JP2021052137A - Position determination method of common standing position, position determination device, and position determination program - Google Patents

Abstract

To increase the number of common standing positions of backup pins as much as possible, and shorten a setup change time of the backup pins.SOLUTION: A method for determining the position of a common standing position 84 in which backup pins are commonly erected between a plurality of types of boards on which components are mounted by a surface mounters includes an image generation step of generating an image 82 that represents the outer shape of the board and the standing position where the backup pin is erected when the components are mounted on the board for each board model, and a determination step of determining the number of common standing positions by superimposing images of respective models, and in the determination step, the determination is made a plurality of times at different angles at which the respective images are superimposed.SELECTED DRAWING: Figure 9A

Description

The techniques disclosed herein relate to a common standing position positioning method, a positioning device, and a positioning program.

A surface mounter for mounting components on a board is provided with a backup device that supports the board from below in order to prevent the board from bending when the components are mounted on the board. The backup device has a plurality of removable backup pins erected, and when mounting components on the board, the backup pins are raised to support the board from below.

The position where the backup pin is erected is set according to the model of the board. When producing multiple types of boards, the standing position of the backup pin is changed according to the model after switching when the model of the board to be produced is switched. In the following description, changing the standing position of the backup pin according to the model of the board after switching is called setup change of the backup pin.

In paragraph [0091] of Patent Document 1, when the backup pin is replaced at the time of setup change, the position of the backup pin actually attached to the holding base and the backup pin used for holding the next printed wiring board are common. If there is a backup pin, leave the common backup pin as it is, remove the non-common backup pin, and use the backup pins other than the common backup pin as the holding base among the backup pins used to hold the next printed wiring board. It is stated that it may be attached.

Further, paragraph [0054] of Patent Document 2 describes a method of determining a support pin position that can be commonly used for a plurality of types of printed circuit boards. Specifically, in Patent Document 2, when there is no common backup pin that can be used for a plurality of models of printed circuit boards, the number of printed circuit board models is reduced one by one to obtain a common backup pin. It is stated that the search will take place.

Japanese Unexamined Patent Publication No. 2002-118399 Japanese Unexamined Patent Publication No. 2005-64058

In the method described in Patent Document 1, the more common backup pins are, the smaller the number of backup pins to be removed from the holding table and the number of backup pins to be attached to the holding table at the time of setup change, so that the setup change time is shortened. Therefore, in order to shorten the setup change time, it is desirable that the number of common backup pins is as large as possible. However, the method of searching for a common backup pin described in Patent Document 2 has room for improvement in increasing the number of common backup pins as much as possible.

In the present specification, a technique is disclosed in which the number of common standing positions of backup pins is increased as much as possible, thereby shortening the setup change time of backup pins.

(1) The method for determining the position of the common standing position disclosed in the present specification is to determine the position of the common standing position where the backup pin is commonly erected between the boards of a plurality of models on which the components are mounted by the surface mounter. The method is an image generation step of generating an image showing the outer shape of the board and the standing position where the backup pin is erected when the component is mounted on the board for each model of the board. A determination step of superimposing the images of each model to determine the number of common standing positions is included, and in the determination step, the determination is performed a plurality of times at different angles at which the images are superimposed.

When a component is mounted on a substrate by a surface mounter, the substrate is conveyed to the working position of the surface mounter by a conveyor. The inventor of the present application has found that when mounting components on a plurality of models of boards, the number of common standing positions differs depending on the direction in which the boards are conveyed. The orientation here refers to the side of the four sides of the substrate that is on the front side in the transport direction.

The method of searching for the common backup pin described in Patent Document 2 described above is to reduce the number of printed circuit board models one by one when the common backup pin does not exist, and to change the orientation of the printed circuit board. Not. Therefore, if the orientation of the printed circuit board is changed, even if there are more common backup pins, the printed circuit board can be mounted without changing the orientation. Therefore, there was room for improvement in increasing the number of common backup pins as much as possible.

According to the above-mentioned position determination method, in the determination step of determining the number of common standing positions by superimposing the images of each model, the determination is performed a plurality of times by changing the overlay angle of each image. By doing so, it is possible to know in what direction the substrates of each model should be transported so that the number of common standing positions is increased as much as possible. Therefore, by determining the orientation of each substrate so that the number of common standing positions is as large as possible, the common standing positions can be determined so that the number of common standing positions of the backup pins is as large as possible. As a result, the setup change time of the backup pin can be shortened.

(2) In the determination step, a composite image in which the images of each model are superimposed may be displayed, and the common standing position may be visually displayed on the composite image.

According to the above-mentioned position determining method, when the operator determines the number of common standing positions and determines the common standing positions, it becomes easy to determine the number of common standing positions.

(3) In the image generation step, a figure representing the outer shape of the substrate, the backup pin is erected when the component is mounted on one surface of the substrate and then mounted on the other surface. The image is generated by superimposing the figure representing the erection position and the figure representing the component mounted on one of the surfaces, and represents the position where the backup pin can be erected in the determination step. The image may be superimposed on the composite image and the addition of the standing position may be accepted.

It may be possible to increase the number of common standing positions by adding standing positions. According to the above position determination method, since it is possible to add standing positions, it is possible to increase the number of common standing positions.

By the way, when mounting a component on both sides of a board, when the component is mounted on the surface on which the component is mounted (one surface) and then mounted on the other surface, the component is mounted first. One side faces down. Therefore, when mounting the component on the other surface, the backup pin comes into contact with one surface. At this time, since the components are already mounted on one surface, the standing position of the backup pin is set to a position avoiding the components mounted on the one surface. Therefore, when adding an upright position, it is desirable to add the parts mounted on one side to a position avoiding it.

According to the above positioning method, a figure showing the outer shape of the board, a figure showing the standing position where the backup pin is erected when the component is mounted on one surface and then the component is mounted on the other surface, and a figure showing the standing position. , An image is generated by superimposing a figure representing a component mounted on one surface, and a composite image is created by superimposing the images of each model. Then, the created composite image and the image showing the position where the backup pin can be erected are superimposed and displayed, and the addition of the erection position is accepted. In this way, the standing position can be added (the position where the backup pin can be erected and the component is not mounted) and the position where it cannot be added (the position where the backup pin can be erected and the component is mounted). The operator can identify the position. As a result, the possibility that the standing position is added to the position where the standing position cannot be set can be reduced.

(4) The figure representing the component may be a rectangle representing the outermost shape of the component.

Some parts have a complicated outer shape. Therefore, when displaying a figure representing the part shape itself, it is difficult for the operator to visually confirm where the boundary of the part is. If it is difficult to confirm the boundary of the parts, it becomes difficult for the operator to grasp the position where the backup pin can be erected and the position where the backup pin cannot be erected.

