JP2021107099A - Laminate processing method, laminate processor and laminate processed product manufacturing method - Google Patents

Abstract

To provide a laminate processing method by which in a laminate in which a plurality of thin plates are laminated, an open hole can be easily and certainly formed in only a prescribed thin plate.SOLUTION: A laminate processing method for processing a laminate in which a plurality of thin plates are laminated has: a recess formation process in which a bottomed recess, which does not reach an opposite surface of other thin plate, is formed in one thin plate; and a removal process in which a portion of the thin plate with the recess formed from a bottom surface of the recess to the opposite surface, is removed. In the removal process, the removal object portion may be removed by adsorption. When adsorbing and removing the removal object portion, processed waste generated in the recess formation process may be removed by the removal process.SELECTED DRAWING: Figure 8

Description

The present invention relates to a laminate processing method, a laminate processing apparatus, and a method for producing a laminate processed product.

As a device for processing a thin plate constituting a laminated body, for example, a grinding device published in JP-A-2002-170797 is known.

Japanese Unexamined Patent Publication No. 2002-170797

By the way, in the conventional apparatus, it is extremely difficult to accurately form a through hole in only one of the thin plates with a grindstone in the laminated body. That is, if a through hole is formed in one thin plate by grinding, the other thin plate may be damaged by the grindstone when the through hole is formed.

Therefore, an object of the present invention is a laminate processing method and lamination capable of easily and surely forming through holes only in a predetermined thin plate without damaging other thin plates in a laminate in which a plurality of thin plates are laminated. It is an object of the present invention to provide a body processing apparatus and a method for manufacturing a laminated body processed product.

The laminate processing method of the present invention made to solve the above problems is
It is a method of processing a laminated body in which a plurality of thin plates are laminated.
A recess forming step of forming a bottomed recess in one thin plate that does not reach the surface facing the other thin plate.
It has a removing step of removing a portion of the thin plate in which the recess is formed from the bottom surface of the recess to the facing surface.

In the laminate processing method, in the recess forming step, at least one thin plate is formed with a bottomed recess that does not reach the surface facing the other thin plate, and in the removing step, the thin plate in which the recess is formed is formed. , The portion from the bottom surface of the recess to the facing surface is removed. As a result, it is possible to easily and surely obtain a laminated work piece in which at least one thin plate has through holes and no through holes are formed in other thin plates facing the thin plate. In particular, since the bottomed recess that does not reach the facing surface of the other thin plate is formed in the recess forming step, it is possible to prevent the other thin plate from being scratched.

In the laminate processing method, it is preferable to remove the processing debris generated in the recess forming step when the portion to be removed is suction-removed in the removing step. Thereby, the removal target portion can be easily and surely removed by suction.

Further, it is preferable to remove the work chips generated in the recess forming step by the suction. As a result, the processing waste can be removed together with the removal of the removal target portion.

In the laminate processing method, it is preferable to form the recesses by grinding with a grindstone in the recess forming step. Thereby, the desired recess can be easily and surely formed by grinding with a grindstone.

The grindstone rotates about the normal direction of the laminated body as a rotation axis, and the rotation axis rotates relative to the laminated body about the normal direction of the laminated body, so that the recessed portion. It is preferable to form. Thereby, the desired recess can be easily and surely formed.

It is preferable that the recess forming step includes a detection step for detecting the position of the recess forming target portion of the laminated body in the thickness direction before forming the recess. By recognizing the position of the concave portion forming target portion of the laminated body in the thickness direction in this way, when forming the concave portion in the concave portion forming step, a desired bottomed surface that does not reach the surface facing the other thin plate is formed. Recesses can be reliably formed.

It is preferable that the laminated body is a substrate of a liquid crystal panel. In the substrate of the liquid crystal panel, a pair of thin plates are arranged with a gap, and according to the laminate processing method, a through hole can be easily and surely formed only in one of the thin plates.

In the laminate processing method, the laminate is formed by laminating at least three thin plates, and in the recess forming step, at least one thin plate has a through hole at a position corresponding to the recess in a plan view. It is preferable to form. As a result, it is possible to obtain a laminated body work piece in which through holes are formed in at least two thin plates.

The laminate processing method may further include an auxiliary step for reducing the removing force required for the removing step after the recess forming step. Thereby, the removal target portion can be easily and surely removed in the removal step.

