating layer, (IV) a step of roughening the insulating layer, and (V) a step of forming a conductor layer may be further carried out. These steps (III) to (V) may be carried out according to various methods known to those skilled in the art used for manufacturing a printed wiring board. When the support is removed after the step (II), the support may be removed between the steps (II) and the step (III), between the steps (III) and the step (IV), or the step ( It may be carried out between IV) and step (V). Further, if necessary, the formation of the insulating layer and the conductor layer in steps (II) to (V) may be repeated to form a multilayer wiring board.

In another embodiment, the printed wiring board of the present invention can be manufactured using the above-mentioned prepreg. The manufacturing method is basically the same as when a resin sheet is used.

The step (III) is a step of drilling holes in the insulating layer, whereby holes such as via holes and through holes can be formed in the insulating layer. The step (III) may be carried out by using, for example, a drill, a laser, a plasma, or the like, depending on the composition of the resin composition used for forming the insulating layer. The dimensions and shape of the holes may be appropriately determined according to the design of the printed wiring board.

Step (IV) is a step of roughening the insulating layer. Usually, in this step (IV), smear removal is also performed. The procedure and conditions for the roughening treatment are not particularly limited, and known procedures and conditions usually used for forming the insulating layer of the printed wiring board can be adopted. For example, the insulating layer can be roughened by performing a swelling treatment with a swelling liquid, a roughening treatment with an oxidizing agent, and a neutralization treatment with a neutralizing liquid in this order.

The swelling solution used for the roughening treatment is not particularly limited, and examples thereof include an alkaline solution and a surfactant solution, preferably an alkaline solution, and the alkaline solution is more preferably a sodium hydroxide solution or a potassium hydroxide solution. preferable. Examples of commercially available swelling liquids include "Swelling Dip Security Guns P" and "Swelling Dip Security Guns SBU" manufactured by Atotech Japan. The swelling treatment with the swelling liquid is not particularly limited, but can be performed, for example, by immersing the insulating layer in the swelling liquid at 30 ° C. to 90 ° C. for 1 minute to 20 minutes. From the viewpoint of suppressing the swelling of the resin of the insulating layer to an appropriate level, it is preferable to immerse the insulating layer in a swelling liquid at 40 ° C to 80 ° C for 5 to 15 minutes.

The oxidizing agent used for the roughening treatment is not particularly limited, and examples thereof include an alkaline permanganate solution in which potassium permanganate or sodium permanganate is dissolved in an aqueous solution of sodium hydroxide. The roughening treatment with an oxidizing agent such as an alkaline permanganate solution is preferably performed by immersing the insulating layer in an oxidizing agent solution heated to 60 ° C. to 100 ° C. for 10 to 30 minutes. The concentration of permanganate in the alkaline permanganate solution is preferably 5% by mass to 10% by mass. Examples of commercially available oxidizing agents include alkaline permanganate solutions such as "Concentrate Compact CP" and "Dozing Solution Security P" manufactured by Atotech Japan.

The neutralizing solution used for the roughening treatment is preferably an acidic aqueous solution, and examples of commercially available products include "Reduction Solution Security P" manufactured by Atotech Japan.

The treatment with the neutralizing solution can be performed by immersing the treated surface that has been roughened with the oxidizing agent in the neutralizing solution at 30 ° C. to 80 ° C. for 5 to 30 minutes. From the viewpoint of workability and the like, a method of immersing the object roughened with an oxidizing agent in a neutralizing solution at 40 ° C to 70 ° C for 5 to 20 minutes is preferable.

In one embodiment, the root mean square roughness (Rq) of the surface of the insulating layer after the roughening treatment is preferably 500 nm or less, more preferably 400 nm or less, still more preferably 300 nm or less. The lower limit is not particularly limited and may be, for example, 1 nm or more and 2 nm or more. The root mean square roughness (Rq) of the insulating layer surface can be measured using a non-contact surface roughness meter.