According to the above-mentioned position-fixing method, the figure representing the part is a rectangle representing the outermost shape of the part. In this way, the operator can easily visually confirm the boundary of the parts, so that the operator can easily grasp the position where the backup pin can be erected and the position where the backup pin cannot be erected. As a result, the possibility that the standing position is added to the position where the standing position cannot be set can be further reduced.

(5) The figure representing each of the parts may be filled with the same single color.

According to the above-mentioned position-determining method, since the figures representing the parts are filled with the same single color, it becomes easier for the operator to grasp the position where the backup pin can be erected and the position where the backup pin cannot be erected.

(6) In the determination step, an image represented by Gerber data on one surface of each model may be superimposed on the composite image and displayed.

In addition to mounting components on the board, resists, patterns, drill holes, etc. are formed. Gerber data is data that represents these positions and shapes. It is not desirable to add an upright position at a position where a resist, pattern, drill hole, etc. is formed. According to the above-mentioned position-determining method, the image represented by the Gerber data on one surface of each model is further superimposed, so that the operator can grasp the position where the resist, the pattern, the drill hole, etc. are formed. This makes it possible to reduce the possibility that an upright position is added to a position where a resist, a pattern, a drill hole, or the like is formed.

(7) The method for determining the position of the common standing position disclosed in the present specification is to determine the position of the common standing position where the backup pin is commonly erected between the boards of a plurality of models on which the components are mounted by the surface mounter. In this method, for each model of the board, the outer shape of the board and the backup pin are erected when the component is mounted on one surface of the board and then mounted on the other surface. The first image generation step of generating the first image representing the standing position, the outer shape of the board, and the component mounted on the other surface for each model of the board, and then on the one surface. A second image generation step of generating a second image representing an erection position where the backup pin is erected when the component is mounted, and either the first image or the second image for each model. Is a substrate image of the model, and includes a determination step of superimposing the substrate images of each model to determine the number of common standing positions. The determination is made a plurality of times by either changing the substrate image of at least one model between the first image and the second image, or both.

The inventor of the present application mounts a component on one surface of the substrate first and then mounts the component on the other surface, and mounts the component on the other surface first and then mounts the component on one surface. It was found that the number of common standing positions may differ depending on the case of mounting. In other words, the inventor of the present application has found that the number of common standing positions may differ depending on which of one surface and the other surface the component is mounted first.

According to the above-mentioned position-determining method, the overlapping angles of the respective substrate images are different, the substrate images of at least one model are exchanged between the first image and the second image, or both are performed. In this way, it is common to determine the production procedure (direction in which the board is transported when mounting the component on the surface on which the component is mounted first and the surface on which the component is mounted later) for each model. You can see if the number of standing positions is as large as possible. Therefore, by determining the production procedure so that the number of common standing positions is as large as possible, the common standing positions can be determined so that the number of common standing positions of the backup pins is as large as possible. As a result, the setup change time of the backup pin can be shortened.

The invention disclosed herein can be realized in various aspects such as devices, methods, computer programs for realizing the functions of these devices or methods, recording media on which the computer programs are recorded, and the like.

Top view of the surface mounter according to the first embodiment Side view of head unit and backup device Perspective view of backup device Side view of a part of the backup device Block diagram showing the electrical configuration of the surface mounter Schematic diagram showing a state in which components are mounted on the leading surface of the board of model A. Schematic diagram showing a state in which components are mounted on the leading surface of the board of model B. Block diagram of the position-fixing device for the common standing position Schematic diagram showing a state in which components are mounted on the trailing surface of the board of model B. Schematic diagram showing a composite image that combines the board image of model A / leading surface / forward flow direction and the board image of model B / leading surface / forward flow direction. Schematic diagram showing a composite image that combines the board image of model A / leading surface / forward flow direction and the board image of model B / leading surface / reverse flow direction. Schematic diagram showing a composite image that combines the board image of model A / leading surface / forward flow direction and the board image of model B / trailing surface / forward flow direction. Schematic diagram showing a composite image that combines the board image of model A / leading surface / forward flow direction and the board image of model B / trailing surface / reverse flow direction. A model showing a composite image that combines the board images of model A, model B, model C, and model D, a composite image that combines the board images of model B and model C, and a composite image that combines the board images of model A and model D. Figure Schematic diagram showing board images of model G and model H Flowchart of the position determination program for the common standing position Flowchart for creating backup pin standing position data Flowchart of setup change using standing position data Schematic diagram showing an example of a board image created using a figure representing the outer shape of the part itself as a figure representing the part. Schematic diagram showing an example of a board image created by using a rectangle representing the outermost shape of a part as a figure representing a part. Schematic diagram for explaining Gerber data according to the second embodiment Flowchart of the position determination program for the common standing position

<Embodiment 1>
The first embodiment will be described with reference to FIGS. 1 to 16. In the following description, the left-right direction shown in FIG. 1 is referred to as the X direction, the front-back direction is referred to as the Y direction, and the up-down direction shown in FIG. 2 is referred to as the Z direction. Further, in the following description, the right side shown in FIG. 1 is referred to as an upstream side, and the left side is referred to as a downstream side. Further, in the following description, the reference numerals of the drawings may be omitted except for some of the same components.

(1) Configuration of Surface Mounter The configuration of the surface mounter 1 will be described with reference to FIG. The surface mounter 1 is a device for mounting a component E such as an electronic component on a substrate P, and is a base 10, a transport conveyor 11, a backup device 12 (see FIGS. 2 and 3), four tape component supply devices 13, and a head. It includes a unit 14, a head moving unit 15, a component imaging camera 16, a substrate imaging camera 17, a control unit 18 (see FIG. 5), an operation unit 19 (see FIG. 5), and the like.

The base 10 has a rectangular shape in a plan view. The rectangular frame A shown by the alternate long and short dash line in FIG. 1 indicates a working position (hereinafter referred to as a working position A) when the component E is mounted on the substrate P.
The conveyor 11 carries the substrate P from the upstream side in the X-axis direction to the working position A, and carries out the substrate P on which the component E is mounted at the working position A to the downstream side. The conveyor 11 includes a pair of conveyor belts 11A and 11B that circulate and drive in the X-axis direction, a conveyor drive motor 50 that drives those conveyor belts (see FIG. 5), and the like. The rear conveyor belt 11A can be moved in the front-rear direction, and the distance between the two conveyor belts 11A and 11B can be adjusted according to the width of the substrate P.

The backup device 12 (see FIGS. 2 and 3) is arranged below the working position A. The configuration of the backup device 12 will be described later.
The tape component supply devices 13 are arranged at two locations along the X-axis direction on both sides of the conveyor 11 in the Y-axis direction, for a total of four locations. A plurality of feeders 20 are attached to these tape component supply devices 13 side by side in the X-axis direction. Each feeder 20 is a so-called tape feeder, and includes a reel on which a component tape containing a plurality of components E is wound, an electric tape delivery device for pulling out the component tape from the reel, and the like. The parts E are supplied one by one from the parts supply position provided at the end on the side.