In the auxiliary step, it is preferable to form a crack penetrating the thin plate at least a part of the outer circumference of the recess. By forming the crack, the removing force required in the removing step can be reduced.

The laminate processing apparatus of the present invention made to solve the above problems is
It is a device that processes a laminated body in which a plurality of thin plates are laminated.
A drive mechanism that drives a recess forming tool that forms a bottomed recess that does not reach the surface facing the other thin plates on at least one thin plate.
It has a removing tool for removing a portion of the thin plate on which the recess is formed from the bottom surface of the recess to the facing surface.

In the laminate processing device, the recess forming tool driven by the drive mechanism forms a bottomed recess on at least one thin plate that does not reach the surface facing the other thin plates, and the removing tool is the recess. The portion of the formed thin plate from the bottom surface of the recess to the facing surface can be removed. As a result, it is possible to easily and surely obtain a laminated work piece in which at least one thin plate has through holes and no through holes are formed in other thin plates facing the thin plate. In particular, since the bottomed recess that does not reach the facing surface of the other thin plate is formed in the recess forming step, it is possible to prevent the other thin plate from being scratched.

In the laminate processing device, it is preferable that the removing tool is a suction tool that sucks the part to be removed. Thereby, the removal target portion can be easily and surely removed by suction of the removal tool.

It is preferable that the suction tool removes the processing debris generated when the concave portion is formed when the portion to be removed is suction-removed. As a result, the suction tool can remove the processing waste as well as the removal target portion.

The recess forming tool is a grindstone, and the grindstone rotates about the normal direction of the laminate as a rotation axis, and the rotation axis is relative to the laminate about the normal direction of the laminate. It is preferable to form the recess by rotating and moving to. Thereby, the desired recess can be easily and surely formed.

It is preferable that the laminated body processing apparatus further includes a detector for detecting the position of the concave portion forming target portion of the laminated body in the thickness direction before forming the concave portion. By recognizing the position of the concave portion forming target portion of the laminated body in the thickness direction in this way, when forming the concave portion in the concave portion forming step, a desired bottomed surface that does not reach the surface facing the other thin plate is formed. Recesses can be reliably formed.

It is preferable that the laminate processing device further includes an auxiliary mechanism that performs an auxiliary operation for reducing the removing force required for the removing tool to perform the removal after the concave forming by the recess forming tool is completed. Thereby, the removal target portion can be easily and surely removed by the removing tool.

The auxiliary mechanism may form a crack penetrating the thin plate at least a part of the outer circumference of the recess. By forming the crack, the removing force required for removing by the removing tool can be reduced.

In the laminated body processing apparatus, the laminated body is formed by laminating at least three thin plates, and the recess forming tool has a through hole at a position corresponding to the recess in a plan view on at least one thin plate. It is preferable to form. As a result, it is possible to obtain a laminated body work piece in which through holes are formed in at least two thin plates.

Further, it is preferable to further provide a grinding tool for grinding the end face of the laminated body or a polishing tool for polishing. As a result, not only the formation of the through hole in the thin plate of the laminate, but also the grinding or polishing of the end face of the laminate can be performed.

Further, it is preferable to further include the recess forming tool when not in use, and a holder for accommodating the grinding tool or the polishing tool, respectively. As a result, the recess forming tool and the grinding tool or the polishing tool when not in use can be housed in the holder, respectively.

Further, the recess forming tool, the spindle to which the grinding tool or the polishing tool can be mounted, and a control unit for controlling the operation of the spindle are further provided, and the control unit is the recess forming tool and the grinding. It is preferable to control the tool or the polishing tool to be selectively mounted on the spindle. Thereby, the forming process of the through hole and the grinding process or the polishing process of the end face can be controlled by the control unit.

The method for producing a laminated body processed product of the present invention, which has been made to solve the above problems, includes the laminated body processing method having the above configuration, and is a method for producing a laminated body processed product having through holes in at least one of the thin plates. Is.

According to the method for producing a work piece of a laminated body, it is possible to easily and surely obtain a work piece of a laminate in which a through hole is formed in at least one thin plate and no through hole is formed in another thin plate facing the thin plate. ..

As described above, in the present invention, it is easy and reliable to easily and surely produce a laminated product in which at least one thin plate has through holes and no through holes are formed in other thin plates facing the thin plate. Obtainable.