The step (V) is a step of forming a conductor layer, and a conductor layer is formed on the insulating layer. The conductor material used for the conductor layer is not particularly limited. In a preferred embodiment, the conductor layer is one or more selected from the group consisting of gold, platinum, palladium, silver, copper, aluminum, cobalt, chromium, zinc, nickel, titanium, tungsten, iron, tin and indium. Contains metal. The conductor layer may be a single metal layer or an alloy layer, and the alloy layer may be, for example, an alloy of two or more metals selected from the above group (for example, nickel-chromium alloy, copper, etc.). Examples include layers formed from nickel alloys and copper-titanium alloys). Among them, from the viewpoint of versatility, cost, ease of patterning, etc. for forming a conductor layer, a single metal layer of chromium, nickel, titanium, aluminum, zinc, gold, palladium, silver or copper, or a nickel-chromium alloy, copper, etc. A nickel alloy, a copper-titanium alloy alloy layer is preferable, a chromium, nickel, titanium, aluminum, zinc, gold, palladium, silver or copper single metal layer, or a nickel-chromium alloy alloy layer is more preferable, and a copper single metal layer is preferable. A metal layer is more preferred.

The conductor layer may have a single-layer structure, a single metal layer made of different types of metals or alloys, or a multi-layer structure in which two or more alloy layers are laminated. When the conductor layer has a multi-layer structure, the layer in contact with the insulating layer is preferably a single metal layer of chromium, zinc or titanium, or an alloy layer of nickel-chromium alloy.

The thickness of the conductor layer depends on the design of the desired printed wiring board, but is generally 3 μm to 35 μm, preferably 5 μm to 30 μm.

In one embodiment, the conductor layer may be formed by plating. For example, the surface of the insulating layer can be plated by a conventionally known technique such as a semi-additive method or a full additive method to form a conductor layer having a desired wiring pattern, and the semi-additive can be manufactured from the viewpoint of ease of manufacture. It is preferably formed by the method. Hereinafter, an example of forming the conductor layer by the semi-additive method will be shown.

First, a plating seed layer is formed on the surface of the insulating layer by electroless plating. Next, a mask pattern that exposes a part of the plating seed layer corresponding to a desired wiring pattern is formed on the formed plating seed layer. After forming a metal layer by electrolytic plating on the exposed plating seed layer, the mask pattern is removed. After that, the unnecessary plating seed layer can be removed by etching or the like to form a conductor layer having a desired wiring pattern.

In other embodiments, the conductor layer may be formed using metal leaf. When the conductor layer is formed using the metal foil, it is preferable that the step (V) is carried out between the steps (I) and the step (II). For example, after step (I), the support is removed and a metal leaf is laminated on the surface of the exposed resin composition layer. The laminating of the resin composition layer and the metal foil may be carried out by a vacuum laminating method. The laminating conditions may be the same as the conditions described for step (I). Then, step (II) is carried out to form an insulating layer. After that, the metal foil on the insulating layer can be used to form a conductor layer having a desired wiring pattern by conventional known techniques such as a subtractive method and a modified semi-additive method.

The metal foil can be produced by a known method such as an electrolysis method or a rolling method. Examples of commercially available metal foils include HLP foils and JXUT-III foils manufactured by JX Nippon Mining & Metals Co., Ltd., 3EC-III foils and TP-III foils manufactured by Mitsui Mining & Smelting Co., Ltd.

<Semiconductor device>
The semiconductor device of the present invention includes the printed wiring board of the present invention. The semiconductor device of the present invention can be manufactured by using the printed wiring board of the present invention.

Examples of the semiconductor device include various semiconductor devices used in electric products (for example, computers, mobile phones, digital cameras, televisions, etc.) and vehicles (for example, motorcycles, automobiles, trains, ships, aircraft, etc.).