Although the tape component supply device 13 will be described here as an example of the component supply device, the component supply device may be a so-called tray feeder that supplies a tray on which the component E is placed, or may supply a semiconductor wafer. It may be something to do.

The head unit 14 is provided with a plurality of (five here) mounting heads 21. The configuration of the head unit 14 will be described later.
The head moving unit 15 moves the head unit 14 in the X-axis direction and the Y-axis direction within a predetermined movable range. The head moving unit 15 includes a beam 22 that supports the head unit 14 so as to be reciprocally movable in the X-axis direction, a pair of Y-axis guide rails 23 that support the beam 22 so that it can be reciprocated in the Y-axis direction, and a head unit 14. The X-axis servomotor 46 for reciprocating the beam 22 in the X-axis direction, the Y-axis servomotor 47 for reciprocating the beam 22 in the Y-axis direction, and the like are provided.

The two component imaging cameras 16 are provided between the two tape component supply devices 13 arranged in the X-axis direction, respectively. The component imaging camera 16 is for imaging the component E attracted to the mounting head 21 from below to recognize the rotation angle of the component E with respect to the mounting head 21, the component shape, and the like.
The substrate imaging camera 17 is provided in the head unit 14. The substrate imaging camera 17 is for recognizing the position and inclination of the substrate P by imaging a fiducial mark (not shown) attached to the substrate P.

(1-1) Head Unit The configuration of the head unit 14 will be described with reference to FIG. The head unit 14 is a so-called in-line type, and a plurality of mounting heads 21 are provided side by side in the X-axis direction. The head unit 14 includes a Z-axis servomotor 48 (see FIG. 5) that individually raises and lowers these mounting heads 21, and an R-axis servomotor 49 (see FIG. 5) that simultaneously rotates these mounting heads 21 around an axis. Is provided.

Each mounting head 21 sucks and releases the component E, and has a nozzle shaft 21A and a suction nozzle 21B detachably attached to the lower end of the nozzle shaft 21A. Negative pressure and positive pressure are supplied to the suction nozzle 21B from an air supply device (not shown) via the nozzle shaft 21A. The suction nozzle 21B sucks the component E by supplying a negative pressure, and releases the component E by supplying a positive pressure.
Although the in-line type head unit 14 will be described here as an example, the head unit 14 may be, for example, a so-called rotary head in which a plurality of mounting heads 21 are arranged on the circumference.

(1-2) Backup Device An example of the backup device 12 will be described with reference to FIGS. 2 to 4. The backup device 12 shown below is an example, and the configuration of the backup device 12 is not limited to the configuration shown below.
As shown in FIG. 3, the backup device 12 includes an upper plate 31, a lower plate 32 arranged under the upper plate 31, four columns 33, a plurality of backup pins 30, and an elevating mechanism 34 for raising and lowering the lower plate 32. (See Fig. 2) and so on.

The upper plate 31 is a metal member formed in a flat plate shape, and a plurality of pin insertion holes 31A penetrating in the plate thickness direction are formed in a matrix shape. The lower plate 32 is a metal member formed in a flat plate shape, and is connected to the upper plate 31 via columns 33 rising from four corners.

FIG. 4 schematically shows a part of the backup device 12. As shown in FIG. 4, the backup pin 30 has a columnar portion 30A extending in a columnar shape in the vertical direction, and a flange portion 30B extending in an annular shape from a position separated by a predetermined distance from the lower end of the columnar portion 30A to the upper side. .. The backup pin 30 is erected on the upper plate 31 by inserting the lower end portion into the pin insertion hole 31A.

As shown in FIG. 2, the elevating mechanism 34 includes a plurality of ball screws 34A extending downward from the lower plate 32, a ball nut 34B screwed into each ball screw 34A, an elevating motor 34C, a ball nut 34B and an elevating motor 34C. It is equipped with a belt 34D and the like that are hung around. When the elevating motor 34C is rotated, the ball nut 34B rotates via the belt 34D, and the ball screw 34A moves up and down. As a result, the backup device 12 moves up and down.

FIG. 2 shows a state in which the substrate P is supported from below by the backup pin 30. In the state before the substrate P is carried into the working position A, the backup pin 30 is lowered to a position where the upper end is lower than the substrate P. When the substrate P is carried into the working position A, the backup pin 30 is raised and the substrate P is lifted. As a result, the substrate P is supported from below by the backup pin 30.
In FIG. 2, the surface 55A facing the upper side of the substrate P is an example of one surface of the substrate P, and the surface 55B facing the lower side of the substrate P is an example of the other surface.

(2) Electrical Configuration of Surface Mount Machine As shown in FIG. 5, the surface mount machine 1 includes a control unit 18 and an operation unit 19. The control unit 18 includes an arithmetic processing unit 40, a motor control unit 41, a storage unit 42, an image processing unit 43, an external input / output unit 44, a feeder communication unit 45, and the like.

The arithmetic processing unit 40 includes a CPU, a ROM, a RAM, and the like, and controls each unit of the surface mounter 1 by executing a control program stored in the ROM.
The motor control unit 41 starts and stops each motor such as the X-axis servomotor 46, the Y-axis servomotor 47, the Z-axis servomotor 48, the R-axis servomotor 49, and the conveyor drive motor 50 under the control of the arithmetic processing unit 40. , And control the rotation speed.

The storage unit 42 is a rewritable storage device (hard disk or the like) in which data is not erased even when the power is turned off. Various programs and data are stored in the storage unit 42. The various data includes the model of the board P to be produced, the data related to the various parts E (including the shape of the parts), the order in which each model is produced, and the data for each model (the number of production sheets, the shape of the board P). , Part E to be mounted, mounting order of part E, mounting coordinates of part E, mounting angle, surface on which component E is mounted first (leading surface), surface on which component E is mounted later (trailing surface), The direction in which the board P is transported when the component E is mounted on the leading surface, the direction in which the board P is transported when the component E is mounted on the trailing surface, the standing position data of the backup pin 30, etc.) are included. ..

The standing position data of the backup pin 30 is data indicating the position where the backup pin 30 is erected when the component E is mounted on the substrate P. In this embodiment, the component E is mounted on both sides of the substrate P of each model. On the board P of each model, the backup pin 30 is erected when the component E is mounted on the leading surface (an example of one surface) and then the component E is mounted on the trailing surface (an example of the other surface). The standing position data and the standing position data on which the backup pin 30 is erected when the component E is mounted on the leading surface after the component E is mounted on the trailing surface are created in advance and stored in the storage unit 42. Has been done.