It is a schematic plan view of the laminated body (before processing) which is the processing target of the processing apparatus of one Embodiment of this invention. FIG. 1 is a cross-sectional view taken along the line AA of FIG. It is a schematic plan view of the laminated body (after processing) which is the object of processing of FIG. FIG. 3 is a cross-sectional view taken along the line BB of FIG. It is a schematic plan view explaining the whole structure of the processing apparatus of FIG. It is a schematic plan view of the processing table of the processing apparatus of FIG. It is a schematic cross-sectional view of the laminated body in the state where the recess is formed by the processing apparatus of FIG. It is schematic cross-sectional view of the laminated body in the state which removes the part to be removed by the processing apparatus of FIG. It is a schematic front view of the remover of the processing apparatus of FIG. It is a schematic bottom view of the remover of FIG. FIG. 10 is a cross-sectional view taken along the line CC of FIG. It is explanatory drawing explaining the operation of the removal tool of FIG. It is a top view of the processing table which installed the suction table. It is a flowchart of the laminated body processing method which concerns on this invention. It is a schematic cross-sectional view of the laminated body (during processing) which is the object of processing of the processing apparatus of another embodiment of this invention.

Hereinafter, as an embodiment according to the present invention, a through hole is formed in one thin plate of a liquid crystal panel substrate (laminated body) formed by laminating two thin plates (hard transparent glass plates). The processing apparatus M to be processed will be described, but first, the laminated body to be processed will be described.

[Laminate]
The laminated body W before processing, which is the object to be processed, is configured by laminating two thin plates 1 (see FIGS. 1 and 2). In the processed laminate W, a through hole 2 is formed only in one thin plate 1 (see FIGS. 3 and 4). The drawings are drawn at a scale different from the actual ones for easy understanding. Actually, the thickness of the thin plate 1 is much larger than the thickness of the sealing materials 3a and 3b, and the sealing materials 3a and 3b are extremely small considering the thickness of the entire laminated body W. The gap between the two thin plates 1 is much smaller than the size of the abrasive grains of the grindstone. More specifically, the gap between the two thin plates 1 is smaller than the largest abrasive grain among the abrasive grains used for thin plate grinding (abrasive grains that actually grind the thin plate). Therefore, when a through hole is formed in one thin plate using a grindstone, the abrasive grains come into contact with the other thin plate immediately after the through hole is formed.

In the laminated body W, as shown in FIG. 2, a thin plate 1 in which a through hole 2 (see FIG. 4) is formed and a thin plate 1 facing the thin plate 1 are arranged with a gap. The two thin plates 1 are adhered to each other by a sealing member 3 arranged in a gap. As shown in FIG. 1, the seal member 3 has a peripheral edge portion 3a arranged along the peripheral edge of the thin plate 1 and a hole peripheral portion 3b arranged around the formed through hole 2. .. As shown in FIGS. 2 and 4, the sealing member 3 seals the liquid crystal 4 in the gap between the two thin plates 1. Even if a hole is formed in a portion surrounded by the hole peripheral portion 3b, the liquid crystal does not leak due to the hole peripheral portion 3b. In the laminated body W, a bottomed recess (through hole only in one thin plate) is formed by the processing device M (see FIG. 5) at a portion surrounded by the hole peripheral portion 3b (see FIGS. 3 and 4). The thickness of the bottom located below the recess needs to be determined in consideration of various factors such as the material of the laminate W and the removing force of the removing tool 120, but the thinner the thickness, the more preferable. However, the thinner the bottom, the higher the processing accuracy is required and the higher the possibility of failure. Therefore, the thickness may be such that it can be removed by the remover 120. Therefore, it is preferable that the thickness of the bottom is set as thin as possible within a range in which grinding can be performed stably without penetrating, in consideration of conditions such as the size of the abrasive grains of the grindstone. By repeating the experiment, the thickness of this bottom can be found to suit the situation. The thickness of the bottom needs to be determined in consideration of various conditions as described above, but it is preferably a thickness of half or less of the thin plate 1. Here, the removing force of the removing tool 120 means the force used for removing, the suction force when the suction tool is used as the removing tool, and the adhesive force when the adhesive tool is used. Means.

