JP2021048227A - Component built-in multi-layer board and programmable logic controller - Google Patents

Abstract

To achieve miniaturization by incorporating an electrical component that requires heat dissipation to the outside in a multilayer board while ensuring heat dissipation of the electrical component.SOLUTION: A built-in component multi-layer board includes a multilayer board body formed by alternately stacking a plurality of base material layers and a plurality of metal layers, a heat dissipation-required built-in component which is an electrical component that is connected to the metal layer, is built in the multilayer board body, and requires heat dissipation to the outside of the multilayer board body, a heat dissipation layer that is connected to a metal layer to which the heat dissipation-required built-in component is connected from among a plurality of metal layers, and is provided outside the multilayer board body, and has flexibility and a sufficient area to dissipate heat from the heat dissipation-required built-in component, and an exposed component that is exposed to the outside from the surface layer of the multilayer board body, and is arranged so as to overlap with at least a part of the heat dissipation-required built-in component in the thickness direction of the multilayer board body.SELECTED DRAWING: Figure 2

Description

An embodiment of the present invention relates to a multi-layer board constituting an electric device such as a PLC, a multi-layer board having built-in components incorporating electric components requiring heat dissipation, and a programmable logic controller using the multi-layer board having built-in components.

In recent years, for example, in the field of programmable logic controllers (hereinafter referred to as PLCs), while the number of electrical parts used has increased with the improvement of PLC performance, factories have increased the demand for high-mix low-lot production. The number of PLCs installed inside is increasing. Therefore, in order to efficiently arrange a large number of PLCs in a limited space in a factory, there is an increasing need for space saving and miniaturization of PLCs.

Therefore, in PLCs and the like used in such factory equipment, the space of the entire equipment should be reduced by arranging the electrical parts inside the PLC at a high density, and eventually the factory equipment should be miniaturized and space-saving. Is needed. In order to arrange electrical components at high density in order to meet such demands, built-in components that can incorporate electrical components inside a multilayer board in which a plurality of layers are laminated, such as PALAP (registered trademark). Technology related to multilayer boards is developing.

In such a multi-layer board with built-in components, electrical components that are relatively large in size and cannot be physically incorporated in the multi-layer board, such as electrolytic capacitors, and components that need to be exposed to the outside, such as connectors, are multi-layered. Although it is arranged on the surface layer of the substrate, small and thin electric components such as integrated circuits such as MCUs and FETs can be provided inside the multilayer substrate. As a result, the components provided on the surface layer of the multilayer board and the electrical components built in the multilayer board are arranged so as to overlap each other in the thickness direction of the multilayer board, thereby reducing the projected area of the multilayer board, that is, the installation area of the entire multilayer board. As a result, the size of the entire multilayer board can be reduced, and the size of the entire device can be reduced.

However, even if it is a small and thin electric component that can be physically incorporated in a multilayer board, the heat generation of the electric component is large, or a plurality of electric components are arranged at high density and the heat generation as a whole is large. In that case, it is necessary to dissipate the heat generation to the outside of the multilayer board. Therefore, in the conventional configuration, when heat dissipation is required in this way, the electric components are arranged on the surface layer without being built in the multilayer board, or even if they are built in, a heat dissipation plate is provided on the surface layer to dissipate heat. It was necessary to secure. Therefore, in such a case, the projected area of the multilayer board is not reduced, and therefore, it is difficult to reduce the size of the entire multilayer board.

Japanese Unexamined Patent Publication No. 2016-171202

The present invention has been made in view of the above problems, and an object of the present invention is to ensure miniaturization by incorporating in a multilayer substrate while ensuring heat dissipation of electrical components that require heat dissipation to the outside. An object of the present invention is to provide a programmable logic controller using a substrate and a multilayer substrate having built-in components thereof.

The component-embedded multilayer board having the present configuration includes a multilayer board main body formed by alternately stacking a plurality of base material layers and a plurality of metal layers, and a multilayer board main body connected to the metal layer and built in the multilayer board main body. A component with a built-in heat dissipation, which is an electrical component that requires heat dissipation to the outside of the multilayer board main body, and a metal layer to which the component with a built-in heat dissipation is connected among a plurality of the metal layers are connected to the outside of the multilayer board main body. A heat-dissipating layer configured with flexibility and a sufficient area to dissipate heat from the heat-dissipating built-in component, and a heat-dissipating layer exposed to the outside from the surface layer of the multilayer board body. It includes exposed parts arranged so as to overlap at least a part of the heat-dissipating built-in parts in the thickness direction of the substrate body.