The image processing unit 43 is configured to capture image signals output from the component image pickup camera 16 and the substrate image pickup camera 17, and generates a digital image based on the output image signals.
The external input / output unit 44 is a so-called interface, and is configured to capture detection signals output from various sensors 51 provided in the main body of the surface mounter 1. Further, the external input / output unit 44 is configured to perform operation control for various actuators 52 (including an air supply device and a backup device 12 (not shown)) based on a control signal output from the arithmetic processing unit 40.

The feeder communication unit 45 is connected to the feeder 20 and controls the feeder 20 in an integrated manner.
The operation unit 19 includes a display unit such as a liquid crystal display and an input unit composed of a touch panel, a keyboard, a mouse, and the like. The operator can operate the operation unit 19 to perform various settings and operation instructions for the surface mounter 1.

(3) Common Standing Position of Backup Pin The common standing position of the backup pin 30 will be described with reference to FIGS. 6A and 6B.
As described above, the board P of each model has the component E mounted on both sides. For each model, a surface on which the component E is mounted (preceding surface) and a surface on which the component E is mounted (posterior surface) are preset. FIG. 6A shows a state in which the component E is mounted on the leading surface of the substrate P of the model A. FIG. 6B shows a state in which the component E is mounted on the leading surface of the substrate P of the model B. The circle 70 (hereinafter referred to as the dotted circle 70) shown by the dotted line in FIGS. 6A and 6B indicates the position of the pin insertion hole 31A of the backup device 12.

In the present embodiment, for example, when 100 boards P of model A and 50 boards P of model B are produced, basically, the component E is first mounted on the leading surface of 100 boards P of model A. After that, the component E is mounted on the leading surface of the 50 substrates P of the model B. Subsequently, the component E is mounted on the trailing surface of the 100 substrates P of the model A, and then the component E is mounted on the trailing surface of the 50 substrates P of the model B.

When the component E is mounted on the trailing surface of each substrate P, the leading surface faces downward, so that the leading surface is supported by the backup pin 30. Since the component E is already mounted on the leading surface, when mounting the component E on the trailing surface, it is necessary to erect the backup pin 30 while avoiding the component E mounted on the leading surface. Of the dotted circles 70 in FIGS. 6A and 6B, the dotted circle 70Y filled with yellow (Y) indicates the standing position where the backup pin 30 is erected when the component E is mounted on the trailing surface. There is. In other words, it indicates the position where the backup pin 30 comes into contact with the leading surface when the component E is mounted on the trailing surface.

When the component E is mounted on the trailing surface of the 100 boards P of the model A, and then the component E is mounted on the trailing surface of the 50 boards P of the model B, the 100 boards P of the model A are mounted. After the component E is mounted on the trailing surface, the arrangement of the backup pins 30 is changed according to the board P of the model B, and the component E is mounted on the trailing surface of the 50 boards P of the model B. In the following description, changing the arrangement of the backup pins 30 according to the model of the board P is referred to as setup change of the backup pins 30. The setup change may be performed manually by the operator, or may be performed automatically by the surface mounter 1.

The common standing position of the backup pin 30 is the standing position where the backup pin 30 is commonly erected among the boards P of each model when the component E is mounted on the trailing surface of the boards P of a plurality of models. Say that.
Here, as described above, each model has a leading surface and a trailing surface set in advance, but in the present embodiment, the component E is mounted on the trailing surface first, and then the component E is mounted on the leading surface. You can also change the mounting order as you do. In the following description, even if the mounting order is changed, the surface that has been set as the leading surface in advance is referred to as the leading surface as it is, and the surface that has been set as the trailing surface in advance is referred to as the trailing surface as it is. It is called the line surface. Therefore, the leading surface does not necessarily mean that the component is mounted first. Similarly, the trailing surface does not necessarily mean the surface on which the component will be mounted later.

As described above, in the present embodiment, the leading surface and the trailing surface can be exchanged, so that the common standing position is to mount the component E on the "surface on which the component E is mounted later" of the boards P of a plurality of models. Occasionally, it can be rephrased as an erection position in which the backup pin 30 is erected in common between the substrates P of each model.

Further, the board P of each model has the direction in which the board P is transported when the component E is mounted on the leading surface (the side of the four sides of the board P that is the front side in the transport direction) and the component E on the trailing surface. The direction in which the substrate P is conveyed at the time of mounting is preset. In the present embodiment, the direction in which the substrate P is conveyed can be changed to the direction opposite to the preset direction. In the following description, transporting the substrate P in a preset direction is referred to as a forward flow direction, and transporting the substrate P in a reverse direction is referred to as a reverse flow direction.

(3) Common Standing Position Positioning Device With reference to FIG. 7, a common standing position position determining device 60 (hereinafter, simply referred to as a position determining device 60) will be described. The position-determining device 60 determines the production procedure of the substrate P so that the number of common standing positions is as large as possible when the component E is mounted on the "plane on which the component E is mounted later" of the substrates P of a plurality of models. This is a device for determining the common standing position so that the number of common standing positions is as large as possible.
Here, the production procedure of the substrate P is that the substrate P is conveyed when the component E is mounted on the front surface and the trailing surface on which the component E is mounted first and the surface on which the component E is mounted later. The direction (forward flow direction or reverse flow direction).

The position-fixing device 60 is a so-called personal computer, and includes a CPU 61 (an example of a processing unit), a RAM 62, a storage unit 63, a display unit 64, an operation unit 65, and the like.
The CPU 61 executes a position-determining program for a common standing position (hereinafter, simply referred to as a position-determining program) stored in the storage unit 63 to determine a production procedure for the substrate P. The RAM 62 is used as a main storage device when the CPU 61 executes a position-fixing program. The storage unit 63 is a storage device that holds data even when power is not supplied. The display unit 64 is a liquid crystal display or the like. The operation unit 65 includes a keyboard, a mouse, a touch panel, and the like.

Various programs and data are stored in the storage unit 63. Various programs include an OS (Operating System), a position-fixing program, and the like. The various data include the model of the substrate P scheduled to be produced, the data related to the various parts E (including the shape of the parts), the order in which each model is produced, and the data for each model. These data are substantially the same as the data stored in the storage unit 42 of the surface mounter 1.

(4) Positioning Program The position-fixing program according to the first embodiment is a program that is interactively operated by an operator. The interactive means a form in which the operator interacts while looking at the screen displayed by the display unit 64. In the following description, the CPU 61 that executes the position-fixing program is simply referred to as a position-fixing program.

The position-fixing program executes the selection process, the image generation process (an example of the image generation step, the first image generation step, and the second image generation step), and the display / editing process described below. The selection process and the display / edit process are examples of the judgment process.