[Processing equipment]
The processing apparatus M shown in FIG. 5 performs processing such as drilling (including forming a recess, that is, processing for making a through hole only in one thin plate 1) or end face grinding on a processing object, for example, a glass plate or a laminate W. conduct. The processing object of the processing apparatus M includes a transparent plate-shaped member made of glass or resin, a semiconductor, a laminated body in which a plurality of thin plates are stacked, and the like, which will be described below as the laminated body W. As shown in FIG. 5, the processing apparatus M supplies the processing unit 100 for grinding the laminated body, the transport unit 10 for transporting the laminate W to the processing unit 100, and the unprocessed laminate to the transport unit 10. It includes a supply unit 60 and a discharge unit 70 that discharges the laminated body W from the transport unit 10. A plurality (4) processing units 100 are provided for one transport unit 10.

As shown in FIG. 5, the transport unit 10 includes a first rail 11 arranged linearly and a traveling body 13 traveling along the first rail 11. The traveling body 13 can hold and convey a plurality of objects to be processed at the same time. More specifically, the traveling body 13 can convey the same number of objects to be processed as the number of suction tables 108 described later. The plurality of processing units 100 are all provided on one side of the first rail 11 (on the right side in FIG. 5). The plurality of processing units 100 are mounted on a second rail 101 arranged in a direction orthogonal to the first rail 11, a processing table 103 running along the second rail 101, and a processing table 103. It has a processing machine 104 that grinds the placed laminate W. The processing table 103 has a transfer position of the laminated body W at which the first rail 11 and the second rail 101 intersect, and a processing position located outside the laminated body W (on the right side in FIG. 5) for processing the laminated body W. It is provided to move.

The supply unit 60 has a work cartridge 61 for holding the laminated body W before processing, and is provided to supply the laminated body W before processing to the transport unit 10. The discharge unit 70 has a work cartridge 71 that holds the laminated body W after processing, and is provided so that the laminated body W after processing from the transport unit 10 is housed in the work cartridge 71. As the specific configurations of the transport unit 10, the supply unit 60, and the discharge unit 70, those published in JP-A-2014-65126 can be adopted.

As shown in FIG. 6, the machining table 103 provided in the machining unit 100 has a stage base 105 slidably mounted on the second rail 101 (see FIG. 5) and the stage base 105 on the stage base 105. It is provided with a holding base 107 that can be detachably attached. A suction base 108 (holding base) for holding the laminated body W is placed and fixed on the holding base 107. More specifically, the suction base 108 is selected according to the type and number of objects to be processed, and in the present embodiment, the three suction bases 108 are placed and fixed on the holding base 107. If the object to be processed has a size different from that of the laminated body W, the number and type of the suction bases 108 mounted and fixed on the holding base 107 are changed accordingly. On the surface of the suction table 108, as shown in FIGS. 2 and 7, when the recess 2a described later is formed, the back surface of the recess forming portion of the laminated body W (the other thin plate of the thin plate 1 on which the recess 2a is formed) is formed. A flat contact portion 108a that contacts 1) is provided. Further, as shown in FIG. 6, at least one suction hole 109 (four in the illustrated example) for sucking and holding the laminated body W is exposed on the surface of the suction table 108.

As shown in FIG. 7, the processing unit 100 includes a recess forming tool 110 (see FIGS. 9 to 11) that forms a bottomed recess 2a that does not reach the surface facing the other thin plate 1 on one thin plate 1. As shown in FIG. 8, it has a removing tool 120 for removing a portion (removal target portion) remaining in the recess forming portion of the thin plate 1 in which the recess 2a is formed. The recess forming tool 110 itself is not necessarily a part of the processing device M, but can be attached to the processing device M, and when attached to the processing device M, forms a part of the processing unit 100. There is.

The processing unit 100 has a detector 130 (see FIG. 2) that detects the position in the thickness direction of the concave portion forming target portion of the laminated body W before forming the concave portion 2a. As the detector 130, an optical displacement meter can be used. The detector 130 is arranged above the suction table 108, moves above the recess forming target portion immediately before the recess forming operation, and is held by the suction table 108 in the thickness direction of the recess forming target portion of the laminate W. Detect the position (thickness). Here, the portion to be formed of the recess means a portion where the recess of the laminated body W is to be formed.