Hereinafter, the present invention will be specifically described with reference to Examples. The present invention is not limited to these examples. In the following, "parts" and "%" representing quantities mean "parts by mass" and "% by mass", respectively, unless otherwise specified. When the temperature and pressure are not specified, the temperature and pressure conditions are room temperature (23 ° C.) and atmospheric pressure (1 atm).

<Example 1>
Isophorone diamine skeleton-containing maleimide compound (“SLK-2600” manufactured by Shin-Etsu Chemical Industry Co., Ltd., anisole solution having a solid content of 50% by mass, main component (nonvolatile component): maleimide compound represented by the following formula (A)), 20 parts, active 17.7 parts of ester compound ("HPC-8150-62T" manufactured by DIC, toluene solution having a solid content of 62% by mass), 18 parts of naphthol aralkyl type epoxy resin ("ESN-475V" manufactured by Nittetsu Chemical & Materials Co., Ltd.), Spherical silica surface-treated with a silane coupling agent (“KBM-573” manufactured by Shin-Etsu Chemical Industry Co., Ltd.) (“SO-C2” manufactured by Admatex Co., Ltd., average particle size 0.5 μm, specific surface area 5.8 m ² / g) 60 parts of an imidazole-based curing accelerator (“1B2PZ” manufactured by Shikoku Kasei Kogyo Co., Ltd., 1-benzyl-2-phenylimidazole) and 20 parts of a methyl ethyl ketone are mixed and uniformly dispersed with a high-speed rotary mixer to form a resin composition. (Resin varnish) was prepared.

<Example 2>
The amount of the active ester compound ("HPC-8150-62T" manufactured by DIC, toluene solution having a solid content of 62% by mass) was changed from 17.7 parts to 16.1 parts, and the naphthol aralkyl type epoxy resin (Nittetsu Chemical) was changed. & Material Co., Ltd. "ESN-475V") has been changed from 18 parts to 15 parts, and biphenyl aralkylnovolac type polymaleimide ("MIR-3000-70MT" manufactured by Nippon Kayaku Co., Ltd., MEK with 70% solid content / A resin composition (resin varnish) was prepared in the same manner as in Example 1 except that 5.7 parts of the toluene mixed solution) was further used.

<Example 3>
Maleimide compound A (Mw / Mn = 1.81, t'' = 1 represented by the following formula (1) synthesized by the method described in Synthesis Example 1 of the Institute of Invention and Innovation, Public Technical Bulletin No. 2020-500211. A MEK solution (70% by mass of non-volatile components) of .47 (mainly 1, 2 or 3)) was prepared.

The amount of the active ester compound ("HPC-8150-62T" manufactured by DIC, a toluene solution having a solid content of 62% by mass) was changed from 17.7 parts to 16.1 parts, and the naphthol aralkyl type epoxy resin (Nittetsu Chemical) was changed. & Material Co., Ltd. "ESN-475V") was changed from 18 parts to 15 parts, and 5.7 parts of maleimide compound A (MEK solution having a solid content of 70%) was further used. Similarly, a resin composition (resin varnish) was prepared.

<Example 4>
The amount of the active ester compound ("HPC-8150-62T" manufactured by DIC, toluene solution having a solid content of 62% by mass) was changed from 17.7 parts to 16.1 parts, and the naphthol aralkyl type epoxy resin (Nittetsu Chemical) was changed. & Material Co., Ltd. "ESN-475V") was changed from 18 parts to 15 parts, and the terminal vinyl benzylated PPE compound (Mitsubishi Gas Chemicals Co., Ltd. "OPE-2St 1200", toluene mixed solution with a solid content of 65%) was changed. ) A resin composition (resin varnish) was prepared in the same manner as in Example 1 except that 6.2 parts were further used.

<Example 5>
The amount of the active ester compound ("HPC-8150-62T" manufactured by DIC, toluene solution having a solid content of 62% by mass) was changed from 17.7 parts to 16.1 parts, and the naphthol aralkyl type epoxy resin (Nittetsu Chemical) was changed. &Material's"ESN-475V") usage amount was changed from 18 parts to 15 parts, divinylbenzene / styrene copolymer (Nittetsu Chemical &Material's"ODV-XET-X04", solid content 65% A resin composition (resin varnish) was prepared in the same manner as in Example 1 except that 6.2 parts of the toluene solution was further used.