(4-1) Selection process The selection process is a process for selecting a model of the substrate P and accepting the setting of the production procedure described above for the selected model. When the position-fixing program is started, a selection screen (not shown) is displayed on the display unit 64. The operator selects two or more models of the board P on the displayed selection screen. Furthermore, the operator sets the production procedure for each model on the selection screen.

(4-2) Image generation process The image generation process is a process of generating two images for each model of the substrate P selected in the selection process. For example, in the case of model B, the position determination program generates a leading surface image 80A (an example of an image and a first image) shown in FIG. 6B and a trailing surface image 80B (an example of an image and a second image) shown in FIG. To do. The leading surface image 80A is an image showing a state in which the component E is mounted on the leading surface. The trailing surface image 80B is an image showing a state in which the component E is mounted on the trailing surface.

The generation of the leading surface image 80A will be described with reference to FIG. 6B. The positioning program first includes a figure 75 representing the outer shape of the substrate P (the outline of the substrate P and the inside is not filled), a figure 76 representing the component E mounted on the leading surface, and the leading surface. Figure 70Y (that is, a dotted circle 70Y whose inside is filled with yellow (Y)) representing the standing position where the backup pin 30 is erected when the component E is mounted on the trailing surface after the component E is mounted. And overlap.

Here, in the present embodiment, at the time of generating the preceding surface image 80A, the image 84 representing the position where the backup pin 30 can be erected is not yet superimposed, but for convenience, the image 84 is also shown superimposed in FIG. 6B. The image 84 is an image showing the position where the backup pin 30 can be erected by the dotted line circle 70 whose inside is not filled.
Here, the generation of the leading surface image 80A has been described, but the same applies to the generation of the trailing surface image 80B.

Further, in the present embodiment, as the figure 76 representing the component E, a rectangle representing the outermost shape of the component E is used instead of a figure representing the shape of the component E itself. Further, in the present embodiment, the figure 76 representing each component E is filled with the same single color (for example, gray). The reason for doing this will be described later.

(4-3) Display / Editing Process For example, in both model A and model B, a leading surface is set as a surface on which component E is mounted first, and a surface on which component E is mounted later (in this case, a subsequent surface). It is assumed that the forward flow direction is set as the direction in which the substrate P is conveyed when the component E is mounted on the surface). In this case, the position-determining program sets the image of the surface (preceding surface image 80A in this example) set as the surface on which the component E is mounted in advance as the board image 80 of the model for each model. Then, the position-fixing program creates a composite image 82 in which the substrate image 80 of the model A and the substrate image 80 of the model B are superimposed in the set directions (forward flow direction in this example) as shown in FIG. 9A. Then, the created composite image 82 is displayed on the display unit 64. At this time, the position-determining program superimposes and displays the image 84 showing the position where the backup pin 30 can be erected on the composite image 82.

Then, the position determination program visually displays the common standing position when there is a common standing position (common standing position) between the models in the composite image 82. In the example shown in FIG. 9A, since the common standing position does not exist, it will be described with reference to FIG. 10A. In the position determination program, when the standing positions of the backup pins 30 (dotted line circle 70Y filled with yellow (Y)) overlap in the board image 80 of the two models, the dotted line circle 70Y is as shown in FIG. 10A. Is filled with red (R). In the following description, the dotted line circle 70 filled with red (R) is referred to as the dotted line circle 70R. As a result, the common standing position is visually displayed. The dotted line circle 70R filled with red (R) is an example of a common standing position.

Here, a case where the common standing position is visually displayed by painting the dotted line circle 70R in red has been described as an example, but the form in which the common standing position is visually displayed is not limited to this. For example, it may be filled with other colors, or it may be displayed with numbers, letters, symbols, and the like.

The operator can edit (add or delete) the standing position of the backup pin 30 for each model while the composite image 82 is displayed. For example, in the image shown in FIG. 9A, when the operator adds the position indicated by the dotted line circle 70A of the board P of the model B as a new standing position, the standing position is common to the model A and the model B. This makes it possible to increase the number of common standing positions.

Alternatively, the standing position can be added for purposes other than the purpose of adding the common standing position. For example, if there is a location where it would be desirable to add an upright position, the operator can add an upright position at that location. Alternatively, it is possible to delete an unnecessary standing position from the already set standing positions. The number of backup pins 30 to be erected can be reduced by deleting unnecessary erection positions.

After the composite image 82 is displayed, the operator can display the selection screen again to change the production procedure of each model. The operation when the operator changes the production procedure will be described below.
For example, in the state where the composite image 82 shown in FIG. 9A is displayed, the substrate P is conveyed for the model B when the component E is mounted on the surface on which the component E is mounted (in this case, the trailing surface). Suppose that the direction is changed to the reverse flow direction. In that case, as shown in FIG. 9B, the position determination program maintains the forward flow direction for the model A board image 80 (leading surface image 80A) and 180 degrees for the model B board image 80 (leading surface image 80A). The composite image 82 is created by rotating and superimposing the images in the reverse flow direction. Then, the position determination program visually displays the standing position common to each model in the composite image 82.

Further, for example, it is assumed that the surface on which the component E is mounted first on the model B is changed from the leading surface to the trailing surface while the composite image 82 shown in FIG. 9A is displayed. In that case, as shown in FIG. 10A, the position determination program replaces the substrate image 80 of the model B between the leading surface image 80A and the trailing surface image 80B, and the substrate image 80 of the model B (trailing surface image 80B). Is superimposed on the substrate image 80 (preceding surface image 80A) of the model A in the forward flow direction to create a composite image 82. Then, the position determination program visually displays the standing position common to each model in the composite image 82.

(5) Example of determination of common standing position using a position-fixing program The determination of a common standing position using a position-fixing program will be described with reference to a plurality of examples.

(5-1) Example 1
Example 1 will be described with reference to FIGS. 9 and 10. Example 1 is an example in which there are two models (model A and model B), and the sizes of the boards P of these two models are the same.

FIG. 9A shows a case where the substrate image 80 (preceding surface image 80A) of each model is superimposed in the forward flow direction (referred to as pattern a). In the example shown in FIG. 9A, there is no common standing position between the model A and the model B, and the two standing positions are shown in yellow (Y) as the standing positions peculiar to the model A.
FIG. 9B shows a case (referred to as pattern b) in which the direction in which the substrate P is conveyed is the reverse flow direction when the component E is mounted on the trailing surface of the model B. In this case, the leading surface image 80A of the model B is rotated 180 degrees and combined. In the example shown in FIG. 9B, three standing positions are shown in red (R) as common standing positions common to the model A and the model B.