A grindstone is used as the recess forming tool 110. As shown in FIGS. 9 to 11, this grindstone has a tubular grinding portion 111 that opens downward and a shaft portion 112 that projects upward from the upper portion of the grinding portion 111. In addition, in FIG. 9 to FIG. 11, the scale is changed from the actual one in order to make the configuration easier to understand. The shaft portion 112 is a spindle 104a provided in the processing machine 104 (corresponding to a drive mechanism of the recess forming tool. The drive mechanism is a mechanism for driving the recess forming tool 110, and has a configuration of a motor, a power transmission mechanism, and the like in addition to the spindle. May be included.) Is detachably attached. In the grinding unit 111, abrasive grains are arranged on the periphery and the lower surface of the tubular shape, and the thin plate 1 is ground by the peripheral surface and the lower surface of the tubular shape. A slit 113 is formed in the tubular grinding portion 111 from the lower portion to the upper portion. Therefore, the work chips generated by grinding move to the inside of the tubular grinding portion 111 through the slit 113.

The grindstone as the recess forming tool 110 forms the recess 2a while performing planetary motion. That is, as shown in FIG. 12, the grindstone rotates with the normal direction of the laminated body W as the rotation axis O1, and the rotation axis O1 rotates relative to the center O2 with respect to the normal direction of the laminated body W. By doing so, the recess 2a (see FIG. 7) is formed. Strictly speaking, the grinding accuracy of grindstones of the same product may differ depending on the grindstone. Therefore, by controlling the planetary motion of the grindstone when forming the recess 2a as described above, it is possible to form the recess 2a having an accurate shape according to the grindstone. Further, as a result, a recess 2a formed of a circular groove in a plan view as shown in FIG. 3 is formed, and the recess 2a remains in a columnar shape without being ground. Therefore, the portion to be removed to be removed in a later step is a convex cross section having a thick portion (remaining portion) and a thin portion (a portion caused by the recess 2a) arranged around the thick portion. It has a shape (see FIGS. 7 and 8).

The depth of the recess 2a formed by the recess forming tool 110 is appropriately determined depending on the purpose of use, the material, and the like of the laminated body W. From the viewpoint of removing the recess 2a, the deeper the recess 2a is, the better, but depending on the dimensional accuracy of the recess forming tool 110, abrasive grains, etc., the deeper the recess 2a, the more thin plates due to penetration. Is more likely to hurt.

As the remover 120, as shown in FIG. 8, a suction tool that sucks the region including the removal target portion can be used. That is, as shown in FIG. 4, the removing tool 120 removes the part to be removed by suction, so that the through hole 2 is formed in only one of the thin plates 1. The remover 120 sucks and removes the portion to be removed, and also sucks and removes the work chips (cutting chips) generated when the recess 2a is formed.

The processing unit 100 can perform not only the formation of the through hole 2 in the thin plate 1 but also other processing. For example, the end face of the laminated body W can be ground or polished. As shown in FIG. 6, a processing tool 140 such as a recess forming tool 110, other grinding tools, and a polishing tool is placed on the processing table 103, and a spindle 104a (see FIG. 9) can be used according to the purpose. It is provided so that it can be installed automatically.

The processing device M has a control device (not shown) that controls various operations. Here, the control device can be composed of, for example, an electronic control unit. The control device controls various operations of the laminate processing method described later. In particular, the control device detects the position of the recess forming target portion of the laminated body W in the thickness direction by the detector 130 before forming the recess 2a, and controls to operate the recess forming tool 110 based on the detection data. .. The surface texture of the laminated body W is different for each laminated body W because there are individual differences in a very minute range even if the laminated body W is of the same type. Therefore, the position of the concave portion forming target portion in the thickness direction (thickness of the concave portion forming target portion) is slightly different for each laminated body W held on the suction table 108. Therefore, by performing the control as described above, the influence of individual differences in the laminated body W can be reduced, and the recess 2a having an accurate depth can be accurately formed.

[Laminate processing method]
The laminate processing method of the present embodiment includes a step (S100) of supplying the laminate W before processing to the processing unit 100 by the transport unit 10 and a step of processing the laminate W before processing supplied by the processing unit 100. (S200) and a step (S300) of carrying out the processed laminate W by the transport unit 10.