According to this configuration, the component-embedded multilayer board can dissipate the heat generated by the component requiring heat dissipation to the outside of the multilayer board main body by the heat dissipation layer. As a result, it is possible to suppress the accumulation of heat inside the main body of the multilayer board, and as a result, it is possible to prevent the heat generated in the component having a built-in heat dissipation from adversely affecting the operation of the multilayer board having the built-in component.

Further, according to this configuration, at least a part of the heat-dissipating built-in component and the exposed component is arranged so as to overlap in the thickness direction of the multilayer substrate main body. Therefore, the projected area of the multilayer substrate main body can be reduced as compared with the case where the heat-dissipating built-in component and the exposed component are arranged side by side so as to be exposed to the outside from the surface layer, for example. Further, since the heat radiating layer has flexibility, it can be configured as a so-called flexible substrate. This makes it possible to arrange the heat radiating layer by bending or folding it into an arbitrary shape, for example. Therefore, when arranging the heat radiating layer 51, the heat radiating layer 51 is less likely to get in the way, and as a result, a relatively free layout is possible.

As described above, according to this configuration, by incorporating the heat-dissipating built-in component in the multilayer board body while ensuring the heat dissipation of the heat-dissipating built-in component that requires heat dissipation to the outside of the multilayer board body, the multilayer board body The projected area can be miniaturized, and the entire multilayer board with built-in components can be miniaturized.

Further, in this configuration, at least one or both sides of the heat radiating layer is covered with a protective layer having an insulating property. According to this, when the multi-layer board with built-in components is incorporated into an electric device, it is possible to prevent an operator from directly touching the heat radiating layer and accidentally damaging the heat radiating layer. Further, according to this configuration, it is possible to prevent the heat radiating layer from coming into direct contact with the metal member or the like and causing the heat radiating layer and the metal member to conduct with each other.

Further, in this configuration, the end portion of the heat radiating layer is connected to an external member different from the multilayer board main body. The external member is, for example, a housing itself of an electric device such as a PLC provided with a multi-layer board having a built-in component or a structure installed in the housing, and is, for example, a metal component. According to this, the heat generated from the heat-dissipating built-in component is dissipated from the heat-dissipating layer and also from an external member via the heat-dissipating layer. As a result, the heat generated from the heat-dissipating built-in component can be dissipated more efficiently. Therefore, the area of the heat radiating layer can also be reduced, and as a result, the size of the entire multilayer board with built-in components can be reduced.

The end portion of the heat radiating layer may be connected to a metal layer different from the metal layer to which the heat radiating built-in component is connected. According to this configuration, the same action and effect as the above configuration can be obtained. Further, according to this configuration, the heat radiating layer can be arranged so as to straddle the upper part of the exposed component provided so as to be exposed from the surface layer, for example. According to this, by arranging the heat radiating layer in the space above the exposed parts, which was difficult to utilize in the past, the space can be effectively utilized, and by extension, the multi-layer board with built-in components can be further miniaturized. ..

Further, the heat dissipation layer can be integrally formed with the metal layer to which the heat dissipation built-in component is connected. According to this, when the multilayer substrate main body is manufactured by using a batch lamination process technology such as PALAP (registered trademark), the metal layer provided with the heat dissipation built-in component and the heat dissipation layer are formed in the same process. be able to. Therefore, compared to the case where the metal layer provided with the heat-dissipating built-in component and the heat-dissipating layer are separately formed and joined later, the labor related to manufacturing can be reduced, and as a result, the productivity is improved. Can be planned. In addition, since a joint is not formed at the boundary between the metal layer provided with the heat-dissipating built-in component and the heat-dissipating layer by soldering or the like, the strength of the boundary between the metal layer provided with the heat-dissipating built-in component and the heat-dissipating layer is strong. Can be kept high.

Further, the heat radiating layer can be configured to extend in a plurality of directions from the periphery of the multilayer substrate main body. That is, the component-embedded multilayer board may include a plurality of heat radiating layers extending from the periphery of the multilayer board main body in a plurality of directions. According to this, since the heat generated by the heat-dissipating built-in component is dissipated by the plurality of heat-dissipating layers, the surface area of each heat-dissipating layer can be reduced. Therefore, when arranging the heat radiating layers, each heat radiating layer is less likely to be an obstacle, and as a result, the multi-layer board with built-in components can be arranged in a more free layout.

The figure which shows an example of the schematic structure of the programmable logic controller which is the application example of the multilayer board with built-in component by 1st Embodiment. A cross-sectional view schematically showing an example of a multilayer board with built-in components according to the first embodiment. An example of a multi-layer board with built-in components according to the first embodiment is schematically shown, and is a plan view showing a state in which heat-dissipating built-in components are exposed. A cross-sectional view schematically showing an example of a multilayer board with built-in components according to the second embodiment. An example of a multi-layer board with built-in components according to the third embodiment is schematically shown, and is a plan view showing a state in which heat-dissipating built-in components are exposed. A cross-sectional view schematically showing an example of a multilayer board with built-in components according to a fourth embodiment.