<Example 6>
The amount of the active ester compound ("HPC-8150-62T" manufactured by DIC, toluene solution having a solid content of 62% by mass) was changed from 17.7 parts to 16.1 parts, and the naphthol aralkyl type epoxy resin (Nittetsu Chemical) was changed. & Material Co., Ltd. "ESN-475V") was changed from 18 parts to 15 parts, and terminal methacrylic-modified PPE compound ("SA9000-111" manufactured by Savik Innovative Plastics Co., Ltd., 50% solid content solution with toluene. A resin composition (resin varnish) was prepared in the same manner as in Example 1 except that 8 parts were further used.

<Comparative Example 1>
Examples except that 10 parts of an aliphatic maleimide (“BMI-689” manufactured by Designer Moleculars) was used instead of 20 parts of an isophorone diamine skeleton-containing maleimide compound (“SLK-2600” manufactured by Shinetsu Chemical Industry Co., Ltd.). A resin composition (resin varnish) was prepared in the same manner as in 1.

<Comparative Example 2>
Instead of 20 parts of an isophorone diamine skeleton-containing maleimide compound (“SLK-2600” manufactured by Shinetsu Chemical Industry Co., Ltd.), a biphenyl aralkylnovolac type polymaleimide (“MIR-3000-70MT” manufactured by Nippon Kayaku Co., Ltd., MEK with a solid content of 70%) A resin composition (resin varnish) was prepared in the same manner as in Example 1 except that 14.3 parts of the / toluene mixed solution was used.

<Comparative Example 3>
20 parts of an isophorone diamine skeleton-containing maleimide compound (“SLK-2600” manufactured by Shinetsu Chemical Industry Co., Ltd.) is not used, and an active ester compound (“HPC-8150-62T” manufactured by DIC Co., Ltd., a toluene solution having a solid content of 62% by mass) is used. Except for changing the usage amount from 17.7 parts to 25.8 parts and changing the usage amount of naphthol aralkyl type epoxy resin (“ESN-475V” manufactured by Nittetsu Chemical & Materials Co., Ltd.) from 18 parts to 23 parts. A resin composition (resin varnish) was prepared in the same manner as in Example 1.

<Comparative Example 4>
Do not use 17.7 parts of the active ester compound ("HPC-8150-62T" manufactured by DIC, a toluene solution having a solid content of 62% by mass), and use a varnish coupling agent ("KBM-573" manufactured by Shinetsu Chemical Industry Co., Ltd.). The amount of surface-treated spherical silica ("SO-C2" manufactured by Admatex) was changed from 60 parts to 51 parts, and the phenolic epoxy curing agent ("LA-7054" manufactured by DIC) had a solid content of 60%. A resin composition (resin varnish) was prepared in the same manner as in Example 1 except that 8.3 parts of MEK solution) was further used.

<Test Example 1: Measurement of Relative Permittivity (Dk) and Dielectric Dissipation Factor (Df)>
As a support, a polyethylene terephthalate film (“AL5” manufactured by Lintec Corporation, thickness 38 μm) having a release layer was prepared. The resin compositions obtained in Examples and Comparative Examples were uniformly applied onto the release layer of this support so that the thickness of the resin composition layer after drying was 40 μm. Then, the resin composition was dried at 80 ° C. to 100 ° C. (average 90 ° C.) for 4 minutes to obtain a resin sheet A containing a support and a resin composition layer.

The obtained resin sheet A was cured in an oven at 190 ° C. for 90 minutes. By peeling the support from the resin sheet A taken out from the oven, a cured product of the resin composition layer was obtained. The cured product was cut into a length of 80 mm and a width of 2 mm and used as a cured product B for evaluation.