The processing step (S200) includes a step (S210) of forming a bottomed recess 2a in one thin plate 1 of the laminated body W so as not to reach a surface facing the other thin plate 1 as shown in FIG. It has a step (S220) of removing a portion of the thin plate 1 in which the recess 2a is formed from the bottom surface of the recess 2a to the facing surface as shown in FIG.

In the recess forming step (S210), the laminate W is formed with a recess based on the detection step (S211) for detecting the position of the recess forming target portion of the laminated body W in the thickness direction and the data obtained in the detection step (S211). It has a forming step (S212) for forming the recess 2a by grinding with the tool 110. In the detection step (S211), as shown in FIG. 2, the detector 130 is moved above the recess formation target portion T, and the detection tool 130 detects the thickness of the recess formation target portion. The amount to be ground is calculated from the detected thickness. When the grinding amount is calculated, grinding is performed based on the calculation result in the forming step (S212). In the forming step (S212), the portion remaining in the concave portion forming portion (the portion to be removed) is ground to a thickness that can be removed by suction of the removing tool 120. Since the appropriate thickness of the recessed portion to be formed varies depending on the strength of the suction force of the remover 120 and the type of the object to be processed, the thickness cannot be uniformly determined, but the strength of the suction force and the object to be processed can be determined. It is determined in consideration of the type, material, shape of the recess, etc.

In the removing step (S220), the part to be removed is removed by suction of the suction tool (removing tool 120). Due to the negative pressure due to suction, stress acts intensively on the recess 2a, which is thinner than the other portions, causing breakage in the recess 2a, and the portion to be removed is removed. Since the portion to be removed is formed in a thin film shape, the above-mentioned stress acts accurately on the bottom portion of the recess 2a, and a desired plan-view shape can be easily and surely removed. Therefore, by providing the shape of the portion to be removed as described above, the desired through hole 2 can be easily and surely formed. Further, in this removing step (S220), the processing waste generated in the recess forming step (S210) by the suction is removed.

[advantage]
According to the laminated body processing method by the processing apparatus M as described above, the laminated body in which the through hole 2 is formed in one thin plate 1 and the through hole 2 is not formed in the other thin plate 1 facing the thin plate 1. The work piece can be obtained easily and surely. In particular, since the bottomed recess 2a that does not reach the facing surface of the other thin plate 1 is formed in the recess forming step (S210), it is possible to prevent the other thin plate 1 from being scratched.

Further, before the concave portion 2a is formed, the position of the concave portion forming target portion of the laminated body W in the thickness direction is detected by the detector 130, and the concave portion 2a is formed based on this data. It is possible to reliably form a desired bottomed recess 2a that does not reach the surface facing the other thin plate 1, and it is possible to more accurately suppress the occurrence of scratches on the other thin plate 1.

Further, as shown in FIGS. 2 and 7, the surface of the suction table 108 has a flat contact portion 108a that abuts on the back surface of the recess-forming portion of the laminated body W. Since the contact portion 108a supports the laminated body W, the desired recess 2a can be formed more easily and reliably.

Further, the part to be removed can be easily and surely removed by suctioning the suction tool, and the work dust generated when the recess 2a is formed can be removed. In other words, the steps of removing machining debris can be reduced.

In the formation of the recess 2a and the removal of the removal target portion, since the laminate W is adsorbed and held on the suction table 108 and fixed, the recess 2a can be formed and the removal target portion can be easily and surely removed. ..

Since the laminate processing device M includes a transport unit 10 for transporting the laminate W to the suction table 108, the laminate W to be processed can be easily and reliably transported. Further, a plurality of laminates W can be conveyed at the same time, and the processing unit can hold each of the plurality of laminates W to be conveyed at one time and process them, so that the laminate W can be processed very efficiently. Can be done.

Further, since the processing tool for polishing the end face of the laminated body W held on the suction table 108 is provided, not only the formation of the through hole 2 in the thin plate 1 but also other processing such as polishing the end face of the laminated body W can be performed. It can be carried out. Further, since the holders for accommodating the recess forming tool 110 and the processing tool 140 when not in use are provided, the recess forming tool 110 and the processing tool 140 when not in use can be accommodated in the holders, respectively. Further, a spindle on which the recess forming tool 110 and the machining tool 140 can be mounted and a control unit for controlling the operation of the spindle are further provided, and this control unit selectively mounts the recess forming tool 110 and the machining tool 140 on the spindle. By controlling the process, the control unit can control other processes such as the forming process of the through hole 2 and the polishing process of the end face.