Hereinafter, a plurality of embodiments will be described with reference to the drawings. In each embodiment, substantially the same configuration is designated by the same reference numerals and the description thereof will be omitted.

(First Embodiment)
The first embodiment will be described with reference to FIGS. 1 to 3. The component-embedded multilayer board 10 shown in FIGS. 2 and 3 can be applied to an electric device such as the PLC1 shown in FIG. 1, for example. As shown in FIG. 1, the PLC 1 includes a housing 2, an operation unit 3, a power supply unit 4, a structure 5, and a multi-layer board 10 with built-in components.

The housing 2 is made of metal, for example, and has a box shape. The operation unit 3 receives an operation input from the user. The power supply unit 4 is connected to an external commercial power source or the like to supply driving power to the component-embedded multilayer board 10. The structure 5 constitutes, for example, a part of the housing 2, and is made of, for example, a metal member having good heat dissipation. The component-embedded multilayer board 10 constitutes a main electronic circuit, that is, a logic circuit of the PCL, and is provided inside the housing 2. The component-embedded multilayer board 10 includes a signal line 11 connected to the operation unit 3, a power line 12 connected to the power supply unit 4, and a heat radiating structure unit 50 connected to the structure 5.

The component-embedded multilayer board 10 can be manufactured by using a batch laminating process technique such as PALAP (registered trademark). As shown in FIG. 2, the component-embedded multilayer board 10 includes a multilayer board main body 20, at least one built-in component 30, at least one exposed component 40, and a heat radiating structure portion 50.

The multilayer substrate main body 20 is configured by alternately stacking a plurality of base material layers 21 and a plurality of metal layers 22. In the following description, the thickness direction of the component-embedded multilayer board 10, the thickness direction of the multilayer board main body 20, and the stacking direction of the base material layer 21 and the metal layer 22 all mean the same direction. Further, the direction perpendicular to the thickness direction of the component-embedded multilayer board 10 is referred to as the surface direction of the component-embedded multilayer board 10 or the multilayer board main body 20, the base material layer 21, and the metal layer 22. Further, in the drawing, the dimensions in the thickness direction are greatly exaggerated with respect to the actual scale for easy explanation.

In the present embodiment, the plurality of base material layers 21 are the first base material layer 211, the second base material layer 212, the third base material layer 213, and the fourth base material layer 21, respectively, in order from one side in the thickness direction of the multilayer substrate main body 20. It is referred to as a material layer 214 and a fifth base material layer 215. Then, among the base material layers 211, 212, 213, 214, and 215, the layer located on the outermost side in the thickness direction of the multilayer substrate main body 20, that is, the layer exposed to the outside and forming the outer surface of the multilayer substrate main body 20. In this case, the first base material layer 211 and the fifth base material layer 215 are referred to as surface layers 211 and 215, respectively.

Of the respective base material layers 211, 212, 213, 214, and 215, at least the intermediate base material layers 212, 213, and 214 sandwiched between the surface layers 211 and 215 are resin materials having an insulating property, and have dimensional accuracy and adhesiveness. It is made of a thermoplastic resin such as polyimide, which has excellent properties. Further, the thickness dimensions of the base material layers 212, 213, and 214 in between these are set to such a thickness dimension that each has flexibility.

It should be noted that the surface layers 211 and 215 may be configured to have a thickness such that they have flexibility due to a thermoplastic resin such as polyimide, like the intermediate base material layers 212, 213 and 214, and have no flexibility. It may be configured to have a thickness dimension, that is, rigidity. Further, the surface layers 211 and 215 may be made of, for example, a glass epoxy resin or the like. Further, in the case of the present embodiment, of the surface layers 211 and 215, the surface layer 211 is located on the upper side in the direction of gravity when the component-embedded multilayer substrate 10 is installed, and the surface layer 211 is flexible such as, for example, a silicone resin. It can also be made of a resin material having properties and elasticity.

In the present embodiment, the plurality of metal layers 22 are on one side in the thickness direction of the multilayer substrate main body 20, in this case, the first metal layer 221, the second metal layer 222, the third metal layer 223, and the like, respectively, from the surface layer 211 side. It is referred to as a fourth metal layer 224. Each metal layer 221, 222, 223, 224 is composed of a metal layer having excellent conductivity and heat transfer, such as copper, aluminum, and gold. Each metal layer 221, 222, 223, 224 is configured to have either or both of the wiring pattern 23 and the heat dissipation pattern 24, for example, as shown in FIG.