For the cured product B for evaluation, the dielectric constant value (Dk value) and the dielectric loss tangent were used at a measurement frequency of 5.8 GHz and a measurement temperature of 23 ° C. by a cavity resonance perturbation method using "HP8632B" manufactured by Agent Technologies. (Df value) was measured. Measurements were carried out with two test pieces, and the average was calculated.

<Test Example 2: Measurement of glass transition point (Tg)>
The resin sheet A obtained in Test Example 1 was cured in an oven at 190 ° C. for 90 minutes, and further peeled off from the support to obtain a cured film. This cured film was cut into a length of 20 mm and a width of 6 mm and used as an evaluation sample. The glass transition temperature (Tg) of this evaluation sample was measured at a heating rate of 5 ° C./min from 25 ° C. to 250 ° C. using a TMA device (thermomechanical analyzer) manufactured by Rigaku Corporation. The same test piece was measured twice and the second value was recorded.

<Test Example 3: Measurement of Arithmetic Mean Roughness (Ra)>
(1) Preparation of inner layer substrate Both sides of the glass cloth base material epoxy resin double-sided copper-clad laminate (copper foil thickness 18 μm, substrate thickness 0.4 mm, Panasonic “R1515A”) on which the inner layer circuit is formed are microscopic. The copper surface was roughened by etching 1 μm with an etching agent (“CZ8101” manufactured by MEC).

(2) Laminating of Resin Sheet A Test Example 1 using a batch type vacuum pressure laminator (2-stage build-up laminator "CVP700" manufactured by Nikko Materials Co., Ltd.) so that the resin composition layer is in contact with the inner layer substrate. The resin sheet A obtained in 1 above was laminated on both sides of the inner layer substrate. Lamination was carried out by reducing the pressure for 30 seconds, adjusting the atmospheric pressure to 13 hPa or less, and then crimping at 120 ° C. and a pressure of 0.74 MPa for 30 seconds. Then, heat pressing was performed at 100 ° C. and a pressure of 0.5 MPa for 60 seconds.

(3) Thermosetting of Resin Composition Layer After that, the inner layer substrate on which the resin sheet A is laminated is put into an oven at 130 ° C. and heated for 30 minutes, then transferred to an oven at 170 ° C. and heated for 30 minutes. , The resin composition layer was thermally cured to form an insulating layer. Then, the support was peeled off to obtain a cured substrate A having an insulating layer, an inner layer substrate, and an insulating layer in this order.

(4) Roughing treatment The cured substrate A was subjected to desmear treatment as a roughening treatment. As the desmear treatment, the following wet desmear treatment was carried out.

(Wet desmear treatment)
The cured substrate A is immersed in a swelling solution (“Swelling Dip Securigant P” manufactured by Atotech Japan, an aqueous solution of diethylene glycol monobutyl ether and sodium hydroxide) at 60 ° C. for 5 minutes, and then an oxidizing agent solution (Atotech Japan). It was immersed in "Concentrate Compact CP" manufactured by the same company (an aqueous solution having a potassium permanganate concentration of about 6% and a sodium hydroxide concentration of about 4%) at 80 ° C. for 20 minutes. Then, it was immersed in a neutralizing solution (“Reduction Solution Securigant P” manufactured by Atotech Japan, sulfuric acid aqueous solution) at 40 ° C. for 5 minutes, and then dried at 80 ° C. for 15 minutes.

(5) Measurement of Arithmetic Average Roughness (Ra) of Insulation Layer Surface After Roughing Treatment The arithmetic average roughness (Ra) of the insulation layer surface of the cured substrate A after roughening treatment is measured by a non-contact surface roughness meter. (WYKO NT3300 manufactured by Bruker Co., Ltd.) was used, and the measurement range was determined by a numerical value obtained with a measurement range of 121 μm × 92 μm using a VSI mode and a 50x lens. It was measured by obtaining the average value of 10 points for each.