FIG. 10A shows a case where the surface on which the component E is mounted is changed to the trailing surface of the model B and the substrate image 80 (trailing surface image 80B) of the model B is superimposed in the forward flow direction (referred to as pattern c). ) Is shown. In this case, the trailing surface image 80B of the model B is combined without being rotated. In the example shown in FIG. 10A, one standing position is shown in yellow (Y) as an upright position unique to the model A, and five standing positions are common to the model A and the model B. The installation position is shown in red (R).

In FIG. 10B, the surface on which the component E is mounted first on the model B is changed from the leading surface to the trailing surface, and the component E is further mounted on the surface on which the component E is mounted after the model B (in this case, the leading surface). The case where the board P is superposed with the direction of transporting the substrate P as the reverse flow direction at the time of mounting (referred to as pattern d) is shown. In this case, the trailing surface image 80B of the model B is rotated 180 degrees and combined. In the example shown in FIG. 10B, two standing positions are shown in yellow (Y) as standing positions unique to the model A, and three standing positions are common to the model A and the model B. The installation position is shown in red (R).

The operator records the number of common standing positions for each pattern. In the case of the above example, the number of common standing positions of each pattern is as follows.
(A) Model A leading surface forward flow + model B leading surface forward flow = common standing position 0 points (b) Model A leading surface forward flow + model B leading surface reverse flow = common standing position 3 locations (c) Model A leading surface forward flow + model B trailing surface forward flow = 5 common standing positions (d) Model A leading surface forward flow + model B backward surface reverse flow = 3 common standing positions

In the above example, the number of common standing positions is the largest in the pattern c. Therefore, the operator determines the production procedure when producing the model A and the model B as "model A leading surface forward flow + model B trailing surface forward flow". This means that for the model A, the component E is mounted on the leading surface first, and then the component E is mounted by transporting the trailing surface in the forward flow direction. Then, for the model B, it means that the component E is mounted on the trailing surface first, and then the component E is mounted by transporting the leading surface in the forward flow direction.
When the production procedure is determined so that the number of common standing positions is the largest, as a result, the common standing positions are determined so that the number of common standing positions of the backup pin 30 is as large as possible.

(5-2) Example 2
Example 2 will be described with reference to FIG. Example 2 is an example in which there are three or more models of the substrate P. When the number of models of the board P is three or more, it may not be possible to set the standing position common to those three models. In that case, the common standing position may be determined by dividing the substrates P of three or more models into several combinations.

For example, in the example shown in FIG. 11, in addition to the above-mentioned model A and model B, there are model C and model D. In the example shown in FIG. 11, when these four models are overlapped, there is no common standing position. Therefore, in the example shown in FIG. 11, the combination of the model B and the model C and the combination of the model A and the model D are divided. Then, the production procedure is determined so that the number of common standing positions is the largest for each combination.

(5-3) Example 3
Example 3 will be described with reference to FIG. Example 3 is an example in which the size of the substrate P differs depending on the model. Specifically, as shown in FIG. 12, in Example 3, there are a model G and a model H as models of the substrate P, and the model G is smaller in size than the model H. In this case, as shown by the dotted line 83, the substrate image 80 of the substrate P of the model G overlaps only a part of the substrate image 80 of the substrate P of the model H. In this case as well, the flow for determining the common standing position is the same as in Example 1.

(6) Flowchart of Positioning Program A flowchart of the position determination program will be described with reference to FIG.
In S101, the position-fixing program displays the above-mentioned selection screen and accepts the selection of the model. Here, it is assumed that model A and model B are selected.
In S102, the position-fixing program generates a leading surface image 80A of the model A and a trailing surface image 80B of the model A.
In S103, the position-fixing program generates the leading surface image 80A of the model B and the trailing surface image 80B of the model B.

In S104, the position-fixing program accepts the setting of the production procedure for each model. As described above, in the production procedure, the substrate P is conveyed when the component E is mounted on the front surface and the trailing surface on which the component E is mounted first and the surface on which the component E is mounted later. The direction (forward flow direction or reverse flow direction).
In S105, the position determination program sets the image of the surface of the leading surface image 80A and the trailing surface image 80B of the model A that is set as the surface on which the component E is mounted earlier in S104 as the board image 80 of the model A. .. Similarly, the position-fixing program sets the image of the surface of the leading surface image 80A and the trailing surface image 80B of the model B that is set as the surface on which the component E is mounted earlier in S104 as the board image 80 of the model B. .. Then, the position-fixing program superimposes the substrate image 80 of the model A and the substrate image 80 of the model B in the directions set in S104 to create a composite image 82.

In S106, the position determination program superimposes the generated composite image 82 and the image 84 showing the position where the backup pin 30 can be erected (that is, the image showing the position of the pin insertion hole 31A) on the display unit 64. .. The operator edits the standing position for each model if necessary.

In S107, the position determination program counts the number of common standing positions (an example of determination) and displays them on the display unit 64. The operator records the number displayed. The position-fixing program may not count the number of common standing positions, but the operator may look at the screen and count the number of common standing positions.
In S108, the position-fixing program ends the process when the operator performs a predetermined end operation, returns to S104 when the operator performs an operation to redisplay the selection screen, and repeats the process.

After the position-fixing program is completed, the operator determines the production procedure in which the number of common standing positions is as large as possible.

(7) Substrate Production Flow With reference to FIGS. 14 and 15, the creation of the upright position data of the backup pin 30 and the setup change using the upright position data according to the present embodiment will be described. Here, a case where the model of the board P is two models (model A and model B) will be described as an example.

First, with reference to FIG. 14, the creation of the upright position data of the backup pin 30 will be described.
In S201, the operator indicates the standing position data representing the standing position on which the backup pin 30 is erected when the component E is mounted on the trailing surface after the component E is mounted on the leading surface of the board P of the model A. , And, after the component E is mounted on the trailing surface, the standing position data representing the standing position where the backup pin 30 is erected when the component E is mounted on the leading surface is created.

In S202, the operator indicates the standing position data representing the standing position on which the backup pin 30 is erected when the component E is mounted on the trailing surface after the component E is mounted on the leading surface of the board P of the model B. , And, after the component E is mounted on the trailing surface, the standing position data representing the standing position where the backup pin 30 is erected when the component E is mounted on the leading surface is created.

In S203, the operator determines the common standing position between the model A and the model B by using the position determination program, and creates the common standing position data representing the common standing position.
In S204, the operator creates the differential standing position data for the model A. The differential standing position data for the model A is data representing the standing position excluding the common standing position determined in S203 from the standing position of the model A.
In S205, the operator creates the differential standing position data for the model B. The differential standing position data for the model B is data representing the standing position excluding the common standing position determined in S203 from the standing position of the model B.

Next, with reference to FIG. 15, setup change using the standing position data will be described.
In S301, the operator sets up the backup pin 30 for producing the board P of the model A. Specifically, the operator installs the backup pin 30 at the standing position indicated by the common standing position data and the standing position indicated by the difference standing position data for the model A.