The wiring pattern 23 is a wiring pattern for transmitting electric signals and electric power of the electric components 30 and 40. The heat dissipation pattern 24 is a so-called solid pattern for heat dissipation of the electric component 30, and its wire diameter is sufficiently thicker than the wiring pattern 23. That is, the heat dissipation pattern 24 has a smaller electric resistance than the wiring pattern 23. The heat dissipation pattern 24 may also be used as a grounding pattern for grounding the electrical components 30 and 40, for example.

In the case of the present embodiment, the component-embedded multilayer board 10 has a plurality of built-in components 30 as shown in FIG. The built-in component 30 is a small and thin electric component such as an integrated circuit such as an MCU or a FET, and is embedded in any one of the base material layers 211, 212, 213, 214, and 215. In the present embodiment, the built-in component 30 includes a first built-in part 31, a second built-in part 32, and a third built-in part 33. Among the built-in parts 31, 32, 33, for example, the first built-in part 31 is configured as a heat-dissipating built-in part 31 that requires heat dissipation to the outside of the multilayer board main body 20.

In this case, the heat dissipation built-in component 31 is directly or indirectly electrically and thermally connected to the metal layer 22. For example, as shown in FIG. 3, the heat-dissipating built-in component 31 has an input / output terminal 311, a heat-dissipating terminal 312, and a thermal pad 313. The necessary portion of each terminal 311 is connected to, for example, the wiring pattern 23. Further, the heat dissipation terminal 312 is connected to the heat dissipation pattern 24 via the thermal pad 313.

Each exposed component 40 is an electrical component that is exposed to the outside from the surface layers 211 and 215, and is a component that is relatively large in size and cannot be physically incorporated into a multilayer board, such as an electrolytic capacitor, or a connector or the like. Parts that need to be exposed to the outside, such as. A connection terminal (not shown) of each exposed component 40 is connected to, for example, one of the metal layers 22. In the following description, when a plurality of exposed parts 40 are distinguished, they are referred to as a first exposed part 41, a second exposed part 42, and a third exposed part 43.

For example, the first exposed component 41 of the exposed components 40 is arranged so as to overlap with at least a part of the heat dissipation built-in component 31 in the thickness direction of the multilayer board main body 20. That is, in this case, the heat dissipation built-in component 31 and the exposed component 41 are arranged so that at least a part or all of them overlap when the multilayer board main body 20 is viewed in a plan view.

The heat radiating structure portion 50 has a structure for radiating heat generated from the heat radiating built-in component 31 to the outside of the multilayer board main body 20, and is provided outside the multilayer board main body 20. The heat radiating structure portion 50 is made of a flexible substrate having flexibility. The heat radiating structure portion 50 has a sufficient surface area so that the heat radiating built-in component 31 can be radiated by natural air cooling without using a blower or the like.

In this case, the surface area of the heat radiating structure portion 50 means the total area of the area of the heat radiating structure portion 50 in the surface direction and the area in the thickness direction. The heat radiating structure portion 50 is thermally connected to at least a metal layer 22 provided with a heat radiating built-in component 31, in this case, a third metal layer 223. Further, the surface area of the heat radiating structure portion 50 is sufficient to dissipate heat from the heat radiating built-in component 31 by natural air cooling because the heat radiating structure portion 50 is not thermally connected to other members and has a heat radiating structure. In the case of a configuration in which heat is radiated by the unit 50 alone, the surface area of the heat radiating structure portion 50 can secure heat dissipation performance equal to or higher than, for example, a heat radiating plate for cooling the heat radiating built-in component 31 by the heat radiating structure unit 50 alone. It means that it is a thing.

Further, the heat dissipation structure portion 50 has a sufficient surface area so that the heat dissipation built-in component 31 can be dissipated by natural air cooling, and the heat dissipation structure portion 50 is thermally connected to another member 90 or the like to be another member. In the case of a configuration in which heat can be released to 90, the surface area of the heat radiating structure portion 50 is equal to or larger than, for example, a heat radiating plate when the amount of heat radiated from the heat radiating structure portion 50 and the heat released to other members 90 are included. It means that the heat dissipation performance can be ensured. Therefore, the surface area of the heat radiating structure portion 50 is appropriately determined according to the amount of heat radiated from the heat radiating built-in component 31 to be radiated, the material and thickness of the heat radiating structure portion 50, and the material and surface area of the other member 90. Can be set. When the component-embedded multilayer board 10 constitutes the PLC 1, the other member 90 or the external member 90 described later constitutes, for example, a part of the housing 2 or a structure provided in the housing 2. It can be a thing 5.