<Test Example 4: Measurement of Copper Plating Peel Strength>
(1) Formation of Copper Plated Conductor Layer A conductor layer was formed on the roughened surface of the insulating layer of the cured substrate A after the roughening treatment obtained in Test Example 3 according to the semi-additive method. That is, the roughened substrate was immersed in an electroless plating solution containing PdCl ₂ at 40 ° C. for 5 minutes, and then immersed in an electroless copper plating solution at 25 ° C. for 20 minutes. Then, after heating at 150 ° C. for 30 minutes for annealing treatment, an etching resist was formed and a pattern was formed by etching. Then, copper sulfate electrolytic plating was performed to form a conductor layer having a thickness of 25 μm, and annealing treatment was performed at 190 ° C. for 60 minutes. The obtained substrate is referred to as "evaluation substrate B".

(2) Measurement of peel strength of copper-plated conductor layer The peel strength of the insulating layer and the conductor layer was measured in accordance with the Japanese Industrial Standards (JIS C6481). Specifically, a notch having a width of 10 mm and a length of 100 mm is made in the conductor layer of the evaluation substrate B, one end of the notch is peeled off, and the conductor layer is grasped by a gripper. The load (kgf / cm) when the 35 mm was peeled off was measured, and the peeling strength was determined. A tensile tester (“AC-50C-SL” manufactured by TSE) was used for the measurement.

<Test Example 5: Measurement of adhesion strength of base copper (copper foil)>
(1) Base treatment of copper foil The glossy surface of "3EC-III" (electroelectric copper foil, 35 μm) manufactured by Mitsui Metal Mining Co., Ltd. is immersed in a microetching agent ("CZ8101" manufactured by MEC Co., Ltd.) to form a copper surface. Was subjected to a roughening treatment (Ra value = 1 μm) and a rust preventive treatment (CL8300). This copper foil is called CZ copper foil. Further, it was heat-treated in an oven at 130 ° C. for 30 minutes.

(2) Lamination of Copper Foil and Formation of Insulation Layer An inner layer substrate on which the resin sheet A was laminated was prepared by the same method as in Test Example 3. Then, the supports on both sides were peeled off from the substrate to expose both resin composition layers. The treated surface of the CZ copper foil of "3EC-III" was laminated on those resin composition layers under the same conditions as the laminating of the resin sheet A of Test Example 1. Then, a sample was prepared by curing the resin composition layer at 190 ° C. for 90 minutes to form an insulating layer.

(3) Measurement of copper foil peeling strength (base adhesion) The prepared sample was cut into small pieces of 150 × 30 mm. Use a cutter to make a notch in the copper foil part of a small piece with a width of 10 mm and a length of 100 mm, peel off one end of the copper foil, and grab it with a gripper (“AC-50C-SL” manufactured by TSE Co., Ltd.). , Measure the load [kgf / cm (N / cm)] when 35 mm is peeled off in the vertical direction at a speed of 50 mm / min at room temperature using an Instron universal tester in accordance with JIS C6481. did.

Table 1 below shows the amounts of non-volatile components used in the resin compositions of Examples and Comparative Examples and the measurement results of Test Examples.

Referring to Table 1, (A) In Comparative Examples 2 and 3 in which the specific maleimide compound was not used, the copper foil adhesion was low, and the relative permittivity (Dk) and the dielectric loss tangent (Df) were high. Further, in Comparative Example 1 in which (A) a maleimide compound having a dimerdiamine skeleton was used instead of the specific maleimide compound, the glass transition point (Tg) was a low value. In Comparative Example 4 in which a phenolic curing agent was used instead of the active ester compound (B) as the epoxy curing agent, the relative permittivity (Dk) and the dielectric loss tangent (Df) were extremely high. On the other hand, it can be seen that these problems can be overcome when the resin composition of the present invention containing (A) the specific maleimide compound and (B) the active ester compound is used.