[Other Embodiments]
The present invention is not limited to the above-described embodiment, and the design can be appropriately changed within the scope intended by the present invention.

In the above embodiment, the liquid crystal panel substrate has been described as an example of the laminated body W, but the present invention is not limited thereto. For example, it may be a laminated body in which thin plates are laminated without any gap. It is especially effective when forming holes in one thin plate of a laminated body in which holes are formed from one thin plate side using a grindstone, a drill, etc. in a laminated state, and the other thin plates are damaged. be.

Further, the laminated body may be formed by laminating at least three thin plates. In this case, in the recess forming step, it is also possible to form a through hole in at least one thin plate at a position corresponding to the plan view recess. Specifically, in the recess forming step, it is also possible to form a through hole in the upper thin plate of the laminated body in which three thin plates are laminated by the recess forming tool and to form a recess in the thin plate of the intermediate layer.

Further, although the case where a grindstone is used for forming the concave portion 2a has been described, the present invention is not necessarily limited to this, and the concave portion may be formed by using another processing tool.

In addition, although the method using suction for removing the portion to be removed has been described, the present invention is not necessarily limited to this. For example, the portion to be removed may be removed by water pressure, pressing, adhesive force, or the like. Even in such a case, it is preferable to remove the work chips together with the removal of the portion to be removed.

In the above embodiment, the grindstone is moved by a planet to form a recess, but the present invention is not limited to this, and the grindstone or the drill may be ground while rotating on the spot without the planetary movement. Further, in the above embodiment, the structure is such that a protruding portion remains in the middle of the recessed portion, but the recess may be flat over the entire planar shape of the through hole.

In the above embodiment, a step (S210) of forming a bottomed recess 2a in one thin plate 1 that does not reach the facing surface of the other thin plate 1 and from the bottom surface of the recess 2a of the thin plate 1 in which the recess 2a is formed. A hole was formed in one of the thin plates 1 in the step (S220) of removing the portion (bottom) up to the facing surface, but the present invention is not limited to this. For example, when a fluid other than a gas such as air or a solid is arranged between two thin plates, it may be difficult to remove them due to these substances. In this case, an auxiliary step to assist the removal may be added. As a step of assisting the removal, for example, as shown in FIG. 14, a step of applying an impact or vibration so as to cause a crack on the bottom surface of the recess 2a by the assisting tool 121 can be considered. By forming a crack penetrating the thin plate 1 at at least one of the recesses 2a, the force required for removal is reduced and the removal becomes easier. Even if cracks are formed on the entire circumference of the recess 2a, it is difficult to remove the bottom only by forming the cracks, and a removal step such as suction is required to form a through hole in one of the thin plates. Here, by forming cracks in the recess 2a as close to the outer periphery as possible by the auxiliary step, it is possible to reduce the portion that remains without being removed.

In the above embodiment, when the recess 2a is formed, the recess forming tool 110 is rotationally moved with respect to the thin plate 1, but the present invention is not limited to this, and the recess forming tool 110 is fixed and the thin plate 1 is moved. It may be rotated and moved.

In the above embodiment, the configuration in which the sealing member is sandwiched between the two thin plates has been described, but the present invention is not limited to this, and the laminated body may have a configuration in which the sealing material or the like is not sandwiched. The present invention can be applied even when there is a sufficient distance between two thin plates.

Further, although the processing apparatus M including the transport unit 10 for transporting the laminated body W to the suction table has been described, the provision of the transport unit 10 is not an essential constituent requirement of the present invention. Further, in the above embodiment, by providing the transport unit 10 and the plurality of processing units 100, it is possible to process a plurality of laminated bodies W at the same time. Not limited.

Further, although the laminate processing apparatus M has described the one in which the position of the laminate W in the thickness direction of the concave portion forming target portion is detected by the detector 130, the present invention is not necessarily limited to this. Further, the laminate processing device can also include a camera that captures a relative plane position between the suction table and the laminate held by the suction table. Specifically, as in Japanese Patent Application Laid-Open No. 2014-651126, a camera can be provided in the transport unit. By providing both this camera and the detector 130 of the above embodiment, the relative plane position between the suction table and the laminated body is recognized by using the shooting data of the camera, and the data of the detector 130 is used. It is possible to perform various processing operations while recognizing the relative positions of the suction table and the laminated body in the thickness direction.