In the case of this embodiment, the heat radiating structure portion 50 is integrally formed with the multilayer substrate main body 20. In this case, the heat radiating structure portion 50 includes a heat radiating layer 51 and a protective layer 52. The heat radiating layer 51 is connected to the metal layer 223 to which the heat radiating built-in component 31 of each metal layer 22 is connected. The heat dissipation layer 51 is provided outside the multilayer board main body 20 and has a sufficient surface area for flexibility and heat dissipation of the heat dissipation built-in component 31.

The heat radiating layer 51 is made of a metal layer such as a metal foil having high heat transfer and flexibility. In the case of the present embodiment, the heat dissipation layer 51 is made of the same material as the metal layer 223 to which the heat dissipation built-in component 31 is connected among the metal layers 22, and the heat dissipation built-in component 31 is connected. It is integrally formed with the metal layer 223. That is, the heat dissipation layer 51 is formed in the same process as the step of forming the metal layer 223 to which the heat dissipation built-in component 31 is connected. In this case, the thickness dimension of the heat radiating layer 51 is set to be about the same as the thickness dimension of the metal layer 223.

Further, the protective layer 52 is made of, for example, a thermosetting resin having electrical insulation, and covers at least one surface of the heat radiating layer 51. In the case of the present embodiment, the protective layer 52 is configured to have two protective layers 521 and 522 covering both sides of the heat radiating layer 51. Further, the protective layers 521 and 522 are made of the same material as the base material layers 213 and 214 sandwiching the metal layer 223 to which the heat dissipation built-in component 31 is connected, respectively, and these base material layers 213 and 214 are formed. It is formed integrally with. That is, the protective layers 521 and 522 are formed in the same process as the steps of forming the base material layers 213 and 214 sandwiching the metal layer 223 to which the heat dissipation built-in component 31 is connected. In this case, the thickness dimensions of the first protective layer 521 and the second protective layer 522 are set to be approximately the same as the thickness dimensions of the third base material layer 233 and the fourth base material layer 234, respectively.

The end portion of the heat radiating structure portion 50, that is, the end portion of the heat radiating structure portion 50 opposite to the multilayer board main body 20, is connected to an external member 90 different from the multilayer board main body 20. In the case of the present embodiment, the external member 90 is a housing itself of an electric device such as a PLC provided with a component-embedded multilayer board 10, or a structure 5 installed in the housing, for example, a metal component. Is. In this case, the external member 90 can be composed of, for example, a heat radiating plate arranged at an arbitrary position.

The end portion of the heat radiating structure portion 50 is fixed to the external member 90 in a state where the protective layer 52, in this case, the second protective layer 522 is in contact with the external member 90. That is, the heat radiating layer 51 is not in direct contact with the external member 90. In this case, for example, by passing a fastening member 91 such as a screw through the end portion of the heat dissipation structure portion 50 and screwing it into the external member 90, the protective layer 52 at the end portion of the heat dissipation structure portion 50 is in contact with the external member 90. Is fixed to the external member 90. As a result, the heat radiating layer 51 in the heat radiating structure portion 50 is thermally connected to the external member 90 in a state of being electrically insulated. The end of the heat radiating structure portion 50 does not necessarily have to be connected to some member.

According to the embodiment described above, the component-embedded multilayer board 10 includes a multilayer board main body 20, a heat-dissipating built-in component 31, a heat-dissipating layer 51, and an exposed component 40. The multilayer substrate main body 20 is configured by alternately stacking a plurality of base material layers 21 and a plurality of metal layers 22. The heat-dissipating built-in component 31 is connected to the metal layer 22, and in the case of the present embodiment, is connected to the third metal layer 223 and is built in the multilayer board main body 20 to dissipate heat to the outside of the multilayer board main body 20. It is an required electrical component.

The heat radiating layer 51 is connected to the metal layer 22 to which the heat radiating built-in component 31 is connected among the plurality of metal layers 22, in this case, the third metal layer 223. Further, the heat dissipation layer 51 is provided outside the multilayer board main body 20 and has a sufficient area for flexibility and heat dissipation of the heat dissipation built-in component 31. At least the first exposed component 41 of the exposed components 40 is provided so as to be exposed to the outside from the surface layer of the multilayer board main body 20, and is provided with at least a part of the heat dissipation built-in component 31 in the thickness direction of the multilayer board main body 20. They are placed on top of each other.

According to this configuration, the component-embedded multilayer board 10 can dissipate the heat generated by the heat-dissipating built-in component 31 to the outside of the multilayer board main body 20 by the heat radiating layer 51. As a result, it is possible to suppress the accumulation of heat inside the multilayer board main body 20, and as a result, it is possible to prevent the heat generated in the heat dissipation built-in component 31 from adversely affecting the operation of the component-embedded multilayer board 10.