Claims (20)

Equation (A) (X1):

[During the ceremony,
Ring X represents a monocycloalkane ring which may have a substituent or a monocycloalkene ring which may have a substituent;
a and b independently indicate 0, 1, 2 or 3, and the sum of a and b is 1-5;
* Indicates a binding site. ]
A resin composition containing a maleimide compound having a partial structure represented by (B) and an active ester compound (B). In addition to the partial structure represented by the formula (X1), the component (A) further comprises the formula (Y1) :.

[During the ceremony,
Ring Y represents a monocycloalkane ring which may have a substituent or a monocycloalkene ring which may have a substituent;
c and d independently represent an integer of 0 or 1 or more, and the sum of c and d is 6 or more;
* Indicates a binding site. ]
The resin composition according to claim 1, which is a maleimide compound having a partial structure represented by. (A) The resin composition according to claim 1 or 2, wherein the number of maleimide groups in one molecule of the component is 2. The resin composition according to any one of claims 1 to 3, wherein the component (A) is a maleimide-terminal polyimide. The component (A) is the formula (A1) :.

[During the ceremony,
R ¹ each independently indicates a substituent;
Rings X and Y each independently represent a monocycloalkane ring which may have a substituent or a monocycloalkene ring which may have a substituent;
Ring Z independently represents a non-aromatic ring which may have a substituent or an aromatic ring which may have a substituent;
Z ¹ and Z ² are independent, single bond, alkylene group, -O-, -CO-, -S-, -SO-, -SO _2- , -CONH-, -NHCO-, -COO-, respectively. , Or -OCO-;
a and b independently indicate 0, 1, 2 or 3, and the sum of a and b is 1-5;
c and d independently represent an integer of 0 or 1 or more, and the sum of c and d is 6 or more;
e independently indicate 0 or 1;
f independently represents an integer greater than or equal to 0 or 1;
g independently indicate 0, 1 or 2;
n1 indicates an integer of 1 or more;
n2 indicates 0 or an integer greater than or equal to 1;
For m1 and m2, one of them indicates 1 and the other indicates 0. ]
The resin composition according to any one of claims 1 to 4, which is a compound represented by. The resin composition according to any one of claims 1 to 5, wherein the component (A) has a weight average molecular weight of 2000 to 50,000. The resin composition according to any one of claims 1 to 6, wherein the content of the component (A) is 3% by mass to 30% by mass when the non-volatile component in the resin composition is 100% by mass. .. The resin composition according to any one of claims 1 to 7, wherein the content of the component (B) is 3% by mass to 30% by mass when the non-volatile component in the resin composition is 100% by mass. .. The resin composition according to any one of claims 1 to 8, wherein the mass ratio of the component (A) to the component (B) (component (A) / component (B)) is 0.5 to 3. The resin composition according to any one of claims 1 to 9, further comprising (C) an epoxy resin. The resin composition according to any one of claims 1 to 10, further comprising (D) an inorganic filler. The resin composition according to claim 11, wherein the content of the component (D) is 40% by mass or more when the non-volatile component in the resin composition is 100% by mass. The resin composition according to any one of claims 1 to 12, wherein the dielectric loss tangent (Df) of the cured product of the resin composition is 0.005 or less when measured at 5.8 GHz and 23 ° C. The resin composition according to any one of claims 1 to 13, wherein the relative permittivity (Dk) of the cured product of the resin composition is 3.0 or less when measured at 5.8 GHz and 23 ° C. The resin composition according to any one of claims 1 to 14, wherein the cured product of the resin composition has a glass transition temperature (Tg) of 150 ° C. or higher. The cured product of the resin composition according to any one of claims 1 to 15. A sheet-like laminated material containing the resin composition according to any one of claims 1 to 15. A resin sheet comprising a support and a resin composition layer formed from the resin composition according to any one of claims 1 to 15 provided on the support. A printed wiring board provided with an insulating layer made of a cured product of the resin composition according to any one of claims 1 to 15. A semiconductor device comprising the printed wiring board according to claim 19.