In S302, the model A is produced by the surface mounter 1.
In S303, the operator sets up to produce the board P of the model B. Specifically, the operator removes the backup pin 30 standing at the standing position indicated by the differential standing position data for the model A from the backup pin 30 already standing, and the differential standing for the model B. The backup pin 30 is erected at the erection position indicated by the erection position data.
In S304, the model B is produced by the surface mounter 1.

(8) Effect of the Embodiment According to the method for determining the position of the common standing position according to the first embodiment, a determination step (selection process) of counting (determining) the number of common standing positions by superimposing the substrate images 80 of each model. And the display / editing process), the counting is performed a plurality of times with different angles (forward flow direction, reverse flow direction) for superimposing the respective substrate images 80. By doing so, it is possible to know in what direction the substrate P of each model should be conveyed so that the number of common standing positions is increased as much as possible. Therefore, by determining the orientation of each substrate P so that the number of common standing positions is as large as possible, the common standing positions can be determined so that the number of common standing positions of the backup pins 30 is as large as possible. As a result, the setup change time of the backup pin 30 can be shortened.

According to the position determination method according to the first embodiment, the common standing position is visually displayed on the displayed composite image 82, so that the operator can easily grasp the common standing position. Further, in the first embodiment, the position determination program counts the number of common standing positions, but the operator may count the number of common standing positions by looking at the screen. In that case, if the common standing position is displayed so as to be visible, the number of common standing positions can be easily counted.

According to the position determination method according to the first embodiment, the operator can add the standing position. Therefore, for example, if the number of common standing positions can be increased by adding the standing position, the standing position can be added. , The number of common standing positions can be increased.
Further, according to the position determination method according to the first embodiment, the figure 75 representing the outer shape of the substrate P, the figure 76 representing the mounted component E, and the figure 70Y representing the standing position where the backup pin 30 is erected (the figure 70Y). That is, an image is generated by superimposing the dotted circle 70Y) whose inside is filled with yellow (Y), and the images of each model are superposed to create a composite image 82. Then, the created composite image 82 and the image 84 representing the position where the backup pin 30 can be erected are displayed in an overlapping manner, and the editing of the erection position is accepted. Therefore, the operator can add the standing position (the position where the backup pin 30 can be erected but the part E is not mounted) and the position where the backup pin 30 cannot be added (the part among the positions where the backup pin 30 can be erected). The position where E is mounted) can be identified. As a result, the possibility that the standing position is added to the position where the standing position cannot be set can be reduced.

According to the position-determining method according to the first embodiment, the figure 76 representing the component E is a rectangle representing the outermost shape of the component E. In this way, it becomes easier to visually confirm the boundary of the component E, so that the operator can more easily grasp the position where the backup pin 30 can be erected and the position where the backup pin 30 cannot be erected.
Specifically, FIG. 16A shows a case where a plurality of SOPs (Small Outline Package) are mounted on the substrate P as the component E. A SOP is an electronic component in which a plurality of leads extend from two opposing sides of a rectangular component body. In the case of a component E having a complicated shape such as SOP, if a figure representing the component shape itself is used as the figure 76 representing the component E, it is difficult for the operator to visually confirm where the boundary of the component E is. On the other hand, if a rectangle representing the outermost shape of the part E is used as the figure 76 representing the part E as shown in FIG. 16B, the operator can easily visually confirm the boundary of the part E, so that the backup pin 30 is erected. It becomes easier for the operator to grasp the possible position and the non-standing position. As a result, the possibility that the standing position is added to the position where the standing position cannot be set can be further reduced.

According to the position-determining method according to the first embodiment, as shown in FIG. 16B, the figure 76 representing each part E is filled with the same single color, so that the backup pin 30 can be erected at a position where it can be erected and cannot be erected. It becomes easier for the operator to grasp the position.

According to the position determination method according to the first embodiment, the angles (forward flow direction, reverse flow direction) at which the respective substrate images 80 are overlapped are different, or at least one model of the substrate image 80 is used as the leading surface image 80A and the trailing surface image 80. Swap with 80B, or both. In this way, it can be understood how to determine the production procedure for each substrate P to increase the number of common standing positions as much as possible. Therefore, by determining the production procedure so that the number of common standing positions is as large as possible, the common standing positions can be determined so that the number of common standing positions of the backup pin 30 is as large as possible.

<Embodiment 2>
In the second embodiment, in the display / editing process described above, the position-determining program further superimposes the composite image 82 with the image represented by the Gerber data of the surface on which the component E is mounted first of each model.

(1) Gerber data With reference to FIG. 17, Gerber data will be described. Gerber data is data for manufacturing the substrate P, and is data exchanged between the designer and the manufacturer of the substrate P. The Gerber format, which is a format of Gerber data, is standardized by the Electronic Industries Alliance (EIA). The Gerber data contains information indicating the positions and shapes of the component surface silk, the component surface resist, the component surface pattern, the board outline, the drill (hole), the solder surface pattern, the solder surface resist, the solder surface silk, etc. formed on the substrate P. It is included.

(2) Flowchart of Positioning Program The flowchart of the position determination program according to the second embodiment will be described with reference to FIG. Here, the same reference numerals are given to the processes substantially the same as those in the first embodiment, and the description thereof will be omitted.

In S401, the position determination program includes the generated composite image 82, the image 84 showing the position where the backup pin 30 can be erected, and the image 95 represented by the Gerber data of the surface on which the component E is mounted at the tip of each model ( (See FIG. 17) is superimposed and displayed on the display unit 64. The operator edits the standing position for each model if necessary.

(3) Effect of the Embodiment According to the position determination method according to the second embodiment, the image 95 represented by the Gerber data is further superimposed, so that the operator can grasp the position where the resist, the pattern, the drill hole, etc. are formed. .. As a result, the possibility that the standing position is added to the position where the standing position cannot be set can be further reduced.

<Other Embodiments>
The techniques disclosed herein are not limited to the embodiments described above and in the drawings, and for example, the following embodiments are also included in the technical scope disclosed herein.

(1) In the above embodiment, when the component E is mounted on one surface of the board P of each model and then the component E is mounted on the other surface, the number of common standing positions of the backup pins 30 is increased as much as possible. The case of determining the common standing position was explained. On the other hand, when the component E is mounted on one surface of the board P on which the component E is not mounted on any surface, the backup pins 30 are commonly installed so that the number of common standing positions is as large as possible. The position may be determined.

Specifically, when the component E is mounted on both sides of the substrate P, a resist, a pattern, or the like is formed on both sides. Therefore, when the component E is mounted on the surface on which the component E is mounted first (corresponding to one surface of the substrate P on which the component E is not mounted on any surface), the surface on which the component E is mounted is mounted later. It is desirable to set the upright position of the backup pin 30 while avoiding the resists and patterns formed on the surface. In this case, the upright position of the backup pin 30 set on the surface on which the component E is mounted differs depending on the model of the substrate P.