Further, according to the present embodiment, the heat dissipation built-in component 31 and the exposed component 40 are arranged so as to overlap each other in the thickness direction of the multilayer board main body 20. Therefore, the projected area of the multilayer substrate main body 20 can be reduced as compared with the case where the heat radiation required built-in component 31 and the exposed component 40 are arranged side by side so as to be exposed to the outside from the surface layer 211, for example. Further, since the heat radiating layer 51 including the protective layer 52 is configured as a flexible substrate having flexibility, it can be arranged by bending or folding it into an arbitrary shape, for example. Therefore, when arranging the heat radiating structure portion 50 including the protective layer 52 and the heat radiating layer 51, the heat radiating structure portion 50 is less likely to get in the way, and as a result, a relatively free layout is possible.

As described above, according to the present embodiment, the heat-dissipating built-in component 31 that requires heat dissipation to the outside of the multilayer board main body 20 is built in the multilayer board main body 20 while ensuring the heat dissipation of the heat-dissipating built-in component 31. The projected area of the multilayer board main body 20 can be reduced, and the entire multilayer board 10 with built-in components can be reduced in size.

Further, at least one or both sides of the heat radiating layer 51 is covered with a protective layer 52 having an insulating property. In the case of the present embodiment, both sides of the heat radiating layer 51 are covered with the first protective layer 521 and the second protective layer 522. According to this, when incorporating the component-embedded multilayer board 10 into an electric device, it is possible to prevent an operator from directly touching the heat radiating layer 51 and accidentally damaging the heat radiating layer 51. Further, according to this configuration, it is possible to prevent the heat radiating layer 51 from coming into direct contact with the metal member 90 or the like and causing the heat radiating layer 51 and the metal member 90 to conduct with each other.

Further, the end portion of the heat radiating layer 51 is connected to an external member 90 different from the multilayer board main body 20. The external member 90 is, for example, a housing itself of an electric device such as a PLC provided with a component-embedded multilayer board 10, or a structure 5 or the like installed in the housing, and is, for example, a metal component. According to this, the heat generated from the heat-dissipating built-in component 31 is dissipated from the heat-dissipating layer 51 and also from the external member 90 via the heat-dissipating layer 51. As a result, the heat generated from the heat-dissipating built-in component 31 can be dissipated more efficiently. Therefore, the area of the heat radiating layer 51 can also be reduced, and as a result, the size of the entire multilayer board 10 with built-in components can be reduced.

Further, the heat dissipation layer 51 is integrally formed with the metal layer 22 to which the heat dissipation built-in component 31 is connected, in this case, the third metal layer 223. According to this, when the multilayer substrate main body 20 is manufactured by using a batch lamination process technique such as PALAP (registered trademark), the heat radiating layer 51 and the third metal layer 223 can be formed in the same process. .. Therefore, as compared with the case where the heat radiating layer 51 and the third metal layer 223 are separately formed and joined later, the labor related to manufacturing can be reduced, and as a result, the productivity can be improved. Further, since a joint portion due to soldering or the like does not occur at the boundary portion between the heat radiating layer 51 and the third metal layer 223, the strength of the boundary portion between the heat radiating layer 51 and the third metal layer 223 can be kept high.

In each of the above embodiments, the heat radiating structure portion 50 can be configured separately from the multilayer substrate main body 20. That is, in this case, the heat dissipation layer 51 of the heat dissipation structure portion 50 is formed separately from the metal layer 22 to which the heat dissipation built-in component 31 is connected, in this case, the third metal layer 223, and is joined to each other by solder or the like. This may allow them to be thermally and electrically interconnected. Further, in this case, the first protective layer 521 and the second protective layer 522 can be bonded to the third base material layer 233 and the fourth base material layer 234 by adhesive, heat welding, or the like, respectively.

Further, the PLC 1 of the embodiment includes the above-mentioned multi-layer board 10 with built-in components and a housing 2 for accommodating the multi-layer board 10 with built-in components. According to this, by reducing the size of the component-embedded multilayer board 10 which occupies a large proportion of the size of the entire PLC1 as described above, it is possible to reduce the size and space of the entire PLC1. Then, by reducing the size and space of the PLC1, it is possible to reduce the size and space of the factory equipment, and a large number of PLC1s can be efficiently installed in the factory.

(Second Embodiment)
Next, the second embodiment will be described with reference to FIG.
In the multilayer board main body 20 of the present embodiment, the connection destination of the end portion of the heat radiating structure portion 50 is different from that of the first embodiment. In the multilayer substrate main body 20 of the present embodiment, the total number of the base material layer 21 and the metal layer 22 is further increased as compared with the multilayer substrate main body 20 of the first embodiment. In this case, the base material layer 21 further includes a sixth base material layer 216, a seventh base material layer 217, and an eighth base material layer 218 in addition to the first base material layer 211 to the fifth base material layer 215. It is composed of. Further, the metal layer 22 is configured to further include a fifth metal layer 225, a sixth metal layer 226, and a seventh metal layer 227 in addition to the first metal layer 221 to the fourth metal layer 224.