As described above, the present invention can form a through hole in a desired thin plate of a laminated body used in, for example, a mobile communication terminal.

1 Thin plate 2 Through hole 2a Recession 3a Sealing member 3b Sealing member 10 Conveying unit 60 Supply unit 61 Work cartridge 70 Discharge unit 71 Work cartridge 100 Machining unit 103 Machining table 140 Machining tool W Laminated body

Claims (22)

It is a method of processing a laminated body in which a plurality of thin plates are laminated.
A recess forming step of forming a bottomed recess in one thin plate that does not reach the surface facing the other thin plate.
A laminate processing method comprising a removing step of removing a portion of the thin plate in which the recess is formed from the bottom surface of the recess to the facing surface. The laminate processing method according to claim 1, wherein in the removal step, the removal target portion is removed by suction. The laminate processing method according to claim 1 or 2, wherein the processing waste generated in the recess forming step is removed when the removal target portion is suction-removed by the removing step. The laminate processing method according to claim 1, claim 2 or claim 3, wherein the recess is formed by grinding with a grindstone in the recess forming step. The grindstone rotates about the normal direction of the laminated body as a rotation axis, and the rotation axis rotates relative to the laminated body about the normal direction of the laminated body, so that the concave portion is formed. The laminate processing method according to claim 4. The laminate processing method according to claim 4 or 5, wherein the recess forming step includes a detection step of detecting the position of the recess forming target portion of the laminate in the thickness direction before forming the recess. The method for processing a laminate according to any one of claims 1 to 6, wherein the laminate is a substrate for a liquid crystal panel. The laminated body is composed of at least three thin plates laminated.
The laminate processing method according to any one of claims 1 to 7, wherein in the recess forming step, a through hole is formed in at least one thin plate at a position corresponding to the recess in a plan view. The laminate processing method according to any one of claims 1 to 8, further comprising an auxiliary step of reducing the removing force required for the removing step after the recess forming step. The laminate processing method according to claim 9, wherein the auxiliary step is to form a crack penetrating the thin plate in at least a part of the outer periphery of the recess. It is a device that processes a laminated body in which a plurality of thin plates are laminated.
A drive mechanism that drives a recess forming tool that forms a bottomed recess that does not reach the surface facing the other thin plate on one thin plate.
A laminate processing apparatus having a removing tool for removing a portion of a thin plate having the recess formed from the bottom surface of the recess to the facing surface. The laminate processing device according to claim 11, wherein the removing tool is a suction tool that sucks the portion to be removed. The laminate processing apparatus according to claim 12, wherein the adsorbent removes the processing debris generated when the recess is formed when the portion to be removed is sucked and removed. The recess forming tool is a grindstone and
The grindstone rotates about the normal direction of the laminated body as a rotation axis, and the rotation axis rotates relative to the laminated body about the normal direction of the laminated body, so that the concave portion is formed. The laminate processing apparatus according to claim 11, claim 12 or claim 13. The laminate processing apparatus according to claim 14, further comprising a detector for detecting the position of the recess-forming target portion of the laminate in the thickness direction before forming the recess. 11. The laminate processing apparatus according to the above. The laminate processing apparatus according to claim 16, wherein the auxiliary mechanism forms a crack penetrating a thin plate at least a part of the outer periphery of the recess. The laminated body is composed of at least three thin plates laminated.
The laminate processing apparatus according to any one of claims 11 to 17, wherein the recess forming tool forms a through hole in at least one thin plate at a position corresponding to the recess in a plan view. The laminate processing apparatus according to claim 17 or 18, further comprising a grinding tool for grinding the end face of the laminate or a polishing tool for polishing. The laminate processing apparatus according to claim 19, further comprising a holder for accommodating the recess forming tool, the grinding tool, or the polishing tool when not in use. The recess forming tool, the spindle to which the grinding tool or the polishing tool can be mounted, and a control unit for controlling the operation of the spindle are further provided.
The laminate processing device according to claim 20, wherein the control unit controls the recess forming tool and the grinding tool or the polishing tool to be selectively mounted on the spindle. A method for producing a laminated body processed product, which comprises the laminated body processing method according to any one of claims 1 to 10, and which produces a laminated body processed product having a through hole in one of the thin plates.

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