Therefore, when mounting the component E on the surface on which the component E is mounted at the tip of the board P of each model, the common standing position is determined so that the number of common standing positions of the backup pins 30 is as large as possible. May be good. The position determination method in that case is substantially the same as that of the second embodiment except that the figures representing the parts E are not superimposed when the leading surface image 80A and the trailing surface image 80B are generated by the image generation processing. is there.
Further, the common standing position of the backup pin 30 may be determined so that the number of common standing positions is as large as possible for each of the surface on which the component E is mounted first and the surface on which the component E is mounted later. ..

(2) In the above embodiment, the case where the standing position can be edited has been described as an example, but the standing position may not be editable. If the standing position cannot be edited, the figure 76 representing the component E may not be overlapped when the leading surface image 80A and the trailing surface image 80B are generated. The figure 76 representing the part E is displayed so that the standing position is not set at the position overlapping the part E when editing the standing position, and it is unnecessary when the standing position cannot be edited. ..
Further, when displaying the composite image 82, the image 84 representing the position where the backup pin 30 can be erected may not be overlapped. The image 84 showing the position where the backup pin 30 can be erected is displayed to indicate the position that can be newly added as the erection position when editing the erection position, and is unnecessary when the erection position cannot be edited. That's why.

(3) In the above embodiment, the case where the operator interactively operates the position determination program to determine the common standing position has been described as an example, but the position determination program automatically operates the common standing position without the operation of the operator. May be determined. In that case, it is not necessary to display the composite image 82.

(4) In the above embodiment, two angles of 0 degrees (forward flow direction) and 180 degrees (reverse flow direction) are used as examples for superimposing the images of each model (board image 80), but the image is 90. It may be rotated by a degree or 270 degrees and overlapped.

(5) In the above embodiment, the case where the leading surface and the trailing surface can be exchanged has been described as an example, but these exchanges may not be possible.

(6) In the above embodiment, the rectangle representing the outermost shape of the part E has been described as an example of the figure 76 representing the part E, but the figure 76 representing the part E may be a figure representing the shape of the part E itself.

(7) In the above embodiment, the case where the figure 76 representing each component E is filled with the same single color has been described as an example, but these may not be filled with the same single color.

(8) In the above embodiment, the case of accepting the addition and deletion of the backup pin 30 has been described as an example. On the other hand, while accepting additions, deletion may not be accepted.

(9) In the above embodiment, a personal computer different from the surface mounter 1 has been described as an example of the position determination device 60, but the surface mounter 1 may also serve as the position determination device 60. Specifically, the control unit 18 and the operation unit 19 of the surface mounter 1 may function as the position-determining device 60.

1 ... Surface mounter, 30 ... Backup pin, 55A ... One surface, 55B ... The other surface, 60 ... Positioning device, 61 ... CPU (an example of processing unit), 70 ... Dotted circle (backup pin can be erected) 70Y ... dotted circle (an example of a figure showing the standing position where the backup pin is erected), 70R ... dotted circle (an example of a common standing position), 75 ... Figure represented, 76 ... Figure representing part, 80 ... Board image, 80A ... Leading surface image (example of first image), 80B ... Trailing surface image (example of second image), 82 ... Composite image, 84 ... Backup Image showing the position where the pin can be erected, 95 ... Image represented by Gerber data, E ... Parts, P ... Board

Claims (9)

It is a method of determining the position of a common standing position where backup pins are commonly erected between multiple types of boards on which components are mounted by a surface mounter.
An image generation step of generating an image showing the outer shape of the board and the standing position where the backup pin is erected when the component is mounted on the board for each model of the board.
A judgment process for determining the number of common standing positions by superimposing the images of each model, and
Including
A position-determining method in which, in the determination step, the determination is performed a plurality of times with different angles at which the images are superimposed. The method for determining the position of a common standing position according to claim 1.
A position-fixing method in which, in the determination step, a composite image in which the images of each model are superimposed is displayed, and the common standing position is visually displayed on the composite image. The method for determining the position of a common standing position according to claim 2.
In the image generation step, a figure representing the outer shape of the substrate, the erection in which the backup pin is erected when the component is mounted on one surface of the substrate and then mounted on the other surface. The image is generated by superimposing a figure representing a position and a figure representing the component mounted on one of the surfaces.
A position determination method in which, in the determination step, an image showing a position where the backup pin can be erected is displayed superimposed on the composite image, and the addition of the erection position is accepted. The method for determining the position of a common standing position according to claim 3.
A position-fixing method in which the figure representing the component is a rectangle representing the outermost shape of the component. The method for determining the position of a common standing position according to claim 4.
A position-fixing method in which a figure representing each of the above parts is filled with the same single color. The method for determining the position of a common standing position according to any one of claims 3 to 5.
In the determination step, a position determination method in which an image represented by Gerber data on one surface of each model is superimposed and displayed on the composite image. It is a method of determining the position of a common standing position where backup pins are commonly erected between multiple types of boards on which components are mounted by a surface mounter.
For each model of the board, the outer shape of the board and the standing position where the backup pin is erected when the component is mounted on one surface of the board and then mounted on the other surface. The first image generation step of generating the first image representing
For each model of the board, the outer shape of the board and the standing position where the backup pin is erected when the component is mounted on the one surface after the component is mounted on the other surface. A second image generation step of generating a second image to be represented, and
For each model, one of the first image and the second image is used as the board image of the model, and the board images of each model are superimposed to determine the number of common standing positions.
Including
In the determination step, the determination is performed by making the overlapping angles of the substrate images different, exchanging the substrate images of at least one model between the first image and the second image, or both. Positioning method that is performed multiple times. It is a position-fixing device that determines the common standing position where backup pins are commonly erected between multiple types of boards on which components are mounted by surface mounters.
Equipped with a processing unit
The processing unit
For each model of the board, an image generation process for generating an image showing the outer shape of the board and the standing position where the backup pin is erected when the component is mounted on the board.
Judgment processing to determine the number of common standing positions by superimposing the images of each model,
And
A position-determining device that performs the determination a plurality of times in the determination process at different angles at which the images are superimposed. It is a position-fixing program that determines the common standing position where backup pins are commonly installed between multiple types of boards on which components are mounted by surface mounters.
For each model of the board, an image generation process for generating an image showing the outer shape of the board and the standing position where the backup pin is erected when the component is mounted on the board.
Judgment processing to determine the number of common standing positions by superimposing the images of each model,
Let the computer run
In the determination process, a position determination program that performs the determination a plurality of times at different angles at which the images are superimposed.

Images