In this case, the areas of the sixth base material layer 216 to the eighth base material layer 218 and the fifth metal layer 225 to the seventh metal layer 227 are the first base material layers 211 to the fifth base material layer 215 and the first metal layer. It is set larger than the area of the 221 to the fourth metal layer 224. As a result, the multilayer substrate main body 20 has a stepped shape with the fifth base material layer 215 as a boundary. In this case, a part of the fifth base material layer 215 is exposed to the outside. Therefore, the exposed portion of the fifth base material layer 215 becomes the surface layer.

In the present embodiment, the end portion of the heat dissipation structure portion 50 is connected to a layer different from the layer to which the heat dissipation built-in component 31 is connected. That is, the end portion of the heat dissipation layer 51 is connected to a metal layer different from the provided third metal layer 223 to which the heat dissipation built-in component 31 is connected, for example, the fifth metal layer 225. In this case, the end portion of the heat radiating layer 51 and the fifth metal layer 225 may be integrally formed or may be joined by, for example, soldering. Further, the protective layer 52, that is, the first protective layer 521 and the second protective layer 522 are both connected to the fifth base material layer 215. In this case, the protective layer 52 and the fifth base material layer 215 may be integrally molded, or may be joined by, for example, an adhesive or heat welding.

Even with this configuration, the same effect as that of the first embodiment can be obtained.
Further, according to this configuration, as shown in FIG. 4, the heat radiating structure portion 50 may be arranged so as to straddle the upper part of the fourth exposed component 44 which is exposed from, for example, the fifth base material layer 215. it can. According to this, by arranging the heat radiating structure portion 50 in the space above the exposed component 40, which was difficult to utilize in the past, the space can be effectively utilized, and as a result, the component-embedded multilayer board 10 can be further miniaturized. Can be planned.

(Third Embodiment)
Next, the third embodiment will be described with reference to FIG.
In the present embodiment, the component-embedded multilayer board 10 includes a plurality of heat dissipation layers 61 in this case instead of the heat dissipation layers 51 in each of the above embodiments. These plurality of heat dissipation layers 61 in this case extend in a plurality of directions from the periphery of the multilayer substrate main body 20 in this case in two directions. The heat radiating layer 61 is the same as the heat radiating layer 51 of each of the above embodiments except that the surface area is different. That is, the heat radiating layer 61 of the present embodiment also constitutes the heat radiating structure portion 60 with both side surfaces sandwiched between the protective layers, similarly to the heat radiating layer 51 of each of the above embodiments.

In this case, the total surface area of the two heat radiating layers 61 is set to be equal to the surface area of the heat radiating layer 51 of each of the above embodiments. That is, the surface area of each heat dissipation layer 61 is set so that when the surface areas of each heat dissipation layer 61 are totaled, the surface area is sufficient to dissipate heat from the heat dissipation built-in component 31 by natural air cooling. .. The end portion of each heat radiating structure portion 60 may be connected to an external member 90 as in the first embodiment, or is required among the layers constituting the multilayer substrate main body 20 as in the second embodiment. It may be connected to another layer in which the heat dissipation built-in component 31 is not provided.

Even with this configuration, the same effects as those of the above-described embodiments can be obtained.
Further, according to the present embodiment, since the heat generated by the heat-dissipating built-in component 31 is dissipated by the plurality of heat-dissipating layers 61, the surface area of each heat-dissipating layer 61, that is, the surface area of the heat-dissipating structure portion 60 is determined. It can be made smaller. Therefore, when arranging each heat radiating structure 60, each heat radiating structure 60 is less likely to get in the way, and as a result, the component-embedded multilayer board 10 can be arranged in a more free layout.

(Fourth Embodiment)
Next, the fourth embodiment will be described with reference to FIG.
In the present embodiment, the heat dissipation built-in component 31 is provided on a metal layer 22 different from the metal layer 22 to which the heat dissipation layer 51 is connected. That is, in each of the above embodiments, the metal layer 22 provided with the heat-dissipating built-in component 31 and the metal layer 22 to which the heat-dissipating layer 51 is connected do not necessarily have to be the same metal layer 22. In the case of the present embodiment, for example, the heat dissipation built-in component 31 is provided on the fourth metal layer 224, while the heat dissipation layer 51 is connected to the third metal layer 223. The fourth metal layer 224 on which the heat-dissipating built-in component 31 is provided and the third metal layer 223 to which the heat-dissipating layer 51 is connected are thermally connected by the via 25.
Even with this configuration, the same effects as those of the above-described embodiments can be obtained.

(Other embodiments)
The present invention is not limited to the above-described embodiments and the above-described embodiments, and can be arbitrarily modified, combined, or extended without departing from the gist thereof.
The numerical values and the like shown in each of the above embodiments are examples, and are not limited thereto.
In addition, each of the above embodiments can be combined as appropriate.

Further, in each of the above embodiments, the heat radiating structure portions 50 and 60 are composed of one heat radiating layer 51 and 61 and two protective layers 52 and 62 provided on both sides of the heat radiating layer 51 and 61. However, it is not limited to this configuration. That is, for example, the heat radiating structure portions 50 and 60 may have a configuration in which a plurality of heat radiating layers 51 and 61 and a plurality of protective layers 52 and 62 are alternately arranged.
Then, the heat radiating structure portions 50 and 60 formed by stacking a plurality of the heat radiating layers 51 and 61 and the protective layers 52 and 62 are extended from the multilayer substrate main body 20 in a plurality of directions and their ends are connected to different portions. You may.

Although the present disclosure has been described in accordance with the examples, it is understood that the present disclosure is not limited to the examples and structures. The present disclosure also includes various modifications and modifications within an equal range. In addition, various combinations and forms, as well as other combinations and forms that include only one element, more, or less, are also within the scope of the present disclosure.

In the drawing, 1 ... programmable logic controller, 5 ... structure (external member, other member) 10 ... multi-layer substrate with built-in parts, 20 ... multi-layer substrate main body, 21 ... base material layer, 211 ... first base material layer, surface layer (Base material layer), 212 ... 2nd base material layer (base material layer), 213 ... 4th base material layer (base material layer), 214 ... 4th base material layer (base material layer), 215 ... 5th base Material layer, surface layer (base material layer), 216 ... 6th base material layer (base material layer), 217 ... 7th base material layer (base material layer), 218 ... 8th base material layer, surface layer (base material layer) , 22 ... Metal layer, 221 ... First metal layer (metal layer), 222 ... Second metal layer (metal layer), 223 ... Third metal layer (metal layer), 224 ... Fourth metal layer (metal layer), 225 ... 5th metal layer (metal layer), 226 ... 6th metal layer (metal layer), 227 ... 7th metal layer (metal layer), 30 ... electrical parts, built-in parts, 31 ... first built-in parts, heat dissipation required Built-in parts (electric parts, built-in parts), 32 ... 2nd built-in parts (electric parts, built-in parts), 33 ... 3rd built-in parts (electric parts, built-in parts), 40 ... exposed parts, 41 ... 1st exposed parts ( (Electrical parts, exposed parts), 42 ... 2nd exposed parts (electric parts, exposed parts), 43 ... 3rd exposed parts (electric parts, exposed parts), 44 ... 4th exposed parts (electric parts, exposed parts), 51 ... heat dissipation layer, 51 ... protective layer, 521 ... first protective layer (protective layer), 522 ... second protective layer (protective layer), 90 ... external member

Claims (7)

It is a multi-layer board with built-in components that composes a programmable logic controller.
A multilayer substrate body formed by alternately stacking a plurality of base material layers and a plurality of metal layers,
A component with a built-in heat dissipation, which is an electric component connected to the metal layer and built in the multilayer board main body and which requires heat dissipation to the outside of the multilayer board main body,
Of the plurality of metal layers, the metal layer to which the heat-dissipating built-in component is connected is connected to the metal layer and is provided outside the multilayer substrate main body, and is sufficient for flexibility and heat dissipation of the heat-dissipating built-in component. A heat-dissipating layer configured with an area,
An exposed component that is exposed to the outside from the surface layer of the multilayer board body and is arranged so as to overlap with at least a part of the heat dissipation built-in component in the thickness direction of the multilayer board body.
Multi-layer board with built-in components. At least one or both sides of the heat radiating layer is covered with an insulating protective layer.
The multilayer board with built-in components according to claim 1. The end portion of the heat radiating layer is connected to an external member different from the multilayer board main body.
The multi-layer board with built-in components according to claim 1 or 2. The end of the heat dissipation layer is connected to a metal layer different from the metal layer to which the heat dissipation built-in component is connected.
The multi-layer board with built-in components according to claim 1 or 2. The heat dissipation layer is integrally formed with the metal layer to which the heat dissipation built-in component is connected.
The multi-layer board with built-in components according to any one of claims 1 to 4. The heat radiating layer extends in a plurality of directions from the periphery of the multilayer substrate main body.
The multi-layer board with built-in components according to any one of claims 1 to 5. The multi-layer board with built-in components according to any one of claims 1 to 6.
A housing for accommodating the multi-layer board with built-in components and
Programmable logic controller with.

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